EuroSimE 2013 was locally organised by Wroclaw University of Technology (Pr Artur Wymyslowski) in Haston City Hotel, on April 15-16-17th 2013

This 14th EuroSimE was attended by 140 individuals.

5 training courses were offered on Sunday.

Proceedings of EuroSimE 2013 : CD-ROM full version: IEEE Catalog number CFP13566-CDR, ISBN 978-1-4673-6137-8

This was the technical programme of EuroSimE 2013:

Go to Global conference schedule  Technical program

Day 1 – Monday Apr 15 2013
09:00 Opening by Technical Committee Chair, W. van Driel, Philips Lighting
09:05 Welcome by local organiser, Prof. Artur Wymysłowski, Wroclaw University, Poland
09:10 Technology and application of heterostructure in micro- and opto-electronics Prof. Marek Tłaczała and Prof. Regina Paszkiewicz, Micro and Nano Technology Division, Wroclaw University
09:40 On trends, challenges and technologies in future microprocessor and systems integration Dr. Thomas Brunschwiler, IBM Switzerland
10:10 Thermal testing: measuring the real world, Dr. Andras Poppe, Product Manager, Mentor Graphics, Hungary
10:40 Break
11:00  S. 1  New Developments in Modeling
12:40 Lunch
14:00  S. 2  3D Interconnect Technology  S. 3  Manufacturing Process Modelling  S. 4  Thermal Behavior Modeling and Characterization
15:50 Break
16:20  S. 5  Chip-Package Interaction  S. 6  MEMS and NEMS Structures  S. 7  Photovoltaics
17:30 End of 1st day technical sessions
18:00 Departure by bus for dinner at Zamek Topacz castle
Day 2 – Tuesday Apr 16 2013
09:00  S. 8  Reliability Modeling  S. 9  Molecular Dynamics  S. 10  Electrothermal Modeling and Characterization
10:10 Break
10:40  S. 11  Thermo-Mechanical Issues in Microelectronics  S. 12  Multi-Physics and Thermal Issues in Microelectronics
12:10 Lunch
13:30  S. 13  Solder Modeling  S. 14   Multi-physics Modelling of MEMS Structures  S. 15  On Stresses, Strains and Strength
15:00 Break
15:40  S. 16  Thermo-Mechanical Modeling for Wirebonds Failures  S. 17  Multi-physics Models for Failure Analysis  S. 18  Interfaces and Adhesives
17:30 Exhibitor and Sponsor Session
APT Electronics Ltd, Guo Wei Xiao – Philips, Willem van Driel – Robert Bosch, Michael Guyenot – Simulia, Witold Kakol – SKL, Cadmus Yuan
18:30 Cocktail party at venue
19:45 EuroSimE Organisers and Technical Committees meeting
Day 3 – Wednesday Apr 17 2013
09:00  S. 19  Advances in Modeling and Testing I
10:30 Break
11:00  S. 20  Experimental Investigations  S. 21  Solid State Lighting
12:50 Lunch
14:00  S. 22  Advances in Modeling and Testing II
15:30 End of conference

Go to Global conference schedule  Technical program

Session 1 11:00 Monday Apr 15 2013
New Developments in Modeling
Chairman: Leo J. Ernst, Consultant and Emeritus Professor of Delft University of Technology
11:00 30mn Keynote presentation – Measuring techniques for deformation and stress analysis in micro-dimensions
Corresponding Author: Dietmar Vogel – Fraunhofer ENAS
Dietmar Vogel, Ellen Auerswald, Juergen Auersperg, Sven Rzepka, Bernd Michel, Fraunhofer ENAS
11:30 30mn Keynote presentation – Enabling Technologies for System-Level Simulation of MEMS
Corresponding Author: Tamara Bechtold – IMTEK – University of Freiburg
Tamara Bechtold, Institute for Microsystems Engineering – IMTEK, Freiburg University, Germany
Gabriele Schrag, Institute for Physics of Electrotechnology, Technische Universität München, Germany
Lihong Feng, Max Planck Institute for Dynamics of Complex Technical Systems, Magdeburg, Germany
12:00 30mn Keynote presentation – Design of SiGe Nano-Electromechanical Relay for Logic Application
Corresponding Author: Véronique Rochus – Imec
V. Rochus, M. Ramezani, S. Cosemans, S. Severi, A. Witvrouw, K. De Meyer, H.A.C. Tilmans, X. Rottenberg, imec, Leuven, Belgium


Session 2 14:00 Monday Apr 15 2013
3D Interconnect Technology
Chairman: Daoguo Yang, Dag Anderson
14:00 30mn Keynote presentation – µ-Raman Spectroscopy and FE-Analysis of thermo-mechanical Stresses in TSV Periphery
Corresponding Author: Peter Sättler – Technical University Dresden
Peter Saettler 1, Mathias Boettcher 2, Klaus Juergen Wolter 1
1 Technical University Dresden
2 Fraunhofer IZM ASSID
14:30 20mn Impact of Bosch Scallops Dimensions on Stress in Open Through Silicon Via
Corresponding Author: Anderson Pires Singulani – Institute for Microelectronics, Technical University of Vienna
Anderson Pires Singulani, Hajdin Ceric, Erasmus Langer, Technical University of Vienna, Vienna, Austria
14:50 20mn Integration of a novel Through Silicon Via Concept in a microelectronic Pressure Sensor
Corresponding Author: Yvonne Bergmann – Robert Bosch GmbH, Automotive Electronics
Yvonne Bergmann, Jochen Reinmuth, Barbara Will, Mathias Hain, Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
15:10 20mn Simulation of Cu pumping during TSV fabrication
Corresponding Author: Nabi Nabiollahi – IMEC
Nabi Nabiollahi 1, Christopher J. Wilson 2, Joke De Messemaeker 2, Mario Gonzalez 2, Kristof Croes 2, Eric Beyne 2, Ingrid De Wolf 1
1 imec, Leuven, Belgium and Dept. of Metallurgy and Materials Engineering, KULeuven, Leuven, Belgium
2 imec, Leuven, Belgium
15:30 20mn Reliability of Cu-plated through encapsulant vias (TEV)
Corresponding Author: Jens Heilmann – Chemnitz University of Technology, Professorship for Materials and Reliability of Microsystems
Jens Heilmann 1, Bernhard Wunderle 1, Sridhar Ganesh Kumar 1, Ole Hoelck 2, Hans Walter 2, Olaf Wittler 2, Gunter Engelmann 2, M. Jürgen Wolf 2, Gottfried Beer 3, Klaus Pressel 3
1 Chemnitz University of Technology
2 Fraunhofer IZM
3 Infineon Technologies


