EuroSimE 2015 was held in Budapest, Hungary, in April 2015

150 attendants. 4 short courses.

Proceedings on flash stick 978-1-4799-9950-7/15/$31.00 ©2015 IEEE IEEE catalog CFP15566-CDR

Programme of EuroSimE 2015

Click to unfold/fold programme at a glance

Authors vs sessions

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09:00 Welcome by local organiser

Special session Industry keynotes 09:10 Monday April 20 2015
Chaired by Kouchi Zhang, TU Delft DIMES
09:10 Simulation driven design – from concept phase to robust design, Dr. Petra Schiebel, Robert Bosch GmbH
09:40 Molecular Modeling in Industry for Electronic Materials, Dr. Nancy Iwamoto, Honeywell
10:10 Predicting the Lifetime of Power Semiconductor Modules under Variable Thermal Stress – Boundary Conditions and Limitations, Prof. Dr. Uwe Scheuermann, Manager Product Reliability, SEMIKRON Elektronik
10:40 Break

Session 1 Technical Keynotes 11:00 Monday April 20 2015
Chaired by Chris Bailey, Peter Rodgers
11:00 30mn Keynote presentation – Nonlinear Mechanical Springs for Counteracting Nonlinearities in Gap-closing Electrostatic Actuators
Ben Rivlin, Shai Shmulevich, Aharon Joffe, David Elata, Technion – Israel Institute of Technology
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11:30 30mn Keynote presentation – Virtual Prototyping of Advanced Packaging Processes
Julien Sylvestre, University Sherbrooke, Canada
12:00 30mn Keynote presentation – B-Spline X-ray Diffraction Imaging Techniques for Die Warpage and Stress Monitoring Inside Fully Encapsulated Packaged Chips
Patrick J. McNally, Dublin City University, Dublin, Ireland
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12:30 Lunch

Session 2 Reliability Investigations 14:00 Monday April 20 2015
Chaired by Zoltán Hajnal, Ricky Lee
14:00 30mn Keynote presentation – Challenges in the Reliability of 3D Integration using TSVs
Martin Stiebing 1, Dietmar Vogel 2, Wolfram Steller 3, M. Jürgen Wolf 3, Bernhard Wunderle 1
1 Technische Universität Chemnitz, Germany
2 Fraunhofer ENAS, Micromaterials Center MMC, Germany
3 Fraunhofer IZM, ASSID, Germany

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14:30 20mn Reliability Investigation and Design of High Power Inverter Modules based on Material Characterization Simulation and experimental Verification.
E. Merten 1, T. von Essen 1, F. Luczack 2, A. Otto 2, A. Lunding 3, P. Lürkens 4, M. Bast 5, M. AboRas 1, S. Rzepka 2
1 Berliner Nanotest u. Design GmbH, Berlin, Germany
2 Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany
3 Philips Medical Systems DMC GmbH, Hamburg, Germany
4 Philips Research Europe, Eindhoven, Netherlands
5 FuE-Zentrum FH Kiel GmbH, Kiel, Germany

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14:50 20mn Study on Thermomechanical Reliability of IGBT Power Module and Thermal Grease Pump-out Mechanism
Jue Li 1, Pirkka Myllykoski 2, Mervi Paulasto-Kröckel 1
1 Aalto University, School of Electrical Engineering, Espoo, Finland
2 ABB Drives, Helsinki, Finland

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15:10 20mn The effect of variations in temperature cycling profile and mechanical properties of solder on thermo-mechanical reliability of a lead-free BGA package
Ilja Belov 1, Jonas Arwidson 2, Ralf Poder 3, Pär Johannesson 4, Peter Leisner 4
1 School of Engineering, Jönköping University, Jönköping, Sweden
2 Saab AB publ.Avionics Systems, Jönköping, Sweden
3 SP Technical Research Institute of Sweden,Copenhagen, Denmark
4 SP Technical Research Institute of Sweden, Borås, Sweden

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15:30 20mn Reliability Study on SMD Components on an Organic Substrate with a Thick Copper Core for Power Electronics Applications
Meier, Karsten, Technische Universität Dresden, Electronics Packaging Laboratory
Roellig, Mike, Fraunhofer Institute for Ceramic Technologies and Systems – Material Diagnostics

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Session 3 Multi-Physics Simulations (including Moisture, Electrical, etc) 14:00 Monday April 20 2015
Chaired by Alexander Gielen, David Elata
14:00 30mn Keynote presentation – Multiphysics Study of Electromigration in Ceramic Capacitors
Jaemi L. Herzberger, Abhijit Dasgupta, Siddhartha Das, University of Maryland Department of Mechanical Engineering, College Park, USA
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14:30 20mn Measurement and Simulation of Electromagnetic Drift for Obsolescence Management in Electronics
Geneviève DUCHAMP 1, Tristan DUBOIS 1, Ala AYED 1, Christian MAROT 2, Hélène FREMONT 1
1 University Bordeaux- IMS Laboratory, Talence, France
2 Airbus Group Innovation, Toulouse, France

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14:50 20mn A Compact Parametric Model of Magnetic Resonance Micro Sensor
M. Kudryavtsev 1, Sh. Gorgi Zade 1, J. G. Korvink 2, T. Bechtol 1
1 University of Rostock, Germany
2 Institute for Microsystems Engineering, Freiburg University, Germany

