23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Submit abstracts before November 1st

EuroSimE 2021 was held virtually in April 2021. Accepted papers were posted to IEEE Xplore Digital Library on April 26

2021 satisfaction survey
2021 on-demand space stats

EuroSimE 2022 will be held in Malta on April 24-27, 2022, supported by STMicroelectronics

Call for Papers Malta 2022

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

Technical sponsorship fromIEEE Electronics Packaging Society

2021 Sponsors

Robert Bosch