EuroSimE 2008 was locally organised by IMTEK (Jan Korvink and team) in Konzerthaus of Freiburg-im-Breisgau, Germany

EuroSimE 2008 in Freiburg-im-Breisgau, Germany

The 9th IEEE EuroSimE conference was held in Freiburg-im-Breisgau,
in April 2008 and was attended by 160 individuals.

·
courses were offered for professional training.
· Three days
of technical sessions for oral and poster presentation .
· A parallel exhibition from industrial contributors and simulation
and optimization software companies.

Proceedings of EuroSimE 2008 – Freiburg-im-Breisgau, Germany, April 2008

698 pages A4
IEEE Catalog Number: CFP08566-PRT
ISBN: 978-1-4244-2127-5
  CD-ROM version
IEEE Catalog Number:CFP08566-CDR
ISBN: 978-1-4244-2128-2

Go to Global conference schedule  List
of Technical Sessions  Technical program

Day 1 – Monday 21 Apr 2008
08:00 Registration
09:00 Opening
session
09:10

Industry
Keynotes session

9:10 Thijs Viegers, Senior director – Chief Technology Officer,
Philips Applied Technologies, Eindhoven, The Netherlands: Challenges
for SiP Product Creation

9:40 Michel Despont, Manager of Nano- & Microfabrication
in IBM Zurich Research Lab, Switzerland: More than Moore by (N)MEMS
on CMOS

10:10 Georg Meyer-Berg, Infineon Technologies, Munich, Germany:
Future Packaging Trends
10:40 Coffee
break
11:10  S
1  New developments in modeling
12:40 Lunch
14:00  S
2  IC-package modeling		  S
3  Multi-physics modeling for MEMS		  S
4  Thermal Behavior Modeling and Characterization
15:50 Coffee
break
16:30  S
5  Solder reliability		  S
6  Fluid-mechanical interactions		  S
7  Advances in thermo-mechanical modeling
18:00 End
of first day technical sessions
19:30 Dinner
downtown in Historisches Kaufhaus
 
Day 2 – Tuesday 22 Apr 2008
08:30  S
8  Molecular modeling in micro-electronics		  S
9  Numerical modeling for magnetic MEMS		  S
10  Thermo-mechanical qualification modeling
09:40 Coffee
break
10:00  S
11  Poster session – Thermomechanical issues in microelectronics		  S
12  Poster session – Thermal and multi-physics issues
in microelectronics
11:20  S
13  Board and System Level Thermal Analysis		  S
14  Polymer physics		  S
15  Interface delamination modeling and characterisation
12:30 Lunch
14:00  S
16  Process modeling		  S
17  Innovative methods for micro-systems modeling		  S
18  Dynamics modeling and testing
15:30 Annual
meeting of EuroSimE Organising Committee		 Coffee
break
16:00 Special
Exhibitors session
17:30 Cocktail
party
 
Day 3 – Wednesday 23 Apr
2008
08:30  S
19  New Developments – I
10:00 Coffee
break
10:30  S
20  Experimental mechanics for micro-electronics		  S
21  Ion transport and electro-migration
12:20 Lunch
14:00  S
22  New Developments – II
16:00 End
of conference
 

Go to Global conference schedule  List
of Technical Sessions  Technical program

List of Technical Sessions
S-1 New developments in modeling
S-2 IC-package modeling
S-3 Multi-physics modeling for MEMS
S-4 Thermal Behavior Modeling and Characterization
S-5 Solder reliability
S-6 Fluid-mechanical interactions
S-7 Advances in thermo-mechanical modeling
S-8 Molecular modeling in micro-electronics
S-9 Numerical modeling for magnetic MEMS
S-10 Thermo-mechanical qualification modeling
S-11 Poster session – Thermomechanical issues in microelectronics
S-12 Poster session – Thermal and multi-physics issues
in microelectronics
S-13 Board and System Level Thermal Analysis
S-14 Polymer physics
S-15 Interface delamination modeling and characterisation
S-16 Process modeling
S-17 Innovative methods for micro-systems modeling
S-18 Dynamics modeling and testing
S-19 New Developments – I
S-20 Experimental mechanics for micro-electronics
S-21 Ion transport and electro-migration
S-22 New Developments – II

Go to Global conference schedule  List
of Technical Sessions  Technical program  List
of sessions by Authors

08:00 Registration

09:00 Opening session

09:10 Industry Keynotes session

10:40 Coffee break

Session 1 11:10 Monday 21 Apr 2008
New developments in modeling
Chaired
by L.J. Ernst, Delft University of Technology – W. van Driel, NXP Semiconductors
    Keynote presentation – Modeling
and Characterization of Interfaces – from an Atomistic Description to
a Continuum Approach
Jianmin
Qu, Remi Dingreville, Georgia Tech
    Keynote presentation – Energy
Efficient Liquid Cooling
Jeff
Punch, CTVR, Stokes Institute, University of Limerick, Limerick, Ireland
    Keynote presentation – Multi-physics
simulation and reliability analysis for RF-MEMS devices
X.
Rottenberg 1, P. Czarnecki 1, H. A. C.
Tilmans 2, W. De Raedt 2, I. De Wolf 1
1 IMEC, KULeuven
2 IMEC

