EuroSimE 2009 in Delft

EuroSimE 2009 was locally organised by TU Delft (Leo Ernst, Kaspar Jansen and team) in TUD Congress Centre, Delft, The Netherlands

The 10th EuroSimE was held in the Aula congress centre of the Technical University of Delft, in the Netherlands, April 2009. It was attended by 150 individuals.

5 training courses were offered on Sunday. The software exhibition brought together 7 exhibitors.

Proceedings of EuroSimE 2009
760 pages
IEEE Catalog Number CFP09566-PRT
ISBN 978-1-4244-4159-4
Library of Congress 200901561

CD-ROM version: IEEE Catalog number CFP09566-CDR
ISBN 978-1-4244-4161-7
Library of Congress 2009901561

This was the technical programme of EuroSimE 2009:

09.10

INDUSTRIAL TRENDS KEYNOTE 1: Trends in Analog and Power Packaging, Dan Kinzer, Senior VP at Fairchild Semiconductor Corp., USA

09.40

INDUSTRIAL TRENDS KEYNOTE 2: From convergence to diversification, Gerard F.M. Beenker VP, Scientific Director NXP Semiconductors / Corporate I&T, The Netherlands

10.10

INDUSTRIAL TRENDS KEYNOTE 3: The Automotive Si(mu)licon Drive, by Peter van Staa, Robert Bosch GmbH

Session 1		11:10	Monday 27 Apr 2009
New Developments in Modeling Chaired by B. Michel, Fraunhofer IZM; L.J. Ernst, Delft University of Technology
11:10	30mn	Keynote presentation – Challenges in LED thermal characterisation Clemens J.M. Lasance, Philips Research, the Netherlands Andras Poppe, Mentor Graphics MicReD Division, Hungary
11:40	30mn	Keynote presentation – Application of stress sensing test chips to area array packaging Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, M. Kaysar Rahim, Jordan C. Roberts, Safina Hussain, Auburn University, USA
12:10	30mn	Keynote presentation – Simulation approaches for magnetic resonance imaging sensors Jan G. Korvink ¹, Zhenyu Liu ², Andreas Peter ², Laura Del Tin ², Feng Jia ², Raghad Zohair ², Ibrahim El-Kair ² ¹ Dpt of Microsystems Engineering (IMTEK), University of Freiburg, Germany; Freiburg Institute of Advanced Studies (FRIAS), University of Freiburg, Germany ² Dpt of Microsystems Engineering (IMTEK), University of Freiburg, Germany

Session 2		14:00	Monday 27 Apr 2009
Thermo-Mechanical Modeling Chaired by P. Lall, Auburn University; Y. Liu, Faichild Semiconductors
14:00	30mn	Keynote presentation – Applications of FE multi-scale simulations in microelectronics Richard van Silfhout, Thijs Viegers, Philips Applied Technologies, Eindhoven, The Netherlands
14:30	20mn	Accurate Thermal Cycle Lifetime Estimation for BGA Memory Components with Lead-free Solder Joints Przemyslaw Gromala, Jan Reichelt, Sven Rzepka, Qimonda Dresden
14:50	20mn	Constitutive Behaviour of Copper Ribbons used in Solar Cell Assembly Processes Steffen Wiese, Rico Meier, Frank Kraemer, Joerg Bagdahn, Fraunhofer Center for Silicon Photovoltaics, Halle (Saale)
15:10	20mn	On the epoxy moulding compound aging effect on package reliability Sander Noijen ¹, Roy Engelen ¹, Joerg Martens ², Alexandru Opran ¹, Olaf van der Sluis ¹ ¹ Philips Applied Technologies, Eindhoven, The Netherlands ² NXP Semiconductors, Hamburg, Germany
15:30	20mn	Analysis of the three-dimensional delamination behavior of stretchable electronics applications Olaf van der Sluis ¹, Peter Timmermans ², Edwin van der Zanden ³, Johan Hoefnagels ³ ¹ Philips Applied Technologies, Eindhoven, The Netherlands and Delft University of Technology, Delft, The Netherlands ² Philips Applied Technologies, Eindhoven, The Netherlands ³ Eindhoven University of Technology, Eindhoven, The Netherlands

Session 3		14:00	Monday 27 Apr 2009
Process Modeling Chaired by C. Bailey, The University of Greenwich; N. Iwamoto, Honeywell
14:00	30mn	Keynote presentation – Modeling, Simulation and Calibration of the Chip Encapsulation Molding Process Mike Roellig ¹, Sebastian Meyer ², Michael Thiele ³, Sven Rzepka ³, Klaus-Juergen Wolter ² ¹ Fraunhoferinstitut fuer Zerstoerungsfreie Pruefverfahren, Dresden ² Technische Universitaet Dresden ³ Qimonda GmbH & Co. KG, Dresden
14:30	20mn	Modeling Cure Shrinkage and Viscoelasticity to Enhance the Numerical Methods for Predicting Delamination in Semiconductor Packages M. Hossein Shirangi ¹, Bernhard Wunderle ², Olaf Wittler ², Hans Walter ², Bernd Michel ² ¹ Robert Bosch GmbH, Automotive Electronics, Germany ² Fraunhofer IZM, Micro Materials Center Berlin, Germany
14:50	20mn	Modeling and simulation of a nanowire based cantilever structure Ritu Bajpai, Onur Tigli, Mona Zaghloul, The George Washington University, Washington DC, USA
15:10	20mn	Package delamination as indicator of ball bond lift: New diagnostic methodology Manoubi Auguste BAHI ¹, Pascal LECUYER ¹, Annabelle GENTIL ¹, Hélène FREMONT ², Jean-Pierre LANDESMAN ³ ¹ ATMEL, Nantes, France ² IMS Université Bordeaux 1, Talence, France ³ IMN Université de Nantes, Nantes, France

