EuroSimE 2014 was held in Ghent, Belgium, in April 2014

180 attendants. 5 short courses.

Proceedings CD-ROM and flash stick ISBN 978-1-4799-4791-1 IEEE catalog CFP14566-CDR

Programme of EuroSimE 2014

Programme at a glance

Session 1		11:00	Monday April 07 2014
Technical Keynotes Chairman: Leo Ernst, Ernst Consultant
11:00	30mn	Keynote presentation – System Reliability for LED-based products J. Lynn Davis, Karmann Mills, Mike Lamvik, Robert Yaga, Sarah D. Shepherd, James Bittle, Nick Baldasaro, Eric Solano, Georgiy Bobashev, Cortina Johnson, Amy Evans, RTI International, USA
11:30	30mn	Keynote presentation – Assessment of Microelectronics Interconnect Reliability – Current Practice and Trends Peter Borgesen, Binghamton University, Binghamton, NY 13902, USA
12:00	30mn	Keynote presentation – Advancements in thermal-fluid engineering and its application to electronics cooling system design Martine Baelmans, KU Leuven, Belgium

 

Session 2		14:00	Monday April 07 2014
3D Interconnect Technology Chairman: Yong Liu, Fairchild Semiconductors; Peter Borgesen, Binghamton University
14:00	30mn	Keynote presentation – Process and Reliability of SF6/O2 Plasma Etched Copper TSVs Lado Filipovic, Roberto Lacerda de Orio, Siegfried Selberherr, Institute for Microelectronics, Technische Universität Wien, Gußhausstraße 27-29/E360, A-1040 Wien, Austria
14:30	20mn	CMOS Stress Sensor for 3D Integrated Circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon Komi Atchou EWUAME 1, Vincent FIORI 1, Karim INAL 2, Pierre-Olivier BOUCHARD 2, Sébastien GALLOIS-GARREIGNOT 1, Sylvain LIONTI 1, Clément TAVERNIER 1, Hervé JAOUEN 1 1 STMicroelectronics, Crolles, France 2 CEMEF Mines ParisTech, Sophia ANtipolis, France
14:50	20mn	The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses Andrej Ivankovic 1, Vladimir Cherman 1, Mario Gonzalez 1, Bart Vandevelde 1, Dirk Vandepitte 2, Gerald Beyer 1, Eric Beyne 1, Ingrid De Wolf 1 1 imec, Leuven, Belgium 2 KU Leuven, Leuven, Belgium
15:10	20mn	Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH) H. Walter 1, A.Kaltwasser 2, M. Broll 3, S.Huber 1, O. Wittler 1, K.-D. Lang 4 1 Fraunhofer IZM, Environmental and Reliability Engineering (ERE), Berlin, Germany 2 Hochschule für Technik und Wirtschaft (HTW) University of Applied Siences, Berlin, Germany 3 Technical University, Berlin, Germany 4 Technical University, Berlin, Germany; Fraunhofer IZM, Environmental and Reliability Engineering (ERE), Berlin, Germany;
15:30	20mn	Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman Spectroscopy and fibDAC Dietmar Vogel 1, Uwe Zschenderlein 2, Ellen Auerswald 1, Ole Hoelck 2, Peter Ramm 3, Bernhard Wunderle 2, Reinhard Pufall 4 1 Fraunhofer ENAS, Chemnitz, Germany 2 Technical University Chemnitz, Germany 3 Fraunhofer EMFT, Munich, Germany 4 Infineon Technologies AG, Munich, Germany

 

Session 3		14:00	Monday April 07 2014
Multi-Physics Modelling (inluding Moisture, Electrical, etc) Chairman: Cell Wong, SKL SSL; Enrico Zanoni, University of Padova
14:00	30mn	Keynote presentation – Multi-physical modeling of nano-second laser dicing on ultra-thin silicon wafers Germano Galasso 1, Manfred Kaltenbacher 2, Balamurugan Karunamurthy 1, Hannes Eder 3, Tobias Polster 3 1 KAI Kompetenzzentrum GmbH, Villach, Austria 2 Vienna University of Technology, Vienna, Austria 3 Infineon Technologies AG, Villach, Austria
14:30	20mn	Mutiphysics Study of RF/Microwave Planar Devices: Effect of the Input Signal Power Miguel Sanchez-Soriano 1, Michael Edwards 2, Yves Quere 1, Dag Andersson 2, Stephane Cadiou 1, Cedric Quendo 1 1 Lab-STICC, Université de Bretagne Occidentale, Brest, France 2 Swerea IVF, Molndal, Sweden
14:50	20mn	Electromigration Reliability of Cylindrical Cu Pillar SnAg3.0Cu0.5 Bumps Lutz Meinshausen 1, Kirsten Weide-Zaage 2, Bastian Goldbeck 2, Aymen Moujbani 2, Jörg Kludt 2, Hélène Frémont 3 1 Information Technology Laboratory, Leibniz Universität Hannover, Hannover, Germany; Laboratoire IMS, CNRS UMR 5218, Université Bordeaux, France 2 Information Technology Laboratory, Leibniz Universität Hannover, Hannover, Germany 3 Laboratoire IMS, CNRS UMR 5218, Université Bordeaux, France
15:10	20mn	Electrical Characteristics Evolution of the Deep Trench Termination Diode based on a finite elements simulation approach F. Baccar, F. Le Henaff, L. Théolier, S. Azzopardi, E. Woirgard, IMS Laboratory, University of Bordeaux, Talence, France
15:30	20mn	Methodology for supporting electronic system prototyping through semiautomatic component selection Ryszard Świerczyński, Krzysztof Urbański, Artur Wymysłowski, Wroclaw University of Technology, Wroclaw, Poland

 

