EuroSimE 2007 was locally organised by The University of Greenwich (Chris Bailey and team) in Holiday Inn Kensington Forum, London, England
EuroSimE 2007 in London, Great-Britain
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The 8th IEEE EuroSimE conference was held in London, Great-Britain, in April 2007 and was attended by 165 individuals. · courses were offered for professional training. |
Proceedings of EuroSimE 2007 – London, Great-Britain, April 2007
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766 pages A4 IEEE Catalog Number: 07EX1736 ISBN: 1-4244-1105-X |
| CD-ROM version IEEE Catalog Number: 07EX1736C ISBN: 1-4244-1106-8 crystal package The CD has a dedicated browser featuring a search capability on keywords: content, author, organisation, country. It contains also the proceedings of former EuroSimEs 2005 and 2006. |
Monday 16 Apr 2007 – Hour start 09:10 – Chairman: G.Q. Zhang, NXP, Eindhoven, The Netherlands
09:10 – 30mn Keynote: S1 thermomechanical [ PID 169 ]
Technology road maps in electronic packaging
Corresponding author: JürgenWolf – Fraunhofer Institute IZM
Full authors list: Juergen Wolf, Fraunhofer Institute IZM, Berlin, Germany
09:40 – 30mn Keynote: S1 thermomechanical [ PID 171 ]
Semiconductor Development Trends – Implications on Assembly and Packaging
Corresponding author: Horst Theuss – Infineon
Full authors list: Horst Theuss, Sr. Mgr. Packaging Innovation, Infineon Technologies AG, München, Germany
10:10 – 30mn Keynote: thermomechanical [ PID 170 ]
SiP and 3D developments and trends
Corresponding author: Gilles Poupon – CEA-LETI
Full authors list: Gilles Poupon, Head of programs on Advanced Packaging, CEA LETI – MINATEC, Grenoble, France
Monday 16 Apr 2007 – Hour start 11:10 – Chairman: L.J. Ernst, Delft University of Technology, The Netherlands
11:10 – 30mn Keynote: TM1 thermomechanical [ PID 166 ]
Nano Structures and their Properties
Corresponding author: Gang Chen – Massachusetts Institute of Technology
Full authors list: Gang Chen, Massachusetts Institute of Technology, USA
11:40 – 30mn Keynote: MP1 multiphysics [ PID 137 ]
Multi-Physics Modelling for Microelectronics and Microsystems – Current Capabilities and Future Challenges
Corresponding author: Chris Bailey – University of Greenwich
Full authors list: Chris Bailey, Hua Lu, Stoyan Stoyanov, Mike Hughes, Chunyan Yin, David Gwyer, University of Greenwich, UK
12:10 – 30mn Keynote: TF1 thermal [ PID 164 ]
The Changing Role of CFD in Electronics Thermal Design
Corresponding author: John Parry – Flomerics
Full authors list: John Parry, Flomerics Ltd, UK
Monday 16 Apr 2007 – Hour start 14:00 – Chairman: N. Iwamoto, Honeywell; T. Shimokawa, Kanazawa University
14:00 – 30mn Keynote: TM2 thermomechanical [ PID 148 ]
Atomistic Simulations of Interface Properties in Metals
Corresponding author: Dr. Tomotsugu Shimokawa – Division of Mechanical Science and Engineering, Graduate School of Natural Science and Technology, Kanazawa University
Full authors list: Tomotsugu Shimokawa, Graduate School of Natural Science and Technology, Kanazawa University, Japan
14:30 – 20mn TM3 thermomechanical [ PID 118 ]
Investigation of Carbon Nanotube Performance Under External Mechanical Stresses and Moisture
Corresponding author: Haibo Fan – Department of Mechanical Engineering, Hong Kong University of Science and Technology
Full authors list: Haibo Fan, Kai Zhang, Matthew M.F. Yuen, Department of Mechanical Engineering, Hong Kong University of Science and Technology, Hong Kong
14:50 – 20mn TM4 thermomechanical [ PID 89 ]
Simulation of Failure Criteria in Dielectric Layers
Corresponding author: Khalil Arshak – University of Limerick
Full authors list: Khalil Arshak, Ivor Guiney, Edward Forde, University of Limerick, Ireland
15:10 – 20mn TM5 thermomechanical [ PID 138 ]
Using Molecular Modeling to Understand Cleaner Efficiency for BARC (“Bottom Anti-Refective Coating”) Layers after Plasma Etch in Dual Damascene Structures
Corresponding author: Nancy Iwamoto – Honeywell
Full authors list: Nancy Iwamoto 1, Deborah Yellowaga 2, Amy Larson 2, Ben Palmer 2, Teri Baldwin-Hendricks 2
1 Honeywell Specialty Materials, San Diego, USA
2 Honeywell Electronic Materials, Chandler, USA
15:30 – 20mn TM6 thermomechanical [ PID 111 ]
The Chemical-Mechanical Relationship of the SiOC(H) dielectric Film
Corresponding author: Cadmus C. A. Yuan – Department of Precision and Microsystems Engineering
Full authors list: Cadmus C.A. Yuan 1, O. van der Sluis 1, G.Q. Zhang 1, L.J. Ernst 1, W.D. van Driel 2, R.B.R. van Silfhout 3, B.J. Thijsse 4
1 Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands
2 NXP Semiconductors, The Netherlands
3 Philips Applied Technologies, The Netherlands
4 Department of Materials Science and Engineering, Delft University of Technology, The Netherlands
Monday 16 Apr 2007 – Hour start 14:00 – Chairman: J. Sieiro, University of Barcelona, Spain
14:00 – 20mn MP3 multiphysics [ PID 25 ]
Extended Finite Element for Electromechanical Coupling
Corresponding author: Rochus Véronique – Delft University of Technology, Department of Precision and Microsystem Engineering
Full authors list: Rochus Véronique, Rixen Daniel, Delft University of Technology, The Netherlands
14:20 – 20mn MP4 multiphysics [ PID 34 ]
A Perturbation Method for the 3D Finite Element Modeling of Electrostaticaly Driven MEMS
Corresponding author: M. Boutaayamou – Dept. of Electrical Engineering and Computer Science, University of Liège
Full authors list: Mohamed Boutaayamou, Ruth V. Sabariego, Patrick Dular, Dept. of Electrical Engineering and Computer Science (ELAP) – University of Liège, Belgium
14:40 – 20mn MP5 multiphysics [ PID 73 ]
Optimizing the Dynamic Response of RF MEMS Switches using Tailored Voltage Pulses
Corresponding author: Vitaly Leus – Technion – Israel Institute of Technology
Full authors list: Vitaly Leus, Arnon Hirshberg, David Elata, Technion – Israel Institute of Technology, Israel
15:00 – 20mn MP6 multiphysics [ PID 116 ]
Efficient Electrostatic-Mechanical Modeling of C-V Curves of RF-MEMS Switches
Corresponding author: Jeroen Bielen – NXP Semiconductors
Full authors list: Jeroen Bielen, Jiri Stulemeijer, NXP Semiconductors, The Netherlands
Monday 16 Apr 2007 – Hour start 14:00 – Chairman: M. Vellvehi, Centre Nacional de Microelectrònica; V. Eveloy, The Petroleum Institute
