Information for Presenters
Oral presenters are kindly asked to be in their session room 10 minutes before the start of their session and to bring their presentation on a stick. It is not possible to use your own laptop. Every presentation is scheduled for 20 minutes, including 3- 5 minutes Q&A at the end. There is no slide template for oral presentations, but please lay out the slides in 16:9 format.
Poster presenters are kindly asked to use this template, it is not obligatory but recommended. It is important that you follow these guidelines when creating your poster:
- Format A0 (84.1 x 118.9 cm, portrait style)
- No font smaller than 18 pt
- Use bullet points, avoid long narrative text
- Pictures and diagrams in good resolution
Assistance for hanging the posters will be available. All posters that have not been picked up by Wednesday afternoon will not be kept.
Full Paper Submission – Upload now open!
All authors have been informed about the acceptance of their abstracts. The submission of a full paper is required for all presenters, both oral and poster. The recommended length is 5-8 pages. The papers will be distributed in time for the conference.
The deadline for the submission of the camera-ready full papers has been extended to March 17, 2025.
Please note that we are using the standard IEEE paper template, it can be downloaded below both in docx- and in Latex-format.
Downloads
Word – Template: Download here (.docx/30 KB)
Latex – Template: Download here (.zip/759 KB)
Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
You need to submit your full paper in pdf format. Please make sure to use the IEEE paper template provided on this page. All full papers must go through the IEEE PDF eXpress Checker before being submitted via ConfTool. The conference ID for the IEEE PDF eXpress checker is 65125X. While you are uploading your camera-ready paper to ConfTool, you will also be asked to identify the presenting author and to provide a short bio of him or her.
Contact
In case you experience any problems with the submission process, please contact us at office@eurosime.org
Important Dates
Deadline for submitting the camera-ready paper through ConfTool: Extended to March 17, 2025
Topics
Single domain simulation
- Thermal, mechanical, thermo-mechanical, vibration, shock
- Chip package board interaction
- Advanced numerical and analytical simulations methodologies and tools
- Compact Modelling & Model Order Reduction
- Digital twins
- Advanced thermal management concepts
Material characterization and validation
- Material characterization, experiments and modelling
- Bulk and interface toughness, characterization and modeling
- Experimental methods for validation of simulation models
- Failure analysis and failure mode extraction
- Failure criteria and damage modelling for reliability prediction
Application domains
- Electronic components, packaging and system integration for applications including aerospace, automotive, energy, lighting
and medical. - MEMS sensors & actuators, piezoelectric, piezoresistive, functional ceramic sensors and components
- Opto-electronic & opto-mechanical devices
- Nano-electronic mechanical devices
- Consumer electronics
Multi-physics simulation
- Multi-physics simulation (MEMS, manufacturing and process models, electronic control unit/system level, fluid structure
interactions) - Multi-scale modelling and simulation
- Integrated process modelling
- Simulation-based optimization, virtual prototyping and prequalification in product and process design
- Simulations for heterogeneous integration
Emerging modeling methods and tools
- Prognostics and Health Management (PHM)
- Development and implementation of artificial intelligence and machine learning
- Use of big data in simulation & reliability applications
- 3D packaging, TSV technology, heterogenuous integraton, chiplet packaging
- Additive manufacturing (3D printing) for electronics