Session 4		14:00	Monday April 07 2014
Thermal Modeling and Characterization Chairman: Heinz Pape, Pape Farm; Peter Rodgers, The Petroleum Institute
14:00	30mn	Keynote presentation – Thermal characteristics of SiC diode assembly to ceramic substrate Kisiel Ryszard 1, Guziewicz Marek 2, Myśliwiec Marcin 1, Kraśniewski Jarosław 3, Janke Włodzimierz 3 1 Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Poland 2 Institute of Electron Technology, Warsaw, Poland 3 Department of Electronics and Computer Science, Koszalin University of Technology, Poland
14:30	20mn	Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials Mohamad Abo Ras 1, Bernhard Wunderle 2, Daniel May 2, Ralph Schacht 3, Thomas Winkler 1, Sven Rzepka 4, Bernd Michel 4 1 Berliner Nanotest und Design GmbH, Germany 2 Chemnitz University of Technology, Germany 3 Brandenburg University of Technology, Germany 4 Fraunhofer Institute for Electronic Nano Systems ENAS, Germany
14:50	20mn	Theoretical and Experimental Study of the Thermal Resistance Spectrum of High-Power AlInGaN LEDs A.E. Chernyakov 1, A.L. Zakgeim 1, K.A. Bulashevich 2, S.Yu. Karpov 2, V.I. Smirnov 3, V.A. Sergeev 3 1 Submicron Heterostructures for Microelectronics Research & Engineering Center, RAS, St. Petersburg, Russia 2 STR Group – Soft-Impact, Ltd. St. Petersburg, Russia 3 Institute of Radio-engineering and Electronics of RAS, Ulyanovsk, Russia
15:10	20mn	Electro-thermal characterization of through-silicon-vias Aida Todri-Sanial, CNRS-LIRMM, Montpellier, France
15:30	20mn	Effect of laminar air flow on probe burn for spring probe Baha Zafer, Istanbul University – Dept. of Mechanical Engineering, Turkey Bahadır Tunaboylu, Istanbul Sehir University – Dept. of Industrial Engineering, Turkey

 

Session 5		16:20	Monday April 07 2014
Materials Modeling Chairman: Jürgen Wilde; Steffen Wiese
16:20	30mn	Keynote presentation – The Shear Strength of nano-Ag Solders and the use of Ag Interconnects in the Design and Manufacture of SiGe-based Thermo-Electric Modules Michael Edwards, Klas Brinkfeldt, Melina Da Silva, Dag Andersson, Swerea IVF, Sweden
16:50	20mn	Thermo-mechanical Stress of Underfilled 3D IC Packaging Ming-Han Wang, Mei-Ling Wu, National Sun Yat-Sen University, Kaohsiung, Taiwan
17:10	20mn	Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions P.F. Fuchs, Polymer Compentence Center Leoben GmbH, Leoben, Austria G. Pinter, Material Science and Testing of Plastics, Department Polymer Engineering and Science, University of Leoben, Leoben, Austria T. Krivec, Austria Technologie & Systemtechnik AG, AT&S, Leoben, Austria
17:30	20mn	Determination of cyclic mechanical properties of thin copper layers for PCB applications Klaus Fellner 1, Peter Filipp Fuchs 1, Thomas Antretter 2, Gerald Pinter 3, Ronald Schöngrundner 4 1 Polymer Competence Center Leoben GmbH, 8700 Leoben, Austria 2 Institute of Mechanics, Montanuniversitaet Leoben, 8700 Leoben, Austria 3 Institute of Materials Science and Testing of Polymers, Montanuniversitaet Leoben, 8700 Leoben, Austria 4 Materials Center Leoben Forschung GmbH, 8700 Leoben, Austria

 

Session 6		16:20	Monday April 07 2014
Molecular Dynamics Chairman: Cadmus Yuan, SKL SSL; Sau Koh, TU Delft Beijing
16:20	30mn	Keynote presentation – Molecular Dynamic Simulations of Maximum Pull-Out Forces of Embedded CNTs for Sensor Applications and Validating Nano Scale Experiments Steffen Hartmann 1, Ole Hölck 2, Thomas Blaudeck 1, Sascha Hermann 1, Stefan E. Schulz 3, Thomas Gessner 3, Bernhard Wunderle 1 1 Technische Universität Chemnitz, Germany 2 Fraunhofer IZM Berlin, Germany 3 Fraunhofer ENAS Chemnitz, Germany
16:50	20mn	An Investigation of the Tensile Deformation and Failure of an Epoxy/Cu Interface Using Coarse-Grained Molecular Dynamics Simulations Shaorui Yang, Jianmin Qu, Northwestern University, USA
17:10	20mn	Using Molecular Modeling to Uncover the Origins of Subtle Solvation-Based Film Defects. Nancy Iwamoto, Teri Baldwin, Honeywell Performance Materials and Technologies, USA
17:30	20mn	Molecular Dynamics Simulation of Adhesion Performance and Conformation Transition of SAM-modified Cu/Epoxy Interface under Electrical Field Stephen C.T. Kwok, Matthew M.F. Yuen, Department of Mechanical & Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong

 

Session 7		16:20	Monday April 07 2014
Thermal Behavior Modeling Chairman: Martine Baelmans, KU Leuven; Martin Springborn, TU Chemnitz
16:20	30mn	Keynote presentation – Investigation of a Finned Baseplate Material and Thickness Variation for Thermal Performance of a SiC Power Module Yafan Zhang 1, Ilja Belov 2, Mietek Bakowski 1, Jang-Kwon Lim 1, Peter Leisner 3, Hans-Peter Nee 4 1 Acreo Swedish ICT AB, Kista, Sweden 2 Jönköping University, School of Engineering, Jönköping, Sweden 3 SP Technical Research Institute of Sweden, Borås, Sweden / Copenhagen, Denmark 4 KTH School of Electrical Engineering, Electrical Energy Conversion, Stockholm, Sweden
16:50	20mn	Compact Thermal Modeling of Microbolometers M. Janicki, P. Zajac, M. Szermer, A. Napieralski, Lodz University of Technology, Poland
17:10	20mn	Modeling of SiC Power Modules with Double Sided Cooling Klas Brinkfeldt 1, Klaus Neumaier 2, Alexander Mann 1, Olaf Zschieschang 2, Alexander Otto 3, Eberhard Kaulfersch 4, Michael Edwards 1, Dag Andersson 1 1 Swerea IVF, Molndal, Sweden 2 Fairchild Semiconductor GmbH, Aschheim, Germany 3 Fraunhofer ENAS, Chemnitz, Germany 4 Berliner Nanotest und Design GmbH, Berlin, Germany
17:30	20mn	Modelling of non-stationary processes in optomechanical thermal microsensors Alexander Kozlov, Omsk State University, Russia

 