Session 4		14:00	Monday 27 Apr 2009
Thermal Behavior Modeling and Characterization Chaired by P. Rodgers, The Petroleum Institute; X. Perpinya, Centro Nacional de Microelectrónica
14:00	30mn	Keynote presentation – Thermal Transient Behavior of Silicon-on-Glass BJTs Salvatore Russo ¹, Luigi La Spina ², Vincenzo d’Alessandro ¹, Niccolò Rinaldi ¹, Massimiliano De Magistris ³, Lis K. Nanver ² ¹ Department of Electronics and Telecommunications Engineering, University of Naples Federico II, Naples, Italy ² Laboratory of Electronic Components, Technology & Materials (ECTM), Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology, Delft, The Netherlands ³ Department of Electrical Engineering, University of Naples Federico II, Naples, Italy
14:30	20mn	Efficient Solution of Inverse Thermal Problem via Parametric Model Order Reduction Tamara Bechtold, MCRTN COMSON, University of Wuppertal, Gauss Str. 20, 42119 Wuppertal, Germany Dennis Hohlfeld, )Holst Centre / IMEC, High Tech Campus 31, 5656 AE Eindhoven, The Netherlands Evgenii B. Rudnyi, CADFEM GmbH, Marktplatz 2, 85567 Grafing b. München, Germany
14:50	20mn	CFD Analysis of Water Jet Impingement Cooling System for Effective Cooling of IGBTs used in Power Electronics M. J. Rizvi ¹, R. Skuriat ², T. Tilford ¹, C. Bailey ¹, C. M. Johnson ², H. Lu ¹ ¹ School of Computing & Mathematical Sciences, The University of Greenwich, London, UK ² Department of Electrical & Electronic Engineering, The University of Nottingham, Nottingham, UK
15:10	20mn	High-Temperature CNFET Characteristics Samaneh Soleimani Amiri, Ali Afzali-Kusha, Behjat Forouzandeh, University of Tehran,Iran
15:30	20mn	Thermal Analysis Based on the Environmental Tests of STN Display Jian-Ping Li ¹, Ping Yang ¹, Jian Zhong ¹, Quayle Chen ², Cherie Jing ², Leon Xu ², Antti Salo ² ¹ School of Mechatronics Engineering, University of Electronic Science and Technology of China ² Nokia Research Center Beijing

Session 5		16:20	Monday 27 Apr 2009
Optimisation (TM) Chaired by J. Auersperg, Fraunhofer IZM; G. Zhiyin, Huazhong University of Science and Technology
16:20	30mn	Keynote presentation – Automated Optimization of Light Dose Distribution for Moving-Mask Lithography Fred van Keulen ¹, Yoshikazu Hirai ², Osamu Tabata ² ¹ Department for Precision and Microsystems Engineering, Delft University of Technology, The Netherlands ² Department of Micro Engineering, Graduate School of Engineering, Kyoto University, Japan
16:50	20mn	Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique Artur Wymyslowski ¹, Olaf Wittler ², Raul Mrossko ², Rainer Dudek ², Jürgen Auersperg ², Lukasz Dowhan ¹ ¹ Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Poland ² Fraunhofer Institute for Reliability and Microintegration (IZM), Micro Materials Center, Germany
17:10	20mn	Prediction of the thermo-mechanical material behavior of PEN foil during photolithographic processing M. Barink, M. Goorhuis, P. Giesen, F. Furthner, I. Yakimets, TNO/Holst Centre, Eindhoven, The Netherlands
17:30	20mn	Simulated annealing as a global optimization algorithm used in numerical prototyping of electronic packaging Lukasz Dowhan, Artur Wymyslowski, Krzysztof Urbanski, Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Poland

Session 6		16:20	Monday 27 Apr 2009
Electro-Mechanical Devices (Part 1) Chaired by D. Elata, Technion; A. Corigliano, Politecnico di Milano
16:20	30mn	Keynote presentation – Pull-in curves determined with monolithic FEM models Stephan Hannot, Daniel Rixen, Delft University of Technology
16:50	20mn	Optimising Dynamic Behaviour of Electrostatically Actuated MEMS Contact Switch Maryna Lishchynska ¹, Marcin Cychowski ¹, Niel Canty ², Tom O’Mahony ², Kieran Delaney ¹ ¹ TEC Centre, Cork Institute of Technology, Cork, Ireland ² Advanced Control Group, Cork Institute of Technology, Cork, Ireland
17:10	20mn	The dynamic model of electrostatic torsion mirror with pullin consideration for multiphysics behavior anticipation Yuheon Yi, Hiroyuki Fujita, Hiroshi Toshiyoshi, University of Tokyo, Tokyo, Japan
17:30	20mn	3D multi-frequency MEMS electromechanical resonator design F. Casset ¹, C. Durand ², S. Dedieu ³, JF. Carpentier ³, JP. Gonchond ³, P. Ancey ³, P. Robert ¹ ¹ CEA, LETI, MINATEC ² IEMN ³ ST

