EuroSimE 2025

26th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

Utrecht, The Netherlands | April 6 – 9, 2025

EuroSimE 2025 will be held in the city of Utrecht, The Netherlands, from April 6-9, 2025.

The local organiser is Michiel van Soestbergen, NXP.

The logistics are organised by mcc Agentur für Kommunikation GmbH, based in Berlin, Germany.

Welcome to EuroSimE 2025!

It is our pleasure to invite you to the 26th EuroSimE Conference in the city of Utrecht, from April 6-9, 2025. The historic city of Utrecht is centrally located in the Netherlands and easily accessible by train from Schiphol (Amsterdam) airport within 30 minutes. The conference will address results of fundamental research and industrial applications for thermal, mechanical, and multiphysics simulation and experiments of micro/nano-electronics and microsystems. Information on abstract submission can be found below and on the submissions page.

Professional training courses will be offered on April 6, 2025 followed by three days of technical sessions (April 7–9, 2025) comprising of oral and poster presentations, including industry keynote talks by invited speakers.  In addition, technical keynote talks will address pressing issues in modeling and experimentation for microelectronics and microsystems. In the accompanying exhibition suppliers of experimental characterization equipment and simulation/optimization software will showcase their latest features.

As you can see, we have given our website a light overhaul. The content from the old website, especially the papers from past conferences, will be added to this site in the weeks to come.

We look forward to seeing you in Utrecht next April!

Abstract Submission

Please use the provided template for your abstract and upload it to the online conference system at

Download Template

Download Call for Papers

Important Dates

Deadline abstract submission: November 4, 2024

Notification of acceptance: December 16, 2024

Submission of full paper for proceedings: February 28, 2025