EuroSimE 2027

28th International Conference on Thermal, Mechanical and Multiphysics
Simulation and Experiments in Microelectronics and Microsystems

Regensburg, Germany | April 11 – 14, 2027

EuroSimE 2026 Supporters & Exhibitors

It is our pleasure to invite you to the 28th EuroSimE Conference in the city of Regensburg, from April 11-14, 2027. Regensburg is one of Germany’s best-preserved medieval cities and a UNESCO World Heritage Site, known for its rich history and stunning architecture. Today, it also serves as a dynamic hub for innovation, with a strong presence of high-tech industries and leading companies in microelectronics and automotive technology.

The conference will address results of fundamental research and industrial applications for thermal, mechanical, and multiphysics simulation and experiments of micro/nano-electronics and microsystems. The call for papers and information on abstract submission will be available  on the submissions page in June.

Professional training courses will be offered on April 11, 2027 followed by three days of technical sessions (April 12–14, 2027) comprising of oral and poster presentations, including industry keynote talks by invited speakers. In addition, technical keynote talks will address pressing issues in modeling and experimentation for microelectronics and microsystems. In the accompanying exhibition suppliers of experimental characterization equipment and simulation/optimization software will showcase their latest features.

We look forward to seeing you in Regensburg next April!

Important Dates

Deadline abstract submission: October 26, 2026

Notification of acceptance: December 17, 2026

Submission of full paper for proceedings: March 2, 2027

Impressions of EuroSimE 2026

View the photo gallery here!

Impressions of EuroSimE 2025

View the photo gallery here!