Special session | Short Course: Ageing Phenomena in Polymers and Effects on Microelectronics Reliability | 08:30 Servanty (3rd floor) | Sunday April 15 2018 |
Chaired by Dr. Ole Hölck, Dr. Hans Walter, Marius van Dijk | |||
08:30 Part 1 |
Special session | Short Course: Thermal Modelling and Characterization of Electronic Systems | 08:30 Daurat (3rd floor) | Sunday April 15 2018 |
Chaired by Peter Rodgers | |||
08:30 Part 1 |
10:30 | Coffee break |
Special session | Short Course: Ageing Phenomena in Polymers and Effects on Microelectronics Reliability | 10:45 | Sunday April 15 2018 |
Chaired by Dr. Ole Hölck, Dr. Hans Walter, Marius van Dijk | |||
10:45 Part 2 |
Special session | Short Course: Thermal Modelling and Characterization of Electronic Systems | 10:45 | Sunday April 15 2018 |
Chaired by Peter Rodgers | |||
10:45 Part 2 |
Special session | 90mn Short Course: New challenges on packaging roadmap | 14:00 Servanty (3rd floor) | Sunday April 15 2018 |
Chaired by Prof. Christopher Bailey | |||
14:00 90mn course |
15:30 | Coffee break |
Special session | 90mn Short Course: Material characterization and modeling for new packaging technologies for harsh environment | 16:00 Servanty (3rd floor) | Sunday April 15 2018 |
Chaired by Dr. Przemyslaw Jakub Gromala | |||
16:00 90mn course |
09:00 | Welcome by W. van Driel |
Special session | Industry keynotes | 09:10 Amphitheater Cassiopée | Monday April 16 2018 |
Chaired by | |||
09:10 Automotive Electronics Reliability, Simulation and Validation Udo Jauernig, Bosch GmbH 09:40 Reliability in Complex Autonomous Systems Shalabh Tandon, Intel |
10:10 | Coffee break |
Session 1 | Technical Keynotes | 10:30 Cassiopée | Monday April 16 2018 | |
Chaired by Chris Bailey, Peter Rodgers | ||||
10:30 | 30mn | Keynote presentation – Microfluidics for the Thermal Control of Photonics Integrated Circuits Jeff Punch, Stokes Laboratories, University of Limerick, Limerick, Ireland |
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11:00 | 30mn | Keynote presentation – Prognostics and health management: current state-of-the-art for optimizing aircraft structural maintenance Christian Gogu, Université de Toulouse – Institut Clément Ader |
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11:30 | 30mn | Keynote presentation – Physics-Based Accelerated Qualification for Rigid and Flexible Electronics Suresh K. Sitaraman, Georgia Institute of Technology, Atlanta, USA |
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12:00 | 30mn | Keynote presentation – Perspectives of Water Effects in Polymers from Molecular Dynamics Nancy Iwamoto, Honeywell |
12:30 | Lunch |
Session 2 | Solder Joint Reliability | 14:00 Cassiopée | Monday April 16 2018 | |
Chaired by Rainer Dudek, Dag Andersson | ||||
14:00 | 30mn | Keynote presentation – Candidate for Best Paper Award On the formation and propagation of laminate cracks and their influence on the fatigue lives of solder joints Andreas Lövberg, Per-Erik Tegehall, Saeed Akbari, Dag Andersson, Swerea IVF |
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14:30 | 20mn | A Mechanistic Model for the Life of Solder Joints under Realistic Long Term Service Conditions Peter Borgesen 1, Luke Wentlent 2, Thaer Alghoul 1, Shantanu Joshi 3, Rajesh Sivasubramony 1, Manu Yadav 1, Sanoop Thekkut 1, Jorge L. Then Cuevas 1, Logan E. Alvarez 1, Christopher Greene 1 1 Binghamton University 2 Universal Instruments 3 Koki Solder America |
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14:50 | 20mn | Modeling the effects of imposed current on the creep of SAC305 solder material Peter Varga, Andrew Rusinko, Óbuda University, Budapest, Hungary |
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15:10 | 20mn | Robustness of BGAs: parametric study of voids’ distribution in SAC solder joints S.Pin 1, A.Gracia 2, J.Y.Delétage 2, J.Fouquet 1, H.Frémont 2 1 Institut de Recherche Technologique Saint-Exupéry, Toulouse, France 2 Univ. Bordeaux, IMS Lab, Talence, France |
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15:30 | 20mn | Experimental investigation and numerical modelling of the High Cycle Fatigue behavior of a SnAgCu-solder alloy including temperature and mean stress effects Youssef Maniar 1, Georg Konstantin 2, Marta Kuczynska 2, Alexander Kabakchiev 1, Michael Guyenot 1 1 Robert Bosch GmbH, Corporate Sector Research and Advance Engineering,71272 Renningen, Germany. 2 Robert Bosch GmbH, Automotive Electronics, 71701 Schwieberdingen, Germany. |
Session 3 | MEMS Structures and Microfluidics | 14:00 Spot | Monday April 16 2018 | |
Chaired by Bart Vandevelde, Craig Hillmann | ||||
14:00 | 30mn | Keynote presentation – On the Applicability of Single-Layer Integrated Microchannel Cooling in 3D ICs Piotr Zajac, Marcin Janicki, Andrzej Napieralski, Lodz University of Technology |
