Basic usages of the virtual on-demand space April 19 — May 15
392 effective visitors
1608 views of list of attendants
183 downloads of proceedings PDF book
301 downloads of proceedings Zip
1875 downloads of individual PDF manuscripts
86 views of videos (more than half duration, or cursor set after half duration)
2136 accesses to virtual rooms
3 posts to chats (including answers)
Most visited Virtual Rooms among 2136 visits
PID 62 : 72x (3.4%) Roland Niemeier — Robust Design Optimization for Failure Analysis...
PID 19 : 49x (2.3%) Junghoon Kim — A Study on the Development of Random Vibration Reliability S...
PID 35 : 48x (2.2%) M. Frewein — Investigation of the effects of moisture expansion of glass ...
PID 5 : 47x (2.2%) Zichuan Li — Warpage deformation analysis of AMB ceramic substrates in po...
PID 3 : 44x (2.1%) Christine Roucoules — Accurate reduced order model thermal simulations for DC/DC d...
PID 40 : 44x (2.1%) Yusuf Burak Ozdemir — Predictive Modeling of Thin Film Yield Stress Using Machine ...
PID 67 : 43x (2.0%) —
PID 28 : 43x (2.0%) Ugur Çelik — Technical Design and Simulation of MEMS Scanner Based on Pie...
PID 55 : 42x (2.0%) Adwait Inamdar — ROM-FOM Interface Optimization for Efficient Thermomechanica...
PID 8 : 40x (1.9%) —
PID 82 : 39x (1.8%) Ludovica Longo — Finite Element Methodology for Estimating Joule Heating in S...
PID 50 : 39x (1.8%) Darshankumar Bhat — Application oriented On-The-Edge Capable Prognostic and Heal...
PID 16 : 36x (1.7%) Daniela Spini — A Comprehensive Thermo-Mechanical Characterization of Organi...
PID 18 : 36x (1.7%) Hendrik Schmidt — Concept for a simulation-based reliability assessment at the...
PID 72 : 36x (1.7%) Pradeep Lall — Assessment of Competing Risk-of-Failure in FCBGA Interfaces ...
PID 27 : 35x (1.6%) Théotime GOUBAULT — Development of a friction modulation haptic interface based ...
PID 64 : 35x (1.6%) —
PID 53 : 34x (1.6%) —
PID 75 : 34x (1.6%) Ralph Maru Grande — Comparative Modeling of Four-Ended, Modified Four-Ended, and...
PID 42 : 34x (1.6%) Mohd Zubair Akhtar — LEDs Lifetime Prediction Modelling: Thermomechanical Simulat...
PID 45 : 34x (1.6%) Mehdi Ghrabli — Hybrid modeling for remaining useful life prediction in powe...
PID 66 : 33x (1.5%) N’Doua Luc Arnaud Kakou — Thermal multiscale simulation of a FO-WLP SiP including a Ga...
PID 33 : 33x (1.5%) Ying-Ju Chen — Study on the feasible mesh size control method for WLP 3D fi...
PID 59 : 33x (1.5%) Silvia Simone — Equivalent skin effect model for time-domain analysis starti...
PID 10 : 33x (1.5%) Zichuan Li — Investigating Sintering Process and Mechanical Properties of...
PID 31 : 32x (1.5%) Yen-Chuan Chen — Warpage Estimation of Panel-Level Packaging by AI-assisted D...
PID 13 : 32x (1.5%) Fengze Hou — Sintering Mechanism Analysis of Cu Nanoparticles via Molecul...
PID 49 : 32x (1.5%) Ralph Schacht — Multi-purpose Thermal Test Vehicle for Experimental Investig...
PID 39 : 32x (1.5%) Pan Liu — Molecular Dynamics Simulation Study of Interface Material in...
PID 61 : 31x (1.5%) Jain Chacko — Investigation of an approach for the determination of curren...
PID 46 : 31x (1.5%) Xiao Hu — Sintering Process Simulation of Ag Nanoparticles by Phase Fi...
PID 4 : 30x (1.4%) Felix Mahr — Optimizing Machine Learning Performance via Data Set Generat...
PID 22 : 30x (1.4%) Leiming Du — Multi-parameters optimization for electromigration in WLCSP ...
PID 6 : 30x (1.4%) Casset — Hybrid PMUT realized using an innovative “Piezo-in-flex”...
PID 32 : 29x (1.4%) Cheng-En Lee — Sensitivity Study of Wafer-Level Packaging Lifetime Predicti...
