22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
EuroSimE 2021 will be held virtually on April 19-20-21, 2021
Deadline for submitting abstracts is extended to Sunday November 22nd
We hopefully will be back to an in person 2022 event in Malta, supported by STMicroelectronics
Second Call for Papers 2021
Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library.
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Microelectronics Reliability: special issue for EuroSime 2018
Technical sponsorship from
2020 Sponsors
