25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

187 attendants are registered.

See final programme

See programme of short courses

Get the slides of the course given by H. Baumgärtl, M. Feuchter, M. Hanke of CADFEM:


2024 sponsors and exhibitors

Exhibitor manual and Sponsorship brochure

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability | Special issue for EuroSimE 2021 | ScienceDirect.com by Elsevier

Technical sponsorship from IEEE Electronics Packaging Society
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