22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
- your credentials to enter the EuroSimE virtual space (proceedings, papers, recorded presentations, chats)
- the links to attend the virtual event (tech sessions, panel, short courses) through Microsoft Teams
Go to full programme of event
We hopefully will be back to an in person 2022 event in Malta, supported by STMicroelectronics
Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library.
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.