27th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

Warsaw, Poland | April 19 – 22, 2026

Abstract Submission

Abstract submission through ConfTool is closed.

Download Call for Papers

Download Abstract Template

Please upload your abstract here:
https://www.conftool.org/eurosime2026

Important Dates

Deadline abstract submission: extended until November 11, 2025

Notification of acceptance: December 19, 2025

Submission of full paper for proceedings: March 9, 2026

Full Paper Submission

All authors have been informed about the acceptance of their abstracts. The submission of a full paper is required for all presenters, both oral and poster. The recommended length is 5-8 pages. The papers will be distributed in time for the conference.

The deadline for the submission of the camera-ready full papers is March 9, 2026.

Please note that we are using the standard IEEE paper template, it can be downloaded below both in docx- and in Latex-format.

Downloads

Word – Template: Download here (.docx/30 KB)

Latex – Template: Download here (.zip/759 KB)

Please upload your full paper here:
https://www.conftool.org/eurosime2026

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

You need to submit your full paper in pdf format. Please make sure to use the IEEE paper template provided on this page. All full papers must go through the IEEE PDF eXpress Checker before being submitted via ConfTool. The conference ID for the IEEE PDF eXpress checker is 69483X. While you are uploading your camera-ready paper to ConfTool, you will also be asked to identify the presenting author and to provide a short bio of him or her.


Contact
In case you experience any problems with the submission process, please contact us at office@eurosime.org.