EuroSimE 2010 was locally organised by IMS Lab of Bordeaux University (Hélène Frémont, Geneviève Duchamp) in Hotel Mercure Cité Mondiale, Bordeaux, France, in April 2010.

The 11th EuroSimE was attended by 155 individuals.

3 training courses were offered on Sunday. The software exhibition brought together 2 exhibitors (Simulia and Insidix).

Proceedings of EuroSimE 2010

CD-ROM full version: IEEE Catalog number CFP10566-CDR
ISBN 978-1-4244-7025-9

Booklet of extended abstracts
142 pages
IEEE Catalog Number : CFP10566-PRT
ISBN : 978-1-4244-7024-2

This was the technical programme of EuroSimE 2010:

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors

Day 1 – Monday 26 Apr 2010
08.00 Registration desk open
09.00 OPENING SESSION by the General Chair
09.09 INDUSTRIAL TRENDS KEYNOTE SESSION Chairman G.Q. Zhang, Philips Lighting
09.10 State-of-the-art of Heterogeneous System Integration, Phys. Rolf Aschenbrenner, Fraunhofer Institute IZM, Berlin, Germany
09.40 The Future of Nanoelectronics, Dr. Heike Riel, IBM Research GmbH, Zurich Research Laboratory, Switzerland
10.10 The new technology landscape of solid state lighting, Prof. Dr. G.Q. (Kouchi) Zhang, Philips Lighting, Eindhoven, The Netherlands
10.40 Break
11:10  S. 1  New Developments in Modeling
12.40 Lunch. EuroSimE Committee meeting [1]
14:00  S. 2  Experimental Investigations  S. 3  Modelling of MEMS Devices I  S. 4  Thermal Modelling and Characterization
15.50 Coffee break
16:20  S. 5  Damage and Failure  S. 6  Innovative Methods for Microsystems Modelling I  S. 7  Electrothermal Modeling and Characterization
18.00 Transport by bus to Château Le Thil
19.00 Wine tasting, dinner in Château Le Thil
Day 2 – Tuesday 27 Apr 2010
08:00 EuroSimE Committee meeting [2](breakfast)
09:00  S. 8  Flexible Electronics  S. 9  Innovative Methods for Microsystems Modelling II  S. 10  Thermal-Fluid Behavior Modeling and Characterization
10.10 Break
11:00  S. 11  Thermo-Mechanical Issues in Microelectronics  S. 12  Multi-Physics Issues in Microelectronics
12.20 Lunch
13:30  S. 13  Thermo-Mechanical Modeling I  S. 14  Modelling of MEMS devices II  S. 15  Molecular Modeling
15.20 Break
16:00  S. 16  Dynamic Problems  S. 17  Multi-Physics Modelling for Power Electronics Devices  S. 18  Modeling for Advanced Packaging
18.00 Reception at the venue
Day 3 – Wednesday 28 Apr 2010
09:00  S. 19  Progress in Thermo-mechanical design and Thermal Performance Enhancement
10.30 Break
11:00  S. 20  Reliability Modeling  S. 21  Process Modelling  S. 22  Thermo-Mechanical Modeling II
12.50 Lunch
14:00  S. 23  Modeling Challenges in Thermal and Multiphysics Applications
15.30 End of conference

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors

List of Technical Sessions
S-1 New Developments in Modeling
S-2 Experimental Investigations
S-3 Modelling of MEMS Devices I
S-4 Thermal Modelling and Characterization
S-5 Damage and Failure
S-6 Innovative Methods for Microsystems Modelling I
S-7 Electrothermal Modeling and Characterization
S-8 Flexible Electronics
S-9 Innovative Methods for Microsystems Modelling II
S-10 Thermal-Fluid Behavior Modeling and Characterization
S-11 Thermo-Mechanical Issues in Microelectronics
S-12 Multi-Physics Issues in Microelectronics
S-13 Thermo-Mechanical Modeling I
S-14 Modelling of MEMS devices II
S-15 Molecular Modeling
S-16 Dynamic Problems
S-17 Multi-Physics Modelling for Power Electronics Devices
S-18 Modeling for Advanced Packaging
S-19 Progress in Thermo-mechanical design and Thermal Performance Enhancement
S-20 Reliability Modeling
S-21 Process Modelling
S-22 Thermo-Mechanical Modeling II
S-23 Modeling Challenges in Thermal and Multiphysics Applications

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors

08.00 Registration desk open

09.00 OPENING SESSION by the General Chair

09.09 INDUSTRIAL TRENDS KEYNOTE SESSION Chairman G.Q. Zhang, Philips Lighting

09.10 State-of-the-art of Heterogeneous System Integration, Phys. Rolf Aschenbrenner, Fraunhofer Institute IZM, Berlin, Germany

09.40 The Future of Nanoelectronics, Dr. Heike Riel, IBM Research GmbH, Zurich Research Laboratory, Switzerland

10.10 The new technology landscape of solid state lighting, Prof. Dr. G.Q. (Kouchi) Zhang, Philips Lighting, Eindhoven, The Netherlands

10.40 Break

Session 1 11:10 Monday 26 Apr 2010
New Developments in Modeling
Chaired by L.J. Ernst, Delft University of Technology
11:10 30mn Keynote presentation – Wafer Level Packaging (WLP): Fan-in, Fan-out and Three-Dimensional Integration
Xuejun Fan, Lamar University, Texas, USA
11:40 30mn Keynote presentation – Jets and Rotary Flows for Single-Phase Liquid Cooling: An Overview of Some Recent Experimental Findings
Punch, J., Walsh, E., Grimes, R., Jeffers, N., Kearney, D., CTVR, Stokes Institute, University of Limerick, Ireland
12:10 30mn Keynote presentation – Development of an elaborate simulation tool for electrochemical failures in microelectronic packages
M. van Soestbergen 1, R.T.H. Rongen 2, K.M.B. Jansen 3, W.D. van Driel 3
1 Materials Innovation Institute, Delft, the Netherlands
2 NXP Semiconductors, Nijmegen, the Netherlands
3 Delft University of Technology, Fundamentals of Microsystems Engineering, Delft, the Netherlands

