24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Hotal Das Weitzer
city of Graz, Austria
April 16-17-18-19, 2023
2023 sponsors and exhibitors
The 2022 financial sponsors were:
Exhibitor manual and Sponsorship brochure
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Microelectronics Reliability: special issue for EuroSime 2018
Technical sponsorship from 
