22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

EuroSimE 2021 will be held virtually on April 19-20-21, 2021

We hopefully will be back to an in person 2022 event in Malta, supported by STMicroelectronics

Advanced programme of event updated Feb 19

Second Call for Papers 2021

Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library.

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018


Technical sponsorship fromIEEE Electronics Packaging Society

2020 Sponsors

Robert Bosch

Huawei Finland