left before EuroSimE !


IEEE Electronics Packaging Society

The 20th EuroSimE will be held in the city of Hannover, Germany, 24-27 March 2019, with the support of Gottfried Wilhelm Leibniz Universität Hannover
Institute of Microelectronic Systems, as local organiser

Local Organiser is apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage

Programme of Short Courses

Advanced technical programme

85 oral presentations and 24 posters

20 hours of short courses

Industry keynotes by:

  • Udo-Martin Gómez (Robert Bosch GmbH): Pushing the limits of MEMS – Success factors design and simulation
  • Ahmer Syed (Qualcomm) on Package Developments at Qualcomm
  • Darrel Frear (NXP) on Package Development for Autonomous Driving

Themes of technical sessions:

  • Solder joint reliability
  • MEMS structures
  • Thermal Behavioral Modelling
  • Prognostics and health monitoring
  • Multi-Physics process models
  • Package level thermo-mechanical assessment
  • System level mechanical reliability
  • Thermal Modelling and Characterization
  • Solid State Lighting
  • Thermal Analysis
  • Electronics reliability under vibration loadings
  • Multiphysics / Scale analysis – including moisture, electromigration, etc.
  • EU projects
  • High power applications
  • IC level thermo-mechanical analysis
  • Advanced experimental analysis techniques