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EuroSimE 2013 was locally organised by Wroclaw University of Technology (Pr Artur Wymyslowski) in Haston City Hotel, on April 15-16-17th 2013 This 14th EuroSimE was attended by 140 individuals. 5 training courses were offered on Sunday. Proceedings of EuroSimE 2013 : CD-ROM full version: IEEE Catalog number CFP13566-CDR, ISBN 978-1-4673-6137-8
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This was the technical programme of EuroSimE 2013:
Go to Global conference schedule Technical program
| Day 1 – Monday Apr 15 2013 | |||
| 09:00 | Opening by Technical Committee Chair, W. van Driel, Philips Lighting | ||
| 09:05 | Welcome by local organiser, Prof. Artur Wymysłowski, Wroclaw University, Poland | ||
| 09:10 | Technology and application of heterostructure in micro- and opto-electronics Prof. Marek Tłaczała and Prof. Regina Paszkiewicz, Micro and Nano Technology Division, Wroclaw University | ||
| 09:40 | On trends, challenges and technologies in future microprocessor and systems integration Dr. Thomas Brunschwiler, IBM Switzerland | ||
| 10:10 | Thermal testing: measuring the real world, Dr. Andras Poppe, Product Manager, Mentor Graphics, Hungary | ||
| 10:40 | Break | ||
| 11:00 | S. 1 New Developments in Modeling | ||
| 12:40 | Lunch | ||
| 14:00 | S. 2 3D Interconnect Technology | S. 3 Manufacturing Process Modelling | S. 4 Thermal Behavior Modeling and Characterization |
| 15:50 | Break | ||
| 16:20 | S. 5 Chip-Package Interaction | S. 6 MEMS and NEMS Structures | S. 7 Photovoltaics |
| 17:30 | End of 1st day technical sessions | ||
| 18:00 | Departure by bus for dinner at Zamek Topacz castle | ||
| Day 2 – Tuesday Apr 16 2013 | |||
| 09:00 | S. 8 Reliability Modeling | S. 9 Molecular Dynamics | S. 10 Electrothermal Modeling and Characterization |
| 10:10 | Break | ||
| 10:40 | S. 11 Thermo-Mechanical Issues in Microelectronics | S. 12 Multi-Physics and Thermal Issues in Microelectronics | |
| 12:10 | Lunch | ||
| 13:30 | S. 13 Solder Modeling | S. 14 Multi-physics Modelling of MEMS Structures | S. 15 On Stresses, Strains and Strength |
| 15:00 | Break | ||
| 15:40 | S. 16 Thermo-Mechanical Modeling for Wirebonds Failures | S. 17 Multi-physics Models for Failure Analysis | S. 18 Interfaces and Adhesives |
| 17:30 | Exhibitor and Sponsor Session APT Electronics Ltd, Guo Wei Xiao – Philips, Willem van Driel – Robert Bosch, Michael Guyenot – Simulia, Witold Kakol – SKL, Cadmus Yuan |
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| 18:30 | Cocktail party at venue | ||
| 19:45 | EuroSimE Organisers and Technical Committees meeting | ||
| Day 3 – Wednesday Apr 17 2013 | |||
| 09:00 | S. 19 Advances in Modeling and Testing I | ||
| 10:30 | Break | ||
| 11:00 | S. 20 Experimental Investigations | S. 21 Solid State Lighting | |
| 12:50 | Lunch | ||
| 14:00 | S. 22 Advances in Modeling and Testing II | ||
| 15:30 | End of conference | ||
Go to Global conference schedule Technical program
| Session 1 | 11:00 | Monday Apr 15 2013 | |
| New Developments in Modeling Chairman: Leo J. Ernst, Consultant and Emeritus Professor of Delft University of Technology |
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| 11:00 | 30mn | Keynote presentation – Measuring techniques for deformation and stress analysis in micro-dimensions Corresponding Author: Dietmar Vogel – Fraunhofer ENAS Dietmar Vogel, Ellen Auerswald, Juergen Auersperg, Sven Rzepka, Bernd Michel, Fraunhofer ENAS |
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| 11:30 | 30mn | Keynote presentation – Enabling Technologies for System-Level Simulation of MEMS Corresponding Author: Tamara Bechtold – IMTEK – University of Freiburg Tamara Bechtold, Institute for Microsystems Engineering – IMTEK, Freiburg University, Germany Gabriele Schrag, Institute for Physics of Electrotechnology, Technische Universität München, Germany Lihong Feng, Max Planck Institute for Dynamics of Complex Technical Systems, Magdeburg, Germany |
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| 12:00 | 30mn | Keynote presentation – Design of SiGe Nano-Electromechanical Relay for Logic Application Corresponding Author: Véronique Rochus – Imec V. Rochus, M. Ramezani, S. Cosemans, S. Severi, A. Witvrouw, K. De Meyer, H.A.C. Tilmans, X. Rottenberg, imec, Leuven, Belgium |
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| Session 2 | 14:00 | Monday Apr 15 2013 | |
| 3D Interconnect Technology Chairman: Daoguo Yang, Dag Anderson |
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| 14:00 | 30mn | Keynote presentation – µ-Raman Spectroscopy and FE-Analysis of thermo-mechanical Stresses in TSV Periphery Corresponding Author: Peter Sättler – Technical University Dresden Peter Saettler 1, Mathias Boettcher 2, Klaus Juergen Wolter 1 1 Technical University Dresden 2 Fraunhofer IZM ASSID |
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| 14:30 | 20mn | Impact of Bosch Scallops Dimensions on Stress in Open Through Silicon Via Corresponding Author: Anderson Pires Singulani – Institute for Microelectronics, Technical University of Vienna Anderson Pires Singulani, Hajdin Ceric, Erasmus Langer, Technical University of Vienna, Vienna, Austria |
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| 14:50 | 20mn | Integration of a novel Through Silicon Via Concept in a microelectronic Pressure Sensor Corresponding Author: Yvonne Bergmann – Robert Bosch GmbH, Automotive Electronics Yvonne Bergmann, Jochen Reinmuth, Barbara Will, Mathias Hain, Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany |
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| 15:10 | 20mn | Simulation of Cu pumping during TSV fabrication Corresponding Author: Nabi Nabiollahi – IMEC Nabi Nabiollahi 1, Christopher J. Wilson 2, Joke De Messemaeker 2, Mario Gonzalez 2, Kristof Croes 2, Eric Beyne 2, Ingrid De Wolf 1 1 imec, Leuven, Belgium and Dept. of Metallurgy and Materials Engineering, KULeuven, Leuven, Belgium 2 imec, Leuven, Belgium |
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| 15:30 | 20mn | Reliability of Cu-plated through encapsulant vias (TEV) Corresponding Author: Jens Heilmann – Chemnitz University of Technology, Professorship for Materials and Reliability of Microsystems Jens Heilmann 1, Bernhard Wunderle 1, Sridhar Ganesh Kumar 1, Ole Hoelck 2, Hans Walter 2, Olaf Wittler 2, Gunter Engelmann 2, M. Jürgen Wolf 2, Gottfried Beer 3, Klaus Pressel 3 1 Chemnitz University of Technology 2 Fraunhofer IZM 3 Infineon Technologies |
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| Session 3 | 14:00 | Monday Apr 15 2013 | |
| Manufacturing Process Modelling Chairman: Alberto Corigliano, Sheng Liu |
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| 14:00 | 30mn | Keynote presentation – Numerical Modelling of the Electroplating Process for Microvia Fabrication Corresponding Author: Chris Bailey – University of Greenwich Nadia Strusevich 1, Chris Bailey 1, Suzanne Costello 2, Mayur Patel 1, Marc Desmulliez 2 1 School of Computing and Mathematical Sciences, University of Greenwich 2 MIcroSystems Engineering Cenre (MISEC), Heriot-Watt University, Edinburgh, UK |
