EuroSimE 2026

27th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

Warsaw, Poland | April 19 – 22, 2026

Warpage Modelling and Validation in Fan-out Wafer/Panel Level Packaging and Assembly Processes

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  • File Size 7.99 MB
  • Create Date April 15, 2026
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