27th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

Warsaw, Poland | April 19 – 22, 2026

EuroSimE Sponsors 2025

Abstract Submission

Abstract submission through ConfTool will open in September 2025.

Download Call for Papers

Important Dates

Deadline abstract submission: November 4, 2025

Notification of acceptance: December 19, 2025

Submission of full paper for proceedings: March 9, 2026

Topics

Single domain simulation

  • Thermal, mechanical, thermo-mechanical, vibration, shock
  • Chip package board interaction
  • Advanced numerical and analytical simulations methodologies and tools
  • Compact Modelling & Model Order Reduction
  • Digital twins
  • Advanced thermal management concepts

Material characterization and validation

  • Material characterization, experiments and modelling
  • Bulk and interface toughness, characterization and modeling
  • Experimental methods for validation of simulation models
  • Failure analysis and failure mode extraction
  • Failure criteria and damage modelling for reliability prediction

Application domains

  • Electronic components, packaging and system integration for applications including aerospace, automotive, energy, lighting
    and medical.
  • MEMS sensors & actuators, piezoelectric, piezoresistive, functional ceramic sensors and components
  • Opto-electronic & opto-mechanical devices
  • Nano-electronic mechanical devices
  • Consumer electronics

Multi-physics simulation

  • Multi-physics simulation (MEMS, manufacturing and process models, electronic control unit/system level, fluid structure
    interactions)
  • Multi-scale modelling and simulation
  • Integrated process modelling
  • Simulation-based optimization, virtual prototyping and prequalification in product and process design
  • Simulations for heterogeneous integration

Emerging modeling methods and tools

  • Prognostics and Health Management (PHM)
  • Development and implementation of artificial intelligence and machine learning
  • Use of big data in simulation & reliability applications
  • 3D packaging, TSV technology, heterogenuous integraton, chiplet packaging
  • Additive manufacturing (3D printing) for electronics