The on-demand virtual space closed on Tuesday July 28 2pm GMT.

Programme of event

In place of the in-person event, EuroSimE 2020 was held as a virtual conference.

International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

kindly provided the Virtual EuroSimE with its WebEx facilities.

EuroSimE 2021 will take place in Malta, supported by STMicroelectronics.

Call for Papers 2021 Malta

EuroSimE 2022 may be held in Cracow.

Accepted papers will be submitted for inclusion in IEEE Xplore Digital Library.

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018


Technical sponsorship fromIEEE Electronics Packaging Society

2020 Sponsors

Robert Bosch

Huawei Finland