 |
EuroSimE 2012 was locally organised by ISQ (Pr Eduardo Dias Lopes) in Hotel This 13th EuroSimE was attended by 155 individuals. 5 training courses were offered on Sunday. The software exhibition Proceedings of EuroSimE 2012 : CD-ROM full version: IEEE Catalog
|
This was the technical programme of EuroSimE 2012:
Go to List of Technical Sessions Technical program
List of Technical Sessions
S-1 New Developments in Modeling
S-2 Adhesion Experiments
S-3 Molecular Dynamics
S-4 Thermal Behavior Modeling and Characterization
S-5 Reliability Modeling
S-6 Process Modelling
S-7 Electrothermal Modeling and Characterization
S-8 Health Monitoring
S-9 Process Modelling and MEMS Structures
S-10 Solid State Lighting Thermal Analysis
S-11 Thermo-Mechanical Issues in Microelectronics
S-12 Multi-Physics and Thermal Issues in Microelectronics
S-13 Experimental Investigations
S-14 MEMS Applications
S-15 Interface Simulations
S-16 Thermo-Mechanical Modeling
S-17 Fracture Modelling and MEMS Analysis
S-18 Solder Measurements and Modeling
S-19 Advances in Modeling and Testing
S-20 Thermo-Mechanics for New Applications
S-21 Solid State Lighting
S-22 Advances in Modeling
Go to List of Technical Sessions Technical program
| Session 1 | 11:00 | Monday Apr 16 2012 | |
| New Developments in Modeling Chairman: Leo J. Ernst, Consultant and Emeritus Professor of Delft University of Technology |
|||
| 11:00 | 30mn | Keynote presentation – Thermo-Mechanical Reliability of Advanced Low-k/Copper Interconnects: Chip Package Interaction Corresponding Author: Xiao Hu Liu – IBM TJ Watson Research Center Xiao Hu Liu, IMB Watson Research Center, USA |
|
| 11:30 | 30mn | Keynote presentation – Anisotropic Strain-Field-induced Change of the Electronic Conductivity of Graphene Sheets and Carbon Nanotubes Corresponding Author: Hideo Miura – Tohoku University Masato Ohnishi, Ken Suzuki, Hideo Miura, Tohoku University |
|
| 12:00 | 30mn | Keynote presentation – Thermal Challenges in Photonic Integrated Circuits Corresponding Author: Jeff Punch – Stokes Institute, University of Limerick Jeff Punch, Stokes Institute, University of Limerick, Limerick, Ireland |
|
| Session 2 | 14:00 | Monday Apr 16 2012 | |
| Adhesion Experiments Chairman: Abhijit Dasgupta, CALCE; Yong Liu, Fairchild Semiconductors |
|||
| 14:00 | 30mn | Keynote presentation – Determination of Interface Fracture Parameters by Shear Testing Using Different Theoretical Approaches Corresponding Author: Rainer Dudek – Fraunhofer ENAS R. Dudek 1, B. Brämer 1, J. Auersperg 1, R. Pufall 2, H. Walter 3, B. Seiler 4, B. Wunderle 5 1 Fraunhofer ENAS, Micro Materials Center Chemnitz, Germany 2 Infineon Technologies, Munich, Germany 3 Fraunhofer IZM, Berlin, Germany 4 CWM GmbH, Chemnitz, Germany 5 TU Chemnitz, Germany |
|
| 14:30 | 20mn | Fracture Toughness Characterization and Modeling of Interfaces in Microelectronic Packages – A Status Review Corresponding Author: Heinz Pape – Infineon Technologies AG H. Pape 1, I. Maus 2, I. Paul 1, L. J. Ernst 3, B. Wunderle 4 1 Infineon Technologies AG, Munich, Germany 2 Infineon Technologies AG, Regensburg, Germany 3 Delft University of Technology, Delft, The Netherlands 4 Chemnitz University of Technology, Chemnitz, Germany |
|
| 14:50 | 20mn | Rapid Fracture-Mechanical Bi-Material Interface Characterisation by using the Advanced Mixed-Mode Bending Test Corresponding Author: Bernhard Wunderle – Chemnitz University of Technology Bernhard Wunderle 1, Marcus Schulz 1, Jürgen Keller 2, Daniel May 3, Ingrid Maus 4, Heinz Pape 4, Bernd Michel 5 1 Chemnitz University of Technology, Germany 2 AMIC, Germany 3 Chemitz University of Technology, Germnay 4 Infineon, Germany 5 Fraunhofer ENAS, Germany |
|
| 15:10 | 20mn | Interfacial Fracture Toughness Measurements in Microelectronic Packages with Different Test Setups on Samples from Production Corresponding Author: Ingrid Maus – Infineon Technologies AG I. Maus 1, H. Pape 2, H. S. Nabi 1, M. Goroll 2, H. Preu 1, J. Keller 3, L.J. Ernst 4, B. Michel 5, B. Wunderle 6 1 Infineon Technologies AG, Regensburg, Germany 2 Infineon Technologies AG, Neubiberg, Germany 3 Amic GmbH, Berlin, Germany 4 Delft University of Technology, Delft, Netherlands 5 MMCC, Fraunhofer Institut ENAS, Chemnitz, Germany 6 Chemnitz University of Technology, Chemnitz, Germany |
|
| 15:30 | 20mn | Establishing the Interfacial Fracture Properties of Cu-EMC Interfaces at Harsh Condition Corresponding Author: Mahdi Sadeghinia – Delft University of Technology Mahdi Sadeghinia 1, K.M.B. Jansen 1, L.J. Ernst 1, H. Pape 2 1 Delft University of Technology, Netherlands 2 Infineon Technologies AG, Munich, Germany |
|
| Session 3 | 14:00 | Monday Apr 16 2012 | |
| Molecular Dynamics Chairman: Nancy Iwamoto, Honeywell Specialty Materials; Hélène Frémont, IMS Bordeaux |
|||
| 14:00 | 30mn | Keynote presentation – Transport of Moisture at Epoxy-SiO2 Interfaces Investigated by Molecular Modeling Corresponding Author: Ole Hölck – Fraunhofer IZM O. Hölck 1, J. Bauer 1, T. Braun 1, H. Walter 1, O. Wittler 1, B. Wunderle 2 1 Fraunhofer IZM, Berlin, Germany 2 Chemnitz University of Technology, Chemnitz, Germany |
|
| 14:30 | 20mn | Study of CNT Growth Termination Mechanism: Effect of Catalyst Diffusion Corresponding Author: Zhaoli GAO – The Hong Kong University of Science and Technology Zhaoli Gao, M. M. F. Yuen, Hong Kong University of Science and Technology |
|
| 14:50 | 20mn | Sintering Process of Silver Nanoparticles in Ink-Jet Printed Conductive Microstrucutres – Molecular Dynamics Approach Corresponding Author: Tomasz Fałat – Wrocław University of Technology Tomasz Falat, Bartosz Platek, Jan Felba, Wroclaw University of Technology, Poland |
|