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| 14:30 | 20mn | A MULTI-SCALE APPROACH TO WAFER TO WAFER METALLIC BONDING IN MEMS Corresponding Author: Aldo Ghisi – Dept. of Structural Engineering, Politecnico di Milano A. Ghisi 1, A. Corigliano 1, S. Mariani 1, G. Allegato 2 1 Dept. of Civil and Environmental Engineering, Politecnico di Milano, Italy 2 STMicroelectronics, AMS – MEMS Technology Development, Agrate Brianza (MI), Italy |
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| 14:50 | 20mn | Multi-Physics Simulation of the Component Attachment within Embedding Process Corresponding Author: Katerina Macurova – Materials Center Leoben Forschung GmbH Katerina Macurova 1, Abdellah Kharicha 2, Martin Pletz 1, Marianne Mataln 1, Raul Bermejo 3, Ronald Schöngrundner 1, Thomas Krivec 4, Thomas Antretter 5, Wilson Maia 6, Mike Morianz 4, Michel Brizoux 6 1 Materials Center Leoben Forschung GmbH, Leoben, Austria 2 Modellierung und Simulation Metallurgischer Prozesse – Montanuniversitaet Leoben, Austria 3 Institut für Struktur- und Funktionskeramik – Montanuniversität Leoben, Austria 4 AT&S AG, Leoben, Austria 5 Institut für Mechanik – Montanuniversitaet Leoben, Austria 6 Thales Global Services, Meudon-la-Forêt, France |
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| 15:10 | 20mn | The fracture studies of polycrystalline silicon based MEMS Corresponding Author: Ludovic NOELS – University of Liège Shantanu S. Mulay 1, Gauthier Becker 1, Renaud Vayrette 2, Jean-Pierre Raskin 2, Thomas Pardoen 2, Montserrat Galceran 3, Stéphane Godet 4, Ludovic Noels 1 1 University of Liege, Liège, Belgium 2 Université catholique de Louvain, Louvain-la-Neuve, Belgium 3 Université Libre de Bruxelles, Brussels, Belgium, and CIC Energigune, Miñano (Álava), Spain 4 Université Libre de Bruxelles, Brussels, Belgium |
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| 15:30 | 20mn | Simulations of Thermal and Mechanical Properties of AlN, Si3N4 and SiC Corresponding Author: Dorothea Winkler – Julius Maximilian University of Würzburg D.E.R. Winkler 1, T. Müller 2, T.E.M. Staab 1, F. Raether 3 1 Chair for Chemical Technology of Advanced Materials, University of Würzburg, Würzburg, Germany 2 Center for High Temperature Materials and Design, Fraunhofer ISC, Würzburg, Germany 3 Center for High Temperature Materials and Design, Fraunhofer ISC, Bayreuth, Germany |
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| Session 4 | 14:00 | Monday Apr 15 2013 | |
| Thermal Behavior Modeling and Characterization Chairman: Andras Poppe, Peter Rodgers |
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| 14:00 | 30mn | Keynote presentation – Thermal evaluation of a liquid/air cooled integrated power inverter for hybrid vehicle applications Corresponding Author: Ilja Belov – School of Engineering, Jönköping University Yafan Zhang 1, Ilja Belov 2, Niklas G. Sarius 3, Mietek Bakowski 1, Hans-Peter Nee 4, Peter Leisner 3 1 Acreo Swedish ICT AB, Kista, Sweden 2 School of Engineering, Jönköping University, Jönköping, Sweden 3 SP Technical Research Institute of Sweden, Borås, Sweden 4 KTH School of Electrical Engineering, Stockholm, Sweden |
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| 14:30 | 20mn | Protection Power device performance investigation using TCAD simulations Corresponding Author: Fabrice ROQUETA – STMicroelectronics ROQUETA Fabrice, TAHRI Karim, STMicroelectronics, Tours, France |
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| 14:50 | 20mn | Wafer test probe burn modeling and characterization Corresponding Author: Baha Zafer – Istanbul University Baha Zafer 1, Mehdi H. Vishkasougheh 2, Bahadır Tunaboylu 2 1 İstanbul University – Dept. of Mechanical Engineering 2 İstanbul Şehir University – Dept. of Industrial Engineering |
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| 15:10 | 20mn | Account of the package features in modelling of thermal microsensors Corresponding Author: Alexander Kozlov – Omsk State University A. G. Kozlov, Omsk State University, Omsk, Russian Federation D. Randjelovic, IHTM – Institute of Microelectronic Technology and Single Crystals, University of Belgrade, Belgrade, Serbia |
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| 15:30 | 20mn | A novel methodology for thermal characterization of power package in high current application Corresponding Author: ByoungOk, Lee – Fairchild KOREA Semiconductor, Package Development Group ByoungOk.Lee, ARom.Moon, JoonSeo.Son, JiHwan Kim, Package Dev. Group, Fairchild KOREA Semiconductor, Korea |
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| Session 5 | 16:20 | Monday Apr 15 2013 | |
| Chip-Package Interaction Chairman: Dietmar Vogel, Frank Krämer |
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| 16:20 | 30mn | Keynote presentation – IC-Package Interaction Corresponding Author: Bart Vandevelde – IMEC Bart Vandevelde, Andrej Ivankovic, Bjorn Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Mario Gonzalez, Geert Vanderplas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei, imec |
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| 16:50 | 20mn | Non-conforming Meshes in Multi-scale Thermo-mechanical Finite Element Analysis of Semiconductor Power Devices Corresponding Author: Sebastian Eiser – Kompetenzzentrum Automobil- und Industrielektronik (KAI) Sebastian Eiser, Kompetenzzentrum Automobil- und Industrielektronik (KAI), Villach, Austria Manfred Kaltenbacher, Technische Universität Wien, Vienna, Austria Michael Nelhiebel, Infineon Technologies Austria AG, Villach, Austria |
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| 17:10 | 20mn | Finite element analysis of fatigue cracks formation in power metallization of a semiconductor device subjected to active cycling Corresponding Author: Grygoriy Kravchenko – Vienna Univ. of Technology, Institute for Lightweight Design and Structural Biomechanics Grygoriy Kravchenko 1, Balamurugan Karunamurthy 2, Michael Nelhiebel 3, Heinz E. Pettermann 1 1 Vienna University of Technology, Institute for Lightweight Design and Structural Biomechanics, Vienna, Austria 2 KAI – Kompetenzzentrum Automobil- u. Industrieelektronik GmbH, Villach, Austria 3 Infineon Technologies Austria AG, Villach, Austria; KAI – Kompetenzzentrum Automobil- u. Industrieelektronik GmbH, Villach, Austria |
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| Session 6 | 16:20 | Monday Apr 15 2013 | |
| MEMS and NEMS Structures Chairman: Cadmus Yuan, Chris Bailey |
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| 16:20 | 30mn | Keynote presentation – Estimation of deflections by interferometry in a cantilever array and its optimization based on a two-scale model Corresponding Author: Michel LENCZNER – FEMTO-ST Hui HUI 1, Michel LENCZNER 1, Scott COGAN 1, André MEISTER 2, Mélanie FAVRE 2, Thomas OVERSTOLZ 2, Raphaël COUTURIER 1, Stéphane DOMAS 1 1 FEMTO-ST, France 2 CSEM, Switzerland |