PID 7 : 29x (1.4%) —
PID 12 : 28x (1.3%) Borja Kilian — Influence of Geometry Effects on Thermo-Mechanical Reliabili...
PID 48 : 28x (1.3%) Na-Yeon Choi — Numerical Evaluation of P-Channel MOSFETs Depending on the T...
PID 43 : 28x (1.3%) —
PID 63 : 28x (1.3%) Hong-Hai Nguyen — Numerical Study on the Correlation between Board-level Drop ...
PID 51 : 27x (1.3%) —
PID 57 : 27x (1.3%) Viktor Dudash — Creep characterization of lead-free solder alloys over an ex...
PID 30 : 27x (1.3%) Hongyu Tang — Effects of natural and thermal oxidation on optical and elec...
PID 36 : 26x (1.2%) Kwan-il Min — Precise Prediction of Sustainable Operating Life of Tantalum...
PID 77 : 26x (1.2%) Freerik Forndran — Modelling Warpage Behavior of Molded Power Modules for Elect...
PID 20 : 25x (1.2%) Wenyu Li — Double-sided heat dissipation numerical modelling of an embe...
PID 26 : 25x (1.2%) Victor MAHAUT — Assessment of the shielding efficiency of FDM-produced conti...
PID 78 : 25x (1.2%) Kevin Talits — Simulation-based Improvement of Analytic Self-inductance for...
PID 17 : 24x (1.1%) Cadmus Yuan — AI-assisted Design for Reliability: Review and Perspectives ...
PID 73 : 24x (1.1%) —
PID 76 : 24x (1.1%) Ariane Tomas — Investigation of different thermomechanical behaviours in on...
PID 79 : 24x (1.1%) Mike Feuchter — Reduced-Order Model for Solder Balls – Potential of projec...
PID 29 : 24x (1.1%) Vincent Sisomseun — Toward measurements of global coefficient of thermal expansi...
PID 65 : 23x (1.1%) Khalil Karrame — Thermal Characterization and Simulation of GaN-on-SiC HEMT T...
Most viewed pre-recorded videos among 86 views
PID 35 : 10x (11.6%) M. Frewein — Investigation of the effects of moisture expansion of glass ...
PID 18 : 8x (9.3%) Hendrik Schmidt — Concept for a simulation-based reliability assessment at the...
PID 39 : 7x (8.1%) Pan Liu — Molecular Dynamics Simulation Study of Interface Material in...
PID 53 : 7x (8.1%) —
PID 55 : 7x (8.1%) Adwait Inamdar — ROM-FOM Interface Optimization for Efficient Thermomechanica...
PID 5 : 6x (7.0%) Zichuan Li — Warpage deformation analysis of AMB ceramic substrates in po...
PID 57 : 6x (7.0%) Viktor Dudash — Creep characterization of lead-free solder alloys over an ex...
PID 31 : 6x (7.0%) Yen-Chuan Chen — Warpage Estimation of Panel-Level Packaging by AI-assisted D...
PID 26 : 5x (5.8%) Victor MAHAUT — Assessment of the shielding efficiency of FDM-produced conti...
PID 42 : 4x (4.7%) Mohd Zubair Akhtar — LEDs Lifetime Prediction Modelling: Thermomechanical Simulat...
PID 43 : 4x (4.7%) —
Most active chats among 3 posts
PID 8 : 2x (66.7%) —
Most downloaded individual manuscripts among 1875 downloads
PID 100 : 34x (1.8%) Stoyan Stoyanov — Physics-informed Machine Learning for Predicting Fatigue Dam...
PID 37 : 33x (1.8%) S.D.M. de Jong — Physics-Informed Machine Learning for Solder Joint Qualifica...
PID 106 : 31x (1.7%) Biagio Schifano — Fast Liquid-to-Liquid Thermal Shock: Experimental Assessment...
PID 54 : 29x (1.5%) Seonho Seok — Fabrication and Analysis of Biaxial Surface Wrinkling of Thi...
PID 59 : 28x (1.5%) Silvia Simone — Equivalent skin effect model for time-domain analysis starti...
PID 4 : 28x (1.5%) Felix Mahr — Optimizing Machine Learning Performance via Data Set Generat...
PID 17 : 27x (1.4%) Cadmus Yuan — AI-assisted Design for Reliability: Review and Perspectives ...
PID 9 : 27x (1.4%) Robert Schwerz — Non-linear viscoelastic Material Models of Polymers for Elec...
