left before EuroSimE !


IEEE Electronics Packaging Society

The 20th EuroSimE will be held in the city of Hannover, Germany, 24-27 March 2019, with the support of Gottfried Wilhelm Leibniz Universität Hannover
Institute of Microelectronic Systems, as local organiser

Local Organiser is apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage

Tentative programme will be published early January 2019.

Programme of Short Courses is available some courses descriptions are yet missing.

All Authors have been notified by email on acceptation / rejection of their abstracts. In case you did not receive the notification email, please check your spam folders first, contact us at eurosime@astefo.com .

2019 industry keynotes by:

  • Udo-Martin Gómez (Robert Bosch GmbH): Pushing the limits of MEMS – Success factors design and simulation
  • Ahmer Sayed (Qualcomm) on Package Developments at Qualcomm
  • Darrel Frear (NXP) on Package Development for Autonomous Driving