EuroSimE 2015 will be held in Budapest, Hungary, in Novotel Budapest City, on April 19-20-21-22 2015.
Local organiser is The Institute for Technical Physics and Materials Science (acronym: MFA - based on its Hungarian name), team of Pr Bársony István, part of the Research Centre for Natural Sciences of the Hungarian Academy of Sciences (MTA TTK). See Web site
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Submit an abstract
FYI: Call for Presentations of the EPoSS Annual Forum 2014 in Turin, 24-26 September 2014.
Deadline for abstract submission is 18th July 2014. Download the flyer with the Call for Presentations.
That was EuroSimE 2014 in Ghent, Belgium...
EuroSimE 2014, 15th "season", was held in the city of Ghent, Belgium, on April 7-8-9th 2014 with imec as local organiser (Dr Bart Vandevelde team). 180 participants to conference, and 42 courses-attendants.
Industry Keynotes session held on Monday April 7th:
- CMOS scaling: challenges ahead, by An Steegen, Senior VP Process Technology at IMEC, Leuven, Belgium
- Automotive Electronics – Trends and Requirements for Reliable Design, by Jan Benzler, VP Engineering Assembly and Interconnect Technology at Robert Bosch GmbH, Stuttgart, Germany
- LEDs: Changing the Lighting Landscape, by Ralph C. Tuttle, Engineering Manager, Cree Hong Kong Ltd., Hong Kong
Smart Systems Reliability session held on Wednesday April 9th:
- EPoSS White Paper on Smart Systems Reliability (Sven Rzepka)
- EPoSS: The ETP for Smart Systems Integration - Mission, Working Groups, Strategic Research Agenda (Petra Weiler, EPoSS Office)
- Current view of European Commission (Willy van Puymbroeck, Head of Unit A4 'Components' of DG ConNECT, European Commission)
- Panel statements and discussion (Moderator: Sven Rzepka): Statement on Advanced Testing (Dag Andersson); Statement on Virtual Prototyping (Rainer Dudek); Statement on Self-diagnosis (Bart Vandevelde); Willem van Driel, Philips Lighting (NL); Michael Guyenot, Bosch (DE); Reinhard Pufall, Infineon (DE); Bernard Candaele, Thales (FR); Discussion
EuroSimE is on LinkedIn®
EuroSimE was created as the only international annual conference with a focus on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
EuroSimE was initiated in 2000 by the COMPETE network, with sponsorship from the European Commission, to meet research and development needs in the fields of Microelectronics and Microsystems.
Since then, EuroSimE has gained worldwide appeal with participants from more than thirty countries, spanning all continents, and has become a fully technically sponsored IEEE CPMT event. The conference proceedings are part of the IEEE conference publication program and can be found in both the IEL and IEEE Xplore® systems.
Since 2005, ASTEFO - a Professional Congress Organiser and Producer - financially produces and logistically
organises EuroSimE under the control of the EuroSimE Steering Committee.
EuroSimE attendance over time
Since 2000, EuroSimE brings together a strong community of engineers,
scientists and researchers, with common focus on modeling and simulation
of materials and components. The average attendance is 150-160 individuals
from 25-30 countries.
