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International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Where: city of Cracow, Poland, hotel Vienna House Andel’s

When: 26-29 April 2020

Organised by Aptiv Poland

Contact for any enquiry

left before the 21th EuroSimE!

Call for Papers
Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

See list of short courses

Advanced technical programme will be available by mid-January

Industry keynotes from AT&S, Intel, LG.

IEEE Electronics Packaging Society

2019 Sponsors

Gottfried Wilhelm Leibniz Universit├Ąt Hannover

Robert Bosch

Huawei Finland

Iwamoto & Associates

Philips Lighting



Chemnitzer Werkstoffmechanik GmbH