EuroSimE 2010 was locally organised by IMS Lab of Bordeaux University (Hélène Frémont, Geneviève Duchamp) in Hotel Mercure Cité Mondiale, Bordeaux, France, in April 2010.
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The 11th EuroSimE was attended by 155 individuals. 3 training courses were offered on Sunday. The software exhibition brought together 2 exhibitors (Simulia and Insidix). |
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Proceedings of EuroSimE 2010 CD-ROM full version: IEEE Catalog number CFP10566-CDR Booklet of extended abstracts |
This was the technical programme of EuroSimE 2010:
Go to Global conference schedule List of Technical Sessions Technical program List of sessions by Authors
| Day 1 – Monday 26 Apr 2010 | |||
| 08.00 | Registration desk open | ||
| 09.00 | OPENING SESSION by the General Chair | ||
| 09.09 | INDUSTRIAL TRENDS KEYNOTE SESSION Chairman G.Q. Zhang, Philips Lighting | ||
| 09.10 | State-of-the-art of Heterogeneous System Integration, Phys. Rolf Aschenbrenner, Fraunhofer Institute IZM, Berlin, Germany | ||
| 09.40 | The Future of Nanoelectronics, Dr. Heike Riel, IBM Research GmbH, Zurich Research Laboratory, Switzerland | ||
| 10.10 | The new technology landscape of solid state lighting, Prof. Dr. G.Q. (Kouchi) Zhang, Philips Lighting, Eindhoven, The Netherlands | ||
| 10.40 | Break | ||
| 11:10 | S. 1 New Developments in Modeling | ||
| 12.40 | Lunch. EuroSimE Committee meeting [1] | ||
| 14:00 | S. 2 Experimental Investigations | S. 3 Modelling of MEMS Devices I | S. 4 Thermal Modelling and Characterization |
| 15.50 | Coffee break | ||
| 16:20 | S. 5 Damage and Failure | S. 6 Innovative Methods for Microsystems Modelling I | S. 7 Electrothermal Modeling and Characterization |
| 18.00 | Transport by bus to Château Le Thil | ||
| 19.00 | Wine tasting, dinner in Château Le Thil | ||
| Day 2 – Tuesday 27 Apr 2010 | |||
| 08:00 | EuroSimE Committee meeting [2](breakfast) | ||
| 09:00 | S. 8 Flexible Electronics | S. 9 Innovative Methods for Microsystems Modelling II | S. 10 Thermal-Fluid Behavior Modeling and Characterization |
| 10.10 | Break | ||
| 11:00 | S. 11 Thermo-Mechanical Issues in Microelectronics | S. 12 Multi-Physics Issues in Microelectronics | |
| 12.20 | Lunch | ||
| 13:30 | S. 13 Thermo-Mechanical Modeling I | S. 14 Modelling of MEMS devices II | S. 15 Molecular Modeling |
| 15.20 | Break | ||
| 16:00 | S. 16 Dynamic Problems | S. 17 Multi-Physics Modelling for Power Electronics Devices | S. 18 Modeling for Advanced Packaging |
| 18.00 | Reception at the venue | ||
| Day 3 – Wednesday 28 Apr 2010 | |||
| 09:00 | S. 19 Progress in Thermo-mechanical design and Thermal Performance Enhancement | ||
| 10.30 | Break | ||
| 11:00 | S. 20 Reliability Modeling | S. 21 Process Modelling | S. 22 Thermo-Mechanical Modeling II |
| 12.50 | Lunch | ||
| 14:00 | S. 23 Modeling Challenges in Thermal and Multiphysics Applications | ||
| 15.30 | End of conference | ||
Go to Global conference schedule List of Technical Sessions Technical program List of sessions by Authors
List of Technical Sessions
S-1 New Developments in Modeling
S-2 Experimental Investigations
S-3 Modelling of MEMS Devices I
S-4 Thermal Modelling and Characterization
S-5 Damage and Failure
S-6 Innovative Methods for Microsystems Modelling I
S-7 Electrothermal Modeling and Characterization
S-8 Flexible Electronics
S-9 Innovative Methods for Microsystems Modelling II
S-10 Thermal-Fluid Behavior Modeling and Characterization
S-11 Thermo-Mechanical Issues in Microelectronics
S-12 Multi-Physics Issues in Microelectronics
S-13 Thermo-Mechanical Modeling I
S-14 Modelling of MEMS devices II
S-15 Molecular Modeling
S-16 Dynamic Problems
S-17 Multi-Physics Modelling for Power Electronics Devices
S-18 Modeling for Advanced Packaging
S-19 Progress in Thermo-mechanical design and Thermal Performance Enhancement
S-20 Reliability Modeling
S-21 Process Modelling
S-22 Thermo-Mechanical Modeling II
S-23 Modeling Challenges in Thermal and Multiphysics Applications
Go to Global conference schedule List of Technical Sessions Technical program List of sessions by Authors
| 08.00 | Registration desk open |
| 09.00 | OPENING SESSION by the General Chair |
| 09.09 | INDUSTRIAL TRENDS KEYNOTE SESSION Chairman G.Q. Zhang, Philips Lighting |
| 09.10 | State-of-the-art of Heterogeneous System Integration, Phys. Rolf Aschenbrenner, Fraunhofer Institute IZM, Berlin, Germany |
| 09.40 | The Future of Nanoelectronics, Dr. Heike Riel, IBM Research GmbH, Zurich Research Laboratory, Switzerland |
| 10.10 | The new technology landscape of solid state lighting, Prof. Dr. G.Q. (Kouchi) Zhang, Philips Lighting, Eindhoven, The Netherlands |
| 10.40 | Break |
| Session 1 | 11:10 | Monday 26 Apr 2010 | |
| New Developments in Modeling Chaired by L.J. Ernst, Delft University of Technology |
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| 11:10 | 30mn | Keynote presentation – Wafer Level Packaging (WLP): Fan-in, Fan-out and Three-Dimensional Integration Xuejun Fan, Lamar University, Texas, USA |
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| 11:40 | 30mn | Keynote presentation – Jets and Rotary Flows for Single-Phase Liquid Cooling: An Overview of Some Recent Experimental Findings Punch, J., Walsh, E., Grimes, R., Jeffers, N., Kearney, D., CTVR, Stokes Institute, University of Limerick, Ireland |
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| 12:10 | 30mn | Keynote presentation – Development of an elaborate simulation tool for electrochemical failures in microelectronic packages M. van Soestbergen 1, R.T.H. Rongen 2, K.M.B. Jansen 3, W.D. van Driel 3 1 Materials Innovation Institute, Delft, the Netherlands 2 NXP Semiconductors, Nijmegen, the Netherlands 3 Delft University of Technology, Fundamentals of Microsystems Engineering, Delft, the Netherlands |
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| 12.40 | Lunch. EuroSimE Committee meeting [1] |
| Session 2 | 14:00 | Monday 26 Apr 2010 | |
| Experimental Investigations Chaired by Sven Rzepka, Fraunhofer Institute ENAS ; Hélène Frémont, IMS-Bordeaux |
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| 14:00 | 30mn | Keynote presentation – Toward Comprehensive Reliability Testing of Electronic Component Boards Toni. T. Mattila, M. Paulasto-Kröckel, Aalto University, School of Science and Technology |
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| 14:30 | 20mn | Theoretical Analyses on the Shear Test Rainer Dudek 1, Ralf Doering 1, Kerstin Kreyssig 2, Bernd Michel 1 1 Fraunhofer ENAS, Micro Materials Center Berlin and Chemnitz 2 CWM GmbH, Chemnitz |