12.40 Lunch. EuroSimE Committee meeting [1]

Session 2 14:00 Monday 26 Apr 2010
Experimental Investigations
Chaired by Sven Rzepka, Fraunhofer Institute ENAS ; Hélène Frémont, IMS-Bordeaux
14:00 30mn Keynote presentation – Toward Comprehensive Reliability Testing of Electronic Component Boards
Toni. T. Mattila, M. Paulasto-Kröckel, Aalto University, School of Science and Technology
14:30 20mn Theoretical Analyses on the Shear Test
Rainer Dudek 1, Ralf Doering 1, Kerstin Kreyssig 2, Bernd Michel 1
1 Fraunhofer ENAS, Micro Materials Center Berlin and Chemnitz
2 CWM GmbH, Chemnitz
14:50 20mn Measuring time-dependent mechanics in metallic MEMS
Bergers, L.I.J.C., Delhey, N.K.R., Hoefnagels, J.P.M., Geers, M.G.D., Eindhoven University of Technology, Dep. of Mechanical Engineering
15:10 20mn Interfacial Strength of Silicon-to-Molding Compound Changes with Thermal Residual Stress
Gerd Schlottig 1, An Xiao 2, Heinz Pape 3, Bernhard Wunderle 4, Leo J. Ernst 2
1 Infineon Technologies AG, Munich; Fraunhofer IZM, Berlin, Germany; TU-Delft, Delft, The Netherlands
2 TU-Delft, Delft, The Netherlands
3 Infineon Technologies AG, Munich, Germany
4 Fraunhofer IZM, Berlin; TU Chemnitz, Chemnitz, Germany
15:30 20mn Local stress analysis in devices by FIB
René Kregting 1, Sander Gielen 1, Willem van Driel 2, Paul Alkemade 3, Hozan Miro 3, Jan-Dirk Kamminga 4
1 TNO Science & Industry, Eindhoven, The Netherlands
2 NXP Semiconductors, Nijmegen, The Netherlands; Delft University of Technology, Delft, The Netherlands
3 Delft University of Technology, Delft, The Netherlands
4 M2i Materials innovation institute, Delft, The Netherlands

Session 3 14:00 Monday 26 Apr 2010
Modelling of MEMS Devices I
Chaired by Yong Liu, Fairchild Semiconductor; Willem van Driel, Philips Lighting
14:00 30mn Keynote presentation – AN ON-CHIP EXPERIMENTAL ASSESSMENT OF CASIMIR FORCE EFFECT IN MICRO-ELECTROMECHANICAL SYSTEMS
R. Ardito, A. Frangi, B. de Masi, A. Corigliano, Politecnico di Milano, Italy
14:30 20mn MEMS resonator temperature compensation
F. Casset 1, C. Durand 2, Y. Civet 3, E. Ollier 1, JF. Carpentier 2, P. Ancey 2, P. Robert 1
1 CEA, LETI, MINATEC, Grenoble, France
2 ST, Crolles, France
3 TIMA, Grenoble, France
14:50 20mn Failure Modes of Wafer Level Thin Film MEMS Packages During Wafer Thinning
J.J.M. Zaal, W.D. van Driel, G.Q. Zhang, Delft University of Technology
15:10 20mn Prediction of stiction in Microswitch Systems
Ling WU, V. ROCHUS, L. NOELS, J.C. GOLINVAL, University of Liege, Liège, Belgium
15:30 20mn FINITE ELEMENT MODELLING OF ADHESION PHENOMENA IN MEMS
Raffaele Ardito, Alberto Corigliano, Attilio Frangi, Politecnico di Milano, Milan, Italy

Session 4 14:00 Monday 26 Apr 2010
Thermal Modelling and Characterization
Chaired by Jeff Punch, Stokes Institute; Peter Rodgers, The Petroleum Institute
14:00 30mn Keynote presentation – Simulation-based analysis of the heat-affected zone during target preparation by pulsed-laser ablation through stacked silicon dies in 3D integrated System-in-Packages
Stefan Martens 1, Markus Fink 1, Walter Mack 1, Friedemann Voelklein 2, Juergen Wilde 3
1 Infineon Technologies AG, Regensburg, Germany
2 RheinMain University of Applied Sciences, IMtech, Institute of Microtechnologies, Ruesselsheim, Germany
3 Laboratory for Assembly and Packaging, IMTEK, Department of Microsystems Engineering, University of Freiburg, Germany
14:30 20mn Fabrication of Freestanding Thin Pt/W Thermocouple by Joule Heat Welding
Hironori Tohmyoh, Hironao Takeda, Mohammed N. I. Khan, Masumi Saka, Tohoku University
14:50 20mn Light Degradation Prediction of High Power Light Emitting Diode Lighting Modules
Yen-Fu Su, Shin-Yueh Yang, Wei-Hao Chi, Kuo-Ning Chiang, Dept. of Power Mechanical Engineering, National Tsing Hua University, HsinChu, Taiwan
15:10 20mn Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation
A. Corfa, A. Gasse, S. Bernabé, H. Ribot, CEA LETI MINATEC, France
15:30 20mn Thermal Modelling of the Emerging Multi-Chip Packages
Eric Monier-Vinard, Valentin Bissuel, Paul Murphy, Olivier Daniel, Julien Dufrenne, Thales Corporate Services, Meudon, France

15.50 Coffee break

Session 5 16:20 Monday 26 Apr 2010
Damage and Failure
Chaired by Toni Mattila, Aalto University ; Rainer Dudek, Fraunhofer Institute ENAS
16:20 30mn Keynote presentation – Detailed Investigation on the Creep Damage Accumulation of Lead-free Solder Joints under Accelerated Temperature Cycling
Y. S. Chan, S. W. Ricky Lee, Center for Advanced Microsystems Packaging, HKUST, Hong-Kong
16:50 20mn Crack and Damage in low-k BEoL Stacks under Assembly and CPI Aspects
Juergen Auersperg 1, Dietmar Vogel 2, Matthias U. Lehr 3, Michael Grillberger 3, Bernd Michel 2
1 Fraunhofer ENAS Chemnitz and AMIC GmbH Berlin
2 Fraunhofer ENAS Chemnitz and Fraunhofer IZM Berlin
3 GLOBALFOUNDRIES Dresden Module One LLC & Co. KG
17:10 20mn Moisture Diffusion Modeling and Application in a 3D RF Module Subject to Moisture Absorption and Desorption Loads
Liping Zhu, Dean Monthei, Gene Lambird, Wally Holgado, TriQuint Semiconductor, USA
17:30 20mn Numerical-experimental analysis of combined bulk and interface fracture in a leadless package
Sander Noijen 1, Sven Walczyk 2, Roelf Groenhuis 2, Olaf van der Sluis 1
1 Philips Applied Technologies, Eindhoven, The Netherlands
2 NXP Semiconductors, Nijmegen, The Netherlands

Session 6 16:20 Monday 26 Apr 2010
Innovative Methods for Microsystems Modelling I
Chaired by Bart Vandevelde, IMEC; Véronique Rochus, University of Liège
16:20 30mn Keynote presentation – A Comparison of Model Order Reduction Methods used in different FE Software Tools
M. Jungwirth, D. Hofinger, H. Weinzierl, FH OÖ – Upper Austria University of Applied Sciences, Wels, Austria
16:50 20mn A linear analysis to overcome the numerical Cherenkov instability
Franck Assous, Ariel University Center & Bar-Ilan University, Israel
Jacques Segre, CEA-Saclay, DEN/DM2S/SFME, France
17:10 20mn Thermomechanical simulation of BCB membrane thin-film package
Seonho Seok 1, Nathalie Rolland 1, Paul-Alain Rolland 1, Siebe Bouwstra 2
1 IEMN / IRCICA / CNRS, France
2 MEMS TC, Amsterdam, The Netherlands
17:30 20mn Mechanism analyses on PBGA strip packaging warpage
In Soo Park 1, Jooho Choi 2, Jin Hyuk Gang 2
1 Doosan Corporation Electro-materials, Korea
2 Korea Aerospace University, Korea

