Welcome to EuroSimE

IEEE Electronics Packaging Society

The 19th EuroSimE was  held in Toulouse, France, on April 15-16-17-18  2018, with technical sponsorship from Institute of Technology Antoine de Saint Exupéry as Local Organiser, and from IEEE-EPS for publishing accepted papers in IEEE Xplore Digital Library.

All info to attend EuroSimE is in Toulouse 2018 page

A new topic is introduced, vibration : methods to derive the endurance strength under vibration, FE methods to derive the dynamic response under vibration, material characterization and modeling for FE models under vibration, vibration load profile derivation and transfer to FE models.