14:00 – 30mn Keynote: thermal [ PID 106 ]
Packaging Design and Testing for High Temperature Applications > 150°C
Corresponding author: Schreier-Alt, Thomas – Fraunhofer IZM
Full authors list: Thomas Schreier-Alt, Christian Rebholz, Frank Ansorge, Fraunhofer IZM-MMZ, Germany
14:30 – 20mn thermal [ PID 99 ]
Validation of Dynamic Thermal Simulations of Power Assemblies Using a Thermal Test Chip
Corresponding author: Xavier Jorda – Centre Nacional de Microelectronica CNM-CSIC
Full authors list: Xavier Jorda, Miquel Vellvehi, Xavier Perpinya, Jose-Luis Galvez, Philippe Godignon, Centre Nacional de Microelectronica (CNM-CSIC), Spain
14:50 – 20mn thermal [ PID 38 ]
Failure Analysis of Power Silicon Devices at Operation above 200°C Junction Temperature
Corresponding author: Vasile OBREJA – National R&D Institute for Microtechnology (IMT- Bucuresti)
Full authors list: Vasile V.N. Obreja 1, Keith I. Nuttall 2, Octavian Buiu 2, Steve Hall 2
1 National R&D Institute for Microtechnology (IMT-Bucuresti), Bucharest, Romania
2 Department of Electrical Engineering and Electronics, The Liverpool University, UK
15:10 – 20mn thermal [ PID 127 ]
Electro-Osmotic Flow Based Cooling System For Microprocessors
Corresponding author: Perumal Nithiarasu – University of Wales Swansea
Full authors list: P.F. Eng, P. Nithiarasu, A.K. Arnold, P. Igic, O.J. Guy, School of Engineering, University of Wales, Swansea, UK
15:30 – 20mn thermal [ PID 130 ]
A Micromachined Gas Thermal Conductivity Sensor for Natural Gas Analysis: Thermal Model and Experimental results
Corresponding author: Santiago Marco – Universitat de Barcelona
Full authors list: G. Carles 1, S. Udina 1, M. Salleras 1, J. Santander 2, L. Fonseca 2, S. Marco 1
1 Departament d’Electrònica, Universitat de Barcelona, Barcelona, Spain
2 Centre Nacional de Microelectrònica, Campus UAB, Bellaterra, Spain
Monday 16 Apr 2007 – Hour start 16:30 – Chairman: Jürgen Auersperg, Fraunhofer IZM; Willem van Driel, NXP Semiconductors
16:30 – 30mn Keynote: TM32 thermomechanical [ PID 154 ]
Design-For-Reliability Tools for Highly Integrated System-On-Package Technology
Corresponding author: Suresh Sitaraman – The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
Full authors list: R.V. Pucha, S. Hegde, M. Damani, K. J. Leee, K. Tunga, A. Perkins, S. Mahalingam, G. Lo, K. Klein, J. Ahmad, Suresh Sitaraman, Packaging Research Center, Georgia Institute of Technology, Atlanta, USA
17:00 – 20mn TM8 thermomechanical [ PID 91 ]
Mechanical Characterization Analysis of Flexible and Stretchable Ultra-Thin Substrates by Experiment and FE Simulation
Corresponding author: Wang Lingen – Delft University of Technology
Full authors list: L. Wang 1, T. Zoumpoulidis 1, K.M.B. Jansen 1, M. Bartek 1, L.J. Ernst 1, G.Q. Zhang 2
1 Delft University of Technology, The Netherlands
2 NXP Semiconductors, The Netherlands
17:20 – 20mn TM9 thermomechanical [ PID 83 ]
Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis
Corresponding author: Mario Gonzalez – IMEC
Full authors list: Mario Gonzalez 1, Fabrice Axisa 2, Mathieu Vanden Bulcke 1, Dominique Brosteaux 3, Bart Vandevelde 1, Jan Vanfleteren 2
1 IMEC, Belgium
2 IMEC, TFCG Microsystems, Belgium
3 ELIS – TFCG Microsystems, University of Ghent, Belgium
Monday 16 Apr 2007 – Hour start 16:30 – Chairman: S. Marco, University of Barcelona, Spain; V. Rochus, University of Liège, Belgium
16:30 – 30mn Keynote: MP7 multiphysics [ PID 48 ]
Multiphysic Modelling of a Microactuator Based on the Decomposition of an Energetic Material: Application to Microfluidics
Corresponding author: Gustavo Adolfo Ardila Rodríguez – LAAS-CNRS
Full authors list: Gustavo Adolfo Ardila Rodríguez, Carole Rossi, LAAS-CNRS, Toulouse, France
17:00 – 20mn MP8 multiphysics [ PID 109 ]
Underexpanded Micro-nozzle Flow Simulation with Coupled Thermal-Fluid Modeling
Corresponding author: José A. Moríñigo – Instituto Nacional de Técnica Aeroespacial, Dpto. Programas Espaciales (A02)
Full authors list: José Hermida Quesada 1, José A. Moríñigo 2, Francisco Caballero Requena 2
1 Dept. Aerodynamics and Propulsion, National Institute for Aerospace Technology, Madrid, Spain
2 Dept. Space Programmes, National Institute for Aerospace Technology, Madrid, Spain
17:20 – 20mn MP9 multiphysics [ PID 81 ]
A Novel Micro/Nano Electromechanical Actuator with Integral Electrodes
Corresponding author: Manuel Carmona Flores – BRDL-Epson Europe Electronics GmbH
Full authors list: Jofre Pallarès 1, Manuel Carmona 2, Marta Duch 3, Marta Gerbolés 3, Lluís Terés 3
1 Barcelona International R&D core (BIRD), CNM-CSIC, Bellaterra (Barcelona), Spain
2 Barcelona R&D Laboratory (BRDL), Epson Europe Electronics GmbH, Sant Cugat del Vallès (Barcelona), Spain
3 Institut de Microelectrònica de Barcelona, Centre Nacional de Microelectrònica-CSIC, Bellaterra (Barcelona), Spain
17:40 – 20mn MP10 multiphysics [ PID 112 ]
Magnetically Actuated Microvalve For Disposable Drug Infusor
Corresponding author: Jasmina Casals-Terre – Technical University of Catalonia-UPC
Full authors list: M. Duch 1, J. Casals-Terré 2, J.A. Plaza 1, J. Esteve 1, R. Perez-Castillejos 1, E. Vallés 3, E. Gomez 3
1 Centro Nacional de Microelectrónica, Spain
2 Technical University of Catalonia, Spain
3 University of Barcelona, Spain
Monday 16 Apr 2007 – Hour start 16:30 – Chairman: W. Nüchter, Bosch; B. Wunderle, Fraunhofer IZM
16:30 – 30mn Keynote: TM11 thermomechanical [ PID 157 ]
Computational Methods and High Speed Imaging Methodologies for Transient-Shock Reliability of Electronics
Corresponding author: Pradeep Lall – NSF Center for Advanced Vehicle Electronics, Auburn University
Full authors list: Pradeep Lall, Auburn University, Department of Mechanical Engineering and Center for Advanced Vehicle Electronics, USA
17:00 – 20mn TM12 thermomechanical [ PID 96 ]
Multi-Scale Modeling of Shock-Induced Failure of Polysilicon MEMS
Corresponding author: Alberto Corigliano – Politecnico di Milano
Full authors list: Aldo Ghisi 1, Fabio Fachin 1, Stefano Mariani 1, Alberto Corigliano 1, Sarah Zerbini 2
1 Politecnico di Milano, Milano, Italy
2 STMicroelectronics, Cornaredo, Milano, Italy
17:20 – 20mn TM13 thermomechanical [ PID 153 ]