| 15:10 | 20mn | Wettability of Organic Ferroelectric Material on Metal Substrate Corresponding Author: William Hua – Hong Kong University of Science & Technology William HAU 1, Nancy IWAMOTO 2, Hai-bo FAN 3, Guo-dong ZHU 4, Jun WANG 4, Matthew M.F. YUEN 1 1 Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong 2 Honeywell Specialty Materials 3 Philips (China) Investment Co., Ltd. 4 Department of Materials Science, Fudan University |
|
| 15:30 | 20mn | Molecular Modeling of the Conductivity Changes of the Emeraldine Base Polyaniline due to Protonic Acid Doping Corresponding Author: Xianping CHEN – Delft University of Technology Xianping Chen 1, Cadmus A. Yuan 2, Cell K. Y. Wong 1, Guoqi Zhang 1 1 Delft University of Technology, the Netherlands 2 TNO IenT, Materials Technology, the Netherlands |
|
| Session 4 | 14:00 | Monday Apr 16 2012 | |
| Thermal Behavior Modeling and Characterization Chairman: Jeff Punch, University of Limerick; Miquel Vellvehi, IMB-CNM (CSIC) |
|||
| 14:00 | 30mn | Keynote presentation – Thermal Modelling and Optimisation of Hot Solder Dip Process Corresponding Author: Stoyan Stoyanov – University of Greenwich Stoyan Stoyanov 1, Chris Bailey 1, Peter Tollafield 2, Rob Crawford 2, Mike Parker 2, Jim Scott 3, John Roulston 4 1 University of Greenwich, London, UK 2 Micross Components Ltd, Crewe, UK 3 Selex Galileo, Edinburgh, UK 4 Scimus Solutions, Edinburgh, UK |
|
| 14:30 | 20mn | Thermal Performances Evaluation of New High Temperature Power Packages using SiC Devices Corresponding Author: Alexandrine GUEDON-GRACIA – IMS Laboratory Gracia Alexandrine, Azzopardi Stéphane, Woirgard Eric, IMS lab, University of Bordeaux, France |
|
| 14:50 | 20mn | Thermal Modeling of Active Embedded Chip into High Density Electronic Board Corresponding Author: MONIER VINARD ERIC – Thales global services Dia Tidiane Cheikh, Eric Monier-vinard, Valentin Bissuel, Olivier Daniel , Thales Global Services, France |
|
| 15:10 | 20mn | Simulation of the Frequency Response of a Thermal Flow Sensor in Gaseous Media Corresponding Author: Diego Fernando Reyes Romero – Laboratory for Sensors, IMTEK, University of Freiburg Diego Fernando Reyes-Romero, Gerald Anton Urban, Laboratory for Sensors, Department of Microsystems Engineering (IMTEK), University of Freiburg, Freiburg, Germany |
|
| 15:30 | 20mn | Thermal Management for Stackable Package with Stacked ICs Corresponding Author: Lutz Meinshausen – Leibniz Universität Hannover, Information Technology Laboratory Lutz Meinshausen 1, Kirsten Weide-Zaage 2, Hélène Frémont 1 1 IMS Université Bordeaux I, Talence, France 2 LFI Leibniz University Hannover, Hanover, Germany |
|
| Session 5 | 16:20 | Monday Apr 16 2012 | |
| Reliability Modeling Chairman: Rainer Dudek, Fraunhofer ENAS; Müge Erinc, TNO Science and Industry |
|||
| 16:20 | 30mn | Keynote presentation – Thermal-Mechanical Responses of 3D IC Integration with a Passive TSV Interposer Corresponding Author: John H Lau – ITRI John H. Lau, Shang-Tsai Wu, Heng-Chieh Chien, Electronics & Optoelectronics Research Laboratory, ITRI, Taiwan |
|
| 16:50 | 20mn | Failure Modeling of BGA Package for Reliability Evaluation of Handheld Device Corresponding Author: Soonwan Chung – Samsung Electronics Co., Ltd. Soonwan Chung, Jae Kwak, Seunghee Oh, Changsun Kang, Samsung Electronics Co., Ltd. |
|
| 17:10 | 20mn | Increasing the Robustness for Reliable Packages by Prediction of Delamination by Cohesive Zone Element Simulation Corresponding Author: Dr. Reinhard Pufall – Infineon Technologies AG R. Pufall 1, M. Goroll 1, W. Kanert 1, R. Dudek 2 1 Infineon Technolgies AG, Neubiberg 2 Fraunhofer ENAS, Chemnitz |
|
| 17:30 | 20mn | Thermo-Mechanical Investigation of the Reliability of Embedded Components in PCBs during Processing and Under Bending Loading Corresponding Author: Sander Noijen – Bilim Atli-Veltin – Philips Research Bilim Atli-Veltin 1, Huang Ling 2, Susan Zhao 1, Sander Noijen 1, Jo Caers 1, Liu Weifeng 2, Gao Feng 2, Ye Yuming 2 1 Philips Research 2 Shenzhen Huawei Technologies Software CO., LTD. |
|
| Session 6 | 16:20 | Monday Apr 16 2012 | |
| Process Modelling Chairman: Bernd Schwarz, Siemens; Xuejun Fan, Lamar University |
|||
| 16:20 | 30mn | Keynote presentation – Simulation of Diffusion Controlled Intermetallic formation of Au/Al Interface Corresponding Author: Rui Huang – Infineon Technologies AG Rui Huang 1, Yik Yee Tan 2, Juergen Walter 3, Heinz Pape 1, Xuejun Fan 4, Heinrich Koerner 1 1 Infineon Technologies AG, Neubiberg, Germany 2 Infineon Technologies (Malaysia) Sdn, Malacca, Malaysia 3 Infineon Technologies AG, Regensburg, Germany 4 Lamar University, Texas, USA |
|
| 16:50 | 20mn | Influence of the Barrier Properties on the Mechanical Stress and Migration Distribution in a Copper Metallization Corresponding Author: Jörg Kludt – Leibniz Universität Hannover, Information Technology Laboratory J. Kludt, J. Ciptokusumo, K. Weide-Zaage, Information Technology Laboratory, Leibniz Universität Hannover |
|
| 17:10 | 20mn | A Model of Electric Field Assisted Capillarity for the Fabrication of Hollow Polymer Microstructures Corresponding Author: Catherine E. H. Tonry – School of Computing and Mathematical Sciences, University of Greenwich C. Tonry 1, M. K. Patel 1, Chris Bailey 1, M. P. Y. Desmuliez 2, S. Cargill 2, W. Yu 3 1 Computational Mechanics and Reliability Group (CMRG), School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London SE10, 9LS, UK 2 Microsystems Engineering Centre (MISEC), School of Engineering & Physical Sciences, Heriot-Watt University, Earl Mountbatten Building, Edinburgh EH14 4AS, UK 3 State Key Laboratory of Applied Optics, Changchun Institute of Optics, Fine mechanics and Physics, Chinese Academy of Sciences, 3888 Dongnanhu Road, Changchun, Jilin, P. R. China |
|
