Welcome to EuroSimE

left before EuroSimE !


IEEE Electronics Packaging Society

The 20th EuroSimE will be held in the city of Hannover, Germany, 24-27 March 2019, with the support of Gottfried Wilhelm Leibniz Universität Hannover
Institute of Microelectronic Systems, as local organiser

Local Organiser is apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage

Tentative programme will be published early January 2019.

2019 industry keynotes by:

  • Udo-Martin Gómez (Robert Bosch GmbH): Pushing the limits of MEMS – Success factors design and simulation
  • Ahmer Sayed (Qualcomm) on Package Developments at Qualcomm
  • Darrel Frear (NXP) on Package Development for Autonomous Driving