**108** effective visitors

**185** views of list of attendants

**56** downloads of proceedings PDF book

**126** downloads of proceedings Zip

**124** downloads of individual PDF manuscripts

**86** views of videos (more than half duration, or cursor set after half duration)

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**3** posts to chats (including answers)

PID 19 : 49x (2.3%) Ange ATINTOH — Characterization of the mechanical behavior of a Printed Cir...

PID 35 : 48x (2.2%) D. May — Tilt- and warpage measurement of bonded dies as an inline qu...

PID 5 : 47x (2.2%) Rika Berger — Relevance evaluation of solder joints attributes to reduce t...

PID 3 : 44x (2.1%) Mario Gschwandl — Electro-Thermo-Mechanical Reliability Assessment of Arbitrar...

PID 40 : 44x (2.1%) Abhijit Dasgupta — Effects of Anisotropic Viscoplasticity on SAC305 Solder Join...

PID 67 : 43x (2.0%) Jiajie Fan — Viscoplastic constitutive modeling of sintered nano-silver p...

PID 28 : 43x (2.0%) Alexander Kozlov — Effect of a Bragg Acoustic Reflector on Thermal Processes in...

PID 55 : 42x (2.0%) Valentina Osipova — Using AFM Measurements for Failure Indication During High-Cy...

PID 8 : 40x (1.9%) Daniel Riegel — Analysis of the stress state in QFN package during four bend...

PID 82 : 39x (1.8%) Przemyslaw Gromala — Digital twins for modelling and simulation...

PID 50 : 39x (1.8%) Alessandro Sitta — Thermo-mechanical finite element simulation and visco-plasti...

PID 16 : 36x (1.7%) Anu Mathew — Lifetime modelling of sintered silver interconnected power d...

PID 18 : 36x (1.7%) Jonas Gleichauf — Test Screening of Solder Joints Under Combined Cyclic Therma...

PID 72 : 36x (1.7%) Ross Wilcoxon — Trade-offs in Electronics Reliability: meeting thermal and s...

PID 64 : 35x (1.6%) Mirko Hofmann — Simulations in the MEMS design process...

PID 27 : 35x (1.6%) Roland Niemeier — Reliability Analysis of a RF Product with Improved Quality f...

PID 53 : 34x (1.6%) Nathanael Jöhrmann — Simulations for nanoindentation on thin metal films and the ...

PID 75 : 34x (1.6%) Klaus Pressel — Impact of thermal-mechanical modelling and simulation for th...

PID 42 : 34x (1.6%) Robert Schwerz — Optical Deformation Measurement for Validation of Thermo-Me...

PID 45 : 34x (1.6%) Uwe Zschenderlein — Dynamical characterisation of a miniaturised bulge tester fo...

PID 10 : 33x (1.5%) Willem Dirk Van Driel — Reliability of LED-based Systems...

PID 66 : 33x (1.5%) Georg Reuther — Determining adhesion of critical interfaces in microelectron...

PID 33 : 33x (1.5%) Freerik Forndran — A Parametric Simulative Study for Lifetime Prediction of Sin...

PID 59 : 33x (1.5%) Amirul Afripin — Finite Element Analysis of Copper Pillar Interconnect Stress...

PID 31 : 32x (1.5%) Haosu Huai — Evaluating Local Delamination of Power Electronic Devices th...

PID 13 : 32x (1.5%) — Robust Package Study for A Power Package by Simulation...

PID 49 : 32x (1.5%) Erik Wiss — Concept of a Mechanical Test Setup for Packaging Materials U...

PID 39 : 32x (1.5%) Julia Zündel — Characterization of prepreg shrinkage and investigation of i...

PID 46 : 31x (1.5%) Mehrdad Shaygi — Finite element-based lifetime modeling of SAC solder joints ...

PID 61 : 31x (1.5%) Alexandru Prisacaru — Oxidation of the Molding Compound identification using piezo...

PID 4 : 30x (1.4%) Christian Schipfer — Prediction of Curing Induced Residual Stresses in Polymeric ...

PID 22 : 30x (1.4%) Dr. Abhijit Dasgupta — Model-Based Quantification of Variability of Mechanical Cycl...

PID 6 : 30x (1.4%) Fosca Conti — Simulations and Experiments to Analyze Stress Phenomena in S...

PID 32 : 29x (1.4%) Marius van Dijk — Study on FO-WLP Warpage Behavior – Influence of Process Te...

PID 7 : 29x (1.4%) Philipp Adler — Time-based Reliability Analysis of Electrolytic Capacitors f...

PID 63 : 28x (1.3%) Ercan M. Dede — Simulation-based design and optimization for future mobility...

PID 12 : 28x (1.3%) Weidong Xie — Modified Norris-Landzberg Model for Reliability of Pb-free B...

PID 48 : 28x (1.3%) Rainer Dudek — Studies on Thermo-Mechanical Reliability of High Performance...

PID 43 : 28x (1.3%) Kento Kariya — Numerical and Experimental Study on Determination Method of ...

PID 30 : 27x (1.3%) Piotr Zając — Comparison of cooling performance of manifold and straight m...

PID 51 : 27x (1.3%) Alessandro Sitta — Paralleling Silicon Carbide MOSFETs in Power Module for Trac...

