EuroSimE 2012 was locally organised by ISQ (Pr Eduardo Dias Lopes) in Hotel
Cascais Miragem, on April 16-17-18th 2012

This 13th EuroSimE was attended by 155 individuals.

5 training courses were offered on Sunday. The software exhibition
brought together 2 exhibitors (ISQ and Insidix).

Proceedings of EuroSimE 2012 : CD-ROM full version: IEEE Catalog
number CFP12566-CDR, ISBN 978-1-4673-1511-1

This was the technical programme of EuroSimE 2012:

Go to   List of Technical Sessions  Technical program

List of Technical Sessions
S-1 New Developments in Modeling
S-2 Adhesion Experiments
S-3 Molecular Dynamics
S-4 Thermal Behavior Modeling and Characterization
S-5 Reliability Modeling
S-6 Process Modelling
S-7 Electrothermal Modeling and Characterization
S-8 Health Monitoring
S-9 Process Modelling and MEMS Structures
S-10 Solid State Lighting Thermal Analysis
S-11 Thermo-Mechanical Issues in Microelectronics
S-12 Multi-Physics and Thermal Issues in Microelectronics
S-13 Experimental Investigations
S-14 MEMS Applications
S-15 Interface Simulations
S-16 Thermo-Mechanical Modeling
S-17 Fracture Modelling and MEMS Analysis
S-18 Solder Measurements and Modeling
S-19 Advances in Modeling and Testing
S-20 Thermo-Mechanics for New Applications
S-21 Solid State Lighting
S-22 Advances in Modeling

Go to   List of Technical Sessions  Technical program

Session 1 11:00 Monday Apr 16 2012
New Developments in Modeling
Chairman: Leo J. Ernst, Consultant and Emeritus Professor of Delft University of Technology
11:00 30mn Keynote presentation – Thermo-Mechanical Reliability of Advanced Low-k/Copper Interconnects: Chip Package Interaction
Corresponding Author: Xiao Hu Liu – IBM TJ Watson Research Center
Xiao Hu Liu, IMB Watson Research Center, USA
11:30 30mn Keynote presentation – Anisotropic Strain-Field-induced Change of the Electronic Conductivity of Graphene Sheets and Carbon Nanotubes
Corresponding Author: Hideo Miura – Tohoku University
Masato Ohnishi, Ken Suzuki, Hideo Miura, Tohoku University
12:00 30mn Keynote presentation – Thermal Challenges in Photonic Integrated Circuits
Corresponding Author: Jeff Punch – Stokes Institute, University of Limerick
Jeff Punch, Stokes Institute, University of Limerick, Limerick, Ireland


Session 2 14:00 Monday Apr 16 2012
Adhesion Experiments
Chairman: Abhijit Dasgupta, CALCE; Yong Liu, Fairchild Semiconductors
14:00 30mn Keynote presentation – Determination of Interface Fracture Parameters by Shear Testing Using Different Theoretical Approaches
Corresponding Author: Rainer Dudek – Fraunhofer ENAS
R. Dudek 1, B. Brämer 1, J. Auersperg 1, R. Pufall 2, H. Walter 3, B. Seiler 4, B. Wunderle 5
1 Fraunhofer ENAS, Micro Materials Center Chemnitz, Germany
2 Infineon Technologies, Munich, Germany
3 Fraunhofer IZM, Berlin, Germany
4 CWM GmbH, Chemnitz, Germany
5 TU Chemnitz, Germany
14:30 20mn Fracture Toughness Characterization and Modeling of Interfaces in Microelectronic Packages – A Status Review
Corresponding Author: Heinz Pape – Infineon Technologies AG
H. Pape 1, I. Maus 2, I. Paul 1, L. J. Ernst 3, B. Wunderle 4
1 Infineon Technologies AG, Munich, Germany
2 Infineon Technologies AG, Regensburg, Germany
3 Delft University of Technology, Delft, The Netherlands
4 Chemnitz University of Technology, Chemnitz, Germany
14:50 20mn Rapid Fracture-Mechanical Bi-Material Interface Characterisation by using the Advanced Mixed-Mode Bending Test
Corresponding Author: Bernhard Wunderle – Chemnitz University of Technology
Bernhard Wunderle 1, Marcus Schulz 1, Jürgen Keller 2, Daniel May 3, Ingrid Maus 4, Heinz Pape 4, Bernd Michel 5
1 Chemnitz University of Technology, Germany
2 AMIC, Germany
3 Chemitz University of Technology, Germnay
4 Infineon, Germany
5 Fraunhofer ENAS, Germany
15:10 20mn Interfacial Fracture Toughness Measurements in Microelectronic Packages with Different Test Setups on Samples from Production
Corresponding Author: Ingrid Maus – Infineon Technologies AG
I. Maus 1, H. Pape 2, H. S. Nabi 1, M. Goroll 2, H. Preu 1, J. Keller 3, L.J. Ernst 4, B. Michel 5, B. Wunderle 6
1 Infineon Technologies AG, Regensburg, Germany
2 Infineon Technologies AG, Neubiberg, Germany
3 Amic GmbH, Berlin, Germany
4 Delft University of Technology, Delft, Netherlands
5 MMCC, Fraunhofer Institut ENAS, Chemnitz, Germany
6 Chemnitz University of Technology, Chemnitz, Germany
15:30 20mn Establishing the Interfacial Fracture Properties of Cu-EMC Interfaces at Harsh Condition
Corresponding Author: Mahdi Sadeghinia – Delft University of Technology
Mahdi Sadeghinia 1, K.M.B. Jansen 1, L.J. Ernst 1, H. Pape 2
1 Delft University of Technology, Netherlands
2 Infineon Technologies AG, Munich, Germany


Session 3 14:00 Monday Apr 16 2012
Molecular Dynamics
Chairman: Nancy Iwamoto, Honeywell Specialty Materials; Hélène Frémont, IMS Bordeaux
14:00 30mn Keynote presentation – Transport of Moisture at Epoxy-SiO2 Interfaces Investigated by Molecular Modeling
Corresponding Author: Ole Hölck – Fraunhofer IZM
O. Hölck 1, J. Bauer 1, T. Braun 1, H. Walter 1, O. Wittler 1, B. Wunderle 2
1 Fraunhofer IZM, Berlin, Germany
2 Chemnitz University of Technology, Chemnitz, Germany
14:30 20mn Study of CNT Growth Termination Mechanism: Effect of Catalyst Diffusion
Corresponding Author: Zhaoli GAO – The Hong Kong University of Science and Technology
Zhaoli Gao, M. M. F. Yuen, Hong Kong University of Science and Technology
14:50 20mn Sintering Process of Silver Nanoparticles in Ink-Jet Printed Conductive Microstrucutres – Molecular Dynamics Approach
Corresponding Author: Tomasz Fałat – Wrocław University of Technology
Tomasz Falat, Bartosz Platek, Jan Felba, Wroclaw University of Technology, Poland
15:10 20mn Wettability of Organic Ferroelectric Material on Metal Substrate
Corresponding Author: William Hua – Hong Kong University of Science & Technology
William HAU 1, Nancy IWAMOTO 2, Hai-bo FAN 3, Guo-dong ZHU 4, Jun WANG 4, Matthew M.F. YUEN 1
1 Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong
2 Honeywell Specialty Materials
3 Philips (China) Investment Co., Ltd.
4 Department of Materials Science, Fudan University
15:30 20mn Molecular Modeling of the Conductivity Changes of the Emeraldine Base Polyaniline due to Protonic Acid Doping
Corresponding Author: Xianping CHEN – Delft University of Technology
Xianping Chen 1, Cadmus A. Yuan 2, Cell K. Y. Wong 1, Guoqi Zhang 1
1 Delft University of Technology, the Netherlands
2 TNO IenT, Materials Technology, the Netherlands