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14:30 | 20mn | Candidate for Best Paper Award Parametric Model Order Reduction of a Thermoelectric Generator for Electrically Active Implants Cheng Dong Yuan 1, Onkar Sandip Jadhav 2, Evgenii B. Rudnyi 3, Dennis Hohlfeld 2, Tamara Bechtold 1 1 Department of Engineering, Jade University of Applied Sciences, Wilhelmshaven, Germany; Institute for Electronic Appliances and Circuits, University of Rostock, Germany 2 Institute for Electronic Appliances and Circuits, University of Rostock, Germany 3 CADFEM GmbH, Munich, Germany |
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14:50 | 20mn | Design and Test of a 3D Printed Acoustic Fresnel Lens G. B. Torri 1, M. Signorelli 2, C. H. Huang 1, R. Haouari 1, S. Mao 1, X. Rottenberg 1 1 Imec 2 Johns Hopkins University |
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15:10 | 20mn | Candidate for Best Paper Award Development and characterization of MEMS membranes based on thin-film PZT actuators for microfluidic applications Baptiste Neff 1, Fabrice Casset 1, Arnaud Millet 2, Vincent Agache 1, Nicolas Verplanck 1, François Boizot 1, Stéphane Fanget 1 1 CEA LETI, Grenoble, France 2 INSERM, Grenoble, France |
Session 4 | Thermal Behavioral Modeling | 14:00 Argos | Monday April 16 2018 | |
Chaired by Andras Poppe, Suresh Sitaraman | ||||
14:00 | 30mn | Keynote presentation – Combined SPICE-FEM Analysis of Electrothermal Effects in InGaP/GaAs HBT Devices and Arrays for Handset Applications Vincenzo d’Alessandro 1, Antonio Pio Catalano 1, Lorenzo Codecasa 2, Brian Moser 3, Peter J. Zampardi 4 1 Department of Electrical Engineering and Information Tecnology, University of Naples, via Claudio 21, 80125 Italy 2 Department of Electronics, Information, and Bioengineering, Politecnico di Milano, Piazza Leonardo da Vinci 32, I-20133 3 Qorvo, Inc., Thorndike Rd. Greensboro, NC, USA 4 Qorvo, Inc., Newbury Park, CA, USA |
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14:30 | 20mn | Experimental and CFD Evaluation of Active Anti-Condensation Methods for Non-Hermetic Cabinets Ilja Belov 1, Zahra Alavizadeh 1, Mats Lindgren 2, Jan Rydén 3, Peter Leisner 4 1 Jönköping University, School of Engineering, Jönköping, Sweden 2 Omnisys Instruments AB, Västra Frölunda, Sweden 3 Saab AB, Göteborg, Sweden 4 RISE Research Institutes of Sweden, Borås, Sweden |
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14:50 | 20mn | Application of FCM-ANFIS approach to model heat transfer and pressure drop of Titania-Water nanofluids in the turbulent flow regime Dr. Mehdi Mehrabi, University of Pretoria |
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15:10 | 20mn | Flow induced hotspot migration studies with heat spreader integrated microchannels using reduced graphene oxide nanofluids G. Narendran, N. Gnanasekaran, D. Arumuga Perumal, National Institute of Technology Karnataka |
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15:30 | 20mn | Kapitza resistance across nanoscale crystalline and amorphous silicon carbide interface Chengdi Xiao 1, Hu He 2, Junhui Li 2, Wenhui Zhu 2 1 State Key Laboratory of High Performance Complex Manufacturing, Central South University, changsha,China;School of Mechatronics Engineering, Nanchang University, Nanchang, China 2 State Key Laboratory of High Performance Complex Manufacturing, Central South University, changsha,China |
15:50 | Coffee break |
Session 5 | Thermo-Mechanical Material Characterisation | 16:20 Cassiopée | Monday April 16 2018 | |
Chaired by Michael Guyenot, Wenhui Zhu | ||||
16:20 | 30mn | Keynote presentation – Mechanical reliability of microelectronics packaging: small scale adhesion measurements and in-situ imaging Emanuele Cattarinuzzi 1, Dario Gastaldi 2, Pasquale Vena 2, Fiorella Pozzobon 3, Lucrezia Guarino 4, Luca Cecchetto 4, Antonio Andreini 4 1 Chemistry, Materials and Chemical Engineering Department (DCMC), Politecnico di Milano, (MI), Italy / STMicroelectronics srl, Agrate (MI), Italy 2 Chemistry, Materials and Chemical Engineering Department (DCMC), Politecnico di Milano, (MI), Italy 3 STMicroelectronics srl, Cornaredo (MI), Italy 4 STMicroelectronics srl, Agrate (MI), Italy |
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16:50 | 20mn | Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration Riet Labie 1, Frederic Duflos 1, Bart Vandevelde 1, Bart Allaert 2, Ralph Lauwaert 3, Geert Willems 1 1 Imec 2 Connect Group 3 Interflux |
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17:10 | 20mn | Thermo-mechanical Characterisation of Thin Sputtered Copper Films on Silicon: towards Elasto-Plastic, Fatigue and Subcritical Fracture-Mechanical Data Bernhard Wunderle 1, Daniel May 1, Uwe Zschenderlein 1, Ramona Ecke 2, Martin Springborn 1, Nathanael Jöhrmann 1, Kaushal Arun Pareek 1, Jens Heilmann 1, Martin Stiebing 1, Jörg Arnold 1, Rainer Dudek 2, Stefan Schulz 2 1 TU Chemnitz 2 Fraunhofer ENAS |
Session 6 | Solid State Lighting | 16:20 Argos | Monday April 16 2018 | |
Chaired by Bernhard Wunderle, Haibo Fan | ||||
