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EuroSimE 2011 was locally organised by FH Österreich (Pr Mario Jungwirth) in Kaufmännischer Verein at Linz, Austria, on April 17-18-19-20 2011. This 12th EuroSimE was attended by 140 individuals. 5 training courses were offered on Sunday. The software exhibition brought together 4 exhibitors (CADFEM GmbH, Simulia, Insidix, MorGaN project). Proceedings of EuroSimE 2011 :
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This was the technical programme of EuroSimE 2011:
Go to Global conference schedule Technical program
| Day 1 – Monday 18 Apr 2011 | |||
| 08:00 | Registration open | ||
| 09:00 | Opening and industry keynote session Chaired by K. Zhang |
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| 09:02 | Industry keynote: Trends of Micro- and Nanoelectronics in the European R&D Programme; Vesselin Dontchev, European Commission | ||
| 09:40 | Industry keynote: Semiconductor Technology, Circuit and Systems Simulation for Industrial Application; Martin Schrems, Austria Microsystems | ||
| 10:10 | Industry keynote: Franz Dielacher, Infineon Technologies Austria AG | ||
| 10:40 | Break | ||
| 11:10 | S. 1 Technical Keynotes | ||
| 12:40 | Lunch | ||
| 14:00 | S. 2 Experimental and Numerical Investigations | S. 3 Modelling of MEMS Devices | S. 4 Solid State Lighting Thermal Analysis |
| 15:50 | Break | ||
| 16:20 | S. 5 On Stresses, Strains and Strength | S. 6 Solid State Lighting | S. 7 Thermal Behavior Modeling and Characterization |
| 18:30 | Transport by bus | ||
| 19:00 | Dinner at Pöstlingberg | ||
| Day 2 – Tuesday 19 Apr 2011 | |||
| 09:00 | S. 8 Thermo-mechanics for Solar Applications | S. 9 Process Modelling | S. 10 Compact Thermal Modeling |
| 10:10 | Break | ||
| 11:00 | S. 11 Thermo-Mechanical Issues in Microelectronics | S. 12 Multi-Physics Issues in Microelectronics | S. 13 Thermal Issues in Microelectronics |
| 12:20 | Lunch | ||
| 13:30 | S. 14 Semiconductor Reliability Modeling | S. 15 Molecular Dynamics | S. 16 Adhesion Experiments |
| 15:20 | Break | ||
| 16:00 | S. 17 Dynamic Problems | S. 18 Innovative Methods for Microsystems Modelling | S. 19 Solder Measurements and Modeling |
| 18:00 | Reception at venue | ||
| Day 3 – Wednesday 20 Apr 2011 | |||
| 09:00 | S. 20 New Developments in Modeling | ||
| 10:30 | Break | ||
| 11:00 | S. 21 Thermo-mechanical Modeling | S. 22 Multi-Physics Modelling for Power Electronics | |
| 12:50 | Lunch | ||
| 13:49 | ENIAC Session | ||
| 13:50 | Public-Private Partnerships Sustaining the European Competitivness in Semiconductors; Dr. Andreas Wild, Executive Director, ENIAC Joint Undertaking | ||
| 14:00 | e3CAR : creating the next generation components for the electric vehicle R. John, Infineon | ||
| 14:30 | SE2A : increasing the safety and efficiency of automobiles using affordable sensors and electronics S. Gielen, TNO | ||
| 15:00 | ESiP : ensuring the quality of System-in-Packages K. Pressel, Infineon AG | ||
| 15:30 | CSSL : affordable solid-state-lighting for the consumer through cooperation along the value chain R. van Silfhout, Philips Lighting | ||
| 16:00 | End of conference | ||
Go to Global conference schedule Technical program
| 08:00 | Registration open |
| 09:00 | Opening and industry keynote session Chaired by K. Zhang |
| 09:02 | Industry keynote: Trends of Micro- and Nanoelectronics in the European R&D Programme; Vesselin Dontchev, European Commission |
| 09:40 | Industry keynote: Semiconductor Technology, Circuit and Systems Simulation for Industrial Application; Martin Schrems, Austria Microsystems |
| 10:10 | Industry keynote: Franz Dielacher, Infineon Technologies Austria AG |
| 10:40 | Break |
| Session 1 | 11:10 | Monday 18 Apr 2011 | |
| Technical Keynotes Chaired by Leo Ernst |
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| 11:10 | 30mn | Keynote presentation – Prognostics and Health Monitoring of Electronic Systems Pradeep Lall 1, Ryan Lowe 1, Kai Goebel 2 1 Auburn University, USA 2 NASA Ames Research Center, USA |
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| 11:40 | 30mn | Keynote presentation – Development of a Standard for Transient Measurement of Junction-To-Case Thermal Resistance Heinz Pape 1, Dirk Schweitzer 1, Liu Chen 1, Rudolf Kutscherauer 1, Martin Walder 2 1 Infineon Technologies AG, Neubiberg, Germany 2 Infineon Technologies Austria AG, Villach, Austria |
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| 12:10 | 30mn | Keynote presentation – Ultrasonic Stresses in Thermosonic Ball Bonding Michael Mayer, University of Waterloo, Ontario, CANADA |
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| 12:40 | Lunch |
| Session 2 | 14:00 | Monday 18 Apr 2011 | |
| Experimental and Numerical Investigations Chaired by Abhijit Dasgupta, Jürgen Auersperg |
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| 14:00 | 30mn | Keynote presentation – Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests. Dr. Reinhard Pufall 1, Dr. Michael Goroll 1, Dr. Joachim Mahler 1, Dr- Werner Kanert 1, Mohamed Bouazza 2, Dr. Olaf Wittler 2, Dr. Rainer Dudek 3 1 Infineon Technologies AG 2 Fraunhofer IZM Berlin 3 Fraunhofer ENAS Chemnitz |
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| 14:30 | 20mn | A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging E.R. Weltevreden 1, M. Erinc 1, S.J. Tesarski 2, A. Wymyslowski 2, A. Mavinkurve 3, A.W.J. Gielen 1 1 TNO, Eindhoven, The Netherlands 2 Wrocław University of Technology, Wrocław, Poland 3 NXP Semiconductors, Nijmegen, The Netherlands |