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| 16:50 | 20mn | Reliability Assessment of a MEMS Microphone under Shock Impact Loading Corresponding Author: Jue Li – Aalto University School of Electrical Engineering Jue Li 1, Joonas Makkonen 1, Mikael Broas 1, Jussi Hokka 1, Toni T. Mattila 1, Mervi Paulasto-Kröckel 1, Jingshi Meng 2, Abhijit Dasgupta 2 1 Aalto University School of Electrical Engineering, Espoo, Finland 2 University of Maryland, College Park, MD, USA |
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| 17:10 | 20mn | A Multiscale Model Derivation and Simulation Tool for MEMS Arrays Corresponding Author: Michel Lenczner – FEMTO-ST Bin YANG, FEMTO-ST, Département Temps-Fréquence, University of Franche-Comté, France Walid BELKHIR, INRIA Nancy – Grand Est, CASSIS project, France Michel LENCZNER, FEMTO-ST, Département Temps-Fréquence, University of Technology at Belfort-Montbéliard, France Nicolas RATIER, FEMTO-ST, Département Temps-Fréquence, Ecole Nationale Supérieure de Mécanique et de Microtechniques, France |
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| Session 7 | 16:20 | Monday Apr 15 2013 | |
| Photovoltaics Chairman: Mike Röllig, Marcus Schulz |
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| 16:20 | 20mn | FEM Simulations of Back Contact Solar Modules during Temperature Cycling Corresponding Author: Steffen Wiese – Saarland University Frank Kraemer, Steffen Wiese, University of Saarland, Saarbrucken, Germany |
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| 16:40 | 20mn | Analysis and Simulation of cracks and micro cracks in PV Cells Corresponding Author: Joseph Al Ahmar – Saarland University Joseph Al Ahmar, Steffen Wiese, University of Saarland, Saarbrucken, Germany |
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| Session 8 | 09:00 | Tuesday Apr 16 2013 | |
| Reliability Modeling Chairman: Bart Vandevelde, Sau Koh |
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| 09:00 | 30mn | Keynote presentation – Novel Reliability Assessment Concept based on accelerated de-rated Strength Approach Corresponding Author: Erik Veninga – TNO Technical Sciences E.P. Veninga, R. Kregting, A. van der Waal, A.W.J. Gielen, TNO Technical Sciences, The Netherlands |
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| 09:30 | 20mn | Reliability Analysis of Next Generation Wafer Level Chip Scale Package Corresponding Author: Yong Liu – Fairchild Semiconductor Qiuxiao Qian, Yong Liu, Fairchild Semiconductor, USA |
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| 09:50 | 20mn | Reliability investigation of System in Package devices toward aeronautic requirements: Methodology and application Corresponding Author: Antoine RENAULT – EADS Innovation Works Antoine RENAULT, Florian MOLIERE, Catherine MUNIER, EADS Innovation Works, Suresnes, France |
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| Session 9 | 09:00 | Tuesday Apr 16 2013 | |
| Molecular Dynamics Chairman: Jianmin Qu, Ingrid Maus |
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| 09:00 | 30mn | Keynote presentation – Moisture transport and swelling stresses at Moulding-Compound substrate inter-faces investigated by Molecular Modeling and Finite Element Simulations Corresponding Author: Ole Hölck – Fraunhofer IZM O. Hölck 1, J. Bauer 1, T. Braun 1, H. Walter 1, O. Wittler 1, B. Wunderle 2, K.-D. Lang 3 1 Fraunhofer IZM, Berlin, Germany 2 Chemnitz University of Technology, Chemnitz, Germany 3 Technische Universität Berlin, Berlin, Germany |
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| 09:30 | 20mn | Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface (Part IV): The effect of Filler Corresponding Author: Nancy Iwamoto – Honeywell Performance Materials and Technologies Nancy Iwamoto, Honeywell PMT, USA |
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| 09:50 | 20mn | Application of molecular modelling for analysis of a surface energy and its comparison with the experimental results based on wetting angle measurement Corresponding Author: Dawid Krol – Wroclaw University of Technology Dawid Król, Artur Wymysłowski, Irena Zubel, Krzysztof Rola, Wroclaw University of Technology, Faculty of Microsystems Electronics and Photonics, Wrocław, Poland |
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| Session 10 | 09:00 | Tuesday Apr 16 2013 | |
| Electrothermal Modeling and Characterization Chairman: Tamara Bechtold, Ilja Belov |
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| 09:00 | 30mn | Keynote presentation – Electro-thermal modelling to quantify the electro-thermal impact of the solder joint delamination on power device assemblies Corresponding Author: Emmanuel MARCAULT – LAAS-CNRS T. Azoui 1, E. Marcault 1, P. Tounsi 1, J.L. Massol 1, J.M. Dorkel 1, Ph. Dupuy 2 1 LAAS-CNRS, France 2 Freescale Seminconductors, France |
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| 09:30 | 20mn | Impact of circuit load on the ageing mode of VDMOS chips using 3D FEM Electro-thermal modelling Corresponding Author: Emmanuel MARCAULT – LAAS-CNRS E. Marcault, J.L. Massol, P. Tounsi, J.M. Dorkel, LAAS-CNRS, France |
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| 09:50 | 20mn | Fast and Accurate Electro-Thermal Analysis of Three-Dimensional Power Delivery Networks Corresponding Author: Aida Todri-Sanial – CNRS-LIRMM Aida Todri-Sanial 1, Alberto Bosio 2, Luigi Dilillo 1, Patrick Girard 1, Arnaud Virazel 2 1 CNRS-LIRMM, France 2 LIRMM, France |
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| Session 11 | 10:40 | Tuesday Apr 16 2013 | |
| Thermo-Mechanical Issues in Microelectronics Chairman: Kaspar Jansen |
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| Temperature effect on tribological and mechanical properties of MEMS Corresponding Author: Marius Pustan – Technical University of Cluj-Napoca Marius Pustan, Corina Birleanu, Cristian Dudescu, Ovidiu Belcin, Technical University of Cluj-Napoca, Romania |
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| Confrontation of Failure Mechanisms Observed during Active Power Cycling Tests with Finite Element Analyze Performed on a MOSFET Power Module Corresponding Author: Durand Camille Jeanne Margot – Robert Bosch GmbH C. Durand 1, M. Klingler 1, D. Coutellier 2, H. Naceur 2 1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany 2 LAMIH UMR CNRS 8201, PRES Lille Nord de France, University of Valenciennes, France |
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| LED design improvement by means of virtual assembly process based on FEM simulation Corresponding Author: Watzke,Stefan ; Altieri-Weimar,Paola – Osram Opto Semiconductors GmbH Stefan Watzke, Paola Altieri-Weimar, Osram Opto Semiconductors, Germany |
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| Simulation of stress concentrations in wire-bonds using a novel strain gradient theory Corresponding Author: Martin Lederer – University of Vienna M. Lederer 1, B. Czerny 1, B. Nagl 2, A. Trnka 2, G. Khatibi 1, M. Thoben 3 1 University of Vienna 2 Siemens AG 3 Infineon Technologies |
