Next EuroSimE 2017 in Dresden, Germany

• April 02 2017 : short courses
• April 3-4-5 : conf. and exhibition

Local Organiser is
Fraunhofer Institute for Ceramic Technologies and Systems IKTS,
team of Dr.-Ing. Mike Röllig

Submit abstracts for EuroSimE 2017 in Dresden:

Submit abstract before October 30

2017 Call For Papers

Previous EuroSimE 2016 was held in Montpellier, France, April 17-20, 2016, local organiser was LIRMM

2016 final programme

See papers accepted for publication in Microelectronics Reliability Journal

Exhibit your softwares and products !

download the2017 Exhibitor Guide

Discover who published about what from 2006 to 2016 (1279 papers)

EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to:

• Multi-physics simulation (e.g. thermal, mechanical, thermo-mechanical, coupled thermo-fluidic, coupled electro-mechanics, fluid structure interactions, opto-mechanics)
• Failure analysis and failure mode extraction
• Material characterisation, experiments and modelling
• Validation of simulations by experiments
• Failure criteria and damage modelling for reliability prediction
• Integrated process modelling
• Advanced numerical and analytical simulation methodologies and tools
• Behavioural modelling
• Simulation-based optimisation, virtual prototyping in product and/or process design
• Compact modelling and model order reduction
• Multiscale modeling and simulation

The applications cover all fields of (micro)-electronics and microsystems, but not limited to:

• Components and packaging
  • Flip-chip, BGA, CSP, Wafer-Level packages, MCM, Cu/low-k packages
  • 3-D packaging
  • Opto-electronic packages
  • High temperature and high power packaging
  • Packaging for harsh environments
• Microsystems
  • Piezoelectric components
  • MEMS sensors and actuators
  • Opto-mechanical devices
  • Nano-electronic mechanical devices
  • Bio-MEMS/NEMS
  • Microfluidics
• LED lighting
• Smart systems of 2^nd and 3^rd generation

EuroSimE was created as the only international annual conference with a focus on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

EuroSimE was initiated in 2000 by the COMPETE network, with sponsorship from the European Commission, to meet research and development needs in the fields of Microelectronics and Microsystems.

Since then, EuroSimE has gained worldwide appeal with participants from more than thirty countries, spanning all continents, and has become a fully technically sponsored IEEE CPMT event. The conference proceedings are part of the IEEE conference publication program and can be found in both the IEL and IEEE Xplore® systems.

Since 2005, ASTEFO - a Professional Congress Organiser and Producer - financially produces and logistically organises EuroSimE under the control of the EuroSimE Steering Committee.