Session 8		09:00	Tuesday April 08 2014
Wirebond Failures Chairman: Michael Guyenot, Robert Bosch; Reinhard Pufall, Infineon
09:00	30mn	Keynote presentation – Modelling the Lifetime of Aluminum Heavy Wire Bond Joints with a Crack Propagation Law Arian Grams 1, Tobias Prewitz 1, Olaf Wittler 1, Stefan Schmitz 1, Andreas Middendorf 1, Klaus-Dieter Lang 2 1 Fraunhofer IZM, Berlin, Germany 2 Technische Universität Berlin, Berlin, Germany
09:30	20mn	Comparison of Bondwire life with Effective Strain Method and Cohesive Zone Method for A Power Package Jicheng Zhang 1, Yangjian Xu 1, Yong Liu 2 1 Zhejiang University of Technology, Hangzhou, China 2 Fairchild Semiconductor, South Portland, Maine, USA
09:50	20mn	FEM Wire Bonding Simulation For Sensor Chip Applications F. Kraemer, S. Wiese, Saarland University, Chair of Microintegration and Reliability, Saarbrucken, Germany

 

Session 9		09:00	Tuesday April 08 2014
MEMS Characterisation and Measurement Chairman: Dag Andersson, Swerea; Xiaosong Ma, Guilin University of Electronic Technology
09:00	30mn	Keynote presentation – B-Field Characterization and Equivalent Ccircuit Modeling of a Poly-SiGi-MEMS Based Xylophone Bar Magnetometer M. A. Farghaly 1, V. Rochus 2, X. Rottenberg 2, U. S. Mohammed 3, H. A. C. Tilmans 2 1 KACST-Intel Consortium Center of Excellence in Nano-manufacturing Applications 2 imec 3 Department of Electrical Engineering, Faculty of Engineering, Assiut University, Assiut, Egypt
09:30	20mn	Modeling and Simulation of a MEMS Thermal Actuator with Polysilicon Heater Dries Dellaert, Jan Doutreloigne, Centre for Microsystems Technology (CMST), IMEC – Ghent University, Gent, Belgium
09:50	20mn	Simulation and Measurement of Pressure Dependent Q-factors in NEMS Resonators Johannes Manz, Gabriele Schrag, Gerhard Wachutka, Institute for Physics of Electrotechnology Munich University of Technology, Munich, Germany

 

Session 10		09:00	Tuesday April 08 2014
Thermal Behavior Modeling using FEA Chairman: Aida Todri-Sanial, CNRS-LIRMM; Ilja Belov, Jönköping University
09:00	30mn	Keynote presentation – Thermo-mechanical Characterization of Passive Stress Sensors in Si interposer Benjamin Vianne 1, Pierre Bar 1, Vincent Fiori 1, Sébastien Gallois-Garreignot 1, Komi Atchou Ewuame 1, Pascal Chausse 2, Stéphanie Escoubas 3, Nicolas Hotellier 1, Olivier Thomas 3 1 STMicroelectronics, Crolles, France 2 CEA LETI, MINATEC Campus, Grenoble, France 3 Aix-Marseille Université, CNRS, IM2NP UMR 7334, Campus de Saint Jérôme, Marseille, France
09:30	20mn	An Analytical Model for Thermal Failure Analysis of 3D IC Packaging Jia-Shen Lan, Mei-Ling Wu, Department of Mechanical and Electro-mechanical Engineering, National Sun Yat-sen University, Kaohsiung, Taiwan (R.O.C)
09:50	20mn	Microstructure Simulation of Grain Growth in Cu Through Silicon Via Using Phase-Field Modelling Nabi Nabiollahi 1, Nele Moelans 2, Mario Gonzalez 1, Joke De Messemaeker 1, Christopher J. Wilson 1, Kristof Croes 1, Eric Beyne 1, Ingrid De Wolf 1 1 IMEC, Leuven, Belgium 2 KuLeuven MTM , Lueven, Belgium

 