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| Dealing with IC Package Material and Design Uncertainties using FUZZY Finite Elements Corresponding Author: Bart Vandevelde – imec B. Vandevelde 1, I. Konstantinou 2, D. Moens 2, D. Vandepitte 2 1 imec 2 KULeuven |
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| Evaluation of Embedded IC Approach for Automotive Application Corresponding Author: Robert Schwerz – TU Dresden – Electronics Packaging Laboratory Robert Schwerz 1, Karsten Meier 2, Mike Roellig 1, Angelika Schingale 3, Andreas Schiessl 3, Klaus-Juergen Wolter 2, Norbert Meyendorf 4 1 Fraunhofer Institute for Non-Destructive Testing, Dresden Branch (lZFP-D) 2 Electronics Packaging Laboratory (IAVT), Technische Universität Dresden 3 Continental Automotive GmbH, Regensburg 4 Fraunhofer Institute for Non-Destructive Testing, Dresden Branch |
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| Novel Quick Predict Approach for Identification of Critical Loadings in Electronic Components on PCB under Vibration Realized as a Design Support Tool Corresponding Author: Dr. Mike Roellig – Fraunhoferinstitute for Non Destructive Testing Mike Roellig 1, René Metasch 1, Angeilka Schingale 2, Andreas Schießl 2, Karsten Meier 3, Norbert Meyendorf 1 1 Fraunhofer Institute for Non-Destructive Testing, Dresden, IZFP-D 2 Continental Automotive GmbH, Regensburg 3 Dresden University of Technology, Electronics Packaging Laboratory (IAVT) |
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| 3D modeling of flip chip assemblies with large array and small pitch Corresponding Author: Manuel FENDLER – CEA LETI Wiyao KPOBIE 1, Napo BONFOH 2, Cynthia DREISTADT 2, Manuel FENDLER 3, Paul LIPINSKI 2 1 CEA Grenoble, LETI, MINATEC Campus, DOPT, France & Laboratoire de mécanique Biomécanique Polymères Structures (LaBPS) – EA 4632 Ecole Nationale d’Ingénieurs de Metz (ENIM) 2 Laboratoire de mécanique Biomécanique Polymères Structures (LaBPS) – EA 4632 Ecole Nationale d’Ingénieurs de Metz (ENIM), France 3 CEA Grenoble, LETI, MINATEC Campus, DOPT, France |
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| Low-Power Smart Sensor for Laminar and Turbulent Flow Detection in Avionics Application Corresponding Author: Ryszard Świerczyński – Wroclaw University of Technology Ryszard Świerczyński, Krzysztof Urbański, Artur Wymysłowski, Krystian Jankowski, Wroclaw University of Technology, Wroclaw, Poland |
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| The Evaluation of Flowability and Wire Sweep by Epoxy Molding Compound for Power Module Packages Using MoldflowTM Corresponding Author: Taekkeun Lee – Fairchild Korea, Package Development Group Taekkeun Lee, Aimee Lim, Youngsun Ko, Taewoo Lee, Byoungok Lee, Fairchild, Korea |
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| Lifetime Assessment for Bipolar Components under Vibration and Temperature Loading Corresponding Author: Karsten Meier – Technische Universität Dresden Karsten Meier 1, Mike Roellig 2, Georg Lautenschlaeger 2, Andreas Schiessl 3, Klaus-Juergen Wolter 1 1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany 2 Fraunhofer Institute for Nondestructive Testing IZFP-D, Dresden, Germany 3 Continental Automotive GmbH, Regensburg, Germany |
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| Application of simulation of plastics in the development of power modules Corresponding Author: Tatyana Kashko – Infineon Technologies AG Tatyana Kashko, Mark Essert, Infineon Technologies AG |
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| VACNT fabrication on aluminum using “fast-heating” thermal CVD Corresponding Author: Zhaoli Gao – The Hong Kong University of Science and Technology Zhaoli GAO, Matthew M.F. YUEN, The Hong Kong University of Science and Technology |
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| Transient thermal response as failure analytical tool – a comparison of different techniques Corresponding Author: Daniel May – TU Chemnitz D.May 1, B. Wunderle 1, R. Schacht 2, B. Michel 3 1 Technical University Chemnitz 2 University of Applied Sciences Lausitz 3 Fraunhofer ENAS |
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| Investigation of the Failure Mode Formation in BGA Components Subjected to JEDEC Drop Test Corresponding Author: Frank Kraemer – Saarland University Frank Kraemer 1, Steffen Wiese 1, Sven Rzepka 2, Jens Lienig 3 1 Saarland University 2 Fraunhofer Institue for Electronic Nano Systems 3 Dresden University of Technology |
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| Low Cycle Fatigue Measurement Results on Real Flip Chip Solder Contacts for Precise Life Time Prediction Corresponding Author: René Metasch – Fraunhofer Institute for Non-Destructive Testing R. Metasch 1, M. Roellig 1, A. Roehsler 2, C. Boehm 2, K.-J. Wolter 3 1 Fraunhofer Institute for Non-Destructive Testing 2 Technische Universität Bergakademie Freiberg 3 Technische Universität Dresden |
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| Mechanical Behavior of Flexible Silicon Devices Curved in Spherical Configurations Corresponding Author: Kevin Tekaya – CEA Laboratoire Packaging et Assemblages Tekaya, K. 1, Fendler, M. 1, Inal, K. 2, Massoni, E. 2, Ribot, H. 1 1 CEA, LETI, Minatec Campus GRENOBLE France 2 Center for Material Forming, CEMEF UMR CNRS 7635 – Mines ParisTech |
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| Reliability modeling analysis of a power module Corresponding Author: Yong Liu – Fairchild Semiconductor Yan Liu 1, YangJian Xu 1, Yong Liu 2 1 Zhejiang University of Technology, Hangzhou, China 2 Fairchild Semiconductor, South Portland, USA |
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| Strength analysis of advanced node BEOL under CPI induced stresses Corresponding Author: Bjorn Debecker – IMEC Bjorn Debecker, Kris Vanstreels, Mario Gonzalez, Bart Vandevelde, Zsolt Tokei, Imec, Leuven, Belgium |
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| Low Temperature Hybrid Wafer Bonding for 3D Integration Corresponding Author: Andrei A. Damian – Laboratory of ECTM, DIMES, Delft University of Technology A.A. Damian 1, R.H. Poelma 1, H.W. van Zeijl 1, G.Q. Zhang 2 1 Laboratory of ECTM, DIMES, Delft University of Technology 2 Laboratory of ECTM, DIMES, Delft University of Technology, Philips Lighting, Eindhoven, The Netherlands |
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| Investigation of Interface Delamination of EMC-Copper Interfaces in Molded Electronic packages Corresponding Author: Arjun Yadur – Robert Bosch GmbH Arjun Yadur 1, P. Gromala 2, S. Green 2, K. Mat daud 3 1 Robert Bosch Engineering and Business Solutions Limited (RBEI), Bangalore, India 2 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany 3 Hochschule Osnabrück, Germany |
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| Session 12 | 10:40 | Tuesday Apr 16 2013 | |
| Multi-Physics and Thermal Issues in Microelectronics Chairman: Kaspar Jansen |
