Short Courses

This course explores the critical role of thermal management and packaging in advancing Artificial Intelligence (AI) and High‑Performance Computing (HPC). It addresses current and emerging challenges through state‑of‑the‑art thermo‑mechanical solutions supported by recent IEEE publications and industry developments. Participants will examine the Heterogeneous Integration Roadmap (HIR) and Advanced Packaging Technologies (MAPT), and learn the Seven Principles shaping next‑generation thermal architectures. Key topics include first‑ and second‑line cooling, direct liquid cooling, immersion cooling, microfluidics, and methods for managing thermal loads beyond 1 kW. Practical examples highlight how to decouple mechanical tolerances while optimizing system‑level thermal performance. The course also covers manufacturing, assembly, and reliability considerations from both package and system perspectives. Designed for thermal, mechanical, reliability, and assembly engineers, it offers interactive discussions and hands‑on insights that can be applied directly to modern AI and HPC system design.

Fan-out wafer and panel-level packaging (FO-WLP/-PLP) technologies have emerged as key enablers for advanced semiconductor integration, offering high I/O density, improved electrical performance, and cost efficiency. However, one of the most critical challenges in these processes is warpage, which occurs due to complex thermo-mechanical interactions and other shrinkage effects during molding, redistribution layer (RDL) formation and assembly. Excessive warpage and die shift can lead to yield loss, reliability issues, and assembly misalignment.

This tutorial provides a comprehensive overview of warpage modelling methodologies for FO-WLP and -PLP processes. It covers fundamental principles of thermo-mechanical behaviour, material property characterization, and process-induced stress evolution. Both analytical and numerical approaches, including finite element modelling (FEM), will be discussed, along with strategies for model calibration and validation using experimental data. Practical case studies will illustrate how predictive modelling can guide design optimization, material selection, and process control to mitigate warpage risks.

Sensors are everywhere! They create data and provide the “food” for the Internet of Things. Which specific requirements distinguish MEMS and sensor packaging from standard assembly? How are these challenges being tackled? Do we need advanced packaging technologies for MEMS? These and more questions will be addressed in the course. From a general introduction into package platforms, we will derive MEMS-specific challenges – e. g. the need for low package induced stress and its impact to MEMS performance, the necessity to create cavities or the implementation of MEMS-specific package materials and processes. The course reviews the state of the art and will be dominated by case studies comprising pressure and impact sensors, microphones, mirrors, magnetic sensors and Radar devices. A further section elaborates on robustness requirements and approaches for risk mitigation in harsh environments.
How does MEMS- and sensor packaging fit into the AI-dominated world of “Advanced Packaging”? Case studies comprise the integration of MEMS-microphones or RF-antennas into Fan-Out-Wafer-Level-Packages. An open discussion on the future of MEMS- and sensor packaging will be appreciated.

This interactive course combines theory with real-world cases and discussions to provide a hands-on learning experience. Led by a instructor with over 25 years of expertise, it covers major and minor field incidents. Participants will learn to manage and prevent issues using the 8D Problem-Solving process and Failure Mode and Effects Analysis (FMEA). These tools help tackle product and process issues, foster continuous improvement, and proactively mitigate risks. Attendees will explore the eight steps of 8D, focusing on identifying, resolving, and preventing recurring problems, forming cross-functional teams, conducting root cause analysis, and implementing corrective actions. Additionally, the course provides insights into identifying failure modes, assessing their impact, and reducing risks in product design and manufacturing. Ideal for professionals in quality management, product design, manufacturing, engineering, and operations, it’s especially valuable for those handling customer complaints or improving product reliability.