Session 4 14:00 Monday Apr 16 2012
Thermal Behavior Modeling and Characterization
Chairman: Jeff Punch, University of Limerick; Miquel Vellvehi, IMB-CNM (CSIC)
14:00 30mn Keynote presentation – Thermal Modelling and Optimisation of Hot Solder Dip Process
Corresponding Author: Stoyan Stoyanov – University of Greenwich
Stoyan Stoyanov 1, Chris Bailey 1, Peter Tollafield 2, Rob Crawford 2, Mike Parker 2, Jim Scott 3, John Roulston 4
1 University of Greenwich, London, UK
2 Micross Components Ltd, Crewe, UK
3 Selex Galileo, Edinburgh, UK
4 Scimus Solutions, Edinburgh, UK
14:30 20mn Thermal Performances Evaluation of New High Temperature Power Packages using SiC Devices
Corresponding Author: Alexandrine GUEDON-GRACIA – IMS Laboratory
Gracia Alexandrine, Azzopardi Stéphane, Woirgard Eric, IMS lab, University of Bordeaux, France
14:50 20mn Thermal Modeling of Active Embedded Chip into High Density Electronic Board
Corresponding Author: MONIER VINARD ERIC – Thales global services
Dia Tidiane Cheikh, Eric Monier-vinard, Valentin Bissuel, Olivier Daniel , Thales Global Services, France
15:10 20mn Simulation of the Frequency Response of a Thermal Flow Sensor in Gaseous Media
Corresponding Author: Diego Fernando Reyes Romero – Laboratory for Sensors, IMTEK, University of Freiburg
Diego Fernando Reyes-Romero, Gerald Anton Urban, Laboratory for Sensors, Department of Microsystems Engineering (IMTEK), University of Freiburg, Freiburg, Germany
15:30 20mn Thermal Management for Stackable Package with Stacked ICs
Corresponding Author: Lutz Meinshausen – Leibniz Universität Hannover, Information Technology Laboratory
Lutz Meinshausen 1, Kirsten Weide-Zaage 2, Hélène Frémont 1
1 IMS Université Bordeaux I, Talence, France
2 LFI Leibniz University Hannover, Hanover, Germany


Session 5 16:20 Monday Apr 16 2012
Reliability Modeling
Chairman: Rainer Dudek, Fraunhofer ENAS; Müge Erinc, TNO Science and Industry
16:20 30mn Keynote presentation – Thermal-Mechanical Responses of 3D IC Integration with a Passive TSV Interposer
Corresponding Author: John H Lau – ITRI
John H. Lau, Shang-Tsai Wu, Heng-Chieh Chien, Electronics & Optoelectronics Research Laboratory, ITRI, Taiwan
16:50 20mn Failure Modeling of BGA Package for Reliability Evaluation of Handheld Device
Corresponding Author: Soonwan Chung – Samsung Electronics Co., Ltd.
Soonwan Chung, Jae Kwak, Seunghee Oh, Changsun Kang, Samsung Electronics Co., Ltd.
17:10 20mn Increasing the Robustness for Reliable Packages by Prediction of Delamination by Cohesive Zone Element Simulation
Corresponding Author: Dr. Reinhard Pufall – Infineon Technologies AG
R. Pufall 1, M. Goroll 1, W. Kanert 1, R. Dudek 2
1 Infineon Technolgies AG, Neubiberg
2 Fraunhofer ENAS, Chemnitz
17:30 20mn Thermo-Mechanical Investigation of the Reliability of Embedded Components in PCBs during Processing and Under Bending Loading
Corresponding Author: Sander Noijen – Bilim Atli-Veltin – Philips Research
Bilim Atli-Veltin 1, Huang Ling 2, Susan Zhao 1, Sander Noijen 1, Jo Caers 1, Liu Weifeng 2, Gao Feng 2, Ye Yuming 2
1 Philips Research
2 Shenzhen Huawei Technologies Software CO., LTD.


Session 6 16:20 Monday Apr 16 2012
Process Modelling
Chairman: Bernd Schwarz, Siemens; Xuejun Fan, Lamar University
16:20 30mn Keynote presentation – Simulation of Diffusion Controlled Intermetallic formation of Au/Al Interface
Corresponding Author: Rui Huang – Infineon Technologies AG
Rui Huang 1, Yik Yee Tan 2, Juergen Walter 3, Heinz Pape 1, Xuejun Fan 4, Heinrich Koerner 1
1 Infineon Technologies AG, Neubiberg, Germany
2 Infineon Technologies (Malaysia) Sdn, Malacca, Malaysia
3 Infineon Technologies AG, Regensburg, Germany
4 Lamar University, Texas, USA
16:50 20mn Influence of the Barrier Properties on the Mechanical Stress and Migration Distribution in a Copper Metallization
Corresponding Author: Jörg Kludt – Leibniz Universität Hannover, Information Technology Laboratory
J. Kludt, J. Ciptokusumo, K. Weide-Zaage, Information Technology Laboratory, Leibniz Universität Hannover
17:10 20mn A Model of Electric Field Assisted Capillarity for the Fabrication of Hollow Polymer Microstructures
Corresponding Author: Catherine E. H. Tonry – School of Computing and Mathematical Sciences, University of Greenwich
C. Tonry 1, M. K. Patel 1, Chris Bailey 1, M. P. Y. Desmuliez 2, S. Cargill 2, W. Yu 3
1 Computational Mechanics and Reliability Group (CMRG), School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London SE10, 9LS, UK
2 Microsystems Engineering Centre (MISEC), School of Engineering & Physical Sciences, Heriot-Watt University, Earl Mountbatten Building, Edinburgh EH14 4AS, UK
3 State Key Laboratory of Applied Optics, Changchun Institute of Optics, Fine mechanics and Physics, Chinese Academy of Sciences, 3888 Dongnanhu Road, Changchun, Jilin, P. R. China
17:30 20mn Multi-physics Simulation and Reliability Analysis for LED Lamp Under Step Stress Accelerated Degradation Test
Corresponding Author: Hongyu Tang – Guilin University of Electronic Technology
Hongyu Tang 1, D.G. Yang 1, G.Q. Zhang 2, Fengze Hou 1, Miao Cai 1, Zaifu Cui 1
1 Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
2 Delft University of Technology, The Netherlands