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| Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens Corresponding Author: Jeffery C. C. Lo – Center for Advanced Microsystems Packaging / HKUST Jeffery C. C. LO 1, Huihua LIU 1, S. W. Ricky LEE 1, Xungao GUO 2, Huishan ZHAO 2 1 Hong Kong University of Science & Technology 2 HKUST LED-FPD Technology R&D Center at Foshan |
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| Influence of contact geometry variations on the life time distribution of IC packages during electromigration testing Corresponding Author: Lutz Meinshausen – Universtite Bordeaux 1 IMS Lutz Meinshausen 1, PD. Dr.-Ing. Kirsten Weide-Zaage 1, MdC HDR Dr. Hélène Frémont 2 1 LFI, Leibniz Universität Hannover, Hanover, Germany 2 IMS, Université Bordeaux 1, Bordeaux, France |
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| Characterization of a new designed octahedron slotted metal track by simulations Corresponding Author: Jörg Kludt – Information Technology Laboratory, Universität Hannover Jörg Kludt 1, Kirsten Weide-Zaage 1, Markus Ackermann 2, Verena Hein 2 1 Information Technology Laboratory, Leibniz Universität Hannover 2 X-FAB Semiconductor Foundries AG |
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| Resistance Electric Filed Dependence Simulation of Piezoresistive Silicon Pressure Sensor and Improvement by Shield Layer Corresponding Author: Sheng Liu – Huazhong University of Science and Technology Gang Cao, Chaojun Liu, Xiaogang Liu, Sheng Liu, Institute of Microsystems, State Key Laboratory for Digital Manufacturing Equipment & Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China |
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| A cost effective AFM setup, combining interferomtery and FPGA Corresponding Author: stéphane Domas – Université de Franche-Comté, laboratoire FEMTO-ST, dpt. DISC Raphaël Couturier 1, Stéphane Domas 1, Michel Lenczner 2, Gwenhaël Goavec-Merou 2, André Meister 3, Mélanie Favre 3 1 University of Franche-Comté, Belfort, France 2 University of Franche-Comté, Besançon, France 3 CSEM, Neuchatel, Switzerland |
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| Piezoresistive force sensor as an application to nanosystems manipulation: design, simulations, technology and experiments Corresponding Author: Gianina Schondelmaier – Technical University Chemnitz, Faculty for Electrical Engineering and Information Technologies, Dept. Materials and Reliability Gianina Schondelmaier 1, Steffen Hartmann 1, Daniel May 1, Alexey Shaporin 2, Sebastian Voigt 2, R.D. Rodriguez 3, O.D.Gordan 3, D.R.T. Zahn 3, Jan Mehner 2, Karla Hiller 4, Bernhard Wunderle 1 1 Technical University Chemnitz, Faculty for Electrical Engineering and Information Technologies, Dept. Materials and Reliability of Microsystems, Germany 2 Technical University Chemnitz, Faculty for Electrical Engineering and Information Technologies, Dept. Microsystems and Precision Engineering, Germany 3 Technical University Chemnitz, Faculty of Natural Science, Dept. Semiconductor Physics, Germany 4 Technical University Chemnitz, Center for Microtechnologies ZfM, Germany |
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| Study on Thermal Conductivity of Boron Nitride in Hexagonal Structure in Atomistic Scale by Using Non-Equilibrium Molecular Dynamics Technique Corresponding Author: Bartosz Platek – Wroclaw Univesity of Technology Bartosz Platek, Tomasz Falat, Jan Felba, Wroclaw University of Technology |
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| A model for color prediction of LED packages Corresponding Author: Cell K Y WONG – State Key Laboratory of Solid State Lighting Changzhou, China C.K.Y. Wong 1, L Zhong 1, YQ Qin 1, Cadmus C.A. Yuan 2, Guoqi Zhang 3 1 State Key Laboratory of Solid State Lighting (Changzhou Base) 2 2 Research and Development Center for Semiconductor Lighting, Institute of Semiconductors, Chinese Academy of Sciences 3 Philips Lighting |
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| A Novel Hybrid Method for Reliability Prediction of High-Power LED Luminaires Corresponding Author: Daoguo Yang – Guilin University of Electronic Technology M. Cai 1, K. M. Tian 1, W. B. Chen 1, H. Huang 1, H. Y. Tang 1, L.L. Liang 1, D. G. Yang 1, Xuejun Fan 2, G. Q. Zhang 3 1 Guilin University of Electronic Technology, China 2 Lamar University, USA 3 Delft University of Technology, The Netherlands |
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| Investigation of temperature gradients with regard to thermomigration in Aluminium metallizations Corresponding Author: Jörg Kludt – Information Technology Laboratory, Leibniz Universität Hannover Jörg Kludt 1, Kirsten Weide-Zaage 1, Markus Ackermann 2, Verena Hein 2 1 Information Technology Laboratory, Leibniz Universität Hannover 2 X-FAB Semiconductor Foundries AG |
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| Protection of Printed Circuit Board´s structure in Microwave process Corresponding Author: Trinh Dung Bui – Institute of Electronic Appliances and Circuits, University of Rostock Trinh Dung Bui, Felix Bremerkamp, Mathias Nowottnick, Dirk Seehase, Institute of Electronic Appliances and Circuits, Department „Reliability and Safety of Electronic Systems“ , University of Rostock, Germany |
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| Triangular RF MEMS switched air gap capacitor using imec’s SiGe-MEMS platform Corresponding Author: Mohammed Bedier – Imec M. Bedier 1, X. Rottenberg 2, V. Rochus 2, R. AbdelRassoul 3, H.A.C. Tilmans 2 1 KACST-Intel Consortium Center of Excellence in Nano-manufacturing Applications, Riyadh, Saudi Arabia 2 imec, Leuven, Belgium 3 Arab Academy for Science and Technology, Alexandria, Egypt |
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| Thermo-Mechanical Modelling and Design of SiGe-based Thermo-Electric Modules for High Temperature Applications Corresponding Author: Michael Edwards, Klas Brinkfeldt – Swerea IVF AB Michael Edwards, Klas Brinkfeldt, Swerea IVF, Sweden |
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| Accelerated Lifetime Test for Isolated Components in Linear Drivers of High-Voltage LED System Corresponding Author: Bo Sun – Beijing Research Center, Delft University of Technology Bo Sun 1, Sau Wee Koh 1, Cadmus Yuan 2, Xuejun Fan 3, Guoqi Zhang 4 1 Beijing Research Center, Delft University of Technology 2 State Key Laboratory of Solid-State Lighting 3 Lamar University 4 Delft University of Technology |
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| Comparative Analysis of the Thermal Resistance Profiles of Power Light-Emitting Diodes Cree and Rebel Types Corresponding Author: Kononenko Valerii K. – BNTU A.L. Zakgeim 1, A.E. Chernyakov 1, A.S. Vaskou 2, V.K. Kononenko 2, V.S. Niss 2 1 Submicron Heterostructures for Microelectronics Research & Engineering Center, RAS 2 Belarusian National Technical University |
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| Session 13 | 13:30 | Tuesday Apr 16 2013 | |
| Solder Modeling Chairman: Bernhard Wunderle, Sima Tarashioon |
