Short Courses
Overview of Short Courses on April 6, 2025
09:00-12:00 | Design-on-Simulation for Advanced Packaging: Warpage Management, Reliability and Life Prediction
Dr. Xuejun Fan
Lamar University, USA
Xuejun Fan is a Regents’ Professor of Texas State University System, a Mary Ann and Lawrence E. Faust endowed chair professor in the Department of Mechanical Engineering at Lamar University, Beaumont, Texas. Dr. Fan had extensive experience in industry, such as with Intel Cooperation, Philips Research, and the Institute of Microelectronics (IME), Singapore. Dr. Fan is an IEEE Fellow and an IEEE Distinguished Lecturer. He received the EuroSimE Achievement Award in 2023. He has published more than 300 papers, including 4 books, over 100 journal papers, many book chapters, and numerous conference papers. Dr. Fan currently serves as a co-chair of Modeling and Simulation in Heterogeneous Integration Roadmap (HIR).
Kuo-Ning Chiang
National Tsing Hua University, Taiwan
Professor K.N. Chiang received his PhD from the Georgia Institute of Technology, USA. He is the Chair Professor at the National Tsing Hua University in Hsinchu, Taiwan. Dr. Chiang He has received outstanding research awards from the Ministry of Science and Technology of Taiwan three times and has published more than 450 technical papers in international journals and conference proceedings. He has been granted more than 50 invention patents. Among the major awards Professor Chiang received are the Excellence in Mechanics Award from ASME (2022) and the Outstanding Sustained Technical Contribution Award (2020) from IEEE-EPS. Currently, he is Editor-in-Chief of the Journal of Mechanics (SCI), Academic Editor of Materials (SCI), and Associate Editor of the Journal of Electronic Packaging (SCI).
Course description
“The electronic packaging community has widely used Design-on-Simulation (DoS) methodology for designing new packaging structures in terms of warpage management, reliability and life prediction. Artificial intelligence (AI)/machine learning approaches can be combined with DoS for better accuracy and efficiency. This course aims to illustrate the fundamentals of physics associated with different failure mechanisms, in particular, the warpage management, and the solution methodology and procedure about large database generation, and AI training performance of different machine learning algorithms. This course will also describe the warpage mitigation solutions, as well as how to combine AI and finite element simulation to estimate the reliability life and obtain the best structure combination of each packaging component using wafer-level packages as demonstrations.
Outline of the course
1. Introduction to advanced packaging
2. Root causes of warpage and mechanics
3. Warpage management
4. Finite element analysis and simulation
5. AI-assisted design-on-simulation methodology
6. AI solvers
7. Case study: solder joint reliability life cycle prediction empirical equations”
Dr. Xuejun Fan
Lamar University
Kuo-Ning Chiang
National Tsing Hua University, Taiwan
09:00-12:00 | Reliability Assessment of Glass Substrates and Interposers for Advanced Packaging
Prof. Seungbae Park
State Univ of New York at Binghamton
Prof. Seungbae (SB) Park is a Professor of Mechanical engineering of the State University of New York (SUNY) at Binghamton. He is also the director of Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology (CAT).
He received his Ph.D from Purdue University in 1994 and worked for IBM before joining SUNY Binghamton.
He has more than 200 technical publications and holds 4 US patents. Dr. Park was elected as an IEEE Fellow, ASME Fellow, former Chair of IEEE Electronic Packaging Society Thermal/Mechanical Technical Committee, former Chair of ASME Electronics and Photonics Packaging Division, former Chair of ASME K-16 Committee on Heat Transfer in Electronic Equipment, and served as an associate editor for ASME Journal of Electronic Packaging.
Course description
The evolution of electronic packaging technology towards the adoption of glass substrates marks a significant advancement in overcoming the constraints posed by traditional organic materials. This course delves into the thermo-mechanical reliability concerns associated with glass substrates, glass interposers, and Through Glass Vias (TGV), highlighting the inherent fragility of glass and its susceptibility to cracking as key challenges in their widespread application. The unique tunable modulus and closely matched coefficient of thermal expansion (CTE) to silicon, offer promising solutions to stress-related failures, particularly in large-format applications. Despite these advantages, the integration of glass substrates faces obstacles such as stress management, fragility, adhesion issues, and the uniformity of via fills, compounded by the limited availability of long-term reliability data.
This course provides a comprehensive overview of the fabrication processes for glass substrates and TGVs, the impact of design parameters such as via density and aspect ratio on glass substrate reliability, and the mitigation strategies for stress and crack of TGV.
Prof. Seungbae Park
State Univ of New York at Binghamton
09:00-17:00 | Efficient Thermo-Mehanical Simulations Using Compact Models (Hands-on course)
Prof. Dr.-Ing. Tamara Bechtold
Jade University of Applied Sciences
Tamara Bechtold obtained her PhD in microsystem simulation from the University of Freiburg, Germany, in 2005. Between 2006 and 2010, she worked as a research engineer for Philips Research Laboratories and NXP Semiconductors in Eindhoven, The Netherlands. From 2011 to 2014 she acted as an interim Professor for microsystems simulation at the University of Freiburg, Germany and since 2014 as a lecturer and research group leader at the University of Rostock, Germany. Since 2017 Dr. Bechtold is a full professor for mechatronic systems at Jade University in Wilhelmshaven, Germany. Since 2022 she is a managing director of Steinbeis Transfer Center. Dr.Bechtold is author or co-author of over 150 technical publications in the area of modelling and simulation of micro-mechatronic systems.
