Basic usages of the virtual on-demand space April 19 — May 15

108 effective visitors

185 views of list of attendants

56 downloads of proceedings PDF book

126 downloads of proceedings Zip

124 downloads of individual PDF manuscripts

86 views of videos (more than half duration, or cursor set after half duration)

2136 accesses to virtual rooms

3 posts to chats (including answers)

Most visited Virtual Rooms among 2136 visits

PID 62 : 72x (3.4%) Laurent Hérard — Simulation, a reality for successfully IC packaging heteroge...
PID 19 : 49x (2.3%) Ange ATINTOH — Characterization of the mechanical behavior of a Printed Cir...
PID 35 : 48x (2.2%) D. May — Tilt- and warpage measurement of bonded dies as an inline qu...
PID 5 : 47x (2.2%) Rika Berger — Relevance evaluation of solder joints attributes to reduce t...
PID 3 : 44x (2.1%) Mario Gschwandl — Electro-Thermo-Mechanical Reliability Assessment of Arbitrar...
PID 40 : 44x (2.1%) Abhijit Dasgupta — Effects of Anisotropic Viscoplasticity on SAC305 Solder Join...
PID 67 : 43x (2.0%) Jiajie Fan — Viscoplastic constitutive modeling of sintered nano-silver p...
PID 28 : 43x (2.0%) Alexander Kozlov — Effect of a Bragg Acoustic Reflector on Thermal Processes in...
PID 55 : 42x (2.0%) Valentina Osipova — Using AFM Measurements for Failure Indication During High-Cy...
PID 8 : 40x (1.9%) Daniel Riegel — Analysis of the stress state in QFN package during four bend...
PID 82 : 39x (1.8%) Przemyslaw Gromala — Digital twins for modelling and simulation...
PID 50 : 39x (1.8%) Alessandro Sitta — Thermo-mechanical finite element simulation and visco-plasti...
PID 16 : 36x (1.7%) Anu Mathew — Lifetime modelling of sintered silver interconnected power d...
PID 18 : 36x (1.7%) Jonas Gleichauf — Test Screening of Solder Joints Under Combined Cyclic Therma...
PID 72 : 36x (1.7%) Ross Wilcoxon — Trade-offs in Electronics Reliability: meeting thermal and s...
PID 64 : 35x (1.6%) Mirko Hofmann — Simulations in the MEMS design process...
PID 27 : 35x (1.6%) Roland Niemeier — Reliability Analysis of a RF Product with Improved Quality f...
PID 53 : 34x (1.6%) Nathanael Jöhrmann — Simulations for nanoindentation on thin metal films and the ...
PID 75 : 34x (1.6%) Klaus Pressel — Impact of thermal-mechanical modelling and simulation for th...
PID 42 : 34x (1.6%) Robert Schwerz — Optical Deformation Measurement for Validation of Thermo-Me...
PID 45 : 34x (1.6%) Uwe Zschenderlein — Dynamical characterisation of a miniaturised bulge tester fo...
PID 10 : 33x (1.5%) Willem Dirk Van Driel — Reliability of LED-based Systems...
PID 66 : 33x (1.5%) Georg Reuther — Determining adhesion of critical interfaces in microelectron...
PID 33 : 33x (1.5%) Freerik Forndran — A Parametric Simulative Study for Lifetime Prediction of Sin...
PID 59 : 33x (1.5%) Amirul Afripin — Finite Element Analysis of Copper Pillar Interconnect Stress...
PID 31 : 32x (1.5%) Haosu Huai — Evaluating Local Delamination of Power Electronic Devices th...
PID 13 : 32x (1.5%) — Robust Package Study for A Power Package by Simulation...
PID 49 : 32x (1.5%) Erik Wiss — Concept of a Mechanical Test Setup for Packaging Materials U...
PID 39 : 32x (1.5%) Julia Zündel — Characterization of prepreg shrinkage and investigation of i...
PID 46 : 31x (1.5%) Mehrdad Shaygi — Finite element-based lifetime modeling of SAC solder joints ...
PID 61 : 31x (1.5%) Alexandru Prisacaru — Oxidation of the Molding Compound identification using piezo...
PID 4 : 30x (1.4%) Christian Schipfer — Prediction of Curing Induced Residual Stresses in Polymeric ...
PID 22 : 30x (1.4%) Dr. Abhijit Dasgupta — Model-Based Quantification of Variability of Mechanical Cycl...
PID 6 : 30x (1.4%) Fosca Conti — Simulations and Experiments to Analyze Stress Phenomena in S...
PID 32 : 29x (1.4%) Marius van Dijk — Study on FO-WLP Warpage Behavior – Influence of Process Te...
PID 7 : 29x (1.4%) Philipp Adler — Time-based Reliability Analysis of Electrolytic Capacitors f...
PID 63 : 28x (1.3%) Ercan M. Dede — Simulation-based design and optimization for future mobility...
PID 12 : 28x (1.3%) Weidong Xie — Modified Norris-Landzberg Model for Reliability of Pb-free B...
PID 48 : 28x (1.3%) Rainer Dudek — Studies on Thermo-Mechanical Reliability of High Performance...
PID 43 : 28x (1.3%) Kento Kariya — Numerical and Experimental Study on Determination Method of ...
PID 30 : 27x (1.3%) Piotr Zając — Comparison of cooling performance of manifold and straight m...
PID 51 : 27x (1.3%) Alessandro Sitta — Paralleling Silicon Carbide MOSFETs in Power Module for Trac...
PID 57 : 27x (1.3%) Vincenzo Vinciguerra — On the Way to understand the Warpage in 8” Taiko Semicondu...
PID 36 : 26x (1.2%) S. Panahandeh — Infrared thermal imaging as inline quality assessment tool...
PID 77 : 26x (1.2%) Karsten Meier — Analysis of Design Parameter Effects on the Board Level Reli...
PID 20 : 25x (1.2%) Antonio Pappaterra — Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Co...
PID 26 : 25x (1.2%) Olaf Wittler — On the Influence of Ball Size and Geometry on the Reliabilit...
PID 78 : 25x (1.2%) Marco Del Sarto — Thermomechanical deformation characterization for full-molde...
PID 29 : 24x (1.1%) Aldo Ghisi — Failure of MEMS microphones during impact tests: the role of...
PID 17 : 24x (1.1%) Kaushal Arun Pareek — Towards data driven failure analysis using infrared thermogr...
PID 73 : 24x (1.1%) Yogendra Joshi — Thermal/fluid modeling of high heat flux power and microproc...
PID 76 : 24x (1.1%) Germano Galasso — T-dependent chip bow and solder process simulation...
PID 79 : 24x (1.1%) I.C. Albayrak — Measurement and simulation of nitride stress liners for stra...
PID 65 : 23x (1.1%) Simon Schlipf — IC package related stress effects on the characteristics of ...