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15:10 20mn New Simulation Method for Deep Trench Termination Diode DT² using Mixed-mode TCAD Sentaurus
Fedia Baccar, Houssam Arbess, Loic Theolier, Stephane Azzopardi, Eric Woirgard, IMS Laboratory, University of Bordeaux, France
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15:30 20mn Understanding Tip-Enhanced Raman Spectroscopy by Multiphysics Finite Element Simulations
Vladimir Kolchuzhin, Jan Mehner, Evgeniya Sheremet, Bhattacharya Kunal, Raul D. Rodriguez, Dietrich R.T. Zahn, Technische Universität Chemnitz, Chemnitz, Germany
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Session 4 Thermal Behavior Modeling and Characterization 14:00 Monday April 20 2015
Chaired by Peter Rodgers, Ilja Belov
14:00 30mn Keynote presentation – Modeling and Model-based Control of Temperature in an SThM Probe
Michel Lenczner 1, Bin Yang 2, Mohamed Abaidi 2, Alexia Bontempi 2, Damien Teyssieux 3, Bernd Koehler 4, Pawel Janus 5
1 FEMTO-ST – Technical University of Belfort Montbéliard, France
2 FEMTO-ST – University of Franche-Comté, France
3 FEMTO-ST – Ecole Nationale Supérieure de Mécanique et de Microtechnologie, France
4 Fraunhofer-Institute – IZFP, Germany
5 Instytut Technologii Elektronowej – Wroclaw University of Technology, Poland

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14:30 20mn CFD Simulations of Wave Soldering on Through-Hole Printed Circuit Assemblies
A. Yuile, S. Wiese, Saarland University, Germany
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14:50 20mn Simulation of a Flip Chip Bonding Technique Using Reactive Foils
F. Kraemer, C. Pauly, F. Muecklich, S. Wiese, Saarland University, Saarbrucken, Germany
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15:10 20mn Thermal Analysis of Micro-Hotplates for Catalytic Gas Microsensors
Alexander Kozlov, Omsk State University, Omsk, Russia
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15:30 20mn Current Load Capacity of Electrical Conductor Tracks Evaluated by Simulation and Thermographic Imaging
Thomas Tetzlaff, Ulf Witkowski, Electronics and Circuit Technology, South Westphalia University of Applied Sciences, Soest, Germany
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15:50 Break

Session 5 Interconnect Investigations 16:20 Monday April 20 2015
Chaired by Steffen Hartmann, Patrick McNally
16:20 30mn Keynote presentation – Adequate Mechanical Copper Modelling for 2nd Level Interconnect Structures
Steffen Wiese, Frank Kraemer, Saarland University, Saarbruecken, Germany
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16:50 20mn A Geometry-Independent Lifetime Modelling Method for Aluminum Heavy Wire Bond Joints
Arian Grams 1, Jan Höfer 1, Andreas Middendorf 2, Stefan Schmitz 1, Olaf Wittler 1, Klaus-Dieter Lang 2
1 Fraunhofer IZM, Berlin, Germany
2 Technische Universität Berlin, Berlin, Germany

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17:10 20mn Thermo-mechanical ball bonding simulation with elasto-plastic parameters obtained from nanoindentation and atomic force measurements
Alan Wright 1, Stephane Koffel 1, Silke Kraft 1, Peter Pichler 2, Juri Cambieri 3, Rainer Minixhofer 3, Ewald Wachmann 3
1 Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany
2 Fraunhofer IISB and Chair of Electron Devices, University of Erlangen-Nuremberg, Germany
3 ams AG, Unterpremstätten, Austria

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17:30 20mn Analyzing Thermo-Mechanical Reliability of an Interconnect Based on Metal Coated Polymer Spheres MPS
R. Fayҫal Hamou 1, Daniel N. Wright 2, Astrid-Sofie B. Vardøy 2, Marie Haupt 3, Susanne Helland 4, Helge Kristiansen 4, Maaike M.Visser Taklo 2
1 SINTEF ICT, Microsystems and Nanotechnology MiNaLab, Oslo, Norway
2 SINTEF ICT, Instrumentation Dept., Oslo, Norway
3 AMIC Angewandte Micro-Messtechnik GmbH, Berlin, Germany
4 Conpart AS, Skjetten, Norway

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Session 6 Molecular Dynamics and Process Modelling 16:20 Monday April 20 2015
Chaired by Li-Ling Liao, Emad Poshtan
16:20 30mn Keynote presentation – Towards Nanoreliability of CNT based Sensor Applications: Investigations of CNT-Metal Interfaces Combining Molecular Dynamics Simulations Advanced In Situ Experiments and Analytics.
Steffen Hartmann 1, Alexey Shaporin 1, Sascha Hermann 1, Jens Bonitz 1, Marc Heggen 2, Peter Meszmer 1, Heinz Sturm 3, Ole Hölck 4, Thomas Blaudeck 1, Stefan E. Schulz 5, Jan Mehner, Bernhard Wunderle 1, Thomas Gessner 5
1 Technische Universität Chemnitz, Germany
2 Ernst Ruska-Centrum und Peter Grünberg Institut, Forschungszentrum Jülich GmbH, Germany
3 Bundesanstalt für Materialforschung und -prüfung, Germany
4 Technische Universität Chemnitz Fraunhofer IZM Berlin, Germany
5 Fraunhofer ENAS Chemnitz, Germany

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16:50 20mn Computational Electrohydrodynamics in the Fabrication of Hollow Polymer Microstructures
C. Tonry 1, M. Patel 1, M. Desmuliez 2, W. Yu 3, C. Bailey 1
1 Computational Mechanics and Reliability Group CMRG, School of Computing and Mathematical Sciences, University of Greenwich, UK
2 Microsystems Engineering Centre MISEC, School of Engineering Physical Sciences, Heriot Watt University, UK
3 State Key Laboratory of Applied Optics, Changchun Institute of Optics, Chinese Academy of Sciences, Changchun, China

