25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
EuroSimE Catania was the most successful of its 25-year life with 190 attendants. All papers are available on IEEE Xplore.
See final programme
See programme of short courses
Freely get the slides of the course given by H. Baumgärtl, M. Feuchter, M. Hanke of CADFEM:
2024 sponsors and exhibitors
MDPI 
STMicroelectronics 
ANSYS Italia Exhibitor manual and Sponsorship brochure
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Microelectronics Reliability | Special issue for EuroSimE 2021 | ScienceDirect.com by Elsevier
Technical sponsorship from 