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| 14:50 | 20mn | Measuring time-dependent mechanics in metallic MEMS Bergers, L.I.J.C., Delhey, N.K.R., Hoefnagels, J.P.M., Geers, M.G.D., Eindhoven University of Technology, Dep. of Mechanical Engineering |
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| 15:10 | 20mn | Interfacial Strength of Silicon-to-Molding Compound Changes with Thermal Residual Stress Gerd Schlottig 1, An Xiao 2, Heinz Pape 3, Bernhard Wunderle 4, Leo J. Ernst 2 1 Infineon Technologies AG, Munich; Fraunhofer IZM, Berlin, Germany; TU-Delft, Delft, The Netherlands 2 TU-Delft, Delft, The Netherlands 3 Infineon Technologies AG, Munich, Germany 4 Fraunhofer IZM, Berlin; TU Chemnitz, Chemnitz, Germany |
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| 15:30 | 20mn | Local stress analysis in devices by FIB René Kregting 1, Sander Gielen 1, Willem van Driel 2, Paul Alkemade 3, Hozan Miro 3, Jan-Dirk Kamminga 4 1 TNO Science & Industry, Eindhoven, The Netherlands 2 NXP Semiconductors, Nijmegen, The Netherlands; Delft University of Technology, Delft, The Netherlands 3 Delft University of Technology, Delft, The Netherlands 4 M2i Materials innovation institute, Delft, The Netherlands |
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| Session 3 | 14:00 | Monday 26 Apr 2010 | |
| Modelling of MEMS Devices I Chaired by Yong Liu, Fairchild Semiconductor; Willem van Driel, Philips Lighting |
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| 14:00 | 30mn | Keynote presentation – AN ON-CHIP EXPERIMENTAL ASSESSMENT OF CASIMIR FORCE EFFECT IN MICRO-ELECTROMECHANICAL SYSTEMS R. Ardito, A. Frangi, B. de Masi, A. Corigliano, Politecnico di Milano, Italy |
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| 14:30 | 20mn | MEMS resonator temperature compensation F. Casset 1, C. Durand 2, Y. Civet 3, E. Ollier 1, JF. Carpentier 2, P. Ancey 2, P. Robert 1 1 CEA, LETI, MINATEC, Grenoble, France 2 ST, Crolles, France 3 TIMA, Grenoble, France |
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| 14:50 | 20mn | Failure Modes of Wafer Level Thin Film MEMS Packages During Wafer Thinning J.J.M. Zaal, W.D. van Driel, G.Q. Zhang, Delft University of Technology |
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| 15:10 | 20mn | Prediction of stiction in Microswitch Systems Ling WU, V. ROCHUS, L. NOELS, J.C. GOLINVAL, University of Liege, Liège, Belgium |
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| 15:30 | 20mn | FINITE ELEMENT MODELLING OF ADHESION PHENOMENA IN MEMS Raffaele Ardito, Alberto Corigliano, Attilio Frangi, Politecnico di Milano, Milan, Italy |
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| Session 4 | 14:00 | Monday 26 Apr 2010 | |
| Thermal Modelling and Characterization Chaired by Jeff Punch, Stokes Institute; Peter Rodgers, The Petroleum Institute |
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| 14:00 | 30mn | Keynote presentation – Simulation-based analysis of the heat-affected zone during target preparation by pulsed-laser ablation through stacked silicon dies in 3D integrated System-in-Packages Stefan Martens 1, Markus Fink 1, Walter Mack 1, Friedemann Voelklein 2, Juergen Wilde 3 1 Infineon Technologies AG, Regensburg, Germany 2 RheinMain University of Applied Sciences, IMtech, Institute of Microtechnologies, Ruesselsheim, Germany 3 Laboratory for Assembly and Packaging, IMTEK, Department of Microsystems Engineering, University of Freiburg, Germany |
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| 14:30 | 20mn | Fabrication of Freestanding Thin Pt/W Thermocouple by Joule Heat Welding Hironori Tohmyoh, Hironao Takeda, Mohammed N. I. Khan, Masumi Saka, Tohoku University |
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| 14:50 | 20mn | Light Degradation Prediction of High Power Light Emitting Diode Lighting Modules Yen-Fu Su, Shin-Yueh Yang, Wei-Hao Chi, Kuo-Ning Chiang, Dept. of Power Mechanical Engineering, National Tsing Hua University, HsinChu, Taiwan |
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| 15:10 | 20mn | Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation A. Corfa, A. Gasse, S. Bernabé, H. Ribot, CEA LETI MINATEC, France |
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| 15:30 | 20mn | Thermal Modelling of the Emerging Multi-Chip Packages Eric Monier-Vinard, Valentin Bissuel, Paul Murphy, Olivier Daniel, Julien Dufrenne, Thales Corporate Services, Meudon, France |
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| 15.50 | Coffee break |
| Session 5 | 16:20 | Monday 26 Apr 2010 | |
| Damage and Failure Chaired by Toni Mattila, Aalto University ; Rainer Dudek, Fraunhofer Institute ENAS |
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| 16:20 | 30mn | Keynote presentation – Detailed Investigation on the Creep Damage Accumulation of Lead-free Solder Joints under Accelerated Temperature Cycling Y. S. Chan, S. W. Ricky Lee, Center for Advanced Microsystems Packaging, HKUST, Hong-Kong |
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| 16:50 | 20mn | Crack and Damage in low-k BEoL Stacks under Assembly and CPI Aspects Juergen Auersperg 1, Dietmar Vogel 2, Matthias U. Lehr 3, Michael Grillberger 3, Bernd Michel 2 1 Fraunhofer ENAS Chemnitz and AMIC GmbH Berlin 2 Fraunhofer ENAS Chemnitz and Fraunhofer IZM Berlin 3 GLOBALFOUNDRIES Dresden Module One LLC & Co. KG |
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| 17:10 | 20mn | Moisture Diffusion Modeling and Application in a 3D RF Module Subject to Moisture Absorption and Desorption Loads Liping Zhu, Dean Monthei, Gene Lambird, Wally Holgado, TriQuint Semiconductor, USA |
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| 17:30 | 20mn | Numerical-experimental analysis of combined bulk and interface fracture in a leadless package Sander Noijen 1, Sven Walczyk 2, Roelf Groenhuis 2, Olaf van der Sluis 1 1 Philips Applied Technologies, Eindhoven, The Netherlands 2 NXP Semiconductors, Nijmegen, The Netherlands |
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| Session 6 | 16:20 | Monday 26 Apr 2010 | |
| Innovative Methods for Microsystems Modelling I Chaired by Bart Vandevelde, IMEC; Véronique Rochus, University of Liège |
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| 16:20 | 30mn | Keynote presentation – A Comparison of Model Order Reduction Methods used in different FE Software Tools M. Jungwirth, D. Hofinger, H. Weinzierl, FH OÖ – Upper Austria University of Applied Sciences, Wels, Austria |
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| 16:50 | 20mn | A linear analysis to overcome the numerical Cherenkov instability Franck Assous, Ariel University Center & Bar-Ilan University, Israel Jacques Segre, CEA-Saclay, DEN/DM2S/SFME, France |