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| 14:50 | 20mn | Accelerated fatigue testing methodology for reliability assessments of fiber reinforced composite polymer materials in micro/nano systems Sven Rzepka 1, Hans Walter 2, Remi Pantou 1, Yuval Freed 3, Bernd Michel 1 1 Micro Materials Center – Fraunhofer ENAS, Chemnitz, Germany 2 AMIC, Angewandte Micro-Messtechnik GmbH, Berlin, Germany 3 Israel Aerospace Industries, Ben-Gurion International Airport, Israel |
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| 15:10 | 20mn | Analytical estimate for cure-induced stresses and warpage in flat packages K.M.B. Jansen 1, J. deVreugd 2, L.J. Ernst 1 1 TU Delft, The Netherlands 2 TNO Industries, The Netherlands |
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| 15:30 | 20mn | Cure Dependent Characterisation of Moulding Compounds Kaspar Jansen, Delft University of Technology, Delft, The Netherlands Michal Hawryluk, Cracow University of Technology, Cracow, Poland Przemyslaw Gromala, Robert Bosch GmbH, Reutlingen, Germany |
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| Session 3 | 14:00 | Monday 18 Apr 2011 | |
| Modelling of MEMS Devices Chaired by Hideo Miura, Artur Wymyslowski |
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| 14:00 | 30mn | Keynote presentation – On the nonlinear behaviour of MEMS resonators Claudia Comi 1, Alberto Corigliano 1, Giacomo Langfelder 2, Antonio Longoni 2, Alessandro Tocchio 2 1 Department of Structural Engineering. Politecnico di Milano 2 Department of Electronics and Information. Politecnico di Milano |
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| 14:30 | 20mn | Modelling, simulation and validation of the dynamic performance of a single-pole single-throw RF-MEMS contact switch Cuong Do, Martin Hill, Maryna Lishchynska, Marcin Cychowski, Kieran Delaney, NIMBUS Centre, Cork Institute of Technology, Rossa Avenue, Cork, Ireland |
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| 14:50 | 20mn | Vibration Characterization of a MEMS 3D Force Sensor M. Erinc 1, H.J. van de Wiel 1, R.J. Werkhoven 1, A. Pongrácz 2, G. Battistig 2, H R. Fischer 1 1 TNO, The Netherlands 2 Research Institute for Technical Physics and Materials Science, Budapest, Hungary |
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| 15:10 | 20mn | Influence of Multiphysics Couplings on the Performance of a MEMS Magnetometer Sylvain Ranvier 1, Stéphane Paquay 2, Sébastien Requier 3, Hervé Lamy 1, Véronique Rochus 4, Laurent A. Francis 5, Pierre Rochus 6 1 Belgian Institute for Space Aeronomy, Brussels, Belgium 2 Open Engineering, Liège, Belgium 3 University of Liège, Liège, Belgium 4 IMEC, Leuven, Belgium 5 Université catholique de Louvain, Louvain-la-Neuve, Belgium 6 Centre Spatial de Liège, Liège, Belgium |
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| 15:30 | 20mn | FEM based modeling and optimization of a 2D micro mirror W. Schock 1, J. Mehner 2, J. Fritz 1, J. Muchow 1, C. Friese 1, S. Pinter 1 1 Robert Bosch GmbH, Reutlingen, Germany 2 Chemnitz University of Technology, Chemnitz, Germany |
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| Session 4 | 14:00 | Monday 18 Apr 2011 | |
| Solid State Lighting Thermal Analysis Chaired by Cadmus Yuan, Xavier Perpinya |
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| 14:00 | 30mn | Keynote presentation – Thermal Performance of LED Packages for Solid State Lighting with Novel Cooling Solutions Kai Zhang 1, David G.W. Xiao 2, Xiaohua Zhang 3, Haibo Fan 3, Zhaoli Gao 3, Matthew M. F. Yuen 3 1 1) Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China; 2) School of Energy & Power Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi, China 2 Advanced Photoelectric Technology Ltd, Unit 501-502, IC Development Centre, No.6 Science Park West Ave., Shatin, N.T., Hong Kong SAR, China 3 Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China |
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| 14:30 | 20mn | Thermal Transient Analysis of LED Array with In-line Pin Fin Heat Sink Fengze Hou , Daoguo Yang, G.Q. Zhang, Yang Hai, Dongjing Liu, Lei Liu, Guilin University of Electronic Technology |
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| 14:50 | 20mn | Thermal simulation and validation of a LED lamp Jiri Jakovenko 1, Robert Werkhoven 2, Jan Formánek 1, Jos Kunen 2, Pieter Bolt 2, Pavel Kulha 1, Peter Bancken 3 1 Czech Technical University in Prague, Faculty or Electrical Engineering 2 TNO, Eindhoven, the Netherlands 3 Philips Lighting, Lightlabs, Eindhoven, The Netherlands |
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| 15:10 | 20mn | Numerical modeling of thermal performance: natural convection and radiation of solid state lighting Huaiyu Ye 1, A.W.J. Gielen 2, H.W. vanZeijl 1, R.J. Werkhoven 2, G.Q. Zhang 1 1 Delft Institute of Microsystems and Nanoelectronics (Dimes) 2 Netherlands Organization for Applied Scientific Research (TNO) |
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| 15:30 | 20mn | Temperature Dependency in Performance of Solid State Lighting Drivers S. Tarashioon, S.W. Koh, W. D. van Driel, G.Q Zhang, Delft Institute of Microsystems and Nanoelectronics (DIMES), The Netherlands |
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| 15:50 | Break |
| Session 5 | 16:20 | Monday 18 Apr 2011 | |
| On Stresses, Strains and Strength Chaired by Daoguo Yang, Rainer Dudek |
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| 16:20 | 30mn | Keynote presentation – Simulation based Design of Mechatronic Systems Mario Jungwirth, Daniel Hofinger, Heinz Weinzierl, University of Applied Sciences Upper Austria, Wels, Austria |
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| 16:50 | 20mn | Monte Carlo Simulation of X-ray diffraction embedded in experimental determination of residual stresses in Microsystems Uwe Zschenderlein, Bernhard Wunderle, Chemnitz University of Technology, Chair Materials and Reliability of Microsystems, Germany |
