Abstract Submission
Abstract submission through ConfTool will open in September 2025.
Important Dates
Deadline abstract submission: November 4, 2025
Notification of acceptance: December 19, 2025
Submission of full paper for proceedings: March 9, 2026
Topics
Single domain simulation
- Thermal, mechanical, thermo-mechanical, vibration, shock
- Chip package board interaction
- Advanced numerical and analytical simulations methodologies and tools
- Compact Modelling & Model Order Reduction
- Digital twins
- Advanced thermal management concepts
Material characterization and validation
- Material characterization, experiments and modelling
- Bulk and interface toughness, characterization and modeling
- Experimental methods for validation of simulation models
- Failure analysis and failure mode extraction
- Failure criteria and damage modelling for reliability prediction
Application domains
- Electronic components, packaging and system integration for applications including aerospace, automotive, energy, lighting
and medical. - MEMS sensors & actuators, piezoelectric, piezoresistive, functional ceramic sensors and components
- Opto-electronic & opto-mechanical devices
- Nano-electronic mechanical devices
- Consumer electronics
Multi-physics simulation
- Multi-physics simulation (MEMS, manufacturing and process models, electronic control unit/system level, fluid structure
interactions) - Multi-scale modelling and simulation
- Integrated process modelling
- Simulation-based optimization, virtual prototyping and prequalification in product and process design
- Simulations for heterogeneous integration
Emerging modeling methods and tools
- Prognostics and Health Management (PHM)
- Development and implementation of artificial intelligence and machine learning
- Use of big data in simulation & reliability applications
- 3D packaging, TSV technology, heterogenuous integraton, chiplet packaging
- Additive manufacturing (3D printing) for electronics