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EuroSimE 2015 will be held in Budapest, Hungary, in Novotel Budapest City, on April 19-20-21-22 2015.

Local organiser is Institute of Technical Physics and Materials Science (MFA), Centre for Energy Research, Hungarian Academy of Sciences, team of Pr Bársony István. See Web site

See the conference full programme

Special session: Industry keynotes, Monday April 20 2015 at 09:10

  • 09:10 Simulation driven design – from concept phase to robust design, Dr. Petra Schiebel, Robert Bosch GmbH
  • 09:40 Molecular Modeling in Industry for Electronic Materials, Nancy Iwamoto, Honeywell
  • 10:10 Predicting the Lifetime of Power Semiconductor Modules under Variable Thermal Stress - Boundary Conditions and Limitations, Prof. Dr. Uwe Scheuermann, Manager Product Reliability, SEMIKRON Elektronik

Short courses, Sunday April 19th

See the programme of 4 short courses instructed by

  • Marc Desmulliez (Heriot-Watt University, UK)
  • Zoltán Hajnal (MFA, Hungary)
  • Pradeep Lall (Auburn University, USA)
  • Michael Pecht (CALCE Electronic Products and Systems Center University of Maryland, USA)

Want to exhibit your softwares and products ? download the2015 Exhibitor Guide

New book on Molecular Modeling and Multiscaling Issues for Electronic Material Applications!

See preface Written by Artur Wymyslowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan, see Springer

Discover who published about what from 2006 to 2014 (1056 papers)


EuroSimE was created as the only international annual conference with a focus on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.


EuroSimE was initiated in 2000 by the COMPETE network, with sponsorship from the European Commission, to meet research and development needs in the fields of Microelectronics and Microsystems.


Since then, EuroSimE has gained worldwide appeal with participants from more than thirty countries, spanning all continents, and has become a fully technically sponsored IEEE CPMT event. The conference proceedings are part of the IEEE conference publication program and can be found in both the IEL and IEEE Xplore® systems.


Since 2005, ASTEFO - a Professional Congress Organiser and Producer - financially produces and logistically organises EuroSimE under the control of the EuroSimE Steering Committee.

EuroSimE attendance over time

Since 2000, EuroSimE brings together a strong community of engineers, scientists and researchers, with common focus on modeling and simulation of materials and components. The average attendance is 150-160 individuals from 25-30 countries.

EuroSimE 2012 papers published in Microelectronics Reliability Journal:

  • Nancy Iwamoto: Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface (Part III): Interface Roughness
  • M.H.M. Kouters, G.H.M. Gubbels, C.A. Yuan: Characterization of Intermetallic Compounds in Cu-Al Ball Bonds: Mechanical Properties, Interface Delamination and Thermal Conductivity
  • J. Jakovenko, J. Formánek, B. Pardo, X. Perpiñà, R.J. Werkhoven, J.M.G. Kunen, P. Bancken, P.J. Bolt: Thermo-Mechanical Evaluation and Life Time Simulation of a High Power LED Lamp Boards
  • Federica Confalonieri, Giuseppe Cocchetti, Aldo Ghisi, Alberto Corigliano: A Domain Decomposition Method for the Simulation of Fracture in Polysilicon MEMS
  • Steffen Wiese, Frank Kraemer, Erik Peter, Jonas Seib: Mechanical Problems of Novel Back Contact Solar Modules
  • O. Hölck, J. Bauer, T. Braun, H. Walter, O. Wittler, B. Wunderle: Transport of Moisture at Epoxy-SiO2 Interfaces Investigated by Molecular Modeling
  • B. Pardo, A. Gasse, A. Fargeix, J. Jakovenko, R.J. Werkhoven, X. Perpiñà, T. Van Weelden, P. Bancken: Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards
  • Stoyan Stoyanov, Chris Bailey, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott, John Roulston: Thermal Modelling and Optimisation of Hot Solder Dip Process

EuroSimE 2010 papers published in Microelectronics Reliability Journal:

  • O. Hölck, E. Dermitzaki, B. Wunderle, J. Bauer and B. Michel: "Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface using Molecular Modelling"
  • Nancy Iwamoto: "Modeling Mechanical Properties of an Epoxy Using Particle Dynamics, as Parameterized through Molecular Modeling"
  • Łukasz Dowhań, Artur Wymysłowski, Paweł Janus, Magdalena Ekwińska, Olaf Wittler: "Extraction of Elastic-Plastic Material Properties of Thin Films Through Nanoindentaion Technique with Support of Numerical Methods"
  • L.I.J.C. Bergers, J.P.M. Hoefnagels, N.K.R. Delhey , M.G.D. Geers: "Measuring time-dependent deformations in metallic MEMS"
  • Cédric LE COQ, Adellah TOUGUI, Marie-Pascale STEMPIN, Laurent BARREAU: "Optimization for Simulation of WL-CSP Subjected to Drop-Test with Plasticity Behavior"
  • Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P.H.M. Timmermans: "Design and Implementation of Flexible and Stretchable Systems"
  • T. T. Mattila and M. Paulasto-Kröckel: "Toward Comprehensive Reliability Testing of Electronics by a Combined Loading Approach"
  • Rene Kregting, Sander Gielen, Willem van Driel, Paul Alkemade, Hozan Miro, Jan-Dirk Kamminga: "Local stress analysis on semiconductor devices by combined experimental-numerical procedure"


One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development.

Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. The 16th in the series, EuroSimE 2015 aims to:

  • promote further development and application of simulation methodologies and tools for the electronics industry,
  • improve communication and exchange information between methodology & tool-developers and industry users,
  • strengthen co-operation between industry, universities, and research institutes.


EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to:

  • Multi-physics simulation (e.g. thermal, mechanical, thermo-mechanical, coupled thermo-fluidic, coupled electro-mechanics, fluid structure interactions, opto-mechanics)
  • Failure analysis and failure mode extraction
  • Material characterisation, experiments and modelling
  • Validation of simulations by experiments
  • Failure criteria and damage modelling for reliability prediction
  • Integrated process modelling
  • Advanced numerical and analytical simulation methodologies and tools
  • Behavioural modelling
  • Simulation-based optimisation, virtual prototyping in product and/or process design
  • Compact modelling and model order reduction
  • Multiscale modeling and simulation


The applications cover all fields of (micro)-electronics and microsystems, but not limited to:

  • Components and packaging
    • Flip-chip, BGA, CSP, Wafer-Level packages, MCM, Cu/low-k packages
    • 3-D packaging
    • Opto-electronic packages
    • High temperature and high power packaging
    • Packaging for harsh environments
  • Microsystems
    • Piezoelectric components
    • MEMS sensors and actuators
    • Opto-mechanical devices
    • Nano-electronic mechanical devices
    • Bio-MEMS/NEMS
    • Microfluidics
  • LED lighting
  • Smart systems of 2nd and 3rd generation
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