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| 13:30 | 30mn | Keynote presentation – Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys Corresponding Author: Jürgen Eckermann – Swansea University J. Eckermann 1, S. Mehmood 1, H.M. Davies 1, N.P. Lavery 1, S.G.R. Brown 1, J. Sienz 1, A. Jones 2, P. Sommerfeld 2 1 Advanced Sustainable Manufacturing Technology (ASTUTE), College of Engineering, Swansea University, Swansea, United Kingdom 2 Electronic Motion Systems Ltd., Swansea, United Kingdom |
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| 14:00 | 20mn | Multiscale Creep modeling of the Effect of Micro-alloying Mn and Sb into SAC105 Solder Corresponding Author: Subhasis Mukherjee – University of Maryland, College Park Subhasis Mukherjee, Abhijit Dasgupta, CALCE, University of Maryland, College Park, Maryland, USA |
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| 14:20 | 20mn | Finite Element Based Design of a New Dogbone Specimen for Low Cycle Fatigue Testing of Highly Filled Epoxy-Based Adhesives for Automotive Applications Corresponding Author: Berkan Öztürk – Robert Bosch GmbH Berkan Ozturk 1, Przemyslaw Gromala 1, Christian Silber 1, Kaspar Jansen 2, Leo Ernst 3 1 Robert Bosch GmbH, Reutlingen, Germany 2 Delft University of Technology, Delft, The Netherlands 3 Emeritus Professor of Delft University of Technology, Schoonhoven, The Netherlands |
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| 14:40 | 20mn | Vibration Durability of Board Mounted BallGridArrays Corresponding Author: Torsten Hauck and Ilko Schmadlak – Freescale Semiconductor Torsten Hauck, Ilko Schmadlak, Freescale Halbleiter Deutschland GmbH |
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| Session 14 | 13:30 | Tuesday Apr 16 2013 | |
| Multi-physics Modelling of MEMS Structures Chairman: Nancy Iwamoto |
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| 13:30 | 30mn | Keynote presentation – Optimal design of a resonating MEMS magnetometer: a multi-physics approach Corresponding Author: Alberto Corigliano – Politecnico di Milano Alberto Corigliano 1, Mehrdad Bagherinia 1, Matteo Bruggi 1, Stefano Mariani 1, Ernesto Lasalandra 2 1 Politecnico di Milano, Italy 2 STMicroelectronics, Italy |
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| 14:00 | 20mn | Novel Teeter-Totter 2-Axes MEMS Magnetometer with Equal sensitivities Corresponding Author: Mahmoud Farghaly – Imec M. A. Farghaly 1, V. Rochus 1, X. Rottenberg 1, U. S. Mohammed 2, H. A. C. Tilmans 1 1 Imec, Leuven, Belgium 2 Assuit University, Assuit, Egypt |
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| 14:20 | 20mn | Investigation into Modelling Power Output for MEMS Energy Harvesting Devices using COMSOL Multiphysics Corresponding Author: Reinhard Pufall – Infineon Technologies AG Rosemary O’Keeffe, 1, Nathan Jackson 1, Finbarr Waldron 1, Mike O’Neill, 2, Kevin McCarthy 3, Alan Mathewson 1 1 Tyndall National Institute, University College Cork, Dyke Parade, Cork, Ireland 2 Analog Devices Inc., Limerick, Ireland 3 Department of Electrical and Electronic Engineering, University College Cork, College Rd., Cork, Ireland |
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| 14:40 | 20mn | Influence of nonlinear intermolecular forces on the harmonic behavior of NEM resonators Corresponding Author: Mohamed Zanaty – Imec M. Zanaty 1, R. Jansen 1, V. Rochus 1, M. Abbas 2, A. Witvrouw 1, H.A.C. Tilmans 1, X. Rottenberg 1 1 imec, Leuven, Belgium 2 Department of Electrical Engineering, Assiut University, Egypt |
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| Session 15 | 13:30 | Tuesday Apr 16 2013 | |
| On Stresses, Strains and Strength Chairman: Öle Hölck, Yong Liu |
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| 13:30 | 30mn | Keynote presentation – Reliability Issues for High Temperature Interconnections Based on Transient Liquid Phase Soldering Corresponding Author: Rainer Dudek – Fraunhofer ENAS Rainer Dudek 1, Peter Sommer 1, Andreas Fix 2, Sven Rzepka 1, Bernd Michel 1 1 Fraunhofer ENAS, Micro Materials Center Chemnitz 2 Robert Bosch GmbH, CR/APJ3, Stuttgart |
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| 14:00 | 20mn | Stress Impact of Moisture Diffusion measured with the stress chip Corresponding Author: Florian Schindler-Saefkow – Fraunhofer ENAS F. Schindler-Saefkow 1, F. Rost 1, A. Otto 1, R. Pantou 1, R. Mroßko 2, B. Wunderle 3, B. Michel 1, S. Rzepka 1, J. Keller 2 1 Fraunhofer ENAS, Micro Materials Center, Chemnitz 2 AMIC Angewandte Micro-Messtechnik GmbH, Berlin 3 Technische Universität Chemnitz |
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| 14:20 | 20mn | Investigation of Stress States in Silicon Dies Induced by the Low Temperature Joining Technology Corresponding Author: Thomas Herboth – Robert Bosch GmbH Thomas Herboth 1, Michael Guenther 1, Roderich Zeiser 2, Juergen Wilde 2 1 Robert Bosch GmbH 2 IMTEK |
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| 14:40 | 20mn | Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique Corresponding Author: Krystian Jankowski – Wroclaw University of Technology Krystian Jankowski 1, Ryszard Swierczynski 1, Krzysztof Urbanski 1, Artur Wymyslowski 1, Didier Chicot 2, Rainer Dudek 3 1 Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland 2 University Lille Nord of France, USTL, LML, CNRS, UMR 8107, Villeneuve d’Ascq, France 3 Fraunhofer-Institut fur Elektronische Nanosysteme Technologie-Campus 3, Chemnitz, Germany |
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| Session 16 | 15:40 | Tuesday Apr 16 2013 | |
| Thermo-Mechanical Modeling for Wirebonds Failures Chairman: Rainer Dudek, Artur Wymyslowski |
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| 15:40 | 30mn | Keynote presentation – Simulation of an Aluminum Thick Wire Bond Fatigue Crack by Means of the Cohesive Zone Method Corresponding Author: Arian Grams – Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM Arian Grams 1, Tobias Prewitz 1, Olaf Wittler 1, Johannes Kripfgans 1, Stefan Schmitz 1, Andreas Middendorf 1, Wolfgang H. Müller 2, Klaus-Dieter Lang 2 1 Fraunhofer IZM, Berlin, Germany 2 Technische Universität Berlin, Berlin, Germany |
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| 16:10 | 20mn | Deformation Analysis of Wire Bonding on soft Polymers Corresponding Author: Frank Kraemer – Saarland University Frank Kraemer, Philipp Ritter, Steffen Wiese, Michael Moller, Saarland University |
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| 16:30 | 20mn | On the thermo-mechanical modelling of a ball bonding process with ultrasonic softening Corresponding Author: Alan Wright – Fraunhofer Institute for Integrated Systems and Device Technology IISB Alan Wright 1, Stephane Koffel 1, Peter Pichler 2, Hubert Enichlmair 3, Rainer Minixhofer 3, Ewald Wachmann 3 1 Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany 2 Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany. Chair of Electron Devices, University of Erlangen-Nuremberg, Erlangen, Germany 3 ams AG, Unterpremstätten, Austria |