Session 7		16:20	Monday 27 Apr 2009
Innovative Methods for Microsystems Modelling Chaired by M. Gonzalez, IMEC; M. Lindgren, SP Technical Research Institute of Sweden
16:20	30mn	Keynote presentation – On Electrochemical Cell Modelling as Basis for Predicting Corrosion Failures in Plastic Encapsulated Microelectronics M. van Soestbergen ¹, R.T.H. Rongen ², A. Mavinkurve ², G.Q. Zhang ³, L.J. Ernst ⁴ ¹ Materials Innovation Institute, Delft, the Netherlands ² NXP Semiconductors, Nijmegen, the Netherlands ³ NXP Semiconductors, Eindhoven, the Netherlands ⁴ Delft University of Technology, Delft, the Netherlands
16:50	20mn	Uncertainty and Reliability Analysis of Chip Scale Package Subjected to Board-level Drop Test Masafumi Sano, Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Kuo-Ning Chiang, Advanced Microsystem Packaging and Nano-Mechanics Research Lab Dept. of Power Mechanical Engineering, National Tsing Hua University, Taiwan
17:10	20mn	Analytical model of electrostatic membrane-based actuators C. Maj ¹, M. Olszacki ¹, M. Al Bahri ¹, P. Pons ¹, A. Napieralski ² ¹ LAAS-CNRS, Universite de Toulouse, Toulouse, France ² Technical University of Lodz, Lodz, Poland
17:30	20mn	A Fusion Approach to IGBT Power Module Prognostics Nishad Patil ¹, Diganta Das ¹, Chunyan Yin ², Hua Lu ², Chris Bailey ², Michael Pecht ³ ¹ Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, USA ² School of Computing and Mathematical Science, University of Greenwich, UK ³ CALCE, University of Maryland, USA; Dpt of Electronics Engineering, City University of Hong Kong

Session 8		09:00	Tuesday 28 Apr 2009
Dynamics Chaired by T. Tee, Amkor; R. Dudek, Fraunhofer IZM
09:00	30mn	Keynote presentation – Copper Trace Fatigue Models for Mechanical Cycling, Vibration and Shock/Drop of High-Density PWAs Daniel Farley ¹, Yuxun Zhou ¹, Farbod Askari ¹, Moustafa Al-Bassyiouni ¹, Abhijit Dasgupta ¹, J. F. J. Caers ², J. W. C. DeVries ² ¹ University of Maryland ² Philips
09:30	20mn	A Multiscale-Stochastic Finite Element Approach to Shock-Induced Polysilicon MEMS Failure S. Mariani ¹, A. Ghisi ¹, R. Martini ¹, A. Corigliano ¹, B. Simoni ² ¹ Politecnico di Milano, Dipartimento di Ingegneria Strutturale, Milano, Italy ² MAHRS Unit, STMicroelectronics, Cornaredo, Italy
09:50	20mn	Design for Board Trace Reliability of WLCSP under Drop Test Tong Yan Tee ¹, Hun Shen Ng ¹, Ahmer Syed ², Rex Anderson ², Choong Peng Khoo ¹, Boyd Rogers ² ¹ Amkor Technology, Singapore ² Amkor Technology, USA