12:40 Lunch

Session 2 14:00 Monday 21 Apr 2008
IC-package modeling
Chaired
by R. Dudek, Fraunhofer Institute IZM – J. Wilde, IMTEK
    Keynote presentation – Thermo-mechanics
of 3D-wafer level and 3D stacked IC packaging technologies
Bart
Vandevelde, Chukwudi Okoro, Mario Gonzalez, Bart Swinnen, Eric Beyne,
IMEC, Leuven, Belgium
    Effect of Package Type in IC-Package
Stress Interaction Design Rules
W.D.
van Driel 1, D.G. Yang 2, G.Q. Zhang 1
1 NXP Semiconductors, TU Delft
2 NXP Semiconductors
    Predictive Models for μBGA and
QFN Reliability Estimation
Juergen
Wilde, Elena Zukowski, Department of Microsystems Engineering, University
of Freiburg, Freiburg, Germany
    Chip-Package Interactions: Some Investigations
On Copper/Low-k Interconnect Delaminations
Vincent
Fiori, Sébastien Gallois-Garreignot, Clément Tavernier, Hervé Jaouen,
André Juge, STMicroelectronics
    A new on chip nanomechanical testing
concept applied to ductile and brittle thin film materials
Asmahan
Safi, Samer Houri, Michaël Coulombier, Sébastien Gravier, Nicolas André,
Thomas Pardoen, Jean-Pierre Raskin, Université catholique de Louvain


Session 3 14:00 Monday 21 Apr 2008
Multi-physics modeling for MEMS

Chaired by M. Biesheuvel, Delft University
– E. Dermitzaki, Fraunhofer IZM
    Keynote presentation – Fluidic-electrostatic-mechanical
modeling of the dynamic response of RF-MEMS capacitive switches
Jeroen
Bielen 1, Jiri Stulemeijer 1, Deepak Ganjoo 2,
Dale Ostergaard 2, Sander Noijen 3
1 NXP Semiconductors
2 Ansys Inc.
3 Philips, Applied Technologies
    A Perturbation Finite Element Method
for Modeling Electrostatic MEMS without Remeshing
Mohamed
Boutaayamou 1, Ruth V. Sabariego 1, Patrick
Dular 2
1 Department of Electrical Engineering and Computer
Science, University of Liège, Belgium.
2 Department of Electrical Engineering and Computer Science,
University of Liège, FNRS, Belgium.
    Electromechanical Resonator Detection
Enhancement by the Use of a Movable Electrode
Casset
F. 1, Durand C. 2, Buchaillot L. 2,
Ollier E. 1, Ancey P. 3, Aïd M. 1
1 CEA-LETI, MINATEC, Grenoble, France
2 IEMN/ISEN, Lille, France
3 STMicroelectronics, Crolles, France
    A New Methodology For RF MEMS Contact
Simulation
D. Peyrou, F. Coccetti,
F. Pennec, H. Achkar, P. Pons, R. Plana, LAAS CNRS
    Modeling of Smart Compliant Electro-Active
Polymer Actuator
S. Soulimane,
M. Al Ahmad, M. Matmat, H. Camon, LAAS-CNRS


Session 4 14:00 Monday 21 Apr 2008
Thermal Behavior Modeling and Characterization

Chaired by P. Rodgers, The Petroleum Institute
– J. Punch, University of Limerick
    Keynote presentation – Effectively
Modeling the Thermal Behavior of Trench-Isolated Bipolar Transistors

Ilaria Marano, Vincenzo d’Alessandro,
Niccolò Rinaldi, Department of Electronics and Telecommunications Engineering,
University of Naples “Federico II”, via Claudio 21, 80125 Naples
    Effective thermal modeling of discretes
under peak-pulsed power loading by sub-domain consideration.
Sander
Noijen, Erik Eggink, Philips Applied Technologies, Eindhoven, The Netherlands
    New method of dynamic Compact Thermal
Model extraction
W. Habra 1,
P. Tounsi 2, F. Madrid 2, J-M. Dorkel 2
1 University of Aleppo, Faculty of Electronics Engineering.
Aleppo, Syria
2 LAAS-CNRS, Université de Toulouse, Toulouse, France.
    Thermal Analysis Automation System for
Semiconductor Package
Yuanxiang
Zhang 1, Lihua Liang 1, Yangjian Xia 1,
Yong Liu 2, Scott Irving 2, Timwah Luk 2
1 Fairchild-ZJUT Joint Lab, Zhejiang University of
Technology, Hangzhou China
2 Fairchild Semiconductor Corp., S. Portland, ME, USA
    Aluminum-Nitride Thin-Film Heatspreaders
Integrated in Bipolar Transistors
Luigi
La Spina 1, Ilaria Marano 2, Vincenzo
d’Alessandro 2, Hugo Schellevis 1, Lis
K. Nanver 1
1 Delft University of Technology, Delft, The Netherlands
2 University of Naples Federico II, Naples, Italy

15:50 Coffee break

Session 5 16:30 Monday 21 Apr 2008
Solder reliability
Chaired
by P. Lall, Auburn University
    Keynote presentation – Simulation
Based Analysis of Secondary Effects on Solder Fatigue
Rainer
Dudek, Ralf Doering, Christine Bombach, Bernd Michel, FhG-IZM, MMCB
    Creep Measurements on SnAgCu Solder
Joints in Different Compositions and after Mechanical and Thermal Treatment