16:20 | 30mn | Keynote presentation – Color maintenance prediction for LED-based products W.D. van Driel 1, J. Beijer 1, B. Jacobs 1, J.W. Bikker 2, K. van Blokland 2, C. Ankomah 2 1 Philips Lighting 2 CQM |
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16:50 | 20mn | Simulation based Optimal Design of High Power Ultraviolet Light-emitting Diode Module used for Photocatalysis Jiajie Fan 1, Zhou Jing 2, Jie Liu 2, Lei Li 3, Cheng Qian 3, Xuejun Fan 4, Guoqi Zhang 5 1 Hohai University, Changzhou, China; Changzhou Institute of Technology Research for Solid State Lighting, China; Beijing Research Center, Delft University of Technology, China 2 Hohai University, Changzhou, China 3 Changzhou Institute of Technology Research for Solid State Lighting, China 4 Changzhou Institute of Technology Research for Solid State Lighting, China; Lamar University, Beaumont, TX, USA 5 Changzhou Institute of Technology Research for Solid State Lighting, China;Beijing Research Center, Delft University of Technology, China |
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17:10 | 20mn | Hardware Implementation of LED Forward Voltage Measurement for Junction Temperature Estimation Thomas Tetzlaff, Ulf Witkowski, South Westphalia University of Applied Sciences, Soest, German |
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17:30 | 20mn | A Probabilistic Physics-of-Failure Reliability Assessment Approach for Integrated LED Lamps Bo Sun, , Guangdong University of Technology, Guangzhou, China Jiajie Fan, , Hohai University, Changzhou, Jiangsu, China Xuejun Fan, , Lamar University, Beaumont, Texas, USA Guoqi Zhang, , Delft University of Technology, Delft, the Netherlands |
Session 7 | Thermal Analysis | 16:20 Spot | Monday April 16 2018 | |
Chaired by Marcin Janicki, Ilja Belov | ||||
16:20 | 30mn | Keynote presentation – CFD-Based Iterative Methodology for Modeling Natural Convection in Microelectronic Packages Mamadou Kabirou Toure 1, Papa Momar Souare 1, Stephanie Allard 2, Benoit Foisy 2, Eric Duchesne 2, Julien Sylvestre 1 1 University of Sherbrooke, Quebec, Canada 2 IBM Bromont, Canada |
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16:50 | 20mn | Modeling of Hyperbolic Heat Conduction in SOI Transistor by Equivalent RLC Network Amir Mirza Gheitaghy 1, Huaiyu Ye 2, Guo Qi Zhang 1 1 Department of Microelectronics, Delft University of Technology, The Netherlands 2 College of Opto-electronic Engineering, Chongqing University, China |
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17:10 | 20mn | Investigation of DELPHI-inspired Compact Thermal Model for modeling planar transformer Valentin Bissuel 1, Eric Monier-Vinard 2, Abel Olivier 3, Brice Rogié 2, Arnaud Mahé 3, Najib Laraqi 4, Christophe Gougis 5 1 Thales Global Services 2 Thales Global Services – Université Paris Nanterre, Laboratoire Thermique Interfaces Environnement 3 Thales Avionics Electrical Systems 4 Université Paris Nanterre, Laboratoire Thermique Interfaces Environnement 5 Université Paris Nanterre |
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17:30 | 20mn | Atomic level prediction of thermal conductivity of metallic materials in IC packaging Guang Zheng, Hu He, Wenhui Zhu, Central South University, Changsha, China |
19:30 | Dinner downtown, restaurant Le Mohai |
Session 8 | Flexible Electronics Reliability | 08:30 Argos | Tuesday April 17 2018 | |
Chaired by Nancy Iwamoto, Bo Sun | ||||
08:30 | 30mn | Keynote presentation – The influence of thermal ageing on the flow-stress of copper traces on PCB’s Adam Yuile, Steffen Wiese, Saarland University, Saarbrucken, Germany |
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09:00 | 20mn | Lifetime Modelling and Geometry Optimization of Meander Tracks in Stretchable Electronics Arian Grams 1, Simon Kuttler 1, Thomas Löher 1, Hans Walter 1, Olaf Wittler 1, Klaus-Dieter Lang 2 1 Fraunhofer IZM, Berlin, Germany 2 Technische Universität Berlin, Microperipheric Technologies, Berlin, Germany |
Session 9 | MEMS Transducers | 08:30 Diamant | Tuesday April 17 2018 | |
Chaired by Jeff Punch, Abhijit Dasgupta | ||||
08:30 | 30mn | Keynote presentation – CMUT with Mechanically Coupled Plate Actuators Marcel Krenkel 1, Marco Kircher 1, Mario Kupnik 2, Sandro G. Koch 1 1 Fraunhofer IPMS, Maria-Reiche-Str. 2, 01109 Dresden, Germany 2 Measurement and Sensor Technology, TU Darmstadt, Merckstraße 25, 64283 Darmstadt |
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09:00 | 20mn | Design, Modelling, and Characterization of Display Compatible pMUT Device Chih-Hsien Huang, Hang Gao, Guilherme Brondani Torri, Shengping Mao, Yongbin Jeong, David Cheyns, Veronique Rochus, Xavier Rottenberg, Imec, Belgium |
