27th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

Warsaw, Poland | April 19 – 22, 2026

EuroSimE Sponsors 2025

Sponsorship Opportunities

EuroSimE is an established international and IEEE listed conference with worldwide recognition, attended by leading experts from both industry and academia working on Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems. EuroSimE is a collaboration and networking platform with dedicated sessions on funded projects and roadmaps for the future microelectronic products (e.g. Heterogenous Integration Roadmap)

WE OFFER STANDARD PACKAGES OF VARIOUS SIZES

CONTACT US FOR INDIVIDUAL SPONSORSHIP PACKAGES

TAILORED MARKETING COLLABORATION: 2000 €+

Please contact the EuroSimE Sponsoring Committee regarding marketing collaborations that are not
covered by the standard EuroSimE sponsorship packages.

WHAT ARE THE BENEFITS FOR YOUR COMPANY?

WHY SPONSOR THE EUROSIME CONFERENCE?

  • Generate awareness of your company, products, and services
  • Establish a strong leadership position for your company
  • Build a network with leaders in the microelectronics industry and academia
  • Promote your company’s latest technology and build partnerships
  • Build knowledge and expertise
  • Create opportunities and develop your business through meaningful connections with other participants

Download

EuroSimE 2026 Sponsorship Opportunities

Martina Creutzfeldt
Financial organizer

office@eurosime.org

Przemyslaw Gromala
Sponsorship chair

pgromala@ieee.org

Martin Niessner
Sponsorship co-chair

martin.niessner@infineon.com

Michiel van Soestbergen
Program Chair

michiel.van.soestbergen@nxp.com

EuroSime 2025 Sponsors