Session 3 14:00 Monday Apr 15 2013
Manufacturing Process Modelling
Chairman: Alberto Corigliano, Sheng Liu
14:00 30mn Keynote presentation – Numerical Modelling of the Electroplating Process for Microvia Fabrication
Corresponding Author: Chris Bailey – University of Greenwich
Nadia Strusevich 1, Chris Bailey 1, Suzanne Costello 2, Mayur Patel 1, Marc Desmulliez 2
1 School of Computing and Mathematical Sciences, University of Greenwich
2 MIcroSystems Engineering Cenre (MISEC), Heriot-Watt University, Edinburgh, UK
Corresponding Author: Aldo Ghisi – Dept. of Structural Engineering, Politecnico di Milano
A. Ghisi 1, A. Corigliano 1, S. Mariani 1, G. Allegato 2
1 Dept. of Civil and Environmental Engineering, Politecnico di Milano, Italy
2 STMicroelectronics, AMS – MEMS Technology Development, Agrate Brianza (MI), Italy
14:50 20mn Multi-Physics Simulation of the Component Attachment within Embedding Process
Corresponding Author: Katerina Macurova – Materials Center Leoben Forschung GmbH
Katerina Macurova 1, Abdellah Kharicha 2, Martin Pletz 1, Marianne Mataln 1, Raul Bermejo 3, Ronald Schöngrundner 1, Thomas Krivec 4, Thomas Antretter 5, Wilson Maia 6, Mike Morianz 4, Michel Brizoux 6
1 Materials Center Leoben Forschung GmbH, Leoben, Austria
2 Modellierung und Simulation Metallurgischer Prozesse – Montanuniversitaet Leoben, Austria
3 Institut für Struktur- und Funktionskeramik – Montanuniversität Leoben, Austria
4 AT&S AG, Leoben, Austria
5 Institut für Mechanik – Montanuniversitaet Leoben, Austria
6 Thales Global Services, Meudon-la-Forêt, France
15:10 20mn The fracture studies of polycrystalline silicon based MEMS
Corresponding Author: Ludovic NOELS – University of Liège
Shantanu S. Mulay 1, Gauthier Becker 1, Renaud Vayrette 2, Jean-Pierre Raskin 2, Thomas Pardoen 2, Montserrat Galceran 3, Stéphane Godet 4, Ludovic Noels 1
1 University of Liege, Liège, Belgium
2 Université catholique de Louvain, Louvain-la-Neuve, Belgium
3 Université Libre de Bruxelles, Brussels, Belgium, and CIC Energigune, Miñano (Álava), Spain
4 Université Libre de Bruxelles, Brussels, Belgium
15:30 20mn Simulations of Thermal and Mechanical Properties of AlN, Si3N4 and SiC
Corresponding Author: Dorothea Winkler – Julius Maximilian University of Würzburg
D.E.R. Winkler 1, T. Müller 2, T.E.M. Staab 1, F. Raether 3
1 Chair for Chemical Technology of Advanced Materials, University of Würzburg, Würzburg, Germany
2 Center for High Temperature Materials and Design, Fraunhofer ISC, Würzburg, Germany
3 Center for High Temperature Materials and Design, Fraunhofer ISC, Bayreuth, Germany


Session 4 14:00 Monday Apr 15 2013
Thermal Behavior Modeling and Characterization
Chairman: Andras Poppe, Peter Rodgers
14:00 30mn Keynote presentation – Thermal evaluation of a liquid/air cooled integrated power inverter for hybrid vehicle applications
Corresponding Author: Ilja Belov – School of Engineering, Jönköping University
Yafan Zhang 1, Ilja Belov 2, Niklas G. Sarius 3, Mietek Bakowski 1, Hans-Peter Nee 4, Peter Leisner 3
1 Acreo Swedish ICT AB, Kista, Sweden
2 School of Engineering, Jönköping University, Jönköping, Sweden
3 SP Technical Research Institute of Sweden, Borås, Sweden
4 KTH School of Electrical Engineering, Stockholm, Sweden
14:30 20mn Protection Power device performance investigation using TCAD simulations
Corresponding Author: Fabrice ROQUETA – STMicroelectronics
ROQUETA Fabrice, TAHRI Karim, STMicroelectronics, Tours, France
14:50 20mn Wafer test probe burn modeling and characterization
Corresponding Author: Baha Zafer – Istanbul University
Baha Zafer  1, Mehdi H. Vishkasougheh 2, Bahadır Tunaboylu 2
1 İstanbul University – Dept. of Mechanical Engineering
2 İstanbul Şehir University – Dept. of Industrial Engineering
15:10 20mn Account of the package features in modelling of thermal microsensors
Corresponding Author: Alexander Kozlov – Omsk State University
A. G. Kozlov, Omsk State University, Omsk, Russian Federation
D. Randjelovic, IHTM – Institute of Microelectronic Technology and Single Crystals, University of Belgrade, Belgrade, Serbia
15:30 20mn A novel methodology for thermal characterization of power package in high current application
Corresponding Author: ByoungOk, Lee – Fairchild KOREA Semiconductor, Package Development Group
ByoungOk.Lee, ARom.Moon, JoonSeo.Son, JiHwan Kim, Package Dev. Group, Fairchild KOREA Semiconductor, Korea


Session 5 16:20 Monday Apr 15 2013
Chip-Package Interaction
Chairman: Dietmar Vogel, Frank Krämer
16:20 30mn Keynote presentation – IC-Package Interaction
Corresponding Author: Bart Vandevelde – IMEC
Bart Vandevelde, Andrej Ivankovic, Bjorn Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Mario Gonzalez, Geert Vanderplas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei, imec
16:50 20mn Non-conforming Meshes in Multi-scale Thermo-mechanical Finite Element Analysis of Semiconductor Power Devices
Corresponding Author: Sebastian Eiser – Kompetenzzentrum Automobil- und Industrielektronik (KAI)
Sebastian Eiser, Kompetenzzentrum Automobil- und Industrielektronik (KAI), Villach, Austria
Manfred Kaltenbacher, Technische Universität Wien, Vienna, Austria
Michael Nelhiebel, Infineon Technologies Austria AG, Villach, Austria
17:10 20mn Finite element analysis of fatigue cracks formation in power metallization of a semiconductor device subjected to active cycling
Corresponding Author: Grygoriy Kravchenko – Vienna Univ. of Technology, Institute for Lightweight Design and Structural Biomechanics
Grygoriy Kravchenko 1, Balamurugan Karunamurthy 2, Michael Nelhiebel 3, Heinz E. Pettermann 1
1 Vienna University of Technology, Institute for Lightweight Design and Structural Biomechanics, Vienna, Austria
2 KAI – Kompetenzzentrum Automobil- u. Industrieelektronik GmbH, Villach, Austria
3 Infineon Technologies Austria AG, Villach, Austria; KAI – Kompetenzzentrum Automobil- u. Industrieelektronik GmbH, Villach, Austria


