Welcome to EuroSimE
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Where: city of Cracow, Poland, hotel Vienna House Andel’s
When: 26-29 April 2020
Organised by Aptiv and TU Cracow
If you attended EuroSimE 2019 in Hannover: see Area for attendants where to get proceedings and other information (open till September 2019)
Contact for any enquiry
left before the 21th EuroSimE!
Call for Papers
Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Iwamoto & Associates