Session 11		10:40	Tuesday April 08 2014
Thermo-Mechanical Issues in Microelectronics Chairman: Bernhard Wunderle, TU Chemnitz; Kaspar Jansen, TU Delft
		Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules Alan Wright 1, Aaron Hutzler 1, Andreas Schletz 1, Peter Pichler 2 1 Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen & Nürnberg, Germany 2 Fraunhofer IISB, Erlangen, Germany and the Chair of Electron Devices, University of Erlangen-Nuremberg, Erlangen, Germany
		Acquisition Unit for In-Situ Stress Measurements in a Smart Electronic Systems Alicja Palczyńska 1, Florian Pesth 1, Przemyslaw Jakub Gromala 1, Tobias Melz 2, Dirk Mayer 2 1 Robert Bosch GmbH, Reutlingen, Germany 2 Fraunhofer-Institut für Betriebsfestigkeit und Systemzuverlässigkeit LBF, Darmstadt, Germany
		Mechanical analysis of encapsulated metal interconnects under transversal load Bjorn Van Keymeulen 1, Mario Gonzalez 2, Frederick Bossuyt 1, Johan De Baets 1, Jan Vanfleteren 1 1 CMST-imec, Belgium 2 imec, Belgium
		Development and Validation of Dye-sensitized Solar Cell Finite Element Model for Sealing Failure Investigation Changwoon Han, Seung Il Park, Korea Electronics Technology Institute, Seongnam, Korea
		FEM Stress Analysis of Various Solar Module Concepts under Temperature Cycling Load F. Kraemer, S. Wiese, Saarland University, Chair of Microintegration and Reliability, Saarbrucken, Germany
		Mechanical Stress Analysis in Photovoltaic Cells during the String-Ribbon Interconnection Process F. Kraemer 1, J. Seib 2, E. Peter 2, S. Wiese 1 1 Saarland University, Chair of Microintegration and Reliability, Saarbrucken, Germany 2 Robert Bosch GmbH, Corporate Sector Research (CR/APJ3), Stuttgart, Germany
		Drop Impact Simulations for Lifetime Assessment of PCB/BGA Assemblies regarding Pad Cratering Grace Lolita Tsebo Simo 1, Hossein Shirangi 1, Matthias Nowottnick 2, Rainer Dudek 3, Eberhard Kaulfersch 3, Sven Rzepka 3, Bernd Michel 3 1 Robert Bosch GmbH; Automotive Electronics, Engineering Assembly and Interconnect Technology (AE/EAI2), Stuttgart, Germany 2 University of Rostock; IEF/IGS, Institute of Electronic Appliances and Circuits; Rostock, Germany 3 Fraunhofer ENAS, Micro Materials Center, Technologie Campus 3, D-09126 Chemnitz, Germany
		Framework to Extract Cohesive Zone Parameters Using Double Cantilever Beam and Four-Point Bend Fracture Tests Sathyanarayanan Raghavan 1, Ilko Schmadlak 2, Suresh K. Sitaraman 1, George Leal 3 1 Georgia Institute of Technology, Atlanta, Georgia, USA 2 Freescale Halbleiter Deutschland GmbH, Munich, Germany 3 Freescale Semiconductor, Austin, Texas, USA
		Applications of Laser Welding to Electric Connectors Chung-Fu Liao, Shih-Po Liu , Kuo-Chi Liao , National Taiwan University, Taipei, Taiwan
		Thermo-Mechanical Stress Investigation of Integrated SAW Strain Sensors Jochen Hempel 1, Sohaib Anees 1, Jürgen Wilde 2, Leonhard Reindl 1 1 Laboratory for Electrical Instrumentation, Department of Microsystems Engineering IMTEK University of Freiburg, Germany 2 Laboratory for Assembly and Packaging Technology Department of Microsystems Engineering IMTEK University of Freiburg, Germany
		A Crack Analysis Model for Silicon Based Solar Cells Joseph Al Ahmar, Steffen Wiese, Saarland University, Germany
		Structure Design and Reliability Assessment of Double-sided with Double-chip Stacking Packaging Yen-Fu Su 1, Chun-Te Lin 2, Tzu-Ying Kuo 2, Kuo-Ning Chiang 1 1 National Tsing Hua University, Hsinchu, Taiwan 2 Industrial Technology Research Institute, Hsinchu, Taiwan
		Design aspects for CPI robust BEOL Mario Gonzalez, Luka Kljucar, Bart Vandevelde, Ingrid De Wolf, Zsolt Tokei, imec, Leuven, Belgium
		Accurate Prediction of SnAgCu Solder Joint Fatigue of QFP Packages for Thermal Cycling Martin Niessner, Gerhard Schuetz, Christian Birzer, Laurens Weiss, Infineon Technologies AG, Germany
		Thermo-mechanical stress induced by CPI on 3D interposer package with large die. Melina Lofrano, Mario Gonzalez, imec, Leuven, Belgium
		Modelling, simulation and optimization for a SThm nanoprobe Bin Yang 1, Michel Lenczner 2, Scott Cogan 1, Fabian Menges 3, Heike Riel 3, Bernd Gotsmann 3, Pawel Janus 4, Guillaume Boetch 5 1 FEMTO-ST, University of Franche-Comté, Belfort, France 2 FEMTO-ST, University of Technology at Belfort-Montbeliard, France 3 IBM Research-Zürich, Rüschlikon, Switzerland 4 Institute of Electron Technology, Warszawa, Poland 5 Imina Technologie SA, EPFL Innovation Park, Lausanne, Switzerland
		Failure mode analysis and optimization of assembled high temperature pressure sensors Roderich Zeiser 1, Suleman Ayub 1, Michael Berndt 1, Jens Müller 2, Jürgen Wilde 1 1 University of Freiburg, Germany 2 University of Ilmenau, Germany
		Improvement of freestanding CMOS-MEMS through thin film stress analysis in metallic layers Sebastian ORELLANA 1, Brice ARRAZAT 2, Pascal FORNARA 3, Christian RIVERO 3, Antonio DI GIACOMO 3, Sylvain BLAYAC 2, Karim INAL 1, Pierre MONTMITONNET 1 1 Mines ParisTech – CEMEF, Sophia Antipolis, France 2 Ecole Nationale Supérieure des Mines de Saint-Etienne, Gardanne, France 3 STMicroelectronics, Rousset, France
		A New Life-Test Equipment Designed for Medium-Duty Electromagnetic Contactors Serkan BIYIK, Murat AYDIN, Karadeniz Technical University, Trabzon, Turkey
		Design for Thermo-Mechanical Reliability of a 3D Microelectronic Component Using 3D FEM Soufyane BELHENINI 1, Abdellah TOUGUI 1, Franck DOSSEUL 2 1 Laboratoire de Mécanique et Rhéologie (LMR), Université de Tours, Tours, France 2 STMicroelectronics, Tours, France
		Measuring Young’s Modulus of Polysilicon via Cantilever Microbeam Arrays Steven Kehrberg 1, Markus Dorwarth 1, Sebastian Günther 1, Steffen Markisch 1, Carsten Geckeler 1, Jan Mehner 2 1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany 2 Technical University Chemnitz, Faculty for Electrical Engineering and Information Technologies, Dept. Microsystems and Precision Engineering, Chemnitz, Germany
		Characterization and modeling of the AuSnCu thin solder joint under thermal cycling Tiphaine Pélisset 1, Balamurugan Karunamurthy 1, Ralf Otremba 2, Thomas Antretter 3 1 KAI GmbH – Kompetenzzentrum Automobil- und Industrieelektronik, Villach, Austria 2 Infineon Technologies AG, Neubiberg, Germany 3 Institute of Mechanics – Montauniversitaet, Leoben, Austria
		FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint Walide Chenniki 1, Isabelle Bord-Majek 1, Bruno Levrier 1, Komkrisd Wongtimnoi 2, Jean-Luc Diot 3, Yves Ousten 1 1 IMS Laboratory, University of Bordeaux, Talence, France 2 INSA Lyon, Villeurbanne, France 3 NovaPack, Saint-Egrève, France
		Software Reliability and Its Interaction with Hardware W.D. van Driel 1, M. Schuld 2, R. Wijgers 2, W.E.J. van Kooten 3 1 Philips Lighting & Delft University of Technology, The Netherlands 2 CQM, The Netherlands 3 Philips Lighting, The Netherlands
		Investigation of Temperature and Moisture Effects on Interface Toughness of EMC and Copper Using Cohesive Zone Modeling Method Xiaosong Ma, G.Q.Zhang, Guilin University of Electronic Technology, Guilin, China

 