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17:10 20mn Diffusion Simulation thru Polymers using Coarse-grained Models Derived from Molecular Models.
Nancy Iwamoto, Honeywell, USA
17:30 20mn Submodeling FEM Analysis of 3D Printed Structures
Javad Zarbakhsh 1, Armin Iravani 1, Zeinab Amin-Akhlaghi 2
1 Carinthia University of Applied Sciences, Department of Engineering IT, Villach, Austria
2 ZAMSTEC – Scientific Technology Engineering and Consulting, Riegersdorf, Austria

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Session 7 Thermal Modelling and Analysis 16:20 Monday April 20 2015
Chaired by Marta Rencz, Frank Krämer
16:20 30mn Keynote presentation – Analytical Experimental and Numerical Approach to Thermal Analysis and Design of a Travelling Wave Tube
Waldemar Wiejak, PIT-RADWAR S.A., Wroclaw, Poland
Artur Wymyslowski, Wroclaw University of Technology, Wroclaw, Poland

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16:50 20mn Measurement of Non-uniform Junction Temperature Distribution of Large Light-Emitting Diode by Using a Modified Forward Voltage Method
Mian TAO, Center for Advanced Microsystems Packaging, Hong Kong University of Science Technology, Hong Kong
S. W. Ricky LEE, Department of Mechanical and Aerospace Engineering, Center for Advanced Microsystems Packaging, HKUST LED-FPD Technology RD Center at Foshan, Hong Kong University of Science Technology, Hong Kong

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17:10 20mn Model Verification of Heat Exchangers in a Flow Test Rig
Klas Brinkfeldt 1, Thorbjörn Åklint 1, Klaus Neumaier 2, Olaf Zschieschang 2, Michael Edwards 3, Dag Andersson 1
1 Swerea IVF, Mölndal, Sweden
2 Fairchild Semiconductor GmbH, Aschheim, Germany
3 Chalmers University of Technology, Göteborg, Sweden

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17:30 20mn Temperature Profiles along Bonding Wires Revealed by the Bond Calculator, a New Thermo-Electrical Simulation Tool
Carl Christoph Jung 1, Christian Silber 2, Jürgen Scheible 1
1 Robert Bosch Center for Power Electronics, Reutlingen University, Germany
2 Robert Bosch GmbH, Reutlingen, Germany

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17:50 End of 1st day technical sessions

19:00 Dinner downtown

Session 8 Modeling for Advanced Package Development 09:00 Tuesday April 21 2015
Chaired by Dag Andersson, Wenbo Yuan
09:00 30mn Keynote presentation – Thermo-Mechanical Simulations of SiC Power Modules with Single and Double Sided Cooling
Klas Brinkfeldt 1, Michael Edwards 2, Jonas Ottosson 3, Klaus Neumaier 4, Olaf Zschieschang 4, Alexander Otto 5, Eberhard Kaulfersch 6, Dag Andersson 1
1 Swerea IVF, Mölndal, Sweden
2 Chalmers University of Technology, Göteborg, Sweden
3 Volvo Group Truck Technology, Göteborg, Sweden
4 Fairchild Semiconductor GmbH, Aschheim, Germany
5 Fraunhofer ENAS, Chemnitz, Germany
6 Berliner Nanotest und Design GmbH, Berlin, Germany

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09:30 20mn Reliability Analysis of Copper Bump Interconnection in Double-sided Power Module
Chia-Chi Tsai, Li-Ling Liao, Yen-Fu Su, Tuan-Yu Hung, Kuo-Ning Chiang, Dept. of Power Mechanical Engineering National Tsing Hua University, HsinChu, Taiwan, R.O.C.
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09:50 20mn Chip Package Interaction: A Stress analysis on 3D IC’s packages
Melina Lofrano, Mario Gonzalez, Wei Guo, Geert Van der Plas, imec, Leuven, Belgium
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Session 9 Multi-Physics Modelling of Interconnects 09:00 Tuesday April 21 2015
Chaired by Véronique Rochus, Pradeep Lall
09:00 30mn Keynote presentation – Life Time Characterization for a Highly Robust Metallization
Kirsten Weide-Zaage 1, Jörg Kludt 1, Markus Ackermann 2, Verena Hein 2, Marco Ernstling 2
1 Reliability: Simulation and Risk Analysis Group, Institute of Microelectronic Systems – AS, Leibniz Universität Hannover, Germany
2 X-FAB Semiconductor Foundries AG, Germany

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09:30 20mn Electro-Thermo-Mechanical Analyses on Silver Sintered IGBT-Module Reliability in Power Cycling
R. Dudek 1, R. Döring 1, S. Rzepka 1, C. Ehrhardt 2, M. Günther 3, M. Haag 4
1 Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany
2 Fraunhofer IZM, Berlin, Germany
3 Robert Bosch GmbH, CRAPJ3, Stuttgart, Germany
4 Bertrandt Ingenieurbuero GmbH, Ingolstadt, Germany

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09:50 20mn Reliability Assessment of Copper Ball Bonds by Combination of Simulation and Accelerated Mechanical Testing
Martin Lederer 1, Alice Lassnig 2, Golta Khatibi 1, Mitra Delshadmanesh 1
1 Vienna University of Technology, Austria
2 University of Vienna, Austria