Measurement of Dynamic Properties of MEMS and the Possibilities of Parameter Identification by Simulation
Corresponding author: Matthias Ebert – Fraunhofer Institute for Mechanics of Materials
Full authors list: Matthias Ebert, Falk Naumann, Ronny Gerbach, Joerg Bagdahn, Fraunhofer Institute for Mechanics of Materials (IWMH), Halle, Germany
17:40 – 20mn TM14 thermomechanical [ PID 90 ]
Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints Determined by Fast Shear Tests and FEM Simulations
Corresponding author: Eberhard Kaulfersch – Fraunhofer Institute for Reliability and Micro-integration, Micro materials center Chemnitz
Full authors list: Eberhard Kaulfersch 1, Sven Rzepka 2, Vijay Ganeshan 2, Axel Müller 2, Bernd Michel 1
1 Fraunhofer Institute for Reliability and Micro-Integration, Micro Materials Center Berlin and Chemnitz, Germany
2 Qimonda Dresden GmbH & Co OHG, Dept. Backend Technologies, Dresden, Germany
Tuesday 17 Apr 2007 – Hour start 08:30 – Chairman: P. Lall, Auburn University; S. Wiese, Dresden University
08:30 – 30mn Keynote: TM15 thermomechanical [ PID 156 ]
Fluctuation Mechanism of Mechanical Properties of Electroplated Copper Thin Films used for Three Dimensional Electronic Modules
Corresponding author: Hideo Miura – Graduate School of Engineering, Tohoku University
Full authors list: Hideo Miura, Ken Suzuki, Kinji Tamakawa, Fracture and Reliability Research Institute, Tohoku University, Japan
09:00 – 20mn TM16 thermomechanical [ PID 94 ]
Design for Reliability with AuSn Interconnects
Corresponding author: Rainer Dudek – FhG IZM, Micro Materials Center Berlin and Chemnitz
Full authors list: Rainer Dudek 1, Olaf Wittler 1, Wolfgang Faust 1, Birgit Braemer 1, Matthias Klein 1, Wei Jun 2, Bernd Michel 1
1 FhG-IZM, Germany
2 Singapore Institute of Manufacturing Technology, Singapore
09:20 – 20mn TM17 thermomechanical [ PID 114 ]
Prediction of the Influence of Induced Stresses in Silicon on CMOS Performance in a Cu-Through-Via Interconnect Technology
Corresponding author: Chukwudi Okoro – IMEC
Full authors list: Chukwudi Okoro 1, Mario Gonzalez 1, Bart Vandevelde 1, Bart Swinnen 1, Geert Eneman 1, Peter Verheyen 1, Eric Beyne 1, Dirk Vandepitte 2
1 IMEC, Belgium
2 Katholieke Universiteit Leuven, Belgium
Tuesday 17 Apr 2007 – Hour start 08:30 – Chairman: W.H.Zhu, UTAC; K. Jansen, Delft University
08:30 – 30mn Keynote: MP11 multiphysics [ PID 42 ]
Surface Evolution of Strained Thin solid Films: Stability Analysis and Time Evolution of Local Surface Perturbations
Corresponding author: Erwan DORNEL – CEA-LETI
Full authors list: Erwan Dornel 1, Jean-Charles Barbe 1, Joel Eymery 2, François De Crecy 1
1 CEA-MINATEC, Grenoble, France
2 CEA-DRFMC, Grenoble, France
09:00 – 20mn MP12 multiphysics [ PID 62 ]
Multiphysics Modelling of the Electrodeposition Process
Corresponding author: Michael Hughes – University og Greenwich
Full authors list: Michael Hughes, Christopher Bailey, Kevin McManus, University of Greenwich, UK
09:20 – 20mn MP13 multiphysics [ PID 76 ]
Parametric Study of Fracture Properties in Polycrystalline MEMS
Corresponding author: Fabrizio Cacchione – Politecnico di Milano
Full authors list: Fabrizio Cacchione 1, Alberto Corigliano 1, Sarah Zerbini 2
1 Politecnico di Milano, Italy
2 ST-Microelectronics, Italy
Tuesday 17 Apr 2007 – Hour start 10:00 – Chairman: M. Meuwissen, TNO; R. Moshfegh, IVF
10:00 – 0mn Poster: thermomechanical [ PID 13 ]
A Molecular Dynamics Simulation for the Diffusion of Water in Amorphous Polymers at Different Temperatures
Corresponding author: Emmanouella Dermitzaki – Fraunhofer Iinstitute for Reliability and Microintegration ( IZM )
Full authors list: E. Dermitzaki, J. Bauer, H. Walter, B. Wunderle, B. Michel, H. Reichl, Fraunhofer Institute of Reliability and Microintegration (IZM), Dept. Mechanical Reliability and Micro Materials, Germany
10:00 – 0mn Poster: thermomechanical [ PID 15 ]
Mechanical Characterization and Viscoplastic-Damage Constitutive Model of SnAgCu Solder
Corresponding author: Zhou Jun – Mechanical and electronic engineering college,Zhejiang University of Technology
Full authors list: Zhou Jun 1, Chai Guo Zhong 1, Liu Yong 2, Liang Li Hua 1, Hao Wei Na 1
1 The MOE Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University of Technology, Zhejiang, China
2 Fairchild-ZJUT Microelectronic Packaging Joint Lab, Zhejiang University of Technology, Zhejiang, China
10:00 – 0mn Poster: thermomechanical [ PID 20 ]
Combined Virtual Prototyping and Reliability Testing Based Design Rules for Stacked Die System in Packages
Corresponding author: Willem van Driel – NXP Semiconductors
Full authors list: W.D. van Driel 1, R.A. Real 2, D.G. Yang 1, G.Q. Zhang 1, J. Pasion 2
1 NXP Semiconductors, The Netherlands
2 NXP Semiconductors, Philippines
10:00 – 0mn Poster: thermomechanical [ PID 21 ]
Evaluation of Thermal Strains in BGA Packages Using Digital Speckle Correlation Technique and FEA
Corresponding author: Adam Zbrzezny – ATI Technologies
Full authors list: Adam Robert Zbrzezny 1, Vincent Chan 1, Hua Lu 2, Ming Zhou 2
1 Advanced Micro Devices, Canada
2 Ryerson University, Canada
10:00 – 0mn Poster: thermomechanical [ PID 23 ]
Computational Design and Optimisation of Mechanically Reinforced Masks for Stencil Lithography
Corresponding author: Maryna Lishchynska – Tyndall National Institute
Full authors list: Maryna Lishchynska 1, Marc A.F. van den Boogaart 2, Juergen Brugger 2, James C. Greer 1
1 Tyndall National Institute, Cork, Ireland
2 EPFL, Laboratoire des Microsystèmes, Lausanne, Switzerland
10:00 – 0mn Poster: thermomechanical [ PID 28 ]
Creep Measurements of 200µm – 400µm Solder Joints
Corresponding author: Mike Röllig – Dresden University of Technology, IAVT
Full authors list: M. Röllig, S. Wiese, K. Meier, K.-J. Wolter, Dresden University of Technology, IAVT, Germany
10:00 – 0mn Poster: thermomechanical [ PID 29 ]
Finite Element Modeling of the Thermoelastic Damping in Filleted Micro-Beams
Corresponding author: Lepage Severine – FNRS Research fellow, University of Liege
Full authors list: Lepage Severine, Golinval Jean-Claude, University of Liege, Belgium
10:00 – 0mn Poster: thermomechanical [ PID 31 ]
Numerical Analysis of the Reliability of Cu/low-k Bond Pad Interconnections Under Wire Pull Test: Application of a 3D Energy Based Failure Criterion.