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09:20 | 20mn | Candidate for Best Paper Award A meta-stable self-aligning interdigitated electrode structure yielding a 100aF/nm capacitive transducer L.M. Middelburg 1, B. El Mansouri 1, R.H. Poelma 1, H.W. van Zeijl 1, J. Wei 1, G.Q. Zhang 1, W.D. van Driel 2 1 Delft University of Technology, Delft, The Netherlands 2 Delft University of Technology, Delft, The Netherlands; Philips Lighting, HTC Eindhoven, The Netherlands |
Session 10 | Thermal Modeling and Characterization | 08:30 Spot | Tuesday April 17 2018 | |
Chaired by Peter Rodgers | ||||
08:30 | 30mn | Keynote presentation – LED 3D Thermal Model Calibration against Measurement Robin Bornoff 1, Gabor Farkas 1, Lajos Gaal 1, Marta Rencz 1, Andras Poppe 2 1 Mentor – A Siemens Business 2 BME |
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09:00 | 20mn | Measurement and Simulation of MEMS Dedicated to Investigation of Heat Transfer at Nanoscale Marcin Janicki 1, Piotr Pietrzak 1, Jedrzej Topilko 1, Piotr Zajac 1, Artur Sobczak 1, Grzegorz Jablonski 1, Pawel Janus 2, Piotr Prokaryn 2, Andrzej Napieralski 1 1 Lodz University of Technology 2 Institute of Electron Technology |
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09:20 | 20mn | 3D Hybrid Bonding Assembly Studied by Scanning Thermal Microscopy, Resistive Thermometry and Finite Element Modelling A. Pic 1, S. Gallois-Garreignot 2, J.-P. Collona 3, V. Fiori 2, P.-O. Chapuis 4 1 STMicroelectronics/CETHIL 2 STMicroelectronics 3 CEA Leti 4 CETHIL |
09:40 | Coffee break |
Special session | Exhibitor and Sponsor special session | 10:00 Spot | Tuesday April 17 2018 |
Chaired by | |||
10:00 Bosch / Dynardo / FRT-CWM / Huawei / IRT / Philips / Siemens |
Session 11 | Dialog session (posters) Best and outstanding posters will be found from all poster contributions by the conference participants |
10:00 | Tuesday April 17 2018 | |
Chaired by Sven Rzepka, Mike Röllig | ||||
Study of EM M Packwood 1, Ying Dai 1, Yangang Wang 1, Xiaoping Dai 2, Daohui Li 1 1 Dynex Semiconductor, Lincoln, United Kingdom 2 CRRC, ZhuZhou, China |
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Board level drop reliability study and orthotropic PCB material property test methodology Jue Li 1, Pirkka Myllykoski 1, Cong Huang 1, Esa Hussa 1, Dongmin Hu 2, Dahe Kou 2 1 Reliability Competence Center, Finland R 2 Simulation Lab, Consumer BG, Huawei Technologies Co. Ltd, Shenzhen, China P.R. |
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Explosion Mechanism Investigation of High Power IGBT Module Matthew Packwood 1, Yangang Wang 1, Fang Qi 1, Ariful Islam 1, Daohui Li 1, Xiapoing Dai 2 1 Dynex Semiconductor, Lincoln, United Kingdom 2 CRRC, Zhuzhou, China |
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Modelling the Influence of Molding Compound and Temperature Profile on Solder Joint Reliability in Single Die QFN Packages Maxim Serebreni 1, Patrick McCluskey 2, Tyler Ferris 3, Gil Sharon 3, Nathan Blattau 3, Craig Hillman 3 1 DfR Solutions, Beltsville, USA; CALCE, University of Maryland, USA 2 CALCE, University of Maryland, USA 3 DfR Solutions, Beltsville, USA |
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Automation of Electro-thermal Simulations Based on Thermal Conductivity Optimization A. Datsuk, , IHP, Frankfurt (Oder), Germany M. Kaynak, , IHP, Frankfurt (Oder), Germany; Sabanci University, İstanbul, Turkey T. Krupkina, , National Research University of Electronic Technology, Moscow, Russia, |
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Simulation-Based Design of a Micro Fluidic Transportation System for Mobile Applications Based on Ultrasonic Actuation Martin Seidl 1, Matthias Gehring 1, Ulrich Krumbein 2, Gabriele Schrag 1 1 Chair for Physics of Electrotechnology, Technical University of Munich 2 Infineon Technologies AG, Neubiberg |
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BGA Strip Warpage Induced by Assembly Process and the Practical Prediction Methodology Roseanne Duca 1, Jing En Luan 2, Phone Maw Hla 2, Claudio Maria Villa 3, Marco Rovitto 3 1 STMicroelectronics (Ltd), Kirkop, Malta 2 STMicroelectronics (Ltd), Toa Payoh, Singapore 3 STMicroelectronics (Ltd), Milan, Italy |
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Reliability assessment of SiC power module stack based on thermo-structural analysis Alexey Sokolov, Chunlei Liu, Fabian Mohn, Asea Brown Boveri Ltd, Corporate Research, Baden-Dättwil, Switzerland |
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Heat haze effects in thermal chamber tensile tests on Digital Image Correlation Adam Yuile 1, Robert Schwerz 2, Mike Roellig 2, Rene Metasch 2, Steffen Wiese 1 1 Saarland University, Saarbrucken, Germany 2 Fraunhofer IKTS, Dresden, Germany |
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Simulating Object Lists using Neural Networks in Automotive Radar Alexander Suhre, Waqas Malik, Valeo |
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Simulation-based specification of the power module lifetime to extend parameter regime beyond testing limitations Tatyana Kashko, Oliver Schilling, Infineon Technologies AG |
