23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Submit abstracts before November 1st
EuroSimE 2021 was held virtually in April 2021. Accepted papers were posted to IEEE Xplore Digital Library on April 26
See 2021 full programme of event, get the 2021 PDF full programme
2021 satisfaction survey
2021 on-demand space stats
EuroSimE 2022 will be held in Malta on April 24-27, 2022, supported by STMicroelectronics
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Microelectronics Reliability: special issue for EuroSime 2018
Technical sponsorship from
2021 Sponsors
