Abstract Submission
Abstract submission through ConfTool will open in July 2027
Important Dates
Deadline abstract submission: October 26, 2026
Notification of acceptance: December 17, 2026
Submission of full paper for proceedings: March 2, 2027
28th International Conference on Thermal, Mechanical and Multiphysics
Simulation and Experiments in Microelectronics and Microsystems
Regensburg, Germany | April 11 – 14, 2027
Technical Sponsorship
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