24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Hotal Das Weitzer
city of Graz, Austria
April 16-17-18-19, 2023

Mon-Tue-Wed programme

PDF program A4, 32 pages, updated April 14

Sunday Short Courses

EuroSimE 2023 was locally organised by

DI Dr. Peter Fuchs MBA,
Division Manager Simulation and Modeling,
Head of Research Group
Simulation Strategies for Polymer and Polymer Composite Designs

Meet with 165 professionals from 19 countries !

Presented papers submitted to IEEE for publication are already available in Xplore.

2023 sponsors and exhibitors

Exhibitor manual and Sponsorship brochure

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

Technical sponsorship from IEEE Electronics Packaging Society