Full Paper Submission
All authors have been informed about the acceptance of their abstracts. All oral and poster presenters must submit a full paper to the conference. The recommended length is 5-8 pages. The papers will be distributed in time for the conference.
The deadline for the submission of the camera-ready full papers is February 28, 2025.
Please note that we are using the standard IEEE paper template, it can be downloaded below both in docx- and in Latex-format.
Downloads
Word – Template: Download here (.docx/30 KB)
Latex – Template: Download here (.zip/759 KB)
Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
Paper upload will be possible starting January 20, 2025. You will need to submit you full paper in pdf format. Please make sure to use the IEEE paper template provided on this page and to go through the IEEE Xpress pdf checker, before uploading your camera-ready paper through the conference system. While you are uploading the paper, you will also be asked to identify the presenting author and to provide a short bio of him or her. The conference ID for the pdf checker is will be announced shortly.
Contact
In case you experience any problems with the submission process, please contact us at office@eurosime.org
Important Dates
Deadline for submitting the camera-ready paper through ConfTool: February 28, 2025
Topics
Single domain simulation
- Thermal, mechanical, thermo-mechanical, vibration, shock
- Chip package board interaction
- Advanced numerical and analytical simulations methodologies and tools
- Compact Modelling & Model Order Reduction
- Digital twins
- Advanced thermal management concepts
Material characterization and validation
- Material characterization, experiments and modelling
- Bulk and interface toughness, characterization and modeling
- Experimental methods for validation of simulation models
- Failure analysis and failure mode extraction
- Failure criteria and damage modelling for reliability prediction
Application domains
- Electronic components, packaging and system integration for applications including aerospace, automotive, energy, lighting
and medical. - MEMS sensors & actuators, piezoelectric, piezoresistive, functional ceramic sensors and components
- Opto-electronic & opto-mechanical devices
- Nano-electronic mechanical devices
- Consumer electronics
Multi-physics simulation
- Multi-physics simulation (MEMS, manufacturing and process models, electronic control unit/system level, fluid structure
interactions) - Multi-scale modelling and simulation
- Integrated process modelling
- Simulation-based optimization, virtual prototyping and prequalification in product and process design
- Simulations for heterogeneous integration
Emerging modeling methods and tools
- Prognostics and Health Management (PHM)
- Development and implementation of artificial intelligence and machine learning
- Use of big data in simulation & reliability applications
- 3D packaging, TSV technology, heterogenuous integraton, chiplet packaging
- Additive manufacturing (3D printing) for electronics