22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

EuroSimE 2021 was held virtually on April 19-20-21-22, 2021
Virtual space is closed since May 16th
Accepted papers were posted to IEEE Xplore Digital Library on April 26

We hopefully will be back to an in person 2022 event in Malta, supported by STMicroelectronics

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

Technical sponsorship fromIEEE Electronics Packaging Society

2021 Sponsors

Robert Bosch