Session 9	11:00	Tuesday 28 Apr 2009
Thermo-Mechanical Issues in Microelectronics Chaired by K. Jansen, Technical University of Delft; H. Pape, Infineon Technologies
	Assembly induced failures in thin film MEMS packages J.J.M. Zaal ¹, W.D. van Driel ², J.T.M. van Beek ³, G.Q. Zhang ² ¹ Delft University of Technology ² NXP Semiconductors, Delft University of Technology ³ NXP Semiconductors
	Design for Reliability Methodology for Micro Laser Welding of Pigtail Fibres Asif Malik ¹, Stoyan Stoyanov ¹, Chris Bailey ¹, Paul Firth ² ¹ University of Greenwich ² Bookham Technology
	Effects of Geometry and Material Properties for Stacked IC Package with Spacer Structure Ming-Che Hsieh, Chih-Kung Yu, Wei Lee, Industrial Technology Research Institute, Hsinchu, Taiwan
	Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests Fubin Song ¹, Tong Jiang ¹, Jeffery C. C. Lo ¹, S. W. Ricky Lee ¹, Keith Newman ² ¹ EPACK Lab, Center for Advanced Microsystems Packaging, Hong Kong University of Science & Technology ² SUN Microsystems
	Development of a submodel technique for the simulation of solder joint fatigue of electronic devices mounted within an assembled ECU. Natalja Schafet ¹, Christian Lemm ¹, Ulrich Becker ¹, Herbert Güttler ², Philipp Schmid ² ¹ Robert Bosch GmbH, Schwieberdingen, Germany ² MicroConsult GmbH, Bernstadt, Germany
	Probabilistic Effects in Thermal Cycling Failures of High-I/O BGA Assemblies Shaughn London ¹, Dominic Fricano ¹, Abhijit Dasgupta ¹, Tommi Reinikainen ², Germano Freitas ³, Cleber Pagliosa ³ ¹ University of Maryland ² Nokia ³ INdT
	Drop Test Simulation Study of Flexible Devices Quayle Chen ¹, Leon Xu ¹, Cherie Jing ¹, Tom Xue ¹, Bin Wang ¹, Tiejun Zhao ¹, Antti Salo ¹, Kari Ojala ² ¹ Nokia Research Center (Beijing), China ² Nokia Devices, R&D (Helsinki), Finland
	Sensitivity Analysis of Technological Fabrication Tolerances on the Lifetime of Flip-Chip Solder Joints Tilman Eckert, Kornelius Tetzner, Olaf Bochow-Ness, Wolfgang H. Müller, Herbert Reichl, Technische Universität Berlin, Berlin, Germany
	In-Situ Observation of SAC305 Degradation during Isothermal Cycling of Joint-Scale Samples Dominik Herkommer, Michael Reid, Jeff Punch, Stokes Institute, University of Limerick, Ireland
	Comprehensive Material Characterization of Organic Packaging Materials Bjoern Boehme ¹, K.M.B. Jansen ², Sven Rzepka ³, Klaus-Juergen Wolter ¹ ¹ Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany ² Delft University of Technology, Mechanics of Materials, Delft, The Netherlands ³ Qimonda Dresden, Dresden, Germany
	Impact of the UBM geometry and solder bump shape on electromigration reliability in a package system Yuanxiang Zhang ¹, Lihua Liang ¹, Xuefan Chen ¹, Yong Liu ², Timwah Luk ², Scott Irving ² ¹ Fairchild-ZJUT Joint Lab, Zhejiang University of Technology ² Fairchild Semiconductor Corp.
	The influence of process parameters and material properties on stress distribution in MEMS-ASIC integrated systems after molding- numerical and experimental approach. Tomasz Falat ¹, Kazimierz Friedel ¹, Krzysztof Malecki ¹, Dominika Uruska ¹, Wilfred Gal ² ¹ Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland ² Fico B.V., Duiven, The Netherlands
	Lifetime Modeling for Jedec Drop Tests Frank Krarmer, Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany Sven Rzepka, Qimonda Dresden GmbH & Co OHG, Dresden, Germany Jens Lienig, Dresden University of Technology, Institute of Electromechanical and Electronic Design, Germany
	Dynamic model for design optimization of a high bandwidth thermal linear motor S.L. Paalvast ¹, P.M. Sarro ², R.H. Munnig Schmidt ¹ ¹ Delft University of Technology, 3mE – PME – MSD ² Delft University of Technology, DIMES – ECTM
	Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens R. Metasch ¹, J.C. Boareto ¹, M. Roellig ², S. Wiese ³, K.-J. Wolter ¹ ¹ Technische Universität Dresden, Electronics Packaging Laboratory ² Fraunhofer Institut für Zerstörungsfreie Prüfverfahren ³ Fraunhofer-Center für Silizium-Photovoltaik
	Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components. T. Falat ¹, K.M.B. Jansen ², J. de Vreugd ², S. Rzepka ³ ¹ Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics ² Delft University of Technology, Faculty of Mechanical, Maritime and Materials Engineering ³ Qimonda Dresden GmbH & Co OHG, Dept. QD BET CMI
	Virtual prototyping of a Wafer Level Chip Scale Package: Underfill role in die cracking Samed Barnat ¹, Stephane Bellenger ², Helene Frémont ³, Alexandrine Gracia ³, Pascal Talbot ⁴ ¹ NXP Semiconductors, Caen; Université Bordeaux I, Laboratoire IMS, France ² NXP Semiconductors, Caen, France ³ Université Bordeaux I, Laboratoire IMS, France ⁴ NXP Semiconductors, Caen, France
	Influence of Thermal Ageing on Long Term Reliability of SnAgCu Solder Joints B. Dompierre ¹, V. Aubin ², E. Charkaluk ², W. C. Maia Filho ¹, M. Brizoux ¹ ¹ Engineering & Process Management, Thales Corporate Services SAS, 92366 Meudon, France ² Laboratoire de Mécanique de Lille, UMR CNRS 8107, 59651 Villeneuve d’Ascq Cedex, France
	Design Study of the Bump on Flexible Lead by FEA for Wafer Level Packaging I. Eidner ¹, B. Wunderle ², K. L. Pan ³, M. J. Wolf ², O. Ehrmann ¹, H. Reichl ¹ ¹ Technical University of Berlin, Germany ² Fraunhofer Institute for Reliability and Microintegration, Germany ³ Guilin University of Electronic Technology, China
	Investigation on the loading of thermomechanical actuators to improve efficient thermomechanical reduction bases for fast reanalysis Alexander M. Steenhoek, Daniel J. Rixen, Delft University of Technology, The Netherlands
	Influence of build-up construction and resin-content on mechanical behavior of printed circuit boards W. C. Maia Filho, M. Brizoux, B. Dompierre, B. Guillaume, Thales Corporate Services – EPM, Meudon-la-Forêt, France
	Characterisation and modelling of the nanoindentation experiment in Au layers Olaf Wittler ¹, Raúl Mroßko ², Saskia Huber ¹, Astrid Gollhardt ¹, Bernd Michel ¹ ¹ Micro Materials Center, Fraunhofer IZM, Berlin, Germany ² AMIC GmbH, Berlin, Germany
	Cure-induced warpage of micro electronics: comparison with experiments J. de Vreugd ¹, K.M.B. Jansen ¹, L.J. Ernst ¹, C. Bohm ², T. Falat ³ ¹ TU-Delft ² Infineon ³ TU Wroclaw
	Board Level Reliability Improvement of Ultra Thin Leadless Package (UTLP) Concept Cadmus Yuan ¹, G.Q. (Kouchi) Zhang ², Joey Salta ¹, Rik Jos ¹ ¹ NXP Semiconductors, The Netherlands ² NXP Semiconductors; Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands
	Moisture Effects on a SiP Carrier Xiaosong Ma ¹, K.M.B. Jansen ¹, L.J. Ernst ¹, W.D van Driel ², O. van der Sluis ³, G.Q.Zhang ² ¹ Delft University of Technology ² Delft University of Technology and NXP the Netherlands ³ Delft University of Technology and Philips

