February 19 – Coronavirus outbreak
FYI the EuroSimE conference will be held in Cracow as scheduled. We are in contact with IEEE and local authorities and we will keep you posted here on any recommendation or policy emitted by Polish authorities.
In case the event would have to be cancelled (a situation which is far to be considered for now), we would reimburse your registration fee.

 

International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Where: city of Cracow, Poland, hotel Vienna House Andel’s

When: 26-29 April 2020

Organised by Aptiv Poland

Contact for any enquiry

FYI: EuroSimE 2021 will take place in Malta, supported by STMicroelectronics.

left before the 21th EuroSimE!

Call for Papers
Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

See programme of short courses

See advanced programme of event

Industry keynotes from AT&S, Intel, LG.

Technical sponsorship fromIEEE Electronics Packaging Society

2019 Sponsors

Gottfried Wilhelm Leibniz Universität Hannover

Robert Bosch

Huawei Finland

Iwamoto & Associates

Philips Lighting

Siemens

CADFEM GmbH

Chemnitzer Werkstoffmechanik GmbH

Dynardo