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Session 10 Thermomechanical Behavior Modeling and Characterization 09:00 Tuesday April 21 2015
Chaired by Jeroen Zaal, Ilko Schmadlak
09:00 30mn Keynote presentation – Thermo-Mechanical Effects in Majorana Type Quantum Devices
A.W.J. Gielen, F.O. Valega Mackenzie, TNO Technical Sciences Materials Solutions, Eindhoven, the Netherlands
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09:30 20mn Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies: A Combined Experimental and FEM Analysis
Bart Vandevelde 1, Franco Zanon 2, Alessio Griffoni 2, Xiaolong Li 3, Geert Willems 1, Matteo Meneghini 4
1 imec, Leuven, Belgium
2 Osram, Treviso, Italy
3 Osram, Treviso; University of Padova, Italy
4 University of Padova, Italy

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09:50 20mn Vapor Pressure Prediction in Reflow for Stacked-Chip Packages by a Convection-Diffusion Model
Jeremy Adams, Liangbiao Chen, Xuejun Fan, Lamar University, USA
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10:10 Break

Session 11 Thermo-Mechanical Issues in Microelectronics 10:40 Tuesday April 21 2015
Chaired by Bernhard Wunderle, Kaspar Jansen
Multi-physics Modelling of Thin Films : Optimization for Finite Elements Simulations Tools
Toni Youssef 1, Eric Woirgard 2, Stephane Azzopardi 2, Donatien Martineau 1, Regis Meuret 1
1 Labinal Power Systems, Moissy-Cramayel, France
2 IMS Laboratory, Talence, France

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An Overview of Scanning Acoustic Microscope a Reliable Method for Non-destructive Failure Analysis of Microelectronic Components
M. Yazdan Mehr 1, A. Bahrami 2, H. Fischer 2, S. Gielen 2, R. Corbeij 2, W.D. van Driel 3, G.Q. Zhang 4
1 Material innovation institute M2i, Delft, The Netherlands; Delft University of Technology, EEMCS Faculty, Delft, The Netherlands
2 Netherlands Organization for Applied Scientific Research, TNO, The Netherlands
3 Delft University of Technology, EEMCS Faculty, Delft, The Netherlands; Philips Lighting, Eindhoven, The Netherland
4 Delft University of Technology, EEMCS Faculty, Delft, The Netherlands

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Application of Design of Computer Experiments DoCE method for the extraction of the elasto-plastic behavior law of ECD copper through nano-indentation tests
Stéphane Moreau, François de Crécy, Vincent Mandrillon, Univ. Grenoble Alpes, Grenoble, France. CEA, LETI, MINATEC Campus, Grenoble, France
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Designing Efficient Computer Experiments – The Step Beyond Finite Element Modelling
Vollert, Natalie 1, Schicker, Johannes 1, Hirschl, Christina 1, Kraft, Marin 1, Pilz, Jürgen 2
1 CTR Carinthian Tech Research AG, Villach, Austria
2 Alpen-Adria University of Klagenfurt, Klagenfurt, Austria

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Die Thickness Impact on Thermo-mechanical Stress in 3D Packages
Abdellah Salahouelhadj, Mario Gonzalez, Herman Oprins, IMEC, Leuven, Belgium
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Efficient Modeling of Printed Circuit Boards Structures for Dynamic Simulations
Elena Zukowski 1, Thomas Kimpel 2, Daniel Kraetschmer 3, Andreas Roessle 1
1 AEEDT3, Robert Bosch GmbH, Germany
2 AEEDS1, Robert Bosch GmbH, Germany
3 AEPJ-SOP, Robert Bosch GmbH, Germany

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Advances in Percolated Thermal Underfill PTU Simulations for 3D- Integration
Sridhar Ganesh Kumar 1, Uwe Zschenderlein 1, Remi Pantou 2, Thomas Brunschwiler 3, Gerd Schlottig 3, Florian Schindler-Saefkow 4, Bernhard Wunderle 1
1 Technische Universität Chemnitz, Chair Materials and Reliability of Microsystems, Chemnitz, Germany
2 Fraunhofer Institute for Electronic Nanosystems ENAS, Chemnitz, Germany
3 IBM Research, Zurich, Switzerland
4 AMIC Angewandte Micro-Messtechnik GmbH, Berlin, Germany

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Fracture Mechanical Modeling for the Stress Analysis of DBC Ceramics
Patrick Gaiser 1, Markus Klingler 1, Juergen Wilde 2
1 Robert Bosch GmbH, Automotive Electronics, Kusterdingen, Germany
2 Department of Microsystem Engineering IMTEK, University of Freiburg, Freiburg, Germany

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Material Characterization and Process Optimization of Dye-sensitized Solar Cell Sealant
Changwoon Han, Seungil Park, Korea Electronics Technology Institute
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Constitutive Modelling of Copper Films on Silicon Substrate
Dr. Martin Lederer, Vienna University of Technology, Vienna, Austria
Dr. Javad Zarbakhsh, KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH and Carinthia University of Applied Science, Department of Engineering and IT, Villach, Austria

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Thermo-mechanical Analysis of GaAs Devices under Temperature-Humidity-Bias testing
Kokou Adokanou 1, Karim Inal 1, Pierre Montmitonnet 1, Frédéric Courtade 2, Barbara Bonnet 3
1 CEMEF MINES Paristech, Sophia Antipolis, France
2 Centre National d’Etudes Spatiales, Toulouse, France
3 Thales Alenia Space, Toulouse, France