Session 10	11:00	Tuesday 28 Apr 2009
Multi-Physics and Thermal Issues in Microelectronics Chaired by K. Jansen, Technical University of Delft; H. Pape, Infineon Technologies
	A Conformal Mapping based Approach for Fast Two-Dimensional FEM electrostatic analysis of MEMS devices without re-meshing Prasad S Sumant, Andreas C Cangellaris, Narayana R Aluru, University of Illinois at Urbana-Champaign, Urbana, IL, USA
	Numerical modeling of two proposed mechanically fabricated free-fins heatsinks Jan Bijan Pourian, Mark Irwin, Erik Dahlquist, Department of energy technique Malardalen University Mdh, Outokumpu fabrication technology,Mdh
	A Multiscale Model of Micro Cantilever Arrays Lenczner Michel, Cogan Scott, Pillet Emannuel, Hui Hui, FEMTO-ST
	Rigid-Flexible Printed Circuit Structure Optimization by Simulation Hai-bo Sun ¹, Ming-quan Shi ¹, Ping Yang ¹, Jian Zhong ¹, Quayle Chen ², Tom Xue ², Tiejun Zhao ², Leon Xu ², Antti Salo ² ¹ School of Mechatronics Engineering, University of Electronic Science and Technology of China ² Nokia Research Center Beijing
	FEA Based Design Optimization of Exciting Sensitivity for Micromachined Piezoelectric Transducer Chengguang Cai ¹, Yang Liu ², Yanan Han ², Quayle Chen ², Antti Salo ², Leon Xu ² ¹ Beijing University of Posts and Telecommunications, Beijing, China ² Nokia Research Center (Beijing), China
	Simulating the real geometry of an electrostatic switch to study the effect of uncertainties on the pull-in voltage. H.ACHKAR, LAAS-CNRS, University of Toulouse: INSA P.PONS, LAAS-CNRS M.SARTOR, University of Toulouse: INSA R.PLANA, LAAS-CNRS, University of Toulouse: UPS
	Dynamic Study and Structure Enhancement of Small Outline Dual-in-line Memory Module C. J. Huang, C. Y. Chou, K. N. Chiang, Advanced Microsystem Packaging and Nano-Mechanics Research Lab Dept. of Power Mechanical Engineering, National Tsing Hua University, Taiwan
	Design and Simulation Study for an Electro-Thermally Actuated Micromanipulator Rodica Voicu, Catalin Tibeica, Raluca Muller, National Institute for Research and Development in Microtechnologies (IMT-Bucharest), Bucharest, Romania
	High Vibration Sensors: Modelling, Design and Integration Véronique Rochus ¹, Stefanie Gutschmidt ¹, Jean-Claude Golinval ¹, Michel Saint-Mard ², Bruno Heusdens ¹, Fabrice Haudry ¹, Jacques Destiné ¹ ¹ University of Liège ² TAIPRO Engineering SA
	Challenges in MEMS parametric macromodeling based on mode superposition technique Vladimir Kolchuzhin, Wolfram Dötzel, Jan Mehner, Chemnitz University of Technology, Chemnitz, Germany
	Multi-disciplinary Approach to Design of a Power Electronics Module for Harsh Environments Mats Lindgren ¹, Ilja Belov ², Alf Johansson ², Torkel Danielsson ³, Niklas Gunnarsson ¹, Peter Leisner ⁴ ¹ SP Technical Research Institute of Sweden ² School of Engineering, Jönköping University ³ Proxy Electronics AB ⁴ SP Technical Research Institute of Sweden/School of Engineering, Jönköping University

Session 11		13:30	Tuesday 28 Apr 2009
Reliability and Materials Chaired by B. Wunderle, Fraunhofer IZM; J. Wilde, IMTEK
13:30	30mn	Keynote presentation – Prognostics and Condition Monitoring of Electronics Pradeep Lall ¹, Prashant Gupta ¹, Dhananjay Panchagade ¹, Manish Kulkarni ¹, Jeff Suhling ¹, James Hofmeister ² ¹ Auburn University ² Ridgetop, Inc.
14:00	20mn	Wire bonding degradation induced by temperature gradients under active cyclic loading R. Pufall, P. Alpern, W. Kanert, T. Smorodin, M. Stecher, Infineon Technologies AG
14:20	20mn	Thermo-Mechanical Reliability Assessment for 3D Through-Si Stacking Rainer Dudek ¹, Birgit Brämer ¹, Roland Irsigler ², Sven Rzepka ³, Bernd Michel ¹ ¹ Fraunhofer ENAS, Micro Materials Center Berlin and Chemnitz, Germany ² Qimonda AG ³ Qimonda Dresden GmbH & Co. OHG
14:40	20mn	Influence of moisture on the time and temperatue dependent properties of polymer systems Walter, H. ¹, Dermitzaki, E. ¹, H.Shirangi ², Wunderle,B. ¹, Hartmann, S. ³, Michel, B. ¹ ¹ Fraunhofer IZM, Micro Materials Center Berlin /Chemnitz, Germany ² Robert Bosch GmbH, Reutlingen,Germany ³ Technische Universität Berlin (TUB), Berlin, Germany
15:00	20mn	Modeling the substrate effects on nanoindentation mechanical property measurement Mario Gonzalez, Kris Vanstreels, Adam M. Urbanowicz, IMEC