Mike Roellig, Steffen Wiese, Karsten
Meier, Klaus-Jürgen Wolter, Dresden University of Technology
    Effect of Primary Creep Behavior on
Fatigue Damage Accumulation Rates in Accelerated Thermal Cycling of Sn3.0Ag0.5Cu
Pb-Free Interconnects
Gayatri
Cuddalorepatta, Abhijit Dasgupta, CALCE Electronic Products and Systems
Center, University of Maryland, USA
    Can temperature shock tests speed up
development of reliable components for automotive applications
Dr.
Reinhard Pufall, Dr. Werner Kanert, Infineon Technologies AG Munich


Session 6 16:30 Monday 21 Apr 2008
Fluid-mechanical interactions

Chaired by R. van Silfhout, Philips Applied
Technologies
    Keynote presentation – A Wide
Pressure Range Estimate of Gas Damping in Polysilicon Inertial MEMS Devices

Attilio Frangi, Department of
Structural Engineering, Politecnico di Milano, Milano, Italy
Aldo Ghisi, Department of Structural EngineDepartment of Structural
Engineering, Politecnico di Milano, Milano, Italy
    Online Fluid-Monitoring using an electromechanical
Cantilever
Mario Jungwirth,
University of Applied Sciences Upper Austria, Campus Wels
    Sensitivity-Maximizing and Error-Reducing
Design of a Flow and Thermal Property Sensor
Cubukcu,
Ali Sukru, Urban, Gerald A., IMTEK / University of Freiburg, Freiburg,
Germany
    Cavitation instability in the plastic
IC packaging material due to moisture-induced vapor pressure and thermal
stress
Li Zhigang, Niu Xiaoyan,
Ma Yong, Shu Xuefeng, Yang Guitong, Institute of Applied Mechanics
& Biomedical Engineering, Taiyuan University of Technology, Taiyuan, PR
China


Session 7 16:30 Monday 21 Apr 2008
Advances in thermo-mechanical modeling

Chaired by A. Corigliano, Politecnico di Milano
– A. Wymyslowski, Wroclaw University
    Keynote presentation – Mechanics
of Moisture for Polymers: Fundamental Concepts and Model Study
Xuejun
Fan, Department of Mechanical Engineering, Lamar University, Beaumont,
Texas, USA; Department of Engineering Mechanics, South China U
    Modeling and improvement of a metallization
system subjected to fast temperature cycle stress
Tobias
Smorodin 1, Christina Bohm 1, Joao Gaspar 2,
Marek Schmidt 2, Oliver Paul 2, Matthias
Stecher 1
1 Infineon Technologies AG
2 IMTEK, University of Freiburg
    Prediction of Wafer Bow through Thermomechanical
Simulation of Patterned Hard Coated Copper Films
Javad
Zarbakhsh 1, Thomas Detzel 2, Rui Huang 1,
Markus Leicht 2, Peter Nelle 3, Stefan
Woehlert 2
1 KAI – Kompetenzzentrum Automobil- und Industrie-Elektronik
GmbH, Villach, Austria
2 Infineon Technologies Austria AG, Villach, Austria
3 Infineon Technologies AG, Munich, Germany
    Stochastic Finite Element Modeling of
Thermoelastic Quality Factor of Micro-Beams
S.
Lepage 1, G. Weickum 2, K. Maute 2
1 University of Illinois, Urbana-Champaign, USA
2 University of Colorado, Boulder, USA

18:00 End of first day technical sessions

19:30 Dinner downtown in Historisches Kaufhaus

Session 8 08:30 Tuesday 22 Apr 2008
Molecular modeling in micro-electronics

Chaired by Y. Liu, Fairchild Semiconductors
– B. Schwarz, Siemens
    Keynote presentation – Performance
Properties in Thick Film Silicate Dielectric Layers Using Molecular Modeling

Nancy Iwamoto 1,
Ahila Krishnamoorthy 2, Richard Spear 2,
Emma Brouk 2, Amanuel Gebrebrhan 2, Mehari
Stifanos 2, Ed Rutter 2, Deb Yellowaga 3
1 Honeywell/UOP
2 Honeywell Electronic Materials
3 Honeywell Electronic Chemicals
    The mechanical influence of the porosity
and nano-scale pore size effect of the SiOC(H) dielectric film
Cadmus
Yuan 1, Amy E. Flower 2, Olaf van der
Sluis 3, G.Q. (Kouchi) Zhang 1, Leo J.
Ernst 3, Mohammed Cherkaoui 4, Willem
D. van Driel 1
1 Delft University of Technology; NXP Semiconductors,
The Netherlands
2 The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology, USA; Delft University of Technology,
T
3 Delft University of Technology, The Netherlands
4 The George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology, USA
    Structure Property Correlation of epoxy
resins under the influence of moisture; and comparison of Diffusion coefficient
with MD-simulations
E. Dermitzaki,
B. Wunderle, J. Bauer, H. Walter, B. Michel, Fraunhofer Institute-IZM


Session 9 08:30 Tuesday 22 Apr 2008
Numerical modeling for magnetic MEMS

Chaired by J. Qu, Georgia Institute of Technology
    Keynote presentation – An Iterative
Approach to Simulate Magnetic Micro Systems by Changing the Magnetic Properties

B. Spasova, D. Dinulovic, Hans
H. Gatzen, Institute for Microtechnology, Hannover, Germany
    An Approach for Simulating Magnetic
Microactuators
Dragan Dinulovic,
Hans H. Gatzen, Institute for Microtechnology, Leibniz Universitaet
Hannover
    2D Finite Element Modeling of Magnetic
MEMS and Coupled Model with Fluid Mechanic Problem: Application to Biological
Pumping Fluids
Hakim Bensaidane,
Advanced Technology Development Center CDTA, Algiers, Algeria