Session 7 16:20 Monday Apr 16 2012
Electrothermal Modeling and Characterization
Chairman: Xavier Perpiñà, IMB-CNM (CSIC); Pradeep Lall, Auburn University
16:20 30mn Keynote presentation – Transient Electrothermal Simulation of Interconnected Systems
Corresponding Author: Torsten Hauck – Freescale Halbleiter GmbH
Torsten Hauck, Freescale Deutschland GmbH
Evgeny Rudnyi, CADFEM GmbH
16:50 20mn Effect of Source Metallization Ageing on Power MOSFET Behavior
Corresponding Author: Toufik AZOUI – LAAS-CNRS
Toufi Azoui 1, Patrick Tounsi 1, Philippe Dupuy 2, Jean-Marie Dorkel 1, Donatien Martineau 3
2 FreeScale semiconductors
17:10 20mn Electro-Thermal Simulation of a Semiconductor Power Switch Considering Damage Effects
Corresponding Author: Torsten Hauck – Freescale Halbleiter Deutschland GmbH
Ilko Schmadlak, Torsten Hauck, Freescale Halbleiter Deutschland GmbH
17:30 20mn 2D Finite Elements Electro-Thermal Modeling for IGBT: Uni and Multicellular Approch
Corresponding Author: EL BOUBKARI Kamal – Laboratoire IMS
K. El Boubkari, S. Azzopardi, L. Théolier, J.Y. Deletage, E. Woirgard, Université de Bordeaux, IMS, Talence, France


Session 8 09:00 Tuesday Apr 17 2012
Health Monitoring
Chairman: Alexander Gielen, TNO; Frank Krämer, Saarland University
09:00 30mn Keynote presentation – Interrogation of Thermo-Mechanical Damage in Field-Deployed Electronics
Corresponding Author: Pradeep Lall – Auburn University
Pradeep Lall 1, Mahendra Harsha 1, Kai Goebel 2, Jim Jones 3
1 Auburn University
2 NASA Ames Research Center
3 Oracle Corporation
09:30 20mn Stress Chip Measurements of Internal Package Stresses for Process Characterization and Health Monitoring
Corresponding Author: Sven Rzepka – Fraunhofer ENAS, Micro Materials Center
Florian Schindler-Saefkow 1, Florian Rost 2, Alexander Otto 3, Wolfgang Faust 2, Bernhard Wunderle 4, Bernd Michel 2, Sven Rzepka 2
1 Fraunhofer ENAS, Micro Materials Center, Chemnitz; Germany & AMIC Angewandte Micro-Messtechnik GmbH, Berlin
2 Fraunhofer ENAS, Micro Materials Center, Chemnitz; Germany
3 Fraunhofer ENAS, Micro Materials Center, Chemnitz; Germany & Berliner Nanotest and Design GmbH, Berlin
4 Fraunhofer ENAS, Micro Materials Center, Chemnitz; Germany & Technische Universität Chemnitz
09:50 20mn An Approach to Life Consumption Monitoring of Solder Joints in Operating Temperature Environment
Corresponding Author: ILJA BELOV – School of Engineering, Jönköping University
Jonas Johansson, Saab AB, Business Area Electronic Defence Systems, Jönköping, Sweden, and Dept. Mechanical Engineering, School of Engineering, Jönköping University, Jönköping, Sweden
Ilja Belov, Dept. Mechanical Engineering, School of Engineering, Jönköping University, Jönköping, Sweden
Erland Johnson, SP Technical Research Institute of Sweden, Borås, Sweden
Peter Leisner, SP Technical Research Institute of Sweden, Borås, Sweden, and Dept. Mechanical Engineering, School of Engineering, Jönköping University, Jönköping, Sweden


Session 9 09:00 Tuesday Apr 17 2012
Process Modelling and MEMS Structures
Chairman: Mike Röllig, Fraunhofer IZFP; Michael Guyenot, Robert Bosch GmbH
09:00 30mn Keynote presentation – Studies on the Transitional Behaviors of Au-to-Au Micro-Contact during the Initialization Stage of Contact Formation Under Low Contact Force
Corresponding Author: Qiu Haodong – Nanyang Technological University
Haodong Qiu 1, Hong Wang 1, Feixiang Ke 2
1 Microelectronics Centre, School of Electrical and Electronic Engineering, Nanyang Technological University, Republic of Singapore
2 Temasek Laboratories @ NTU, Republic of Singapore
09:30 20mn Reliability and Functionality Investigation of CFRP Embedded Ultrasonic Transducers Supported by FEM and EFIT Simulations
Corresponding Author: Mike Roellig – Fraunhofer Institute for Nondestructive Testing
Mike Roellig 1, Frank Schubert 1, Georg Lautenschlaeger 1, Bjoern Boehme 2, Michael Franke 3, Norbert Meyendorf 1
1 Fraunhofer Institut for Non-destructive Testing,IZFP-D, Dresden, Germany
2 Electronics Packaging Laboratory, TU Dresden, Germany
3 Cotesa GmbH, Mittweida, Germany
09:50 20mn Measurement and Simulation of Moisture effects on Electromagnetic Radiation of Printed Circuit Boards
Corresponding Author: Hassene Fridhi – IMS-Bordeaux
H.Fridhi, G.Duchamp, V. Vigneras, A. Guedon-Gracia, J.Y.Deletage, H.Frémont, T. Dubois, IMS-Bordeaux, Talence, France


Session 10 09:00 Tuesday Apr 17 2012
Solid State Lighting Thermal Analysis
Chairman: Peter Rodgers, Valerie Eveloy, The Petroleum Institute
09:00 30mn Keynote presentation – Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards
Corresponding Author: Fargeix Alain – CEA-LETI
B. Pardo 1, A. Gasse 1, A. Fargeix 1, J. Jakovenko 2, R.J. Werkhoven 3, X. Perpiñà 4, T. Van Weelden 5, P. Bancken 6
1 CEA-LETI, Grenoble, France
2 Czech Technical University, Prague, Czech Republic
3 TNO, Eindhoven, The Netherlands
4 IMB-CNM, Bellaterra, Spain
5 Boschman Technologies, Duiven, The Netherlands
6 Philips Lighting, Eindhoven, The Netherlands
09:30 20mn Dynamic Thermal Simulation of High Brightness LEDs with Unsteady Driver Power Output
Corresponding Author: Huaiyu Ye – TUDelft, Sau Koh, J.Wei, H.W.vanZeijl, G.Q.Zhang, Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Mekelweg 6, 2628CD, Delft, Netherlands
09:50 20mn Thermal Improvement of Die Attach with Iodine Treat-ment and Its Application in Solid State Lighting
Corresponding Author: Kai Zhang – The Hong Kong University of Science and Technology
Kai ZHANG 1, Xinfeng ZHANG 1, Min ZHANG 1, Chen YANG 1, Hongye SUN 1, Matthew YUEN 1, Barry ZHONG 2, Aernout Reints BOK 2, Lisa LIU 2, Cheuk Yan CHAN 2, Guoqi ZHANG 3
1 Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
2 Philips (China) Investment Co., Ltd, Philips Innovation Campus Shanghai No.2 Building, No.9, Lane 888, Tian Lin Road, Shanghai, 200233, China
3 Philips Lighting, Building EEA-208, Mathildelaan 1, 5611 BD Eindhoven, Netherlands


