22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

EuroSimE 2021 will be held virtually in April 2021.

Deadline for submitting abstracts is extended to Sunday November 22nd.

We hopefully will be back to an in person 2022 event in Malta, supported by STMicroelectronics.

Call for Papers 2021

Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library.

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

 

Technical sponsorship fromIEEE Electronics Packaging Society

2020 Sponsors

Robert Bosch

Huawei Finland

Siemens