Session 6 16:20 Monday Apr 15 2013
MEMS and NEMS Structures
Chairman: Cadmus Yuan, Chris Bailey
16:20 30mn Keynote presentation – Estimation of deflections by interferometry in a cantilever array and its optimization based on a two-scale model
Corresponding Author: Michel LENCZNER – FEMTO-ST
Hui HUI 1, Michel LENCZNER 1, Scott COGAN 1, André MEISTER 2, Mélanie FAVRE 2, Thomas OVERSTOLZ 2, Raphaël COUTURIER 1, Stéphane DOMAS 1
1 FEMTO-ST, France
2 CSEM, Switzerland
16:50 20mn Reliability Assessment of a MEMS Microphone under Shock Impact Loading
Corresponding Author: Jue Li – Aalto University School of Electrical Engineering
Jue Li 1, Joonas Makkonen 1, Mikael Broas 1, Jussi Hokka 1, Toni T. Mattila 1, Mervi Paulasto-Kröckel 1, Jingshi Meng 2, Abhijit Dasgupta 2
1 Aalto University School of Electrical Engineering, Espoo, Finland
2 University of Maryland, College Park, MD, USA
17:10 20mn A Multiscale Model Derivation and Simulation Tool for MEMS Arrays
Corresponding Author: Michel Lenczner – FEMTO-ST
Bin YANG, FEMTO-ST, Département Temps-Fréquence, University of Franche-Comté, France
Walid BELKHIR, INRIA Nancy – Grand Est, CASSIS project, France
Michel LENCZNER, FEMTO-ST, Département Temps-Fréquence, University of Technology at Belfort-Montbéliard, France
Nicolas RATIER, FEMTO-ST, Département Temps-Fréquence, Ecole Nationale Supérieure de Mécanique et de Microtechniques, France


Session 7 16:20 Monday Apr 15 2013
Chairman: Mike Röllig, Marcus Schulz
16:20 20mn FEM Simulations of Back Contact Solar Modules during Temperature Cycling
Corresponding Author: Steffen Wiese – Saarland University
Frank Kraemer, Steffen Wiese, University of Saarland, Saarbrucken, Germany
16:40 20mn Analysis and Simulation of cracks and micro cracks in PV Cells
Corresponding Author: Joseph Al Ahmar – Saarland University
Joseph Al Ahmar, Steffen Wiese, University of Saarland, Saarbrucken, Germany


Session 8 09:00 Tuesday Apr 16 2013
Reliability Modeling
Chairman: Bart Vandevelde, Sau Koh
09:00 30mn Keynote presentation – Novel Reliability Assessment Concept based on accelerated de-rated Strength Approach
Corresponding Author: Erik Veninga – TNO Technical Sciences
E.P. Veninga, R. Kregting, A. van der Waal, A.W.J. Gielen, TNO Technical Sciences, The Netherlands
09:30 20mn Reliability Analysis of Next Generation Wafer Level Chip Scale Package
Corresponding Author: Yong Liu – Fairchild Semiconductor
Qiuxiao Qian, Yong Liu, Fairchild Semiconductor, USA
09:50 20mn Reliability investigation of System in Package devices toward aeronautic requirements: Methodology and application
Corresponding Author: Antoine RENAULT – EADS Innovation Works
Antoine RENAULT, Florian MOLIERE, Catherine MUNIER, EADS Innovation Works, Suresnes, France


Session 9 09:00 Tuesday Apr 16 2013
Molecular Dynamics
Chairman: Jianmin Qu, Ingrid Maus
09:00 30mn Keynote presentation – Moisture transport and swelling stresses at Moulding-Compound substrate inter-faces investigated by Molecular Modeling and Finite Element Simulations
Corresponding Author: Ole Hölck – Fraunhofer IZM
O. Hölck 1, J. Bauer 1, T. Braun 1, H. Walter 1, O. Wittler 1, B. Wunderle 2, K.-D. Lang 3
1 Fraunhofer IZM, Berlin, Germany
2 Chemnitz University of Technology, Chemnitz, Germany
3 Technische Universität Berlin, Berlin, Germany
09:30 20mn Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface (Part IV): The effect of Filler
Corresponding Author: Nancy Iwamoto – Honeywell Performance Materials and Technologies
Nancy Iwamoto, Honeywell PMT, USA
09:50 20mn Application of molecular modelling for analysis of a surface energy and its comparison with the experimental results based on wetting angle measurement
Corresponding Author: Dawid Krol – Wroclaw University of Technology
Dawid Król, Artur Wymysłowski, Irena Zubel, Krzysztof Rola, Wroclaw University of Technology, Faculty of Microsystems Electronics and Photonics, Wrocław, Poland


Session 10 09:00 Tuesday Apr 16 2013
Electrothermal Modeling and Characterization
Chairman: Tamara Bechtold, Ilja Belov
09:00 30mn Keynote presentation – Electro-thermal modelling to quantify the electro-thermal impact of the solder joint delamination on power device assemblies
Corresponding Author: Emmanuel MARCAULT – LAAS-CNRS
T. Azoui 1, E. Marcault 1, P. Tounsi 1, J.L. Massol 1, J.M. Dorkel 1, Ph. Dupuy 2
1 LAAS-CNRS, France
2 Freescale Seminconductors, France
09:30 20mn Impact of circuit load on the ageing mode of VDMOS chips using 3D FEM Electro-thermal modelling
Corresponding Author: Emmanuel MARCAULT – LAAS-CNRS
E. Marcault, J.L. Massol, P. Tounsi, J.M. Dorkel, LAAS-CNRS, France
09:50 20mn Fast and Accurate Electro-Thermal Analysis of Three-Dimensional Power Delivery Networks
Corresponding Author: Aida Todri-Sanial – CNRS-LIRMM
Aida Todri-Sanial 1, Alberto Bosio 2, Luigi Dilillo 1, Patrick Girard 1, Arnaud Virazel 2
1 CNRS-LIRMM, France
2 LIRMM, France