Corresponding author: Vincent FIORI – STMicroelectronics
Full authors list: Sébastien Gallois-Garreignot, Freescale, France
Vincent Fiori, STMicroelectronics, France
Stéphane Orain, NXP, France
Olaf van der Sluis, Philips Applied Technologies, The Netherlands
10:00 – 0mn Poster: thermomechanical [ PID 40 ]
Simulation of Wafer Probing Process Considering Probe Needle Dynamics
Corresponding author: Ilko Schmadlak – Freescale Halbleiter Halbleiter GmbH
Full authors list: Ilko Schmadlak, Torsten Hauck, Freescale Semiconductor, Germany
10:00 – 0mn Poster: thermomechanical [ PID 41 ]
Modeling of the Mechanical Behavior During Programming of a Non-Volatile Phase-change Memory Cell using a Coupled Electrical-Thermal-Mechanical Finite-Element Simulator
Corresponding author: Thomas Gille – IMEC vzw
Full authors list: Thomas Gille 1, Judit Lisoni 2, Ludovic Goux 2, Kristin De Meyer 1, Dirk J. Wouters 2
1 IMEC vzw & Katholieke Universiteit Leuven, Belgium
2 IMEC vzw, Leuven, Belgium
10:00 – 0mn Poster: thermomechanical [ PID 47 ]
Reliability Based Design Optimisation for System-in-Package
Corresponding author: Stoyan Stoyanov – University of Greenwich
Full authors list: Stoyan Stoyanov 1, Jean-Marc Yannou 2, Chris Bailey 1, Nadia Strusevich 1
1 University of Greenwich, UK
2 NXP Semiconductors, Caen, France
10:00 – 0mn Poster: thermomechanical [ PID 49 ]
Crack Degradation Model Derived From Experimental Strain-Stress Data
Corresponding author: Christopher Hunt – National Physical Laboratory
Full authors list: Milos Dusek, Chris Hunt, DEPC, NPL, Teddington, UK
10:00 – 0mn Poster: thermomechanical [ PID 55 ]
Impact of Solder Overflow and ACLV Moisture Absorption of Mold Compound on Package Reliability
Corresponding author: Yong Liu – Fairchild Semiconductor Corp.
Full authors list: Richard Qian 1, Yong Liu 2, Scott Irving 2, Timwah Luk 2
1 Fairchild Semiconductor-Suzhou, China
2 Fairchild Semiconductor Corp., S. Portland, ME, USA
10:00 – 0mn Poster: thermomechanical [ PID 56 ]
Mechanical Property Tests for Lead Free Material SnAgCu and the Comparison
Corresponding author: Yong Liu – Fairchild Semiconductor Corp.
Full authors list: Qiang Wang 1, Lihua Liang 1, Xuefan Chen 1, Xiaohong Weng 1, Yong Liu 2, Scott Irving 2, Timwah Luk 2
1 Zhejiang University of Technology, Hangzhou, China
2 Fairchild Semiconductor Corp., S. Portland, ME, USA
10:00 – 0mn Poster: thermomechanical [ PID 61 ]
Thermal-mechanical Modelling of Power Electronic Module Packaging
Corresponding author: Hua Lu – School of Computing and Mathematical Sciences, University of Greenwich
Full authors list: Hua Lu, Tim Tilford, Xiangdong Xue, Chris Bailey, University of Greenwich, UK
10:00 – 0mn Poster: thermomechanical [ PID 68 ]
Research of Stacked VIA\’s Mechanical Stress
Corresponding author: Tohru Nakanishi, Alan Claaseen – Nakanishi PE Office
Full authors list: Tohru Nakanishi, Nakanishi Professional Engineering Office, Japan
Hideo Ohkuma, HTO Inc., Japan
Hiroshi Ohira, Flextronics Aichi K.K., Japan
10:00 – 0mn Poster: thermomechanical [ PID 69 ]
Research on Material Properties Reliance for POP (Package on Package) with Numerical Analysis
Corresponding author: Tohru Nakanishi – IBM Japan
Full authors list: Tohru Nakanishi, Nakanishi Professional Engineering Office, Japan
Hiroshi Ohira, Flextronics Aichi K.K., Japan
Hideo Ohkuma, HTO Inc., Japan
10:00 – 0mn Poster: thermomechanical [ PID 74 ]
The Effect of Visco-elasticity on the Result Accuracy of Thermo-mechanical FEM Simulations Supporting Industrial Microelectronics Packaging
Corresponding author: Sven Rzepka – Qimonda Dresden GmbH & Co OHG
Full authors list: Sven Rzepka, Axel Müller, Qimonda Dresden GmbH & Co OHG, Germany
10:00 – 0mn Poster: thermomechanical [ PID 92 ]
Study on the Board-level SMT Assembly and Solder Joint Reliability of different QFN Packages
Corresponding author: SUN Wei – United Test & Assembly Center Ltd (UTAC)
Full authors list: Wei Sun, W.H. Zhu, Retuta Danny, F.X. Che, C.K. Wang, Anthony Y.S. Sun, H.B. Tan, United Test & Assembly Center Ltd (UTAC), Singapore
10:00 – 0mn Poster: thermomechanical [ PID 93 ]
Thin Film Interface Fracture Properties at Scales Relevant to Microelectronics
Corresponding author: A. XIAO – Delft University of Technology
Full authors list: A. XIAO 1, L.G. Wang 1, W.D. van Driel 2, O. van der Sluis 1, D.G. Yang 2, L.J. Ernst 1, G.Q. Zhang 2
1 Delft University of Technology, The Netherlands
2 NXP Semiconductors, The Netherlands
10:00 – 0mn Poster: thermomechanical [ PID 95 ]
Thermal Stress Analysis of a Lead-Free Surface Mount Device
Corresponding author: Pradeep Hegde – Loughborough University
Full authors list: Pradeep Hegde, David Whalley, Vadim. V. Silberschmidt, Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, UK
10:00 – 0mn Poster: thermomechanical [ PID 97 ]
Packaging Effects of Cu/Low-k Interconnect Structure
Corresponding author: Ming-Che Hsieh – Rm. 168, Bldg. 14, 195, Sec. 4, Chung Hsing Rd.
Full authors list: Ming-Che Hsieh, EOL/Industrial Technology Research Institute, Taiwan
10:00 – 0mn Poster: thermomechanical [ PID 100 ]
Thermo-Mechanical Investigations on the Effects of the Solder Meniscus Design in Solder Lifetime
Corresponding author: Zoubir KHATIR – INRETS
Full authors list: M. Bouarroudj 1, Z. Khatir 1, S. Lefebvre 2, L. Dupont 2
1 INRETS, France
2 SATIE/CNAM, France
10:00 – 0mn Poster: thermomechanical [ PID 101 ]
Development and Assessment of Global-Local Modeling Technique Used in Advanced Microelectronic Packaging
Corresponding author: Che Faxing – United Test & Assembly Center Ltd.
