Authors : you were all notified on Wednesday December 21, by email. Otherwise, use menu "Authors / Your status" to know about your abstract(s) status.
Advanced technical programme will be published on January 21^st

6 training courses will be provided on Sunday April 15^th:

• Analog and power packaging, by Yong LIU, Fairchild Semiconductors
• 3D IC and MEMS Integration Packaging, by John LAU, ITRI
• Coplanarity Measurement of Chip, Component and PCB during Assembly Process, by Prof Bongtae HAN, CALCE
• System Reliability, by Willem VAN DRIEL, Philips Lighting
• Reliability of of RoHS Compliant 2D and 3D IC Interconnects, by John LAU, ITRI
• LED packaging on lighting applications, by Sheng LIU, Huazhong University of Science and Technology

EuroSimE 2011 Linz participants : further to the advice recently received by knowledgeable consultants, we are reimbursing the 20% VAT you paid with your registrations.

One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development.

Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. The 12th in the series, EuroSimE 2011 aimed to:

• promote further development and application of simulation methodologies and tools for the electronics industry,
• improve communication and exchange information between methodology & tool-developers and industry users,
• strengthen co-operation between industry, universities, and research institutes.

EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to:

• mechanical simulation (both static and dynamic),
• thermo-mechanical simulation,
• thermal simulation,
• material characterisation experiments and modelling,
• thin-film mechanics,
• failure criteria and damage-modelling (fatigue, creep, delamination, cracks, buckling, large deformation, moisture-induced failures, yield),
• fracture, continuum, and micro-mechanics in (micro)-electronics,
• interface strengths,
• experiments for model verification,
• simulation in reliability engineering,
• (micro)-electronic product and/or process optimisation,
• simulation-based optimisation,
• simulation for reliability improvement/failure prediction,
• virtual and accelerated reliability qualification,
• design rule development via simulation,
• virtual prototyping in product and/or process design,
• from micro to macro simulation,
• multi-physics simulation,
• advanced numerical and analytical simulation methodologies and tools.

The applications cover all fields of (micro)-electronics and microsystems, but not limited to:

• Wafer processing and chip design,
• PWB design and application,
• Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level packages, MCM, Opto-electronic packages, MEMS),
• Microsystems,
• Interconnections,
• Systems,
• Materials of (micro)-electronics,
• Processes in (micro)-electronics