Impressions from EuroSimE 2026

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©Rajfoto

Our congratulations go to all the award winners!

OUTSTANDING POSTER AWARD 2026
Design and Optimization of MEMS Variable-Area Capacitive Pressure Sensors for Improved Sensitivity and Linearity in Fingertip Tactile Sensing

Rhiyan Mae Ladlad, Jarod Soriano, Walton Matthew Kuo, Ralph Maru Grande, Rafael Pangilinan, Maria Theresa De Leon
University of the Philippines, Philippines

OUTSTANDING POSTER AWARD 2026
Thermal Cycling Lifetime of BGA Microcontroller Package and Influence of Assembly on Aluminum Baseplates

Iulia-Eliza Tinca, Florian Pielmeier, Martin Niessner, Paola Altieri-Weimar, Sophia Stautner, Mario Soric
Infineon Technologies AG, Germany

BEST POSTER AWARD 2026
Liquid-assisted Contactless Adhesive Bonding: Experimental Validation and 2D Multiphysics Simulations

Ahmed Abdelwahab¹, Zohreh Farmani², Hans Kuipers³, Marcel Tichem², Jiajie Fan¹, G. Q. Zhang^1
1ECTM, Delft University of Technology, The Netherlands; ²PME, Delft University of Technology, The Netherlands; ³ITEC Equipment, The Netherlands

OUTSTANDING PAPER AWARD 2026
High-performance and Scalable DG-SEM Modeling of Large PMUT Arrays for Biomedical Imaging

Michelangelo Gabriele Garroni¹ , Omer Mohamed Osman Abdalla², Edoardo Moretti², Alberto Corigliano², Attilio Frangi², Domenico Giusti³, Alessandro Stuart Savoia⁴, Paola Antonietti¹, Nicola Parolini¹, Ilario Mazzieri^1
1MOX, Dipartimento di Matematica, Politecnico di Milano, Italy; ²Department of Civil and Environmental Engineering, Politecnico di Milano, Italy.; ³STMicroelectronics Agrate, Italy; ⁴Università degli Studi Roma Tre, Italy

BEST PAPER AWARD 2026
Compact Thermal RC Model of a Multi Die Power Stage with In-package Sensing for Remaining Useful Life Prediction

Ole J. Bergmann¹, Henk van Zeijl1, Willem van Driel¹, Guoqi Zhang¹, René H. Poelma^1,2
1Department of Microelectronics, Delft University of Technology, The Netherlands; ²Nexperia BV, The Netherlands