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| 17:10 | 20mn | Local strength measurement technique for miniaturised silicon-based components Marco Deluca 1, Raul Bermejo 2, Martin Pletz 1, Mike Morianz 3, Johannes Stahr 3, Peter Supancic 2, Robert Danzer 2 1 Materials Center Leoben Forschung GmbH, Leoben, Austria 2 Montanuniversitaet Leoben, Leoben, Austria 3 AT&S AG, Leoben, Austria |
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| 17:30 | 20mn | Developing the mesoscale stress-strain curve to failure. Nancy Iwamoto, Honeywell Specialty Materials, USA |
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| Session 6 | 16:20 | Monday 18 Apr 2011 | |
| Solid State Lighting Chaired by Sander Gielen, Frank Krämer |
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| 16:20 | 30mn | Keynote presentation – LED System Reliability W.D. van Driel 1, C.A. Yuan 2, S. Koh 3, G.Q. Zhang 1 1 Philips Lighting & Delft University of Technology 2 TNO Science and Industry 3 Delft University of Technology |
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| 16:50 | 20mn | Multi-Physics and Multi-Disciplinary Analysis for Solid State Lighting C. Bailey 1, C. Yin 1, H. Lu 1, C. Cartwright 2 1 School of Computing and Mathematical Science, University of Greenwich, London, UK 2 School of Computing and Creative Technologies, University of Abertay Dundee, Dundee, UK |
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| 17:10 | 20mn | Performance Analysis of High-power LEDs Packaging Modules under Different Junction Temperatures Lei Liu, Daoguo Yang, G.Q. Zhang, Zhi You, Fengze Hou, Dongjing Liu, Guilin University of Electronic Technology |
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| 17:30 | 20mn | Degradation of epoxy lens of LED system S. Koh 1, W.D. van Driel 2, G.Q. Zhang 2 1 Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, Netherlands 2 Philips Lighting, LightLabs, Eindhoven, Netherlands |
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| Session 7 | 16:20 | Monday 18 Apr 2011 | |
| Thermal Behavior Modeling and Characterization Chaired by Xuejun Fan, Valérie Eveloy |
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| 16:20 | 30mn | Keynote presentation – Electrothermal prediction model of Cu low k interconnection on glass substrate Laurent Siegert 1, Guillaume Fiannaca 2, Fabrice Roqueta 2, Gael Gautier 1, Christine Anceau 2 1 Université de Tours, Tours, France 2 ST Microelectronics, Tours, France |
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| 16:50 | 20mn | Enhancing the lifetime prediction methodology for photovoltaic modules based on electronic packaging experience Guyenot, Michael 1, Peter, Erik 1, Zerrer, Patrick 2, Wiese, Steffen 3, Kraemer, Frank 3 1 Robert Bosch GmbH, Germany, Schwieberdingen 2 BOSCH Solar Modules GmbH, Arnstadt, Germany 3 Saarland University, Saarbrücken, Germany |
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| 17:10 | 20mn | Heatsink design for optimal thermal management D. Hofinger 1, M. Jungwirth 1, A. Eder 2, H. Pflügelmeier 2 1 FH OÖ – Upper Austria University of Applied Sciences, Wels, Austria 2 Fronius International GmbH, Wels-Thalheim, Austria |
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| 17:30 | 20mn | Thermal Investigation of a Battery module for Work machines Yasir Abdul-Quadir 1, Perttu Heikkilä 2, Teemu Lehmuspelto 2, Juha Karppinen 1, Tomi Laurila 1, Mervi Paulasto-Kröckel 1 1 Aalto University, School of Electrical Engineering, Department of Electronics, Espoo, Finland 2 Aalto University, School of Electrical Engineering, Department of Automation and Systems Technology, Espoo, Finland |
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| 18:30 | Transport by bus |
| 19:00 | Dinner at Pöstlingberg |
| Session 8 | 09:00 | Tuesday 19 Apr 2011 | |
| Thermo-mechanics for Solar Applications Chaired by Pradeep Lall, Ming-Che Hsieh |
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| 09:00 | 30mn | Keynote presentation – Thermo-mechanical assessment of solar cell displacement with respect to the viscoelastic behaviour of the encapsulate Matthias Pander 1, Sascha Dietrich 1, Stefan-H. Schulze 1, Ulrich Eitner 2, Matthias Ebert 1 1 Fraunhofer Center for Silicon Photovoltaics CSP, Halle (Saale), Germany 2 Institute for Solar Energy Research Hameln (ISFH), Emmerthal, Germany |
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| 09:30 | 20mn | Thermo-mechanical challenges of advanced solar cell modules Mario Gonzalez, Jonathan Govaerts, Riet Labie, Ingrid De Wolf, Kris Baert, IMEC, Leuven, Belgium |
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| 09:50 | 20mn | Development of a Drop Test Methodology for Solar Cells Frank Kraemer, Steffen Wiese, University of Saarland, Germany |
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| Session 9 | 09:00 | Tuesday 19 Apr 2011 | |
| Process Modelling Chaired by Alberto Corigliano, Véronique Rochus |
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| 09:00 | 30mn | Keynote presentation – Evaluation of the Change of the Residual Stress in Nano-scale Transistors During the Deposition and Fine Patterning Processes of Thin Films Kota Nakahira 1, Hironori Tago 1, Hiroki Kishi 1, Ken Suzuki 1, Hideo Miura 1, Masaki Yoshimaru 2, Ken-ichiro Tatsuuma 2 1 Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, Japan 2 Semiconductor Technology Academic Research Center, Japan |
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| 09:30 | 20mn | FE modeling of Cu wire bond process and reliability Cadmus Yuan 1, Esther Weltevreden 1, Pieter van dan Akker 1, René Kregting 1, Jan de Vreugd 2, G. Q. Zhang 3 1 TNO Science and Industry, Eindhoven, The Netherlands 2 TNO Science and Industry, Delft, The Netherlands 3 Delft University of Technology, Delft, The Netherlands |
