26th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

Utrecht, The Netherlands | April 6 – 9, 2025

Sponsorship Opportunities

EuroSimE is an established international and IEEE listed conference with worldwide recognition, attended by leading experts from both industry and academia working on Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems. EuroSimE is a collaboration and networking platform with dedicated sessions on funded projects and roadmaps for the future microelectronic products (e.g. Heterogenous Integration Roadmap)

WE OFFER STANDARD PACKAGES OF VARIOUS SIZES

CONTACT US FOR INDIVIDUAL SPONSORSHIP PACKAGES

TAILORED MARKETING COLLABORATION: 2000 €+

Please contact the EuroSimE sponsoring committee for tailored and special purpose marketing collaborations which are not covered by the EuroSimE standard sponsorship packages.

All fees include 21% Dutch VAT

WHAT ARE THE BENEFITS FOR YOUR COMPANY?

WHY SPONSOR THE EUROSIME CONFERENCE?

  • Generate awareness for your company, products and services
  • Generate a strong leadership position for your company
  • Build a network with microelectronics industry and academia leaders
  • Promote your company’s latest technology and build partnerships
  • Build knowledge and expertise
  • Create opportunities and develop your business through meaningful connections with the other participants

Download

EuroSimE 2025 Sponsorship Opportunities

Martina Creutzfeldt
Financial organizer

office@eurosime.org

Przemyslaw Gromala
Sponsorship chair

pgromala@ieee.org

Martin Niessner
Sponsorship co-chair

martin.niessner@infineon.com

Michiel van Soestbergen
Local Organizer

michiel.van.soestbergen@nxp.com

Sponsors