Session 11 10:40 Tuesday Apr 16 2013
Thermo-Mechanical Issues in Microelectronics
Chairman: Kaspar Jansen
Temperature effect on tribological and mechanical properties of MEMS
Corresponding Author: Marius Pustan – Technical University of Cluj-Napoca
Marius Pustan, Corina Birleanu, Cristian Dudescu, Ovidiu Belcin, Technical University of Cluj-Napoca, Romania
Confrontation of Failure Mechanisms Observed during Active Power Cycling Tests with Finite Element Analyze Performed on a MOSFET Power Module
Corresponding Author: Durand Camille Jeanne Margot – Robert Bosch GmbH
C. Durand 1, M. Klingler 1, D. Coutellier 2, H. Naceur 2
1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
2 LAMIH UMR CNRS 8201, PRES Lille Nord de France, University of Valenciennes, France
LED design improvement by means of virtual assembly process based on FEM simulation
Corresponding Author: Watzke,Stefan ; Altieri-Weimar,Paola – Osram Opto Semiconductors GmbH
Stefan Watzke, Paola Altieri-Weimar, Osram Opto Semiconductors, Germany
Simulation of stress concentrations in wire-bonds using a novel strain gradient theory
Corresponding Author: Martin Lederer – University of Vienna
M. Lederer 1, B. Czerny 1, B. Nagl 2, A. Trnka 2, G. Khatibi 1, M. Thoben 3
1 University of Vienna
2 Siemens AG
3 Infineon Technologies
Dealing with IC Package Material and Design Uncertainties using FUZZY Finite Elements
Corresponding Author: Bart Vandevelde – imec
B. Vandevelde 1, I. Konstantinou 2, D. Moens 2, D. Vandepitte 2
1 imec
2 KULeuven
Evaluation of Embedded IC Approach for Automotive Application
Corresponding Author: Robert Schwerz – TU Dresden – Electronics Packaging Laboratory
Robert Schwerz 1, Karsten Meier 2, Mike Roellig 1, Angelika Schingale 3, Andreas Schiessl 3, Klaus-Juergen Wolter 2, Norbert Meyendorf 4
1 Fraunhofer Institute for Non-Destructive Testing, Dresden Branch (lZFP-D)
2 Electronics Packaging Laboratory (IAVT), Technische Universität Dresden
3 Continental Automotive GmbH, Regensburg
4 Fraunhofer Institute for Non-Destructive Testing, Dresden Branch
Novel Quick Predict Approach for Identification of Critical Loadings in Electronic Components on PCB under Vibration Realized as a Design Support Tool
Corresponding Author: Dr. Mike Roellig – Fraunhoferinstitute for Non Destructive Testing
Mike Roellig 1, René Metasch 1, Angeilka Schingale 2, Andreas Schießl 2, Karsten Meier 3, Norbert Meyendorf 1
1 Fraunhofer Institute for Non-Destructive Testing, Dresden, IZFP-D
2 Continental Automotive GmbH, Regensburg
3 Dresden University of Technology, Electronics Packaging Laboratory (IAVT)
3D modeling of flip chip assemblies with large array and small pitch
Corresponding Author: Manuel FENDLER – CEA LETI
Wiyao KPOBIE 1, Napo BONFOH 2, Cynthia DREISTADT 2, Manuel FENDLER 3, Paul LIPINSKI 2
1 CEA Grenoble, LETI, MINATEC Campus, DOPT, France & Laboratoire de mécanique Biomécanique Polymères Structures (LaBPS) – EA 4632 Ecole Nationale d’Ingénieurs de Metz (ENIM)
2 Laboratoire de mécanique Biomécanique Polymères Structures (LaBPS) – EA 4632 Ecole Nationale d’Ingénieurs de Metz (ENIM), France
3 CEA Grenoble, LETI, MINATEC Campus, DOPT, France
Low-Power Smart Sensor for Laminar and Turbulent Flow Detection in Avionics Application
Corresponding Author: Ryszard Świerczyński – Wroclaw University of Technology
Ryszard Świerczyński, Krzysztof Urbański, Artur Wymysłowski, Krystian Jankowski, Wroclaw University of Technology, Wroclaw, Poland
The Evaluation of Flowability and Wire Sweep by Epoxy Molding Compound for Power Module Packages Using MoldflowTM
Corresponding Author: Taekkeun Lee – Fairchild Korea, Package Development Group
Taekkeun Lee, Aimee Lim, Youngsun Ko, Taewoo Lee, Byoungok Lee, Fairchild, Korea
Lifetime Assessment for Bipolar Components under Vibration and Temperature Loading
Corresponding Author: Karsten Meier – Technische Universität Dresden
Karsten Meier 1, Mike Roellig 2, Georg Lautenschlaeger 2, Andreas Schiessl 3, Klaus-Juergen Wolter 1
1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany
2 Fraunhofer Institute for Nondestructive Testing IZFP-D, Dresden, Germany
3 Continental Automotive GmbH, Regensburg, Germany
Application of simulation of plastics in the development of power modules
Corresponding Author: Tatyana Kashko – Infineon Technologies AG
Tatyana Kashko, Mark Essert, Infineon Technologies AG
VACNT fabrication on aluminum using “fast-heating” thermal CVD
Corresponding Author: Zhaoli Gao – The Hong Kong University of Science and Technology
Zhaoli GAO, Matthew M.F. YUEN, The Hong Kong University of Science and Technology
Transient thermal response as failure analytical tool – a comparison of different techniques
Corresponding Author: Daniel May – TU Chemnitz
D.May 1, B. Wunderle 1, R. Schacht 2, B. Michel 3
1 Technical University Chemnitz
2 University of Applied Sciences Lausitz
3 Fraunhofer ENAS
Investigation of the Failure Mode Formation in BGA Components Subjected to JEDEC Drop Test
Corresponding Author: Frank Kraemer – Saarland University
Frank Kraemer 1, Steffen Wiese 1, Sven Rzepka 2, Jens Lienig 3
1 Saarland University
2 Fraunhofer Institue for Electronic Nano Systems
3 Dresden University of Technology
Low Cycle Fatigue Measurement Results on Real Flip Chip Solder Contacts for Precise Life Time Prediction
Corresponding Author: René Metasch – Fraunhofer Institute for Non-Destructive Testing
R. Metasch 1, M. Roellig 1, A. Roehsler 2, C. Boehm 2, K.-J. Wolter 3
1 Fraunhofer Institute for Non-Destructive Testing
2 Technische Universität Bergakademie Freiberg
3 Technische Universität Dresden
Mechanical Behavior of Flexible Silicon Devices Curved in Spherical Configurations
Corresponding Author: Kevin Tekaya – CEA Laboratoire Packaging et Assemblages
Tekaya, K. 1, Fendler, M. 1, Inal, K. 2, Massoni, E. 2, Ribot, H. 1
1 CEA, LETI, Minatec Campus GRENOBLE France
2 Center for Material Forming, CEMEF UMR CNRS 7635 – Mines ParisTech
Reliability modeling analysis of a power module
Corresponding Author: Yong Liu – Fairchild Semiconductor
Yan Liu 1, YangJian Xu 1, Yong Liu 2
1 Zhejiang University of Technology, Hangzhou, China
2 Fairchild Semiconductor, South Portland, USA
Strength analysis of advanced node BEOL under CPI induced stresses
Corresponding Author: Bjorn Debecker – IMEC
Bjorn Debecker, Kris Vanstreels, Mario Gonzalez, Bart Vandevelde, Zsolt Tokei, Imec, Leuven, Belgium
Low Temperature Hybrid Wafer Bonding for 3D Integration
Corresponding Author: Andrei A. Damian – Laboratory of ECTM, DIMES, Delft University of Technology
A.A. Damian 1, R.H. Poelma 1, H.W. van Zeijl 1, G.Q. Zhang 2
1 Laboratory of ECTM, DIMES, Delft University of Technology
2 Laboratory of ECTM, DIMES, Delft University of Technology, Philips Lighting, Eindhoven, The Netherlands
Investigation of Interface Delamination of EMC-Copper Interfaces in Molded Electronic packages
Corresponding Author: Arjun Yadur – Robert Bosch GmbH
Arjun Yadur 1, P. Gromala 2, S. Green 2, K. Mat daud 3
1 Robert Bosch Engineering and Business Solutions Limited (RBEI), Bangalore, India
2 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
3 Hochschule Osnabrück, Germany