Session 10 08:30 Tuesday 22 Apr 2008
Thermo-mechanical qualification modeling

Chaired by K. Newman, Sun Microsystems – B.
Wunderle, Fraunhofer Institute IZM
    Keynote presentation – Die Fracture
Probability Prediction and Design Guidelines for Laminate-Based Over-Molded
Packages
Daoguo Yang 1,
Jeroen Bielen 1, F. Theunis 1, W. D. van
Driel 2, G.Q. Zhang 2
1 NXP Semiconductors
2 NXP Semiconductors, Delft University of Technology
    A Multilayer PCB Material Modeling Approach
Based on Laminate Theory
Sven
Rzepka 1, Frank Krämer 1, Oliver Grassmé 1,
Jens Lienig 2
1 Qimonda Dresden GmbH & Co. OHG, Dresden, Germany
2 Dresden University of Technology, Institute of Electromechanical
and Electronic Design, Germany
    Warpage Simulation and DOE Analysis
with Application in Package-on-Package Development
Wei
Sun, W.H. Zhu, C.K. Wang, Anthony Y.S. Sun, H.B. Tan, United Test &
Assembly Center Ltd (UTAC), Singapore

09:40 Coffee break

Session 11 10:00 Tuesday 22 Apr 2008
Poster session – Thermomechanical
issues in microelectronics
Chaired by
K.Jansen (TU Delft), H.Pape (Infineon)
  Thermo-mechanical Simulations for 4-Layer
Stacked IC Packages
Ming-Che
Hsieh, Chih-Kuang Yu, Industrial Technology Research Institute
  Study of JEDEC B-condition JESD22-B111
Standard for Drop Test Reliability of Chip Scale Packages
Yassine
Bentata, STMicroelectronics Tours & IMS Bordeaux
Stéphane Forster, STMicroelectronics Tours
Kim Yong Goh, STMicroelectronics Singapore
Hélène Fremont, IMS Bordeaux
  Analytical Model for Thermally-induced
Warpage of PoP
W. Feng, H.
Frémont, A. Guédon-Gracia, F. Verdier, B. Plano, Laboratoire IMS, CNRS
UMR 5218, ENSEIRB, Université Bordeaux I
  Testing Solder Interconnect Reliability
Under Drop Impact Loading Conditions
J.J.M.
Zaal, Delft University of Technology, Delft, The Netherlands
H.P. Hochstenbach, NXP Semiconductors, Nijmegen, the Netherlands
W.D. van Driel, NXP Semiconductors, Nijmegen, the Netherlands / Delft
University of Technology, Delft, the Netherlands
G.Q. Zhang, NXP Semiconductors, Eindhoven, the Netherlands/ Delft University
of Technology, Delft, the Netherlands
  Durability Modelling of a BGA Component
under Random Vibration
Marc
Grieu 1, Gregor Massiot 1, Olivier Maire 1,
Agnès Chaillot 1, Catherine Munier 1,
Yves Bienvenu 2, Jacques Renard 2
1 EADS France Innovation Works
2 Mines Paris, Centre des Matériaux
  Effects of detailed substrate modeling
and solder layout design on the 1st and 2nd level solder joint reliability
for the large die FCBGA
Kalyan
Biswas 1, Shiguo Liu 1, Xiaowu Zhang 2,
TC Chai 2
1 IBIDEN Singapore Pte Ltd
2 Institute of Microelectronics (IME), Singapore
  Optimization of High Density Interconnections
(HDI) Printed Circuit Boards robustness
A.
Chaillot 1, O. Maire 1, C. Munier 1,
L. Tonnelier 2, C. Chastanet 2
1 EADS France Innovation Work
2 AIRBUS France
  Flexible Device and Component Reliability
Study Using Simulations
Quayle
Chen, quayle.chen@nokia.com
Leon Xu, leon.xu@nokia.com
Cherie Jing, cherie.jing@nokia.com
Tom Xue, tom.xue@nokia.com
Antti Salo, antti.o.salo@nokia.com
Kari Ojala, kari.ojala@nokia.com
  Aging Effects on IMC Formation and Joint
Strength of Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP
F.
Sun 1, P Hochstenbach 2, W. D. Van Driel 2,
G. Q. Zhang 3
1 Harbin University of Science and Technology, Harbin,
China
2 NXP Semiconductors, Eindhoven, the Netherlands
3  NXP Semiconductors, Eindhoven, the Netherlands
  Investigation of BPSG Profile and FAB
Size on Cu Stud Bumping Process by Modeling and Experiment
Yumin
Liu, Yong Liu, Scott Irving, Timwah Luk, Qi Wang, Fairchild Semiconductor
  Identification and Verification by Experiment
and Simulation for the Possibility of Die Cracking Induced by UIL Test