Session 7 16:20 Monday 26 Apr 2010
Electrothermal Modeling and Characterization
Chaired by Sheng Liu, China Huazhong University of Science & Technology; Christopher Bailey, University of Greenwich
16:20 30mn Keynote presentation – New Methodology on Electro-Thermal Characterization and Modeling of Large Power Drivers using Lateral PNP BJTs
J. Rhayem 1, A.Vrbicky 1, R. Blecic 2, P. Malena 3, S. Bychikhin 4, D. Pogany 4, A. Wieers 5, A. Baric 2, M. Tack 5
1 ONSEMI, Bratislava, Slovakia
2 University of Zagreb, Zagreb, Croatia
3 ONSEMI, Brno, Czech
4 Institute for Solid State Electronics, Vienna, Austria
5 ONSEMI, Oudenaarde, Belgium
16:50 20mn Electromagnetic and Thermal investigations of RF Devices
A. ALNUKARI 1, P.GUILLEMET 2, Y.SCUDELLER 2, S.TOUTAIN 1
1 University of Nantes, Ecole Polytechnique, IREENA, France
2 University of Nantes, Ecole Polytechnique, LGMPA, France

18.00 Transport by bus to Château Le Thil

19.00 Wine tasting, dinner in Château Le Thil

08:00 EuroSimE Committee meeting [2](breakfast)

Session 8 09:00 Tuesday 27 Apr 2010
Flexible Electronics
Chaired by Daoguo Yang, NXP Semiconductors / Guilin University ; Michel Brizoux, Thales Corporate Services
09:00 30mn Keynote presentation – Thermo-Mechanical Analysis of Flexible and Stretchable Systems
Mario Gonzalez 1, Bart Vandevelde 1, Wim Christiaens 2, Yung-Yu Hsu 1, François Iker 1, Frederick Bossuyt 1, Jan Vanfleteren 1, Olaf van der Sluis 3, P.H.M. Timmermans 3
1 IMEC, Leuven, Belgium
2 Ghent University, Belgium
3 Philips Applied Technologies, The Netherlands
09:30 20mn Flexible Circuits with Embedded Resistors Subjected to Extreme Thermal Loading Conditions Using the Shadow Moiré and FEM Measurements Techniques
Luciano Arruda 1, Luanda Marinho 2, Edson Silva 1, Willy Machado 2
1 Instituto Nokia de Tecnologia
2 Universidade Estadual do Amazonas
09:50 20mn Modeling the residual shrinkage during lithographic processing on flexible polymer substrates
M. Barink, D. van den Berg, I. Yakimets, E. Meinders, TNO/Holst Centre

Session 9 09:00 Tuesday 27 Apr 2010
Innovative Methods for Microsystems Modelling II
Chaired by Dag Anderson, IVF ; Alberto Corigliano, Politecnico di Milano
09:00 30mn Keynote presentation – Exemplified calculation of stress migration in a 90nm node via structure
Kirsten Weide-Zaage, Information Technology Laboratory, Leibniz University Hannover
09:30 20mn Multiple Environment Overstress Testing and Modelling of Solar Cells
E.P. Veninga, A.W.J. Gielen, TNO Science and Industry, Eindhoven, The Netherlands
09:50 20mn Response of an Electrostatically Actuated Microbeam to Drop-Table Test
H. Ouakad, M. I. Younis, F. Alsaleem, T. Levo, J. Pitarresi, State University of New York at Binghamton, USA

Session 10 09:00 Tuesday 27 Apr 2010
Thermal-Fluid Behavior Modeling and Characterization
Chaired by Peter Rodgers, The Petroleum Institute, UAE
09:00 30mn Keynote presentation – Analysis of the performance reduction of axial fans in close proximity to EMC screens
Raúl Antón, Asier Bengoechea, Yunesky Masip, Alejandro Rivas, Juan Carlos Ramos, Gorka S. Larraona, TECNUN-University of Navarra, Spain
09:30 20mn CFD Assisted Design Evaluation and Experimental Verification of a Logic-Controlled Local PCB Heater for Humidity Management in Electronics Enclosure
Ilja Belov 1, Mats Lindgren 2, Jan Ryden 3, Zahra Alavizadeh 1, Peter Leisner 2
1 School of Engineering, Jönköping University, Jönköping, Sweden
2 SP Technical Research Institute of Sweden, Borås, Sweden
3 Saab Microwave Systems, Göteborg, Sweden
09:50 20mn Bond Wire Design for eXtreme Switch Devices
Torsten Hauck, Anton Kolbeck, Freescale Semiconductor Germany

