EuroSimE 2008 in Freiburg im Breisgau, Germany

EuroSimE was held in Konzerthaus, downtown Freiburg, on April 20, 2008 (courses), April 21-22-23 (conference, exhibition).

Local organiser:

See the conference final programme, the program of training courses and the list of exhibitors

Monday April 21: keynote session, industrial trends

Thijs Viegers, Senior director - Chief Technology Officer, Philips Applied Technologies, Eindhoven, The Netherlands: Challenges for SiP Product Creation

Michel Despont, Manager of Nano- & Microfabrication in IBM Zurich Research Lab, Switzerland: More than Moore by (N)MEMS on CMOS

Georg Meyer-Berg, Infineon Technologies, Munich, Germany: Future Packaging Trends, from Mechanics to Wafer Level Ball Grid Array Technologies and other Hot Topics. Download the presentation (PDF 3Mb)

The event is sponsored by the following organisations:

Background

One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development.

Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. The 9th in the series, EuroSimE 2008 aims to:

• promote further development and application of simulation methodologies and tools for the electronics industry,
• improve communication and exchange information between methodology & tool-developers and industry users,
• strengthen co-operation between industry, universities, and research institutes.

Scope of EuroSimE

EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to:

• mechanical simulation (both static and dynamic),
• thermo-mechanical simulation,
• thermal simulation,
• material characterisation experiments and modelling,
• thin-film mechanics,
• failure criteria and damage-modelling (fatigue, creep, delamination, cracks, buckling, large deformation, moisture-induced failures, yield),
• fracture, continuum, and micro-mechanics in (micro)-electronics,
• interface strengths,
• experiments for model verification,
• simulation in reliability engineering,
• (micro)-electronic product and/or process optimisation,
• simulation-based optimisation,
• simulation for reliability improvement/failure prediction,
• virtual and accelerated reliability qualification,
• design rule development via simulation,
• virtual prototyping in product and/or process design,
• from micro to macro simulation,
• multi-physics simulation,
• advanced numerical and analytical simulation methodologies and tools.

Applications

The applications cover all fields of (micro)-electronics and microsystems, but not limited to:

• Wafer processing and chip design,
• PWB design and application,
• Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level packages, MCM, Opto-electronic packages, MEMS),
• Microsystems,
• Interconnections,
• Systems,
• Materials of (micro)-electronics,
• Processes in (micro)-electronics

Organisers

is a Professional Congress Organiser and Producer who financially produces and logistically organises EuroSimE under the control of the EuroSimE Steering Committee.

Institut für Mikrosystemtechnik is the 2008 local organizer (Pr J. Korvink).

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