Zhongfa Yuan 1,
Yong Liu 2, Scott Irving 2, Timwah Luk 2
1 Fairchild Semiconductor, Suzhou, China
2 Fairchild Semiconductor, South Portland, USA
  Influence of Heat Sink Mounting Procedure
on Package Reliability
Zhongfa
Yuan 1, Yong Liu 2, Timwah Luk 2,
Scott Irving 2
1 Fairchild Semiconductor, Suzhou, China
2 Fairchild Semiconductor, South Portland, USA
  Thermomechanical Modelling and Reliability
Study of an IGBT Module for an Aeronautical Application
Adrien
Zeanh 1, Moussa Karama 1, Olivier Dalverny 1,
Eric Woirgard 2, Stéphane Azzopardi 2,
Arezki Bouzourene 3, Jacques Casutt 3,
Michel Mermet-Guyennet 4
1 ENIT – LGP, Tarbes, France
2 ENSEIRB – IMS, Bordeaux, France
3 THALES AES, Chatou, France
4 Alstom – PEARL, Séméac, France
  Aging Induced Evolution of Lead Free
Solder Material Behavior
Hongtao
Ma, Yifei Zhang, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall, Michael
J. Bozack, Auburn University
  Prognostication of System-State in Lead-Free
Electronics Equipment under Cyclic and Steady-State Thermo-Mechanical
Loads
Pradeep Lall, Madhura
Hande, Chandan Bhat, Vikrant More, Rahul Vaidya, Jeff Suhling, Auburn
University
  Effect of aging of packaging materials
on die surface cracking of a SiP carrier
Xiaosong
Ma 1, K.M.B. Jansen 1, L.J. Ernst 1,
W.D van Driel 2, O. van der Sluis 3, G.Q.Zhang 4,
Charles Regard 5, Christian Gautier 6,
Hélène Frémont 7
1 Delft University of Technology
2 NXP, the Netherlands
3 Delft University of Technology, Philips, the Netherlans
4 Delft University of Technology, NXP, the Netherlands
5 NXP Semiconductors, LaMIPS, Université de Caen,IMS Bordeaux
Université de Bordeaux,France
6 NXP Semiconductors, LaMIPS, Université de Caen, France
7 IMS Bordeaux Université de Bordeaux, France
  Solder Fatigue of Wafer Level Package
Assemblies. Comparison with Flip Chip BGA’S
Charles
Regard 1, Christian Gautier 1, Hélène
Frémont 2, Alexandre Val 3, Frédéric Roullier 1,
Patrice Schwindenhammer 1, Patrick Poirier 1
1 NXP Semiconductors, Caen, France
2 IMS, Bordeaux, France
3 Solectron, Canéjan, France
  Predicting Dielectric Constant Trends
Using Molecular Modeling
Nancy
Iwamoto, Honeywell, Ramona, California, USA


Session 12 10:00 Tuesday 22 Apr 2008
Poster session – Thermal and multi-physics
issues in microelectronics
Chaired by
K.Jansen (TU Delft), H.Pape (Infineon)
  Investigation of Stress-buffer-enhanced
Package Subjected to Board-level Drop Test
Chan-Yen
Chou 1, Tuan-Yu Hung 1, Ming-Chih Yew 1,
Wen-Kun Yang 2, Dyi-Chung Hu 2, Mon-Chin
Tsai 2, Ching-Shun Huang 2, Kuo-Ning Chiang 1
1 Advanced Microsystem Packaging and Nano-Mechanics
Research Lab. PME, National Tsing Hua University
2 Advanced Chip Engineering Technology Inc.
  Characterization of Dynamic Behavior
of Pb-Free Material 95.7Sn3.8Ag0.5Cu and Its Determination of Dynamic
Constitutive Model Parameters
Liang
Lihua 1, Chen Xuefan 1, Wang Qiang 1,
Liu Fei 1, Yong Liu 2, Scott Irving 2,
Timwah Luk 2
1 Zhejiang University of Technology
2 Fairchild Semiconductor Corp
  Investigation of the stress-strain curves
of lead-free solder alloy
Niu
Xiaoyan, Ma Yong, Li Zhigang, Shu Xuefeng, Yang Guitong, Institute
of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology,
Taiyuan, PR China
  Use The Reverse Engineering Technique
To Link COMSOL and ANSYS Softwares
H.Achkar 1,
F.Pennec 1, D.Peyrou 1, M.Sartor 2,
R.Plana 1, P.Pons 1
1 LAAS-CNRS
2 INSA-Toulouse
  The Thermal-Structural Analysis of Plastic
Substrate Based Display Using Experiments and FEM Simulations
Chang-chun
Gu 1, Ming-quan Shi 1, PingYang 1,
Leon Xu 2, Quayle Chen 2, Antti Salo 2
1 School of Mechatronics Engineering, University of
Electronic Science and Technology of China,
2 Nokia Research Center, Beijing
  Analysis of the Thermal Behavior of
Trench-Isolated Bipolar Transistors Fabricated on SOI Substrates
Ilaria
Marano, Vincenzo d’Alessandro, Niccolò Rinaldi, Department of Electronics
and Telecommunications Engineering, University of Naples “Federico II”,
via Claudio 21, 80125 Naples
  Cold Test and Cyclic Damp Heat Test
of Plastic Substrate Based Displays
Jian-Ping
Li 1, Ping Yang 1, Jian Zhong 1,
Jun Zhou 1, Leon Xu 2, Quayle Chen 2,
Antti Salo 2, Kari Ojala 3
1 School of Mechatronics Engineering, University of
Electronic Science and Technology of China
2 Nokia Research Center, Beijing
3 Nokia Devices, R&D, Finland
  The Steady State Damp Heat Test and
Dry Heat Test of Plastic Substrate Based Displays
Jian
Zhong 1, Ping Yang 1, Jian-ping Li 1,
Jun Zhou 1, Quayle Chen 2, Leon Xu 2,
Antti Salo 2
1 School of Mechatronics Engineering, University of
Electronic Science and
2 Nokia Research Center, Beijing
  Efficient Electrothermal Simulation
of Power Electronics for Hybrid Electric Vehicle
Anis
Dehbi 1, Wolfgang Wondrak 1, Evgenii B.
Rudnyi 2, Udo Killat 2, Peter van Duijsen 3
1 Daimler AG, GR & AE Cabin and Powertrain E/E
2 CADFEM GmbH
3 Simulation Research