| 17:30 | 20mn | Multi-physics Simulation and Reliability Analysis for LED Lamp Under Step Stress Accelerated Degradation Test Corresponding Author: Hongyu Tang – Guilin University of Electronic Technology Hongyu Tang 1, D.G. Yang 1, G.Q. Zhang 2, Fengze Hou 1, Miao Cai 1, Zaifu Cui 1 1 Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China 2 Delft University of Technology, The Netherlands |
|
| Session 7 | 16:20 | Monday Apr 16 2012 | |
| Electrothermal Modeling and Characterization Chairman: Xavier Perpiñà, IMB-CNM (CSIC); Pradeep Lall, Auburn University |
|||
| 16:20 | 30mn | Keynote presentation – Transient Electrothermal Simulation of Interconnected Systems Corresponding Author: Torsten Hauck – Freescale Halbleiter GmbH Torsten Hauck, Freescale Deutschland GmbH Evgeny Rudnyi, CADFEM GmbH |
|
| 16:50 | 20mn | Effect of Source Metallization Ageing on Power MOSFET Behavior Corresponding Author: Toufik AZOUI – LAAS-CNRS Toufi Azoui 1, Patrick Tounsi 1, Philippe Dupuy 2, Jean-Marie Dorkel 1, Donatien Martineau 3 1 LAAS-CNRS 2 FreeScale semiconductors 3 CEMES-CNRS |
|
| 17:10 | 20mn | Electro-Thermal Simulation of a Semiconductor Power Switch Considering Damage Effects Corresponding Author: Torsten Hauck – Freescale Halbleiter Deutschland GmbH Ilko Schmadlak, Torsten Hauck, Freescale Halbleiter Deutschland GmbH |
|
| 17:30 | 20mn | 2D Finite Elements Electro-Thermal Modeling for IGBT: Uni and Multicellular Approch Corresponding Author: EL BOUBKARI Kamal – Laboratoire IMS K. El Boubkari, S. Azzopardi, L. Théolier, J.Y. Deletage, E. Woirgard, Université de Bordeaux, IMS, Talence, France |
|
| Session 8 | 09:00 | Tuesday Apr 17 2012 | |
| Health Monitoring Chairman: Alexander Gielen, TNO; Frank Krämer, Saarland University |
|||
| 09:00 | 30mn | Keynote presentation – Interrogation of Thermo-Mechanical Damage in Field-Deployed Electronics Corresponding Author: Pradeep Lall – Auburn University Pradeep Lall 1, Mahendra Harsha 1, Kai Goebel 2, Jim Jones 3 1 Auburn University 2 NASA Ames Research Center 3 Oracle Corporation |
|
| 09:30 | 20mn | Stress Chip Measurements of Internal Package Stresses for Process Characterization and Health Monitoring Corresponding Author: Sven Rzepka – Fraunhofer ENAS, Micro Materials Center Florian Schindler-Saefkow 1, Florian Rost 2, Alexander Otto 3, Wolfgang Faust 2, Bernhard Wunderle 4, Bernd Michel 2, Sven Rzepka 2 1 Fraunhofer ENAS, Micro Materials Center, Chemnitz; Germany & AMIC Angewandte Micro-Messtechnik GmbH, Berlin 2 Fraunhofer ENAS, Micro Materials Center, Chemnitz; Germany 3 Fraunhofer ENAS, Micro Materials Center, Chemnitz; Germany & Berliner Nanotest and Design GmbH, Berlin 4 Fraunhofer ENAS, Micro Materials Center, Chemnitz; Germany & Technische Universität Chemnitz |
|
| 09:50 | 20mn | An Approach to Life Consumption Monitoring of Solder Joints in Operating Temperature Environment Corresponding Author: ILJA BELOV – School of Engineering, Jönköping University Jonas Johansson, Saab AB, Business Area Electronic Defence Systems, Jönköping, Sweden, and Dept. Mechanical Engineering, School of Engineering, Jönköping University, Jönköping, Sweden Ilja Belov, Dept. Mechanical Engineering, School of Engineering, Jönköping University, Jönköping, Sweden Erland Johnson, SP Technical Research Institute of Sweden, Borås, Sweden Peter Leisner, SP Technical Research Institute of Sweden, Borås, Sweden, and Dept. Mechanical Engineering, School of Engineering, Jönköping University, Jönköping, Sweden |
|
| Session 9 | 09:00 | Tuesday Apr 17 2012 | |
| Process Modelling and MEMS Structures Chairman: Mike Röllig, Fraunhofer IZFP; Michael Guyenot, Robert Bosch GmbH |
|||
| 09:00 | 30mn | Keynote presentation – Studies on the Transitional Behaviors of Au-to-Au Micro-Contact during the Initialization Stage of Contact Formation Under Low Contact Force Corresponding Author: Qiu Haodong – Nanyang Technological University Haodong Qiu 1, Hong Wang 1, Feixiang Ke 2 1 Microelectronics Centre, School of Electrical and Electronic Engineering, Nanyang Technological University, Republic of Singapore 2 Temasek Laboratories @ NTU, Republic of Singapore |
|
| 09:30 | 20mn | Reliability and Functionality Investigation of CFRP Embedded Ultrasonic Transducers Supported by FEM and EFIT Simulations Corresponding Author: Mike Roellig – Fraunhofer Institute for Nondestructive Testing Mike Roellig 1, Frank Schubert 1, Georg Lautenschlaeger 1, Bjoern Boehme 2, Michael Franke 3, Norbert Meyendorf 1 1 Fraunhofer Institut for Non-destructive Testing,IZFP-D, Dresden, Germany 2 Electronics Packaging Laboratory, TU Dresden, Germany 3 Cotesa GmbH, Mittweida, Germany |
|
| 09:50 | 20mn | Measurement and Simulation of Moisture effects on Electromagnetic Radiation of Printed Circuit Boards Corresponding Author: Hassene Fridhi – IMS-Bordeaux H.Fridhi, G.Duchamp, V. Vigneras, A. Guedon-Gracia, J.Y.Deletage, H.Frémont, T. Dubois, IMS-Bordeaux, Talence, France |
|
| Session 10 | 09:00 | Tuesday Apr 17 2012 | |
| Solid State Lighting Thermal Analysis Chairman: Peter Rodgers, Valerie Eveloy, The Petroleum Institute |
|||
| 09:00 | 30mn | Keynote presentation – Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards Corresponding Author: Fargeix Alain – CEA-LETI B. Pardo 1, A. Gasse 1, A. Fargeix 1, J. Jakovenko 2, R.J. Werkhoven 3, X. Perpiñà 4, T. Van Weelden 5, P. Bancken 6 1 CEA-LETI, Grenoble, France 2 Czech Technical University, Prague, Czech Republic 3 TNO, Eindhoven, The Netherlands 4 IMB-CNM, Bellaterra, Spain 5 Boschman Technologies, Duiven, The Netherlands 6 Philips Lighting, Eindhoven, The Netherlands |
|
| 09:30 | 20mn | Dynamic Thermal Simulation of High Brightness LEDs with Unsteady Driver Power Output Corresponding Author: Huaiyu Ye – TUDelft H.ye, Sau Koh, J.Wei, H.W.vanZeijl, G.Q.Zhang, Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Mekelweg 6, 2628CD, Delft, Netherlands |
