left before the 20th EuroSimE !


IEEE Electronics Packaging Society

The 20th EuroSimE will be held in the city of Hannover, Germany, 24-27 March 2019, with the support of Gottfried Wilhelm Leibniz Universität Hannover
Institute of Microelectronic Systems, as local organiser

Local Organiser is apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage

Programme of Short Courses

Final full programme

85 oral presentations and 15 posters

20 hours of short courses

Industry keynotes by:

  • Udo-Martin Gómez (Robert Bosch GmbH): Pushing the limits of MEMS – Success factors design and simulation
  • Ahmer Syed (Qualcomm) on Package Developments at Qualcomm
  • Darrel Frear (NXP) on Package Development for Autonomous Driving