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| 09:50 | 20mn | Evaluation of Polymer Wafer Bonding with Silicone Adhesive and Patterned Trenches Jeffery C. C. LO, Rong ZHANG, S. W. Ricky LEE, Zelin WANG, Hong Kong University of Science & Technology |
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| Session 10 | 09:00 | Tuesday 19 Apr 2011 | |
| Compact Thermal Modeling Chaired by Peter Rodgers, Miquel Vellvehi |
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| 09:00 | 30mn | Keynote presentation – Dynamic Compact Thermal Model for Electro-Thermal modeling and Design Optimization of Automotive Power Devices Toufi azoui 1, Patrick Tounsi 1, Guillaume Pasquet 1, Philippe Dupuy 2, Jean-Marie Dorkel 1 1 CNRS ; LAAS ; Toulouse, France 2 Freescale Semiconductor, Inc., Toulouse, France |
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| 09:30 | 20mn | A Model for Static and Dynamic Thermal Analysis of Thin Heated Beams or Membranes including the Thermal Conductivity of the Surrounding Gas G. de Graaf, Huai-Wen Wu, R.F. Wolffenbuttel, TU-Delft, The Netherlands |
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| 09:50 | 20mn | Generation of Reduced Thermal Models of Electronic Systems from Transient Thermal Response Marcin Janicki, Mariusz Zubert, Andrzej Napieralski, Technical University of Lodz, Poland |
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| 10:10 | Break |
| Session 11 | 11:00 | Tuesday 19 Apr 2011 | |
| Thermo-Mechanical Issues in Microelectronics Chaired by Kaspar Jansen, Heinz Pape |
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| Design of Athermalized Proximity Coupled (APC) Synthetic Green Laser Opto-electronic Package for Microprojector Displays – Numerical Modeling and Experiments Satish Chaparala, Venkata Bhagavatula, John Himmelreich, Corning Incorporated, Corning, NY, USA, 14831 |
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| Investigation of Thin Films by Nanoindentation with DOE and Numerical Methods Łukasz Dowhań 1, Artur Wymysłowski 1, Olaf Wittler 2 1 Wrocław University of Technology, Wrocław, Poland 2 Micro Materials Center Berlin, Fraunhofer IZM, Berlin, Germany |
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| Comparison of Metaheuristic Algorithms for Simulation Based OPF Computation Stephan Hutterer 1, Franz Auinger 1, Michael Affenzeller 2 1 Upper Austria University of Applied Sciences, School of Engineering and Environmental Sciences 2 Upper Austria University of Applied Sciences, School of Engineering and Environmental Sciences; Josef Ressel Centre Heureka! |
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| Mechanical properties of intermetallic compounds in Cu-Al ball bonds M.H.M. Kouters 1, G.H.M. Gubbels 1, O. O’Halloran 2, R. Rongen 2 1 TNO, Eindhoven, The Netherlands 2 NXP Semiconductors, Nijmegen, The Netherlands |
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| Board Level Flat and Vertical Drop Impact Reliability for Wafer Level Chip Scale Package Richard Qian 1, Yong Liu 2, Jihwan Kim 3, Stephen Martin 2 1 Fairchild Semiconductor Suzhou, China 2 Fairchild Semiconductor Corp. 3 Fairchild Semiconductor Bucheon, Korea |
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| A substructure method for strip level warpage simulation of a power module in assembly process Jianghai Gu 1, Lihua Liang 1, Yong Liu 2 1 Zhejiang University of Technology 2 Fairchild Semiconductor Corp. |
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| Simulation of Lateral Effect in Emitter Region of Silicon Solar Cells for Concentrated Sunlight Ali Alimardani 1, Negin Manavizadeh 2, Ali Afzali-Kusha 1, Ebrahim Asl-Soleimani 1 1 School of Electrical and Computer Engineering, University of Tehran, Tehran, Iran 2 Faculty of Electrical and Computer Engineering, K. N. Toosi University of Technology, Tehran, Iran |
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| Study of constant rate and constant force low cycle fatigue methods for solder characterization R. Metasch 1, G. Rodrigues 2, M. Roellig 1, P. A. P. Wendhausen 2, K.-J. Wolter 3 1 Fraunhofer Institut für Zerstörungsfreie Prüfverfahren, Dresden, Germany 2 Universidade Federal de Santa Catarina, Materials Laboratory, Brazil 3 Technische Universität Dresden, Electronics Packaging Laboratory, Germany |
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| Au-Au ‘Cold-weld’ Bond Strength in Adhesively Bonded Flip-Chip Interconnects Koustav Sinha 1, Daniel Farley 1, Thomas Kahnert 1, Abhijit Dasgupta 1, J. F. J. Caers 2, X. J. Zhao 2 1 CALCE Center, Mechanical Engineering Department, University of Maryland, College Park, Maryland, U.S.A. 2 Philips Research Labs, Eindhoven, The Netherlands |
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| Anomalous Moisture Absorption and Desorption at Various Temperatures in Epoxy Mold Compounds Mark D. Placette 1, Xuejun Fan 1, Jie-Hua Zhao 2, Darvin Edwards 2 1 Department of Mechanical Engineering, Lamar University, Beaumont, TX, USA 2 Texas Instruments, Inc., Dallas, Texas, USA |
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| Low Cycle Fatigue Crack Growth In Nanostructure Copper S. Koh 1, A. Saxena 2, W.D. van Driel 3, G.Q. Zhang 3, R. Tummala 4 1 Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, The Netherlands 2 Department of Mechanical Engineering, University of Arkansas, USA 3 Philips Lighting, LightLabs, Eindhoven, The Netherlands 4 Department of Materials Science and Engineering, Georgia Institute of Technology, USA |