Session 12		10:40	Tuesday April 08 2014
Thermal and Multi-Physics Issues in Microelectronics Chairman: Bernhard Wunderle, TU Chemnitz; Kaspar Jansen, TU Delft
		Crosstalk phenomena analysis using electromagnetic wave propagation by experimental an numerical simulation methods Alicja Palczyńska 1, Artur Wymysłowski 1, Tomasz Bieniek 2, Grzegorz Janczyk 2, Daniel Pasquet 3, Thanh Vinh Dinh 3 1 Wroclaw University of Technology, Poland 2 Institute of Electron Technology, Poland 3 LaMIPS, France
		MedeA® Atomistic Simulations for Designing and Testing Micro/Nano Electronics Systems A. France-Lanord 1, D. Rigby 2, A. Mavromaras 1, V. Eyert 1, P. Saxe 2, C. Freeman 2, E. Wimmer 2 1 Materials Design SARL 2 Materials Design Inc.
		Adhesion work analysis by molecular modelling and wetting angle measurement Kamil Nouri Allaf, Dawid Jan Król, Artur Wymysłowski, Irena Zubel, Krzysztof Rola, Wroclaw University of Technology, Faculty of Microsystems Electronics and Photonics, ul. Janiszewskiego 11/17, 50-372 Wrocław, Poland
		Correlation of Activation Energy between LEDs and Luminaires in the Lumen Depreciation Test Guangjun Lu, Beijing Research Center, Delft University of Technology, Beijing, China; State Key Laboratory of Solid State Lighting, Beijing, China Cadmus Yuan, Institute of Semiconductors, Chinese Academy of Sciences, Haidian, Beijing, China; State Key Laboratory of Solid State Lighting, Beijing, China Xuejun Fan, Department of Mechanical Engineering, Lamar University, Beaumont, USA G.Q. Zhang, Delft University of Technology, EEMCS Faculty, Delft, the Netherlands; Institute of Semiconductors, Chinese Academy of Sciences, Haidian, Beijing, China
		Modelling and Simulation of monolithic integration of rectifiers for solid state lighting applications Manjunath.R.Venkatesh, P.Liu, H.W.van Zeijl, G.Q.Zhang, Delft University of Technology, DIMES Research Center, Delft, the Netherlands
		Thermal Performance of Embedded Heat Pipe in High Power Density LED Streetlight Module Hongyu Tang 1, Jia Zhao 1, Bo Li 2, Stanley Y Y Leung 3, Cadmus C A Yuan 4, G Q Zhang 5 1 State Key Laboratory of Solid-State Lighting, Changzhou, Jiangsu, China 2 State Key Laboratory of Solid-State Lighting, Haidian, Beijing, China 3 State Key Laboratory of Solid-State Lighting, Changzhou, Jiangsu, China; Beijing Research Center, Delft University of Technology, Haidian, Beijing, China 4 State Key Laboratory of Solid-State Lighting, Haidian, Beijing, China; Research and Development Center for Semiconductor Lighting, Institute of Semiconductors, Chinese Academy of Sciences, Haidian, Beijing, China 5 Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology, Delft, the Netherlands
		Reliability and Accelerated Tests of Plastic Materials in LED-Based Products M. Yazdan Mehr, Materials innovation institute (M2i), Delft, The Netherlands, Delft University of Technology, EEMCS Faculty, Delft, The Netherlands W.D. van Driel, Delft University of Technology, EEMCS Faculty, Delft, The Netherlands , Philips Lighting, Eindhoven, The Netherlands G.Q. Zhang, Delft University of Technology, EEMCS Faculty, Delft, The Netherlands
		2-Gb/s/pin DDR3 Memory Channel Design and Simulation for Carbon Reduction Nansen Chen, MediaTek Inc., Hsinchu, Taiwan, R.O.C.
		Investigation of Color Shift of LEDs-Based Lighting Products S. Koh 1, H. Ye2 2, M. Yazdan Mehr 2, J. Wei 2, W.D. van Driel 3, L.B. Zhao 4, G.Q. Zhang 2 1 Beijing Research Center, Delft University of Technology, Beijing, China 2 Delft University of Technology, EEMCS Faculty, Delft, the Netherlands 3 Philips Lighting, Eindhoven, the Netherlands 4 Institute of Semiconductor, Chinese Academy of Science, Beijing, China
		Size effect on the microbridges quality factor tested in free air space Marius Pustan, Corina Birleanu, Florina Rusu, Cristian Dudescu, Ovidiu Belcin, Technical University of Cluj-Napoca, Romania
		Analytical tool for electro-thermal modelling of microbolometers Piotr Zając 1, Cezary Maj 1, Michał Szermer 1, Mykhaylo Lobur 2, Andrzej Napieralski 1 1 Dept. of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland 2 CAD Dept., Lviv Polytechnic National University, Lviv, Ukraine
		Comparation of Thermal and Moisture Effect on the Degradation of LED Packages Xiaosong Ma, G.Q.Zhang, Guilin University of Electronic Technology, China
		Microactuator modeling to develop a new template for the Braille reading Sofiane Soulimane 1, Med El Amine Brixi Nigassa 2, Benyounes Bouazza 2, Henri Camon 3 1 Biomedical Engineering electronic and Department (Tlemcen University) and CDTA, Algeria 2 Biomedical Engineering electronic and Department (Tlemcen University), Algeria 3 LAAS-CNRS, Toulouse, France
		Numerical Modeling of Flexible Actuator for Dynamic Lighting Teng Ma, Xueming Li, G.Q. Zhang, P.M.Sarro, Electronic Components, Technology and Materials Laboratory (ECTM), Delft University of Technology, The Netherlands
		System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS Vladimir Kolchuzhin 1, Jan Mehner 1, Erik Markert 1, Ulrich Heinkel 1, Christian Wagner 1, Jörg Schuster 2, Thomas Gessner 2 1 Chemnitz University of Technology, Chemnitz, Germany 2 Fraunhofer Institute for Electronic Nano System (ENAS), Chemnitz, Germany
		Multiphysics modeling for Current Carrying Capability of a Power Package Richard Qian, Fairchild Semiconductor, Suzhou, China Yumin Liu, Fairchild Semiconductor, Shanghai, China Yong Liu, Fairchild Semiconductor, South Portland, Maine, USA

 