10.10 Break

Session 11 11:00 Tuesday 27 Apr 2010
Thermo-Mechanical Issues in Microelectronics
Chaired by Kaspar Jansen, Delft University ; Heinz Pape, Infineon Technologies
Principles for Simulation of Barrier Cracking due to high Stress
Johar Ciptokusumo 1, Kirsten Weide-Zaage 1, Oliver Aubel 2
1 Leibniz Universitaet Hannover, Laboratorium fuer Informationstechnologie
2 GLOBALFOUNDRIES Incorporated
Aging Effects of Epoxy Moulding Compound on the Long-Term Stability of Plastic Package
Eric Nguegang 1, Jochen Franz 1, André Kretschmann 1, Hermann Sandmaier 2
1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
2 University of Stuttgart, Lehrstuhl Mikrosystemtechnik, Stuttgart, Germany
Evaluating the Effect of Shock Absorber Layers in the Dynamic Behavior of PWB with Viscoelastic Insert
Cleber Pagliosa, Joao Morais da Silva Neto, Nokia Institute of Technology, Manaus, Brazil
Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board
Wilson Carlos Maia Filho, Michel Brizoux, Arnaud Grivon, Thales Corporate Services, France
Design of Al Pad Geometry for Reducing Current Crowding Effect in Flip-chip Solder Joint Using Finite-element Analysis
Y. W. Chang, Chih Chen, Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan, ROC
Efficiency and robustness of some behavior laws in the description of viscoplastic deformation and degradation of solder materials
Sabeur MSOLLI, Adrien ZÈANH, Olivier DALVERNY, Moussa KARAMA, Université de Toulouse ; INP/ENIT ; LGP ; Tarbes, France
Thermomechanical characterization of electronic components
Sana Ben KHLIFA 1, Napo BONFOH 1, Paul LIPINSKI 1, Manuel FENDLER 2, Stéphane BERNABE 2, Hervé RIBOT 2
1 Laboratoire de mécanique Biomécanique Polymère Structures (LaBPS), Ecole Nationale d’Ingénieurs de Metz (ENIM) ,Metz,France.
2 Laboratoire d’Electronique et des Technologies de l’Information, CEA / LETI-MINATEC, Grenoble,France.
Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality
E. Spaan 1, E. Ooms 1, W.D. van Driel 2, C.A. Yuan 1, D.G. Yang 3, G.Q. Zhang 4
1 NXP Semiconductors, Nijmegen, The Netherlands
2 NXP Semiconductors, Nijmegen; Delft University of Technology, Delft, The Netherlands
3 NXP Semiconductors, Nijmegen, The Netherlands; Guilin University, Guilin, China
4 Delft University of Technology, Delft; Phillips Lighting, Eindhoven, The Netherlands
Thermo-mechanical simulations of LTCC packages for RF MEMS applications
J. Lenkkeri 1, E. Juntunen 1, M. Lahti 1, S. Bouwstra 2
1 VTT Technical Research Centre of Finland, Oulu, Finland
2 MEMS TC, Amsterdam, The Netherlands
GaAs-Based Laser Diode Bonding-Induced Stress Investigation By Means Of Simulation And Degree Of Polarization Of The Photoluminescence Measurements
Julien LeClec’H 1, Daniel T. Cassidy 2, Michel Biet 1, François Laruelle 1, Mauro Bettiati 1, Jean-Pierre Landesman 3
1 3S Photonics, Nozay, France
2 McMaster University, Hamilton, Canada
3 Université de Nantes, France
Mechanical and Thermal Simulations of a Microactuator for the Stimulation of the Perilymph
T. Creutzburg, H.H. Gatzen, Leibniz Universität Hannover – Institute for Microtechnology, Garbsen, Germany
Thermomechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array) : Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability
CHAILLOT A. 1, MUNIER C. 1, MAIRE O. 1, VIGIER M. 2, CHASTANET C. 2
1 EADS Innovation Works, France
2 Airbus, Suresnes, France
Influence of PCB design and materials on chip solder joint reliability
Berthou Matthieu 1, Hélène Frémont 2, Alexandrine Gracia 2, C.Jéphos-Davennel 3
1 MBDA France, IMS Bordeaux, DGA CELAR, France
2 IMS Bordeaux, Université Bordeaux 1, France
3 DGA CELAR, Rennes, France
Measurement of Viskoelastic Material Properties of Adhesives for SHM Sensors Under Harsh Environmental Conditions
Boehme, B. 1, Roellig, M. 2, Wolter, K.-J. 1
1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany
2 Fraunhofer-Institut for Non-destructive Testing, Dresden, Germany
Application of Numerical Optimization Algorithms Used to Investigation of Thin Films in Nanoindentation Test
Lukasz Dowhan 1, Artur Wymyslowski 1, Olaf Wittler 2, Raul Mroßko 2
1 Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Poland
2 Fraunhofer IZM, Micro Materials Center, Germany
Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates
Karsten Meier 1, Mike Roellig 2, Steffen Wiese 3, Klaus-Jürgen Wolter 1
1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany
2 Fraunhofer Institute for Non-Destructive Testing (IZFP-D), Dresden, Germany
3 Fraunhofer Center for Silicon-Photovoltaics (CSP), Halle, Germany
The study of carbon nanotube’s length in reference to its thermal conductivity by molecular dynamics approach
Bartosz Platek, Tomasz Falat, Jan Felba, Artur Borzdun, Wroclaw University of Technology, Faculty of Microsystems Electronics and Photonics, Laboratory for Interconnecting and Packaging Electronic Circuits, Poland
Vibration Reliability of SMD Pb-free Solder Joints
Mario Borras 1, Olivier Lanier 1, Roumen Ratchev 1, Michael Guyenot 1, Daniel Coutellier 2
1 Robert Bosch GmbH, Corporate Research CR/APJ3, Schwieberdingen, Germany
2 LAMIH, UMR CNRS 8530, Université de Valenciennes, Valenciennes, France
Development of fast and easy methods for measuring the Young’s Modulus of molding compounds for IC packages
Daniel Vanderstraeten 1, Andrej Ivankovic 1, Kris Vanstreels 2, Guy Brizar 1, Renaud Gillon 1, Eddy Blansaer 1, Bart Vandevelde 2
1 ON Semiconductor, Oudenaarde, Belgium
2 IMEC, Leuven, Belgium
Vibration Durability of Pb-free HVQFN Assemblies
C. Choi 1, M. Al-Bassyiouni 1, A. Dasgupta 1, J. W. C. de Vries 2, W. Balemans 2, W. van Driel 3
1 CALCE Center, University of Maryland
2 Philips Applied Technologies
3 Philips Lighting
Interconnection Technologies for Photovoltaic Modules – Analysis of technological and mechanical Problems
Steffen Wiese 1, Frank Kraemer 1, Norbert Betzl 2, Dietmar Wald 2
1 Fraunhofer CSP, Halle, Germany
2 SOLARWATT AG, Dresden, Germany
A Case Study of Networked Sensors by Simulations and Experiments
Cheng Guo, Martin Jacobsson, R. Venkatesha Prasad, Delft University of Technology
Sintering, in Different Temperatures, of Traces of Silver Printed in Flexible Surfaces
Mancosu, R. D., Quintero, J, A, Q., Azevedo, R. E. S., Nokia Institute of Technology – INdT, Manaus, Brazil
Thermo-mechanical simulations in double-sided heat transfer power assemblies
E. Woirgard 1, I. Favre 1, JY Deletage 1, S. Azzopardi 1, R. Leon 2, G. Convenant 2, Z. Khatir 3
1 Université de Bordeaux I,Talence, France
2 Valeo-CEE, Montigny-le-Bretonneux, France
3 Inrets, Versailles, France
Numerical Simulations of Thermo-Mechanical Stresses during the Casting of Multi-Crystalline Silicon Ingots
M. Oswald, M. Turek, J. Bagdahn, Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany

Session 12 11:00 Tuesday 27 Apr 2010
Multi-Physics Issues in Microelectronics
Chaired by Kaspar Jansen, Delft University ; Heinz Pape, Infineon Technologies
Virtual prototyping of PoP interconnections regarding electrically activated mechanisms
Lutz Meinshausen 1, Kirsten Weide-Zaage 1, Hélène Frémont 2, Wei Feng 2
1 Laboratorium für Informationstechnologie, University Hannover, Germany
2 Laboratoire IMS, CNRS UMR 5218, ENSEIRB, Université Bordeaux I, France
Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test
Fei Liu 1, Qiang Wang 1, Lihua Liang 1, Yong Liu 2
1 Zhejiang University of Technology, Fairchild-ZJUT Microelectronic Packaging Joint Lab, Hangzhou, China
2 Fairchild Semiconductor, S. Portland, Maine, USA
Control of a Cantilever Array by Periodic Networks of Resistances
Hui HUI 1, Youssef YAKOUBI 2, Michel LENCZNER 1, Nicolas RATIER 1
1 FEMTO-ST, Département Temps-Fréquences Université de Franche-Comté, Besaçon, France
2 Laboratoire Jacques-Louis Lions, Université Pierre et Marie Curie, Paris, France
Numerical Approach to Multiscale Evaluation and Analysis of Tg of Crosslinked Polymers
Sebastian J. Tesarski 1, Ole Hölck 2, Artur Wymyslowski 1
1 Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland
2 Fraunhofer Institut Zuverlässigkeit und Mikrointegration, Volmerstr. 9B, 12489 Berlin, Germany
Comparison and characterization of a typical strain gage trace against another using the printed method
Quintero, Jairo Alonso Quintero, Mancosu, Rafael Drumond, Nokia Institute of Technology – INdT, Manaus, Brazil
Large Deformation of Beam Columns – a Closed Form Solution and Design Guide for Vertical Buckling Probe Needles
Torsten Hauck, Freescale Semiconductor Germany
Wolfgang H. Müller, Technische Universität Berlin
A New Iterative Algorithm For The Solution For The Load Deflection Square Membranes
Youssef Hicham 1, André Ferrand 2, Patrick Pons 1, Robert Plana 1
1 LAAS CNRS, Toulouse, France
2 LAAS CNRS, ICA-MSEM, Toulouse, France