Full authors list: F.X. Che 1, H.L.J. Pang 2, W.H. Zhu 1, Wei Sun 1, Anthony Y.S. Sun 1, C.K. Wang 1, H.B. Tan 1
1 United Test & Assembly Center Ltd., Singapore
2 Nanyang Technological University, Singapore
10:00 – 0mn Poster: thermomechanical [ PID 104 ]
The Effect of Board Stiffness on the Solder-Joint Reliability of HVQFN-Packages
Corresponding author: J. de Vries – Philips Applied Technologies
Full authors list: J. de Vries 1, M. Jansen 1, W. van Driel 2
1 Philips Applied Technologies, The Netherlands
2 NXP Semiconductors, The Netherlands
10:00 – 0mn Poster: thermomechanical [ PID 124 ]
Stress Relaxation Characterization of Hypoeutectic Sn3.0Ag0.5Cu Pb-free Solder: Experiment and Modeling
Corresponding author: Gayatri Cuddalorepatta – Graduate Research Assistant
Full authors list: Gayatri Cuddalorepatta, Dominik Herkommer, Abhijit Dasgupta, University of Maryland, CALCE Electronic Products and Systems Center, College Park, MD, USA
10:00 – 0mn Poster: thermomechanical [ PID 110 ]
Optimization of Cu Low-k Bond Pad Designs to Improve Mechanical Robustness using the Area Release Energy Method
Corresponding author: Roy A.B. Engelen – Philips Applied Technologies
Full authors list: R.A.B. Engelen 1, O. van der Sluis 1, R.B.R. van Silfhout 1, W.D. van Driel 2, V. Fiori 3
1 Philips Applied Technologies, Eindhoven, The Netherlands
2 NXP Semiconductors, Nijmegen, The Netherlands
3 STMicroelectronics, Crolles, France
10:00 – 0mn Poster: thermomechanical [ PID 119 ]
Wafer Probing Simulation for Copper Bond Pad Based BPOA Structure
Corresponding author: Yumin Liu – Fairchild Semiconductor, Suzhou
Full authors list: Yumin Liu 1, Yong Liu 2, Scott Irving 2, Timwah Luk 2
1 Fairchild Semiconductor, Suzhou, China
2 Fairchild Semiconductor Corp., S. Portland, ME, USA
10:00 – 0mn Poster: thermomechanical [ PID 123 ]
Mechanical Characterization of III-V Nanowire Using Molecular Dynamics Simulation
Corresponding author: Alex Dawotola – TUDelft
Full authors list: Alex. W. Dawotola 1, C.A. Yuan 1, W.D. van Driel 2, E.P.A.M. Bakkers 3, G.Q. Zhang 2
1 Department of Precision and Microsystems Engineering, Delft University of Technology, The Netherlands
2 Department of Precision and Microsystems Engineering, Delft University of Technology and NXP Semiconductors, The Netherlands
3 Philips Research, Eindhoven, The Netherlands
10:00 – 0mn Poster: thermomechanical [ PID 140 ]
Numerical simulation of Creep Strain of PBGA Solder Joints Under Thermal Cycling
Corresponding author: liuyang – liuyang
Full authors list: F.L. Sun, Y. Liu, L.F. Wang, Harbin University of Science and Technology, China
10:00 – 0mn Poster: thermomechanical [ PID 141 ]
Comparative Sensitivity Analysis for µBGA and QFN Reliability
Corresponding author: Jürgen Wilde, Elena Zukowski – University of Freiburg, Department of Microsystems Engineering, Laboratory for Assembly and Packaging
Full authors list: Jürgen Wilde, Elena Zukowski, University of Freiburg, Germany
10:00 – 0mn Poster: thermomechanical [ PID 142 ]
Experimental Determination of Time-Independent Elastic-Plastic Behaviour of Solder Joints at High Strain Rates
Corresponding author: Steffen Wiese – TU Dresden
Full authors list: S. Wiese 1, K. Meier 1, D. Scholz 2, A. Müller 2, M. Röllig 1, S. Rzepka 2, K.-J. Wolter 1
1 TU Dresden, IAVT, Dresden, Germany
2 Qimonda Dresden GmbH & Co., OHG, Dresden, Germany
10:00 – 0mn Poster: thermomechanical [ PID 149 ]
Wirebond Reliability for Power Electronic Modules – Effect of Bonding Temperature
Corresponding author: Wei-Sun Loh – University of Sheffield
Full authors list: Wei-Sun Loh 1, Martin Corfield 1, Hua Lu 2, Simon Hogg 3, Tim Tilford 2, C. Mark Johnson 4
1 University of Sheffield, UK
2 University of Greenwich, UK
3 IPTME, Loughborough University, UK
4 University of Nottingham, UK
10:00 – 0mn Poster: thermomechanical [ PID 155 ]
Block-Diagram Based SIMULINK Analysis for the Drop Impact Response of a Mobile Electronic System
Corresponding author: Jiang Zhou – Lamar University
Full authors list: Jiang Zhou, Paul Corder, Ratna P. Niraula, Lamar University, USA
10:00 – 0mn Poster: multiphysics [ PID 22 ]
Quantification of Creep Strain in Small Lead-Free Solder Joints with the Micro-Resistance Measurement
Corresponding author: Li Jiang, keling Yang – Li Jiang
Full authors list: Li Jiang 1, Keling Yang 1, Jiemin Zhou 2, Ke Xiang 1, Wenjie Wang 1
1 School of Physics Science and Technology, Central South University, Changsha, China
2 School of Energy and Power Engineering, Central South University, Changsha, China
10:00 – 0mn Poster: multiphysics [ PID 52 ]
The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders
Corresponding author: Maik Müller – TU Dresden
Full authors list: Maik Mueller, Steffen Wiese, Mike Roellig, Klaus-Juergen Wolter, TU Dresden, Germany
Tuesday 17 Apr 2007 – Hour start 10:00 – Chairman: M. Meuwissen, TNO; R. Moshfegh, IVF
10:00 – 0mn Poster: multiphysics [ PID 18 ]
Magnetic Field Sensor Using a Physical Model to Pre-Calculate the Magnetic Field and to Remove Systematic Error due to Physical Parameters
Corresponding author: Simon HAINZ – KAI – Kompetenzzentrum Automobil- und Industrie- Elektronik
Full authors list: Simon Hainz, KAI Kompetenzzentrum Automobil- und Industrie- Elektronik, Austria
Mario Jungwirth, University of Applied Sciences Upper Austria Campus Wels, Austria
10:00 – 0mn Poster: multiphysics [ PID 53 ]
Electromigration in Large Volume Solder Joints
Corresponding author: Karsten Meier – TU Dresden
Full authors list: Karsten Meier 1, Mike Roellig 1, Steffen Wiese 1, Carsten Goette 2, Ulrich Deml 2, Klaus-Juergen Wolter 1
1 TU Dresden, IAVT, Dresden, Germany
2 Siemens AG, Siemens VDO Automotive, Regensburg, Germany
10:00 – 0mn Poster: multiphysics [ PID 60 ]
A Mathematical Technique to estimate the High Frequency Current Inside the Silicon Die from the Noise Measurements.
