EuroSimE 2012 is scheduled in Lisbon, Portugal, April 16-17-18, 2012
Local organiser is ISQ (Pr Dr Eduardo Dias Lopes)
See a video on Estoril coast, from the Portuguese Tourism Office
Authors : you were all notified on Wednesday December 21, by email. Otherwise, use menu "Authors / Your status" to know about your abstract(s) status.
Advanced technical programme will be published on January 21st
6 training courses will be provided on Sunday April 15
th:
- Analog and power packaging, by Yong LIU, Fairchild Semiconductors
- 3D IC and MEMS Integration Packaging, by John LAU, ITRI
- Coplanarity Measurement of Chip, Component and PCB during Assembly Process, by Prof Bongtae HAN, CALCE
- System Reliability, by Willem VAN DRIEL, Philips Lighting
- Reliability of of RoHS Compliant 2D and 3D IC Interconnects, by John LAU, ITRI
- LED packaging on lighting applications, by Sheng LIU, Huazhong University of Science and Technology
EuroSimE 2011 Linz participants : further to the advice recently received by knowledgeable consultants, we are reimbursing the 20% VAT you paid with your registrations.
EuroSimE 2011 was held in Linz, Austria
Get ENIAC keynote presentations:

EuroSimE 2011 was supported by exhibiting software companies and EC project:



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EuroSimE 2010 papers published in Microelectronics Reliability Journal:
- O. Hölck, E. Dermitzaki, B. Wunderle, J. Bauer and B. Michel: "Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface using Molecular Modelling"
- Nancy Iwamoto: "Modeling Mechanical Properties of an Epoxy Using Particle Dynamics, as Parameterized through Molecular Modeling"
- Łukasz Dowhań, Artur Wymysłowski, Paweł Janus, Magdalena Ekwińska, Olaf Wittler: "Extraction of Elastic-Plastic Material Properties of Thin Films Through Nanoindentaion Technique with Support of Numerical Methods"
- L.I.J.C. Bergers, J.P.M. Hoefnagels, N.K.R. Delhey , M.G.D. Geers: "Measuring time-dependent deformations in metallic MEMS"
- Cédric LE COQ, Adellah TOUGUI, Marie-Pascale STEMPIN, Laurent BARREAU: "Optimization for Simulation of WL-CSP Subjected to Drop-Test with Plasticity Behavior"
- Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P.H.M. Timmermans: "Design and Implementation of Flexible and Stretchable Systems"
- T. T. Mattila and M. Paulasto-Kröckel: "Toward Comprehensive Reliability Testing of Electronics by a Combined Loading Approach"
- Rene Kregting, Sander Gielen, Willem van Driel, Paul Alkemade, Hozan Miro, Jan-Dirk Kamminga: "Local stress analysis on semiconductor devices by combined experimental-numerical procedure"
One of the technology trends of the electronics industry is the rapid development
and ever-increasing application of advanced simulation methodologies and tools.
For the leading global companies, simulation is becoming a daily practice,
a standard tool, and an important competitive edge to achieve competitive
product and/or process development.
Thermal, thermo-mechanical and mechanical simulations have significant impact
on the business profitability of electronics industries. On the other hand,
the fascinating development of the electronics industry has also formulated
many challenges and impulse for the further development of simulation methodologies
and tools. As the only international conference specially dedicated to thermal,
mechanical and multiphysics simulation and experiments in microelectronics
and microsystems, EuroSimE was initiated in 2000 with major sponsorship from
the European Community. The 12th in the series, EuroSimE 2011 aimed to:
- promote further development and application of simulation methodologies and tools for the electronics industry,
- improve communication and exchange information between methodology & tool-developers and industry users,
- strengthen co-operation between industry, universities, and research institutes.
EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to:
- mechanical simulation (both static and dynamic),
- thermo-mechanical simulation,
- thermal simulation,
- material characterisation experiments and modelling,
- thin-film mechanics,
- failure criteria and damage-modelling (fatigue, creep, delamination, cracks, buckling, large deformation, moisture-induced failures, yield),
- fracture, continuum, and micro-mechanics in (micro)-electronics,
- interface strengths,
- experiments for model verification,
- simulation in reliability engineering,
- (micro)-electronic product and/or process optimisation,
- simulation-based optimisation,
- simulation for reliability improvement/failure prediction,
- virtual and accelerated reliability qualification,
- design rule development via simulation,
- virtual prototyping in product and/or process design,
- from micro to macro simulation,
- multi-physics simulation,
- advanced numerical and analytical simulation methodologies and tools.
The applications cover all fields of (micro)-electronics and microsystems, but not limited to:
- Wafer processing and chip design,
- PWB design and application,
- Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level
packages, MCM, Opto-electronic packages, MEMS),
- Microsystems,
- Interconnections,
- Systems,
- Materials of (micro)-electronics,
- Processes in (micro)-electronics
Organiser
is a Professional
Congress Organiser and Producer who financially produces and logistically
organises EuroSimE under the control of the EuroSimE Steering Committee.