12.20 Lunch

Session 13 13:30 Tuesday 27 Apr 2010
Thermo-Mechanical Modeling I
Chaired by Ricky Lee, HKUST ; Ahmer Syed, Amkor Technology
13:30 30mn Keynote presentation – Simulation of Drop Testing at Extremely High Accelerations
Stuart Douglas, M. Al-Bassyiouni, A. Dasgupta, CALCE Center, University of Maryland
14:00 20mn Numerical investigations of the strain behavior in nanoscale patterned strained silicon structures
F. Naumann 1, O. Moutanabbir 2, M. Reiche 2, C. Schriever 3, J. Schilling 3, M. Petzold 1
1 Fraunhofer Institute for Mechanics of Materials, Halle, Germany
2 Max Planck Institute of Microstructure Physics, Halle, Germany
3 ZIK
14:20 20mn Virtual Thermo-Mechanical Prototyping for High-Temperature-Application Microelectronics
Daoguo Yang 1, W. D. van Driel 2, Huib Scholten 2, L. Goumans 2, R. Faria 2
1 Guilin University of Electronics Technology, China
2 NXP Semiconductors, Nijmegen, the Netherlands
14:40 20mn Multi-scale Viscoplastic Modeling of Pb-free Sn3.0Ag0.5Cu Solder Interconnects
Gayatri Cuddalorepatta, Abhijit Dasgupta, CALCE Electronic Products and Systems Center, University of Maryland, USA

Session 14 13:30 Tuesday 27 Apr 2010
Modelling of MEMS devices II
Chaired by Xavier Chauffleur, Epsilon Ingénierie ; Attilio Frangi, Politecnico di Milano
13:30 30mn Keynote presentation – FEM assisted Development of a SHM-Piezo-Package for Damage Evaluation in Airplane Components
Mike Roellig 1, Lars Schubert 1, Uwe Lieske 1, Bjoern Boehme 2, Bernd Frankenstein 1, Norbert Meyendorf 1
1 Fraunhofer Institute for Non-Destructive Testing
2 Dresden University of Technology
14:00 20mn Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS
Joseph Zekry 1, Bart Vandevelde 1, Siebe Bouwstra 2, Robert Puers 3, Chris Van Hoof 1, Harrie A.C. Tilmans 1
1 Imec, Leuven, Belgium
2 MEMS TC, Amsterdam, The Netherlands
3 K.U.Leuven, Belgium
14:20 20mn Modeling the effects of printed circuit motion on the response of microstructures under mechanical shock
Abdallah H Ramini, Mohammad I Younis, Ronald Miles, SUNY Binghamton
14:40 20mn Global modelling and simulation of a Coriolis vibrating micro-gyroscope for quadrature error compensation
Descharles Mélanie 1, Guérard Jean 1, Kokabi Hamid 2
1 ONERA, Chatillon, France
2 UPMC L2E, Ivry-sur-Seine, France

Session 15 13:30 Tuesday 27 Apr 2010
Molecular Modeling
Chaired by Steffen Wiese, Fraunhofer CSP ; Xuejun Fan, Lamar University
13:30 30mn Keynote presentation – Mechanical Properties of an Epoxy, Modeled Using Particle Dynamics as Parameterized through Molecular Modeling
Nancy Iwamoto, Honeywell Specialty Materials, USA
14:00 20mn Design of reliable Cu-epoxy interface using Molecular Dynamic Simulation
Cell K Y Wong 1, H B Fan 2 2, G Q Zhang 1, Matthew M F Yuen 2
1 Faculty 3mE, Department PME Delft University of Technology
2 Department of Mechanical Engineering, Hong Kong University of Science and Technology
14:20 20mn Molecular Modeling of Microelectronic Packaging Materials – Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface
O. Hölck 1, E. Dermitzaki 1, B. Wunderle 2, J. Bauer 3, B. Michel 1
1 Micro Materials Center Berlin – Fraunhofer IZM, Berlin, Germany
2 TU Chemnitz, Chemnitz, Germany
3 SIIT – Fraunhofer IZM, Berlin, Germany
14:40 20mn On the Mechanical Properties of Cu3Sn Intermetallic Compound through Molecular Dynamics Simulation and Nanoindentation Testing
Wen-Hwa Chen 1, Hsien-Chie Cheng 2, Ching-Feng Yu 1
1 Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan
2 Department of Aerospace and Systems Engineering, Feng Chia University, Taiwan
15:00 20mn Computational materials engineering: capabilities of atomic-scale prediction of mechanical, thermal, and electric properties of microelectronic materials
A. Mavromaras 1, D. Rigby 2, W. Wolf 3, M. Christensen 1, M. Halls 2, C. Freeman 2, P. Saxe 4, E. Wimmer 5
1 Materials Design SARL, Stockholm, Sweden
2 Materials Design, Inc., San Diego, USA
3 Materials Design SARL, Vienna, Austria
4 Materials Design, Inc. Angel Fire, USA
5 Materials Design, Inc., Santa Fe, USA

15.20 Break

Session 16 16:00 Tuesday 27 Apr 2010
Dynamic Problems
Chaired by Jürgen Auersperg, Fraunhofer ENAS / AMIC ; Mario Gonzalez, IMEC
16:00 30mn Keynote presentation – Anomaly Detection and Fault-Mode Isolation for Prognostics Health Monitoring of Electronics Subjected to Drop and Shock
Pradeep lall, Prashant Gupta, Arjun Angral, Auburn University, NSF Center for Advanced Vehicle and Extreme Environment Electronics (CAVE-3), USA
16:30 20mn BGA Lifetime Prediction in JEDEC Drop Tests Accounting for Copper Trace Routing Effects
Frank Kraemer 1, Steffen Wiese 1, Sven Rzepka 2, Jens Lienig 3
1 Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany
2 Fraunhofer ENAS, Micro Material Center Chemnitz & Berlin, Germany
3 Dresden University of Technology, Institute of Electromechanical and Electronic Design, Germany
16:50 20mn Computer Simulation and Design of a Solder Joint Vibration Test Machine
Elisha Kamara 1, Hua Lu 1, Chris Bailey 1, Chris Hunt 2, Davide Di Maio 2, Owen Thomas 2
1 School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom
2 National Physical Laboratory, London, United Kingdom
17:10 20mn Optimization for Simulation of WL-CSP Subjected to Drop-Test with Plasticity Behavior
C. Le Coq 1, A. Tougui 2, M.-P. Stempin 3, L. Barreau 3
1 LMR – STMicroelectronics, France
2 LMR, France
3 STMicroelectronics, France
17:30 20mn High-Speed Mechanical Impact Reliability of Solder Interconnections in High-Power LEDs
J. Hokka 1, J.F.J.M. Caers 2, X.J. Zhao 2, M. de Jong 3, W. Peels 3, B. Sykes 4, G.Q. Zhang 3, M. Paulasto-Kröckel 1
1 Aalto University School of Science and Technology, Espoo, Finland
2 Philips Applied Technologies, Eindhoven, The Netherlands
3 Philips Lighting, Eindhoven, The Netherlands
4 XYZTEC bv, Panningen, The Netherlands

