EuroSimE 2011 in Linz, Austria ...
EuroSimE 2010 was held in Bordeaux, France, April 2010
Local organiser was Université of Bordeaux, IMS Laboratory for Integration from Materials to Systems (Mrs Hélène Frémont and Geneviève Duchamp).
See what was the final program.
Pictures available here !
Background
One of the technology trends of the electronics industry is the rapid development
and ever-increasing application of advanced simulation methodologies and tools.
For the leading global companies, simulation is becoming a daily practice,
a standard tool, and an important competitive edge to achieve competitive
product and/or process development.
Thermal, thermo-mechanical and mechanical simulations have significant impact
on the business profitability of electronics industries. On the other hand,
the fascinating development of the electronics industry has also formulated
many challenges and impulse for the further development of simulation methodologies
and tools. As the only international conference specially dedicated to thermal,
mechanical and multiphysics simulation and experiments in microelectronics
and microsystems, EuroSimE was initiated in 2000 with major sponsorship from
the European Community. The 11th in the series, EuroSimE 2010 aims to:
- promote further development and application of simulation methodologies
and tools for the electronics industry,
- improve communication and exchange information between methodology &
tool-developers and industry users,
- strengthen co-operation between industry, universities, and research institutes.
Scope
EuroSimE addresses the results of both fundamental research and industrial application
in the fields of thermal, mechanical and multiphysics simulation and experiments
in microelectronics and microsystems. This includes, but is not limited to:
- mechanical simulation (both static and dynamic),
- thermo-mechanical simulation,
- thermal simulation,
- material characterisation experiments and modelling,
- thin-film mechanics,
- failure criteria and damage-modelling (fatigue, creep, delamination, cracks,
buckling, large deformation, moisture-induced failures, yield),
- fracture, continuum, and micro-mechanics in (micro)-electronics,
- interface strengths,
- experiments for model verification,
- simulation in reliability engineering,
- (micro)-electronic product and/or process optimisation,
- simulation-based optimisation,
- simulation for reliability improvement/failure prediction,
- virtual and accelerated reliability qualification,
- design rule development via simulation,
- virtual prototyping in product and/or process design,
- from micro to macro simulation,
- multi-physics simulation,
- advanced numerical and analytical simulation methodologies and tools.
Applications
The applications cover all fields of (micro)-electronics and microsystems,
but not limited to:
- Wafer processing and chip design,
- PWB design and application,
- Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level
packages, MCM, Opto-electronic packages, MEMS),
- Microsystems,
- Interconnections,
- Systems,
- Materials of (micro)-electronics,
- Processes in (micro)-electronics
Organiser
is a Professional
Congress Organiser and Producer who financially produces and logistically
organises EuroSimE under the control of the EuroSimE Steering Committee.