25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Catania, Italy
April 7-8-9-10, 2024
148 abstracts were submitted by 133 different individuals.
2023 sponsors and exhibitors
Exhibitor manual and Sponsorship brochure
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Microelectronics Reliability: special issue for EuroSime 2018
Technical sponsorship from 