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| 17:10 | 20mn | Thermomechanical simulation of BCB membrane thin-film package Seonho Seok 1, Nathalie Rolland 1, Paul-Alain Rolland 1, Siebe Bouwstra 2 1 IEMN / IRCICA / CNRS, France 2 MEMS TC, Amsterdam, The Netherlands |
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| 17:30 | 20mn | Mechanism analyses on PBGA strip packaging warpage In Soo Park 1, Jooho Choi 2, Jin Hyuk Gang 2 1 Doosan Corporation Electro-materials, Korea 2 Korea Aerospace University, Korea |
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| Session 7 | 16:20 | Monday 26 Apr 2010 | |
| Electrothermal Modeling and Characterization Chaired by Sheng Liu, China Huazhong University of Science & Technology; Christopher Bailey, University of Greenwich |
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| 16:20 | 30mn | Keynote presentation – New Methodology on Electro-Thermal Characterization and Modeling of Large Power Drivers using Lateral PNP BJTs J. Rhayem 1, A.Vrbicky 1, R. Blecic 2, P. Malena 3, S. Bychikhin 4, D. Pogany 4, A. Wieers 5, A. Baric 2, M. Tack 5 1 ONSEMI, Bratislava, Slovakia 2 University of Zagreb, Zagreb, Croatia 3 ONSEMI, Brno, Czech 4 Institute for Solid State Electronics, Vienna, Austria 5 ONSEMI, Oudenaarde, Belgium |
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| 16:50 | 20mn | Electromagnetic and Thermal investigations of RF Devices A. ALNUKARI 1, P.GUILLEMET 2, Y.SCUDELLER 2, S.TOUTAIN 1 1 University of Nantes, Ecole Polytechnique, IREENA, France 2 University of Nantes, Ecole Polytechnique, LGMPA, France |
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| 18.00 | Transport by bus to Château Le Thil |
| 19.00 | Wine tasting, dinner in Château Le Thil |
| 08:00 | EuroSimE Committee meeting [2](breakfast) |
| Session 8 | 09:00 | Tuesday 27 Apr 2010 | |
| Flexible Electronics Chaired by Daoguo Yang, NXP Semiconductors / Guilin University ; Michel Brizoux, Thales Corporate Services |
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| 09:00 | 30mn | Keynote presentation – Thermo-Mechanical Analysis of Flexible and Stretchable Systems Mario Gonzalez 1, Bart Vandevelde 1, Wim Christiaens 2, Yung-Yu Hsu 1, François Iker 1, Frederick Bossuyt 1, Jan Vanfleteren 1, Olaf van der Sluis 3, P.H.M. Timmermans 3 1 IMEC, Leuven, Belgium 2 Ghent University, Belgium 3 Philips Applied Technologies, The Netherlands |
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| 09:30 | 20mn | Flexible Circuits with Embedded Resistors Subjected to Extreme Thermal Loading Conditions Using the Shadow Moiré and FEM Measurements Techniques Luciano Arruda 1, Luanda Marinho 2, Edson Silva 1, Willy Machado 2 1 Instituto Nokia de Tecnologia 2 Universidade Estadual do Amazonas |
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| 09:50 | 20mn | Modeling the residual shrinkage during lithographic processing on flexible polymer substrates M. Barink, D. van den Berg, I. Yakimets, E. Meinders, TNO/Holst Centre |
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| Session 9 | 09:00 | Tuesday 27 Apr 2010 | |
| Innovative Methods for Microsystems Modelling II Chaired by Dag Anderson, IVF ; Alberto Corigliano, Politecnico di Milano |
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| 09:00 | 30mn | Keynote presentation – Exemplified calculation of stress migration in a 90nm node via structure Kirsten Weide-Zaage, Information Technology Laboratory, Leibniz University Hannover |
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| 09:30 | 20mn | Multiple Environment Overstress Testing and Modelling of Solar Cells E.P. Veninga, A.W.J. Gielen, TNO Science and Industry, Eindhoven, The Netherlands |
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| 09:50 | 20mn | Response of an Electrostatically Actuated Microbeam to Drop-Table Test H. Ouakad, M. I. Younis, F. Alsaleem, T. Levo, J. Pitarresi, State University of New York at Binghamton, USA |
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| Session 10 | 09:00 | Tuesday 27 Apr 2010 | |
| Thermal-Fluid Behavior Modeling and Characterization Chaired by Peter Rodgers, The Petroleum Institute, UAE |
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| 09:00 | 30mn | Keynote presentation – Analysis of the performance reduction of axial fans in close proximity to EMC screens Raúl Antón, Asier Bengoechea, Yunesky Masip, Alejandro Rivas, Juan Carlos Ramos, Gorka S. Larraona, TECNUN-University of Navarra, Spain |
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| 09:30 | 20mn | CFD Assisted Design Evaluation and Experimental Verification of a Logic-Controlled Local PCB Heater for Humidity Management in Electronics Enclosure Ilja Belov 1, Mats Lindgren 2, Jan Ryden 3, Zahra Alavizadeh 1, Peter Leisner 2 1 School of Engineering, Jönköping University, Jönköping, Sweden 2 SP Technical Research Institute of Sweden, Borås, Sweden 3 Saab Microwave Systems, Göteborg, Sweden |
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| 09:50 | 20mn | Bond Wire Design for eXtreme Switch Devices Torsten Hauck, Anton Kolbeck, Freescale Semiconductor Germany |
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| 10.10 | Break |
| Session 11 | 11:00 | Tuesday 27 Apr 2010 | |
| Thermo-Mechanical Issues in Microelectronics Chaired by Kaspar Jansen, Delft University ; Heinz Pape, Infineon Technologies |
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| Principles for Simulation of Barrier Cracking due to high Stress Johar Ciptokusumo 1, Kirsten Weide-Zaage 1, Oliver Aubel 2 1 Leibniz Universitaet Hannover, Laboratorium fuer Informationstechnologie 2 GLOBALFOUNDRIES Incorporated |
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| Aging Effects of Epoxy Moulding Compound on the Long-Term Stability of Plastic Package Eric Nguegang 1, Jochen Franz 1, André Kretschmann 1, Hermann Sandmaier 2 1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany 2 University of Stuttgart, Lehrstuhl Mikrosystemtechnik, Stuttgart, Germany |
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| Evaluating the Effect of Shock Absorber Layers in the Dynamic Behavior of PWB with Viscoelastic Insert Cleber Pagliosa, Joao Morais da Silva Neto, Nokia Institute of Technology, Manaus, Brazil |
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| Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board Wilson Carlos Maia Filho, Michel Brizoux, Arnaud Grivon, Thales Corporate Services, France |
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| Design of Al Pad Geometry for Reducing Current Crowding Effect in Flip-chip Solder Joint Using Finite-element Analysis Y. W. Chang, Chih Chen, Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan, ROC |