Session 11 11:00 Tuesday Apr 17 2012
Thermo-Mechanical Issues in Microelectronics
Chairman: Kaspar Jansen, TU Delft; Heinz Pape, Infineon Technologies
Evaluation of Quasi-Hermetic Packaging Solutions for Active Microwave Devices and Space Applications
Ben Naceur W. 1, Malbert N. 1, Labat N. 1, Fremont H. 1, Muraro J.L. 2, Monfraix P. 2
1 IMS Laboratory, Bordeaux, France
2 Thales Alenia Space, Toulouse, France
Effect of Isothermal Aging and Salt Spray Tests on Reliability and Mechanical Strength of Eutectic Sn-Bi Lead-Free Solder Joints
Corresponding Author: Milad Mostofizadeh – Tampere University of Technology
Milad Mostofizadeh, Juha Pippola, Tuomas Marttila, Laura Frisk, Tampere University of Technology, Tampere, Finland
An Extensive Investigation of the Four Point Bending Test for Interface Characterization
Corresponding Author: Sander Noijen – Philips Research
Sander Noijen, Olaf van der Sluis, Peter Timmermans, Philips Research
Shear Stress Modelling of ACA Joints in Thermal Tests
Corresponding Author: Kirsi Saarinen – Tampere University of Technology
Kirsi Saarinen, Laura Frisk, Tampere University of Technology, Tampere, Finland
Evaluation of Very Low Bending Radius of Flexible Circuits Beyond the Standard Rules
Corresponding Author: Wilson Maia – Thales Global Services
Wilson Carlos Maia Filho 1, Solenne Hameau 2, Michel Brizoux 1
1 Thales Global Services
2 Thales Communications & Security
3-D Finite Elements Simulation of Drop Test Reliability on a Chip Scale Package: Focus on the Component Architecture and Materials
Corresponding Author: BELHENINI Soufyane – Ecole Polytechnique de l\’Université de Tours
BELHENINI Soufyane 1, BOUCHOU Abdelhake 2, DOSSEUL Franck 3, TOUGUI Abdellah 1
1 LMR.EPU, Université de Tours, France
2 LMR.ENIVL, France
3 STMicroelectronics,Tours, France
In Situ Vibration Measurements on Power Modules Under Operating Conditions
Corresponding Author: Bernhard CZERNY – University of Vienna, Faculty of Physics
B. Czerny 1, B. Nagl 2, M. Lederer 1, A. Trnka 2, G. Khatibi 1, M. Thoben 3
1 University of Vienna Faculty of Physics, Vienna, Austria
2 Siemens AG, Vienna, Austria
3 Infineon Technologies, Warstein, Germany
A Novel Wafer-Level Test Method to Measure the Bond Strength in Microelectronic Materials
Corresponding Author: Sara Carniello – Austriamicrosystems AG
Sara Carniello, Jörg Siegert, Bernhard Löffler, Ewald Stückler, Austriamicrosystems AG, Unterpremstätten, Austria
Accelerated Lifetime Measurements of Cu-Al Ball Bonded Interconnects
Corresponding Author: Dr. Golta Khatibi – University of Vienna, Faculty of Physics
Alice Lassnig 1, Rainer Pelzer 2, Golta Khatibi 1, Brigitte Weiss 1, Michael Nelhiebel 2
1 University of Vienna, Austria
2 Infineon Technologies Austria AG
Cu/Epoxy Interface Enhancement and Characterization with Thiol Treatment
Corresponding Author: Peng He – The Hong Kong University of Science and Technology
Peng He, Matthew M. F. Yuen, Hong Kong University of Science and Technology
Parameter Optimization of Torque Wireless Sensors based on Surface Acoustic Waves (SAW)
Corresponding Author: Jürgen Wilde, Thomas Fellner, Elena Zukowski – University of Freiburg-IMTEK, Department of Microsystems Engineering, Laboratory for Assembly and Packaging
Elena Zukowski, Thomas Fellne, Jürgen Wilde, Michael Berndt, University of Freiburg-IMTEK, Germany
Lifetime Assessment of BGA Solder Joints with Voids Under Thermomechanical Load
Corresponding Author: Robert Schwerz – TU-Dresden
Robert Schwerz 1, Mike Roellig 2, Karsten Meier 1, Klaus-Juergen Wolter 1
1 Electronics Packaging Laboratory, Technische Universität Dresden
2 Fraunhofer Institute for Non-Destructive Testing, Dresden Branch, IZFP-D
FEM Stress Analysis in BGA Components Subjected to JEDEC Drop Test Applying High Strain Rate Lead-Free Solder Material Models
Corresponding Author: Frank Kraemer – University of Saarland
Frank Kraemer 1, Karsten Meier 2, Steffen Wiese 1, Sven Rzepka 3
1 Saarland University
2 Technische Universität Dresden
3 Fraunhofer ENAS Chemnitz
Simulation and Qualification of an System-in-Package (SiP) Based Solid State Lighting (SSL) Module
Corresponding Author: Dr. Daniel Farley – TU Delft
Daniel Farley 1, F. Boschman 2, J.E. Bullema 3, A.W.J. Gielen 3, P. Hesen 4, J.P.H.M. Krugers 3, F. Swartjes 5, H. van Zeijl 1, G.Q. Zhang 6
1 Delft University of Technology
2 Boschman Technologies
3 TNO: NL Organization for Applied Scientific Research
4 Philips Research
5 NXP Semiconductors
6 Delft University of Technology, Philips Research
3D Deformation FEM Simulations and Measurement during VDMOS Transistor Operation
Corresponding Author: MARCAULT Emmanuel – LAAS-CNRS
E. Marcault 1, D. Weidmann 2, A. Bourennane 1, M. Breil 1, L. Charpiot 2
1 CNRS, LAAS, Toulouse, France
2 INSIDIX, Seyssins, France
Investigation of Interface Delamination in a SO8 Package Under Reflow
Corresponding Author: Yong Liu – Fairchild Semiconductor Corp.
Yumin Liu, Fairchild Semiconductors, Suzhou, China
Yong Liu, Fairchild Semiconductors, South Portland, USA
Suresh Belani, Fairchild Semiconductors, San Jose, USA
Oseob Jeon, Fairchild Semiconductors, Bucheon, Korea
Finite Element Modeling of Solder Joint Fatigue Under Four-Point Bending Test at Elevated Temperature
Corresponding Author: Baris Sabuncuoglu – IMEC
Baris Sabuncuoglu 1, Filip Vanhee 2, Geert Willems 3, Bart Vandevelde 3, Dirk Vandepitte 4, Ingrid De Wolf 1
1 IMEC, Leuven, Belgium & KULeuven, Leuven, Belgium
2 KHBO, Oostende, Belgium
3 IMEC, Leuven, Belgium
4 KULeuven, Leuven, Belgium
Characterization of Adhesives and Interface Strength for Automotive Applications
Corresponding Author: Berkan Oeztuerk – Robert Bosch GmbH, Automotive Electronics
B. Öztürk 1, P. Gromala 2, C.Otto 2, A. Fischer 2, K.M.B. Jansen 3, L.J. Ernst 3
1 Robert Bosch GmbH, Reutlingen, Germany; Delft University of Technology, The Netherlands
2 Robert Bosch GmbH, Reutlingen, Germany
3 Delft University of Technology, The Netherlands
Experimental System for Analysing the Combined Loading and Failure Modes of Solder Joints in Electronic Packaging
Corresponding Author: Krystian Jankowski – Wroclaw University of Technology
Krystian Jankowski 1, Artur Wymysłowski 1, Didier Chicot 2
1 Wroclaw University of Technology, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Polnad
2 Universite Lille Nord de France, F-59659 Villeneuve d’Ascq, France
Trends and challenges in Lead Free Soldering
Corresponding Author: Eduardo Dias Lopes – ISQ
Dias Lopes, E. M., ISQ, Instituto de Soldadura e Qualidade, Oeiras, Portugal; ISEL, Departamento de Engenharia Mecânica, Lisboa, Portugal
Margarida Pinto, ISQ, Instituto de Soldadura e Qualidade, Oeiras, Portugal
Eurico Assunção, EWF, Oeiras, Portugal
Luisa Coutinho, TU-Lisbon, Instituto Superior Técnico, Lisboa, Portugal