Session 17 16:00 Tuesday 27 Apr 2010
Multi-Physics Modelling for Power Electronics Devices
Chaired by Abhijit Dasgupta, University of Maryland ; Torsten Hauck, Freescale
16:00 30mn Keynote presentation – Electro-thermo-mechanical simulation of automotive MOSFET transistor
Xavier CHAUFFLEUR, Jen-Pierre FRADIN, EPSILON Ingénierie, Labège, France
16:30 20mn A correlation between thermo-mechanical finite elements tool with electro-thermal finite elements tool: towards an electro-mechanical finite elements modeling for IGBT used in power assemblies
Yassine BELMEHDI, Stéphane AZZOPARDI, Eric WOIRGARD, Jean-Yves DELETAGE, Isabelle FAVRE, IMS Laboratory, University of Bordeaux
16:50 20mn The Degradation of Solder Joints Under High Current Density and Low-Cycle Fatigue
D. Di Maio 1, C. Murdoch 2, O. Thomas 1, C. Hunt 1
1 National Physical Laboratory, Teddington, UK
2 Imperial College, London UK
17:10 20mn Electro-thermal investigation of silicon power inverters operating at low switching Frequencies
J.ANTONIOS 1, N.GINOT 1, C.BATARD 1, Y. SCUDELLER 2, M. MACHMOUM 1
1 Université de Nantes, Ecole Polytechnique, IREENA, France
2 Université de Nantes, Ecole Polytechnique, LGMPA, France

Session 18 16:00 Tuesday 27 Apr 2010
Modeling for Advanced Packaging
Chaired by Xueren Zhang, UTAC ; Cadmus Yuan, TNO
16:00 30mn Keynote presentation – Virtual Prototyping Advanced by Statistic and Stochastic Methodologies
Sven Rzepka 1, Axel Müller 2, Bernd Michel 1
1 Fraunhofer ENAS, Micro Materials Center Chemnitz/Berlin; Chemnitz, Germany
2 BorgWarner BERU Systems GmbH, Dept. Modeling and Analysis, Ludwigsburg, Germany
16:30 20mn Evaluation of Probing Process Parameters and PAD Designs: Experiments and Modeling Correlations for Solving Mechanical Issues
Romuald Roucou 1, Vincent Fiori 2, Florian Cacho 2, Karim Inal 3, Xavier Boddaert 3
1 STMicroelectronics, Crolles, France / Ecole Nationale Supérieure des Mines de Saint Etienne, CMP-GC, Gardanne, France
2 STMicroelectronics, Crolles, France
3 Ecole Nationale Supérieure des Mines de Saint Etienne, CMP-GC, Gardanne, France
16:50 20mn Numerical Modelling Methodology for Design of Miniaturised Integrated Products – an Application to 3D CMM Micro-probe Development
Pushpa Rajaguru 1, Stoyan Stoyanov 1, Ying Kit Tang 1, Chris Bailey 1, James Claverley 2, Richard Leach 2, David Topham 3
1 Centre for Numerical Modelling and Process Analysis, University of Greenwich, London, UK
2 Engineering Measurement Division, National Physical Laboratory, Teddington, UK
3 School of Engineering and Design, Brunel University, London, UK
17:10 20mn The probability design for wire bonding process by finite element and Monte Carlo method
Huixian Wu 1, Yangjian Xu 1, Lihua Liang 1, Yong Liu 2, Stephen Martin 2
1 Fairchild-ZJUT Microelectronic Packaging Joint Lab, Zhejiang University of Technology, Hangzhou, China
2 Fairchild Semiconductor, S. Portland, Maine, USA
17:30 20mn Mechanical Behaviour and Fatigue of Copper Ribbons used as Solar Cell Interconnectors
Steffen Wiese, Rico Meier, Frank Kraemer, Fraunhofer CSP, Halle, Germany

18.00 Reception at the venue

Session 19 09:00 Wednesday 28 Apr 2010
Progress in Thermo-mechanical design and Thermal Performance Enhancement
Chaired by Bernhard Wunderle, Fraunhofer-IZM ; Liping Zhu,TriQuint Semiconductor
09:00 30mn Keynote presentation – Thermo-mechanical design of a generic 0-level MEMS Package using Chip Capping and Through Silicon Via’s
B. Vandevelde 1, R. Janssens 1, S. Bouwstra 2, N. Pham 1, B. Majeed 1, P. Limaye 1, E. Beyne 1, H.A.C. Tilmans 1
1 IMEC, Leuven, Belgium
2 MEMS TC, Amsterdam, the Netherlands
09:30 30mn Keynote presentation – How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies
H. Frémont, IMS-Bordeaux, Université Bordeaux 1, UMR-5218, Talence, France
10:00 30mn Keynote presentation – Thermal Performance Enhancement by Exploitation of Nano-Effects
Bernhard Wunderle, Micro Materials Centre Berlin, Fraunhofer IZM, Germany

10.30 Break

Session 20 11:00 Wednesday 28 Apr 2010
Reliability Modeling
Chaired by Ole Hölck, Fraunhofer IZM
11:00 30mn Keynote presentation – Thermo-mechanical challenges in the longevity of microelectronics
A. W. J. Gielen, TNO Science and Industry, Eindhoven, The Netherlands
11:30 20mn Limitations of Norris-Landzberg Equation and Application of Damage Accumulation Based Methodology for Estimating Acceleration Factors for Pb Free Solders
Ahmer Syed, Amkor Technology, Chandler, USA
11:50 20mn Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via
Samed Barnat 1, Hélène Frémont 2, Alexandrine Gracia 2, Eric Cadalen 3, Catherine Bunel 3, François Neuilly 4, Jean-René Tenailleau 3
1  IPDIA ; NXP Semiconductors Caen ; IMS Bordeaux Université de Bordeaux, France
2 IMS Bordeaux, Université Bordeaux 1, France
3 IPDIA, Caen, France
4 IPDIA, IEMN Université de Lille 1, France
12:10 20mn Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures
Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura, Tohoku University
12:30 20mn Die Attach Interface Property Characterization as Function of Temperature Using Cohesive Zone Modeling Method
Xiaosong Ma 1, G.Q. Zhang 1, O. van der Sluis 2, K.M.B. Jansen 1, W.D van Driel 3, L.J. Ernst 1, Charles Regard 4, Christian Gautier 5, Hélène Frémont 6
1 Delft University of Technology, Delft, The Netherlands
2 Philips Applied Technologies, Eindhoven, The Netherlands
3 Delft University of Technology, Delft; NXP, Nijmegen, The Netherlands
4 NXP Semiconductors; LaMIPS, Université de Caen; IMS Université de Bordeaux, Talence, France
5 NXP Semiconductors; LaMIPS, Université de Caen, France
6 IMS Université de Bordeaux, Talence, France