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| Efficiency and robustness of some behavior laws in the description of viscoplastic deformation and degradation of solder materials Sabeur MSOLLI, Adrien ZÈANH, Olivier DALVERNY, Moussa KARAMA, Université de Toulouse ; INP/ENIT ; LGP ; Tarbes, France |
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| Thermomechanical characterization of electronic components Sana Ben KHLIFA 1, Napo BONFOH 1, Paul LIPINSKI 1, Manuel FENDLER 2, Stéphane BERNABE 2, Hervé RIBOT 2 1 Laboratoire de mécanique Biomécanique Polymère Structures (LaBPS), Ecole Nationale d’Ingénieurs de Metz (ENIM) ,Metz,France. 2 Laboratoire d’Electronique et des Technologies de l’Information, CEA / LETI-MINATEC, Grenoble,France. |
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| Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality E. Spaan 1, E. Ooms 1, W.D. van Driel 2, C.A. Yuan 1, D.G. Yang 3, G.Q. Zhang 4 1 NXP Semiconductors, Nijmegen, The Netherlands 2 NXP Semiconductors, Nijmegen; Delft University of Technology, Delft, The Netherlands 3 NXP Semiconductors, Nijmegen, The Netherlands; Guilin University, Guilin, China 4 Delft University of Technology, Delft; Phillips Lighting, Eindhoven, The Netherlands |
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| Thermo-mechanical simulations of LTCC packages for RF MEMS applications J. Lenkkeri 1, E. Juntunen 1, M. Lahti 1, S. Bouwstra 2 1 VTT Technical Research Centre of Finland, Oulu, Finland 2 MEMS TC, Amsterdam, The Netherlands |
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| GaAs-Based Laser Diode Bonding-Induced Stress Investigation By Means Of Simulation And Degree Of Polarization Of The Photoluminescence Measurements Julien LeClec’H 1, Daniel T. Cassidy 2, Michel Biet 1, François Laruelle 1, Mauro Bettiati 1, Jean-Pierre Landesman 3 1 3S Photonics, Nozay, France 2 McMaster University, Hamilton, Canada 3 Université de Nantes, France |
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| Mechanical and Thermal Simulations of a Microactuator for the Stimulation of the Perilymph T. Creutzburg, H.H. Gatzen, Leibniz Universität Hannover – Institute for Microtechnology, Garbsen, Germany |
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| Thermomechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array) : Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability CHAILLOT A. 1, MUNIER C. 1, MAIRE O. 1, VIGIER M. 2, CHASTANET C. 2 1 EADS Innovation Works, France 2 Airbus, Suresnes, France |
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| Influence of PCB design and materials on chip solder joint reliability Berthou Matthieu 1, Hélène Frémont 2, Alexandrine Gracia 2, C.Jéphos-Davennel 3 1 MBDA France, IMS Bordeaux, DGA CELAR, France 2 IMS Bordeaux, Université Bordeaux 1, France 3 DGA CELAR, Rennes, France |
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| Measurement of Viskoelastic Material Properties of Adhesives for SHM Sensors Under Harsh Environmental Conditions Boehme, B. 1, Roellig, M. 2, Wolter, K.-J. 1 1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany 2 Fraunhofer-Institut for Non-destructive Testing, Dresden, Germany |
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| Application of Numerical Optimization Algorithms Used to Investigation of Thin Films in Nanoindentation Test Lukasz Dowhan 1, Artur Wymyslowski 1, Olaf Wittler 2, Raul Mroßko 2 1 Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Poland 2 Fraunhofer IZM, Micro Materials Center, Germany |
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| Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates Karsten Meier 1, Mike Roellig 2, Steffen Wiese 3, Klaus-Jürgen Wolter 1 1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany 2 Fraunhofer Institute for Non-Destructive Testing (IZFP-D), Dresden, Germany 3 Fraunhofer Center for Silicon-Photovoltaics (CSP), Halle, Germany |
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| The study of carbon nanotube’s length in reference to its thermal conductivity by molecular dynamics approach Bartosz Platek, Tomasz Falat, Jan Felba, Artur Borzdun, Wroclaw University of Technology, Faculty of Microsystems Electronics and Photonics, Laboratory for Interconnecting and Packaging Electronic Circuits, Poland |
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| Vibration Reliability of SMD Pb-free Solder Joints Mario Borras 1, Olivier Lanier 1, Roumen Ratchev 1, Michael Guyenot 1, Daniel Coutellier 2 1 Robert Bosch GmbH, Corporate Research CR/APJ3, Schwieberdingen, Germany 2 LAMIH, UMR CNRS 8530, Université de Valenciennes, Valenciennes, France |
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| Development of fast and easy methods for measuring the Young’s Modulus of molding compounds for IC packages Daniel Vanderstraeten 1, Andrej Ivankovic 1, Kris Vanstreels 2, Guy Brizar 1, Renaud Gillon 1, Eddy Blansaer 1, Bart Vandevelde 2 1 ON Semiconductor, Oudenaarde, Belgium 2 IMEC, Leuven, Belgium |
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| Vibration Durability of Pb-free HVQFN Assemblies C. Choi 1, M. Al-Bassyiouni 1, A. Dasgupta 1, J. W. C. de Vries 2, W. Balemans 2, W. van Driel 3 1 CALCE Center, University of Maryland 2 Philips Applied Technologies 3 Philips Lighting |
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| Interconnection Technologies for Photovoltaic Modules – Analysis of technological and mechanical Problems Steffen Wiese 1, Frank Kraemer 1, Norbert Betzl 2, Dietmar Wald 2 1 Fraunhofer CSP, Halle, Germany 2 SOLARWATT AG, Dresden, Germany |
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| A Case Study of Networked Sensors by Simulations and Experiments Cheng Guo, Martin Jacobsson, R. Venkatesha Prasad, Delft University of Technology |
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| Sintering, in Different Temperatures, of Traces of Silver Printed in Flexible Surfaces Mancosu, R. D., Quintero, J, A, Q., Azevedo, R. E. S., Nokia Institute of Technology – INdT, Manaus, Brazil |
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| Thermo-mechanical simulations in double-sided heat transfer power assemblies E. Woirgard 1, I. Favre 1, JY Deletage 1, S. Azzopardi 1, R. Leon 2, G. Convenant 2, Z. Khatir 3 1 Université de Bordeaux I,Talence, France 2 Valeo-CEE, Montigny-le-Bretonneux, France 3 Inrets, Versailles, France |