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Research and Design of On-line Measurement System for Grinding Force and Temperature of Wafer Grinder Hui Yang, Wenhui Zhu, JunHui Li, Zhuo Chen, School of Mechanical and Electronical Engineering, Central South University, Changsha, China |
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Thermal Aging Modeling of Molding Compound under High-Temperature Storage and Temperature Cycling Conditions Bingbing Zhang 1, Michael Johlitz 1, Alexander Lion 1, L. J. Ernst 2, K. M. B. Jansen 3, Duc-Khoi Vu 4, Laurens Weiss 4 1 Institute of Mechanics, Universität der Bundeswehr München, Germany 2 Ernst Consultant, Schoonhoven, Netherlands 3 Department of Design Engineering, Delft University of Technology, Netherlands 4 Infineon Technologies AG, Munich, Germany |
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Extending the Performance of High Heat Flux 2.5D and 3D Packaging from Component-System Interaction Gamal Refai-Ahmed 1, Hoa Do 1, Brian Philofsky 2, Jason Strader 3 1 Xilinx Inc. San Jose, Ca, USA 2 Xilinx Inc. Longmont, CO, USA 3 Laird Cleveland, Ohio, USA |
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Modelling and simulation of microelectronic packages containing complex chip structures Pećanac G, Haist G., Jerke G., Silber C., Henkel I., Robert Bosch GmbH, Reutlingen, Germany |
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Lumen maintenance prediction for LEDs – new insights B. Jacobs, , Philips Lighting W.D. van Driel, , Philips Lighting; Delft University of Technology M. Schuld, , CQM |
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Wire Pull FEA Simulation Comparison Raj Sekar Sethu 1, Salil Hari Kulkarni 2, How Ung Ha 2, Kok Heng Soon 2 1 X-FAB Semiconductor Foundries AG, Kuching Sarawak, Malaysia 2 Swinburne University of Technology Sarawak, Sarawak, Malaysia |
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Thick Metal Flat Passivation Elastic Modulus Investigation Raj Sekar Sethu, Kumar Sambhawam, Yang Peng, X-FAB Semiconductor Foundries AG, Kuching Sarawak, Malaysia |
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Determination of Relevant Material Behaviour for Use in Stretchable Electronics H. Walter 1, A. Grams 1, O. Wittler 1, M. Seckel 2, T. Löher 2, K.-D. Lang 2 1 Fraunhofer IZM, Berlin, Germany 2 Technical University Berlin, Berlin, Germany |
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Influence of Cooling Conditions on LED Compact Thermal Model Element Values Tomasz Torzewicz, Marcin Janicki, Andrzej Napieralski, Lodz University of Technology |
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Electro-Thermal Behaviour Using Finite Volume and Finite Element Method Martina Aderonke Bella, Chris Bailey, Hua Lu, University of Greenwich |
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Failure Assessments of Polymeric Structure for Electronic Connectors D.-C. Huang, Y.-T. Juo, K.-C. Liao, Department of Bio-Industrial Mechatronics Engineering National Taiwan University, Taiwan |
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Thermodynamic analysis of SiO2 thickness effect on TSV Li Yanruoyue 1, Fu Guicui 2, Yan Xiaojun 1, Zhang Weifang 2 1 School of Energy and Power Engineering, Beihang University 2 School of Reliability and Systems Engineering, Beihang University |
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Method to Predict Lifetime of IGBT under Power Cycling based-on Fast Electro-Thermo-Mechanical Model Maogong Jiang, Guicui Fu, Hongyan Leng, Bo Wan, Yu Cheng, School of Reliability and Systems Engineering, Beihang University |
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Mechanistic Model for the Stress-Strain Response of Double-Layered PSA Hao Huang, Abhijit Dasgupta, CALCE, Unversity of Maryland, College Park |
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On Relation between Parameters of Cohesive Zone Model S. Ananiev, Infineon Technologies AG, Neubiberg, Germany |
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Power Map Modeling in Packaged Integrated Circuits and Power Devices Kunal Jain, Swati Saxena, ESI US R |
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Internal Stress State of a TQFP subjected to Liquid Temperature Shock using Piezoresistive Silicon Stress Sensor Alexandru Prisacaru 1, Yue Sun 1, Przemyslaw Jakub Gromala 1, Bongtae Han 2, Guo Qi Zhang 3 1 Robert Bosch GmbH 2 University of Maryland College Park 3 Delft University of Technology |
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Study on Layout Optimization of Multi-Chip LED Modules Based on Discrete Element Method Quan Xia, Yi Ren, Zili Wang, Bo Sun, Qiang Feng, Dezhen Yang, Cheng Qian, School of Reliability and Systems Engineering, Beihang University |
12:15 | Lunch |
Session 12 | MEMS Structures | 13:30 Argos | Tuesday April 17 2018 | |
Chaired by Alberto Corigliano, Hélène Frémont | ||||