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Numerical Investigation of Ceramic Package Interposer Interconnects using Isotropic Conductive Adhesive
R. Fayҫal Hamou 1, Per Dalsjø 2, Cato Dorum 2, Susanne Helland 3, Helge Kristiansen 3, Maaike M.Visser Taklo 4, Jakob Gakkestad 2
1 SINTEF ICT, Microsystems and Nanotechnology MiNaLab, Oslo, Norway
2 Norwegian Defence Research Establishment FFI, Kjeller, Norway
3 Conpart AS, Skjetten, Norway
4 SINTEF ICT, Instrumentation Dept., Oslo, Norway

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A Finite Element Modelling and Fracture Mechanical Approach of Multilayer Ceramic Capacitors
Joseph Al Ahmar, Steffen Wiese, Saarland University, Germany
Acceleration of Lifetime Modeling by Isothermal Bending Fatigue Tests
Jens Heilmann, Joerg Arnold, Bernhard Wunderle, Technische Universität Chemnitz, Chemnitz, Germany
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Analyses on a Directly Attached Airbag Sensor Packaging System
Hyun Jin Kang 1, Jong Dae Lee 2, Joon Ki Kim 2, Yeong K. Kim 3
1 Inha University, Incheon South Korea
2 Korea Institute of Industrial Technology,Incheon South Korea
3 Inha University,Incheon South Korea

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Session 12 Thermal and Multi-Physics Issues in Microelectronics 10:40 Tuesday April 21 2015
Chaired by Bernhard Wunderle, Kaspar Jansen
GEANT4 Simulations in Terms of Radiation Hardness of Commercially Available SRAM
Aymen Moujbani 1, Kirsten Weide-Zaage 1, Berthold Römer 2, Frank Sabath 2
1 RESRI Group, Institute of Microelectronic Systems IMS, Leibniz Universität Hannover, Germany
2 Bundeswehr Research Institute for Protective Technologies and NBC Protection WIS,Germany

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Electromigration Modelling of Void Nucleation in Open Cu-TSVs
Marco Rovitto, Wolfhard H. Zisser, Hajdin Ceric, Tibor Grasser, Vienna University of Technology TU Wien, Vienna, Austria
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Comparison of Electrical, Thermal, and Optical characteristics of High-Power LEDs operating in various spectral ranges: from UV to green
A.E. Chernyakov 1, A.L. Zakgeim 1, K.A. Bulashevich 2, S.Yu. Karpov 2
1 Submicron Heterostructures for Microelectronics Research Engineering Center, RAS, St. Petersburg, Russia
2 STR Group – Soft-Impact, Ltd., St.Petersburg, Russia

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LED’s Luminous Flux Lifetime Prediction Using a Hybrid Numerical Approach
Kasemsak Kijkanjanapaiboon, Theodore Wagner Kretschmer, Liangbiao Chen, Xuejun Fan, Jiang Zhou, Lamar University, USA
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Statistical Energy Study for 28nm FDSOI Devices
Rida Kheirallah 1, Jean-Marc Galliere 1, Aida Todri-Sanial 1, Gilles Ducharme 2, Nadine Azemard 1
1 LIRMM, UMR CNRS-University of Montpellier, France
2 Dept. of Mathematics, University of Montpellier, France

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Special session Mentor Graphics Software Demo Training 10:41 Tuesday April 21 2015
Chaired by Robin Bornoff and András Poppe, Mentor Graphics
10:40 Combined use of software and hardware tools to design more reliable electronics
12:10 Lunch

Session 13 Materials Modeling 13:30 Tuesday April 21 2015
Chaired by Steffen Wiese, Kirsten Weide-Zaage
13:30 30mn Keynote presentation – Multiscale modeling of the Anisotropic Transient Creep Response of Heterogeneous SAC Single Crystals
Subhasis Mukherjee 1, Bite Zhou 2, Abhijit Dasgupta 1, Thomas Bieler 2
1 University of Maryland, USA
2 Michigan State University, USA

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14:00 20mn Simulation of the Deformation Behaviour of Large Thin Silicon Wafers and Comparison with Experimental Findings
Schicker Johannes, Arnold Thomas, Hirschl Christina, Iravani Armin, Kraft Martin, CTR Carinthian Tech Research AG, Villach, Austria
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14:20 20mn Numerical Analysis of Cure Induced Residual Stress in Die Packaging
A.R. Rezaie Adli, K.M.B. Jansen, L.J. Ernst, TU Delft, the Netherlands
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14:40 20mn Material Characterization and Nonlinear Viscoelastic Modelling of Epoxy Based Thermosets for Automotive Application
Gromala Przemyslaw 1, Muthuraman Balaji 1, Oeztuerk Berkan 1, Jansen Kaspar 2, Ernst Leo 3
1 Robert Bosch GmbH, Automotive Electronics, Tuebingerstr. 123, 72762, Reutlingen, Germany
2 Delft University of Technology, IO, Landbergstraat15, 2628 CE Delft, The Netherlands
3 Emeritus Professor of Delft University of Technology

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15:00 20mn Experimental Thermal and Mechanical Characterisation of Percolating Thermal Underfills PTU for Thermally Enhanced Flip-Chip Packages
Uwe Zschenderlein 1, Karthik Suresh 1, Mario Baum 2, Bernhard Wunderle 1
1 Technische Universität Chemnitz, Germany
2 Fraunhofer Institut ENAS, Chemnitz, Germany