|
| 09:50 | 20mn | Thermal Improvement of Die Attach with Iodine Treat-ment and Its Application in Solid State Lighting Corresponding Author: Kai Zhang – The Hong Kong University of Science and Technology Kai ZHANG 1, Xinfeng ZHANG 1, Min ZHANG 1, Chen YANG 1, Hongye SUN 1, Matthew YUEN 1, Barry ZHONG 2, Aernout Reints BOK 2, Lisa LIU 2, Cheuk Yan CHAN 2, Guoqi ZHANG 3 1 Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China 2 Philips (China) Investment Co., Ltd, Philips Innovation Campus Shanghai No.2 Building, No.9, Lane 888, Tian Lin Road, Shanghai, 200233, China 3 Philips Lighting, Building EEA-208, Mathildelaan 1, 5611 BD Eindhoven, Netherlands |
|
| Session 11 | 11:00 | Tuesday Apr 17 2012 | |
| Thermo-Mechanical Issues in Microelectronics Chairman: Kaspar Jansen, TU Delft; Heinz Pape, Infineon Technologies |
|||
| Evaluation of Quasi-Hermetic Packaging Solutions for Active Microwave Devices and Space Applications Corresponding Author: Walim BEN NACEUR – LABORATOIRE IMS, CNRS, UNIVERSITE BORDEAUX 1, IPB Ben Naceur W. 1, Malbert N. 1, Labat N. 1, Fremont H. 1, Muraro J.L. 2, Monfraix P. 2 1 IMS Laboratory, Bordeaux, France 2 Thales Alenia Space, Toulouse, France |
|||
| Effect of Isothermal Aging and Salt Spray Tests on Reliability and Mechanical Strength of Eutectic Sn-Bi Lead-Free Solder Joints Corresponding Author: Milad Mostofizadeh – Tampere University of Technology Milad Mostofizadeh, Juha Pippola, Tuomas Marttila, Laura Frisk, Tampere University of Technology, Tampere, Finland |
|||
| An Extensive Investigation of the Four Point Bending Test for Interface Characterization Corresponding Author: Sander Noijen – Philips Research Sander Noijen, Olaf van der Sluis, Peter Timmermans, Philips Research |
|||
| Shear Stress Modelling of ACA Joints in Thermal Tests Corresponding Author: Kirsi Saarinen – Tampere University of Technology Kirsi Saarinen, Laura Frisk, Tampere University of Technology, Tampere, Finland |
|||
| Evaluation of Very Low Bending Radius of Flexible Circuits Beyond the Standard Rules Corresponding Author: Wilson Maia – Thales Global Services Wilson Carlos Maia Filho 1, Solenne Hameau 2, Michel Brizoux 1 1 Thales Global Services 2 Thales Communications & Security |
|||
| 3-D Finite Elements Simulation of Drop Test Reliability on a Chip Scale Package: Focus on the Component Architecture and Materials Corresponding Author: BELHENINI Soufyane – Ecole Polytechnique de l\’Université de Tours BELHENINI Soufyane 1, BOUCHOU Abdelhake 2, DOSSEUL Franck 3, TOUGUI Abdellah 1 1 LMR.EPU, Université de Tours, France 2 LMR.ENIVL, France 3 STMicroelectronics,Tours, France |
|||
| In Situ Vibration Measurements on Power Modules Under Operating Conditions Corresponding Author: Bernhard CZERNY – University of Vienna, Faculty of Physics B. Czerny 1, B. Nagl 2, M. Lederer 1, A. Trnka 2, G. Khatibi 1, M. Thoben 3 1 University of Vienna Faculty of Physics, Vienna, Austria 2 Siemens AG, Vienna, Austria 3 Infineon Technologies, Warstein, Germany |
|||
| A Novel Wafer-Level Test Method to Measure the Bond Strength in Microelectronic Materials Corresponding Author: Sara Carniello – Austriamicrosystems AG Sara Carniello, Jörg Siegert, Bernhard Löffler, Ewald Stückler, Austriamicrosystems AG, Unterpremstätten, Austria |
|||
| Accelerated Lifetime Measurements of Cu-Al Ball Bonded Interconnects Corresponding Author: Dr. Golta Khatibi – University of Vienna, Faculty of Physics Alice Lassnig 1, Rainer Pelzer 2, Golta Khatibi 1, Brigitte Weiss 1, Michael Nelhiebel 2 1 University of Vienna, Austria 2 Infineon Technologies Austria AG |
|||
| Cu/Epoxy Interface Enhancement and Characterization with Thiol Treatment Corresponding Author: Peng He – The Hong Kong University of Science and Technology Peng He, Matthew M. F. Yuen, Hong Kong University of Science and Technology |
|||
| Parameter Optimization of Torque Wireless Sensors based on Surface Acoustic Waves (SAW) Corresponding Author: Jürgen Wilde, Thomas Fellner, Elena Zukowski – University of Freiburg-IMTEK, Department of Microsystems Engineering, Laboratory for Assembly and Packaging Elena Zukowski, Thomas Fellne, Jürgen Wilde, Michael Berndt, University of Freiburg-IMTEK, Germany |
|||
| Lifetime Assessment of BGA Solder Joints with Voids Under Thermomechanical Load Corresponding Author: Robert Schwerz – TU-Dresden Robert Schwerz 1, Mike Roellig 2, Karsten Meier 1, Klaus-Juergen Wolter 1 1 Electronics Packaging Laboratory, Technische Universität Dresden 2 Fraunhofer Institute for Non-Destructive Testing, Dresden Branch, IZFP-D |
|||
| FEM Stress Analysis in BGA Components Subjected to JEDEC Drop Test Applying High Strain Rate Lead-Free Solder Material Models Corresponding Author: Frank Kraemer – University of Saarland Frank Kraemer 1, Karsten Meier 2, Steffen Wiese 1, Sven Rzepka 3 1 Saarland University 2 Technische Universität Dresden 3 Fraunhofer ENAS Chemnitz |
|||
| Simulation and Qualification of an System-in-Package (SiP) Based Solid State Lighting (SSL) Module Corresponding Author: Dr. Daniel Farley – TU Delft Daniel Farley 1, F. Boschman 2, J.E. Bullema 3, A.W.J. Gielen 3, P. Hesen 4, J.P.H.M. Krugers 3, F. Swartjes 5, H. van Zeijl 1, G.Q. Zhang 6 1 Delft University of Technology 2 Boschman Technologies 3 TNO: NL Organization for Applied Scientific Research 4 Philips Research 5 NXP Semiconductors 6 Delft University of Technology, Philips Research |
|||
| 3D Deformation FEM Simulations and Measurement during VDMOS Transistor Operation Corresponding Author: MARCAULT Emmanuel – LAAS-CNRS E. Marcault 1, D. Weidmann 2, A. Bourennane 1, M. Breil 1, L. Charpiot 2 1 CNRS, LAAS, Toulouse, France 2 INSIDIX, Seyssins, France |