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| Numerical Simulations of Thermo-Mechanical Stresses during the Casting of Multi-Crystalline Silicon Ingots M. Oswald, M. Turek, J. Bagdahn, Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany |
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| Session 12 | 11:00 | Tuesday 27 Apr 2010 | |
| Multi-Physics Issues in Microelectronics Chaired by Kaspar Jansen, Delft University ; Heinz Pape, Infineon Technologies |
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| Virtual prototyping of PoP interconnections regarding electrically activated mechanisms Lutz Meinshausen 1, Kirsten Weide-Zaage 1, Hélène Frémont 2, Wei Feng 2 1 Laboratorium für Informationstechnologie, University Hannover, Germany 2 Laboratoire IMS, CNRS UMR 5218, ENSEIRB, Université Bordeaux I, France |
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| Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test Fei Liu 1, Qiang Wang 1, Lihua Liang 1, Yong Liu 2 1 Zhejiang University of Technology, Fairchild-ZJUT Microelectronic Packaging Joint Lab, Hangzhou, China 2 Fairchild Semiconductor, S. Portland, Maine, USA |
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| Control of a Cantilever Array by Periodic Networks of Resistances Hui HUI 1, Youssef YAKOUBI 2, Michel LENCZNER 1, Nicolas RATIER 1 1 FEMTO-ST, Département Temps-Fréquences Université de Franche-Comté, Besaçon, France 2 Laboratoire Jacques-Louis Lions, Université Pierre et Marie Curie, Paris, France |
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| Numerical Approach to Multiscale Evaluation and Analysis of Tg of Crosslinked Polymers Sebastian J. Tesarski 1, Ole Hölck 2, Artur Wymyslowski 1 1 Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland 2 Fraunhofer Institut Zuverlässigkeit und Mikrointegration, Volmerstr. 9B, 12489 Berlin, Germany |
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| Comparison and characterization of a typical strain gage trace against another using the printed method Quintero, Jairo Alonso Quintero, Mancosu, Rafael Drumond, Nokia Institute of Technology – INdT, Manaus, Brazil |
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| Large Deformation of Beam Columns – a Closed Form Solution and Design Guide for Vertical Buckling Probe Needles Torsten Hauck, Freescale Semiconductor Germany Wolfgang H. Müller, Technische Universität Berlin |
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| A New Iterative Algorithm For The Solution For The Load Deflection Square Membranes Youssef Hicham 1, André Ferrand 2, Patrick Pons 1, Robert Plana 1 1 LAAS CNRS, Toulouse, France 2 LAAS CNRS, ICA-MSEM, Toulouse, France |
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| 12.20 | Lunch |
| Session 13 | 13:30 | Tuesday 27 Apr 2010 | |
| Thermo-Mechanical Modeling I Chaired by Ricky Lee, HKUST ; Ahmer Syed, Amkor Technology |
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| 13:30 | 30mn | Keynote presentation – Simulation of Drop Testing at Extremely High Accelerations Stuart Douglas, M. Al-Bassyiouni, A. Dasgupta, CALCE Center, University of Maryland |
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| 14:00 | 20mn | Numerical investigations of the strain behavior in nanoscale patterned strained silicon structures F. Naumann 1, O. Moutanabbir 2, M. Reiche 2, C. Schriever 3, J. Schilling 3, M. Petzold 1 1 Fraunhofer Institute for Mechanics of Materials, Halle, Germany 2 Max Planck Institute of Microstructure Physics, Halle, Germany 3 ZIK |
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| 14:20 | 20mn | Virtual Thermo-Mechanical Prototyping for High-Temperature-Application Microelectronics Daoguo Yang 1, W. D. van Driel 2, Huib Scholten 2, L. Goumans 2, R. Faria 2 1 Guilin University of Electronics Technology, China 2 NXP Semiconductors, Nijmegen, the Netherlands |
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| 14:40 | 20mn | Multi-scale Viscoplastic Modeling of Pb-free Sn3.0Ag0.5Cu Solder Interconnects Gayatri Cuddalorepatta, Abhijit Dasgupta, CALCE Electronic Products and Systems Center, University of Maryland, USA |
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| Session 14 | 13:30 | Tuesday 27 Apr 2010 | |
| Modelling of MEMS devices II Chaired by Xavier Chauffleur, Epsilon Ingénierie ; Attilio Frangi, Politecnico di Milano |
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| 13:30 | 30mn | Keynote presentation – FEM assisted Development of a SHM-Piezo-Package for Damage Evaluation in Airplane Components Mike Roellig 1, Lars Schubert 1, Uwe Lieske 1, Bjoern Boehme 2, Bernd Frankenstein 1, Norbert Meyendorf 1 1 Fraunhofer Institute for Non-Destructive Testing 2 Dresden University of Technology |
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| 14:00 | 20mn | Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS Joseph Zekry 1, Bart Vandevelde 1, Siebe Bouwstra 2, Robert Puers 3, Chris Van Hoof 1, Harrie A.C. Tilmans 1 1 Imec, Leuven, Belgium 2 MEMS TC, Amsterdam, The Netherlands 3 K.U.Leuven, Belgium |
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| 14:20 | 20mn | Modeling the effects of printed circuit motion on the response of microstructures under mechanical shock Abdallah H Ramini, Mohammad I Younis, Ronald Miles, SUNY Binghamton |
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| 14:40 | 20mn | Global modelling and simulation of a Coriolis vibrating micro-gyroscope for quadrature error compensation Descharles Mélanie 1, Guérard Jean 1, Kokabi Hamid 2 1 ONERA, Chatillon, France 2 UPMC L2E, Ivry-sur-Seine, France |
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| Session 15 | 13:30 | Tuesday 27 Apr 2010 | |
| Molecular Modeling Chaired by Steffen Wiese, Fraunhofer CSP ; Xuejun Fan, Lamar University |
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| 13:30 | 30mn | Keynote presentation – Mechanical Properties of an Epoxy, Modeled Using Particle Dynamics as Parameterized through Molecular Modeling Nancy Iwamoto, Honeywell Specialty Materials, USA |
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| 14:00 | 20mn | Design of reliable Cu-epoxy interface using Molecular Dynamic Simulation Cell K Y Wong 1, H B Fan 2 2, G Q Zhang 1, Matthew M F Yuen 2 1 Faculty 3mE, Department PME Delft University of Technology 2 Department of Mechanical Engineering, Hong Kong University of Science and Technology |
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| 14:20 | 20mn | Molecular Modeling of Microelectronic Packaging Materials – Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface O. Hölck 1, E. Dermitzaki 1, B. Wunderle 2, J. Bauer 3, B. Michel 1 1 Micro Materials Center Berlin – Fraunhofer IZM, Berlin, Germany 2 TU Chemnitz, Chemnitz, Germany 3 SIIT – Fraunhofer IZM, Berlin, Germany |
