23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Submit abstracts before November 8th latest !

EuroSimE 2021 was held virtually in April 2021. Accepted papers were posted to IEEE Xplore Digital Library on April 26

2021 satisfaction survey
2021 on-demand space stats

EuroSimE 2022 will be held in Malta on April 24-27, 2022, supported by STMicroelectronics

Call for Papers Malta 2022

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

Technical sponsorship fromIEEE Electronics Packaging Society

2021 Sponsors

Robert Bosch


Siemens