Most viewed pre-recorded videos among 86 views

PID 35 : 10x (11.6%) D. May — Tilt- and warpage measurement of bonded dies as an inline qu...
PID 18 : 8x (9.3%) Jonas Gleichauf — Test Screening of Solder Joints Under Combined Cyclic Therma...
PID 39 : 7x (8.1%) Julia Zündel — Characterization of prepreg shrinkage and investigation of i...
PID 53 : 7x (8.1%) Nathanael Jöhrmann — Simulations for nanoindentation on thin metal films and the ...
PID 55 : 7x (8.1%) Valentina Osipova — Using AFM Measurements for Failure Indication During High-Cy...
PID 31 : 6x (7.0%) Haosu Huai — Evaluating Local Delamination of Power Electronic Devices th...
PID 5 : 6x (7.0%) Rika Berger — Relevance evaluation of solder joints attributes to reduce t...
PID 57 : 6x (7.0%) Vincenzo Vinciguerra — On the Way to understand the Warpage in 8” Taiko Semicondu...
PID 26 : 5x (5.8%) Olaf Wittler — On the Influence of Ball Size and Geometry on the Reliabilit...
PID 42 : 4x (4.7%) Robert Schwerz — Optical Deformation Measurement for Validation of Thermo-Me...
PID 43 : 4x (4.7%) Kento Kariya — Numerical and Experimental Study on Determination Method of ...

Most active chats among 3 posts

PID 8 : 2x (66.7%) Daniel Riegel — Analysis of the stress state in QFN package during four bend...

Most downloaded individual manuscripts among 124 downloads

PID 19 : 9x (7.3%) Ange ATINTOH — Characterization of the mechanical behavior of a Printed Cir...
PID 8 : 7x (5.6%) Daniel Riegel — Analysis of the stress state in QFN package during four bend...
PID 16 : 6x (4.8%) Anu Mathew — Lifetime modelling of sintered silver interconnected power d...
PID 29 : 6x (4.8%) Aldo Ghisi — Failure of MEMS microphones during impact tests: the role of...
PID 59 : 6x (4.8%) Amirul Afripin — Finite Element Analysis of Copper Pillar Interconnect Stress...
PID 33 : 5x (4.0%) Freerik Forndran — A Parametric Simulative Study for Lifetime Prediction of Sin...
PID 67 : 5x (4.0%) Jiajie Fan — Viscoplastic constitutive modeling of sintered nano-silver p...
PID 37 : 4x (3.2%) Majid Tavakolibasti — Thermo-mechanical-optical coupling within a digital twin dev...
PID 40 : 4x (3.2%) Abhijit Dasgupta — Effects of Anisotropic Viscoplasticity on SAC305 Solder Join...
PID 45 : 4x (3.2%) Uwe Zschenderlein — Dynamical characterisation of a miniaturised bulge tester fo...
PID 48 : 4x (3.2%) Rainer Dudek — Studies on Thermo-Mechanical Reliability of High Performance...
PID 58 : 4x (3.2%) Vincenzo Vinciguerra — Weibull Analysis of Failure Strength and Flexural Modulus in...
PID 14 : 3x (2.4%) Jun-Han Han — Thermal Analysis of Microchamber Cooling for Processing-in-M...
PID 38 : 3x (2.4%) Péter Pálovics — Comparison of different models of magnetic nanoparticle aggr...
PID 17 : 3x (2.4%) Kaushal Arun Pareek — Towards data driven failure analysis using infrared thermogr...
PID 22 : 3x (2.4%) Dr. Abhijit Dasgupta — Model-Based Quantification of Variability of Mechanical Cycl...
PID 3 : 3x (2.4%) Mario Gschwandl — Electro-Thermo-Mechanical Reliability Assessment of Arbitrar...
PID 5 : 3x (2.4%) Rika Berger — Relevance evaluation of solder joints attributes to reduce t...
PID 61 : 3x (2.4%) Alexandru Prisacaru — Oxidation of the Molding Compound identification using piezo...
PID 35 : 3x (2.4%) D. May — Tilt- and warpage measurement of bonded dies as an inline qu...
PID 12 : 3x (2.4%) Weidong Xie — Modified Norris-Landzberg Model for Reliability of Pb-free B...