Session 21 11:00 Wednesday 28 Apr 2010
Process Modelling
Chaired by Nancy Iwamoto, Honeywell ; Edward KL Chan, Hong Kong University of Science & Technology
11:00 30mn Keynote presentation – Multiscale approach optimization on surface wettabilty change on rough surface
Edward K L CHAN, Haibo FAN, Matthew M F YUEN, Hong Kong University of Science & Technology, Hong Kong
11:30 20mn Thermo-mechanical simulations of RF-MEMS 0-level package based on wafer bonding by soldering
Siebe Bouwstra, Remco Hageman, MEMS Technical Consultancy, Amsterdam, The Netherlands
11:50 20mn Electromigration modeling with consideration of hillock formation
Yuan Xiang Zhang 1, Lihua Liang 1, Yong Liu 2
1 Zhejiang University of Technology, Fairchild-ZJUT Microelectronic Packaging Joint Lab, Hangzhou, China
2 Fairchild Semiconductor Corp. S. Portland, USA
12:10 20mn Multiphysics Modeling and Design of Ultralarge Multiwafer MOVPE Reactor for Group III-Nitride Light Emitting Diodes
Changsung Sean Kim 1, Jongpa Hong 2, Jihye Shim 1, Yongsun Won 1, Yong-Il Kwon 1
1 Samsung Electro-Mechanics Co., Ltd.
2 Samsung LED Co., Ltd.
12:30 20mn Magnetic Analysis and Simulation of a Self-Propelled Capsule Endoscope
Chengzhi Hu, Mingyuan Gao, Zhenzhi Chen, Honghai Zhang, Sheng Liu, School of Mechanical Science & Engineering, Huazhong University of Science & Technology

Session 22 11:00 Wednesday 28 Apr 2010
Thermo-Mechanical Modeling II
Chaired by Cell Wong, Delft University of Technology
11:00 30mn Keynote presentation – Board level reliability of the advanced RF Power Packaging
Cadmus Yuan 1, Michael A. Asis 1, Joey Salta 1, Willem van Driel 2
1 PL RF Power & Base stations, BL HP-RF, BU MultiMarket Semiconductors, NXP Semiconductors, The Netherlands
2 Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands
11:30 20mn High temperature storage influence on molding compound properties
J. de Vreugd 1, K.M.B. Jansen 1, L.J. Ernst 1, C.Bohm 2
1 Technical University Delft, The Netherlands
2 Infineon Technologies AG, Munich, Germany
11:50 20mn Effects of the Geometrical Dimensions on Stress and Strain of Electrostatically Actuated MEMS Resonators at Pull-in and Stiction Positions
Marius Pustan 1, Véronique Rochus 2, Jean-Claude Golinval 2
1 University of Liège, Liège, Belgium / Technical University of Cluj-Napoca, Cluj-Napoca, Romania
2 University of Liège, Liège, Belgium
12:10 20mn Multi-scale numerical-experimental method to determine the size dependent elastic properties of composite silicon copper nano cantilevers using an electrostatic pull in experiment
R.H. Poelma, H. Sadeghian, S.P.M. Noijen, J.J.M. Zaal, G.Q. Zhang, Delft University of Technology, Delft, The Netherlands
12:30 20mn Copper Pillar Bump Structure Optimization for Flip Chip Packaging with Cu/Low-K Interconnects
Zhang Xueren 1, Zhu Wenhui 1, Liew B.P. 1, Gaurav M. 1, Yeo A. 2, Chan K.C. 2
1 United Test & Assembly Center Ltd, Singapore
2 GLOBALFOUNDRIES Singapore Pte Ltd

12.50 Lunch

Session 23 14:00 Wednesday 28 Apr 2010
Modeling Challenges in Thermal and Multiphysics Applications
Chaired by Chris Bailey, University of Greenwich ; Matthew Ming Fai Yuen, Hong Kong University of Science & Technology
14:00 30mn Keynote presentation – Two-scale vs three-scale FE analyses of shock-induced failure in polysilicon MEMS
S. Mariani 1, A. Ghisi 1, R. Martini 1, A. Corigliano 1, B. Simoni 2
1 Politecnico di Milano, Dipartimento di Ingegneria Strutturale, Milan, Italy
2 STMicroelectronics, MH Division, Cornaredo, Italy
14:30 30mn Keynote presentation – Simulation of Particle Levitation due to Dielectrophoresis
Rochus Véronique 1, Hannot Stephan 2, Golinval Jean-Claude 1, Rixen Daniel 2
1 University of Liège, Belgium
2 TU-Delft, Delft, The Netherlands
15:00 30mn Keynote presentation – Are Current Turbulence Modeling Practices Addressing Industry’s Needs for Electronics Thermal Design ?
Peter Rodgers, Valérie Eveloy, Department of Mechanical Engineering, The Petroleum Institute, Abu Dhabi, United Arab Emirates

15.30 End of conference

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors

Authors: find your session number:

