From July 16, the EuroSimE Web site will be managed by mcc Agentur für Kommunikation GmbH, the company now organising the event.

25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

EuroSimE Catania was the most successful of its 25-year life with 190 attendants. All papers are available on IEEE Xplore.

See final programme

See programme of short courses

Freely get the slides of the course given by H. Baumgärtl, M. Feuchter, M. Hanke of CADFEM:


2024 sponsors and exhibitors

Exhibitor manual and Sponsorship brochure

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability | Special issue for EuroSimE 2021 | by Elsevier

Technical sponsorship from IEEE Electronics Packaging Society
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