Soenke Maeter
CADFEM GmbH
Sönke Maeter obtained a Master’s degree in electrical engineering from the Jade University of Applied Sciences in Wilhelmshaven in 2022. His master’s thesis, titled “Nonlinear Model Order Reduction of MEMS Actuators,” was awarded a prize by the German Electrical Engineering Association (VDE). Since October 2022, he has been with Cadfem Germany, responsible for model order reduction research and development of the software tool “Model Reduction inside Ansys”.
Course description
Heat is generated in almost all technical processes. For example, the integration density in modern electronic systems is so high that their performance is limited by cooling. Microelectronic reliability depends on thermo-mechanical properties of packages. Highly integrated batteries of hybrid electrical vehicles depend on cooling. The properties of electrical machines are determined by the heat losses, etc. These effects can be determined by numerical simulations via e.g., finite element analysis of thermal or thermomechanical fields. However, the key to correctly considering the entire system is a system-level simulation in which compact models are connected to further mechanical, electrical or fluidic components. Furthermore, the compact models can be used for efficient design optimization and control and can be shared along the supply chain, as they protect the IP.
Using industry-relevant examples, this seminar shows the great advantages of compact models, explains the underlying theory in a comprehensive way and presents the state-of-the-art software tool “Model Reduction inside Ansys” and the working flow through hands-on exercises.
Prof. Dr.-Ing. Tamara Bechtold
Jade University of Applied Sciences
14:00-17:00 | Nano/Micro Metal Particle Sintering: Materials, Process, Characterization, and Reliability in Automotive and Power Electronics
Dr. Jiajie Fan
Fudan University, China
Dr. Jiajie Fan is a Youth Professor and PhD Supervisor at the Academy for Engineering & Technology and Shanghai Engineering Technology Research Center for SiC Power Device of Fudan University, Shanghai, China. He received the Ph.D. degree in Industrial and Systems Engineering at The Hong Kong Polytechnic University, Hung Hom, Hong Kong, China, in 2014. He is an IEEE Senior Member, Associate Editor of IEEE Access journal. He has published more than 120 academic papers and held more than 10 invention patents in China. His main research interests include: Wide bandgap power electronics packaging, LED packaging and system integration, Prognostics and health management, Reliability modeling and assessment.
Dr. Xuejun Fan
Lamar University, USA
Dr. Xuejun Fan is a Regents’Professor of Texas State University System, and a Mary Annand Lawrence E. Faust Endowed Professor at Lamar University, Beaumont, Texas. Dr. Fan is an IEEE Fellow, and an IEEE Distinguished Lecturer. He received the Outstanding Sustained Technical Contribution Award in 2017, and the Exceptional Technical Achievement Awardin2011 from Electronic Packaging Society of IEEE. Dr. Fan is a co-chair of Modeling and Simulation in Heterogeneous Integration Roadmap committee. Dr. Fan was a Senior Staff Engineer at Intel from 2004 to 2007 with Q&R Division in Chandler, Arizona.
Course description
To fulfill the high-temperature, high-voltage, and high-frequency applications of Wide Bandgap Semiconductor (WBG) power electronics, an excellent interconnect technology that can withstand harsh environments for a long time are necessary in WBG packaging. With its benefits of low processing temperatures, exceptional electro-thermo-mechanical performance, and high process flexibility, nano/micro metal particle sintering technology is gaining increased attention, particularly in automotive and power electronics packaging applications. In this course, the high-temperature interconnect materials, such as high-temperature solders and transient liquid-phase bonding materials, are reviewed first. Then, Ag and Cu metallic particle and paste material preparations and sintering process are thoroughly introduced. Next, the property characterization and reliability testing methods and applications are overviewed, respectively. Finally, the challenges and outlook of promising sintering technology are summarized.
Dr. Jiajie Fan
Fudan University, China
Dr. Xuejun Fan
Lamar University
14:00-17:00 | Reliability and Failure of Micro-electronics Packaging Materials
Dr. Amar Mavinkurve
NXP Semiconductors
Dr. Amar Mavinkurve finished his PhD in Polymer Science from the University of Groningen in the Netherlands in 1996. He then started at Philips Research working on various topics like polymer-metal interfaces, polymer processing and textiles. He joined NXP Semiconductors in 2004 (at that time still Philips) and has worked mainly on packaging materials and reliability with specific interest in interconnect systems (especially wire bonding but also flip chipping) and aging behaviour of packaging materials. He currently leads the Global Materials team at NXP.
Course description
The tutorial will cover failure mechanisms in microelectronic packages induced by aging of various packaging materials, with focus on interconnect reliability, viz. wire bonded and flip chip interconnects. Acceleration models will be presented, which can be used to assess application mission profiles, including harsh environments. A number of case studies will be shown, including some examples demonstrating over-acceleration during reliability testing. The basis of this tutorial is a chapter from the recently published book “Reliability of Organic Compounds in Microelectronics and Optoelectronics”, Springer Verlag 2022.
Dr. Amar Mavinkurve
NXP Semiconductors