The on-demand virtual space closed on Tuesday July 28 2pm GMT.
In place of the in-person event, EuroSimE 2020 was held as a virtual conference.
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
kindly provided the Virtual EuroSimE with its WebEx facilities.
EuroSimE 2021 will take place in Malta, supported by STMicroelectronics.
EuroSimE 2022 may be held in Cracow.
Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library.
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Microelectronics Reliability: special issue for EuroSime 2018
Technical sponsorship from
2020 Sponsors