13:30 | 30mn | Keynote presentation – Self-assembly of High Performance On-Chip RF-MEMS Inductors Based on Internal-Stress Induced Post-Release Bending Rayan Bajwa, Murat Kaya Yapici, Sabanci University, Istanbul, Turkey |
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14:00 | 20mn | Simulation and characterization of a high-sensitive Micro-Opto-Mechanical Microphone V. Rochus, H. Gao, CH. Huang, W. Westerveld, R. Haouari, B. Troia, F. Verhaegen, R. Jansen , B. Figeys, X. Rottenberg , Imec, Leuven, Belgium |
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14:20 | 20mn | Low Cycle Fatigue of Aluminium Thin Films on Vibrating Silicon MEMS Cantilevers: Highly Accelerated Stress Test and Finite Element Modelling Georg M. Reuther 1, Reinhard Pufall 1, Bernhard Wunderle 2 1 Infineon Technologies AG, Munich 2 Technische Universität Chemnitz |
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14:40 | 20mn | A Novel Graphene Based Waveguide Electro-optic Bragg Grating Modulator Feng Zhang 1, Xian-Ping Chen 1, Qi-qin Wei 2, Li-Bo Yuan 2, Miao Cai 2, Huaiyu Ye 1, Guoqi Zhang 3, Jing Xiao 4 1 Key Laboratory of Optoelectronic Technology 2 School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology 3 Delft Institute of Microsystems and Nanoelectronics, Delft University of Technology 4 School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, |
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15:00 | 20mn | Simulation of the Thermomechanical Stress of a MEMS Microphone Hanna Ebbinghaus 1, Gregor Feiertag 1, Sebastian Walser 2 1 Munich University of Applied Science, Munich, Germany 2 EPCOS AG, A TDK Group Company, Munich, Germany |
Session 13 | Process Modelling | 13:30 Spot | Tuesday April 17 2018 | |
Chaired by Jürgen Auersperg, Alexandru Prisacaru | ||||
13:30 | 30mn | Keynote presentation – 3D-Printing and wet metallization for uniaxial and multi-axial accelerometers Valentina Zega 1, Caterina Credi 2, Marta Invernizzi 2, Roberto Bernasconi 2, Giacomo Langfelder 3, Alfredo Cigada 4, Luca Magagnin 2, Marinella Levi 2, Alberto Corigliano 1 1 Politecnico di Milano, Department of Civil and Environmental Engineering 2 Politecnico di Milano, Department of Chemistry, Materials and Chemical Engineering “Giulio Natta” 3 Politecnico di Milano, Department of Electronics Information and Bioengineering 4 Politecnico di Milano, Department of Mechanical Engineering |
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14:00 | 20mn | Optimized 2D positioning of windings in inductive components by genetic algorithm Andreas Rosskopf, Karsten Knoerzer, Eberhard Baer, Stefan Ehrlich, Fraunhofer IISB, Erlangen, Germany |
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14:20 | 20mn | Prediction of filling time in capillary-driven underfill process through 3D numerical analysis Kanglun Wang, Yan Wang, Wenhui Zhu, Central South University, Changsha, China |
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14:40 | 20mn | Effect of Ultrasonic Agitation on the Properties of Copper Electrodeposition in Micro-Via Houya Wu, Yan Wang, Fuliang Wang, Wenhui Zhu, Central South University, Changsha, China |
Session 14 | Reliability of Power Packages | 13:30 Diamant | Tuesday April 17 2018 | |
Chaired by Jeroen Zaal, Kouchi Zhang | ||||
13:30 | 30mn | Keynote presentation – Multi-Scale Modelling of Internal Failure Mechanism of SiC Power MOSFETs Kai Zheng, Houcai Luo, Lingming Wang, Chunjian Tan, Shaogang Wang, Huaiyu Ye, Xianping Chen, Key Laboratory of Optoelectronic Technology |
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14:00 | 20mn | Failure Analysis in Power Devices using Lock-in Infrared Thermography M. Vellvehi, X. Perpinyà, D. Sánchez, P. Fernández-Martínez, D. Flores , X. Jordà , Institut de Microelectrònica de Barcelona, Centre Nacional de Microelectrònica (IMB-CNM,CSIC), Cerdanyola del Vallès, Spain |
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14:20 | 20mn | Study of Cu Wire Crack under Thermal Cycling Test Haibo Fan 1, WW Chow 1, Fei Wong 1, Dashun Liu 2, Haibin Chen 2, Jingshen Wu 2 1 Nexperia, Hong Kong 2 Hong Kong University of Science and Technology, Hong Kong |
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14:40 | 20mn | Determination of Die-Shift in a Multi-Project Fan-out Wafer Level Package after Processing by means of Numerical Simulations Marius van Dijk 1, Tanja Braun 1, Hans Walter 1, Stefan Raatz 1, Steve Voges 1, Marcus Paeck 1, Klaus-Dieter Lang 2 1 Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany 2 Technische Universität Berlin, Microperipheric Technologies, Berlin, Germany |
15:05 | Coffee break |
Session 15 | Electronics Reliability under Vibration Loadings | 15:30 Diamant | Tuesday April 17 2018 | |
Chaired by Przemyslaw Gromala, Xian-Ping Chen | ||||
