International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Where: city of Cracow, Poland, hotel Vienna House Andel’s

When: 26-29 April 2020

Organised by Aptiv and TU Cracow

If you attended EuroSimE 2019 in Hannover: see Area for attendants where to get proceedings and other information (open till September 2019)

Contact for any enquiry

left before the 21th EuroSimE!

Call for Papers
Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library

IEEE Electronics Packaging Society

2019 Sponsors

Gottfried Wilhelm Leibniz Universität Hannover

Robert Bosch

Huawei Finland

Iwamoto & Associates

Philips Lighting

Siemens

CADFEM GmbH

Chemnitzer Werkstoffmechanik GmbH

Dynardo