Corresponding author: Bidyut Kumar Bhattacharyya and Gang Huo – Intel Corporation
Full authors list: Bidyut Kumar Bhattacharyya, Gang Huo, Intel Corporation, Oregon, USA
10:00 – 0mn Poster: multiphysics [ PID 80 ]
A Study of Failure Mechanism and Reliability Assessment for the Panel Level Package (PLP) Technology
Corresponding author: Kuo-Ning Chiang – National Tsing Hua University
Full authors list: Ming-Chih Yew 1, Hsiu-Ping Wei 1, Ching-Shun Huang 2, Dyi-Chung Hu 2, Wen-Kung Yang 2, Kou-Ning Chiang 1
1 Advanced Packaging Research Center, National Tsing Hua University, Taiwan
2 Advanced Chip Engineering Technology Inc., Taiwan
10:00 – 0mn Poster: thermal [ PID 33 ]
Thermal Simulation with Coupled Network Models on System Level
Corresponding author: Adam AUGUSTIN – Freescale Semiconductor
Full authors list: Adam Augustin, Freescale Semiconductor, Germany
Bartosz Maj, Continental Automotive Systems AG, Germany
10:00 – 0mn Poster: multiphysics [ PID 87 ]
Numerical Modelling of Electrical Resistance of Interconnections in High-Tech Multilayer PCBs Manufactured by Magnetron Sputtering Deposition of Copper
Corresponding author: Artur Wymyslowski – Wroclaw University of Technology
Full authors list: Janusz Borecki, Tele and Radio Research Institute, Poland
Artur Wymyslowski, Wroclaw University of Technology, Poland
10:00 – 0mn Poster: multiphysics [ PID 107 ]
An Enriched Cohesive Zone Model for Numerical Simulation of Interfacial Delamination in Microsystems
Corresponding author: Mohammad Samimi – Materials Technology Institute, Department of Mechanical Engineering, Eindhoven University of Technology
Full authors list: M. Samimi, B.A.E. van Hal, R.H.J. Peerlings, J.A.W. van Dommelen, M.G.D. Geers, Materials Technology Institute, Dept. of Mechanical Engineering, Eindhoven University of Technology, The Netherlands
10:00 – 0mn Poster: multiphysics [ PID 113 ]
Generating VHDL-AMS Models of Digital-to-Analogue Converters From MATLAB/SIMULINK
Corresponding author: Ian Grout – University of Limerick
Full authors list: Alexandre Cesar Rodrigues da Silva 1, Ian Grout 2, Jeffrey Ryan 2, Thomas O’Shea 2
1 UNESP School of Engineering at Ilha Solteira, Brazil
2 University of Limerick, Ireland
10:00 – 0mn Poster: multiphysics [ PID 125 ]
Effect of Surrounding Air on Board Level Drop Tests of Flexible Printed Circuit Boards
Corresponding author: Luciano Arruda – Instituto Nokia de Tecnologia
Full authors list: Luciano Arruda, Germano Freitas, Nokia Technology Institute – INdT, Brazil
10:00 – 0mn Poster: multiphysics [ PID 132 ]
Behavioral Modelling of Vibrating Piezoelectric Micro-Gyro Sensor and Actuation/Detection Electronics
Corresponding author: Souhil MEGHERBI – Institut d\’Electronique Fondamentale, Université Paris-Sud-11
Full authors list: Souhil Megherbi 1, Raphael Levy 1, Fabien Parrain 1, Hervé Mathias 1, Olivier Letraon 2, Denis Janiaud 2, Jean-Paul Gilles 1
1 IEF, UMR 8622, Univ. of Paris-Sud, Orsay, France
2 ONERA-DMPH, Chatillon, France
10:00 – 0mn Poster: multiphysics [ PID 134 ]
Simultaneous Measurement of Young’s Modulus and Damping Dependence on Magnetic Fields by Laser Interferometry
Corresponding author: Angel Luis Morales Robredo – E.T.S.I. Industriales, Universidad de Castilla – La Mancha
Full authors list: Morales A.L. 1, Nieto A.J. 1, Moreno R. 2, González A. 1, Chicharro J.M. 1, Pintado P. 1
1 Universidad de Castilla – La Mancha (E.T.S.I. Industriales), Ciudad Real, Spain
2 Universidad de Antioquia, Medellin, Colombia
10:00 – 0mn Poster: multiphysics [ PID 136 ]
Validation of Simulation Platform by comparing Results and Calculation Time of Different Softwares
Corresponding author: ACHKAR Hikmat – LAAS-CNRS
Full authors list: Hikmat Achkar 1, Fabienne Pennec 1, David Peyrou 1, Mahmoud Al Ahmad 1, Marc Sartor 2, Robert Plana 1, Patrick Pons 1
1 LAAS-CNRS, France
2 LGMT, France
10:00 – 0mn Poster: multiphysics [ PID 147 ]
A Macro Model Based on Finite Element Method to Investigate Temperature and Residual Stress Effects on RF MEMS Switch Actuation
Corresponding author: David Peyrou – LAAS
Full authors list: D. Peyrou, H. Achkar, F. Pennec, P. Pons, R. Plana, LAAS CNRS, Toulouse, France
10:00 – 0mn Poster: thermal [ PID 10 ]
Thermal and Hot Spot Evaluations on Oil Immersed Power Transformers by FEMLAB and MATLAB softwares
Corresponding author: Kourosh Mousavi Takami – autorDept of Public Technology, IST M�lardalen University, MDH
Full authors list: Kourosh Mousavi Takami, Hasan Gholinejad, Jafar Mahmoudi, Malardalen University, Sweden
10:00 – 0mn Poster: thermal [ PID 50 ]
CFD Aided Reflow Oven Profiling for PCB Preheating in a Soldering Process
Corresponding author: Ilja Belov – School of Egineering, Jönköping University
Full authors list: Ilja Belov, Jönköping University, Jönköping, Sweden
Mats Lindgren, Kitron AB, Jönköping, Sweden
Peter Leisner, SP Technical Research Institute of Sweden, Borås, Sweden
Fredrik Bergner, Flomerics Nordic AB, Nacka, Sweden
Robin Bornoff, Flomerics Group PLC, Hampton Court, UK
10:00 – 0mn Poster: thermal [ PID 78 ]
Development of an Internal Liquid Cooling System for CPU using CAE
Corresponding author: Sebastian Flores – Mechanical Engineering Department, Kun-Shan University
Full authors list: Sebastian Flores 1, Songhao Wang 1, Chong-Qing Chang 2
1 Mechanical Engineering Department, Kun-Shan University, Taiwan
2 System Engineering Department, National Tainan University, Taiwan
10:00 – 0mn Poster: thermal [ PID 150 ]
Reduced Order Electro-Thermal Models for Real-Time Health Management of Power Electronics
Corresponding author: Mahera Musallam – University of Nottingham
Full authors list: Mahera Musallam 1, Cyril Buttay 1, C. Mark Johnson 1, Chris Bailey 2, Michael Whitehead 3
1 University of Nottingham, UK
2 University of Greenwich, UK
3 University of Sheffield, UK
10:00 – 0mn Poster: thermomechanical [ PID 128 ]
Parameter Identification on Wafer Level of Membrane Structures
Corresponding author: Steffen Michael – Melexis GmbH
Full authors list: Steffen Michael 1, Siegfried Hering 2, Gisbert Hölzer 2, Tobias Polster 3, Martin Hoffmann 3, Arne Albrecht 3
1 Melexis GmbH, Erfurt, Germany
2 X-FAB Semiconductor Foundries AG, Erfurt, Germany
3 Technische Universität Ilmenau, Fachgebiet Mikromechanische Systeme, Ilmenau, Germany
Tuesday 17 Apr 2007 – Hour start 11:00 – Chairman: Y. Liu, Fairchild Semiconductors; R. Dudek, Fraunhofer IZM
11:00 – 30mn Keynote: TM18 thermomechanical [ PID 160 ]
Fatigue Strength and Damage Behaviors of Multi-Scale Metallic Multilayers
Corresponding author: Guang-Ping Zhang – Shenyang National Laboratory for Materials Science
Full authors list: G.P. Zhang, X.F. Zhu, Y.P. Li, Z.G. Wang, Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, China
11:30 – 20mn TM19 thermomechanical [ PID 133 ]
Validation of Constitutive Models for Electrically Conductive Adhesives
Corresponding author: Marcel Meuwissen – TNO Science and Industry
Full authors list: Marcel Meuwissen, Monique van den Nieuwenhof, Henk Steijvers, Adri van der Waal, Tom Bots, TNO Science and Industry, Eindhoven, The Netherlands
11:50 – 20mn TM20 thermomechanical [ PID 79 ]
Kinetic Characterisation of Molding Compounds
Corresponding author: K.M.B. Jansen – TU Delft
Full authors list: K.M.B. Jansen 1, C. Qian 1, L.J. Ernst 1, C. Bohm 2, A. Kessler 2, H. Preu 2, M. Stecher 2
1 Delft University of Technology, The Netherlands
2 Infineon Technologies AG, Munich, Germany
12:10 – 20mn TM21 thermomechanical [ PID 72 ]
Cure Shrinkage Characterization and its Implementation into Correlation of Warpage between Simulation and Measurement
Corresponding author: W.H. Zhu – United test and Assembly Center Ltd
Full authors list: W.H. Zhu 1, Guang Li 2, Wei Sun 1, F.X. Che 1, Anthony Sun 1, C.K. Wang 1, H.B. Tan 1, B.Z. Zhao 2, N.H. Chin 2
1 Packaging Design and Analysis Center, United Test and Assembly Center Limited, Singapore
2 Cookson Semiconductor Packaging Materials, Singapore
Tuesday 17 Apr 2007 – Hour start 11:00 – Chairman: J.G. Korvink, IMTEK, Freiburg, Germany; J. Casals, Technical University of Catalonia-UPC, Spain
11:00 – 30mn Keynote: MP14 multiphysics [ PID 65 ]
Application of Higher Order Derivatives Method to Parametric Simulation of MEMS
Corresponding author: Vladimir Kolchuzhin – Chemnitz University of Technology
Full authors list: Vladimir Kolchuzhin 1, Jan Mehner 2, Thomas Gessner 2, Wolfram Doetzel 1
1 Chemnitz University of Technology, Germany
2 Fraunhofer Institute for Reliability and Microintegration, Chemnitz, Germany
11:30 – 20mn MP15 multiphysics [ PID 126 ]
Numerical Simulation of Ion Drift within Ion Mobility Spectrometers in High Peclet Conditions using FEM methods.