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| Session 12 | 11:00 | Tuesday 19 Apr 2011 | |
| Multi-Physics Issues in Microelectronics Chaired by Kaspar Jansen, Heinz Pape |
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| System-level model of electrothermal microsystem and temperature control circuit Tamara Bechtold 1, Dennis Hohlfeld 2, Evgenii B. Rudnyi 1 1 CADFEM GmbH, Germany 2 Reutlingen University, Germany |
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| Mechanical Model of an Inertial Rotational Microgyroscope Francesco Braghin, Elisabetta Leo, Ferruccio Resta, Stefano Cerra, Politecnico di Milano, Milano, Italy |
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| Experimental Procedure to fast verify Inertial MEMS Gyroscope Properties Francesco Braghin, Elisabetta Leo, Ferruccio Resta, Andrea Castro, Stefano Cerra, Politecnico di Milano, Milano, Italy |
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| Effects of the electrode positions on the dynamical behaviour of electrostatically actuated MEMS resonators Marius Pustan, University of Liège; Technical University of Cluj-Napoca Stéphane Paquay, Open Engineering SA Liège, Belgium Véronique Rochus, IMEC Leuven, Belgium Jean-Claude Golinval, University of Liège, Belgium |
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| Study on passive micro direct methanol fuel cell Cao Yijiang 1, Zhang Yufeng 2, Xu Biao 1, Yin Jinghua 1, Liu Xiaowei 2 1 College of Applied Science, Harbin University of Science and Technology, Harbin, China 2 MEMS Center, Harbin Institute of Technology, Harbin, China |
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| Computer-Aided Multiscale Model Derivation for MEMS Arrays Bin YANG 1, Walid BELKHIR 2, Raj Narayan DHARA 1, Michel LENCZNER 1, Alain Giorgetti 2 1 FEMTO-ST, Département Temps-Fréquence, University of Franche-Comté, France 2 LIFC, University of Franche-Comté, France |
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| Optimization of Solder Joint Configuration in Multi-chip Packages Benjie Balos Hornales, Fairchild Semiconductor, Philippines |
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| Piezoelectric membrane actuator design F. CASSET 1, M. CUEFF 1, E. DEFAY 1, G. Le Rhun 1, A. Suhm 1, P. ANCEY 2, A. DEVOS 3 1 CEA-LETI, MINATEC Campus, Grenoble, France 2 ST, Crolles, France 3 IEMN/ISEN, Lille, France |
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| Modeling and Assessment for a Novel Power System Module with Vertical Input Capacitor Richard Qian 1, Yumin Liu 2, Yong Liu 3, Stephen Martin 3, OS Jeon 4 1 Fairchild Semiconductor Suzhou, China 2 Fairchild Semiconductor Shanghai, China 3 Fairchild Semiconductor Corp. 4 Fairchild Semiconductor Bucheon, Korea |
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| Compact Models for the Electronic Properties of Edge-Disordered Graphene Nanoribbons Arash Yazdanpanah Goharrizi 1, Mahdi Pourfath 1, Morteza Fathipour 2, Hans Kosina 1 1 Technische Universität Wien, Institute for Microelectronics, Wien, Austria 2 University of Tehran, Electrical Engineering, Tehran, Iran |
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| Recent developments in reduced order modeling based on mode superposition technique Vladimir Kolchuzhin, Michael Naumann, Jan Mehner, Chemnitz University of Technology, Chemnitz, Germany |
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| Impact of the solder joint ageing on IGBT I-V characteristics using 2D physical simulation E. MARCAULT 1, M. BREIL 1, A. BOURENNANE 1, P. TOUNSI 1, P. DUPUY 2 1 LAAS-CNRS, Toulouse, France 2 Freescale Semiconductor, Toulouse, France |
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| Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach – preliminary results Sebastian J. Tesarski 1, Artur Wymyslowski 1, Ole Hölck 2 1 Wroclaw University of Technology, Wroclaw, Poland 2 Fraunhofer Institut Zuverlässigkeit und Mikrointegration, Berlin, Germany |
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| Simulation of aging effects on radiated emission of microstrip line Hassene Fridhi, Geneviève Duchamp, Valérie Vignéras, IMS-Bordeaux, France |
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| Design issues in electrostatic microplate actuators: device stability and post-pull-in behaviour Emanuele Bertarelli 1, Raffaele Ardito 1, Andreas Greiner 2, Jan G. Korvink 2, Alberto Corigliano 1 1 Department of Structural Engineering, Politecnico di Milano, Italy 2 Department of Microsystems Engineering, University of Freiburg, Germany |
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| The influence of molecular dynamics simulation parameters on the accuracy of carbon nanotubes thermal conductivity calculations. Bartosz Platek, Tomasz Falat, Jan Felba, Wroclaw University of Technology, Faculty of Microsystems Electronics and Photonics, Laboratory for Interconnecting and Packaging Electronic Circuits, Poland |
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| Session 13 | 11:00 | Tuesday 19 Apr 2011 | |
| Thermal Issues in Microelectronics Chaired by Kaspar Jansen, Heinz Pape |
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| Hydrogen-Passivated Graphene Antidot Structures for Thermoelectric Applications Hossein Karamitaheri 1, Mahdi Pourfath 1, Rahim Faez 2, Hans Kosina 1 1 Technische Universität Wien, Institute for Microelectronics, Wien, Austria 2 School of Electrical Engineering, Sharif University of Technology, Tehran, Iran |
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| Research on the Failure Property of VDMOS Device by Thermal Cycles Yin Jinghua 1, Hua Qing 1, He Yanqiang 1, Cao Yijiang 1, Chen Minghua 1, Liu Ting 1, Liu Xiaowei 2 1 School of Applied Science, Harbin University of Science and Technology, Harbin, China 2 School of Astronautics, Harbin Institute of Technology, Harbin, China |
