Welcome to EuroSimE

IEEE Electronics Packaging Society

The 19th EuroSimE was  held in Toulouse, France, in April 2018, with technical sponsorship from Institute of Technology Antoine de Saint Exupéry as Local Organiser, and from IEEE-EPS for publishing accepted papers in IEEE Xplore Digital Library.

The 20th EuroSimE will be held in the city of Hannover, Germany, end of March 2019, with the support of Gottfried Wilhelm Leibniz Universität Hannover , Institute of Microelectronic Systems, as local organiser.

Local Organiser is apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage

The Author Portal is the place for you to post abstracts.

Call for Papers
Template for abstract

 

EPTC 2018, 20th Electronics Packaging Technology Conference is also celebrating its 20th birthday in Singapore in December 2018. Get the Call for Papers