Session 12		13:30	Tuesday 28 Apr 2009
Multi-Physics Models for Reliability Chaired by D. Andersson, Swerea IVF; S. Wiese, Fraunhofer CSP
13:30	30mn	Keynote presentation – Moisture induced effects in PoP A. Guédon-Gracia, W. FENG, J.-Y. Delétage, F. Verdier, H. Frémont, IMS, Université bordeaux 1, FRANCE
14:00	20mn	Thermo-mechanical modeling of stress-induced-voiding in BEOL Cu interconnects structures Melina Lofrano ¹, Christopher J. Wilson ², Kristof Croes ¹, Bart Vandevelde ¹ ¹ IMEC, Leuven, Belgium ² School of Electrical, Electronic, and Computer Engineering. Newcastle University, United-Kingdom
14:20	20mn	The electro-thermal-mechanical performance of an OLED: a multi-physics model study Sander Gielen ¹, Marco Barink ¹, Jeroen van den Brand ², Ton van Mol ² ¹ TNO Science and Industry, Eindhoven, The Netherlands ² Holst Centre, Eindhoven, The Netherlands
14:40	20mn	Electrically driven matter transport effects in PoP interconnections W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, H. Frémont, IMS, Université bordeaux 1, FRANCE
15:00	20mn	Effect of Wire Bond and Die Layout on Electrical Performance of Power Packages Yumin Liu ¹, Mark Rembrandr T Carredo ¹, Zhiping Hu ¹, Yong Liu ², Timwah Luk ², Scott Irving ² ¹ Fairchild Semiconductor, Suzhou ² Fairchild Semiconductor Corp., S. Portland

Session 13		13:30	Tuesday 28 Apr 2009
Molecular Dynamics Chaired by J. Qu, Georgia Tech; C. Yuan, NXP Semiconductors
13:30	30mn	Keynote presentation – A multiscale approach for investigation of interfacial delamination in electronic packages Haibo Fan, Matthew M F Yuen, Department of Mechanical Engineering, Hong Kong University of Science and Technology
14:00	20mn	Molecular Dynamics Simulation and Mechanical Characterisation for the Establishment of Structure-Property Correlations for Epoxy Resins in Microelectronics Packaging Applications B. Wunderle ¹, E. Dermitzaki ¹, O. Hölck ¹, J. Bauer ¹, H. Walter ¹, Q. Shaik ², K. Rätzke ², F. Faupel ², B. Michel ¹ ¹ Fraunhofer IZM ² Kiel University
14:20	20mn	Understanding Leakage Current Susceptibility in Dielectrics using Molecular Modeling Nancy Iwamoto, Honeywell Specialty Materials Ahila Krishnamoorthy, Honeywell Electronic Materials
14:40	20mn	Computational Study of Armchair Single Wall Carbon Nanotubes Dumitru Pavel, Kouchi Zhang, Cadmus Yuan, Department of Precision and Microsystem Engineering, Delft University of Technology, Delft The Netherlands
15:00	20mn	Investigation on thermal and mechanical properties of Crosslinked Epoxy Resin by MD Simulation Ningbo Liao ¹, G.Q. Zhang ¹, Dumitru Pavel ¹, Olaf van der Sluis ², K.M.B. Jansen ¹, L.J. Ernst ¹ ¹ Department of Precision and Microsystem Engineering, Delft University of Technology. 2600 GA, Delft. The Netherlands ² Philips Applied Technologies, High Tech Campus 7, 5656 AE Eindhoven, The Netherlands

Session 14		16:00	Tuesday 28 Apr 2009
Solder Modeling Chaired by A. Dasgupta, University of Maryland; F. Gao, Georgia Institute of Technology
16:00	30mn	Keynote presentation – Multi-scale analysis of solder interconnects in micro-electronics M.G.D. Geers ¹, M. Erinc ², M.A. Matin ¹ ¹ Eindhoven University of Technology, Eindhoven, The Netherlands ² TNO, Eindhoven, The Netherlands
16:30	20mn	Modelling of Sn3.0Ag0.5Cu Thermo-Mechanical Behaviour by a Continuum Damage Approach Marc GRIEU ¹, Gregor MASSIOT ², Olivier MAIRE ², Catherine MUNIER ², Yves BIENVENU ³, Jacques RENARD ³ ¹ EADS France Innovation Works / Ecole des Mines de Paris ² EADS France Innovation Works ³ Ecole des Mines de Paris
16:50	20mn	Combining Experimental and Simulation Methods for the Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads Karsten Meier ¹, Mike Roellig ², Steffen Wiese ³, K.-J. Wolter ¹ ¹ Technische Universität Dresden, Electronics Packaging Laboratory, D-01062 Dresden, Germany ² Fraunhofer Gesellschaft IZFP-D, Dresden, Germany ³ Fraunhofer Gesellschaft CSP, Halle, Germany
17:10	20mn	Influence of the Microstructure on the Stress State of Solder Joints during Thermal Cycling Alexander Menk, Robert Bosch GmbH Stephane Bordas, University of Glasgow, Department of Civil Engineering
17:30	20mn	Effect of Cyclic Fatigue Damage Accumulation on the Elastic-Plastic Properties of SAC305 Solders Gayatri Cuddalorepatta, Abhijit Dasgupta, CALCE Electronic Products and Systems Center, Mechanical Engineering Department, University of Maryland, USA