Session 13 11:20 Tuesday 22 Apr 2008
Board and System Level Thermal Analysis

Chaired by N. Cordero, Tyndall Institute
    Keynote presentation – An Experimental
and Numerical Investigation of Tube Bank Heat Exchanger Thermofluids

Peter Rodgers 1,
Afshin Goharzadeh 1, Osama Abd Elhamid Ali 2,
Valerie Eveloy 1
1 The Petroleum Institute, Abu Dhabi, United Arab Emirates
2 National Drilling Company, Abu Dhabi, United Arab Emirates
    Application of CFD Modeling for Energy
Efficient Humidity Management of an Electronics Enclosure in Storage under
Severe Climatic Conditions
Ilja
Belov 1, Jan Rydén 2, Joakim Lindeblom 3,
Yafan Zhang 1, Torgny Hansson 2, Fredrik
Bergner 4, Peter Leisner 5
1 School of Engineering, Jönköping University, Sweden
2 Saab Microwave Systems, Göteborg, Sweden
3 SP Technical Research Institute of Sweden, Boras, Sweden
4 Flomerics Nordic AB, Nacka, Sweden
5 School of Engineering, Jönköping University; SP Technical
Research Institute of Sweden, Boras; Sweden
    Simulation of Fluid Dynamics in Active
Liquid Heat Sink for CPU Cooling System
Song-Hao
Wang, Steven Melendez, Ronny Blanco, Milton Gomez, Micro and Precision
Manufacturing Center, Kun-Shan University of Technology, Taiwan


Session 14 11:20 Tuesday 22 Apr 2008
Polymer physics
Chaired
by W.H. Zhu, UTAC – M. Guyenot, Robert Bosch GmbH
    Keynote presentation – Numerical
Simulation of Encapsulant Curing within a Variable Frequency Microwave
Processing System
T. Tilford 1,
K.I. Sinclair 2, G. Goussetis 2, C. Bailey 1,
M.P.Y. Desmulliez 2, A.K. Parrott 1, A.J.
Sangster 2
1 University Of Greenwich, London, United Kingdom
2 Heriot Watt University, Edinburgh, United Kingdom
    Characterization of Dual-Stage Moisture
Diffusion, Residual Moisture Content and Hygroscopic Swelling of Epoxy
Molding Compounds
Hossein Shirangi 1,
Juergen Auersperg 2, Metin Koyuncu 1,
Hans Walter 2, Wolfgang H. Müller 3, Bernd
Michel 2
1 Robert Bosch GmbH, Automotive Electronics, Reutlingen,
Germany
2 Fraunhofer IZM, Berlin, Germany
3 Technical University of Berlin, Institut Für Mechanik,
Berlin, Germany
    A Characterization Method for Viscoelastic
Bulk Modulus of Molding Compounds
M.K.Saraswat 1,
K.M.B.Jansen 1, M.D. Patel 2, L.J Ernst 1,
C. Bohm 3
1 Delft University of Technology, The Netherlands
2 Lamar University, Beaumont, Texas USA
3 Infineon Technologies, Munich, Germany


Session 15 11:20 Tuesday 22 Apr 2008
Interface delamination modeling and
characterisation
Chaired by X. Fan, Lamar
University – S. Rzepka, Qimonda
    Keynote presentation – Failure
modelling of flexible electronics
Olaf
van der Sluis 1, Roy Engelen 2, Peter
Timmermans 2, Kouchi Zhang 3
1 Philips Applied Technologies, Eindhoven, The Netherlands
and Delft University of Technology, Delft, The Netherlands
2 Philips Applied Technologies, Eindhoven, The Netherlands
3 NXP Semiconductors, Eindhoven, The Netherlands and Delft
University of Technology, Delft, The Netherlands
    Sapphire-removed induced the deformation
of high power InGaN light emitting diodes
C.
N. Han 1, T .L. Chou 1, C. F. Huang 2,
K.N. Chiang 1
1 Advanced Microsystem Packaging and Nano-Mechanics
Research Lab., Department of Power Mechanical Engineering, National Tsing
Hua
2 Epistar corporation.
    Advanced Miniature Mixed Mode Bending
Setup for In-situ Interface Delamination Characterization
M.
Kolluri 1, M.H.L. Thissen 2, J.P.M. Hoefnagels 2,
J.A.W. van Dommelen 2, M.G.D. Geers 2
1 The Netherlands Institute for Metals Research
2 Eindhoven University of Technology, Department of Mechanical
Engineering,