Session 12 11:00 Tuesday Apr 17 2012
Multi-Physics and Thermal Issues in Microelectronics
Chairman: Kaspar Jansen, TU Delft; Heinz Pape, Infineon Technologies
3D Electrostatic Microgenerator
Corresponding Author: Janicek Vladimir – FEE CTU in Prague, Department of Microelectronics
Janicek Vladimir, Husak Miroslav, FEE CTU in Prague, Czech Republic
Thermosonic Flip-chip Assembly on Flex Substrates
Corresponding Author: Guangbin Dou – Imperial College London
Guangbin Dou, Andrew S. Holmes, Imperial College London, London, United Kingdom
Mechanical and Tribological Characterizations for Reliability Design of Micromembranes
Corresponding Author: Pustan Marius – Technical University of Cluj-Napoca
Pustan Marius, Birleanu Corina, Dudescu Cristian, Belcin Ovidiu, Technical University of Cluj-Napoca, Romania
MEMS Accelerometers and their Bio-Applications
Corresponding Author: Willem D. van Driel – Delft University of Technology
M. Trifunovic, A.M. Vadiraj, W.D. van Driel, TU Delft, The Netherlands
Establishment of the Mesoscale Parameters for Epoxy-Copper Interfacial Separation
Corresponding Author: Cell K Y Wong – Delft University of Technology
C. K. Y. Wong  1, S. Y. Y. Leung 1, R.H. Poelma 2, K.M.B. Jansen 1, C. C. A. Yuan 3, W. D. van Driel 4, G. Q. Zhang 4
1 Faculty 3mE, Department PME, Delft University of Technology
2 2Faculty EWI, Department of Microelectronics, Delft University of Technology
3 TNO, the Netherlands
4 Philips Lighting, The Netherlands
Influence of Conversion Level on Simulation Results of Crosslinked Polymers
Corresponding Author: Sebastian J. Tesarski – Wrocław University of Technology
Sebastian J. Tesarski 1, Artur Wymysłowski 1, Ole Hölck 2
1 Wroclaw University of Technology, Wrocław, Poland
2 Fraunhofer Institut Zuverlässigkeit und Mikrointegration, Berlin, Germany
The Method of Lines for the Analysis of Mechanical Structures
Corresponding Author: Larissa Vietzorreck – TU Munich
Amirali Taghavi, Larissa Vietzorreck, TU München, München, Germany
In-situ Moisture Desorption Characterization of Epoxy Mold Compound
Corresponding Author: Xuejun Fan – Lamar University
Xuejun Fan, Vishal Nagaraj, Lamar University, USA
Thermal and Moisture Degradation in SSL System
Corresponding Author: S. koh – Delft University of Technology
Sau Koh 1, Willem VD Driel 2, G.Q. Zhang 2
1 Delft Institute of Microsystems and Nanoelectronics (Dimes)
2 Philips Lighting
Investigation of Chip Temperature Related to Various Copper Thickness on Glass-Fabric-Based Substrate
Corresponding Author: Chen-Chia Chen – National Chip Implementation Center
Jin-Ju Chue, Chih-Chyau Yang, Chen-Chia Chen, Chun-Chieh Chiu, Chien-Ming Wu, Chun-Ming Huang, National Chip Implementation Center, Hsinchu, Taiwan
Viscoplastic Behavior of Diamond Die Attach Subjected to High Temperature Conditions
Corresponding Author: Ahlem BAAZAOUI – Laboratoire Génie de Production à l\’Ecole Nationale d\’Ingénieurs de Tarbes
S. MSOLLI, A. BAAZAOUI, O. DALVERNY, J. ALEXIS, M. KARAMA, Université de Toulouse ; INP/ENIT ; LGP ; Tarbes, France
Modelling of Temperature Distribution in Thermal Microsensors on Sandwich Thermally Isolated Structures
Corresponding Author: Alexander Kozlov – Omsk State University
Alexander Kozlov , Omsk State University, Omsk, Russia
Danijela Randjelovic, IHTM-Institute of Microelectronic Technologies and Single Crystals, Belgrade, Serbia
A Cost-effective Active Cooling Method: Thermal Performance and Cost Analysis
Corresponding Author: Sheng Liu – Huazhong University of Science and Technology
Sheng Liu, Ling Xu, Mingxiang Chen, Huazhong University of Sci & Tech, Wuhan, China
Experimental Assessment of Flat-type Photovoltaic Module Thermal Behavior
Corresponding Author: Peter Rodgers, Valerie Eveloy, Shrinivas Bojanampati – The Petroleum Institute
Shrinivas Bojanampati, Peter Rodgers, Valérie Eveloy, The Petroleum Institute, Abu Dhabi, United Arab Emirates