Session 12 10:40 Tuesday Apr 16 2013
Multi-Physics and Thermal Issues in Microelectronics
Chairman: Kaspar Jansen
Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens
Corresponding Author: Jeffery C. C. Lo – Center for Advanced Microsystems Packaging / HKUST
Jeffery C. C. LO 1, Huihua LIU 1, S. W. Ricky LEE 1, Xungao GUO 2, Huishan ZHAO 2
1 Hong Kong University of Science & Technology
2 HKUST LED-FPD Technology R&D Center at Foshan
Influence of contact geometry variations on the life time distribution of IC packages during electromigration testing
Corresponding Author: Lutz Meinshausen – Universtite Bordeaux 1 IMS
Lutz Meinshausen 1, PD. Dr.-Ing. Kirsten Weide-Zaage  1, MdC HDR Dr. Hélène Frémont  2
1 LFI, Leibniz Universität Hannover, Hanover, Germany
2 IMS, Université Bordeaux 1, Bordeaux, France
Characterization of a new designed octahedron slotted metal track by simulations
Corresponding Author: Jörg Kludt – Information Technology Laboratory, Universität Hannover
Jörg Kludt 1, Kirsten Weide-Zaage 1, Markus Ackermann 2, Verena Hein 2
1 Information Technology Laboratory, Leibniz Universität Hannover
2 X-FAB Semiconductor Foundries AG
Resistance Electric Filed Dependence Simulation of Piezoresistive Silicon Pressure Sensor and Improvement by Shield Layer
Corresponding Author: Sheng Liu – Huazhong University of Science and Technology
Gang Cao, Chaojun Liu, Xiaogang Liu, Sheng Liu, Institute of Microsystems, State Key Laboratory for Digital Manufacturing Equipment & Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
A cost effective AFM setup, combining interferomtery and FPGA
Corresponding Author: stéphane Domas – Université de Franche-Comté, laboratoire FEMTO-ST, dpt. DISC
Raphaël Couturier 1, Stéphane Domas 1, Michel Lenczner 2, Gwenhaël Goavec-Merou 2, André Meister 3, Mélanie Favre 3
1 University of Franche-Comté, Belfort, France
2 University of Franche-Comté, Besançon, France
3 CSEM, Neuchatel, Switzerland
Piezoresistive force sensor as an application to nanosystems manipulation: design, simulations, technology and experiments
Corresponding Author: Gianina Schondelmaier – Technical University Chemnitz, Faculty for Electrical Engineering and Information Technologies, Dept. Materials and Reliability
Gianina Schondelmaier 1, Steffen Hartmann 1, Daniel May 1, Alexey Shaporin 2, Sebastian Voigt 2, R.D. Rodriguez 3, O.D.Gordan 3, D.R.T. Zahn 3, Jan Mehner 2, Karla Hiller 4, Bernhard Wunderle 1
1 Technical University Chemnitz, Faculty for Electrical Engineering and Information Technologies, Dept. Materials and Reliability of Microsystems, Germany
2 Technical University Chemnitz, Faculty for Electrical Engineering and Information Technologies, Dept. Microsystems and Precision Engineering, Germany
3 Technical University Chemnitz, Faculty of Natural Science, Dept. Semiconductor Physics, Germany
4 Technical University Chemnitz, Center for Microtechnologies ZfM, Germany
Study on Thermal Conductivity of Boron Nitride in Hexagonal Structure in Atomistic Scale by Using Non-Equilibrium Molecular Dynamics Technique
Corresponding Author: Bartosz Platek – Wroclaw Univesity of Technology
Bartosz Platek, Tomasz Falat, Jan Felba, Wroclaw University of Technology
A model for color prediction of LED packages
Corresponding Author: Cell K Y WONG – State Key Laboratory of Solid State Lighting Changzhou, China
C.K.Y. Wong 1, L Zhong 1, YQ Qin 1, Cadmus C.A. Yuan 2, Guoqi Zhang 3
1 State Key Laboratory of Solid State Lighting (Changzhou Base)
2 2 Research and Development Center for Semiconductor Lighting, Institute of Semiconductors, Chinese Academy of Sciences
3 Philips Lighting
A Novel Hybrid Method for Reliability Prediction of High-Power LED Luminaires
Corresponding Author: Daoguo Yang – Guilin University of Electronic Technology
M. Cai 1, K. M. Tian 1, W. B. Chen 1, H. Huang 1, H. Y. Tang 1, L.L. Liang 1, D. G. Yang 1, Xuejun Fan 2, G. Q. Zhang 3
1 Guilin University of Electronic Technology, China
2 Lamar University, USA
3 Delft University of Technology, The Netherlands
Investigation of temperature gradients with regard to thermomigration in Aluminium metallizations
Corresponding Author: Jörg Kludt – Information Technology Laboratory, Leibniz Universität Hannover
Jörg Kludt 1, Kirsten Weide-Zaage 1, Markus Ackermann 2, Verena Hein 2
1 Information Technology Laboratory, Leibniz Universität Hannover
2 X-FAB Semiconductor Foundries AG
Protection of Printed Circuit Board´s structure in Microwave process
Corresponding Author: Trinh Dung Bui – Institute of Electronic Appliances and Circuits, University of Rostock
Trinh Dung Bui, Felix Bremerkamp, Mathias Nowottnick, Dirk Seehase, Institute of Electronic Appliances and Circuits, Department „Reliability and Safety of Electronic Systems“ , University of Rostock, Germany
Triangular RF MEMS switched air gap capacitor using imec’s SiGe-MEMS platform
Corresponding Author: Mohammed Bedier – Imec
M. Bedier 1, X. Rottenberg 2, V. Rochus 2, R. AbdelRassoul 3, H.A.C. Tilmans 2
1 KACST-Intel Consortium Center of Excellence in Nano-manufacturing Applications, Riyadh, Saudi Arabia
2 imec, Leuven, Belgium
3 Arab Academy for Science and Technology, Alexandria, Egypt
Thermo-Mechanical Modelling and Design of SiGe-based Thermo-Electric Modules for High Temperature Applications
Corresponding Author: Michael Edwards, Klas Brinkfeldt – Swerea IVF AB
Michael Edwards, Klas Brinkfeldt, Swerea IVF, Sweden
Accelerated Lifetime Test for Isolated Components in Linear Drivers of High-Voltage LED System
Corresponding Author: Bo Sun – Beijing Research Center, Delft University of Technology
Bo Sun 1, Sau Wee Koh 1, Cadmus Yuan 2, Xuejun Fan 3, Guoqi Zhang 4
1 Beijing Research Center, Delft University of Technology
2 State Key Laboratory of Solid-State Lighting
3 Lamar University
4 Delft University of Technology
Comparative Analysis of the Thermal Resistance Profiles of Power Light-Emitting Diodes Cree and Rebel Types
Corresponding Author: Kononenko Valerii K. – BNTU
A.L. Zakgeim 1, A.E. Chernyakov 1, A.S. Vaskou 2, V.K. Kononenko 2, V.S. Niss 2
1 Submicron Heterostructures for Microelectronics Research & Engineering Center, RAS
2 Belarusian National Technical University


