27th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

Warsaw, Poland | April 19 – 22, 2026

Registration is open

 

Attendee Ticket Type Early Bird* (incl. Polish VAT)
Standard (incl. Polish VAT)
Attendees 850.00 € 950.00 €
Presenting Authors**, Committee & IEEE Members
750.00 € 850.00 €
PhD Students*** 600.00 € 700.00 €
MSC/BSC Students*** 450.00 € 550.00 €
Professional Development Course 80.00 € 100.00 €
Professional Development Course for Students (for Bachelor’s, Master’s and PhD Students) free
25.00 €
Additional Conference Dinner Ticket for Accompanying Persons 80.00 € 80.00 €


All fees include Polish VAT.
Fees cover access to all sessions, the exhibition, the welcome reception, the conference dinner and the conference proceedings.

* The early bird phase ends on January 30th, 2026.
** For each accepted paper one person from the group of authors will have to register at the author rate or as a PhD student.
*** The student fee is available for Bachelor and Master students. PhD Students must choose the “PhD Students” fee during registration. The conference dinner is included in all student registrations.