24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Hotal Das Weitzer
city of Graz, Austria
April 16-17-18-19, 2023

Mon-Tue-Wed programme

Sunday Short Courses

Travelplan to Graz

EuroSimE 2023 is locally organised by

DI Dr. Peter Fuchs MBA,
Division Manager Simulation and Modeling,
Head of Research Group
Simulation Strategies for Polymer and Polymer Composite Designs

2023 sponsors and exhibitors

The 2022 financial sponsors were:

Robert Bosch

Exhibitor manual and Sponsorship brochure

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

Technical sponsorship from IEEE Electronics Packaging Society