11th EuroSimE in France, April 2010
EuroSimE 2010 will be held in the city of Bordeaux, France, on April 26-27-28 2010.
Local organiser is Université of Bordeaux, IMS Laboratory for Integration from Materials to Systems. See English provisional web page or French main Web gate.
Here is the initial call for papers 2010.
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10th EuroSimE 2009 in Delft, The Netherlands, April 2009.
Back to the roots ! EuroSimE 2009 celebrated its tenth anniversary in the Netherlands, Technical University of Delft, with 165 participants, an excellent participation when considering the current economic context !
See what was the 2009 technical program.
2009 Exhibitors: Abaqus-Simulia - Ansys - COMSOL - Delft Centre for Mechatronics and Microsystems - Infinite Simulation Systems - Insidix - MSC.Software - Noesis Solutions - TNO
See the pictures taken in Rotterdam and TU Delft
2009 Industry keynotes:
2009 Technical keynotes:
- Application of stress sensing test chips to area array packaging, by Jeff Suhling, Departments of Mechanical Engineering and of Electrical and Computer Engineering,
Center for Advanced Vehicle Electronics,
Auburn University, USA
- Prognostics and Health Monitoring For Improved Qualification, by Michael Pecht, CALCE, University of Maryland, USA
- Fatigue and impact behavior of lead free solders, by Jianmin Qu, Georgia Institute of Technology, USA
The 2009 event was sponsored by the following organisations:
Background 
One of the technology trends of the electronics industry is the rapid development
and ever-increasing application of advanced simulation methodologies and tools.
For the leading global companies, simulation is becoming a daily practice,
a standard tool, and an important competitive edge to achieve competitive
product and/or process development.
Thermal, thermo-mechanical and mechanical simulations have significant impact
on the business profitability of electronics industries. On the other hand,
the fascinating development of the electronics industry has also formulated
many challenges and impulse for the further development of simulation methodologies
and tools. As the only international conference specially dedicated to thermal,
mechanical and multiphysics simulation and experiments in microelectronics
and microsystems, EuroSimE was initiated in 2000 with major sponsorship from
the European Community. The 11th in the series, EuroSimE 2010 aims to:
- promote further development and application of simulation methodologies
and tools for the electronics industry,
- improve communication and exchange information between methodology &
tool-developers and industry users,
- strengthen co-operation between industry, universities, and research institutes.
Scope
EuroSimE addresses the results of both fundamental research and industrial application
in the fields of thermal, mechanical and multiphysics simulation and experiments
in microelectronics and microsystems. This includes, but is not limited to:
- mechanical simulation (both static and dynamic),
- thermo-mechanical simulation,
- thermal simulation,
- material characterisation experiments and modelling,
- thin-film mechanics,
- failure criteria and damage-modelling (fatigue, creep, delamination, cracks,
buckling, large deformation, moisture-induced failures, yield),
- fracture, continuum, and micro-mechanics in (micro)-electronics,
- interface strengths,
- experiments for model verification,
- simulation in reliability engineering,
- (micro)-electronic product and/or process optimisation,
- simulation-based optimisation,
- simulation for reliability improvement/failure prediction,
- virtual and accelerated reliability qualification,
- design rule development via simulation,
- virtual prototyping in product and/or process design,
- from micro to macro simulation,
- multi-physics simulation,
- advanced numerical and analytical simulation methodologies and tools.
Applications
The applications cover all fields of (micro)-electronics and microsystems,
but not limited to:
- Wafer processing and chip design,
- PWB design and application,
- Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level
packages, MCM, Opto-electronic packages, MEMS),
- Microsystems,
- Interconnections,
- Systems,
- Materials of (micro)-electronics,
- Processes in (micro)-electronics
Organisers
Technical University of Delft hosted the 2009 conference and exhibition
is a Professional
Congress Organiser and Producer who financially produces and logistically
organises EuroSimE under the control of the EuroSimE Steering Committee.