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| 14:40 | 20mn | On the Mechanical Properties of Cu3Sn Intermetallic Compound through Molecular Dynamics Simulation and Nanoindentation Testing Wen-Hwa Chen 1, Hsien-Chie Cheng 2, Ching-Feng Yu 1 1 Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan 2 Department of Aerospace and Systems Engineering, Feng Chia University, Taiwan |
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| 15:00 | 20mn | Computational materials engineering: capabilities of atomic-scale prediction of mechanical, thermal, and electric properties of microelectronic materials A. Mavromaras 1, D. Rigby 2, W. Wolf 3, M. Christensen 1, M. Halls 2, C. Freeman 2, P. Saxe 4, E. Wimmer 5 1 Materials Design SARL, Stockholm, Sweden 2 Materials Design, Inc., San Diego, USA 3 Materials Design SARL, Vienna, Austria 4 Materials Design, Inc. Angel Fire, USA 5 Materials Design, Inc., Santa Fe, USA |
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| 15.20 | Break |
| Session 16 | 16:00 | Tuesday 27 Apr 2010 | |
| Dynamic Problems Chaired by Jürgen Auersperg, Fraunhofer ENAS / AMIC ; Mario Gonzalez, IMEC |
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| 16:00 | 30mn | Keynote presentation – Anomaly Detection and Fault-Mode Isolation for Prognostics Health Monitoring of Electronics Subjected to Drop and Shock Pradeep lall, Prashant Gupta, Arjun Angral, Auburn University, NSF Center for Advanced Vehicle and Extreme Environment Electronics (CAVE-3), USA |
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| 16:30 | 20mn | BGA Lifetime Prediction in JEDEC Drop Tests Accounting for Copper Trace Routing Effects Frank Kraemer 1, Steffen Wiese 1, Sven Rzepka 2, Jens Lienig 3 1 Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany 2 Fraunhofer ENAS, Micro Material Center Chemnitz & Berlin, Germany 3 Dresden University of Technology, Institute of Electromechanical and Electronic Design, Germany |
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| 16:50 | 20mn | Computer Simulation and Design of a Solder Joint Vibration Test Machine Elisha Kamara 1, Hua Lu 1, Chris Bailey 1, Chris Hunt 2, Davide Di Maio 2, Owen Thomas 2 1 School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom 2 National Physical Laboratory, London, United Kingdom |
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| 17:10 | 20mn | Optimization for Simulation of WL-CSP Subjected to Drop-Test with Plasticity Behavior C. Le Coq 1, A. Tougui 2, M.-P. Stempin 3, L. Barreau 3 1 LMR – STMicroelectronics, France 2 LMR, France 3 STMicroelectronics, France |
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| 17:30 | 20mn | High-Speed Mechanical Impact Reliability of Solder Interconnections in High-Power LEDs J. Hokka 1, J.F.J.M. Caers 2, X.J. Zhao 2, M. de Jong 3, W. Peels 3, B. Sykes 4, G.Q. Zhang 3, M. Paulasto-Kröckel 1 1 Aalto University School of Science and Technology, Espoo, Finland 2 Philips Applied Technologies, Eindhoven, The Netherlands 3 Philips Lighting, Eindhoven, The Netherlands 4 XYZTEC bv, Panningen, The Netherlands |
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| Session 17 | 16:00 | Tuesday 27 Apr 2010 | |
| Multi-Physics Modelling for Power Electronics Devices Chaired by Abhijit Dasgupta, University of Maryland ; Torsten Hauck, Freescale |
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| 16:00 | 30mn | Keynote presentation – Electro-thermo-mechanical simulation of automotive MOSFET transistor Xavier CHAUFFLEUR, Jen-Pierre FRADIN, EPSILON Ingénierie, Labège, France |
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| 16:30 | 20mn | A correlation between thermo-mechanical finite elements tool with electro-thermal finite elements tool: towards an electro-mechanical finite elements modeling for IGBT used in power assemblies Yassine BELMEHDI, Stéphane AZZOPARDI, Eric WOIRGARD, Jean-Yves DELETAGE, Isabelle FAVRE, IMS Laboratory, University of Bordeaux |
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| 16:50 | 20mn | The Degradation of Solder Joints Under High Current Density and Low-Cycle Fatigue D. Di Maio 1, C. Murdoch 2, O. Thomas 1, C. Hunt 1 1 National Physical Laboratory, Teddington, UK 2 Imperial College, London UK |
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| 17:10 | 20mn | Electro-thermal investigation of silicon power inverters operating at low switching Frequencies J.ANTONIOS 1, N.GINOT 1, C.BATARD 1, Y. SCUDELLER 2, M. MACHMOUM 1 1 Université de Nantes, Ecole Polytechnique, IREENA, France 2 Université de Nantes, Ecole Polytechnique, LGMPA, France |
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| Session 18 | 16:00 | Tuesday 27 Apr 2010 | |
| Modeling for Advanced Packaging Chaired by Xueren Zhang, UTAC ; Cadmus Yuan, TNO |
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| 16:00 | 30mn | Keynote presentation – Virtual Prototyping Advanced by Statistic and Stochastic Methodologies Sven Rzepka 1, Axel Müller 2, Bernd Michel 1 1 Fraunhofer ENAS, Micro Materials Center Chemnitz/Berlin; Chemnitz, Germany 2 BorgWarner BERU Systems GmbH, Dept. Modeling and Analysis, Ludwigsburg, Germany |
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| 16:30 | 20mn | Evaluation of Probing Process Parameters and PAD Designs: Experiments and Modeling Correlations for Solving Mechanical Issues Romuald Roucou 1, Vincent Fiori 2, Florian Cacho 2, Karim Inal 3, Xavier Boddaert 3 1 STMicroelectronics, Crolles, France / Ecole Nationale Supérieure des Mines de Saint Etienne, CMP-GC, Gardanne, France 2 STMicroelectronics, Crolles, France 3 Ecole Nationale Supérieure des Mines de Saint Etienne, CMP-GC, Gardanne, France |
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| 16:50 | 20mn | Numerical Modelling Methodology for Design of Miniaturised Integrated Products – an Application to 3D CMM Micro-probe Development Pushpa Rajaguru 1, Stoyan Stoyanov 1, Ying Kit Tang 1, Chris Bailey 1, James Claverley 2, Richard Leach 2, David Topham 3 1 Centre for Numerical Modelling and Process Analysis, University of Greenwich, London, UK 2 Engineering Measurement Division, National Physical Laboratory, Teddington, UK 3 School of Engineering and Design, Brunel University, London, UK |
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| 17:10 | 20mn | The probability design for wire bonding process by finite element and Monte Carlo method Huixian Wu 1, Yangjian Xu 1, Lihua Liang 1, Yong Liu 2, Stephen Martin 2 1 Fairchild-ZJUT Microelectronic Packaging Joint Lab, Zhejiang University of Technology, Hangzhou, China 2 Fairchild Semiconductor, S. Portland, Maine, USA |
