2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Read the Call for Papers
This is the place for you to post any data related to your final work: "final manuscript" if any, etc.
You must have registered to the event to access this area ! Once registered, you will receive by email your "author key" to enter.
Please use a template for your final manuscript (the one that will be published). Note that recent versions of Microsoft Office accept ODT, ODP files (LibreOffice and OpenOffice standard).
The LaTeX template was kindly designed by Gerd Schlottig
You may use the following template for your presentation:
You may use the following template for your poster (but it is not compulsory, you may design your poster as you like):
Once you receive your "paper key", you can perform the following operations and repeat them as many times as wished until final deadline:
|What||Should you do it?||Comment|
|Post your final PDF manuscript||Mandatory if "publishable"||You may do it every time you refine your final paper, new post always supersedes previous one (we do not keep any backup)|
|Post the list of all Authors||Mandatory||To be reproduced in the online and printed programmes|
|Post a short textual abstract||Recommended||Appearing in the published Web technical programme and in the printed programme, it helps people make their mind about your work|
|Post your short biography||Mandatory if not a poster||To be read by your session chairman|
|Post your presentation PPT, PDF, MP4||Optional||A simple backup for your comfort, should you break or lose your laptop...|
|Post your PDF poster||Optional||Only if you subcontract its printing to the organiser|
|Transfer copyright to IEEE||Mandatory if "publishable"||You do it once for all|
Please paste the paper key :