EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems CPMTIEEE

Next EuroSimE 2017 in Dresden, Germany

  • April 02 2017 : short courses
  • April 3-4-5 : conf. and exhibition

Final Programme
Training Courses
2017 Awards
Download our travel guide
Register online early-bird rate until March 01

Local Organiser is

Fraunhofer Institute for Ceramic Technologies and Systems IKTS
, team of Dr.-Ing. Mike Röllig

Authors :

  • deadline for registering is Wednesday March 1st !
  • deadline for delivering manuscript is extended to Wednesday March 15th

Author portal post final manuscript, transfer copyright to IEEE, etc.

2017 Call For Papers

See papers accepted for publication in Microelectronics Reliability Journal, Mechatronics

Exhibit your softwares and products !

download the2017 Exhibitor Guide

Discover who published about what from 2006 to 2016 (1279 papers)

Scope and applications

EuroSimE history