|||
| Investigation of Interface Delamination in a SO8 Package Under Reflow Corresponding Author: Yong Liu – Fairchild Semiconductor Corp. Yumin Liu, Fairchild Semiconductors, Suzhou, China Yong Liu, Fairchild Semiconductors, South Portland, USA Suresh Belani, Fairchild Semiconductors, San Jose, USA Oseob Jeon, Fairchild Semiconductors, Bucheon, Korea |
|||
| Finite Element Modeling of Solder Joint Fatigue Under Four-Point Bending Test at Elevated Temperature Corresponding Author: Baris Sabuncuoglu – IMEC Baris Sabuncuoglu 1, Filip Vanhee 2, Geert Willems 3, Bart Vandevelde 3, Dirk Vandepitte 4, Ingrid De Wolf 1 1 IMEC, Leuven, Belgium & KULeuven, Leuven, Belgium 2 KHBO, Oostende, Belgium 3 IMEC, Leuven, Belgium 4 KULeuven, Leuven, Belgium |
|||
| Characterization of Adhesives and Interface Strength for Automotive Applications Corresponding Author: Berkan Oeztuerk – Robert Bosch GmbH, Automotive Electronics B. Öztürk 1, P. Gromala 2, C.Otto 2, A. Fischer 2, K.M.B. Jansen 3, L.J. Ernst 3 1 Robert Bosch GmbH, Reutlingen, Germany; Delft University of Technology, The Netherlands 2 Robert Bosch GmbH, Reutlingen, Germany 3 Delft University of Technology, The Netherlands |
|||
| Experimental System for Analysing the Combined Loading and Failure Modes of Solder Joints in Electronic Packaging Corresponding Author: Krystian Jankowski – Wroclaw University of Technology Krystian Jankowski 1, Artur Wymysłowski 1, Didier Chicot 2 1 Wroclaw University of Technology, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Polnad 2 Universite Lille Nord de France, F-59659 Villeneuve d’Ascq, France |
|||
| Trends and challenges in Lead Free Soldering Corresponding Author: Eduardo Dias Lopes – ISQ Dias Lopes, E. M., ISQ, Instituto de Soldadura e Qualidade, Oeiras, Portugal; ISEL, Departamento de Engenharia Mecânica, Lisboa, Portugal Margarida Pinto, ISQ, Instituto de Soldadura e Qualidade, Oeiras, Portugal Eurico Assunção, EWF, Oeiras, Portugal Luisa Coutinho, TU-Lisbon, Instituto Superior Técnico, Lisboa, Portugal |
|||
| Session 12 | 11:00 | Tuesday Apr 17 2012 | |
| Multi-Physics and Thermal Issues in Microelectronics Chairman: Kaspar Jansen, TU Delft; Heinz Pape, Infineon Technologies |
|||
| 3D Electrostatic Microgenerator Corresponding Author: Janicek Vladimir – FEE CTU in Prague, Department of Microelectronics Janicek Vladimir, Husak Miroslav, FEE CTU in Prague, Czech Republic |
|||
| Thermosonic Flip-chip Assembly on Flex Substrates Corresponding Author: Guangbin Dou – Imperial College London Guangbin Dou, Andrew S. Holmes, Imperial College London, London, United Kingdom |
|||
| Mechanical and Tribological Characterizations for Reliability Design of Micromembranes Corresponding Author: Pustan Marius – Technical University of Cluj-Napoca Pustan Marius, Birleanu Corina, Dudescu Cristian, Belcin Ovidiu, Technical University of Cluj-Napoca, Romania |
|||
| MEMS Accelerometers and their Bio-Applications Corresponding Author: Willem D. van Driel – Delft University of Technology M. Trifunovic, A.M. Vadiraj, W.D. van Driel, TU Delft, The Netherlands |
|||
| Establishment of the Mesoscale Parameters for Epoxy-Copper Interfacial Separation Corresponding Author: Cell K Y Wong – Delft University of Technology C. K. Y. Wong 1, S. Y. Y. Leung 1, R.H. Poelma 2, K.M.B. Jansen 1, C. C. A. Yuan 3, W. D. van Driel 4, G. Q. Zhang 4 1 Faculty 3mE, Department PME, Delft University of Technology 2 2Faculty EWI, Department of Microelectronics, Delft University of Technology 3 TNO, the Netherlands 4 Philips Lighting, The Netherlands |
|||
| Influence of Conversion Level on Simulation Results of Crosslinked Polymers Corresponding Author: Sebastian J. Tesarski – Wrocław University of Technology Sebastian J. Tesarski 1, Artur Wymysłowski 1, Ole Hölck 2 1 Wroclaw University of Technology, Wrocław, Poland 2 Fraunhofer Institut Zuverlässigkeit und Mikrointegration, Berlin, Germany |
|||
| The Method of Lines for the Analysis of Mechanical Structures Corresponding Author: Larissa Vietzorreck – TU Munich Amirali Taghavi, Larissa Vietzorreck, TU München, München, Germany |
|||
| In-situ Moisture Desorption Characterization of Epoxy Mold Compound Corresponding Author: Xuejun Fan – Lamar University Xuejun Fan, Vishal Nagaraj, Lamar University, USA |
|||
| Thermal and Moisture Degradation in SSL System Corresponding Author: S. koh – Delft University of Technology Sau Koh 1, Willem VD Driel 2, G.Q. Zhang 2 1 Delft Institute of Microsystems and Nanoelectronics (Dimes) 2 Philips Lighting |
|||
| Investigation of Chip Temperature Related to Various Copper Thickness on Glass-Fabric-Based Substrate Corresponding Author: Chen-Chia Chen – National Chip Implementation Center Jin-Ju Chue, Chih-Chyau Yang, Chen-Chia Chen, Chun-Chieh Chiu, Chien-Ming Wu, Chun-Ming Huang, National Chip Implementation Center, Hsinchu, Taiwan |
|||
| Viscoplastic Behavior of Diamond Die Attach Subjected to High Temperature Conditions Corresponding Author: Ahlem BAAZAOUI – Laboratoire Génie de Production à l\’Ecole Nationale d\’Ingénieurs de Tarbes S. MSOLLI, A. BAAZAOUI, O. DALVERNY, J. ALEXIS, M. KARAMA, Université de Toulouse ; INP/ENIT ; LGP ; Tarbes, France |
|||
| Modelling of Temperature Distribution in Thermal Microsensors on Sandwich Thermally Isolated Structures Corresponding Author: Alexander Kozlov – Omsk State University Alexander Kozlov , Omsk State University, Omsk, Russia Danijela Randjelovic, IHTM-Institute of Microelectronic Technologies and Single Crystals, Belgrade, Serbia |
|||
| A Cost-effective Active Cooling Method: Thermal Performance and Cost Analysis Corresponding Author: Sheng Liu – Huazhong University of Science and Technology Sheng Liu, Ling Xu, Mingxiang Chen, Huazhong University of Sci & Tech, Wuhan, China |