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| Analytical modelling of transient processes in thermal microsensors A. G. Kozlov 1, D. Randjelovic 2, Z. Djuric 2 1 Omsk State University, Omsk, Russia 2 IHTM – Institute of Microelectronic Technologies and Single Crystals, University of Belgrade, Belgrade, Serbia |
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| A Comprehensive Study of Nanoscale Field Effect Diodes N. Manavizadeh 1, M. Pourfath 2, F. Raissi 1, E. Asl-Soleimani 3 1 Faculty of Electrical and Computer Engineering, K. N. Toosi University of Technology, Tehran, Iran 2 Institute for Microelectronics, TU Wien, Vienna, Austria 3 NanoElectronics and Thin Film Lab., School of ECE, University of Tehran, Tehran, Iran |
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| A Study on Thermal Analysis for 3D Heterogenous Embedded System Integration Platform MorPack Jin-Ju Chue, Chih-Chyau Yang, Shih-Lun Chen, Chun-Chieh Chiu, Yi-Jun Liu, Chun-Chieh Chu, Chien-Ming Wu, Chun-Ming Huang, National Chip Implementation Center (CIC), Hsinchu, Taiwan |
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| 12:20 | Lunch |
| Session 14 | 13:30 | Tuesday 19 Apr 2011 | |
| Semiconductor Reliability Modeling Chaired by Bart Vandevelde, Mario Jungwirth |
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| 13:30 | 30mn | Keynote presentation – Reliability of Semiconductor Devices Werner Kanert, Infineon Technologies, Neubiberg, Germany |
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| 14:00 | 20mn | Stress/Stain Assessment and Reliability Prediction of Through Silicon Via and Trace Line Structures of 3D Packaging Ting-Hsin Kuo 1, Yen-Fu Su 1, Chung-Jung Wu 1, Kuo-Ning Chiang 2 1 Dept. of Power Mechanical Engineering, National Tsing Hua University, HsinChu, Taiwan 2 National Center for High-Performance Computing, Taiwan |
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| 14:20 | 20mn | Studies on the Reliability of Power Packages Based on Strength and Fracture Criteria Rainer Dudek 1, Reinhard Pufall 2, Bettina Seiler 3, Bernd Michel 1 1 Fraunhofer ENAS, Germany 2 Infineon Technologies, Germany 3 CWM GmbH, Germany |
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| 14:40 | 20mn | Cyclic Loading and Fatigue in Power Packages Torsten Hauck, Freescale Halbleiter Deutschland GmbH |
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| Session 15 | 13:30 | Tuesday 19 Apr 2011 | |
| Molecular Dynamics Chaired by Nancy Iwamoto, Kuo-Ning Chiang |
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| 13:30 | 30mn | Keynote presentation – Comparative Characterization of Chip to Epoxy Interfaces by Molecular Modeling and Contact Angle Determination Ole Hölck 1, Jörg Bauer 1, Olaf Wittler 1, Bernd Michel 2, Bernhard Wunderle 3 1 Fraunhofer IZM, Berlin, Germany 2 Fraunhofer ENAS, Chemnitz, Germany 3 Chemnitz University of Technology, Chemnitz, Germany |
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| 14:00 | 20mn | Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces C. K. Y. Wong 1, S. Y. Y. Leung 1, R.H. Poelma 1, K.M.B. Jansen 1, C. C. A. Yuan 1, W. D. van Driel 2, G. Q. Zhang 2 1 Delft University of Technology, The Netherlands 2 Philips Lighting, The Netherlands |
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| 14:20 | 20mn | Investigation of Benzenethiol (BT) Materials as Adhesion Promoter for Cu/Epoxy Interface Using Molecular Dynamic Simulation Peng He, Haibo Fan, Matthew M. F. Yuen, Hong Kong University of Science and Technology, Hong Kong SAR |
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| 14:40 | 20mn | Non-equilibrium molecular dynamics simulation of heat transfer in carbon nanotubes – verification and model validation. Tomasz Falat, Bartosz Platek, Jan Felba, Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland |
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| 15:00 | 20mn | Buckling analysis of carbon nanotubes and the influence of defect position R.H. Poelma, H. Sadeghian, S. Koh, G.Q. Zhang, Delft University of Technology, Delft, The Netherlands |
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| Session 16 | 13:30 | Tuesday 19 Apr 2011 | |
| Adhesion Experiments Chaired by Steffen Wiese, Mario Gonzalez |
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| 13:30 | 30mn | Keynote presentation – Prediction of Mixed-Mode Interfacial Fracture from Cohesive Zone Finite Element Model: Testing and Determination of Fracture Process Parameters Stanley Y Y Leung 1, Mahdi Sadeghinia 1, Heniz Pape 2, Leo J Ernst 1 1 Department of Precision and Microsystem Engineering, Faculty of 3mE, Delft University of Technology, The Netherlands 2 Infineon Technologies AG, Germany |
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| 14:00 | 20mn | Determination of strength of interface in packages based on an approach using coupling of experimental and modelling results Diane Weidmann 1, Guillaume DUBOIS 2, Michael HERTL 1, Xavier CHAUFFLEUR 2 1 INSIDIX, France 2 EPSILON, France |
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| 14:20 | 20mn | Investigation of Energy Release Rate for Through Silicon Vias (TSVs) in 3D IC integration Ming-Che Hsieh, Sheng-Tsai Wu, Chung-Jung Wu, John H. Lau, Ra-Min Tain, Wei-Chung Lo, Industrial Technology Research Institute, Taiwan |
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| 14:40 | 20mn | Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: characterisation methods and implementation in FEM A. Ivankovic 1, K. Vanstreels 1, YY. Hsu 1, M. Gonzalez 1, G. Brizar 2, D. Vanderstraeten 2, E. Blansaer 2, R. Gillon 2, M. Defloor 3, K. Vandaele 3, D. Degryse 3, B. Vandevelde 1 1 IMEC, Leuven, Belgium 2 ON Semiconductor Belgium, Oudenaarde, Belgium 3 KAHO, Gent, Belgium |