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Session 14 MEMS – Switches, Accelerometers, Sensors 13:30 Tuesday April 21 2015
Chaired by Rainer Dudek, Nancy Iwamoto
13:30 30mn Keynote presentation – Latching MEMS Switch Matrices for Telecommunication Applications
Dries Dellaert, Jan Doutreloigne, CMST, Ghent University – IMEC, Ghent, Belgium
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14:00 20mn Optimal Design and Nonlinearities in a Z-axis Resonant Micro-Accelerometer
Claudia Comi 1, Alberto Corigliano 1, Valentina Zega 1, Sarah Zerbini 2
1 Politecnico di Milano, Milano, Italy
2 ST-Microelectronics, Cornaredo Milano, Italy

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14:20 20mn Modelling and Characterization of Circular Electrostatic Actuators
Raffaele Ardito, Emanuele Bertarelli, Alice Colnago, Alberto Corigliano, Gabriele Dubini, Politecnico di Milano, Milan, Italy
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14:40 20mn Fast Analytical Design of Poly-SiGe MEMS Pressure Sensors
Veronique Rochus, Bo Wang, Ashesh Ray Chaudhuri, Philippe Helin, Simone Severi, Xavier Rottenberg, imec, Leuven, Belgium
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15:00 20mn Packaging Effects of Three-axis SOI MEMS Accelerometer
Hung-Te Yang, Yen-Fu Su, Kuo-Ning Chiang, Advanced Microsystem Packaging and Nano-Mechanics Research Lab Dept. of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, R.O.C
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Session 15 Thermo-Mechanical Simulations 13:30 Tuesday April 21 2015
Chaired by René Metasch, Jan Albrecht
13:30 30mn Keynote presentation – FEA Study of Damage and Cracking Risks in BEoL Structures under Copper Wirebonding Impact
J. Auersperg 1, D. Breuer 2, K.V. Machani 2, S. Rzepka 1, B. Michel 1
1 Micro Materials Center at Fraunhofer ENAS, Chemnitz, Germany
2 GLOBALFOUNDRIES Dresden Module One LLC Co. KG, Dresden, Germany

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14:00 20mn Laser Cutting of Semiconductor Wafers: comparing a Simplified Numerical Approach with Experiments
M. van Soestbergen, J.J.M. Zaal, F.H.M. Swartjes, J.H.J. Janssen, NXP Semiconductors, Nijmegen, the Netherlands
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14:20 20mn Efficient Simulation of Thermo-Mechanical Stress in the On-Chip Metallization of Power Semiconductors
Gimi Pham, Martin Pfost, Robert Bosch Center for Power Electronics, Reutlingen University, Reutlingen, Germany
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14:40 20mn Prediction of Package Delamination Based on µMMT and BST Experiments
Hasan Sadat Nabi 1, Dirk Schweitzer 2, Duc-Khoi Vu 2, Ingrid Maus 1, Laurens Weiss 2
1 Infineon Technologies AG, Regensburg, Germany
2 Infineon Technologies AG, Neubiberg, Germany

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15:00 20mn The Influence of PBGAs Post-Cure Warpage Simulation Viscoelastic Material Properties and Evaluation Methodology on Accuracy of Solder Joints Damage Prediction
Marta Kuczynska, Natalja Schafet, Manfred Spraul, Ulrich Becker, Robert Bosch GmbH AEEDE3, Schwieberdingen, Germany
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15:20 Break

Session 16 Failure Mode Extraction 15:40 Tuesday April 21 2015
Chaired by Marco Barink, Michel Lenczner
15:40 30mn Keynote presentation – Thermal Deformation Analysis of Automotive Electronic Control Units Subjected to Passive and Active Thermal Cycles
Bulong Wu 1, Dae-Suk Kim 1, Bongtae Han 1, Alicja Palczynska 2, Przemyslaw Gromala 2
1 Mechanical Engineering Department, University of Maryland College Park, USA
2 Robert Bosch GmbH, AEEDT3, Reutlingen, Germany

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16:10 20mn Fracture Risk Assessment of Laser Marked Die by Means of Simulation and Test
Ilko Schmadlak 1, Betty Yeung 2, Derek Morgan 2, Paul Galles 3
1 Freescale Halbleiter Deutschland GmbH, Munich, Germany
2 Freescale Semiconductor Inc., Phoenix, Arizona, USA
3 Freescale Semiconductor Inc., Austin, Texas, USA

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16:30 20mn An In-situ Numerical-experimental Approach for Fatigue Delamination Characterization in Microelectronic Packages
Emad A. Poshtan 1, Sven Rzepka 2, Christian Silber 1, Bernhard Wunderle 3
1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
2 Fraunhofer Institute ENAS, Dept. Micro Material Center, Chemnitz, Germany
3 Chemnitz University of Technology, Chemnitz, Germany

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16:50 20mn Simulation Driven Design of Novel Integrated Circuits -Part 1: Selection of the materials based on the Virtual DoE
Arun Sasi 1, Arjun Yadur 1, Gromala Przemyslaw Jakub 2
1 Robert Bosch Engineering and Business Solutions Private Limited RBEI, Bangalore, India
2 Robert Bosch GmbH, Automotive Electronics, Tuebingerstr. 123, Reutlingen, Germany

