27th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

Warsaw, Poland | April 19 – 22, 2026

EuroSimE Sponsors 2025

Committee

Steering Committee

Global Chair:

Willem van Driel (Signify / TU Delft, The Netherlands)

Program Chair:

Michiel van Soestbergen (NXP, The Netherlands)

Local Chairs:

  • Tomasz Bieniek (Łukasiewicz – IMiF, Poland)
  • Grzegorz Janczyk (Łukasiewicz – IMiF, Poland)

Emeritus Chair:

Vincenzo Vinciguerra (STMicroelectronics Catania, Italy)

Technical Program Committee:

  • Kouchi Zhang (TU Delft, The Netherlands) | Keynotes
  • Bart Vandevelde (IMEC, Belgium) | ThermoMechanical track (TM)
  • Véronique Rochus (IMEC, Belgium) | MultiPhysics track (MP)
  • Peter Rodgers (The Petroleum Institutes, UAE) | ThermoFluidics track (TF)
  • Mike Röllig (Fraunhofer Institute IKTS, Germany) | Posters
  • Przemyslaw Gromala (Robert Bosch GmbH, Germany) | Keynotes
  • Wilson Maia (Thales, France) | ThermoMechanical track (TM)
  • Gabrielle Schrag (TU Munchen, Germany) | MultiPhysics track (MP)
  • Miquel Vellvehi (CNM, Spain) | ThermoFluidics track (TF)

Short Courses Committee:

  • Roseanne Duca (STMicroelectronics, Malta)
  • Rainer Dudek, (Fraunhofer Institute ENAS, Germany)

Journals Committee:

  • Przemyslaw Gromala (Robert Bosch GmbH, Germany)
  • Jiajie Fan (Fudan University, China)
  • Alberto Corigliano (Politecnico di Milano, Italy)

Exhibition Committee:

Martin Niessner (Infineon, Germany)

Communication Committee:

open

Award Committee

Sven Rzepka (Fraunhofer Institute ENAS, Germany)

Production and organization:

Martina Creutzfeldt (mcc Agentur für Kommunikation, Germany)

Technical Committee

 

Multi-physics track

  • Alberto Corigliano (Politecnico di Milano, Italy)
  • Ariane Tomas (IMS Université Bordeaux, France)
  • Chris Bailey (ASU, USA)
  • Fabrice Casset (CEA-Leti, Univ. Grenoble Alpes, France)
  • Jose-Antonio Plaza (CSIC, Spain)
  • Romain Liechti (CEA/LETI, France)
  • Michel Lenczner (Uni, France)
  • Stoyan Stoyanov (Greenwich, UK)
  • Tamara Bechtold (Jade University of Applied Sciences, Germany)
  • Xuejun Fan (Lamar University, USA)
  • Zhen Cui (Qualcomm, The Netherlands)

Thermo-mechanical track

  • Abhijit Dasgupta (University of Maryland, USA)
  • Alexandru Prisacaru (Robert Bosch GmbH, Germany)
  • Ali Mazloum-Nejadari (Infineon, Germany)
  • Anton Chernyakov
  • Bernhard Wunderle (Fraunhofer Institute ENAS, Germany)
  • Binh Nguyen (University Duisburg Essen, Germany)
  • Cadmus Yuan (Feng Chia University, Taiwan)
  • Emad Poshtan (Bosch, Germany)
  • Fengze Hou (Institute of Microelectronics of the Chinese Academy of Sciences, China)
  • Florian Schindler-Saefkow
  • Georg Reuther (Infineon, Germany)
  • Goran Pecanac (Bosch, Germany)
  • Hélène Frémont (IMS Université Bordeaux, France)
  • Huaiyu Ye (TU Delft, NL)
  • Ingrid Maus (Infineon, Germany)
  • Jan Albrecht (Fraunhofer, DE)
  • Julia Zündel (AT&S, Austria)
  • Jürgen Auersperg (Fraunhofer, Germany)
  • Jürgen Keller (AMIC, Germany)
  • Kamble Vikram Gourishankar (AT&S, Austria)
  • Karlheinz Bock (TU DresGermanyn, Germany)
  • Karsten Meier (TU Dresden, Germany)
  • Kirsten Weide-Zaage (IMS Hannover University, Germany)
  • Kuo-Ning Chiang (Taiwan University, RPChina)
  • Leo Svenningsson (RISE, Sweden)
  • Marco Rovitto (STMicroelectronics, Italy)
  • Marius van Dijk (Fraunhofer Institute IZM, Germany)
  • Markus Leicht (Vitesco)
  • Mohamed Boutaleb (STMicroelectronics, France)
  • Muyuan Li (AMS Osram, Germany)
  • Ole Hölck (Fraunhofer, Germany)
  • Daniel Losbichler (Bosch Reutlingen)
  • Paresh Limaye (Imec, Berlgium)
  • Peter Fuchs (PCCL, Austria)
  • Pradeep Lall (Auburn University, USA)
  • Robert Schwerz (FhG IKTS, Germany)
  • Rainer Dudek, (Fraunhofer Institute ENAS, Germany)
  • Ross Wilcoxon (Collins, USA)
  • Sander Gielen (ASML, NL)
  • Sau Koh, (Huawei, China)
  • Sergey Ananiev (Infineon, Germany)
  • Steffen Wiese (Saarland University, Germany)
  • Sven Rzepka (Fraunhofer Institute ENAS, Germany)
  • Youssef Maniar (Bosch Renningen)
  • Thomas Krivec (ATS, Austria)
  • Tobias Horn (Fraunhofer Institute ENAS, Germany)
  • Veronique Rochus (imec, Berlgium)
  • Vincenzo Vinciguerra (STMicroelectronics Catania, Italy)
  • Wilson Maia (Thales, France)
  • Yi Zhang (Hong Kong University of Science and Technology, China
  • Xiao Hu (TU Delft, The Netherlands)

Thermo-fluidics track

  • Ali Mazloum-Nejadari (Infineon, Germany)
  • Clemens Lasance (Retired, The Netherlands)
  • Christine Roucoules (Valeo Lighting System, France)
  • Fabrice Roqueta (STMicroelectronics, France)
  • Geneviève Martin (ASML, NL)
  • Haibo Fan (Nexperia, Hong Kong)
  • Jiajie Fan (Fudan University, China)
  • Julia Zündel (ATS, Austria)
  • Marcin Janicki (Lodz University, Poland)
  • Marta Rencz (Uni Budapest, Hungary)
  • Miquel Vellvehi (CSIC, Spain)
  • Mohamad Abo Ras (Nanontest, Germany)
  • Valérie Eveloy (Khalifa University of Science & Technology, UAE)
  • Xavier Perpinyà (CSIC, Spain)