22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

EuroSimE 2021 will be held virtually on April 19-20-21-22, 2021
Registered attendants, what’s next ? on Friday April 16 latest, you will receive 2 emails:
  • your credentials to enter the EuroSimE virtual space (proceedings, papers, recorded presentations, chats)
  • the links to attend the virtual event (tech sessions, panel, short courses) through Microsoft Teams

We hopefully will be back to an in person 2022 event in Malta, supported by STMicroelectronics

Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library.

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

Technical sponsorship fromIEEE Electronics Packaging Society

2021 Sponsors

Robert Bosch