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| 17:30 | 20mn | Mechanical Behaviour and Fatigue of Copper Ribbons used as Solar Cell Interconnectors Steffen Wiese, Rico Meier, Frank Kraemer, Fraunhofer CSP, Halle, Germany |
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| 18.00 | Reception at the venue |
| Session 19 | 09:00 | Wednesday 28 Apr 2010 | |
| Progress in Thermo-mechanical design and Thermal Performance Enhancement Chaired by Bernhard Wunderle, Fraunhofer-IZM ; Liping Zhu,TriQuint Semiconductor |
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| 09:00 | 30mn | Keynote presentation – Thermo-mechanical design of a generic 0-level MEMS Package using Chip Capping and Through Silicon Via’s B. Vandevelde 1, R. Janssens 1, S. Bouwstra 2, N. Pham 1, B. Majeed 1, P. Limaye 1, E. Beyne 1, H.A.C. Tilmans 1 1 IMEC, Leuven, Belgium 2 MEMS TC, Amsterdam, the Netherlands |
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| 09:30 | 30mn | Keynote presentation – How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies H. Frémont, IMS-Bordeaux, Université Bordeaux 1, UMR-5218, Talence, France |
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| 10:00 | 30mn | Keynote presentation – Thermal Performance Enhancement by Exploitation of Nano-Effects Bernhard Wunderle, Micro Materials Centre Berlin, Fraunhofer IZM, Germany |
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| 10.30 | Break |
| Session 20 | 11:00 | Wednesday 28 Apr 2010 | |
| Reliability Modeling Chaired by Ole Hölck, Fraunhofer IZM |
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| 11:00 | 30mn | Keynote presentation – Thermo-mechanical challenges in the longevity of microelectronics A. W. J. Gielen, TNO Science and Industry, Eindhoven, The Netherlands |
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| 11:30 | 20mn | Limitations of Norris-Landzberg Equation and Application of Damage Accumulation Based Methodology for Estimating Acceleration Factors for Pb Free Solders Ahmer Syed, Amkor Technology, Chandler, USA |
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| 11:50 | 20mn | Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via Samed Barnat 1, Hélène Frémont 2, Alexandrine Gracia 2, Eric Cadalen 3, Catherine Bunel 3, François Neuilly 4, Jean-René Tenailleau 3 1 IPDIA ; NXP Semiconductors Caen ; IMS Bordeaux Université de Bordeaux, France 2 IMS Bordeaux, Université Bordeaux 1, France 3 IPDIA, Caen, France 4 IPDIA, IEMN Université de Lille 1, France |
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| 12:10 | 20mn | Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura, Tohoku University |
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| 12:30 | 20mn | Die Attach Interface Property Characterization as Function of Temperature Using Cohesive Zone Modeling Method Xiaosong Ma 1, G.Q. Zhang 1, O. van der Sluis 2, K.M.B. Jansen 1, W.D van Driel 3, L.J. Ernst 1, Charles Regard 4, Christian Gautier 5, Hélène Frémont 6 1 Delft University of Technology, Delft, The Netherlands 2 Philips Applied Technologies, Eindhoven, The Netherlands 3 Delft University of Technology, Delft; NXP, Nijmegen, The Netherlands 4 NXP Semiconductors; LaMIPS, Université de Caen; IMS Université de Bordeaux, Talence, France 5 NXP Semiconductors; LaMIPS, Université de Caen, France 6 IMS Université de Bordeaux, Talence, France |
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| Session 21 | 11:00 | Wednesday 28 Apr 2010 | |
| Process Modelling Chaired by Nancy Iwamoto, Honeywell ; Edward KL Chan, Hong Kong University of Science & Technology |
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| 11:00 | 30mn | Keynote presentation – Multiscale approach optimization on surface wettabilty change on rough surface Edward K L CHAN, Haibo FAN, Matthew M F YUEN, Hong Kong University of Science & Technology, Hong Kong |
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| 11:30 | 20mn | Thermo-mechanical simulations of RF-MEMS 0-level package based on wafer bonding by soldering Siebe Bouwstra, Remco Hageman, MEMS Technical Consultancy, Amsterdam, The Netherlands |
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| 11:50 | 20mn | Electromigration modeling with consideration of hillock formation Yuan Xiang Zhang 1, Lihua Liang 1, Yong Liu 2 1 Zhejiang University of Technology, Fairchild-ZJUT Microelectronic Packaging Joint Lab, Hangzhou, China 2 Fairchild Semiconductor Corp. S. Portland, USA |
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| 12:10 | 20mn | Multiphysics Modeling and Design of Ultralarge Multiwafer MOVPE Reactor for Group III-Nitride Light Emitting Diodes Changsung Sean Kim 1, Jongpa Hong 2, Jihye Shim 1, Yongsun Won 1, Yong-Il Kwon 1 1 Samsung Electro-Mechanics Co., Ltd. 2 Samsung LED Co., Ltd. |
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| 12:30 | 20mn | Magnetic Analysis and Simulation of a Self-Propelled Capsule Endoscope Chengzhi Hu, Mingyuan Gao, Zhenzhi Chen, Honghai Zhang, Sheng Liu, School of Mechanical Science & Engineering, Huazhong University of Science & Technology |
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| Session 22 | 11:00 | Wednesday 28 Apr 2010 | |
| Thermo-Mechanical Modeling II Chaired by Cell Wong, Delft University of Technology |
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| 11:00 | 30mn | Keynote presentation – Board level reliability of the advanced RF Power Packaging Cadmus Yuan 1, Michael A. Asis 1, Joey Salta 1, Willem van Driel 2 1 PL RF Power & Base stations, BL HP-RF, BU MultiMarket Semiconductors, NXP Semiconductors, The Netherlands 2 Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands |
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| 11:30 | 20mn | High temperature storage influence on molding compound properties J. de Vreugd 1, K.M.B. Jansen 1, L.J. Ernst 1, C.Bohm 2 1 Technical University Delft, The Netherlands 2 Infineon Technologies AG, Munich, Germany |
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| 11:50 | 20mn | Effects of the Geometrical Dimensions on Stress and Strain of Electrostatically Actuated MEMS Resonators at Pull-in and Stiction Positions Marius Pustan 1, Véronique Rochus 2, Jean-Claude Golinval 2 1 University of Liège, Liège, Belgium / Technical University of Cluj-Napoca, Cluj-Napoca, Romania 2 University of Liège, Liège, Belgium |
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| 12:10 | 20mn | Multi-scale numerical-experimental method to determine the size dependent elastic properties of composite silicon copper nano cantilevers using an electrostatic pull in experiment R.H. Poelma, H. Sadeghian, S.P.M. Noijen, J.J.M. Zaal, G.Q. Zhang, Delft University of Technology, Delft, The Netherlands |