Session 13 13:30 Tuesday Apr 17 2012
Experimental Investigations
Chairman: E. Dias Lopes, ISQ; M. Gonzalez, IMEC
13:30 30mn Keynote presentation – Wafer Level System Packaging and Integration for Solid State Lighting (SSL)
Corresponding Author: Xuejun Fan – Lamar University
Xuejun Fan, Lamar University, USA
14:00 20mn Material Characterization to Model Linear Viscoelastic Behavior of Thin Organic Polymer Films in Microelectronics
Corresponding Author: Katrin Unterhofer – Infineon Technologies AG
Katrin Unterhofer 1, Halald Preu 1, Jürgen Walter  1, Georg Lorenz 2, Walter Mack 1, Matthias Petzold 2
1 Infineon Technologies AG, Regensburg, Germany
2 Fraunhofer Institute for Mechanics of Materials, Halle, Germany
14:20 20mn In-Situ Characterization of Moisture Induced Swelling Behaviour of Microelectronic Relevant Polymers
Corresponding Author: Dr. Hans Walter – Fraunhofer IZM
H. Walter 1, J. Bauer 1, T.Braun 1, O.Hölck 1, B.Wunderle 2, O.Wittler 1
1 Fraunhofer IZM, Berlin, Germany
2 Chemnitz University of Technology, Chemnitz, Germany
14:40 20mn Transient Thermal Analysis as Failure Analytical Tool in Electronic Packaging
Corresponding Author: Daniel May – Technical University Chemnitz
D. May 1, B. Wunderle 1, R. Schacht 2, B. Michel 3
1 Technical University Chemnitz
2 University of Applied Sciences Lausitz
3 Fraunhofer Institute ENAS
15:00 20mn Combined Creep and Fatigue Measurement Method for Lead-Free Solder Alloys
Corresponding Author: René Metasch – Fraunhofer Institute for Non-Destructive Testing
R. Metasch 1, M. Roellig 1, K.-J. Wolter 2
1 Fraunhofer Institute for non-destructive testing, Branch Dresden, Germany/Saxony
2 Technische Universität Dresden, Electronic Packaging Laboratory, Germany


Session 14 13:30 Tuesday Apr 17 2012
MEMS Applications
Chairman: A. Corigliano, A. Frangi, Politecnico di Milano
13:30 30mn Keynote presentation – Consistent Analytical Model for Single and Dual Thickness Capacitive Micromachined Ultrasound Transducers (cMUT)
Corresponding Author: Xavier Rottenberg – IMEC
X. Rottenberg, A. Erismis, P.Czarnecki, Ph. Helin, A. Verbist, H. A. C. Tilmans, IMEC v.z.w., Leuven, Belgium
14:00 20mn Optimized Design and Placement of Piezoelectric Transducers for Micromechanical Structures Subjected to Membrane Stresses
Corresponding Author: Guilherme Brondani Torri – IMEC
G. B. Torri 1, X. Rottenberg 1, D. M. Karabacak 2, M. Vandecasteele 2, C. Van Hoof 1, R. Puers 3, H. A. C. Tilmans 1
1 IMEC, Heverlee, Belgium
2 Holst Centre/IMEC, Eindhoven, The Netherlands
3 KU Leuven, Heverlee, Belgium
14:20 20mn Study of an Active Thermal Recovery Mechanism for an Electrostatically Actuated RF-MEMS Switch
Corresponding Author: Thomas Künzig – Munich University of Technology
Thomas Kuenzig 1, Jacopo Iannacci 2, Gabriele Schrag 1, Gerhard Wachutka 1
1 Munich University of Technology, Munich, Germany
2 Fondazione Bruno Kessler, Trento, Italy
14:40 20mn Experimental and Numerical Assessment of Adhesion in Real-Life Mems
Corresponding Author: Raffaele Ardito – Politecnico di Milano
Raffaele Ardito, Leonardo Baldasarre, Alberto Corigliano, Biagio De Masi, Attilio Frangi, Luca Magagnin, Politecnico di Milano
15:00 20mn A Parametric Multilevel MEMS Simulation Methodology using Finite Element Method and Mesh Morphing
Corresponding Author: Vladimir A. Kolchuzhin – Chemnitz University of Technology, Department of Microsystems and Precision Engineering
Vladimir A. Kolchuzhin, Jan E. Mehner, Chemnitz University of Technology, Department of Microsystems and Precision Engineering, Germany


Session 15 13:30 Tuesday Apr 17 2012
Interface Simulations
Chairman: B. Wunderle, Chemnitz University of Technology; M. Jungwirth, University of Applied Sciences Upper Austria
13:30 30mn Keynote presentation – Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface (Part III): Interface Roughness
Corresponding Author: Nancy Iwamoto – Honeywell Specialty Materials
Nancy Iwamoto, Honeywell Specialty Materials
14:00 20mn Nonlinear Copper Behavior of TSV and the Cracking Risks during BEoL-Built-up for 3D-IC-Integration
Corresponding Author: Juergen Auersperg – Fraunhofer ENAS
Juergen Auersperg, Dietmar Vogel, Ellen Auerswald, Sven Rzepka, Bernd Michel, Micro Materials Center, Fraunhofer ENAS, Chemnitz, Germany
14:20 20mn Cohesive Zone Model for Delamination Analysis of an Embedded Die System in Package
Corresponding Author: Yong Liu – Fairchild Semiconductor Corp.
Xiaopei Li 1, Jianghai Gu 1, Yangjian Xu 1, Yong Liu 2
1 Zhejiang University of Technology, China
2 Fairchild Semiconductors, USA
14:40 20mn Investigation on the Effect of Surface Roughness on the Fracture Strength of SCS
Corresponding Author: Kuo-Ning Chiang – Dept. of Power Mechanical Engineering National Tsing Hua University
C. T. Lai, T. Y. Hung, K. N. Chiang, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R. O. C.
15:00 20mn A Simplified and Meaningful Crack Propagation Model in Silicon for Microelectronic Power Devices
Corresponding Author: Calvez Damien – STMicroelectronics
Damien Calvez 1, Fabrice Roqueta 2, Sébastien Jacques 2, Samuel Ducret 2, Laurent Bechou 1, Yves Ousten 1
1 IMS Laboratory, France
2 STMicroelectronics Tours, France