Session 15		16:00	Tuesday 28 Apr 2009
Innovative Methods for Multi-Physics Modeling Chaired by A. Frangi, Politecnico di Milano
16:00	30mn	Keynote presentation – On the numerical evaluation of capacitance and electrostatic forces in MEMS Raffaele Ardito, Leonardo Baldasarre, Alberto Corigliano, Department of Structural Engineering, Politecnico di Milano
16:30	20mn	Parameter Identification of Piezoelectric AlGaN/GaN Beam Resonators by Dynamic Measurements Steffen Michael ¹, Klemens Brueckner ², Florentina Niebelschuetz ², Katja Tonisch ², Christoph Schaeffel ¹ ¹ Institute for Microelectronic and Mechatronic Systems, Ilmenau ² Institute of Micro- and Nanotechnologies, Ilmenau University of Technology
16:50	20mn	Experimentally Validated and Automatically Generated Multi-Energy Domain Coupled Model of a RF MEMS Switch Martin Niessner ¹, Gabriele Schrag ², Jacopo Iannacci ³, Gerhard Wachutka ² ¹ Institute for Physics of Electrotechnology, Munich University of Technology, Munich, Germany, Munich, Germany ² Institute for Physics of Electrotechnology, Munich University of Technology, Munich, Germany ³ Fondazione Bruno Kessler (FBK), MemSRaD Research Unit, Povo di Trento, Italy
17:10	20mn	Simulation of large-scale periodic circuits by a homogenization method Nicolas Ratier, Michel Lenczner, FEMTO-ST/CNRS, Besançon, France

Session 16		16:00	Tuesday 28 Apr 2009
Modeling for Advanced Packaging Chaired by D. Yang, NXP Semiconductors; O. van der Sluis, Philips
16:00	30mn	Keynote presentation – Several Modeling Issues in LED, 3D-SiP, and Nano Interconnects Sheng Liu ¹, Kai Wang ², Zhiyin Gan ³, Xiaobing Luo ⁴, Xiaohui Song ⁵, Zhaohui Chen ⁵, Zongyuan Liu ⁶, Han Yan ⁷, Wei Wei ⁸, Pei Wang ⁶ ¹ Huazhong University of Science and Technology; Wuhan National Laboratory for Optoelectronics; School of Optoelectronics Science and Engineering, Huazhong University of Science & Technology, Wuhan, China ² Division of MOEMS, Wuhan National Laboratory for Optoelectronics; School of Optoelectronics Science and Engineering, University of Science & Technology, Wuhan, China ³ Huazhong University of Science and Technology; Wuhan National Laboratory for Optoelectronics; Wuhan, China ⁴ Division of MOEMS, Wuhan National Laboratory for Optoelectronics; School of Energy and Power Engineering, Huazhong University of Science & Technology, Wuhan, China ⁵ Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China; Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China ⁶ School of Mechanical Science and Engineering, Huazhong University of Science & Technology; Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China ⁷ Division of MOEMS, Wuhan National Laboratory for Optoelectronics; Department of Electronic Science & Technology, Huazhong University of Science & Technology, Wuhan, China ⁸ Division of MOEMS, Wuhan National Laboratory for Optoelectronics; School of Optoelectronics Science and Engineering, Huazhong University of Science & Technology, Wuhan, China
16:30	20mn	Experimental and numerical analyses of flexible PCBs under various loading conditions Luciano Arruda ¹, Renato Bonadiman ², Costa Josineto ³, Germano Freitas ² ¹ Instituto Nokia de Tecnologia; Universidade Estadual do Amazonas, Manaus, Brazil ² Instituto Nokia de Tecnologia, Manaus, Brazil ³ Instituto Nokia de Tecnologia; Universidade Federal do Amazonas, Manaus, Brazil
16:50	20mn	Modeling of Process and Reliability of Press-Fit Interconnections Thomas Fellner, Elena Zukowski, Jürgen Wilde, University of Freiburg – IMTEK, Germany
17:10	20mn	Reliability Modeling on a MOSFET Power Package Based on Embedded Die Technology Daoguo Yang ¹, Martien Kengen ², W.G.M. Peels ², David Heyes ³, W. D. van Driel ¹ ¹ Operations BE Innovation, NXP Semiconductors, Nijmegen, the Netherlands ² IS&O CSC-Innovation, NXP Semiconductors, Nijmegen, the Netherlands ³ BL Power Management, NXP Semiconductors
17:30	20mn	Fatigue life prediction models developed for Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS) A. Chaillot ¹, M. Grieu ¹, C. Munier ¹, I. Lombaert-Valot ¹, S. Bousquet ², C. Chastanet ², J-P. Canaud ³, R. Dumonteil ⁴, S. Villard ⁴, P. Raynal ⁵, D. Maron ⁵ ¹ EADS IW ² Airbus France ³ EADS SN ⁴ TECH-CI ⁵ ACTIA