Session 13 13:30 Tuesday Apr 16 2013
Solder Modeling
Chairman: Bernhard Wunderle, Sima Tarashioon
13:30 30mn Keynote presentation – Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
Corresponding Author: Jürgen Eckermann – Swansea University
J. Eckermann 1, S. Mehmood 1, H.M. Davies 1, N.P. Lavery 1, S.G.R. Brown 1, J. Sienz 1, A. Jones 2, P. Sommerfeld 2
1 Advanced Sustainable Manufacturing Technology (ASTUTE), College of Engineering, Swansea University, Swansea, United Kingdom
2 Electronic Motion Systems Ltd., Swansea, United Kingdom
14:00 20mn Multiscale Creep modeling of the Effect of Micro-alloying Mn and Sb into SAC105 Solder
Corresponding Author: Subhasis Mukherjee – University of Maryland, College Park
Subhasis Mukherjee, Abhijit Dasgupta, CALCE, University of Maryland, College Park, Maryland, USA
14:20 20mn Finite Element Based Design of a New Dogbone Specimen for Low Cycle Fatigue Testing of Highly Filled Epoxy-Based Adhesives for Automotive Applications
Corresponding Author: Berkan Öztürk – Robert Bosch GmbH
Berkan Ozturk 1, Przemyslaw Gromala 1, Christian Silber 1, Kaspar Jansen 2, Leo Ernst 3
1 Robert Bosch GmbH, Reutlingen, Germany
2 Delft University of Technology, Delft, The Netherlands
3 Emeritus Professor of Delft University of Technology, Schoonhoven, The Netherlands
14:40 20mn Vibration Durability of Board Mounted BallGridArrays
Corresponding Author: Torsten Hauck and Ilko Schmadlak – Freescale Semiconductor
Torsten Hauck, Ilko Schmadlak, Freescale Halbleiter Deutschland GmbH


Session 14 13:30 Tuesday Apr 16 2013
Multi-physics Modelling of MEMS Structures
Chairman: Nancy Iwamoto
13:30 30mn Keynote presentation – Optimal design of a resonating MEMS magnetometer: a multi-physics approach
Corresponding Author: Alberto Corigliano – Politecnico di Milano
Alberto Corigliano 1, Mehrdad Bagherinia 1, Matteo Bruggi 1, Stefano Mariani 1, Ernesto Lasalandra 2
1 Politecnico di Milano, Italy
2 STMicroelectronics, Italy
14:00 20mn Novel Teeter-Totter 2-Axes MEMS Magnetometer with Equal sensitivities
Corresponding Author: Mahmoud Farghaly – Imec
M. A. Farghaly 1, V. Rochus 1, X. Rottenberg 1, U. S. Mohammed 2, H. A. C. Tilmans 1
1 Imec, Leuven, Belgium
2 Assuit University, Assuit, Egypt
14:20 20mn Investigation into Modelling Power Output for MEMS Energy Harvesting Devices using COMSOL Multiphysics
Corresponding Author: Reinhard Pufall – Infineon Technologies AG
Rosemary O’Keeffe,  1, Nathan Jackson 1, Finbarr Waldron 1, Mike O’Neill,  2, Kevin McCarthy 3, Alan Mathewson 1
1 Tyndall National Institute, University College Cork, Dyke Parade, Cork, Ireland
2 Analog Devices Inc., Limerick, Ireland
3 Department of Electrical and Electronic Engineering, University College Cork, College Rd., Cork, Ireland
14:40 20mn Influence of nonlinear intermolecular forces on the harmonic behavior of NEM resonators
Corresponding Author: Mohamed Zanaty – Imec
M. Zanaty 1, R. Jansen 1, V. Rochus 1, M. Abbas 2, A. Witvrouw 1, H.A.C. Tilmans 1, X. Rottenberg 1
1 imec, Leuven, Belgium
2 Department of Electrical Engineering, Assiut University, Egypt


Session 15 13:30 Tuesday Apr 16 2013
On Stresses, Strains and Strength
Chairman: Öle Hölck, Yong Liu
13:30 30mn Keynote presentation – Reliability Issues for High Temperature Interconnections Based on Transient Liquid Phase Soldering
Corresponding Author: Rainer Dudek – Fraunhofer ENAS
Rainer Dudek 1, Peter Sommer 1, Andreas Fix 2, Sven Rzepka  1, Bernd Michel 1
1 Fraunhofer ENAS, Micro Materials Center Chemnitz
2 Robert Bosch GmbH, CR/APJ3, Stuttgart
14:00 20mn Stress Impact of Moisture Diffusion measured with the stress chip
Corresponding Author: Florian Schindler-Saefkow – Fraunhofer ENAS
F. Schindler-Saefkow 1, F. Rost 1, A. Otto 1, R. Pantou 1, R. Mroßko 2, B. Wunderle 3, B. Michel 1, S. Rzepka 1, J. Keller 2
1 Fraunhofer ENAS, Micro Materials Center, Chemnitz
2 AMIC Angewandte Micro-Messtechnik GmbH, Berlin
3 Technische Universität Chemnitz
14:20 20mn Investigation of Stress States in Silicon Dies Induced by the Low Temperature Joining Technology
Corresponding Author: Thomas Herboth – Robert Bosch GmbH
Thomas Herboth 1, Michael Guenther 1, Roderich Zeiser 2, Juergen Wilde 2
1 Robert Bosch GmbH
14:40 20mn Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique
Corresponding Author: Krystian Jankowski – Wroclaw University of Technology
Krystian Jankowski 1, Ryszard Swierczynski 1, Krzysztof Urbanski 1, Artur Wymyslowski 1, Didier Chicot 2, Rainer Dudek 3
1 Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland
2 University Lille Nord of France, USTL, LML, CNRS, UMR 8107, Villeneuve d’Ascq, France
3 Fraunhofer-Institut fur Elektronische Nanosysteme Technologie-Campus 3, Chemnitz, Germany


Session 16 15:40 Tuesday Apr 16 2013
Thermo-Mechanical Modeling for Wirebonds Failures
Chairman: Rainer Dudek, Artur Wymyslowski
15:40 30mn Keynote presentation – Simulation of an Aluminum Thick Wire Bond Fatigue Crack by Means of the Cohesive Zone Method
Corresponding Author: Arian Grams – Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Arian Grams 1, Tobias Prewitz 1, Olaf Wittler 1, Johannes Kripfgans 1, Stefan Schmitz 1, Andreas Middendorf 1, Wolfgang H. Müller  2, Klaus-Dieter Lang 2
1 Fraunhofer IZM, Berlin, Germany
2 Technische Universität Berlin, Berlin, Germany
16:10 20mn Deformation Analysis of Wire Bonding on soft Polymers
Corresponding Author: Frank Kraemer – Saarland University
Frank Kraemer, Philipp Ritter, Steffen Wiese, Michael Moller, Saarland University
16:30 20mn On the thermo-mechanical modelling of a ball bonding process with ultrasonic softening
Corresponding Author: Alan Wright – Fraunhofer Institute for Integrated Systems and Device Technology IISB
Alan Wright 1, Stephane Koffel 1, Peter Pichler 2, Hubert Enichlmair 3, Rainer Minixhofer 3, Ewald Wachmann 3
1 Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany
2 Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany. Chair of Electron Devices, University of Erlangen-Nuremberg, Erlangen, Germany
3 ams AG, Unterpremstätten, Austria
16:50 20mn Bonding Wire Life Prediction Model of the Power Module under Power Cycling Test
Corresponding Author: Kuo-Ning Chiang – Department of Power Mechanical Engineering, National Tsing Hua University
Tuan-Yu Hung 1, Chin-Chun Wang 2, Kuo-Ning Chiang 1
1 Dept. of Power Mechanical Engineering National Tsing Hua University, HsinChu 300, Taiwan, R.O.C.
2 DELTA Electronics, INC., Taoyuan 333, Taiwan, R.O.C.
17:10 20mn Influence of wirebond shape on its lifetime with application to frame connections
Corresponding Author: Bernhard Czerny – University of Vienna, Faculty of Physics PNM
Bernhard Czerny 1, Indrajit Paul 2, Golta Khatibi 1, Markus Thoben 3
1 University of Vienna Faculty of Physics, Vienna, Austria
2 Infineon Technologies, Neubiberg, Germany
3 Infineon Technologies, Warstein, Germany


