25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Catania, Italy
April 7-8-9-10, 2024

151 abstracts were submitted by 133 different individuals.

Advanced programme

See programme Short Courses

 

2023 sponsors and exhibitors



Exhibitor manual and Sponsorship brochure

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

Technical sponsorship from IEEE Electronics Packaging Society
banner eurosime 2024