|||
| Experimental Assessment of Flat-type Photovoltaic Module Thermal Behavior Corresponding Author: Peter Rodgers, Valerie Eveloy, Shrinivas Bojanampati – The Petroleum Institute Shrinivas Bojanampati, Peter Rodgers, Valérie Eveloy, The Petroleum Institute, Abu Dhabi, United Arab Emirates |
|||
| Session 13 | 13:30 | Tuesday Apr 17 2012 | |
| Experimental Investigations Chairman: E. Dias Lopes, ISQ; M. Gonzalez, IMEC |
|||
| 13:30 | 30mn | Keynote presentation – Wafer Level System Packaging and Integration for Solid State Lighting (SSL) Corresponding Author: Xuejun Fan – Lamar University Xuejun Fan, Lamar University, USA |
|
| 14:00 | 20mn | Material Characterization to Model Linear Viscoelastic Behavior of Thin Organic Polymer Films in Microelectronics Corresponding Author: Katrin Unterhofer – Infineon Technologies AG Katrin Unterhofer 1, Halald Preu 1, Jürgen Walter 1, Georg Lorenz 2, Walter Mack 1, Matthias Petzold 2 1 Infineon Technologies AG, Regensburg, Germany 2 Fraunhofer Institute for Mechanics of Materials, Halle, Germany |
|
| 14:20 | 20mn | In-Situ Characterization of Moisture Induced Swelling Behaviour of Microelectronic Relevant Polymers Corresponding Author: Dr. Hans Walter – Fraunhofer IZM H. Walter 1, J. Bauer 1, T.Braun 1, O.Hölck 1, B.Wunderle 2, O.Wittler 1 1 Fraunhofer IZM, Berlin, Germany 2 Chemnitz University of Technology, Chemnitz, Germany |
|
| 14:40 | 20mn | Transient Thermal Analysis as Failure Analytical Tool in Electronic Packaging Corresponding Author: Daniel May – Technical University Chemnitz D. May 1, B. Wunderle 1, R. Schacht 2, B. Michel 3 1 Technical University Chemnitz 2 University of Applied Sciences Lausitz 3 Fraunhofer Institute ENAS |
|
| 15:00 | 20mn | Combined Creep and Fatigue Measurement Method for Lead-Free Solder Alloys Corresponding Author: René Metasch – Fraunhofer Institute for Non-Destructive Testing R. Metasch 1, M. Roellig 1, K.-J. Wolter 2 1 Fraunhofer Institute for non-destructive testing, Branch Dresden, Germany/Saxony 2 Technische Universität Dresden, Electronic Packaging Laboratory, Germany |
|
| Session 14 | 13:30 | Tuesday Apr 17 2012 | |
| MEMS Applications Chairman: A. Corigliano, A. Frangi, Politecnico di Milano |
|||
| 13:30 | 30mn | Keynote presentation – Consistent Analytical Model for Single and Dual Thickness Capacitive Micromachined Ultrasound Transducers (cMUT) Corresponding Author: Xavier Rottenberg – IMEC X. Rottenberg, A. Erismis, P.Czarnecki, Ph. Helin, A. Verbist, H. A. C. Tilmans, IMEC v.z.w., Leuven, Belgium |
|
| 14:00 | 20mn | Optimized Design and Placement of Piezoelectric Transducers for Micromechanical Structures Subjected to Membrane Stresses Corresponding Author: Guilherme Brondani Torri – IMEC G. B. Torri 1, X. Rottenberg 1, D. M. Karabacak 2, M. Vandecasteele 2, C. Van Hoof 1, R. Puers 3, H. A. C. Tilmans 1 1 IMEC, Heverlee, Belgium 2 Holst Centre/IMEC, Eindhoven, The Netherlands 3 KU Leuven, Heverlee, Belgium |
|
| 14:20 | 20mn | Study of an Active Thermal Recovery Mechanism for an Electrostatically Actuated RF-MEMS Switch Corresponding Author: Thomas Künzig – Munich University of Technology Thomas Kuenzig 1, Jacopo Iannacci 2, Gabriele Schrag 1, Gerhard Wachutka 1 1 Munich University of Technology, Munich, Germany 2 Fondazione Bruno Kessler, Trento, Italy |
|
| 14:40 | 20mn | Experimental and Numerical Assessment of Adhesion in Real-Life Mems Corresponding Author: Raffaele Ardito – Politecnico di Milano Raffaele Ardito, Leonardo Baldasarre, Alberto Corigliano, Biagio De Masi, Attilio Frangi, Luca Magagnin, Politecnico di Milano |
|
| 15:00 | 20mn | A Parametric Multilevel MEMS Simulation Methodology using Finite Element Method and Mesh Morphing Corresponding Author: Vladimir A. Kolchuzhin – Chemnitz University of Technology, Department of Microsystems and Precision Engineering Vladimir A. Kolchuzhin, Jan E. Mehner, Chemnitz University of Technology, Department of Microsystems and Precision Engineering, Germany |
|
| Session 15 | 13:30 | Tuesday Apr 17 2012 | |
| Interface Simulations Chairman: B. Wunderle, Chemnitz University of Technology; M. Jungwirth, University of Applied Sciences Upper Austria |
|||
| 13:30 | 30mn | Keynote presentation – Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface (Part III): Interface Roughness Corresponding Author: Nancy Iwamoto – Honeywell Specialty Materials Nancy Iwamoto, Honeywell Specialty Materials |
|
| 14:00 | 20mn | Nonlinear Copper Behavior of TSV and the Cracking Risks during BEoL-Built-up for 3D-IC-Integration Corresponding Author: Juergen Auersperg – Fraunhofer ENAS Juergen Auersperg, Dietmar Vogel, Ellen Auerswald, Sven Rzepka, Bernd Michel, Micro Materials Center, Fraunhofer ENAS, Chemnitz, Germany |
|
| 14:20 | 20mn | Cohesive Zone Model for Delamination Analysis of an Embedded Die System in Package Corresponding Author: Yong Liu – Fairchild Semiconductor Corp. Xiaopei Li 1, Jianghai Gu 1, Yangjian Xu 1, Yong Liu 2 1 Zhejiang University of Technology, China 2 Fairchild Semiconductors, USA |
|
| 14:40 | 20mn | Investigation on the Effect of Surface Roughness on the Fracture Strength of SCS Corresponding Author: Kuo-Ning Chiang – Dept. of Power Mechanical Engineering National Tsing Hua University C. T. Lai, T. Y. Hung, K. N. Chiang, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R. O. C. |
|
| 15:00 | 20mn | A Simplified and Meaningful Crack Propagation Model in Silicon for Microelectronic Power Devices Corresponding Author: Calvez Damien – STMicroelectronics Damien Calvez 1, Fabrice Roqueta 2, Sébastien Jacques 2, Samuel Ducret 2, Laurent Bechou 1, Yves Ousten 1 1 IMS Laboratory, France 2 STMicroelectronics Tours, France |
|
| Session 16 | 16:00 | Tuesday Apr 17 2012 | |