12:30 Lunch

Session 16 14:00 Tuesday 22 Apr 2008
Process modeling
Chaired
by A. Dasgupta, CALCE Electronic Products & Systems Consortium – C. Yuan,
Delft University / NXP Semiconductors
    Keynote presentation – Optimisation
of Wirebond Interconnects by Automated Parameter Variation
Stefan
Martens 1, Jürgen Wilde 2, Elena Zukowski 2,
Friedemann Völklein 3, Markus Ledermann 4
1 Infineon Technologies AG, Regensburg, Germany
2 University of Freiburg, IMTEK, Institute of Microsystem
Technology, Assembly and Packaging, Germany
3 University of Applied Sciences Wiesbaden, IMtech, Institute
of Microtechnologies, Germany
4 Robert Bosch GmbH, Stuttgart, Germany
    Wire Bonding Capillary Profile and Bonding
Process Parameter Optimization Simulation
Qiuxiao
Qian, Yong Liu, Timwah Luk, Scott Irving, Fairchild Semiconductor,
South Portland, USA
    Modelling the Nano-Imprint Forming Process
for the Production of Miniaturised 3D Structures
Stoyan
Stoyanov 1, Farid Amalou 2, Keith Sinclair 2,
Chris Bailey 1, Marc P.Y. Desmulliez 2
1 University of Greenwich, London, UK
2 Heriot-Watt University, Edinburgh, UK
    Intrinsic Dissipation in Microelectromechanical
Systems
Ardito Raffaele, Comi
Claudia, Corigliano Alberto, Frangi Attilio, Department of Structural
Engineering, Technical University (Politecnico) of Milan
    Assessment of the Feasibility of ‘Multiple
Chips-to-Wafer’ Thermo-Compression Bonding using FEM
Chukwudi
Okoro 1, Anne Jourdain 2, Bart Vandevelde 2,
Bart Swinnen 2, Dirk Vandepitte 3
1 IMEC / Katholieke Universiteit Leuven, Belgium
2 IMEC, Belgium
3 Katholieke Universiteit Leuven, Belgium


Session 17 14:00 Tuesday 22 Apr 2008
Innovative methods for micro-systems
modeling
Chaired by X. Rottenberg, IMEC
    Keynote presentation – A Derivatives-based
Method for Parameterization of MEMS Reduced Order Models
Vladimir
Kolchuzhin, Wolfram Doetzel, Jan Mehner, Chemnitz University of Technology,
Germany
    A multi-domain piezoresistive pressure
sensor design tool based on analytical models
M.
Olszacki 1, C. Maj 1, M. Al Bahri 2,
D. Peyrou 2, F. Kerrour 2, P. Pons 2,
A. Napieralski 3
1 LAAS-CNRS, Toulouse, France; Department of Microelectronics
and Computer Science, Lodz, Poland
2 LAAS-CNRS, Toulouse, France
3 Department of Microelectronics and Computer Science,
Lodz, Poland
    Determining Pull-In Curves with Electromechanical
FEM Models
S.D.A. Hannot, D.J.
Rixen, Delft University of Technology, Delft, The Netherlands
    Parametric Design of an Electrostatic
Rotary Microactuator Using Finite Element Analysis and Metamodeling

Jessica Bronson, Irene Fassi, ITIA-CNR
    Circular MEM Resonator: Modeling Second
Order Effects on Resonance Frequency
Yasseen
S. Nada 1, Steve Stoffels 2, Harrie A.
C. Tilmans 2, Emad Hegazi 3, Hani F. Ragai 3,
Amr M. Shaarawi 1
1 American University in Cairo
2 Interuniversity Micro Electronics Center
3 Ain Shams University


Session 18 14:00 Tuesday 22 Apr 2008
Dynamics modeling and testing

Chaired by B. Vandevelde, IMEC – M. Gonzalez,
IMEC
    Keynote presentation – Recent
Advances in Drop-Impact Reliability
E.H.
Wong, Singapore Institute of Manufacturing Technology (SIMTech)
S.K.W. Seah, Institute of Microelectronics (IME)
W.D. van Driel, NXP Semiconductors
J.F.J.M. Caers, Philips Applied Technologies
N. Owens, Freescale Semiconductor, Inc.
Y.-S. Lai, Central Labs, ASE, Inc.
    FEM Simulation Study on the Free Drop
of Electronic Modules Based on Calibrated and Validated Models
Przemyslaw
Gromala, Axel Müller, Sven Rzepka, Qimonda Dresden GmbH & Co. OHG,
Dresden, Germany
    Correlating Drop Impact Simulations
with Drop Impact Testing using High-Speed Camera Measurements
J.J.M.
Zaal, Delft University of Technology, Delft, The Netherlands
W.D. van Driel, NXP Semiconductors, Nijmegen, The Netherlands / Delft
University of Technology, Delft, The Netherlands
F.J.H.G. Kessels, NXP Semiconductors, Nijmegen, The Netherlands
G.Q. Zhang, NXP Semiconductors, Eindhoven, The Netherlands / Delft
University of Technology, Delft, The Netherlands
    Numerical-experimental comparison of
low-g and high-g tests on a polysilicon MEMS accelerometer
Aldo
Ghisi 1, Stanislaw Kalicinski 2, Stefano
Mariani 1, Ingrid de Wolf 2, Alberto Corigliano 1
1 Dipartimento di Ingegneria Strutturale, Politecnico
di Milano, Milano, Italy
2 IMEC, Leuven, Belgium
    Effect of Thermomechanical Stress on
Resonant Frequency Shift of a Silicon MEMS resonator
Mario
Gonzalez, Anne Jourdain, Bart Vandevelde, Harrie A. C. Tilmans, IMEC,
Leuven, Belgium

15:30 Annual meeting of EuroSimE Organising Committee

15:30 Coffee break

16:00 Special Exhibitors session

17:30 Cocktail party

Session 19 08:30 Wednesday 23 Apr 2008
New Developments – I
Chaired
by J. Korvink, IMTEK – C. Bailey, University of Greenwich
    Keynote presentation – Finite
difference scheme for the accurate modelling of boundary layers in microchannels