Session 17 15:40 Tuesday Apr 16 2013
Multi-physics Models for Failure Analysis
Chairman: Steffen Hartmann, Sven Rzepka
15:40 30mn Keynote presentation – Multi-Physics Simulations for Combined Temperature/Humidity Cycling of Potted Electronic Assemblies
Corresponding Author: Ehsan Parsa – University of Maryland College Park
Ehsan Parsa, Hao Huang, Abhijit Dasgupta, CALCE University of Maryland College Park, MD USA
16:10 20mn Multi-physics Reliability Simulation for Solid State Lighting Drivers
Corresponding Author: Sima Tarashioon – Delft University of Technology
S. Tarashioon, W.D. van Driel, G.Q. Zhang, Delft University of Technology, Delft, The Netherlands
16:30 20mn Quantifying Moisture Diffusion into Three Dimensional Axisymmetric Sealants
Corresponding Author: David Leslie – University of Maryland
David Leslie 1, Abhijit Dasgupta 1, J.W. C. de Vries 2
1 University of Maryland, Maryland, United States of America
2 Philips Research, Eindhoven, the Netherlands
16:50 20mn Simulation and Measurement of the Solder Bumps with a plastic Core
Corresponding Author: Jochen Schlobohm – Leibniz Universität Hannover LfI
J. Schlobohm 1, K. Weide-Zaage 1, R. Rongen 2, F. Voogt 2, R. Roucou 2
1 Information Technology Laboratory, Leibniz Universität Hannover, Hanover, Germany
2 NXP Semiconductor, Nijmegen, The Netherlands
17:10 20mn Thermo-Electro-Chemo-Mechanics of Solids
Corresponding Author: Jianmin Qu – Northwestern University
Jianmin Qu, Northwestern University, USA


Session 18 15:40 Tuesday Apr 16 2013
Interfaces and Adhesives
Chairman: Steffen Wiese
15:40 30mn Keynote presentation – Advanced Mixed-Mode Bending Test Experimental-Numerical Characterization of the Critical Energy Release Rate Gc including Mixed-Mode-Angle Ψ in Interfaces under independent external loads
Corresponding Author: Marcus Schulz – AMIC Angewandte Micro-Messtechnik GmbH
Schulz, Marcus 1, Springborn, Martin 1, Keller, Jürgen 2, Michel, Bernd 3, Wunderle, Bernhard 4
1 AMIC Angewandte Micro-Messtechnik GmbH, Berlin, Germany, Chemnitz University of Technology, Chemnitz, Germany
2 AMIC Angewandte Micro-Messtechnik GmbH, Berlin, Germany
3 Fraunhofer Institute Electronic Nanosystems ENAS, Chemnitz, Germany
4 Chemnitz University of Technology, Chemnitz, Germany, Fraunhofer Institute Electronic Nanosystems ENAS, Chemnitz, Germany
16:10 20mn On the Crack and Delamination Risk Optimization of a Si-Interposer for LED Packaging
Corresponding Author: Juergen Auersperg – Fraunhofer ENAS
Auersperg, Juergen 1, Dudek, Rainer 1, Jordan, Rafael 2, Bochow-Neß, Olaf 3, Rzepka, Sven 1, Michel, Bernd 1
1 Micro Materials Center at Fraunhofer ENAS, Chemnitz, Germany
2 Dept. Photonic and Power System Assembly, Fraunhofer IZM, Berlin, Germany
3 Dept. Environmental & Reliability Engineering, Fraunhofer IZM, Berliln, Germany
16:30 20mn Determination of Interface Fracture Parameters: Energy Release Rate and Mode Mixity using FEA
Corresponding Author: Maus Ingrid – Infineon Technologies AG
Ingrid Maus 1, Heinz Pape 2, Hasan Nabi 1, Bernd Michel 3, Bernhard Wunderle 4
1 Infineon Technologies AG, Regensburg, Germany
2 Infineon Technologies AG, Neubiberg, Germany
3 Fraunhofer ENAS Chemnitz, Germany
4 TU Chemnitz, Germany
16:50 20mn Modeling of Mixed-Mode Delamination by Cohesive Zone Method
Corresponding Author: Daoguo Yang – Guilin University of Electronic Technology
Bingbing Zhang 1, Daoguo Yang 1, Leo Ernst 2, Heinz Pape 3
1 Guilin University of Electronics Technology, Guilin, China
2 Ernst Consultant, Schoonhoven, The Netherlands
3 Infineon Technologies AG, Munich, Germany
17:10 20mn Adhesion of Printed Circuit Boards with bending and the effect of reflow cycles
Corresponding Author: Ronald Schoengrundner – Materials Center Leoben Forschung GmbH
Ronald Schöngrundner 1, Megan J. Cordill 2, Julia Berger 2, Hans-Peter Krückl 1, Klaus Fellner 3, Thomas Krivec 4, Markus Kurz 5, Peter F. Fuchs 3, Günther A. Maier 1
1 Materials Center Leoben Forschung GmbH
2 Erich Schmid Institute for Materials Science, Austrian Academy of Sciences
3 Polymer Competence Center Leoben
5 Panasonic Industrial Devices Materials Europe GmbH


Session 19 09:00 Wednesday Apr 17 2013
Advances in Modeling and Testing I
Chairman: Jürgen Auersperg, KuoNing Chiang
09:00 30mn Keynote presentation – An Integrated Thermal Management Solution for Flat-Type Solar Photovoltaic Modules
Corresponding Author: Peter Rodgers – The Petroleum Institute
Peter Rodgers, Valerie Eveloy, The Petroleum Institute, UAE
09:30 30mn Keynote presentation – Fracture mechanics and its applications in microsystem packaging
Corresponding Author: Jianmin Qu – Northwestern University
Jianmin Qu, Northwestern University, USA
10:00 30mn Keynote presentation – Current state-of-the-art in the reliability of solid state lighting systems
Corresponding Author: XueJun Fan – Lamar University
Xuejun Fan, Lamar University, USA