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| 16:50 | 20mn | Bonding Wire Life Prediction Model of the Power Module under Power Cycling Test Corresponding Author: Kuo-Ning Chiang – Department of Power Mechanical Engineering, National Tsing Hua University Tuan-Yu Hung 1, Chin-Chun Wang 2, Kuo-Ning Chiang 1 1 Dept. of Power Mechanical Engineering National Tsing Hua University, HsinChu 300, Taiwan, R.O.C. 2 DELTA Electronics, INC., Taoyuan 333, Taiwan, R.O.C. |
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| 17:10 | 20mn | Influence of wirebond shape on its lifetime with application to frame connections Corresponding Author: Bernhard Czerny – University of Vienna, Faculty of Physics PNM Bernhard Czerny 1, Indrajit Paul 2, Golta Khatibi 1, Markus Thoben 3 1 University of Vienna Faculty of Physics, Vienna, Austria 2 Infineon Technologies, Neubiberg, Germany 3 Infineon Technologies, Warstein, Germany |
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| Session 17 | 15:40 | Tuesday Apr 16 2013 | |
| Multi-physics Models for Failure Analysis Chairman: Steffen Hartmann, Sven Rzepka |
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| 15:40 | 30mn | Keynote presentation – Multi-Physics Simulations for Combined Temperature/Humidity Cycling of Potted Electronic Assemblies Corresponding Author: Ehsan Parsa – University of Maryland College Park Ehsan Parsa, Hao Huang, Abhijit Dasgupta, CALCE University of Maryland College Park, MD USA |
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| 16:10 | 20mn | Multi-physics Reliability Simulation for Solid State Lighting Drivers Corresponding Author: Sima Tarashioon – Delft University of Technology S. Tarashioon, W.D. van Driel, G.Q. Zhang, Delft University of Technology, Delft, The Netherlands |
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| 16:30 | 20mn | Quantifying Moisture Diffusion into Three Dimensional Axisymmetric Sealants Corresponding Author: David Leslie – University of Maryland David Leslie 1, Abhijit Dasgupta 1, J.W. C. de Vries 2 1 University of Maryland, Maryland, United States of America 2 Philips Research, Eindhoven, the Netherlands |
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| 16:50 | 20mn | Simulation and Measurement of the Solder Bumps with a plastic Core Corresponding Author: Jochen Schlobohm – Leibniz Universität Hannover LfI J. Schlobohm 1, K. Weide-Zaage 1, R. Rongen 2, F. Voogt 2, R. Roucou 2 1 Information Technology Laboratory, Leibniz Universität Hannover, Hanover, Germany 2 NXP Semiconductor, Nijmegen, The Netherlands |
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| 17:10 | 20mn | Thermo-Electro-Chemo-Mechanics of Solids Corresponding Author: Jianmin Qu – Northwestern University Jianmin Qu, Northwestern University, USA |
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| Session 18 | 15:40 | Tuesday Apr 16 2013 | |
| Interfaces and Adhesives Chairman: Steffen Wiese |
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| 15:40 | 30mn | Keynote presentation – Advanced Mixed-Mode Bending Test Experimental-Numerical Characterization of the Critical Energy Release Rate Gc including Mixed-Mode-Angle Ψ in Interfaces under independent external loads Corresponding Author: Marcus Schulz – AMIC Angewandte Micro-Messtechnik GmbH Schulz, Marcus 1, Springborn, Martin 1, Keller, Jürgen 2, Michel, Bernd 3, Wunderle, Bernhard 4 1 AMIC Angewandte Micro-Messtechnik GmbH, Berlin, Germany, Chemnitz University of Technology, Chemnitz, Germany 2 AMIC Angewandte Micro-Messtechnik GmbH, Berlin, Germany 3 Fraunhofer Institute Electronic Nanosystems ENAS, Chemnitz, Germany 4 Chemnitz University of Technology, Chemnitz, Germany, Fraunhofer Institute Electronic Nanosystems ENAS, Chemnitz, Germany |
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| 16:10 | 20mn | On the Crack and Delamination Risk Optimization of a Si-Interposer for LED Packaging Corresponding Author: Juergen Auersperg – Fraunhofer ENAS Auersperg, Juergen 1, Dudek, Rainer 1, Jordan, Rafael 2, Bochow-Neß, Olaf 3, Rzepka, Sven 1, Michel, Bernd 1 1 Micro Materials Center at Fraunhofer ENAS, Chemnitz, Germany 2 Dept. Photonic and Power System Assembly, Fraunhofer IZM, Berlin, Germany 3 Dept. Environmental & Reliability Engineering, Fraunhofer IZM, Berliln, Germany |
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| 16:30 | 20mn | Determination of Interface Fracture Parameters: Energy Release Rate and Mode Mixity using FEA Corresponding Author: Maus Ingrid – Infineon Technologies AG Ingrid Maus 1, Heinz Pape 2, Hasan Nabi 1, Bernd Michel 3, Bernhard Wunderle 4 1 Infineon Technologies AG, Regensburg, Germany 2 Infineon Technologies AG, Neubiberg, Germany 3 Fraunhofer ENAS Chemnitz, Germany 4 TU Chemnitz, Germany |
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| 16:50 | 20mn | Modeling of Mixed-Mode Delamination by Cohesive Zone Method Corresponding Author: Daoguo Yang – Guilin University of Electronic Technology Bingbing Zhang 1, Daoguo Yang 1, Leo Ernst 2, Heinz Pape 3 1 Guilin University of Electronics Technology, Guilin, China 2 Ernst Consultant, Schoonhoven, The Netherlands 3 Infineon Technologies AG, Munich, Germany |
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| 17:10 | 20mn | Adhesion of Printed Circuit Boards with bending and the effect of reflow cycles Corresponding Author: Ronald Schoengrundner – Materials Center Leoben Forschung GmbH Ronald Schöngrundner 1, Megan J. Cordill 2, Julia Berger 2, Hans-Peter Krückl 1, Klaus Fellner 3, Thomas Krivec 4, Markus Kurz 5, Peter F. Fuchs 3, Günther A. Maier 1 1 Materials Center Leoben Forschung GmbH 2 Erich Schmid Institute for Materials Science, Austrian Academy of Sciences 3 Polymer Competence Center Leoben 4 AT&S AG 5 Panasonic Industrial Devices Materials Europe GmbH |
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| Session 19 | 09:00 | Wednesday Apr 17 2013 | |
| Advances in Modeling and Testing I Chairman: Jürgen Auersperg, KuoNing Chiang |
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| 09:00 | 30mn | Keynote presentation – An Integrated Thermal Management Solution for Flat-Type Solar Photovoltaic Modules Corresponding Author: Peter Rodgers – The Petroleum Institute Peter Rodgers, Valerie Eveloy, The Petroleum Institute, UAE |
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| 09:30 | 30mn | Keynote presentation – Fracture mechanics and its applications in microsystem packaging Corresponding Author: Jianmin Qu – Northwestern University Jianmin Qu, Northwestern University, USA |
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| 10:00 | 30mn | Keynote presentation – Current state-of-the-art in the reliability of solid state lighting systems Corresponding Author: XueJun Fan – Lamar University Xuejun Fan, Lamar University, USA |
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| Session 20 | 11:00 | Wednesday Apr 17 2013 | |
| Experimental Investigations Chairman: Ilko Schmadlak, Véronique Rochus |
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| 11:00 | 30mn | Keynote presentation – Toolbox for Visco-elastic Material Modeling of Smart Lightweight Structures Corresponding Author: Sven Rzepka – Fraunhofer ENAS, Micro Materials Center Sven Rzepka 1, Remi Pantou 1, Franz Bormann 2, Birgit Brämer 3, Ines Brabandt 3, Bernd Michel 1 1 Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany 2 CWM Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany 3 AMITRONICS Angewandte Mikromechatronik GmbH, Seefeld b. München, Germany |