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| 12:30 | 20mn | Copper Pillar Bump Structure Optimization for Flip Chip Packaging with Cu/Low-K Interconnects Zhang Xueren 1, Zhu Wenhui 1, Liew B.P. 1, Gaurav M. 1, Yeo A. 2, Chan K.C. 2 1 United Test & Assembly Center Ltd, Singapore 2 GLOBALFOUNDRIES Singapore Pte Ltd |
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| 12.50 | Lunch |
| Session 23 | 14:00 | Wednesday 28 Apr 2010 | |
| Modeling Challenges in Thermal and Multiphysics Applications Chaired by Chris Bailey, University of Greenwich ; Matthew Ming Fai Yuen, Hong Kong University of Science & Technology |
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| 14:00 | 30mn | Keynote presentation – Two-scale vs three-scale FE analyses of shock-induced failure in polysilicon MEMS S. Mariani 1, A. Ghisi 1, R. Martini 1, A. Corigliano 1, B. Simoni 2 1 Politecnico di Milano, Dipartimento di Ingegneria Strutturale, Milan, Italy 2 STMicroelectronics, MH Division, Cornaredo, Italy |
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| 14:30 | 30mn | Keynote presentation – Simulation of Particle Levitation due to Dielectrophoresis Rochus Véronique 1, Hannot Stephan 2, Golinval Jean-Claude 1, Rixen Daniel 2 1 University of Liège, Belgium 2 TU-Delft, Delft, The Netherlands |
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| 15:00 | 30mn | Keynote presentation – Are Current Turbulence Modeling Practices Addressing Industry’s Needs for Electronics Thermal Design ? Peter Rodgers, Valérie Eveloy, Department of Mechanical Engineering, The Petroleum Institute, Abu Dhabi, United Arab Emirates |
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| 15.30 | End of conference |
Go to Global conference schedule List of Technical Sessions Technical program List of sessions by Authors
Authors: find your session number:
- ALNUKARI : 7 AZZOPARDI : 17 Al-Bassyiouni : 11 13 Alavizadeh : 10 Alkemade : 2 Alsaleem : 9 Ancey : 3 Angral : 16 Antón : 10 Ardito : 3 Arruda : 8 Asis : 22 Assous : 6 Aubel : 11 Auersperg : 5 Azzopardi : 11
- BELMEHDI : 17 BERNABE : 11 BONFOH : 11 Bagdahn : 11 Bailey : 16 18 Balemans : 11 Baric : 7 Barink : 8 Barnat : 20 Barreau : 16 Bauer : 15 Belov : 10 Bengoechea : 10 Berg : 8 Bernabé : 4 Bettiati : 11 Betzl : 11 Beyne : 19 Biet : 11 Bissuel : 4 Blansaer : 11 Blecic : 7 Boddaert : 18 Boehme : 14 Borras : 11 Borzdun : 11 Bossuyt : 8 Bouwstra : 6 11 14 19 21 Brizar : 11 Brizoux : 11 Bunel : 20 Bychikhin : 7
- CHAN : 21 CHAUFFLEUR : 17 Cacho : 18 Cadalen : 20 Caers : 16 Carpentier : 3 Casset : 3 Cassidy : 11 Chan : 5 Chang : 11 Chen : 11 15 21 Cheng : 15 Chi : 4 Chiang : 4 Choi : 6 11 Christensen : 15 Christiaens : 8 Ciptokusumo : 11 Civet : 3 Claverley : 18 Convenant : 11 Coq : 16 Corfa : 4 Corigliano : 3 23 Coutellier : 11 Creutzburg : 11 Cuddalorepatta : 13
- DALVERNY : 11 DELETAGE : 17 Daniel : 4 23 Dasgupta : 11 13 Deletage : 11 Dermitzaki : 15 Doering : 2 Douglas : 13 Dowhan : 11 Driel : 1 2 3 11 13 20 22 Drumond : 12 Dudek : 2 Dufrenne : 4 Durand : 3
- Ernst : 2 20 22 Eveloy : 23
- FAN : 21 FAVRE : 17 FENDLER : 11 FRADIN : 17 Falat : 11 Fan : 1 Faria : 13 Favre : 11 Felba : 11 Feng : 12 Ferrand : 12 Filho : 11 Fink : 4 Fiori : 18 Frangi : 3 Frankenstein : 14 Franz : 11 Freeman : 15 Frémont : 11 12 19 20
- GOLINVAL : 3 Gang : 6 Gao : 21 Gasse : 4 Gatzen : 11 Gautier : 20 Ghisi : 23 Gielen : 2 9 20 Gillon : 11 Golinval : 22 Gonzalez : 8 Goumans : 13 Gracia : 11 20 Grillberger : 5 Grivon : 11 Groenhuis : 5 Guo : 11 Gupta : 16 Guyenot : 11
- HUI : 12 Hageman : 21 Halls : 15 Hamid : 14 Hauck : 10 12 Hicham : 12 Hofinger : 6 Hokka : 16 Holgado : 5 Hong : 21 Hoof : 14 Hsu : 8 Hu : 21 Hunt : 16 17 Hölck : 12 15
- Iker : 8 Inal : 18 Ivankovic : 11 Iwamoto : 15
- Jacobsson : 11 Jansen : 1 20 22 Janssens : 19 Jean : 14 Jean-Claude : 23 Jong : 16 Jungwirth : 6 Juntunen : 11
- KARAMA : 11 KHLIFA : 11 Kamara : 16 Kamminga : 2 Khan : 4 Khatir : 11 Kim : 21 Kishi : 20 Kolbeck : 10 Kraemer : 11 16 18 Kregting : 2 Kretschmann : 11 Kreyssig : 2 Kwon : 21
- LENCZNER : 12 LIPINSKI : 11 Lahti : 11 Lambird : 5 Landesman : 11 Lanier : 11 Larraona : 10 Laruelle : 11 LeClec’H : 11 Leach : 18 Lee : 5 Lehr : 5 Leisner : 10 Lenkkeri : 11 Leon : 11 Levo : 9 Liang : 12 18 21 Lienig : 16 Lieske : 14 Limaye : 19 Lindgren : 10 Liu : 12 18 21 Lu : 16
- MACHMOUM : 17 MSOLLI : 11 Ma : 20 Machado : 8 Mack : 4 Maio : 16 17 Majeed : 19 Malena : 7 Mariani : 23 Marinho : 8 Martens : 4 Martin : 18 Martini : 23 Masi : 3 Masip : 10 Matthieu : 11 Mattila : 2 Mavromaras : 15 Meier : 11 18 Meinders : 8 Meinshausen : 12 Meyendorf : 14 Michel : 2 5 15 18 Miles : 14 Miro : 2 Miura : 20 Monier-Vinard : 4 Monthei : 5 Moutanabbir : 13 Mroßko : 11 Murdoch : 17 Murphy : 4 Mélanie : 14 Müller : 12 18
- NOELS : 3 Nakahira : 20 Naumann : 13 Neto : 11 Neuilly : 20 Nguegang : 11 Noijen : 5 22
- Ollier : 3 Ooms : 11 Oswald : 11 Ouakad : 9
- Pagliosa : 11 Pape : 2 Park : 6 Paulasto-Kröckel : 2 16 Peels : 16 Petzold : 13 Pham : 19 Pitarresi : 9 Plana : 12 Platek : 11 Poelma : 22 Pogany : 7 Pons : 12 Prasad : 11 Puers : 14 Pustan : 22
- Quintero : 12
- RATIER : 12 RIBOT : 11 ROCHUS : 3 Rajaguru : 18 Ramini : 14 Ramos : 10 Ratchev : 11 Regard : 20 Reiche : 13 Rhayem : 7 Ribot : 4 Rigby : 15 Rivas : 10 Robert : 3 Rochus : 22 Rodgers : 23 Roellig : 11 14 Rolland : 6 Rongen : 1 Roucou : 18 Ryden : 10 Rzepka : 16 18
- SCUDELLER : 17 Sadeghian : 22 Saka : 4 Salta : 22 Sandmaier : 11 Sato : 20 Saxe : 15 Schilling : 13 Schlottig : 2 Scholten : 13 Schriever : 13 Schubert : 14 Segre : 6 Seok : 6 Shim : 21 Silva : 8 Simoni : 23 Sluis : 5 8 20 Soestbergen : 1 Spaan : 11 Stempin : 16 Stephan : 23 Stoyanov : 18 Su : 4 Suzuki : 20 Syed : 20 Sykes : 16
- Tack : 7 Takeda : 4 Tang : 18 Tenailleau : 20 Tesarski : 12 Thomas : 16 17 Tilmans : 14 19 Timmermans : 8 Tohmyoh : 4 Topham : 18 Tougui : 16 Turek : 11
- Vanderstraeten : 11 Vandevelde : 8 11 14 19 Vanfleteren : 8 Vanstreels : 11 Veninga : 9 Voelklein : 4 Vogel : 5 Vreugd : 22
- 0 : 1 2 11 22
- Vries : 11 Véronique : 23
- WOIRGARD : 17 WU : 3 Walczyk : 5 Wald : 11 Wang : 12 Weide-Zaage : 9 11 12 Weinzierl : 6 Wenhui : 22 Wieers : 7 Wiese : 11 16 18 Wilde : 4 Wimmer : 15 Wittler : 11 Woirgard : 11 Wolf : 15 Wolter : 11 Won : 21 Wong : 15 Wu : 18 Wunderle : 2 15 19 Wymyslowski : 11 12
- Xiao : 2 Xu : 18 Xueren : 22
- YAKOUBI : 12 YUEN : 21 Yakimets : 8 Yang : 4 11 13 Younis : 9 14 Yu : 15 Yuan : 11 22 Yuen : 15
- Zaal : 3 22 Zekry : 14 Zhang : 3 11 15 16 20 21 22 Zhao : 16 Zhu : 5 ZÈANH : 11
- lall : 16
- 2 : 15
Go to Global conference schedule List of Technical Sessions Technical program List of sessions by Authors
