28th International Conference on Thermal, Mechanical and Multiphysics
Simulation and Experiments in Microelectronics and Microsystems
Regensburg, Germany | April 11 – 14, 2027
Technical Sponsorship
Technical Sponsorship
Platinum Supporter
Gold Supporter
Silver Supporter
Silver Supporter
Silver Supporter
Bronze Supporter
Exhibitor
Exhibitor
Exhibitor
Exhibitor
Exhibitor