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| 11:30 | 20mn | Internal Stress State Measurements of the Large Molded Electronic Control Units Corresponding Author: Gromala Przemyslaw – Robert Bosch GmbH Gromala P. 1, Fischer S. 1, Zoller T. 1, Andeescu A. 1, Duerr J. 1, Rapp M. 1, Wilde J. 2 1 Robert Bosch GmbH 2 IMTEK, University of Freiburg |
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| 11:50 | 20mn | Mechanically relevant chemical shrinkage of moulding compounds Corresponding Author: Micaela Sousa – Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM M.F. Sousa 1, O. Hölck 1, T. Braun 1, J. Bauer 1, H. Walter 1, O. Wittler 1, K.D. Lang 2 1 Fraunhofer IZM Berlin 2 Technische Universität Berlin |
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| 12:10 | 20mn | Stress and wafer warpage analysis of GaN thin film induced by transfer bonding process on 200mm Si substrate Corresponding Author: Melina Lofrano – imec Melina Lofrano, Nga Pham, Maarten Rosmeulen, Philippe Soussan, imec |
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| 12:30 | 20mn | Thermal Improvement of Die Attach by using PDMS-grafted particles as filler and Its Application in Solid State Lighting Corresponding Author: Kai Zhang – The Hong Kong University of Science and Technology Kai Zhang 1, Xinfeng Zhang 1, Zhibo Chen 1, Hongye Sun 1, Matthew Yuen 1, Min Zhang 1, Cheuk Yan Chan 2, Yuhua Lee 2, Lisa Liu 2, Sean Ho 2, Guoqi Zhang 3 1 Department of Mechanical Engineering, The Hong Kong University of Science and Technology 2 Philips (China) Investment Co., Ltd 3 Philips Lighting |
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| Session 21 | 11:00 | Wednesday Apr 17 2013 | |
| Solid State Lighting Chairman: Willem van Driel, Xuejun Fan |
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| 11:00 | 30mn | Keynote presentation – OLED/textile integration: Virtual prototyping by a design sensitivity analysis Corresponding Author: Jeroen van den Brand – TNO Science and Industry M. Erinc 1, C.G. van der Sman 2, J.P.M. Hoefnagels 2, J. van den Brand 3, K. Pacheco-Morillo 3, M. de Kok 3 1 TNO Science and Industry, Materials for Integrated Products, Eindhoven, The Netherlands 2 Eindhoven University of Technology, Department of Mechanical Engineering, Materials Technology, Eindhoven, The Netherlands 3 Holst Centre/TNO, HTC31, Eindhoven, The Netherlands |
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| 11:30 | 20mn | Optical design of micro-fabricated light reflector for 3D multi chip LED module Corresponding Author: Stanley Y Y Leung, Lei Zhong, Jia Wei, Cell K Y Wong, Cadmus C A Yuan, G Q Zha – State Key Laboratory of Solid State Lighting Stanley Y Y Leung 1, Lei Zhong 1, Jia Wei 2, Zhenlei Xu 3, Cadmus C A Yuan 4, G Q Zhang 5 1 State Key Laboratory of Solid State Lighting, Changzhou, 213161, China 2 State Key Laboratory of Solid State Lighting, Changzhou, 213161, China, and Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology, Delft, the Netherlands 3 Unilumin Group Co., Ltd., Baoan, Shenzhen, 518103, China 4 Research and Development Center for Semiconductor Lighting, Institute of Semiconductors, Chinese Academy of Sciences, Haidian, Beijing, 100086, China, and State Key Laboratory of Solid-State Lighting, Haidian, Beijing, 100086, China 5 Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology, Delft, the Netherlands |
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| 11:50 | 20mn | Geometric Optimization of High Performance Interconnect of Rigid/Flexible/Rigid Substrate for Wafer Level Packaging in Solid State Lighting Applications by numerical simulations Corresponding Author: Pan Liu – Delft University of Technology P. Liu 1, J. Zhang 1, R. Sokolovskij 1, H.W. van Zeijl 1, B. Mimoun 1, G.Q. Zhang 2 1 Delft University of Technology, DIMES Research Center, Delft, the Netherlands 2 Delft University of Technology, DIMES Research Center, Delft, the Netherlands; Philips Lighting, Eindhoven, the Netherlands |
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| 12:10 | 20mn | Product Level Accelerated Lifetime Test for Indoor LED Luminaires Corresponding Author: Sau Koh – Delft Institute of Microsystems and Nanoelectronics (Dimes) Sau Koh 1, Cadmus Yuan 2, Bo Sun 3, Bob Li 2, Xuejun Fan 4, G.Q. Zhang 5 1 Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, The Netherlands; Beijing Research Center, Delft University of Technology, Beijing, China; State Key Laboratory of Solid-State Lighting, Beijing, China 2 State Key Laboratory of Solid-State Lighting, Beijing, China 3 Beijing Research Center, Delft University of Technology, Beijing, China 4 Department of Mechanical Engineering, Lamar University, Beaumont, USA 5 Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, The Netherlands |
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| 12:30 | 20mn | Wire bonding lifetime prediction of LED packages using numerical analysis Corresponding Author: Sung-Uk Zhang – Samsung Electronics Sung-Uk Zhang, Samsung Electronics, Korea |
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| Session 22 | 14:00 | Wednesday Apr 17 2013 | |
| Advances in Modeling and Testing II Chairman: Abhijit Dasgupta, Michael Guyenot |
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| 14:00 | 30mn | Keynote presentation – Molecular Dynamics Simulations for Mechanical Characterization of CNT/Gold Interface and its Bonding Strength Corresponding Author: Steffen Hartmann – University of Technology Chemnitz Steffen Hartmann 1, Ole Hoelck 2, Bernhard Wunderle 1 1 University of Technology Chemnitz 2 Fraunhofer IZM Berlin |
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| 14:30 | 30mn | Keynote presentation – Reduced Order Modeling Enables System Level Simulation of a MEMS Piezoelectric Energy Harvester with a Self-Supplied SSHI-Scheme Corresponding Author: Fatma Shabaan Sharkawi Sayed – Institute for Microsystems Engineering, IMTEK, Freiburg University F. Sayed 1, T. Aftab 1, M. Eker 2, D. Hohlfeld 2, T. Bechtold 1, J. G. Korvink 3 1 Institute for Microsystems Engineering, Freiburg University, Germany 2 Reutlingen University, Germany 3 Institute for Microsystems Engineering & Freiburg Institute of Advanced Studies, Freiburg University, Germany |
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| 15:00 | 30mn | Keynote presentation – Multiscale FE Modeling Concepts applied to Microelectronic Device Simulations Corresponding Author: Helmut Köck – KAI GmbH Helmut Köck 1, Stefano de Filippis 1, Michael Nelhiebel 2, Michael Glavanovics 1, Manfred Kaltenbacher 3 1 Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, Villach, Austria 2 Infineon Technologies Austria AG, Villach, Austria 3 Vienna University of Technology, Institute of Mechanics and Mechatronics, Vienna, Austria |
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