15:30 | 30mn | Keynote presentation – Assessing the vibrational response and robustness of electronic systems by dissolving time and length scale Thomas Schriefer, , PhD student, University of Erlangen-Nuremberg Dr. Ing. Maximilian Hofmann, , Group leader, Drives and Mechatroncis, Fraunhofer Institute for Integrated Systems and Device Technology |
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16:00 | 20mn | Effect of Temperature on Vibration Fatigue of SAC105 Solder Material after Extended Room Temperature Aging David Leslie, Tim Heid, Abhijit Dasgupta, Center for Advanced Life Cycle Engineering, University of Maryland, College Park, US |
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16:20 | 20mn | Vibration Test and Simulation of Printed Circuit Board Faical Arabi, Alexandrine Gracia, Jean-Yves Delétage, Hélène Frémont, University of Bordeaux – IMS Laboratory |
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16:40 | 20mn | Resonance frequency dependency of Thermal Interface Materials under vibration Emad A. Poshtan, Robert Bosch GmbH |
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17:00 | 20mn | Vibration Fatigue Analysis of Lead-free CSP Assemblies on Printed Circuit Board Chinmay Nawghane 1, Bart Vandevelde 2, Riet Labie 2, Bart Allaert 3, Ralph Lauwaert 4, Filip Vanhee 5, Davy Pissoort 5, Ingrid De Wolf 6, Jan Mehner 7 1 Imec, Belgium; Technische Universität Chemnitz, Germany 2 Imec, Belgium 3 Connect Group, Belgium 4 Interflux Electronics, Belgium 5 KU Leuven, Belgium 6 Imec, Belgium; KU Leuven, Belgium 7 Technische Universität Chemnitz, Germany |
Session 16 | Life Time Predictions | 15:30 Spot | Tuesday April 17 2018 | |
Chaired by Jiajie Fan, Peter Borgesen | ||||
15:30 | 30mn | Keynote presentation – Long-Term Thermal Fatigue Testing of Solder Joints and Related Fatigue Life Predictions Rainer Dudek 1, M. Hildebrandt 1, K. Kreyßig 1, S. Rzepka 1, M. Novak 2, W. Grübl 2, B. Schuch 2 1 Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany 2 Continental, Division Powertrain, Business Unit Transmission, Nuremberg, Germany |
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16:00 | 20mn | Data Analytics Approach for Optimal Qualification Testing of Electronic Components Stoyan Stoyanov, Mominul Ahsan, Chris Bailey, University of Greenwich, London, United Kingdom |
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16:20 | 20mn | Reliability analysis of encapsulated components in 3D-circuit board integration Robert Schwerz 1, Mike Roellig 1, Klaus-Juergen Wolter 2 1 Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Dresden, Germany 2 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany |
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16:40 | 20mn | FEM modelling of porosity in Ag sintering die attach for RF power applications Jianlin Huang, Huib Scholten, Frank de Bruijn, An Xiao, Mario de Vaan, Ampleon Netherlands B.V., Nijmegen, The Netherlands |
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17:00 | 20mn | A Thermo-Mechanical Fatigue Damage Modeling Methodology for Power Semiconductor Robustness Validation Studies Martin Springer, Heinz E. Pettermann, Vienna University of Technology, Institute of Lightweight Design and Structural Biomechanics, Vienna, Austria |
Session 17 | Interfacial Properties | 15:30 Argos | Tuesday April 17 2018 | |
Chaired by Michel Lenczner, Andreas Lövberg | ||||
15:30 | 30mn | Keynote presentation – Modeling reaction front propagation of intermetallic compounds by using an isogeometric analysis A. Morozov 1, A.B. Freidin 2, W.H. Müller 1, T. Hauck 3, I. Schmadlak 3 1 Technical University of Berlin, Berlin, Germany 2 Institute for Problems in Mechanical Engineering of Russian Academy of Sciences, St. Petersburg, Russia 3 NXP Semiconductors, München, Germany |
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16:00 | 20mn | Candidate for Best Paper Award Interfacial Properties of Cu/SiO2 using a Multiscale Modelling Approach in Electronic Packages ZhenCui 1, Xianping Chen 2, Xuejun Fan 3, Guoqi Zhang 1 1 Delft university of technology, Delft, Netherlands 2 Chongqing University, Chongqing, China 3 Lamar University, USA |
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16:20 | 20mn | Characterization of EMC/LF Interfacial Fracture Toughness using the Advanced Mixed-Mode Bending Method Schulz, M. 1, Nabi, H. S. 2, Vu, D.-K. 2, Wunderle, B. 3, Keller, J. 1 1 AMIC Angwandte Micro-Messtechnik GmbH 2 Infineon Technologies AG 3 Chemnitz University of Technologies |
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16:40 | 20mn | Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation Reinhard Pufall 1, Michael Goroll, 1, Georg M. Reuther 1, Nadine Pflügler 1, Dominik Udiljak 1, Rainer Dudek 2 1 Infineon Technologies AG, Munich 2 Fraunhofer ENAS, Chemnitz |
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17:00 | 20mn | Four-Point-Bending Experiments on Multilayer Ceramic Capacitors: Microstructural Details on Crack Initiation and Propagation Joseph Al Ahmar, Erik Wiss, Steffen Wiese, Saarland University |