PID 63 : 26x (1.4%) Hong-Hai Nguyen — Numerical Study on the Correlation between Board-level Drop ...
PID 16 : 25x (1.3%) Daniela Spini — A Comprehensive Thermo-Mechanical Characterization of Organi...
PID 38 : 24x (1.3%) Pan Liu — Process-based IGBT Modeling with TCAD for Static and Dynamic...
PID 78 : 23x (1.2%) Kevin Talits — Simulation-based Improvement of Analytic Self-inductance for...
PID 71 : 23x (1.2%) Rainer Dudek — Solder Fatigue Analyses and Predictions for PCB Mounted Comp...
PID 24 : 23x (1.2%) Chinmay Nawghane — Effect of potting on the solder joint reliability of QFN pac...
PID 29 : 22x (1.2%) Vincent Sisomseun — Toward measurements of global coefficient of thermal expansi...
PID 45 : 22x (1.2%) Mehdi Ghrabli — Hybrid modeling for remaining useful life prediction in powe...
PID 33 : 22x (1.2%) Ying-Ju Chen — Study on the feasible mesh size control method for WLP 3D fi...
PID 11 : 21x (1.1%) Silvia Tedesco — Package Model for DC-DC Converters Design...
PID 27 : 21x (1.1%) Théotime GOUBAULT — Development of a friction modulation haptic interface based ...
PID 60 : 21x (1.1%) Julia Zündel — Life-time prediction of copper µ-vias based on a stochastic...
PID 19 : 21x (1.1%) Junghoon Kim — A Study on the Development of Random Vibration Reliability S...
PID 35 : 21x (1.1%) M. Frewein — Investigation of the effects of moisture expansion of glass ...
PID 61 : 20x (1.1%) Jain Chacko — Investigation of an approach for the determination of curren...
PID 62 : 20x (1.1%) Roland Niemeier — Robust Design Optimization for Failure Analysis...
PID 30 : 19x (1.0%) Hongyu Tang — Effects of natural and thermal oxidation on optical and elec...
PID 73 : 19x (1.0%) —
PID 42 : 19x (1.0%) Mohd Zubair Akhtar — LEDs Lifetime Prediction Modelling: Thermomechanical Simulat...
PID 58 : 19x (1.0%) H. Friaa — Comparative study of lead-free alloys submitted to thermomec...
PID 3 : 18x (1.0%) Christine Roucoules — Accurate reduced order model thermal simulations for DC/DC d...
PID 72 : 18x (1.0%) Pradeep Lall — Assessment of Competing Risk-of-Failure in FCBGA Interfaces ...
PID 47 : 17x (0.9%) Abhijit Dasgupta — Effect of Aging and Recrystallization on Performance of Olig...
PID 34 : 17x (0.9%) Sylvie Jarjayes — Analysis of the key parameters of box creep process for adva...
PID 22 : 17x (0.9%) Leiming Du — Multi-parameters optimization for electromigration in WLCSP ...
PID 105 : 17x (0.9%) Luca Donetti — Development of a Computational Fluid Dynamics Model to Evalu...
PID 75 : 16x (0.9%) Ralph Maru Grande — Comparative Modeling of Four-Ended, Modified Four-Ended, and...
PID 44 : 16x (0.9%) Vincenzo Vinciguerra — Finite Element Analysis of the Upsurge of Bifurcation during...
PID 1 : 16x (0.9%) Iulia - Eliza Tinca — Predictive Reliability Assessment Workflow for System-Level ...
PID 65 : 16x (0.9%) Khalil Karrame — Thermal Characterization and Simulation of GaN-on-SiC HEMT T...
PID 2 : 16x (0.9%) —
PID 68 : 16x (0.9%) —
PID 5 : 16x (0.9%) Zichuan Li — Warpage deformation analysis of AMB ceramic substrates in po...
PID 102 : 16x (0.9%) Damiano Ricciarelli — Toward a Virtual Design-of-Experiment for Laser Annealing Si...
PID 23 : 16x (0.9%) Vincenzo Vinciguerra — Extension of the Equivalent Thickness Concept to the Bifurca...
PID 55 : 16x (0.9%) Adwait Inamdar — ROM-FOM Interface Optimization for Efficient Thermomechanica...
PID 104 : 16x (0.9%) Mauro Canigliula — Design and Optimization of an MCU-based controller implement...
PID 10 : 16x (0.9%) Zichuan Li — Investigating Sintering Process and Mechanical Properties of...
