For any inquiry: contact the logistics organiser olivier.desaintleger@eurosime.org
EuroSimE is financially produced and organised by Astefo sarl, France, under the supervision of the EuroSimE Steering Committee.

Steering Committee

General chair:

Willem van Driel (Signify, The Netherlands)

Technical Program Committee:

  • Kouchi Zhang (TU Delft, The Netherlands) : Keynotes
  • Bart Vandevelde (IMEC, Belgium): thermomechanical track
  • Christopher Bailey (University of Greenwich): multiphysics track
  • Peter Rodgers (The Petroleum Institutes, UAE): thermofluidics track
  • Mike Röllig (Fraunhofer Institute IKTS, Germany): posters

Journals Committee:

  • Hélène Frémont (IMS Université Bordeaux, France)
  • Michel Lenczner (FEMTO-ST, France)
  • Véronique Rochus (IMEC, Belgium)

Exhibition Committee:

  • Przemyslaw Gromala (Robert Bosch GmbH, Germany)
  • Alexandru Prisacaru (Robert Bosch GmbH, Germany)

Short Courses Committee:

  • RainerDudek (Fraunhofer Institute ENAS, Germany)
  • Roseanne Duca (STMicroelectronics, Malta)
  • Bernhard Wunderle (Fraunhofer Institute ENAS, Germany)

Communication Committee:

  • open

Award Committee

  • Sven Rzepka (Fraunhofer Institute ENAS, Germany)

Industry Liaison Committee

  • Michael Guyenot (Robert Bosch, Germany)
  • Matthias Heimann (Siemens, Germany)
  • Przemyslaw Gromala (Robert Bosch GmbH, Germany)

Production and organization:

  • Olivier de Saint Leger (Astefo, France)

Technical Committee

Andersson, D. R. IVF – Sweden
Bailey, C. University of Greenwich – UK
Calabretta, M. STM – Italy
Chiang, K. National Tsing Hua University/ITRI – Taiwan
Corigliano, A. Politecnico di Milano – Italy
Dasgupta, Abhijit, University of Maryland – USA
Dijk, van, Marius, Fraunhofer Institute IZM – Germany
Driel, van W., Signify – The Netherlands
Dudek, R. Fraunhofer Institute ENAS – Germany
Elata, David, Technion – Israel
Eveloy, V. The Petroleum Institute -UAE
Fan, X.J. Lamar University – USA
Frémont, H. IMS Université Bordeaux, France
Gao, Feng, Northwestern University, Evanston, IL, USA
García Martínez, Yamila, Catalan Institute of Nanoscience & Nanotechnology,  Barcelona – Spain
Gonzalez, M. IMEC – Belgium
Hanreich, G. Vienna University of Technology – Austria
Iwamoto, N. Honeywell – USA
Jansen, K. TU Delft – The Netherlands
Koh, S., Huawei, China
Lall, P. Auburn University
Lee, R. Hong Kong Univ. of Science & Technology – China
Lenczner, M. FEMTO-ST Institute / Time-Frequency – France
Liu, Y. Fairchild Semiconductor -USA
Madenci, E. University of Arizona – USA
Messina, Angelo Alberto STM – Italy
Nabi Aharon, Rafael – Israel
Noritake, Chikage, DENSO CORPORATION – Japan
Pape, H. consultant – Germany
Perpinya, X, Centro Nacional de Microelectrónica – Spain
Plaza, J.A., Centro Nacional de Microelectrónica – Spain
Poshtan, E. Robert Bosch – Germany
Rantala, J. Nokia – Finland
Rochus, V. IMEC – Belgium
Rogers, P. The Petroleum Institute – UAE
Schwarz, B. Siemens – Germany
Rejaei, B., Delft University of Technology – The Netherlands
Rovitto, M., STMicroelectronics – Italy
Rzepka, S. Fraunhofer ENAS – Germany
Sabry, M.N. Université Française d’Egypte – Egypt
Sitaraman, S. K. Georgia Tech – USA
Vandevelde, B., IMEC – Belgium
van Dijk, M., Fraunhofer IZM Berlin – Germany
van Soestbergen, M., NXP Semiconductors – The Netherlands
Vellvehi, M.H., Centre Nacional de Microelectrònica (CNM) – Spain
Wang, Bo Ping, Univ. of Texas at Arlington – USA
Wiese, S. Saarland University – Germany
Yang, D., Guilin University, China
Zhang, Guang-Ping, Shenyang National Laboratory for Materials Science/ Institute of Metal Research (IMR), Chinese Academy of Sciences – China
Zhang, G.Q. Philips Lighting, Delft University of Technology -The Netherlands
Zhong Zhaowei, Nanyang Technology University – Singapore
Zhou, J. Lamar University – USA