Special session | Panel: Should we rethink the reliability standards for these heterogeneous integrated SIP packages? | 17:30 Cassiopée | Tuesday April 17 2018 |
Chaired by Willem van Driel, Philips | |||
17:30 With Emilie Jolivet (Yole Développement), Jeroen Zaal (NXP), Brian Philofski (Xilinx), Suresh Sitaraman (Gatech), Christopher Bailey (University of Greenwich), Przemyslaw Gromala (Robert Bosch), Abhijit Dasgupta (University of Maryland) |
19:30 | Dinner cocktail at venue, Foyer Ariane 1st floor, until 21:30 |
20:30 | Steering Committee meeting, Bar Armagnac, 30mn |
Session 18 | Technical Keynotes | 08:30 Cassiopée | Wednesday April 18 2018 | |
Chaired by Xuejun Fan | ||||
08:30 | 30mn | Keynote presentation – On the TSV Delamination Risk Dependence on TSV Distance and Silicon Crystal Orientation Juergen Auersperg, Jan Albrecht, Sven Rzepka, Micro Materials Center at Fraunhofer ENAS, Chemnitz, Germany |
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09:00 | 30mn | Keynote presentation – Thermal Management Challenges for Downhole Electronics in the Oil and Gas Industry Peter Rodgers, Khalifa University of Science and Technology, Abu Dhabi, UAE |
Special session | Awards ceremony | 09:30 Cassiopée | Wednesday April 18 2018 |
Chaired by Sven Rzepka | |||
09:30 Best and outstanding papers and posters |
09:40 | Coffee break |
Session 19 | IC level thermo-mechanical analysis | 10:00 Cassiopée | Wednesday April 18 2018 | |
Chaired by Marius van Dijk, Véronique Rochus | ||||
10:00 | 30mn | Keynote presentation – Lift off reliability model for Aluminum and Copper wire bonds Michael Guyenot, Youssef Maniar, Manfred Reinold, Martin Rittner, Robert Bosch GmbH, Renningen, Germany |
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10:30 | 20mn | Minimizing electro-mechanical shifts in IC applications J.J.M. Zaal 1, A. Mavinkurve 1, Y.K. Liang 2, S.F. Chopin 3, E. Huynh 4, Y. Gao 4, A. Damian 1 1 NXP Semiconductors, Nijmegen, Netherlands 2 NXP Semiconductors, Tianjin, China 3 NXP Semiconductors, Austin, Texas 4 NXP Semiconductors, Toulouse, France |
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10:50 | 20mn | Advanced risk analysis of interface delamination in semiconductor packages: a novel experimental approach to calibrating cohesive zone elements for Finite Element Modelling Nadine Pflügler 1, Georg M. Reuther 1, Michael Goroll 1, Dominik Udiljak 1, Reinhard Pufall 1, Bernhard Wunderle 2 1 Infineon Technologies AG, Neubiberg, Germany 2 Technische Universität Chemnitz, Chemnitz, Germany |
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11:10 | 20mn | Coupled Thermo-Mechanical Analysis of Mass Reduced Silicon Micromirrors Harris J Hall, Jason Schmidt, LaVern Starman, Air Force Research Laboratory |
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11:30 | 20mn | Peridynamic modelling of crack initiation and propagation in thermo-mechanically loaded electronic devices Gábor Ladányi, , University of Dunaújváros, Dunaújváros, HUNGARY Viktor Gonda, , Óbuda University, Budapest, HUNGARY |
Session 20 | Multi-Physics / Scale Analysis | 10:00 Spot | Wednesday April 18 2018 | |
Chaired by Reinhard Pufall, Steffen Wiese | ||||
10:00 | 30mn | Keynote presentation – A Review of Modeling Moisture Diffusion in Electronic Packages Liangbiao Chen 1, Yong Liu 1, Xuejun Fan 2 1 On Semiconductor 2 Lamar University |
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10:30 | 20mn | Modelling the magnetic nanoparticle filling procedure of flow-through microchambers Péter Pálovics, Márta Rencz, Budapest University of Technology and Economics, Department of Electron Devices, Hungary |
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10:50 | 20mn | Thick AlCu-Metal Reliability Characterization Kirsten Weide-Zaage 1, Yuqi Tan 1, Verena Hein 2 1 LUH IMS-RESRI 2 X-FAB |
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11:10 | 20mn | Investigation of Trapping Behaviour in GaN HEMTs through physical TCAD Simulation of Capacitance Voltage characteristics Kalparupa Mukherjee, Arnaud Curutchet, Frederic Darracq, Nathalie Malbert, Nathalie Labat, IMS Lab, University of Bordeaux |
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11:30 | 20mn | A Multiscale Model of a Two-Dimensional Micro-Mirror Array Nguyen Nhat Binh Trinh 1, Michel Lenczner 1, Frédéric Zamkotsian 2, Nicolas Ratier 1 1 FEMTO-ST, University of Bourgogne Franche-Comté, CNRS, UTBM, ENSMM, Besançon, France 2 LAM-CNRS, AMU, Marseille, France |
11:50 | Lunch |
Special session | Visit of Airbus plant | 12:30 | Wednesday April 18 2018 |
Chaired by | |||
12:30 Departure group 1 by bus from venue 13:00 Departure group 2 from venue 13:00 Group 1 checks in 13:30 Group 1 begins visit 13:30 Group 2 checks in 14:00 Group 2 begins visit 15:00 Group 1 finishes visit; bus stops at Blagnac airport and comes back to venue 15:30 Group 2 finishes visit; bus stops at Blagnac airport and comes back to venue |