Session 13		13:30	Tuesday April 08 2014
Solder Modeling Chairman: Rainer Dudek, Fraunhofer ENAS; Nancy Iwamoto, Honeywell
13:30	30mn	Keynote presentation – Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for Finite Element calculations A. Kabakchiev 1, B. Métais 1, R. Ratchev 1, M. Guyenot 1, P. Buhl 2, M. Hossfeld 2, X. Schuler 2, R. Metasch 3, M. Roellig 3 1 Robert Bosch GmbH, Corporate Research Division, Postfach 300240, 70442 Stuttgart, Germany 2 Materialprüfungsanstalt (MPA) Universtät Stuttgart, Pfaffenwaldering 32, 70569 Stuttgart, Germany 3 Fraunhofer Institute for Ceramic Technology and Systems, Material Diagnostics, Dresden, Germany
14:00	20mn	Analytical stress model for tin based solder material M. Guyenot, A. Fix, Robert Bosch GmbH, Corporate Research Division, Schwieberdingen, Germany
14:20	20mn	Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modeling in Finite Element calculations of automotive electronics R. Metasch 1, M. Roellig 1, A. Kabakchiev 2, B. Metais 2, R. Ratchev 2, K. Meier 3, K.-J. Wolter 3 1 Fraunhofer Institute for Ceramic Technology and Systems, Material Diagnostics, Germany 2 Robert Bosch GmbH, Postfach 300240, 70442 Stuttgart, Germany 3 Technische Universität Dresden, Electronics Packaging Laboratory, Germany
14:40	20mn	Reliability Study on Chip Capacitor Solder Joints under Thermo-Mechanical and Vibration Loading Karsten Meier 1, Mike Roellig 2, Andreas Schießl 3, Klaus-Juergen Wolter 1 1 Technische Universität Dresden – Electronics Packaging Laboratory, Germany 2 Fraunhofer IKTS-MD, Germany 3 Continental Automotive GmbH, Germany
15:00	20mn	Creep and Fatigue as Main Degradation Phenomena in Reliability of Solder Joints Krystian Jankowski, Artur Wymyslowski, Wroclaw University of Technology, Poland

 

Session 14		13:30	Tuesday April 08 2014
Multi-Physics Modelling of MEMS Structures Chairman: Alberto Corigliano, Politecnico di Milano; Germano Galasso, KAI
13:30	30mn	Keynote presentation – Theoretical and Experimental Investigations on Failure Mechanisms Occuring During Long-Term Cycling of Electrostatic Actuators Regine Behlert, Thomas Kuenzig, Gabriele Schrag, Gerhard Wachutka, Munich University of Technology, Munich, Germany
14:00	20mn	Computationally Efficient and Stable Order Reduction Method for a Large-Scale Model of MEMS Piezoelectric Energy Harvester M. Kudryavtsev 1, E. B. Rudnyi 2, T. Bechtold 1, J. G. Korvink 1 1 Institute for Microsystems Engineering, Freiburg University, Germany 2 CADFEM GmbH, Munich, Germany
14:20	20mn	2D micro-chamber for DC Plasma working at low power Véronique Rochus, Vladimir Samara, Bart Vereecke, Philippe Soussan, Bart Onsia, Xavier Rottenberg, imec, Leuven, Belgium
14:40	20mn	Characterization and post simulation of thin-film PZT actuated plates for haptic applications F. Casset 1, JS. Danel 1, P. Renaux 1, C. Chappaz 2, G. Le Rhun 1, C. Dieppedale 1, M. Gorisse 3, S. Basrour 3, S. Fanget 1, P. Ancey 2, A. Devos 4, E. Defaÿ 1 1 CEA, LETI, MINATEC Campus, Grenoble, France 2 STMicroelectronics, Crolles, France 3 TIMA, Grenoble, France 4 IEMN/ISEN-CNRS, Lille, France
15:00	20mn	Design, Technology, Numerical Simulation and Optimization of Building Blocks of a Micro and Nano Scale Tensile Testing Platform with Focus on a Piezoresistive Force Sensor Peter Meszmer 1, Karla Hiller 2, Daniel May 1, Steffen Hartmann 1, Alexey Shaporin 3, Jan Mehner 3, Bernhard Wunderle 1 1 Technische Universität Chemnitz, Faculty for electrical engineering and information technologies,Chair materials and reliability of microsystems, Chemnitz, Germany 2 Technische Universität Chemnitz, Center for Microtechnologies ZfM, Chemnitz, Germany 3 Technische Universität Chemnitz, Faculty for electrical engineering and information technologies,Chair of Microsystems and Precision Engineering, Chemnitz, Germany

 

Session 15		13:30	Tuesday April 08 2014
Process Modeling Chairman: Ingrid Maus, Infineon; Arian Grams, Fraunhofer IZM
13:30	30mn	Keynote presentation – Thermo-mechanical Analyses of Printed Board Assembly during Reflow Process for Warpage Prediction Soonwan Chung, Seunghee Oh, Tackmo Lee, Minyoung Park, Samsung Electronics Co., Ltd., Suwon, Republic of Korea
14:00	20mn	Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards Katerina Macurova 1, Paul Angerer 1, Ronald Schöngrundner 1, Thomas Krivec 2, Mike Morianz 2, Thomas Antretter 3, Raul Bermejo 4, Martin Pletz 1, Michel Brizoux 5, Wilson Maia 5 1 Materials Center Leoben Forschung GmbH, Leoben, Austria 2 AT&S AG, Leoben, Austria 3 Institut für Mechanik, Montanuniversitaet Leoben, Leoben, Austria 4 Institut für Struktur- und Funktionskeramik, Montanuniversitaet Leoben, Leoben, Austria 5 Thales Global Services, Meudon-la-Forêt, France
14:20	20mn	Measuring the Mechanical Relevant Shrinkage during In-Mold and Post-Mold Cure with the Stress Chip Florian Schindler-Saefkow 1, Florian Rost 1, Ali Rezaie Adli 2, K.M.B. Jansen 2, B. Wunderle 3, J. Keller 4, Sven Rzepka 1, B. Michel 1 1 Fraunhofer ENAS 2 Delft University of Technology, Netherland 3 Technische Universität Chemnitz 4 AMIC GmbH, Berlin, Germany
14:40	20mn	Thermo-electrical and structural coupled simulations of buckling beam microprobes in high temperature / high current conditions D. Eckhaut 1, E. Bertarelli 2, D. Acconcia 2, R. Vallauri 2, G. Cocchetti 1, A. Corigliano 1 1 Department of Civil and Environmental Engineering, Politecnico di Milano, Milano, Italy 2 R&D Department, Technoprobe SpA, Cernusco Lombardone (LC), Italy
15:00	20mn	New equivalent stress describes the dicing caused anisotropic breaking strength of silicon dies Matthias Steiert, Jürgen Wilde, Department of Microsystems Engineering (IMTEK), Freiburg, Germany

 