| Thermo-Mechanical Modeling Chairman: Jürgen Auersperg, Sven Rzepka, Fraunhofer ENAS |
|||
| 16:00 | 30mn | Keynote presentation – Weibull Stress Analysis for Failure of Semiconductor Package Corresponding Author: Hideo Aoki, Kanako Sawada – Toshiba Eigo Matsuura 1, Kanako Sawada 1, Hideko Mukaida 1, Hideo Aoki 1, Fumiyoshi Minami 2 1 Toshiba Corporation, Yokohama, Japan 2 Osaka University, Japan |
|
| 16:30 | 20mn | Multiscale Modeling of Residual Stresses in Isotropic Conductive Adhesives with Nano Particles Corresponding Author: Muge Erinc – TNO Science and Industry Muge Erinc 1, Marius van Dijk 2, Varvara Kouznetsova 2 1 TNO Science and Industry, The Netherlands 2 Eindhoven University of Technology, The Netherlands |
|
| 16:50 | 20mn | Testing and Multiscale Modeling of Drop and Impact Loading of Complex MEMS Microphone Assemblies Corresponding Author: Jingshi Meng – University of Maryland J. Meng 1, T. Mattila 1, A. Dasgupta 1, M. Sillanpaa 2, R. Jaakkola 2, K. Andersson 2, E. Hussa 2 1 CALCE Electronic Products and System Center, University of Maryland, USA 2 Nokia Corporation, Salo, Finland |
|
| 17:10 | 20mn | Simulations of High Temperature Pressure Sensor Packaging and Interconnections Corresponding Author: Klas Brinkfeldt – Swerea IVF Klas Brinkfeldt 1, Jan Formánek 2, Alexander Laposa 2, Jíří Jakovenko 2, Erik Adolfsson 1, Per Johander 1 1 Swerea IVF, Argongatan 30, SE-431 53 Mölndal, Sweden 2 Czech Technical University, Faculty of El. Eng., Department of Microelectronics, Technicka 2, CZ 166 27 Prague, Czech Republic |
|
| 17:30 | 20mn | Assessment of Thermo-Mechanical Stresses in Low Temperature Joining Technology Corresponding Author: Thomas Herboth – Robert Bosch GmbH Thomas Herboth 1, Christiane Früh 1, Michael Günther 1, Jürgen Wilde 2 1 Robert Bosch GmbH, Schwieberdingen, Germany 2 Albert-Ludwigs-Universität, Freiburg, Germany |
|
| Session 17 | 16:00 | Tuesday Apr 17 2012 | |
| Fracture Modelling and MEMS Analysis Chairman: Dag Anderson, Swerea; Alberto Corigliano, Politecnico di Milano |
|||
| 16:00 | 30mn | Keynote presentation – A Domain Decomposition Method for the Simulation of Fracture in Polysilicon MEMS Corresponding Author: Alberto Corigliano – Politecnico di Milano Federica Confalonieri, Giuseppe Cocchetti, Aldo Ghisi, Alberto Corigliano, Politecnico di Milano, Italy |
|
| 16:30 | 20mn | PZT Piezoelectric Coefficient extraction by PZT-Actuated Micro-Beam Characterization and Modeling Corresponding Author: Fabrice Casset – CEA-LETI, MINATEC Campus F. Casset 1, M. Cueff 1, A. Suhm 1, G. Le Rhun 1, J. Abergel 1, M. Allain, C. Dieppedale, T. Ricart 1, S. Fanget 1, P. Renaux 1, D. Faralli 2, P. Ancey 3, A. Devos 4, E. Defaÿ 1 1 CEA, LETI, MINATEC Campus, Grenoble, France 2 STMicroelectronics, Italy 3 STMicroelectronics, Crolles, France 4 IEMN/ISEN-CNRS, Lille, France |
|
| 16:50 | 20mn | Simulation of Thermo-Elastic losses in a Meta-Material Bulk Bar Resonator Corresponding Author: Roelof Jansen – IMEC R. Jansen, X. Rottenberg, V. Rochus, H.A.C. Tilmans, IMEC v.z.w., Leuven, Belgium |
|
| 17:10 | 20mn | Using an Electro-Thermo-Fluidic Model for the Design of a 3-Axis Thermal Accelerometer Corresponding Author: Luis Alexandre Machado da Rocha – University of Minho L.A. Rocha, C.S. Silva, A.J. Pontes , J.C. Viana, IPC\I3N – Institute for Polymers and Composites, University of Minho, Portugal |
|
| Session 18 | 16:00 | Tuesday Apr 17 2012 | |
| Solder Measurements and Modeling Chairman: Bong Tae. Han, CALCE; Michel Brizoux, Thales Global Services |
|||
| 16:00 | 30mn | Keynote presentation – Characterisation of Lead-free Solders at High Strain Rates Considering Microstructural Conditions Corresponding Author: Karsten Meier – TU Dresden, Electronics Packaging Laboratory Meier, K. 1, Kraemer, F. 2, Roellig, M. 3, Wolter, K.-J. 1 1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany 2 Saarland University, Saarbruecken, Germany 3 Fraunhofer IZFP-D, Dresden, Germany |
|
| 16:30 | 20mn | A Comparison of the Creep Behaviour of Joint-Scale SAC105 and SAC305 Solder Samples Under Shear Conditions. Corresponding Author: Cillian Burke – CTVR Stokes Institute Cillian Burke, Jeff Punch, CTVR, Stokes Institute, University of Limerick. |
|
| 16:50 | 20mn | Characterization of Intermetallic Compounds in Cu-Al Ball Bonds: Mechanical Properties, Interface Delamination and Thermal Conductivity Corresponding Author: Marcel Kouters – TNO Technical Sciences M.H.M. Kouters, G.H.M. Gubbels, C.A. Yuan, TNO Technical Sciences, Eindhoven, The Netherlands |
|
| 17:10 | 20mn | Simulation-based Predicition of Reliability and Robustness of Interconnect Systems for Semiconductor Applications Corresponding Author: Markus Ackermann – X-FAB Semiconductor Foundries AG Markus Ackermann 1, Verena Hein 1, Kirsten Weide-Zaage 2 1 X-FAB Semiconductor Foundries AG, Erfurt, Germany 2 LfI, Leibniz University of Hannover, Hannover, Germany |
|
| 17:30 | 20mn | Reliability Modeling of Electronic Systems subjected to High Strain Rates Corresponding Author: Pradeep Lall – Auburn University Pradeep Lall 1, Sandeep Shantaram 1, David Locker 2 1 Auburn University 2 US AMRDEC |
|
| Session 19 | 09:00 | Wednesday Apr 18 2012 | |
| Advances in Modeling and Testing Chairman: Xiao Hu Liu, IBM Watson Research Center; Steffen Wiese, Saarland University |
|||
| 09:00 | 30mn | Keynote presentation – Prospects for Waste Heat Recovery in Microelectronic Systems Corresponding Author: Peter Rodgers, Valérie Eveloy – The Petroleum Institute, Abu Dhabi Peter Rodgers, Valérie Eveloy, The Petroleum Institute, Abu Dhabi, UAE |
|
| 09:30 | 30mn | Keynote presentation – Photomechanics Methods as Tools for Semiconductor Package Development Corresponding Author: Pr BongTae Han – Universirty of Maryland Bongtae Han, Center for Advanced Life Cycle Engineering (CALCE), USA |