Session 20 11:00 Wednesday Apr 17 2013
Experimental Investigations
Chairman: Ilko Schmadlak, Véronique Rochus
11:00 30mn Keynote presentation – Toolbox for Visco-elastic Material Modeling of Smart Lightweight Structures
Corresponding Author: Sven Rzepka – Fraunhofer ENAS, Micro Materials Center
Sven Rzepka 1, Remi Pantou 1, Franz Bormann 2, Birgit Brämer 3, Ines Brabandt 3, Bernd Michel 1
1 Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany
2 CWM Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany
3 AMITRONICS Angewandte Mikromechatronik GmbH, Seefeld b. München, Germany
11:30 20mn Internal Stress State Measurements of the Large Molded Electronic Control Units
Corresponding Author: Gromala Przemyslaw – Robert Bosch GmbH
Gromala P.  1, Fischer S. 1, Zoller T. 1, Andeescu A. 1, Duerr J. 1, Rapp M.  1, Wilde J. 2
1 Robert Bosch GmbH
2 IMTEK, University of Freiburg
11:50 20mn Mechanically relevant chemical shrinkage of moulding compounds
Corresponding Author: Micaela Sousa – Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
M.F. Sousa 1, O. Hölck 1, T. Braun 1, J. Bauer 1, H. Walter 1, O. Wittler 1, K.D. Lang 2
1 Fraunhofer IZM Berlin
2 Technische Universität Berlin
12:10 20mn Stress and wafer warpage analysis of GaN thin film induced by transfer bonding process on 200mm Si substrate
Corresponding Author: Melina Lofrano – imec
Melina Lofrano, Nga Pham, Maarten Rosmeulen, Philippe Soussan, imec
12:30 20mn Thermal Improvement of Die Attach by using PDMS-grafted particles as filler and Its Application in Solid State Lighting
Corresponding Author: Kai Zhang – The Hong Kong University of Science and Technology
Kai Zhang 1, Xinfeng Zhang 1, Zhibo Chen 1, Hongye Sun 1, Matthew Yuen 1, Min Zhang 1, Cheuk Yan Chan 2, Yuhua Lee 2, Lisa Liu 2, Sean Ho 2, Guoqi Zhang 3
1 Department of Mechanical Engineering, The Hong Kong University of Science and Technology
2 Philips (China) Investment Co., Ltd
3 Philips Lighting


Session 21 11:00 Wednesday Apr 17 2013
Solid State Lighting
Chairman: Willem van Driel, Xuejun Fan
11:00 30mn Keynote presentation – OLED/textile integration: Virtual prototyping by a design sensitivity analysis
Corresponding Author: Jeroen van den Brand – TNO Science and Industry
M. Erinc 1, C.G. van der Sman 2, J.P.M. Hoefnagels 2, J. van den Brand 3, K. Pacheco-Morillo 3, M. de Kok 3
1 TNO Science and Industry, Materials for Integrated Products, Eindhoven, The Netherlands
2 Eindhoven University of Technology, Department of Mechanical Engineering, Materials Technology, Eindhoven, The Netherlands
3 Holst Centre/TNO, HTC31, Eindhoven, The Netherlands
11:30 20mn Optical design of micro-fabricated light reflector for 3D multi chip LED module
Corresponding Author: Stanley Y Y Leung, Lei Zhong, Jia Wei, Cell K Y Wong, Cadmus C A Yuan, G Q Zha – State Key Laboratory of Solid State Lighting
Stanley Y Y Leung 1, Lei Zhong 1, Jia Wei 2, Zhenlei Xu 3, Cadmus C A Yuan 4, G Q Zhang 5
1 State Key Laboratory of Solid State Lighting, Changzhou, 213161, China
2 State Key Laboratory of Solid State Lighting, Changzhou, 213161, China, and Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology, Delft, the Netherlands
3 Unilumin Group Co., Ltd., Baoan, Shenzhen, 518103, China
4 Research and Development Center for Semiconductor Lighting, Institute of Semiconductors, Chinese Academy of Sciences, Haidian, Beijing, 100086, China, and State Key Laboratory of Solid-State Lighting, Haidian, Beijing, 100086, China
5 Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology, Delft, the Netherlands
11:50 20mn Geometric Optimization of High Performance Interconnect of Rigid/Flexible/Rigid Substrate for Wafer Level Packaging in Solid State Lighting Applications by numerical simulations
Corresponding Author: Pan Liu – Delft University of Technology
P. Liu 1, J. Zhang 1, R. Sokolovskij 1, H.W. van Zeijl 1, B. Mimoun 1, G.Q. Zhang 2
1 Delft University of Technology, DIMES Research Center, Delft, the Netherlands
2 Delft University of Technology, DIMES Research Center, Delft, the Netherlands; Philips Lighting, Eindhoven, the Netherlands
12:10 20mn Product Level Accelerated Lifetime Test for Indoor LED Luminaires
Corresponding Author: Sau Koh – Delft Institute of Microsystems and Nanoelectronics (Dimes)
Sau Koh 1, Cadmus Yuan 2, Bo Sun 3, Bob Li 2, Xuejun Fan 4, G.Q. Zhang 5
1 Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, The Netherlands; Beijing Research Center, Delft University of Technology, Beijing, China; State Key Laboratory of Solid-State Lighting, Beijing, China
2 State Key Laboratory of Solid-State Lighting, Beijing, China
3 Beijing Research Center, Delft University of Technology, Beijing, China
4 Department of Mechanical Engineering, Lamar University, Beaumont, USA
5 Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, The Netherlands
12:30 20mn Wire bonding lifetime prediction of LED packages using numerical analysis
Corresponding Author: Sung-Uk Zhang – Samsung Electronics
Sung-Uk Zhang, Samsung Electronics, Korea


Session 22 14:00 Wednesday Apr 17 2013
Advances in Modeling and Testing II
Chairman: Abhijit Dasgupta, Michael Guyenot
14:00 30mn Keynote presentation – Molecular Dynamics Simulations for Mechanical Characterization of CNT/Gold Interface and its Bonding Strength
Corresponding Author: Steffen Hartmann – University of Technology Chemnitz
Steffen Hartmann 1, Ole Hoelck 2, Bernhard Wunderle 1
1 University of Technology Chemnitz
2 Fraunhofer IZM Berlin
14:30 30mn Keynote presentation – Reduced Order Modeling Enables System Level Simulation of a MEMS Piezoelectric Energy Harvester with a Self-Supplied SSHI-Scheme
Corresponding Author: Fatma Shabaan Sharkawi Sayed – Institute for Microsystems Engineering, IMTEK, Freiburg University
F. Sayed 1, T. Aftab 1, M. Eker 2, D. Hohlfeld 2, T. Bechtold 1, J. G. Korvink 3
1 Institute for Microsystems Engineering, Freiburg University, Germany
2 Reutlingen University, Germany
3 Institute for Microsystems Engineering & Freiburg Institute of Advanced Studies, Freiburg University, Germany
15:00 30mn Keynote presentation – Multiscale FE Modeling Concepts applied to Microelectronic Device Simulations
Corresponding Author: Helmut Köck – KAI GmbH
Helmut Köck 1, Stefano de Filippis 1, Michael Nelhiebel 2, Michael Glavanovics 1, Manfred Kaltenbacher 3
1 Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, Villach, Austria
2 Infineon Technologies Austria AG, Villach, Austria
3 Vienna University of Technology, Institute of Mechanics and Mechatronics, Vienna, Austria


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