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| 15:00 | 20mn | Fracture Toughness of Cu-EMC Interfaces under Pressure Cooker Conditions M. Sadeghinia 1, L.J. Ernst 1, K.M.B. Jansen 1, H.Pape 2, G. Schlottig 2 1 Delft University of Technology, The Netherlands 2 Infineon Technologies AG, Germany |
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| 15:20 | Break |
| Session 17 | 16:00 | Tuesday 19 Apr 2011 | |
| Dynamic Problems Chaired by Yong Liu, Torsten Hauck |
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| 16:00 | 30mn | Keynote presentation – The Effect of Secondary Impacts on PWB-level Drop Tests at High Impact Accelerations Stuart Douglas, Jingshi Meng, Joshua Akman, Irfan Yildiz, Moustafa Al-Bassyiouni, Abhijit Dasgupta, CALCE Center, Mechanical Engineering Department, University of Maryland, College Park, Maryland, U.S.A. |
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| 16:30 | 20mn | Life Time Prediction for Lead-free Solder Joints under Vibration Loads Karsten Meier 1, Mike Roellig 2, Andreas Schiessl 3, Klaus-Juergen Wolter 1 1 Technische Universität Dresden, Electronics Packaging Laboratory, Germany 2 Fraunhofer IZFP-D, Germany 3 Continental Automotive GmbH, Germany |
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| 16:50 | 20mn | Numerical Investigation of the Process of Embedding Components into Printed Circuit Boards Martin Pletz 1, Raúl Bermejo 2, Peter Supancic 1, Johannes Stahr 3, Mike Morianz 3 1 Materials Center Leoben Forschung GmbH, Leoben, Austria; Institut für Struktur- und Funktionskeramik, Montanuniversität Leoben, Leoben, Austria 2 Institut für Struktur- und Funktionskeramik, Montanuniversität Leoben, Leoben, Austria 3 AT&S AG, Leoben, Austria |
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| 17:10 | 20mn | Fatigue Model based on Average Cross-Section Strain of Cu Trace Cyclic Bending Daniel Farley 1, Abhijit Dasgupta 2, Yuxun Zhou 3, Jo Caers 4, JWC de Vries 4 1 Delft University of Technology, The Netherlands 2 CALCE Electronic Products and Systems Consortium, USA 3 Microsoft Research, Redmond, USA 4 Philips Research, Eindhoven, The Netherlands |
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| Session 18 | 16:00 | Tuesday 19 Apr 2011 | |
| Innovative Methods for Microsystems Modelling Chaired by Bernard Wunderle, Xuejun Fan |
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| 16:00 | 30mn | Keynote presentation – Moisture Diffusion and Integrated Stress Analysis for Polymer Materials at Reflow Process: Continuum Mechanics Theory and Numerical Implementation Xuejun Fan, Dept Mech Eng, Lamar University, Beaumont, TX, USA Jie-Hua Zhao, Texas Instruments, Inc., MS3611, Dallas, TX, USA |
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| 16:30 | 20mn | The Impact of Moisture Absorption on the Electrical Parameters of Organic Dielectric Materials Brian Curran 1, Ivan Ndip 1, Jorg Bauer 1, Stephan Guttowski 1, Klaus Dieter Lang 1, Herbert Reichl 2 1 Fraunhofer – IZM 2 Fraunhofer – IZM, TU Berlin |
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| 16:50 | 20mn | Distributed modeling approach applied to the power PIN diode using VHDL-AMS A.HNEINE, J. L. MASSOL, P. TOUNSI, P. AUSTIN, LAAS-CNRS, Toulouse, FRANCE |
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| 17:10 | 20mn | Numerical modelling and optimization of an electronic system embedded in multi-layered viscoelastic materials under shock loads Amjad Alsakarneh, Liam Moore, John Barrett, Cork Institute of Technology, Ireland |
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| 17:30 | 20mn | Modeling, Filtering and Optimization for AFM Arrays Hui HUI 1, Youssef YAKOUBI 1, Michel LENCZNER 2, Scott COGAN 3, André MEISTER 4, Mélaine FAVRE 4, Raphaël COUTURIER 5, Stéphane DOMAS 5 1 FEMTO-ST, Time-Frequency Departement, University of Franche-Comté, France 2 FEMTO-ST, Time-Frequency Departement. UTBM, France 3 FEMTO-ST, Applied Mechanics Departement, CNRS, France 4 CSEM, Neufchâtel, Switzerland 5 LIFC, Université de Franche-Comté, France |
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| Session 19 | 16:00 | Tuesday 19 Apr 2011 | |
| Solder Measurements and Modeling Chaired by Sven Rzepka, Werner Kanert |
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| 16:00 | 30mn | Keynote presentation – Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies Bart Vandevelde 1, Riet Labie 1, Vladimir Cherman 1, Tomas Webers 1, Christophe Winters 1, Eric Beyne 1, Franck Dosseul 2 1 IMEC, Leuven, Belgium 2 STMicroelectronics, Tours, France |
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| 16:30 | 20mn | Thermo-Mechanical Simulations and Measurements on High Temperature Interconnects Klas Brinkfeldt, Rafael Amen, Erik Adolfsson, Per-Erik Tegehall, Per Johander, Dag Andersson, Swerea IVF, Mölndal, Sweden |
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| 16:50 | 20mn | Lifetime prediction for solder joints with the extended finite element method Alexander Menk 1, Chris J. Pearce 2, Olivier Lanier 3, Robert Simpson 4, Stephane P.A. Bordas 4 1 Robert Bosch GmbH, University of Glasgow 2 University of Glasgow, UK 3 Robert Bosch GmbH, Germany 4 University of Cardiff, UK |
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| 17:10 | 20mn | Improving the Solderability and Electromigration Behavior of SAC0705 Soldering Sun Fenglian, Liu Yang, Liu Yang, Wang Jiabing, Harbin Uni. of Sci. and Tech., China |