PID 57 : 27x (1.3%) Vincenzo Vinciguerra — On the Way to understand the Warpage in 8” Taiko Semicondu...

PID 36 : 26x (1.2%) S. Panahandeh — Infrared thermal imaging as inline quality assessment tool...

PID 77 : 26x (1.2%) Karsten Meier — Analysis of Design Parameter Effects on the Board Level Reli...

PID 20 : 25x (1.2%) Antonio Pappaterra — Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Co...

PID 26 : 25x (1.2%) Olaf Wittler — On the Influence of Ball Size and Geometry on the Reliabilit...

PID 78 : 25x (1.2%) Marco Del Sarto — Thermomechanical deformation characterization for full-molde...

PID 29 : 24x (1.1%) Aldo Ghisi — Failure of MEMS microphones during impact tests: the role of...

PID 17 : 24x (1.1%) Kaushal Arun Pareek — Towards data driven failure analysis using infrared thermogr...

PID 73 : 24x (1.1%) Yogendra Joshi — Thermal/fluid modeling of high heat flux power and microproc...

PID 76 : 24x (1.1%) Germano Galasso — T-dependent chip bow and solder process simulation...

PID 79 : 24x (1.1%) I.C. Albayrak — Measurement and simulation of nitride stress liners for stra...

PID 65 : 23x (1.1%) Simon Schlipf — IC package related stress effects on the characteristics of ...

PID 18 : 8x (9.3%) Jonas Gleichauf — Test Screening of Solder Joints Under Combined Cyclic Therma...

PID 39 : 7x (8.1%) Julia Zündel — Characterization of prepreg shrinkage and investigation of i...

PID 53 : 7x (8.1%) Nathanael Jöhrmann — Simulations for nanoindentation on thin metal films and the ...

PID 55 : 7x (8.1%) Valentina Osipova — Using AFM Measurements for Failure Indication During High-Cy...

PID 31 : 6x (7.0%) Haosu Huai — Evaluating Local Delamination of Power Electronic Devices th...

PID 5 : 6x (7.0%) Rika Berger — Relevance evaluation of solder joints attributes to reduce t...

PID 57 : 6x (7.0%) Vincenzo Vinciguerra — On the Way to understand the Warpage in 8” Taiko Semicondu...

PID 26 : 5x (5.8%) Olaf Wittler — On the Influence of Ball Size and Geometry on the Reliabilit...

PID 42 : 4x (4.7%) Robert Schwerz — Optical Deformation Measurement for Validation of Thermo-Me...

PID 43 : 4x (4.7%) Kento Kariya — Numerical and Experimental Study on Determination Method of ...

PID 8 : 7x (5.6%) Daniel Riegel — Analysis of the stress state in QFN package during four bend...

PID 16 : 6x (4.8%) Anu Mathew — Lifetime modelling of sintered silver interconnected power d...

PID 29 : 6x (4.8%) Aldo Ghisi — Failure of MEMS microphones during impact tests: the role of...

PID 59 : 6x (4.8%) Amirul Afripin — Finite Element Analysis of Copper Pillar Interconnect Stress...

PID 33 : 5x (4.0%) Freerik Forndran — A Parametric Simulative Study for Lifetime Prediction of Sin...

PID 67 : 5x (4.0%) Jiajie Fan — Viscoplastic constitutive modeling of sintered nano-silver p...

PID 37 : 4x (3.2%) Majid Tavakolibasti — Thermo-mechanical-optical coupling within a digital twin dev...

PID 40 : 4x (3.2%) Abhijit Dasgupta — Effects of Anisotropic Viscoplasticity on SAC305 Solder Join...

PID 45 : 4x (3.2%) Uwe Zschenderlein — Dynamical characterisation of a miniaturised bulge tester fo...

PID 48 : 4x (3.2%) Rainer Dudek — Studies on Thermo-Mechanical Reliability of High Performance...

PID 58 : 4x (3.2%) Vincenzo Vinciguerra — Weibull Analysis of Failure Strength and Flexural Modulus in...

PID 14 : 3x (2.4%) Jun-Han Han — Thermal Analysis of Microchamber Cooling for Processing-in-M...

PID 38 : 3x (2.4%) Péter Pálovics — Comparison of different models of magnetic nanoparticle aggr...

PID 17 : 3x (2.4%) Kaushal Arun Pareek — Towards data driven failure analysis using infrared thermogr...

PID 22 : 3x (2.4%) Dr. Abhijit Dasgupta — Model-Based Quantification of Variability of Mechanical Cycl...

PID 3 : 3x (2.4%) Mario Gschwandl — Electro-Thermo-Mechanical Reliability Assessment of Arbitrar...

PID 5 : 3x (2.4%) Rika Berger — Relevance evaluation of solder joints attributes to reduce t...

PID 61 : 3x (2.4%) Alexandru Prisacaru — Oxidation of the Molding Compound identification using piezo...

PID 35 : 3x (2.4%) D. May — Tilt- and warpage measurement of bonded dies as an inline qu...

PID 12 : 3x (2.4%) Weidong Xie — Modified Norris-Landzberg Model for Reliability of Pb-free B...