28th International Conference on Thermal, Mechanical and Multiphysics
Simulation and Experiments in Microelectronics and Microsystems

Regensburg, Germany | April 11 – 14, 2027

Supporters of EuroSimE 2027

Registration is open

 

Attendee Ticket Type Early Bird* (incl. German VAT)
Standard (incl. German VAT)
Attendees 850.00 € 950.00 €
Presenting Authors**, Committee & IEEE Members
750.00 € 850.00 €
MSC/BSC Students*** 450.00 € 550.00 €
Professional Development Course 80.00 € 100.00 €
Additional Conference Dinner Ticket for Accompanying Persons 85.00 € 85.00 €


All fees include German VAT.
Fees cover access to all sessions, the exhibition, the welcome reception, the conference dinner and the conference proceedings.

* The early bird phase ends on January 25, 2027.
** For each accepted paper one person from the group of authors will have to register at the author rate.
*** The student rate applies to Bachelor’s and Master’s students only. The conference dinner is included in all student registrations.