PID 12 : 15x (0.8%) Borja Kilian — Influence of Geometry Effects on Thermo-Mechanical Reliabili...
PID 18 : 15x (0.8%) Hendrik Schmidt — Concept for a simulation-based reliability assessment at the...
PID 50 : 15x (0.8%) Darshankumar Bhat — Application oriented On-The-Edge Capable Prognostic and Heal...
PID 115 : 15x (0.8%) Arash Mohammadi — Finite Element Simulation of Accelerated Stress Testing and ...
PID 53 : 15x (0.8%) —
PID 8 : 15x (0.8%) —
PID 57 : 15x (0.8%) Viktor Dudash — Creep characterization of lead-free solder alloys over an ex...
PID 26 : 15x (0.8%) Victor MAHAUT — Assessment of the shielding efficiency of FDM-produced conti...
PID 74 : 15x (0.8%) —
PID 28 : 14x (0.7%) Ugur Çelik — Technical Design and Simulation of MEMS Scanner Based on Pie...
PID 76 : 14x (0.7%) Ariane Tomas — Investigation of different thermomechanical behaviours in on...
PID 14 : 14x (0.7%) —
PID 67 : 14x (0.7%) —
PID 36 : 14x (0.7%) Kwan-il Min — Precise Prediction of Sustainable Operating Life of Tantalum...
PID 70 : 14x (0.7%) Michiel van Soestbergen — Thermo-mechanical compact model to simulate solder fatigue o...
PID 7 : 14x (0.7%) —
PID 89 : 14x (0.7%) Fabrice ROQUETA — Numerical strategies for the prediction of patterned wafer w...
PID 43 : 13x (0.7%) —
PID 93 : 13x (0.7%) Daniel Losbichler — Fatigue behavior of aluminum and copper metallization for Si...
PID 13 : 13x (0.7%) Fengze Hou — Sintering Mechanism Analysis of Cu Nanoparticles via Molecul...
PID 46 : 13x (0.7%) Xiao Hu — Sintering Process Simulation of Ag Nanoparticles by Phase Fi...
PID 112 : 13x (0.7%) Bhanu Pratap Singh — Analysis of the Thermo-Mechanical Performance of Double-Side...
PID 64 : 13x (0.7%) —
PID 80 : 13x (0.7%) Cristiano Calabretta — Advanced strategies for high activation in ion implanted 4H-...
PID 114 : 13x (0.7%) Romain Liechti — A Lumped Element model for biaxial MEMS scanners...
PID 66 : 13x (0.7%) N’Doua Luc Arnaud Kakou — Thermal multiscale simulation of a FO-WLP SiP including a Ga...
PID 52 : 13x (0.7%) L. Guarino — Acoustic softening characterization to improve copper wire b...
PID 101 : 13x (0.7%) Shiva Goud Anthati — Bending Experiments on QFN Components...
PID 6 : 13x (0.7%) Casset — Hybrid PMUT realized using an innovative “Piezo-in-flex”...
PID 40 : 13x (0.7%) Yusuf Burak Ozdemir — Predictive Modeling of Thin Film Yield Stress Using Machine ...
PID 56 : 13x (0.7%) Wissam Assaad — An analytical model describing residual stresses in thin die...
PID 121 : 13x (0.7%) Gianluca Massimino — Large Area Flexible Triaxial Force Sensor Array...
PID 127 : 12x (0.6%) Apostol Apostolov — Analysis of parameters influencing delamination in thermo-me...
PID 79 : 12x (0.6%) Mike Feuchter — Reduced-Order Model for Solder Balls – Potential of projec...
PID 49 : 12x (0.6%) Ralph Schacht — Multi-purpose Thermal Test Vehicle for Experimental Investig...
PID 116 : 12x (0.6%) Doaa Mohamed — Enhancing Defect Detection Using Lock In thermography...
PID 90 : 12x (0.6%) Hanna Baumgartl — A new method of model order reduction (MOR) for mechanical n...
PID 123 : 12x (0.6%) Bernhard Wunderle — Determination of Temperature Dependent Young’s Modulus of ...
PID 109 : 11x (0.6%) Giuseppe Mauromicale — Thermography Analysis of Automotive SiC Power Modules for Re...
PID 125 : 11x (0.6%) Venu Prakash Kasinikota — Characterization and modeling of cure-induced thermo mechani...
PID 95 : 11x (0.6%) Al-mu'tez billah Al-sqour — Gamma process-based online prognostic for IGBT power modules...