Session 16 16:00 Tuesday Apr 17 2012
Thermo-Mechanical Modeling
Chairman: Jürgen Auersperg, Sven Rzepka, Fraunhofer ENAS
16:00 30mn Keynote presentation – Weibull Stress Analysis for Failure of Semiconductor Package
Corresponding Author: Hideo Aoki, Kanako Sawada – Toshiba
Eigo Matsuura 1, Kanako Sawada 1, Hideko Mukaida 1, Hideo Aoki 1, Fumiyoshi Minami 2
1 Toshiba Corporation, Yokohama, Japan
2 Osaka University, Japan
16:30 20mn Multiscale Modeling of Residual Stresses in Isotropic Conductive Adhesives with Nano Particles
Corresponding Author: Muge Erinc – TNO Science and Industry
Muge Erinc 1, Marius van Dijk 2, Varvara Kouznetsova 2
1 TNO Science and Industry, The Netherlands
2 Eindhoven University of Technology, The Netherlands
16:50 20mn Testing and Multiscale Modeling of Drop and Impact Loading of Complex MEMS Microphone Assemblies
Corresponding Author: Jingshi Meng – University of Maryland
J. Meng 1, T. Mattila 1, A. Dasgupta 1, M. Sillanpaa 2, R. Jaakkola 2, K. Andersson 2, E. Hussa 2
1 CALCE Electronic Products and System Center, University of Maryland, USA
2 Nokia Corporation, Salo, Finland
17:10 20mn Simulations of High Temperature Pressure Sensor Packaging and Interconnections
Corresponding Author: Klas Brinkfeldt – Swerea IVF
Klas Brinkfeldt 1, Jan Formánek 2, Alexander Laposa 2, Jíří Jakovenko 2, Erik Adolfsson 1, Per Johander 1
1 Swerea IVF, Argongatan 30, SE-431 53 Mölndal, Sweden
2 Czech Technical University, Faculty of El. Eng., Department of Microelectronics, Technicka 2, CZ 166 27 Prague, Czech Republic
17:30 20mn Assessment of Thermo-Mechanical Stresses in Low Temperature Joining Technology
Corresponding Author: Thomas Herboth – Robert Bosch GmbH
Thomas Herboth 1, Christiane Früh 1, Michael Günther 1, Jürgen Wilde 2
1 Robert Bosch GmbH, Schwieberdingen, Germany
2 Albert-Ludwigs-Universität, Freiburg, Germany


Session 17 16:00 Tuesday Apr 17 2012
Fracture Modelling and MEMS Analysis
Chairman: Dag Anderson, Swerea; Alberto Corigliano, Politecnico di Milano
16:00 30mn Keynote presentation – A Domain Decomposition Method for the Simulation of Fracture in Polysilicon MEMS
Corresponding Author: Alberto Corigliano – Politecnico di Milano
Federica Confalonieri, Giuseppe Cocchetti, Aldo Ghisi, Alberto Corigliano, Politecnico di Milano, Italy
16:30 20mn PZT Piezoelectric Coefficient extraction by PZT-Actuated Micro-Beam Characterization and Modeling
Corresponding Author: Fabrice Casset – CEA-LETI, MINATEC Campus
F. Casset 1, M. Cueff 1, A. Suhm 1, G. Le Rhun 1, J. Abergel 1, M. Allain, C. Dieppedale, T. Ricart 1, S. Fanget 1, P. Renaux 1, D. Faralli 2, P. Ancey 3, A. Devos 4, E. Defaÿ 1
1 CEA, LETI, MINATEC Campus, Grenoble, France
2 STMicroelectronics, Italy
3 STMicroelectronics, Crolles, France
4 IEMN/ISEN-CNRS, Lille, France
16:50 20mn Simulation of Thermo-Elastic losses in a Meta-Material Bulk Bar Resonator
Corresponding Author: Roelof Jansen – IMEC
R. Jansen, X. Rottenberg, V. Rochus, H.A.C. Tilmans, IMEC v.z.w., Leuven, Belgium
17:10 20mn Using an Electro-Thermo-Fluidic Model for the Design of a 3-Axis Thermal Accelerometer
Corresponding Author: Luis Alexandre Machado da Rocha – University of Minho
L.A. Rocha, C.S. Silva, A.J. Pontes , J.C. Viana, IPC\I3N – Institute for Polymers and Composites, University of Minho, Portugal


Session 18 16:00 Tuesday Apr 17 2012
Solder Measurements and Modeling
Chairman: Bong Tae. Han, CALCE; Michel Brizoux, Thales Global Services
16:00 30mn Keynote presentation – Characterisation of Lead-free Solders at High Strain Rates Considering Microstructural Conditions
Corresponding Author: Karsten Meier – TU Dresden, Electronics Packaging Laboratory
Meier, K. 1, Kraemer, F. 2, Roellig, M. 3, Wolter, K.-J. 1
1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany
2 Saarland University, Saarbruecken, Germany
3 Fraunhofer IZFP-D, Dresden, Germany
16:30 20mn A Comparison of the Creep Behaviour of Joint-Scale SAC105 and SAC305 Solder Samples Under Shear Conditions.
Corresponding Author: Cillian Burke – CTVR Stokes Institute
Cillian Burke, Jeff Punch, CTVR, Stokes Institute, University of Limerick.
16:50 20mn Characterization of Intermetallic Compounds in Cu-Al Ball Bonds: Mechanical Properties, Interface Delamination and Thermal Conductivity
Corresponding Author: Marcel Kouters – TNO Technical Sciences
M.H.M. Kouters, G.H.M. Gubbels, C.A. Yuan, TNO Technical Sciences, Eindhoven, The Netherlands
17:10 20mn Simulation-based Predicition of Reliability and Robustness of Interconnect Systems for Semiconductor Applications
Corresponding Author: Markus Ackermann – X-FAB Semiconductor Foundries AG
Markus Ackermann 1, Verena Hein 1, Kirsten Weide-Zaage 2
1 X-FAB Semiconductor Foundries AG, Erfurt, Germany
2 LfI, Leibniz University of Hannover, Hannover, Germany
17:30 20mn Reliability Modeling of Electronic Systems subjected to High Strain Rates
Corresponding Author: Pradeep Lall – Auburn University
Pradeep Lall 1, Sandeep Shantaram 1, David Locker 2
1 Auburn University


Session 19 09:00 Wednesday Apr 18 2012
Advances in Modeling and Testing
Chairman: Xiao Hu Liu, IBM Watson Research Center; Steffen Wiese, Saarland University
09:00 30mn Keynote presentation – Prospects for Waste Heat Recovery in Microelectronic Systems
Corresponding Author: Peter Rodgers, Valérie Eveloy – The Petroleum Institute, Abu Dhabi
Peter Rodgers, Valérie Eveloy, The Petroleum Institute, Abu Dhabi, UAE
09:30 30mn Keynote presentation – Photomechanics Methods as Tools for Semiconductor Package Development
Corresponding Author: Pr BongTae Han – Universirty of Maryland
Bongtae Han, Center for Advanced Life Cycle Engineering (CALCE), USA
10:00 30mn Keynote presentation – Comparison of Ni- and SiGe-Based MEMS Magnetometers
Corresponding Author: Veronique Rochus – IMEC
V. Rochus 1, R. Jansen 1, X. Rottenberg 1, H.A.C. Tilmans 1, S. Ranvier 2, H. Lamy 2, P. Rochus 3
1 IMEC, Leuven, Belgium
2 Belgian Institute for Space Aeronomy, Bruxelles, Belgium
3 Centre Spatial de Liège, Liège, Belgium