Corresponding author: Santiago Marco – Universitat de Barcelona
Full authors list: A. Kalms 1, M. Salleras 1, Z. Liu 2, J.G. Korvink 2, J. Goebel 3, G. Müller 3, J. Samitier 1, S. Marco 1
1 Departament d’Electrònica, Universitat de Barcelona, Spain
2 University of Freiburg, IMTEK-Institute for Microsystem Technology, Germany
3 EADS-CRC, Munich, Germany
11:50 – 20mn MP17 multiphysics [ PID 143 ]
The BGK Kinetic Model Applied to the Analysis of Gas-Structure Interactions in MEMS
Corresponding author: FRANGI ATTILIO – POLITECNICO OF MILANO
Full authors list: Frangi Attilio, Ghisi Aldo, Politecnico di Milano, Italy
Tuesday 17 Apr 2007 – Hour start 14:00 – Chairman: D. Anderson, IVF; B. Vandevelde, IMEC
14:00 – 30mn Keynote: TM22 thermomechanical [ PID 158 ]
Low-temperature and Pressure-less Sintering Technology for High-performance and High-temperature Interconnection of Semiconductor Devices
Corresponding author: Guo-Quan Lu – Virginia Polytechnic Institute and State University or Virginia Tech
Full authors list: Guo-Quan Lu 1, Jesus N. Calata 2, Guangyin Lei 2, Xu Chen 3
1 Dept. of MSE and ECE, Virginia Tech, USA
2 Dept. of MSE, Virginia Tech, USA
3 School of Chemical Engineering, Tianjin University, Tianjin, China
14:30 – 20mn TM23 thermomechanical [ PID 27 ]
Modelling of Reliability Issues in Multilayer Substrates
Corresponding author: Rene Ubachs – Delft, University of Technology
Full authors list: R.L.J.M. Ubachs, Delft Technical University, The Netherlands
O. van der Sluis, Philips Applied Technologies, Eindhoven, The Netherlands
W.D. van Driel, NXP IMO-BE, Nijmegen, The Netherlands
G.Q. Zhang, NXP, Eindhoven, The Netherlands
14:50 – 20mn TM24 thermomechanical [ PID 26 ]
Finite Element Modelling (FEM) of Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)
Corresponding author: CHAILLOT Agnès – EADS CRC
Full authors list: A. Chaillot 1, G. Massiot 1, C. Munier 1, I. Lombaert-Valot 1, S. Bousquet 2, C. Chastanet 2, D. Plouseau 3, E. Munier 3, D. Maron 4, P. Raynal 4, S. Villard 5, R. Dumonteil 5
1 EADS, France
2 AIRBUS, France
3 EADS Secure Networks, France
4 ACTIA, France
5 TECHCI, France
15:10 – 20mn TM25 thermomechanical [ PID 103 ]
Development of Reliability Verification System for Robust Package Design
Corresponding author: DongKil Shin – Samsung Electronics Co.
Full authors list: Dongkil Shin, Hyunggil Baek, Joonyoung Oh, Dongok Kwak, Kuyoung Kim, Younghee Song, Jeongyeol Kim, Samsung Electronics Co., Korea
15:30 – 20mn TM26 thermomechanical [ PID 67 ]
Multi-objective Parametric Approach to Numerical Optimisation of Stacked Packages
Corresponding author: Artur Wymyslowski – Wroclaw University of Technology
Full authors list: Łukasz Dowhań 1, Artur Wymysłowski 1, Rainer Dudek 2
1 Wrocław University of Technology, Poland
2 Fraunhofer Institute for Reliability and Microintegration, Germany
Tuesday 17 Apr 2007 – Hour start 14:00 – Chairman: P. Ho, University of Texas; T. Reinikainen, INdT
14:00 – 30mn Keynote: TM27 thermomechanical [ PID 159 ]
3D Modeling of Electromigration combined with Thermal/Mechanical Effect for IC device and Package
Corresponding author: Yong Liu – Fairchild Semiconductor Corp.
Full authors list: Yong Liu 1, Scott Irving 1, Timwah Luk 1, Liang Lihua 2, Shinan Wang 2
1 Fairchild Semiconductor Corp., South Portland, ME, USA
2 Zhejiang University of Technology, Hangzhou, China
14:30 – 20mn TM28 thermomechanical [ PID 117 ]
Evaluation of Creep in RF MEMS Devices
Corresponding author: Marcel van Gils – NXP Semiconductors
Full authors list: Marcel van Gils, Jeroen Bielen, Gavin McDonald, NXP Semiconductors, The Netherlands
14:50 – 20mn TM29 thermomechanical [ PID 46 ]
Gold Wire Bonding Induced Peeling in Cu/Low-k Interconnects: 3D Simulation and Correlations.
Corresponding author: Vincent FIORI – STMicroelectronics
Full authors list: Vincent Fiori, STMicroelectronics, Crolles, France
Lau Teck Beng, Freescale Semiconductor, Malaysia
Susan Downey, Freescale Semiconductor Inc., Austin, TX, USA
Sebastien Gallois-Garreignot, Freescale Semiconductor, Crolles, France
Stephane Orain, NXP, Crolles, France
15:10 – 20mn TM30 thermomechanical [ PID 105 ]
Investigation of Mechanical Reliability of Cu/low-k Multi-layer Interconnects in Flip Chip Packages
Corresponding author: Chihiro J. UCHIBORI, Xuefeng Zhang, Sehyuk Im, Paul S. Ho, Tomoji Nakamura – Fujitsu Labs. America, Inc., The University of Texas at Austin, Fujitsu Labs. LTD.