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| 17:30 | 20mn | The Creep Behaviour and Microstructure of ultra small Solder Joints Steffen Wiese 1, Maik Mueller 2, Iuliana Panchenko 2, Rene Metasch 3, Klaus-Juergen Wolter 2 1 Saarland University, Germany 2 TU Dresden, Germany 3 Fraunhofer IzfP, Germany |
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| 18:00 | Reception at venue |
| Session 20 | 09:00 | Wednesday 20 Apr 2011 | |
| New Developments in Modeling Chaired by Chris Bailey, Dag Andersson |
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| 09:00 | 30mn | Keynote presentation – Challenges of Power Electronic Packaging and Modeling Yong Liu, Dan Kinzer, Fairchild Semiconductor Corp., USA |
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| 09:30 | 30mn | Keynote presentation – Optimization of Air Cooled Heat Sinks in Free Convection P. Rodgers, V. Eveloy, The Petroleum Institute, Abu Dhabi, U.A.E. |
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| 10:00 | 30mn | Keynote presentation – Molecular Dynamics Simulation for Electronic Packaging Matthew M F Yuen, Haibo Fan, Department of Mechanical Engineering, The Hong Kong University of Science and Technology |
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| 10:30 | Break |
| Session 21 | 11:00 | Wednesday 20 Apr 2011 | |
| Thermo-mechanical Modeling Chaired by Hélène Fremont, Sun Fenglian |
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| 11:00 | 30mn | Keynote presentation – Reduced order modeling for thermal and multiphysics problems Manfred Kaltenbacher, Applied Mechatronics, Alps-Adriatic University, Klagenfurt, Austria Helmut Köck, KAI (Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH), Villach, Austria |
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| 11:30 | 20mn | Comprehensive material characterization and method of its validation by means of FEM simulation P. Gromala 1, J. Duerr 1, M. Dressler 2, K. M. B. Jansen 3, M. Hawryluk 4, J. de Vreugd 5 1 Robert Bosch GmbH, Automotive Electronics, Germany 2 Robert Bosch GmbH, Corporate Research, Germany 3 Delft University of Technology, Faculty of Mechanical, Maritime and Materials Engineering, The Netherlands 4 Cracow University of Technology, Faculty of Mechanical Engineering, Poland 5 Netherlands Organization for Applied Scientific Research (TNO), The Netherlands |
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| 11:50 | 20mn | Moisture Diffusion Modeling and its Impact on Fracture Mechanics Parameters with regard to a PQFP Siow Ling HO, Andrew A. O. TAY, National University of Singapore, Singapore |
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| 12:10 | 20mn | Interaction Integral and Mode Separation for BEoL-cracking and -delamination Investigations under 3D-IC Integration Aspects Auersperg, Juergen 1, Dudek, Rainer 1, Oswald, Jens 2, Michel, Bernd 1 1 Micro Materials Center Chemnitz, Fraunhofer ENAS, Chemnitz, Germany 2 GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany |
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| 12:30 | 20mn | Co-design of Wafer Level Thin Film Package Assembly J.J.M. Zaal, F. Santagata, W.D. van Driel, G.Q. Zhang, J.F. Creemer, P.M. Sarro, Delft University of Technology, The Netherlands |
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| Session 22 | 11:00 | Wednesday 20 Apr 2011 | |
| Multi-Physics Modelling for Power Electronics Chaired by Ole Hölck, Michael Guyenot |
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| 11:00 | 30mn | Keynote presentation – Modelling aluminium wire bond reliability in high power OMP devices Rene Kregting 1, Cadmus Yuan 1, An Xiao 2, Frank de Bruijn 2 1 TNO, Eindhoven, The Netherlands 2 NXP, Nijmegen, The Netherlands |
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| 11:30 | 20mn | Impact of VDMOS source metallization ageing in 3D FEM Wire lift off modeling E. MARCAULT 1, T. AZOUI 1, P. TOUNSI 1, M. BREIL 1, A. BOURENNANE 1, P. DUPUY 2 1 LAAS-CNRS, Toulouse, France 2 Freescale Semiconductor, Toulouse, France |
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| 11:50 | 20mn | FEA Study on the Electrical Interconnects of a Power QFN Package Erwin Ian V. Almagro, Benjie B. Hornales, Marvin R. Gestole, Fairchild Semiconductor, Cebu, Philippines |
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| 12:10 | 20mn | Modelling of Metal Degradation in Power Devices under Active Cycling Conditions Werner Kanert 1, Reinhard Pufall 1, Olaf Wittler 2, Rainer Dudek 3, Mohamed Bouazza 2 1 Infineon Technologies, Neubiberg, Germany 2 Fraunhofer IZM, Berlin, Germany 3 Fraunhofer IZM, Chemnitz, Germany |
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| 12:30 | 20mn | Electro-Thermal Analysis of the Insulated Gate Bipolar Transistor Module Subjected to Power Cycling Test Using Specified Boundary Condition Technology Shih-Ying Chiang 1, Tuan-Yu Hung 1, Hsien-Chih Ou 2, Kuo-Ning Chiang 1 1 National Tsing Hua University, Taiwan 2 DELTA Electronic, INC, Taiwan |
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| 12:50 | Lunch |
| 13:49 | ENIAC Session |
| 13:50 | Public-Private Partnerships Sustaining the European Competitivness in Semiconductors; Dr. Andreas Wild, Executive Director, ENIAC Joint Undertaking |
| 14:00 | e3CAR : creating the next generation components for the electric vehicle R. John, Infineon |
| 14:30 | SE2A : increasing the safety and efficiency of automobiles using affordable sensors and electronics S. Gielen, TNO |
| 15:00 | ESiP : ensuring the quality of System-in-Packages K. Pressel, Infineon AG |
| 15:30 | CSSL : affordable solid-state-lighting for the consumer through cooperation along the value chain R. van Silfhout, Philips Lighting |
| 16:00 | End of conference |
Go to Global conference schedule Technical program
Compiled on Mon, 04 Apr 2011 10:40:34 +0200