Session 20 11:00 Wednesday Apr 18 2012
Thermo-Mechanics for New Applications
Chairman: Michael Guyenot, Robert Bosch GmbH; Artur Wymyslowski, Wroclaw University
11:00 30mn Keynote presentation – Mechanical Problems of Novel Back Contact Solar Modules
Corresponding Author: Steffen Wiese – Saarland University
Steffen Wiese 1, Frank Kraemer 1, Erik Peter 2, Jonas Seib 2
1 Saarland University
2 Robert Bosch GmbH
11:30 20mn GaN Growth on Patterned Silicon Substrates – A Thermo Mechanical Study on Wafer Bow Reduction
Corresponding Author: Mario Gonzalez – IMEC
Mario Gonzalez, Kai Cheng, Peter Tseng, Gustaaf Borghs, IMEC, Leuven, Belgium
11:50 20mn A Multivariate Parameter Analysis of Copper Pillars Eases the Design of Denser Interconnects
Corresponding Author: Gerd Schlottig – IBM Research GmbH
Gerd Schlottig, Thomas Brunschwiler, Javier Goicochea, Werner Escher, Bruno Michel, IBM Research, Rüschlikon, Switzerland
12:10 20mn Thermo-Mechanical Characterization and Modeling of TSV Annealing
Corresponding Author: Peter Saettler – Technical University Dresden
Peter Saettler 1, Daria Kovalenko 2, Karsten Meier 1, Mike Roellig 2, Mathias Boettcher 3, Klaus Juergen Wolter 1
1 Technische Universität Dresden, Germany
2 Fraunhofer Institut für Zerstörungsfreie Prüfung, Germany
3 Fraunhofer IZM-ASSID, Germany
12:30 20mn Thermo-Mechanical Reliability of Embedded Capacitors
Corresponding Author: Antoine RENAULT – EADS Innovation Works
A. Renault, C. Munier, EADS Innovation Works, Suresnes, France


Session 21 11:00 Wednesday Apr 18 2012
Solid State Lighting
Chairman: Christopher Bailey, University of Greenwich; Sheng Liu, Huazhong University of Science and Technology
11:00 30mn Keynote presentation – Thermo-Mechanical Evaluation and Life Time Simulation of a High Power LED Lamp Boards
Corresponding Author: Jiri Jakovenko – Czech Technical University in Prague, Faculty of Electrical Engineering
J. Jakovenko 1, J. Formánek 1, B. Pardo 2, X. Perpiñà 3, R.J. Werkhoven 4, J.M.G. Kunen 4, P. Bancken 5, P.J. Bolt 4
1 Czech Technical University in Prague, Faculty or Electrical Engineering, Praha, Czech Republic
2 CEA-LETI, MINATEC Campus, Grenoble, France
3 Instituto de Microelectrónica de Barcelona (IMB-CNM), Bellaterra, Spain
4 TNO, Eindhoven, The Netherlands
5 Philips Lighting, Lightlabs, Eindhoven, The Netherlands
11:30 20mn A Comparison Study of the Prognostics Approaches to Light Emitting Diodes Based on Accelerated Aging
Corresponding Author: Chris Bailey – University of Greenwich
Thamo Sutharssan, Chris Bailey, Stoyan Stoyanov, Computational Mechanics and Reliability Group, University of Greenwich, United-Kingdom
11:50 20mn Modelling Lead Free Solder Reliability in SSL Applications Towards Virtual Design
Corresponding Author: Rene Kregting – TNO
René Kregting 1, Müge Erinc 1, Jan Kloosterman 2, Willem van Driel 2
1 TNO, Eindhoven, The Netherlands
2 Philips Lighting, Nijmegen, The Netherlands
12:10 20mn Polymer-Based 2D/3D Wafer Level Heterogeneous Integration for SSL Module
Corresponding Author: Cadmus Yuan – Netherlands Organisation for Applied Scientific Research (TNO)
Cadmus Yuan 1, Jia Wei 2, Huaiyu Ye 3, Sau Koh 2, Stephen Harianto 4, Monique van den Nieuwenhof 5, G. Q. Zhang 2
1 TNO, Eindhoven, Netherlands; Delft University of Technology, Delft, Netherlands
2 Delft University of Technology, Delft, Netherlands
3 Delft University of Technology, Delft, Netherlands; Materials innovation institute (M2i), Delft, Netherlands
4 TNO, Eindhoven, Netherlands; Fontys University of Applied Sciences, Eindhoven, Netherlands
5 TNO, Eindhoven, Netherlands
12:30 20mn Accelerated Testing Method of LED Luminaries
Corresponding Author: Miao Cai – Guilin University of Electronic Technology, Guilin, China
M. Cai 1, D. G. Yang 1, S. Koh 2, C. A. Yuan  2, W. B. Chen 1, B. Y. Wu 3, G. Q. Zhang 2
1 Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, China
2 Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, Netherlands
3 Flextronics Manufacturing Company, Zhuhai, P.R. China


Session 22 14:00 Wednesday Apr 18 2012
Advances in Modeling
Chairman: John Lau, ITRI; Cadmus Yuan, TNO
14:00 30mn Keynote presentation – Numerical Modelling of Anchor Losses in MEMS Resonators
Corresponding Author: Frangi Attilio – Politecnico di Milano
A. Frangi, A. Bugada, M. Martello, P.T. Savadkoohi, Politecnico di Milano, Italy
14:30 30mn Keynote presentation – LED Driver Thermal Design Considerations for Solid-State Lighting Technologies
Corresponding Author: Xavier Perpiñà Giribet – IMB-CNM (CSIC)
X. Perpiñà 1, R.J. Werkhoven 2, M. Vellvehi 1, X. Jordà 1, J.M.G. Kunen 2, J. Jakovenko 3, P. Bancken 4, P.J. Bolt 2
1 IMB-CNM (CSIC), Bellaterra, Spain
2 TNO, Eindhoven, The Netherlands
3 Department of Microelectronics, Czech Technical University in Prague, Czech Republic
4 Philips Lighting, Lightlabs, Eindhoven, The Netherlands
15:00 30mn Keynote presentation – Nonlinear Analyses of Semi-Embedded Through-Silicon Via (TSV) Interposer with Stress Relief Gap Under Thermal and Shock Conditions
Corresponding Author: John H Lau – ITRI
John H. Lau, Shang-Tsai Wu, Heng-Chieh Chien, Electronics & Optoelectronics Research Laboratory, ITRI, Taiwan