Author Portal
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Read the Call for Papers
This is the place for you to post any data related to your final work: "final manuscript" if any, etc.
You must have registered to the event to access this area ! Once registered, you will receive by email your "author key" to enter.
Please use a template for your final manuscript (the one that will be published). Note that recent versions of Microsoft Office accept ODT, ODP files (LibreOffice and OpenOffice standard).
EuroSimE_A4_Word_template_General_rules.doc
EuroSimE_A4_LibreOffice_template_General_rules.odt
EuroSimE_A4_LaTeX_template.7z
The LaTeX template was kindly designed by Gerd Schlottig
You may use the following template for your presentation:
You may use the following template for your poster (but it is not compulsory, you may design your poster as you like):
Once you receive your "paper key", you can perform the following operations and repeat them as many times as wished until final deadline:
What | Should you do it? | Comment |
---|---|---|
Post your final PDF manuscript | Mandatory if "publishable" | You may do it every time you refine your final paper, new post always supersedes previous one (we do not keep any backup) |
Post the list of all Authors | Mandatory | To be reproduced in the online and printed programmes |
Post a short textual abstract | Recommended | Appearing in the published Web technical programme and in the printed programme, it helps people make their mind about your work |
Post your short biography | Mandatory if not a poster | To be read by your session chairman |
Post your presentation PPT, PDF, MP4 | Optional | A simple backup for your comfort, should you break or lose your laptop... |
Post your PDF poster | Optional | Only if you subcontract its printing to the organiser |
Transfer copyright to IEEE | Mandatory if "publishable" | You do it once for all |
Please paste the paper key :