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Session 17 Solid State Lighting 15:40 Tuesday April 21 2015
Chaired by Xuejun Fan, Zhuangjian Liu
15:40 30mn Keynote presentation – Modeling of LED Solder Joint Cracking during Temperature Cycling with Finite Element FE
Wenbo Yuan, Paola Altieri-Weimar, Osram Opto Semiconductors GmbH Regensburg, Germany
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16:10 20mn Accelerated Reliability Test method for Optics in LED Luminaire Applications
M. Yazdan Mehr, Materials innovation institute M2i, Delft, The Netherlands and Delft University of Technology, EEMCS Faculty, Delft, The Netherlands
W.D. van Driel, Delft University of Technology, EEMCS Faculty, Delft, The Netherlands 3 Philips Lighting, Eindhoven, The Netherlands
G.Q. Zhang, Delft University of Technology, EEMCS Faculty, Delft, The Netherlands

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16:30 20mn Lumen Maintenance Predictions for LED Packages using LM80 Data
W.D. van Driel 1, M. Schuld 2, B. Jacobs 1, F. commissaris 1, J. van der Eyden 1, B. Hamon 1
1 Philips Lighting, The Netherlands
2 CQM, The Netherlands

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16:50 20mn A Degradation Model of Aluminum Electrolytic Capacitors for LED Power Supplies
Bo Sun 1, Xuejun Fan 2, C.A. Yuan 3, Cheng Qian 3, Guoqi Zhang 3
1 Beijing Research Center, Delft University of Technology, The Netherlands
2 Lamar University, USA
3 Institute of Semiconductors, Chinese Academy of Sciences, China

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Session 18 Experimental Investigations 15:40 Tuesday April 21 2015
Chaired by Jürgen Auersperg, Michiel van Soestbergen
15:40 30mn Keynote presentation – High Strain-Rate Constitutive Behavior of SAC105 and SAC305 Leadfree Solder During Operation at High Temperature
Pradeep Lall 1, Di Zhang 1, Vikas Yadav 1, David Locker 2
1 Auburn University, NSF CAVE3 Electronics Research Center, USA
2 US Army AMRDEC, Hunstville, USA

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16:10 20mn Fracture Mechanics of Thin Film Systems on the Sub-Micron Scale
Darjan Kozic 1, Ruth Treml 2, Ronald Schöngrundner 1, Roland Brunner 1, Daniel Kiener 2, Johannes Zechner 3, Thomas Antretter 4, Hans-Peter Gänser 1
1 Materials Center Leoben, Leoben Austria
2 Department Materials Physics, Montanuniversität Leoben, Leoben Austria
3 EMPA, Swiss Federal Laboratories of Materials Science and Technologz, Thun, Switzerland
4 Institute of Mechanics, Montanuniversität Leoben, Leoben, Austria

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16:30 20mn Thermal and Mechanical Behavior of an RFID Based Smart System Embedded in a Transmission Belt Determined by FEM Simulations for Industry 4.0 Applications
Jan Albrecht, Rainer Dudek, Jürgen Auersperg, Remi Pantou, Sven Rzepka, Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany
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16:50 20mn Investigation of Sensitive Parameters in the Structural Simulation Tool Chain for Fiber Reinforced Plastics in Automotive Electronic Control Units
Rongsi Wang 1, Dorothea Papathanassiou 1, Matthias Werner 2, Jing Jin 3
1 Bosch Automotive Products Suzhou Co., Ltd, Suzhou, China
2 Robert Bosch GmbH, Reutlingen, Germany
3 BASF China Co., Ltd., Shanghai, China

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Special session Exhibitor and Sponsor special session 17:10 Tuesday April 21 2015
Chaired by Artur Wymyslowski, Willem van Driel
17:10 Bosch – Mentor Graphics – NXP – Philips Lighting – Siemens
18:15 Cocktail party at venue

20:00 EuroSimE Organisers and Technical Committees meeting

Session 19 New Developments in Thermal Management, Failure and Reliability Modelling 08:30 Wednesday April 22 2015
Chaired by Bernd Schwarz, Michael Guyenot
08:30 30mn Keynote presentation – Applications of Computational Mechanics in Stretchable Electronics
Zhuangjian LIU, Institute of High Performance Computing, Singapore
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09:00 30mn Keynote presentation – Design and Implementation of Spectral Power Distribution for White Light LED Packaging
Ricky Lee, Hong Kong University of Science and Technology
09:30 30mn Keynote presentation – Bayesian Models for Life Prediction and Fault-Mode Classification in Solid State Lamps
Pradeep Lall, Junchao Wei, Peter Sakalaukus, Auburn University, NSF CAVE3 Electronics Research Center, USA
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10:00 30mn Keynote presentation – Mission profile driven lifetime estimation of power modules
Prof Marta Rencz, Department of Electron Devices, Budapest University of Technology and Economics, Hungary

10:30 Break

Session 20 Solders 11:00 Wednesday April 22 2015
Chaired by Alberto Corigliano, Nadine Azemard
11:00 30mn Keynote presentation – Characterization and Simulation of LTCC Adhesive and Alloy42 Adhesive Interface Strength for Automotive Applications
Oeztuerk Berkan 1, Lou Panpan 1, Gromala Przemyslaw 1, Silber Christian 1, Jansen Kaspar 2, Ernst Leo 3
1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
2 Delft University of Technology, IO, CE Delft, The Netherlands
3 Emeritus Professor of Delft University of Technology, The Netherlands

