Welcome to EuroSimE

IEEE Electronics Packaging SocietyEuroSimE 2017 was held in Dresden in last April, with 165 participants and 9 Exhibitors.

Call For Papers EuroSimE 2018

The 19th EuroSimE will be held in Toulouse, France, on April 16-17-18  2018, with technical sponsorship from Institute of Technology Antoine de Saint Exupéry as Local Organiser, and from IEEE-EPS for publishing accepted papers in IEEE Xplore Digital Library.

A new topic is introduced, vibration : methods to derive the endurance strength under vibration, FE methods to derive the dynamic response under vibration, material characterization and modeling for FE models under vibration, vibration load profile derivation and transfer to FE models.