Welcome to EuroSimE

left before EuroSimE !


IEEE Electronics Packaging Society

The 20th EuroSimE will be held in the city of Hannover, Germany, end of March 2019, with the support of Gottfried Wilhelm Leibniz Universität Hannover , Institute of Microelectronic Systems, as local organiser.

Local Organiser is apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage

Submit abstracts before October 30!

 

2019 industry keynotes by:

  • Udo-Martin Gómez (Robert Bosch GmbH) on MEMS and IC Packaging for Automotive Applications
  • Ahmer Sayed (Qualcomm) on Package Developments at Qualcomm
  • Darrel Frear (NXP) on Package Development for Autonomous Driving

EPTC 2018, 20th Electronics Packaging Technology Conference is also celebrating its 20th birthday in Singapore in December 2018. Get the Call for Papers