Nicolás Cordero 1,
Grigory Shishkin 2, Lida Shishkina 3,
Orla Slattery 1, Martin Stynes 2
1 Tyndall National Institute, Cork, Ireland
2 Dept. of Mathematics, University College Cork, Ireland
3 Inst. of Mathematics and Mechanics, Russian Academy
of Science, Ekaterinburg, Russia
    Keynote presentation – Current
Hardware Trends in Mobile Phones
Eduardo
Asuncao, Angelo Costa, Iramylson Freitas, Tommi Reinikainen, Instituto
Nokia de Tecnologia
    Keynote presentation – Feature
Extraction and Health Monitoring using Image Correlation for Survivability
of Leadfree Packaging under Shock and Vibration
Pradeep
Lall, Deepti Iyengar, Sandeep Shantaram, Prashant Gupta, Dhananjay Panchagade,
Jeff Suhling, Auburn University

10:00 Coffee break

Session 20 10:30 Wednesday 23 Apr 2008
Experimental mechanics for micro-electronics

Chaired by J. Auersperg, Fraunhofer IZM –
E.H. Wong, Singapore Institute of Manufacturing Technology
    Keynote presentation – Characterization
and modeling of molding compound properties during cure
K.M.B.
Jansen 1, C. Qian 1, L.J. Ernst 1,
C. Bohm 2, A. Kessler 2, H. Preu 2,
M. Stecher 2
1 TU Delft
2 Infineon Technologies
    Comparison of Bulk Modulus Determined
by Transient Bulk Creep Experiment and Direct Optical Measurement of Poisson’s
Ratio
Richard Löw, Robert
Bosch GmbH, Corporate Sector Research and Advance Engineering, Advance
Production Technology, Plastics Engineering, Germa
Jürgen Wilde, University of Freiburg, Institute of Microsystem Technology,
Laboratory for Assembly and Packaging, Germany
    Lifetime Prediction of BGA Assemblies
with Experimental Torsion Test and Finite Element Analysis
Wilson
Carlos Maia Filho 1, Michel Brizoux 1,
Hélène Frémont 2, Yves Danto 2
1 Thales Services SAS, Meudon-la-Forêt, France
2 IMS, ENSEIRB, UMR 5218, Université Bordeaux 1, Talence,
France
    Lead-free Solder Material Characterization
For Thermo-Mechanical Modeling
Edith
S.W. Poh, W.H. Zhu, X.R. Zhang, C.K. Wang, Anthony Y.S. Sun, H.B. Tan,
United Test and Assembly Center Ltd (UTAC), Singapore
    A Comprehensive Shear-testing Facility
for Joint-scale Solder Samples
Dominik
Herkommer, Michael Reid, Jeff Punch, CTVR, Stokes Research Institute,
University of Limerick, Limerick, Ireland


Session 21 10:30 Wednesday 23 Apr 2008
Ion transport and electro-migration

Chaired by N. Iwamoto, Honeywell
    Keynote presentation – Ionic
polarisation layers in polymer electrolytes
P.M.
Biesheuvel 1, M. van Soestbergen 1, A.
Mavinkurve 2, L.J. Ernst 3, G.Q. Zhang 3
1 Netherlands Institute for Metals Research; Delft
University of Technology; Delft, the Netherlands
2 NXP Semiconductors, Nijmegen, the Netherlands
3 Delft University of Technology, the Netherlands
    Electromigration Induced Failure Mechanism:
Multiphysics Model and Correlation with Experiments
F.
Cacho, V. Fiori, L. Doyen, C. Chappaz, C. Tavernier, H. Jaouen, STMicroelectronics
    Modelling the electromechanical coupling
of RF switch using Extended Finite Element
V.
Rochus 1, L. Van Miegroet 1, P. Duysinx 1,
J.C. Golinval 1, D. Rixen 2
1 University of Liège, Liège, Belgium
2 TU Delft, Delft, The Netherlands
    Simulation of Migration effects in PoP

Kirsten Weide-Zaage 1,
Helene Fremont 2, Linyan Wang 1
1 Laboratorium für Informationstechnologie, University
of Hannover
2 IMS, Université Bordeaux 1 ENSEIRB-UMR 5218 ,
    Thermo-Electro-Mechanical V-Shaped Actuator
Design and Simulations
M. Matmat,
M. Al Ahmad, C. Escriba, S. Soulimane, A. Marty, J.Y Fourniols, LAAS
CNRS, France

12:20 Lunch

Session 22 14:00 Wednesday 23 Apr 2008
New Developments – II
Chaired
by G.Q. Zhang, NXP Semiconductors
    Keynote presentation – Board-Level
Solder Joint Reliability of High Performance Computers under Mechanical
Loading
Keith Newman, Sun
Microsystems
    Keynote presentation – Design
of Carbon Nanotubes based Microwave Applications Employing Mechanical
Resonance Analysis
Mahmoud
Al Ahmad 1, W. I. Milne 2, Robert Plana 1
1 LAAS CNRS
2 University of Cambridge
    Keynote presentation – Investigation
of Thermal Performance of Various Power Device Packages
Xuejun
Fan 1, K. Aung 2, X. Li 2
1 Department of Mechanical Engineering, Lamar University,
Beaumont, Texas; Department of Engineering Mechanics, South China Univer
2 Department of Mechanical Engineering, Lamar University,
Beaumont, Texas

16:00 End of conference