Session 16		15:40	Tuesday April 08 2014
Reliability modeling Chairman: Jianmin Qu, Northwestern University; Sven Rzepka, Fraunhofer ENAS
15:40	30mn	Keynote presentation – Combined Experimental- and FE-Studies on Sinter-Ag Behaviour and Effects on IGBT-Module Reliability Rainer Dudek 1, Ralf Döring  1, J.-Peter Sommer 1, Bettina Seiler 2, Kerstin Kreyssig 2, Hans Walter 3, Martin Becker 4, Michael Günther 5 1 Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany 2 CWM GmbH, Chemnitz, Germany 3 TU Berlin, Forschungsschwerpunkt „Technologien der Mikroperipherik“, Germany 4 FH Kiel, Institut für Mechatronik, Germany 5 Robert Bosch GmbH, CR/APJ3, Stuttgart, Germany
16:10	20mn	Hidden Head-in-Pillow soldering failures Bart Vandevelde 1, Geert Willems 1, Bart Allaert 2 1 imec 2 Connect Group
16:30	20mn	Reliability Assessment of Discrete Passive Components embedded into PCB Core Robert Schwerz 1, Mike Roellig 1, Sergii Osmolovskyi 2, Klaus-Jürgen Wolter 2 1 Fraunhofer IKTS-MD, Germany 2 TU-Dresden, Electronics Packaging Laboratory, Germany
16:50	20mn	Study on configuration design of interconnection in high power module Li-Ling Liao 1, Tuan-Yu Hung 2, Chun-Kai Liua 3, Yen-Fu Su 2, Kuo-Ning Chiang 2 1 Electronic and Optoelectronics Research Laboratories, Industrial Technology Research Institute; Dept. of Power Mechanical Engineering, National Tsing Hua University, HsinChu, Taiwan 300, R.O.C. 2 Dept. of Power Mechanical Engineering, National Tsing Hua University, HsinChu, Taiwan 300, R.O.C. 3 Electronic and Optoelectronics Research Laboratories, Industrial Technology Research Institute.
17:10	20mn	Predictive reliability using FEA simulations of power stacked ceramic capacitors for aeronautical applications Warda Benhadjala 1, Bruno Levrier 2, Isabelle Bord-Majek 2, Laurent Béchou 2, Ephraim Suhir 3, Yves Ousten 2 1 IMS Laboratory, University of Bordeaux, UMR CNRS 5218, Talence, France; CEA LETI, Grenoble, France 2 IMS Laboratory, University of Bordeaux, UMR CNRS 5218, Talence, France 3 University of California, Santa Cruz, California 95064, USA

 

Session 17		15:40	Tuesday April 08 2014
Solid State Lighting Chairman: Lynn Davis, RTI; Ralph Tuttle, Cree
15:40	30mn	Keynote presentation – Reliability of LED-based products Xuejun Fan, Lamar University, Beaumont, Texas, USA Cadmus Yuan, State Key Lab SSL, Beijing, China
16:10	20mn	Numerical study on integrated optical sensors in smart LED devices Erica Coenen, TNO Technical Sciences, Eindhoven, the Netherlands
16:30	20mn	Degradation of LED package materials during device operation: an FE approach to product reliability prediction Stefan Watzke, Paola Altieri-Weimar, OSRAM Opto Semicondoctors, Regensburg, Germany
16:50	20mn	A model in predicting color of LED packages with different phosphor layer dimensions Cell K Y Wong 1, Stanley Y Y Leung 1, Y J Xiong  1, Cadmus C.A. Yuan 2, G Q Zhang 3 1 State Key Laboratory of Solid State Lighting, Changzhou, China 2 State Key Laboratory of Solid State Lighting, Beijing, China 3 Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology, Delft, the Netherlands
17:10	20mn	A Lifetime Prediction Method for Solid State Lighting Power Converters Based on SPICE Models and Finite Element Thermal Simulations Bo Sun 1, Xuejun Fan 2, C.A. Yuan 1, Sau Wee Koh 1, G.Q. Zhang 3 1 Institute of Semiconductors, Chinese Academy of Sciences, Haidian, Beijing, China; State Key Laboratory of Solid-State Lighting, Haidian, Beijing, China 2 Lamar University, Beaumont, Texas, USA; State Key Laboratory of Solid-State Lighting, Haidian, Beijing, China 3 Institute of Semiconductors, Chinese Academy of Sciences, Haidian, Beijing, China; DIMES Center for SSL Technologies, Delft University of Technology, Delft, Netherlands

 

Session 18		15:40	Tuesday April 08 2014
Thermo-mechanics Chairman: Mario Gonzalez, IMEC; Frank Krämer, Saarland University
15:40	30mn	Keynote presentation – Understanding delamination for fast development of reliable packages for automotive applications Reinhard Pufall, Michael Goroll, Georg Michael Reuther, Infineon Technologies AG
16:10	20mn	Experimental Investigation and Interpretation of the real time, in situ Stress Measurement during Transfer Molding using the Piezoresistive Stress Chips Ali R. Rezaie Adli 1, K.M.B. Janses 1, Florian Schindler-Saefkow  2, Florian Rost  2 1 TU Delft, Delft, Netherlands 2 Fraunhofer ENAS, Berlin, Germany
16:30	20mn	Thermo-Mechanical Properties of Underfills at Partial and Full Filler Percolation – Sub-Layering the Underfill Gerd Schlottig 1, Marie Haupt 2, Severin Zimmermann 1, Jonas Zürcher 1, Thomas Brunschwiler 1 1 IBM Research GmbH, Switzerland 2 AMIC Angewandte Micro-Messtechnik GmbH, Germany
16:50	20mn	Failure Mechanisms in Chip-Metallization in Power Applications Durand Camille 1, Klingler Markus 2, Coutellier Daniel 3, Naceur Hakim 3 1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany and LAMIH UMR CNRS 8201, Valenciennes, France 2 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany 3 LAMIH UMR CNRS 8201, Valenciennes, France
17:10	20mn	Electronic Control Package Model Calibration using Moiré Interferometry Dae-Suk Kim 1, Bongtae Han 1, Arjun Yadur 2, Przemyslaw Jakub Gromala 3 1 Mechanical Engineering Department, University of Maryland, USA 2 Robert Bosch Engineering and Business Solutions Limited, Germany 3 Robert Bosch GmbH, Germany

 