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11:30 20mn Surrogate Model Based Mechanical Characterization of Lead-free Soldered Joint Material Exhibiting Ratcheting Behavior: an Advanced Methodology
Benoît Dompierre, Ludovic Barrière, Arnaud François, Eric Wyart, Cenaero ASBL, Gosselies, Belgium
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11:50 20mn A Viscoplastic-Fatigue-Creep-Damage Model for Tin-based Solder Alloy
Benjamin Métais 1, Alexander Kabakchiev 2, Youssef Maniar 3, Michael Guyenot 1, René Metasch 4, Mike Roellig 4, Philipp Rettenmeier 5, Patrick Buhl 5, Weihe Stefan 5
1 Robert Bosch GmbH, Stuttgart, MPA Stuttgart University, Germany
2 Robert Bosch GmbH, Stuttgart, Germany
3 Robert Bosch GmbH, Stuttgart, IMWF Stuttgart University, Germany
4 Fraunhofer IKTS, Dresden, Germany
5 MPA Stuttgart University, Germany

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12:10 20mn Experimental Investigation on the Influence of Microstructure on Visco-Plastic Mechanical Properties of a Sn-based Solder Alloy for Material Modelling in Finite Element Calculations
R. Metasch 1, R. Schwert 1, M. Röllig 1, A. Kabakchiev 2, B. Metais 2, K.-J. Wolter 3
1 Fraunhofer Institute for Ceramic Technology and Systems, Branch Material Diagnostics, Germany
2 Robert Bosch GmbH, Germany
3 Technische Universität Dresden, Electronics Packaging Laboratory, Germany

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12:30 20mn Investigation of Relaxation Behavior by Piezoresistive Stress Sensor
Alicja Palczynska 1, Przemyslaw Jakub Gromala 1, Dirk Mayer 2, Bongtae Han 3, Tobias Melz 2
1 Robert Bosch GmbH, Reliability Modeling and System Optimization AEEDT3 Reutlingen, Germany
2 Fraunhofer-Institut für Betriebsfestigkeit und Systemzuverlässigkeit LBF, Darmstadt, Germany
3 Mechanical Engineering Department, University of Maryland College Park, USA

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Session 21 Multi-Scale/Physics Modelling of MEMS Devices 11:00 Wednesday April 22 2015
Chaired by Abhijit Dasgupta, Karsten Meier
11:00 30mn Keynote presentation – A Multi-scale Model of Micro-Mirror Array
Duy Duc Nguyen 1, Walid Belkhir 1, Nicolas Ratier 2, Bin Yang 1, Michel Lenczner 3, Frédéric Zamkotsian 4, Horatiu Cirstea 5
1 FEMTO-ST, Time and Frequency Department, University of Franche-Comté, France
2 FEMTO-ST, Time and Frequency Department, Ecole Nationale Supérieure de Mécanique et de Microtechniques, France
3 FEMTO-ST, Time and Frequency Department, Technical University of Belfort-Monbéliard, France
4 LAM-CNRS, France
5 University of Lorraine – LORIA, France

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11:30 20mn Design of thin-film AlN actuators for 4 inches transparent plates for haptic applications
F. Casset 1, JS. Danel 1, C. Chappaz 2, F. Bernard 3, S. Basrour 3, B. Desloges 1, S. Fanget 1
1 CEA-LETI, MINATEC Campus, France
2 STMicroelectronics, France
3 TIMA, France

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11:50 20mn Predicting Non-Fickian Moisture Diffusion in EMCs for Application in Micro-electronic Devices
M. Barink 1, A. Mavinkurve 1, J. Janssen 2
1 TNO, Materials Solutions, Eindhoven, The Netherlands
2 NXP, Package Innovation, Nijmegen, The Netherlands

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12:10 20mn A Simple Constitutive Model for Dielectric Charging Based on Frenkel-Poole Mechanism
Tal Rubin 1, George Papaioannou 2, David Elata 1
1 Technion – Israel Institute of Technology, Haifa, Israel
2 University of Athens, Athens, Greece

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12:30 20mn Finite Element Modeling of ZnO Nanowire with Different Configurations of Electrodes Connected to External Capacitive Circuit for Pressure Sensing Applications
Rolanas Dauksevicius 1, Rimvydas Gaidys 1, Eoin O’Reilly 2, Masoud Seifikar 2
1 Kaunas University of Technology, Kaunas, Lithuania
2 Tyndall National Institute. Department of Physics, University College Cork, Ireland

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12:50 Lunch

Special session Electronics reliability challenges for Automated Driving 13:30 Wednesday April 22 2015
Chaired by Sven Rzepka, Dag Andersson, Bart Vandevelde
13:30 European Roadmap 2015 ‘Smart Systems for Automated Driving’,

Gereon Meyer, VDI/VDE-IT, EPoSS office

14:00 Horizon 2020 – European Work Programs 2015 & 2016/17:

  • Opportunities for New Exciting Research Work
  • Expectation concerning the Impact on Industrial Economy and Leadership.

Eric Fribourg-Blanc, Unit A4 ‘Components’ of DG ConNECT, European Commission

14:30 Panel statements and discussion

Expert engineers will outline and illustrate their priorities in coming research activities.
Highlight results from current projects will help explaining the next challenges that need to be tackled when developing the electronics and smart systems that will eventually bring visions like automated driving to life. When creating all the nifty new functional features, these systems must also meet strict requirements with respect to safety, robustness, and reliability as well as those on yield, affordability, and fast industrial product development with immediate market entrance. Otherwise, the intended economic and technological effects for strengthening the European leadership and wealth will not be achieved.

In particular, three fields of application oriented methodology research will be addressed:

  • New test strategies and methods for module level reliability and safety assessments
  • New strategies and approaches to the implementation of virtual techniques in the industrial design process
  • New measures and policies for self-diagnosis and predictive maintenance of electronics and smart systems

15:30 End

15:30 End of conference

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