Welcome to EuroSimE
EuroSimE 2020 Cracow is postponed to Sunday July 05th to Wednesday 08th.
Considering the fact that many people are unable to travel for an unknown period of time, because of corporate directives, the EuroSimE Steering Committee decided to postpone the event.
Speakers and already registered attendants: you were alerted by email on March 06. As stated in this email, use the provided survey link to let us know the probability that you will attend the event in July.
Registration: in case you will not participate and have already paid your registration, this registration fee will be fully refunded. If you paid by VISA/Mastercard, refund will be done directly. If you paid by bank wire, ask your administration the bank account coordinates where to refund and let us know.
Speakers: the deadline for you to register and post final paper is now May 31. There will not be any extension!
It is possible to submit new abstracts until May 08.
We will provide you with news here along the coming weeks, depending on the evolutions of attendance and programme.
February 24 – Coronavirus notice
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Where: city of Cracow, Poland, hotel Vienna House Andel’s
When: July 05-08 2020
Organised by Aptiv Poland
Contact for any enquiry
FYI: EuroSimE 2021 will take place in Malta, supported by STMicroelectronics.
left before the 21th EuroSimE!
Call for Papers
Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Microelectronics Reliability: special issue for EuroSime 2018
See programme of short courses
See advanced programme of event
Industry keynotes from AT&S, Intel, LG.
2019 Sponsors
Iwamoto & Associates