Session 19		09:00	Wednesday April 09 2014
New Developments in Thermal Management, Failure and Reliability Modelling Chairman: Xuejun Fan, Lamar University; Artur Wymysłowski, WRUT
09:00	30mn	Keynote presentation – Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing Martin Springborn 1, Bernhard Wunderle 1, Daniel May 1, Raul Mrossko 2, Charles-Alix Manier 3, Hermann Oppermann 3, Mohamad Abo Ras 4, Radoslava Mitova 5 1 Chemnitz University of Technology, Chemnitz, Germany 2 AMIC GmbH, Berlin, Germany 3 Fraunhofer Institute Reliability and Microintegration, IZM, Berlin, Germany 4 Berliner Nanotest & Design GmbH, Berlin, Germany 5 Schneider Electric, Grenoble, France
09:30	30mn	Keynote presentation – GaN-based LEDs: state of the art and reliability-limiting mechanisms Enrico Zanoni 1, Matteo Meneghini 1, Nicola Trivellin 2, Matteo Dal Lago 1, Gaudenzio Meneghesso 1 1 University of Padova, Dept. of Information Engineering, Italy 2 University of Padova, Dept. of Information Engineering and LightCube srl, Italy
10:00	30mn	Keynote presentation – Analysis of RF-MEMS Switches in Failure Mode: Towards a More Robust Design Thomas Kuenzig 1, Tatek Muschol 1, Jacopo Iannacci 2, Gabriele Schrag 1, Gerhard Wachutka 1 1 Munich University of Technology (TUM), Munich, Germany 2 Fondazione Bruno Kessler (FBK), Trento, Italy
10:30	30mn	Keynote presentation – Numerical Simulation Aided Design of Stretchable Electronics LIU ZhuangJian, Institute of High Performance Computing, Singapore

 

Session 20		11:00	Wednesday April 09 2014
Experimental Investigations Chairman: Dietmar Vogel, Fraunhofer ENAS; Michael Edwards, Swerea IVF
11:00	30mn	Keynote presentation – Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling S. Pin 1, M. Sartor 2, L. Michel 2, J. Parain 3, S. Dareys 1 1 Centre National d’Etudes Spatiales,Toulouse, France 2 Institut Clément Ader, Toulouse, France 3 Thales Alenia Space,Toulouse, France
11:30	20mn	Challenges of viscoelastic characterization of low Tg epoxy based adhesives for Automotive Applications in DMA and relaxation experiments I. Maus 1, M. Niessner 2, H. Preu 1, K.M.B. Jansen 3, R. Pantou 4, B. Michel 5, B. Wunderle 4 1 Infineon Technologies AG, Regensburg, Germany 2 Infineon Technologies AG, Neubiberg, Germany 3 TU Delft, The Netherlands 4 Fraunhofer ENAS, Chemnitz, Germany; TU Chemnitz, Germany 5 Fraunhofer ENAS, Chemnitz, Germany
11:50	20mn	A Product Based Lap Shear Fatigue Testing of Electrically Conductive Adhesives Berkan Öztürk 1, Abdalla Youssef 1, Przemyslaw Gromala 1, Christian Silber 1, Kaspar Jansen 2, Leo Ernst 3 1 Robert Bosch GmbH, Germany 2 Delft University of Technology, The Netherlands 3 Ernst Consultant, The Netherlands
12:10	20mn	Evaluation of the Residual Stress Distribution in Thin Films by Means of the Ion Beam Layer Removal Method Darjan Kozic 1, Ruth Treml 2, Ronald Schöngrundner 1, Roland Brunner 1, Daniel Kiener 2, Thomas Antretter 3, Hans-Peter Gänser 1 1 Materials Center Leoben, Leoben, Austria 2 Department Materials Physics, Montanuniversität Leoben, Leoben, Austria 3 Institute of Mechanics, Montanuniversität Leoben, Leoben, Austria
12:30	20mn	An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions Emad A. Poshtan 1, Sven Rzepka 2, Bernd Michel 2, Christian Silber 1, Bernhard Wunderle 3 1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany 2 Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany 3 Chemnitz University of Technology, Chemnitz, Germany

 

Session 21		11:00	Wednesday April 09 2014
MEMS Switches, Mirrors and Energy Harvesting Chairman: Véronique Rochus, IMEC; Mike Röllig, Fraunhofer IKTS-MD
11:00	30mn	Keynote presentation – Finite Element Multi-physics Modeling for Ohmic contact of Microswitches Hong LIU 1, Dimitri LERAY 1, Patrick PONS 2, Stéphane COLIN 3 1 Institut Clément Ader, INSA, Univ de Toulouse; CNRS, LAAS, Univ de Toulouse, INSA, LAAS, Toulouse, France 2 CNRS, LAAS, Univ de Toulouse, INSA, LAAS, Toulouse, France 3 Institut Clément Ader, INSA, Univ de Toulouse, Toulouse, France
11:30	20mn	FEM simulation and measurement validation of a cMUT cell S.P. Mao 1, X. Rottenberg 1, V. Rochus 1, B. Nauwelaers 2, H.A.C. Tilmans 1 1 IMEC v.z.w., Kapeldreef 75, 3001 Heverlee, Belgium 2 Department of Electronic Engineering, Katholieke Universiteit Leuven, Leuven, Belgium
11:50	20mn	Numerical simulations of piezoelectric MEMS energy harvesters Giacomo Gafforelli 1, Raffaele Ardito 1, Alberto Corigliano 1, Carlo Valzasina  2, Francesco Procopio  2 1 Politecnico di Milano, Milano, Italy. 2 STMicroelectronics, Cornaredo (MI), Italy
12:10	20mn	Fluid Damping in Compliant, Comb-Actuated Torsional Micromirrors Ramin Mirzazadeh 1, Stefano Mariani 1, Aldo Ghisi 1, Marco De Fazio 2 1 Politecnico di Milano, Dipartimento di Ingegneria Civile e Ambientale, Milano, Italy 2 STMicroelectronics, Advanced System Technology, Agrate Brianza, Italy
12:30	20mn	Multiphysics modelling of the fabrication steps and operating conditions of a pellistor device Ferenc Biró 1, Zoltán Hajnal 2, Andrea Edit Pap 2, István Bársony 2 1 University of Pannonia, Egyetem u. 10, H-8200 Veszprém, Hungary 2 MEMS Laboratory, Institute of Technical Physics and Materials Science, Research Centre for Natural Sciences, Hungarian Academy of Sciences, Konkoly Thege Miklós út 29-33, H-1121 Budapest, Hungary

 

Compiled on Mon, 14 Apr 2014 17:15:40 +0200

End of programme