Full authors list: Chihiro J. Uchibori 1, Xuefeng Zhang 2, Sehyuk Im 2, Paul S. Ho 2, Tomoji Nakamura 3
1 Fujitsu Labs. America, Inc., Sunnyvale, USA.
2 University of Texas at Austin, Austin, USA
3 Fujitsu Laboratories Ltd., Tokyo, Japan
15:30 – 20mn TM31 thermomechanical [ PID 54 ]
Multi-Scale Energy-based Failure Modelling of Bond Pad Structures
Corresponding author: Olaf van der Sluis – Philips Applied Technologies and Delft University of Technology
Full authors list: O. van der Sluis 1, R.B.R. van Silfhout 2, R.A.B. Engelen 2, W.D. van Driel 3, G.Q. Zhang 3
1 Philips Applied Technologies and Delft University of Technology, The Netherlands
2 Philips Applied Technologies, The Netherlands
3 NXP Semiconductors and Delft University of Technology, The Netherlands
Wednesday 18 Apr 2007 – Hour start 08:30 – Chairman: A. Corigliano, Politecnico di Milano; H. Pape, Infineon Technologies
08:30 – 30mn Keynote: TF7 thermal [ PID 165 ]
Digital and Continuous Liquid Cooling for Electronics Cooling
Corresponding author: Martine Baelmans – Katholieke Universiteit Leuven
Full authors list: M. Baelmans 1, H. Oprins 2, T. Stevens 1, F. Rogiers 1
1 Katholieke Universiteit Leuven, Belgium
2 IMEC, Leuven, and Katholieke Universiteit Leuven, Belgium
09:00 – 30mn Keynote: TM7 thermomechanical [ PID 121 ]
Optimization and Robust Design of Electronics Assemblies under Fracture, Delamination and Fatigue Aspects
Corresponding author: Juergen Auersperg – 1) Fraunhofer Institute for Reliability and Microintegration Berlin (IZM), Micro Materials Center Berlin
Full authors list: Juergen Auersperg, Matthias Klein, Bernd Michel, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany
Wednesday 18 Apr 2007 – Hour start 10:15 – Chairman: B. Schwarz, Siemens; G.P. Zhang, Shenyang National Laboratory
10:15 – 30mn Keynote: TM33 thermomechanical [ PID 151 ]
Reliability Test Method Overview to Characterise Second Level Interconnects
Corresponding author: Michel Brizoux – IXL Universit� Bordeaux 1
Full authors list: Michel Brizoux 1, H�l�ne Fr�mont 2, Yves Danto 2, Wilson Carlos Maia Filho 3
1 EPM, Thales Group, France
2 Laboratoire IMS, Universit� de Bordeaux 1, France
3 EPM, Thales Group; Laboratoire IMS, Universit� de Bordeaux 1, France
10:45 – 20mn TM34 thermomechanical [ PID 51 ]
The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties
Corresponding author: Steffen Wiese – TU Dresden
Full authors list: Steffen Wiese, Mike Roellig, Maik Mueller, K.-J. Wolter, TU Dresden, Germany
11:05 – 20mn TM35 thermomechanical [ PID 17 ]
Thermo-Mechanical Fatigue Failure in SnAgCu Solder Joints
Corresponding author: Muge Rullenraad Erinc – Eindhoven University of Technology
Full authors list: M. Erinc, P.J.G. Schreurs, M.G.D. Geers, Eindhoven University of Technology, The Netherlands
11:25 – 20mn TM37 thermomechanical [ PID 144 ]
Development of 2D Modeling Techniques for the Thermal Fatigue Analysis of Solder Joints of RF Power Modules Mounted in a 3D Cavity on a Printed Circuit Board
Corresponding author: Ricky Lee – Hong Kong University of Science and Technology
Full authors list: Y.S. Chan 1, S.W. Ricky Lee 1, Yuming Ye 2, Sang Liu 2
1 EPACK Lab, HKUST, Hong Kong
2 Huawei Technologies Co. Ltd., Shenzhen, China
Wednesday 18 Apr 2007 – Hour start 10:15 – Chairman: A. Corigliano, Politecnico di Milano, Italy; A. Wymyslowski, Wroclaw University, Poland
10:15 – 30mn Keynote: MP19 multiphysics [ PID 77 ]
A Modelling Framework for the Reliability of Safety Critical Electronics
Corresponding author: Diana M. Segura Velandia – Research Associate, Loughborough University
Full authors list: Diana M. Segura Velandia, Paul P. Conway, Antony R. Wilson, Andrew A. West, David C. Whalley, Wolfson School of Mechanical & Manufacturing Engineering, Loughborough University Leicestershire, UK
10:45 – 20mn MP20 multiphysics [ PID 102 ]
Transport of Corrosive Constituents in Epoxy Molding Compounds
Corresponding author: Michiel van Soestbergen – University of Technology Delft, Fundamentals of Microsystems Engineering
Full authors list: M. van Soestbergen, Netherlands Institute for Metals Research, The Netherlands
L.J. Ernst, Delft University of Technology, Fundamentals of Microsystems, The Netherlands
G.Q. Zhang, Delft University of Technology, Fundamentals of Microsystems; Strategy and NXP Semiconductors, The Netherlands
R.T.H. Rongen, NXP Semiconductors, Nijmegen, The Netherlands
11:05 – 20mn MP21 multiphysics [ PID 115 ]
Effect of Processing Parameters and Hygro-thermo-mechanical Stresses on the Reliability of Flip Chip Bonding RFID Tags
Corresponding author: Daoguo Yang – NXP Semiconductors
Full authors list: D.G. Yang, E. de Bruin, B. Kasemset, W.D. van Driel, NXP Semiconductors, Nijmegen, The Netherlands
11:25 – 20mn MP22 multiphysics [ PID 16 ]
Atom Diffusion Mechanism of Thermo-Sonic Flip Chip Bonding Interface
Corresponding author: Fuliang WANG – Junhui LI
Full authors list: Fuliang Wang, Junhui Li, Lei Han, Jue Zhong, School of Mechanical and Electrical Engineering, Central South University, Changsha, China
11:45 – 20mn MP23 multiphysics [ PID 57 ]
Numerical Simulation and Thermal Failure analysis of SOM packages
Corresponding author: Jin Taek Chung – Department of Mechnical Engineering, Korea University
Full authors list: Jae Choon Kim 1, Jin Taek Chung 1, Won Suk Lee 1, Gyoung Bum Kim 2, Dong Jin Lee 2, Ji-Man Cho 3, Ji-Hyuk Yu 3, Byeong-Kwon Ju 3, SungWoo Hang 2, Heung-Woo Park 4, Sang-Kyeong Yun 4
1 Department of mechanical Engineering, Korea University, Korea
2 Department of Electrical Engineering, Korea University, Korea
3 Display and Nanosystem Lab, College of Engineering, Korea University, Korea
4 SOM Group, OS Division, Samsung Electro-Mechanics, Korea
Wednesday 18 Apr 2007 – Hour start 13:45 – Chairman: R. Lee, HKUST; P. Rodgers, The Petroleum Institute
13:45 – 30mn Keynote: TM38 thermomechanical [ PID 152 ]
Intermetallic Formation and Its Impact on Electromigration Reliability of Pb-free Solder Joints
Corresponding author: Paul S. Ho – Microelectronics Research Center, University of Texas at Austin
Full authors list: Brook Chao, Seung-Hyun Chae, Xuefeng Zhang, Paul S. Ho, The University of Texas at Austin, USA
14:15 – 30mn Keynote: MP24 multiphysics [ PID 167 ]
Solid State Chemical Sensors: Technologies and Aplications
Corresponding author: Krishna Persaud – University of Manchester
Full authors list: Krishna C. Persaud 1, Anthony Flint 1, Robert W. Sneath 2
1 The University of Manchester, UK
2 Silsoe Odours Ltd., UK14:45 – 30mn Keynote: thermal [ PID 19 ]
Unsteady CFD Modelling of Electronics Cooling
Corresponding author: James Christopher Tyacke – University of Wales Swansea
Full authors list: James C. Tyacke, Paul G. Tucker, University of Wales, Swansea, UK
