Welcome to EuroSimE
Authors: you were all notified upon status of your abstracts on December 20. Please check your spam box!
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Where: city of Cracow, Poland, hotel Vienna House Andel’s
When: 26-29 April 2020
Organised by Aptiv Poland
Contact for any enquiry
left before the 21th EuroSimE!
Call for Papers
Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Microelectronics Reliability: special issue for EuroSime 2018
Advanced technical programme will be available by mid-January
Industry keynotes from AT&S, Intel, LG.
2019 Sponsors
Iwamoto & Associates