|
| 10:00 | 30mn | Keynote presentation – Comparison of Ni- and SiGe-Based MEMS Magnetometers Corresponding Author: Veronique Rochus – IMEC V. Rochus 1, R. Jansen 1, X. Rottenberg 1, H.A.C. Tilmans 1, S. Ranvier 2, H. Lamy 2, P. Rochus 3 1 IMEC, Leuven, Belgium 2 Belgian Institute for Space Aeronomy, Bruxelles, Belgium 3 Centre Spatial de Liège, Liège, Belgium |
|
| Session 20 | 11:00 | Wednesday Apr 18 2012 | |
| Thermo-Mechanics for New Applications Chairman: Michael Guyenot, Robert Bosch GmbH; Artur Wymyslowski, Wroclaw University |
|||
| 11:00 | 30mn | Keynote presentation – Mechanical Problems of Novel Back Contact Solar Modules Corresponding Author: Steffen Wiese – Saarland University Steffen Wiese 1, Frank Kraemer 1, Erik Peter 2, Jonas Seib 2 1 Saarland University 2 Robert Bosch GmbH |
|
| 11:30 | 20mn | GaN Growth on Patterned Silicon Substrates – A Thermo Mechanical Study on Wafer Bow Reduction Corresponding Author: Mario Gonzalez – IMEC Mario Gonzalez, Kai Cheng, Peter Tseng, Gustaaf Borghs, IMEC, Leuven, Belgium |
|
| 11:50 | 20mn | A Multivariate Parameter Analysis of Copper Pillars Eases the Design of Denser Interconnects Corresponding Author: Gerd Schlottig – IBM Research GmbH Gerd Schlottig, Thomas Brunschwiler, Javier Goicochea, Werner Escher, Bruno Michel, IBM Research, Rüschlikon, Switzerland |
|
| 12:10 | 20mn | Thermo-Mechanical Characterization and Modeling of TSV Annealing Corresponding Author: Peter Saettler – Technical University Dresden Peter Saettler 1, Daria Kovalenko 2, Karsten Meier 1, Mike Roellig 2, Mathias Boettcher 3, Klaus Juergen Wolter 1 1 Technische Universität Dresden, Germany 2 Fraunhofer Institut für Zerstörungsfreie Prüfung, Germany 3 Fraunhofer IZM-ASSID, Germany |
|
| 12:30 | 20mn | Thermo-Mechanical Reliability of Embedded Capacitors Corresponding Author: Antoine RENAULT – EADS Innovation Works A. Renault, C. Munier, EADS Innovation Works, Suresnes, France |
|
| Session 21 | 11:00 | Wednesday Apr 18 2012 | |
| Solid State Lighting Chairman: Christopher Bailey, University of Greenwich; Sheng Liu, Huazhong University of Science and Technology |
|||
| 11:00 | 30mn | Keynote presentation – Thermo-Mechanical Evaluation and Life Time Simulation of a High Power LED Lamp Boards Corresponding Author: Jiri Jakovenko – Czech Technical University in Prague, Faculty of Electrical Engineering J. Jakovenko 1, J. Formánek 1, B. Pardo 2, X. Perpiñà 3, R.J. Werkhoven 4, J.M.G. Kunen 4, P. Bancken 5, P.J. Bolt 4 1 Czech Technical University in Prague, Faculty or Electrical Engineering, Praha, Czech Republic 2 CEA-LETI, MINATEC Campus, Grenoble, France 3 Instituto de Microelectrónica de Barcelona (IMB-CNM), Bellaterra, Spain 4 TNO, Eindhoven, The Netherlands 5 Philips Lighting, Lightlabs, Eindhoven, The Netherlands |
|
| 11:30 | 20mn | A Comparison Study of the Prognostics Approaches to Light Emitting Diodes Based on Accelerated Aging Corresponding Author: Chris Bailey – University of Greenwich Thamo Sutharssan, Chris Bailey, Stoyan Stoyanov, Computational Mechanics and Reliability Group, University of Greenwich, United-Kingdom |
|
| 11:50 | 20mn | Modelling Lead Free Solder Reliability in SSL Applications Towards Virtual Design Corresponding Author: Rene Kregting – TNO René Kregting 1, Müge Erinc 1, Jan Kloosterman 2, Willem van Driel 2 1 TNO, Eindhoven, The Netherlands 2 Philips Lighting, Nijmegen, The Netherlands |
|
| 12:10 | 20mn | Polymer-Based 2D/3D Wafer Level Heterogeneous Integration for SSL Module Corresponding Author: Cadmus Yuan – Netherlands Organisation for Applied Scientific Research (TNO) Cadmus Yuan 1, Jia Wei 2, Huaiyu Ye 3, Sau Koh 2, Stephen Harianto 4, Monique van den Nieuwenhof 5, G. Q. Zhang 2 1 TNO, Eindhoven, Netherlands; Delft University of Technology, Delft, Netherlands 2 Delft University of Technology, Delft, Netherlands 3 Delft University of Technology, Delft, Netherlands; Materials innovation institute (M2i), Delft, Netherlands 4 TNO, Eindhoven, Netherlands; Fontys University of Applied Sciences, Eindhoven, Netherlands 5 TNO, Eindhoven, Netherlands |
|
| 12:30 | 20mn | Accelerated Testing Method of LED Luminaries Corresponding Author: Miao Cai – Guilin University of Electronic Technology, Guilin, China M. Cai 1, D. G. Yang 1, S. Koh 2, C. A. Yuan 2, W. B. Chen 1, B. Y. Wu 3, G. Q. Zhang 2 1 Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, China 2 Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, Netherlands 3 Flextronics Manufacturing Company, Zhuhai, P.R. China |
|
| Session 22 | 14:00 | Wednesday Apr 18 2012 | |
| Advances in Modeling Chairman: John Lau, ITRI; Cadmus Yuan, TNO |
|||
| 14:00 | 30mn | Keynote presentation – Numerical Modelling of Anchor Losses in MEMS Resonators Corresponding Author: Frangi Attilio – Politecnico di Milano A. Frangi, A. Bugada, M. Martello, P.T. Savadkoohi, Politecnico di Milano, Italy |
|
| 14:30 | 30mn | Keynote presentation – LED Driver Thermal Design Considerations for Solid-State Lighting Technologies Corresponding Author: Xavier Perpiñà Giribet – IMB-CNM (CSIC) X. Perpiñà 1, R.J. Werkhoven 2, M. Vellvehi 1, X. Jordà 1, J.M.G. Kunen 2, J. Jakovenko 3, P. Bancken 4, P.J. Bolt 2 1 IMB-CNM (CSIC), Bellaterra, Spain 2 TNO, Eindhoven, The Netherlands 3 Department of Microelectronics, Czech Technical University in Prague, Czech Republic 4 Philips Lighting, Lightlabs, Eindhoven, The Netherlands |
|
| 15:00 | 30mn | Keynote presentation – Nonlinear Analyses of Semi-Embedded Through-Silicon Via (TSV) Interposer with Stress Relief Gap Under Thermal and Shock Conditions Corresponding Author: John H Lau – ITRI John H. Lau, Shang-Tsai Wu, Heng-Chieh Chien, Electronics & Optoelectronics Research Laboratory, ITRI, Taiwan |
|