EuroSimE 2012 papers published in Microelectronics Reliability Journal:
- Nancy Iwamoto: Molecularly Derived Mesoscale Modeling of an
Epoxy/Cu Interface (Part III): Interface Roughness
- M.H.M. Kouters, G.H.M. Gubbels, C.A. Yuan: Characterization of Intermetallic Compounds in
Cu-Al Ball Bonds: Mechanical Properties, Interface Delamination and
- J. Jakovenko, J. Formánek, B. Pardo, X. Perpiñà, R.J. Werkhoven, J.M.G. Kunen, P. Bancken, P.J. Bolt: Thermo-Mechanical Evaluation and Life Time
Simulation of a High Power LED Lamp Boards
- Federica Confalonieri, Giuseppe Cocchetti, Aldo Ghisi, Alberto Corigliano: A Domain Decomposition Method for the
Simulation of Fracture in Polysilicon MEMS
- Steffen Wiese, Frank Kraemer, Erik Peter, Jonas Seib: Mechanical Problems of Novel Back Contact Solar
- O. Hölck, J. Bauer, T. Braun, H. Walter, O. Wittler, B. Wunderle: Transport of Moisture at Epoxy-SiO2 Interfaces
Investigated by Molecular Modeling
- B. Pardo, A. Gasse, A. Fargeix, J. Jakovenko, R.J. Werkhoven, X. Perpiñà, T. Van Weelden, P. Bancken: Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards
- Stoyan Stoyanov, Chris Bailey, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott, John Roulston: Thermal Modelling and Optimisation of Hot Solder
EuroSimE 2010 papers published in Microelectronics Reliability Journal:
- O. Hölck, E. Dermitzaki, B. Wunderle, J. Bauer and B. Michel:
"Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked
Epoxy / SiO2 Interface using Molecular Modelling"
- Nancy Iwamoto: "Modeling Mechanical Properties of an Epoxy
Using Particle Dynamics, as Parameterized through Molecular Modeling"
- Łukasz Dowhań, Artur Wymysłowski, Paweł Janus,
Magdalena Ekwińska, Olaf Wittler: "Extraction of Elastic-Plastic
Material Properties of Thin Films Through Nanoindentaion Technique
with Support of Numerical Methods"
- L.I.J.C. Bergers, J.P.M. Hoefnagels, N.K.R. Delhey , M.G.D. Geers:
"Measuring time-dependent deformations in metallic MEMS"
- Cédric LE COQ, Adellah TOUGUI, Marie-Pascale STEMPIN, Laurent
BARREAU: "Optimization for Simulation of WL-CSP Subjected to
Drop-Test with Plasticity Behavior"
- Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu,
François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van
der Sluis, P.H.M. Timmermans: "Design and Implementation of
Flexible and Stretchable Systems"
- T. T. Mattila and M. Paulasto-Kröckel: "Toward Comprehensive
Reliability Testing of Electronics by a Combined Loading Approach"
- Rene Kregting, Sander Gielen, Willem van Driel, Paul Alkemade,
Hozan Miro, Jan-Dirk Kamminga: "Local stress analysis on semiconductor
devices by combined experimental-numerical procedure"
One of the technology trends of the electronics industry is the rapid
development and ever-increasing application of advanced simulation
methodologies and tools. For the leading global companies, simulation
is becoming a daily practice, a standard tool, and an important competitive
edge to achieve competitive product and/or process development.
Thermal, thermo-mechanical and mechanical simulations have significant
impact on the business profitability of electronics industries. On
the other hand, the fascinating development of the electronics industry
has also formulated many challenges and impulse for the further development
of simulation methodologies and tools. As the only international conference
specially dedicated to thermal, mechanical and multiphysics simulation
and experiments in microelectronics and microsystems, EuroSimE was
initiated in 2000 with major sponsorship from the European Community.
The 16th in the series, EuroSimE 2015 aims to:
- promote further development and application of simulation methodologies
and tools for the electronics industry,
- improve communication and exchange information between methodology
& tool-developers and industry users,
- strengthen co-operation between industry, universities, and research
EuroSimE addresses the results of both fundamental research and industrial
application in the fields of thermal, mechanical and multiphysics
simulation and experiments in microelectronics and microsystems. This
includes, but is not limited to:
- Multi-physics simulation (e.g. thermal, mechanical, thermo-mechanical, coupled thermo-fluidic, coupled electro-mechanics, fluid structure interactions, opto-mechanics)
- Failure analysis and failure mode extraction
- Material characterisation, experiments and modelling
- Validation of simulations by experiments
- Failure criteria and damage modelling for reliability prediction
- Integrated process modelling
- Advanced numerical and analytical simulation methodologies and tools
- Behavioural modelling
- Simulation-based optimisation, virtual prototyping in product and/or process design
- Compact modelling and model order reduction
- Multiscale modeling and simulation
The applications cover all fields of (micro)-electronics
and microsystems, but not limited to:
- Components and packaging
- Flip-chip, BGA, CSP, Wafer-Level packages, MCM, Cu/low-k packages
- 3-D packaging
- Opto-electronic packages
- High temperature and high power packaging
- Packaging for harsh environments
- Piezoelectric components
- MEMS sensors and actuators
- Opto-mechanical devices
- Nano-electronic mechanical devices
- LED lighting
- Smart systems of 2nd and 3rd generation