  • ALNUKARI :  7  AZZOPARDI :  17  Al-Bassyiouni :  11 13  Alavizadeh :  10  Alkemade :  2  Alsaleem :  9  Ancey :  3  Angral :  16  Antón :  10  Ardito :  3  Arruda :  8  Asis :  22  Assous :  6  Aubel :  11  Auersperg :  5  Azzopardi :  11  
  • BELMEHDI :  17  BERNABE :  11  BONFOH :  11  Bagdahn :  11  Bailey :  16 18  Balemans :  11  Baric :  7  Barink :  8  Barnat :  20  Barreau :  16  Bauer :  15  Belov :  10  Bengoechea :  10  Berg :  8  Bernabé :  4  Bettiati :  11  Betzl :  11  Beyne :  19  Biet :  11  Bissuel :  4  Blansaer :  11  Blecic :  7  Boddaert :  18  Boehme :  14  Borras :  11  Borzdun :  11  Bossuyt :  8  Bouwstra :  6 11 14 19 21  Brizar :  11  Brizoux :  11  Bunel :  20  Bychikhin :  7  
  • CHAN :  21  CHAUFFLEUR :  17  Cacho :  18  Cadalen :  20  Caers :  16  Carpentier :  3  Casset :  3  Cassidy :  11  Chan :  5  Chang :  11  Chen :  11 15 21  Cheng :  15  Chi :  4  Chiang :  4  Choi :  6 11  Christensen :  15  Christiaens :  8  Ciptokusumo :  11  Civet :  3  Claverley :  18  Convenant :  11  Coq :  16  Corfa :  4  Corigliano :  3 23  Coutellier :  11  Creutzburg :  11  Cuddalorepatta :  13  
  • DALVERNY :  11  DELETAGE :  17  Daniel :  4 23  Dasgupta :  11 13  Deletage :  11  Dermitzaki :  15  Doering :  2  Douglas :  13  Dowhan :  11  Driel :  1 2 3 11 13 20 22  Drumond :  12  Dudek :  2  Dufrenne :  4  Durand :  3  
  • Ernst :  2 20 22  Eveloy :  23  
  • FAN :  21  FAVRE :  17  FENDLER :  11  FRADIN :  17  Falat :  11  Fan :  1  Faria :  13  Favre :  11  Felba :  11  Feng :  12  Ferrand :  12  Filho :  11  Fink :  4  Fiori :  18  Frangi :  3  Frankenstein :  14  Franz :  11  Freeman :  15  Frémont :  11 12 19 20  
  • GOLINVAL :  3  Gang :  6  Gao :  21  Gasse :  4  Gatzen :  11  Gautier :  20  Ghisi :  23  Gielen :  2 9 20  Gillon :  11  Golinval :  22  Gonzalez :  8  Goumans :  13  Gracia :  11 20  Grillberger :  5  Grivon :  11  Groenhuis :  5  Guo :  11  Gupta :  16  Guyenot :  11  
  • HUI :  12  Hageman :  21  Halls :  15  Hamid :  14  Hauck :  10 12  Hicham :  12  Hofinger :  6  Hokka :  16  Holgado :  5  Hong :  21  Hoof :  14  Hsu :  8  Hu :  21  Hunt :  16 17  Hölck :  12 15  
  • Iker :  8  Inal :  18  Ivankovic :  11  Iwamoto :  15  
  • Jacobsson :  11  Jansen :  1 20 22  Janssens :  19  Jean :  14  Jean-Claude :  23  Jong :  16  Jungwirth :  6  Juntunen :  11  
  • KARAMA :  11  KHLIFA :  11  Kamara :  16  Kamminga :  2  Khan :  4  Khatir :  11  Kim :  21  Kishi :  20  Kolbeck :  10  Kraemer :  11 16 18  Kregting :  2  Kretschmann :  11  Kreyssig :  2  Kwon :  21  
  • LENCZNER :  12  LIPINSKI :  11  Lahti :  11  Lambird :  5  Landesman :  11  Lanier :  11  Larraona :  10  Laruelle :  11  LeClec’H :  11  Leach :  18  Lee :  5  Lehr :  5  Leisner :  10  Lenkkeri :  11  Leon :  11  Levo :  9  Liang :  12 18 21  Lienig :  16  Lieske :  14  Limaye :  19  Lindgren :  10  Liu :  12 18 21  Lu :  16  
  • MACHMOUM :  17  MSOLLI :  11  Ma :  20  Machado :  8  Mack :  4  Maio :  16 17  Majeed :  19  Malena :  7  Mariani :  23  Marinho :  8  Martens :  4  Martin :  18  Martini :  23  Masi :  3  Masip :  10  Matthieu :  11  Mattila :  2  Mavromaras :  15  Meier :  11 18  Meinders :  8  Meinshausen :  12  Meyendorf :  14  Michel :  2 5 15 18  Miles :  14  Miro :  2  Miura :  20  Monier-Vinard :  4  Monthei :  5  Moutanabbir :  13  Mroßko :  11  Murdoch :  17  Murphy :  4  Mélanie :  14  Müller :  12 18  
  • NOELS :  3  Nakahira :  20  Naumann :  13  Neto :  11  Neuilly :  20  Nguegang :  11  Noijen :  5 22  
  • Ollier :  3  Ooms :  11  Oswald :  11  Ouakad :  9  
  • Pagliosa :  11  Pape :  2  Park :  6  Paulasto-Kröckel :  2 16  Peels :  16  Petzold :  13  Pham :  19  Pitarresi :  9  Plana :  12  Platek :  11  Poelma :  22  Pogany :  7  Pons :  12  Prasad :  11  Puers :  14  Pustan :  22  
  • Quintero :  12  
  • RATIER :  12  RIBOT :  11  ROCHUS :  3  Rajaguru :  18  Ramini :  14  Ramos :  10  Ratchev :  11  Regard :  20  Reiche :  13  Rhayem :  7  Ribot :  4  Rigby :  15  Rivas :  10  Robert :  3  Rochus :  22  Rodgers :  23  Roellig :  11 14  Rolland :  6  Rongen :  1  Roucou :  18  Ryden :  10  Rzepka :  16 18  
  • SCUDELLER :  17  Sadeghian :  22  Saka :  4  Salta :  22  Sandmaier :  11  Sato :  20  Saxe :  15  Schilling :  13  Schlottig :  2  Scholten :  13  Schriever :  13  Schubert :  14  Segre :  6  Seok :  6  Shim :  21  Silva :  8  Simoni :  23  Sluis :  5 8 20  Soestbergen :  1  Spaan :  11  Stempin :  16  Stephan :  23  Stoyanov :  18  Su :  4  Suzuki :  20  Syed :  20  Sykes :  16  
  • Tack :  7  Takeda :  4  Tang :  18  Tenailleau :  20  Tesarski :  12  Thomas :  16 17  Tilmans :  14 19  Timmermans :  8  Tohmyoh :  4  Topham :  18  Tougui :  16  Turek :  11  
  • Vanderstraeten :  11  Vandevelde :  8 11 14 19  Vanfleteren :  8  Vanstreels :  11  Veninga :  9  Voelklein :  4  Vogel :  5  Vreugd :  22  
  • 0 :  1 2 11 22  
  • Vries :  11  Véronique :  23  
  • WOIRGARD :  17  WU :  3  Walczyk :  5  Wald :  11  Wang :  12  Weide-Zaage :  9 11 12  Weinzierl :  6  Wenhui :  22  Wieers :  7  Wiese :  11 16 18  Wilde :  4  Wimmer :  15  Wittler :  11  Woirgard :  11  Wolf :  15  Wolter :  11  Won :  21  Wong :  15  Wu :  18  Wunderle :  2 15 19  Wymyslowski :  11 12  
  • Xiao :  2  Xu :  18  Xueren :  22  
  • YAKOUBI :  12  YUEN :  21  Yakimets :  8  Yang :  4 11 13  Younis :  9 14  Yu :  15  Yuan :  11 22  Yuen :  15  
  • Zaal :  3 22  Zekry :  14  Zhang :  3 11 15 16 20 21 22  Zhao :  16  Zhu :  5  ZÈANH :  11  
  • lall :  16  
  • 2 :  15  

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Compiled on Fri, 23 Apr 2010 15:14:45 +0200