Session 17		09:00	Wednesday 29 Apr 2009
New Developments I Chaired by N. Iwamoto, Honeywell; M. Geers, Technical University of Eindhoven
09:00	30mn	Keynote presentation – Ten Years of Thermal Analysis at EuroSimE – What’s Next? Peter Rodgers, Valerie Eveloy, The Petroleum Institute, Abu Dhabi, United Arab Emirates
09:30	30mn	Keynote presentation – Prognostics and Health Monitoring For Improved Qualification Michael Pecht, Prognostics and Health Management Center City University of Hong Kong; Center for Advanced Life Cycle Engineering (CALCE) University of Maryland, USA
10:00	30mn	Keynote presentation – On the Analysis of Spontaneous Adhesion in MEMS Raffaele Ardito, Alberto Corigliano, Attilio Frangi, Department of Structural Engineering, Politecnico di Milano, Italy

Session 18		11:00	Wednesday 29 Apr 2009
Electro-Mechanical Devices (Part 2) Chaired by M. Jungwirth, Upper Austria University of Applied Sciences
11:00	30mn	Keynote presentation – Experimental characterization and numerical simulation of a dielectric tuning technique dedicated to miniature monolithic NMR coils. Jean-Clément GUISIANO ¹, Simon LAMBERT ², Souhil MEGHERBI ³, Luc DARRASSE ², Jean-Christophe GINEFRI ² ¹ IEF/U2R2M ² U2R2M ³ IEF
11:30	20mn	Thermal and Mechanical Design Optimisation of a Micro Machined Mid-Infrared Emitter for Optical Gas Sensing Systems Falk Naumann ¹, Matthias Ebert ¹, Jürgen Hildenbrand ², Emmanuel Moretton ², Carolin Peter ², Jürgen Wöllenstein ² ¹ Fraunhofer Institute for Mechanics of Materials, Halle, Germany ² Fraunhofer Institute for Physical Measurement Techniques, Freiburg, Germany
11:50	20mn	Static and dynamic experimental investigations of a micro-electromechanical cantilever in air and vacuum Stefanie Gutschmidt ¹, Veronique Rochus ², Jean-Claude Golinval ² ¹ University of Canterbury, Dept. of Mechanical Engineering, Christchurch, NZ ² University of Liège, Dept. of Aerospace and Materials, Liège, Belgium
12:10	20mn	Frequency response of a 2D flow and thermal property sensor Ali Sükrü Çubukçu, Gerald A. Urban, IMTEK, University of Freiburg, Freiburg, Germany
12:30	20mn	Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints Shih-Wei Liang, Chih Chen, National Chiao Tung University

Session 19		11:00	Wednesday 29 Apr 2009
IC – Package Interactions Chaired by H. Fan, Hong Kong University of Technology; S. Rzepka, Qimonda
11:00	30mn	Keynote presentation – 3D Circuit Model for 3D IC Reliability Study Cher Ming Tan, Feifei He, Nanyang Technological University
11:30	20mn	Crack and Damage Evaluation in low-k BEoL Stacks under Chip Package Interaction Aspects Juergen Auersperg ¹, Dietmar Vogel ², Matthias U. Lehr ³, Michael Grillberger ³ ¹ Fraunhofer ENAS Chemnitz and AMIC GmbH Berlin, Germany ² Fraunhofer ENAS Chemnitz, Germany ³ AMD Fab36 LLC & Co. KG, Dresden, Germany
11:50	20mn	Virtual Prototyping for PPM-level Failures in Microelectronic Package W.D. van Driel ¹, R.A.B. Engelen ², A. Mavinkurve ¹, H. Cobussen ¹, M. van Dort ¹, M. van Eckendonk ¹, L. Endrinal ¹ ¹ NXP Semiconductors ² Philips Apptech
12:10	20mn	Package induced low-k delaminations: Numerical developments and Experimental Investigations to address FEBE compatibility fracture phenomena. Sébastien Gallois-Garreignot ¹, Vincent Fiori ¹, Daniel Nélias ² ¹ STMicroelectronics ² LaMCoS, INSA
12:30	20mn	Induced Delamination of Silicon-Molding Compound Interfaces Gerd Schlottig, Infineon Technologies AG, Regensburg, Germany Heinz Pape, Infineon Technologies AG, Munich, Germany Bernhard Wunderle, Fraunhofer IZM, Berlin, Germany Leo J. Ernst, TU-Delft, Delft, The Netherlands

Session 20		13:40	Wednesday 29 Apr 2009
New Developments II Chaired by W. Van Driel, NXP Semiconductors; X. Fan, Lamar University
13:40	30mn	Keynote presentation – Thermal simulation of defect localisation using Lock-In Thermography in complex and fully packaged devices Christian Schmidt ¹, Falk Naumann ¹, Frank Altmann ¹, Stefan Martens ² ¹ Fraunhofer Institute for Mechanics of Materials Halle, Germany ² Infineon Technologies AG, Regensburg, Germany
14:10	30mn	Keynote presentation – Cohesive Zone Simulation on Dynamic Fracture at the Interfaces of a Single Solder Joint Feng Gao ¹, Jianping Jing ², Frank Z. Liang ³, Richard L. Williams ³, Jianmin Qu ¹ ¹ Georgia Institute of Technology, USA ² Shanghai JiaoTong University, China ³ Intel Corporation
14:40	30mn	Keynote presentation – Co-Design and Multi-Physics Analysis for Power Electronic Modules C. Bailey, H. Lu, T. Tilford, C. Yin, J. Rizvi, University of Greenwich
15:10	30mn	Keynote presentation – System-Level Modeling and Simulation of a Frequency-Tunable Electrostatic Energy Harvester Dennis Hohlfeld, Svetla Matova, Rob van Schaijk, Holst Centre / IMEC, Eindhoven, The Netherlands

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