PID 96 : 11x (0.6%) S. Ananiev — Enhancing the reliability of power packages combining SiC an...
PID 69 : 11x (0.6%) —
PID 103 : 11x (0.6%) Erik Wiss — Thermal Assessment of Soldering MLCC Components...
PID 25 : 11x (0.6%) S. Ananiev — Chip failure rate under stochastic package stress...
PID 122 : 11x (0.6%) —
PID 91 : 11x (0.6%) Jinglin Li — Temperature dependent trap characterisation and modelling of...
PID 124 : 10x (0.5%) Jeffrey C. Suhling — Modeling and Characterization of Single Grain Lead Free Sold...
PID 111 : 10x (0.5%) —
PID 15 : 10x (0.5%) —
PID 48 : 10x (0.5%) Na-Yeon Choi — Numerical Evaluation of P-Channel MOSFETs Depending on the T...
PID 98 : 10x (0.5%) —
PID 99 : 10x (0.5%) —
PID 51 : 10x (0.5%) —
PID 84 : 10x (0.5%) —
PID 118 : 10x (0.5%) Alexey Shaporin — High precision electrostatic MEMS actuators for in-plane Fab...
PID 39 : 10x (0.5%) Pan Liu — Molecular Dynamics Simulation Study of Interface Material in...
PID 120 : 10x (0.5%) —
PID 41 : 10x (0.5%) Abhijit Dasgupta — Prediction of Variability in Vibration Durability of Oligocr...
PID 108 : 9x (0.5%) Gaetano CALOGERO — Multiscale modelling of nanosecond-pulsed laser annealing fo...
PID 94 : 9x (0.5%) Enrico Martello — Exploring hybrid organic-metallic Perovskite Thin Films depo...
PID 110 : 9x (0.5%) Giuseppe Fisicaro — A multiscale simulation workflow for the CVD epitaxy of Si a...
PID 31 : 9x (0.5%) Yen-Chuan Chen — Warpage Estimation of Panel-Level Packaging by AI-assisted D...
PID 85 : 9x (0.5%) —
PID 86 : 9x (0.5%) —
PID 88 : 9x (0.5%) Eike Trumann — Characterization of Soft Errors on a 28-nm SRAM-based FPGA u...
PID 32 : 8x (0.4%) Cheng-En Lee — Sensitivity Study of Wafer-Level Packaging Lifetime Predicti...
PID 142 : 8x (0.4%) Fredy John Porathur — Warpage optimization of package substrates using Metamodels:...
PID 130 : 7x (0.4%) Veronique Rochus — Design of novel ultrasound transducers compatible with large...
PID 21 : 7x (0.4%) Wilson Maia — Evaluation of warpage of FOWLP considering the viscoelastic ...
PID 92 : 6x (0.3%) Valentina Troncale — Hygroscopic Swelling Influence on Critical Sensor Components...
PID 128 : 6x (0.3%) Gabriele Schrag — Design Optimization of a Corrugated Piezoelectric MEMS Micro...
PID 140 : 6x (0.3%) Barbara Leikam — Design Studies and Optimization of Acoustic Pressure in Acou...
PID 126 : 5x (0.3%) I. Maus — Application of Digital Image Correlation (DIC) for deformati...
PID 97 : 5x (0.3%) Alberto Corigliano — Metasurfaces for Enhanced Energy Harvesting in MEMS with Lea...
PID 158 : 5x (0.3%) Henry A. Martin — Training Convolutional Neural Networks with Confocal Scannin...
PID 119 : 5x (0.3%) Chengdong Yuan — Model Order Reduction of a Microelectronic Package Subjected...
PID 20 : 4x (0.2%) Wenyu Li — Double-sided heat dissipation numerical modelling of an embe...
PID 144 : 3x (0.2%) Ł. Chrobak — Influence of the Doping Level of Silicon on its Optical and ...
PID 145 : 3x (0.2%) M. Maliński — Investigations of the Thermal Parameters of the Polybutyl Me...
PID 149 : 3x (0.2%) Sameer Yadav — Automated Multidisciplinary Analysis and Lab Verification fo...
PID 133 : 3x (0.2%) Dag Andersson — A Link Between the Lab and the Real World - A Setup for Acce...
PID 155 : 3x (0.2%) Vincenzo Vinciguerra — A Comparison of Analytical and Finite Element Analysis Metho...
PID 87 : 3x (0.2%) —