EuroSimE 2006 was locally organised by Politecnico di Milano (Alberto Corigliano and team) in Grand Hotel di Como, Italy
EuroSimE 2006 in Como, Italy
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The 7th IEEE EuroSimE conference was held in Como, near Milan Italy, in April 2006 and was attended by 160 individuals. · courses were offered for professional training. |
Proceedings of EuroSimE 2006 – Como, Italy, April 2006
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774 pages A4 IEEE Catalog Number: 06EX1341 ISBN: 1-4244-0275-1 |
| CD-ROM version IEEE Catalog Number: 06EX1341C ISBN: 1-4244-0276-X crystal package The CD has a dedicated browser featuring a search capability on keywords: content, author, organisation, country. |
Chairman: A. Corigliano, Politecnico di Milano, Italy
09:10 – 30mn Keynote: K1 thermomechanical [ PID 289 ]
Evolution of Semiconductor Packaging. Present and Future
Corresponding author: Carlo COGNETTI – STMicroelectronics
Full authors list: Carlo Cognetti, STMicroelectronics, Italy
09:40 – 30mn Keynote: K2 thermomechanical [ PID 288 ]
Nanotechnology in Silicon CMOS Fabrication and Nanoelectronics
Corresponding author: M. Meyyappan – Center for Nanotechnology, NASA Ames Research Center
Full authors list: Meyya Meyyappan, Center for Nanotechnology, NASA Ames Research Center, USA
10:10 – 30mn Keynote: K3 thermomechanical [ PID 265 ]
Strategic Research Agenda of ?More than Moore?
Corresponding author: G.Q. (Kouchi) Zhang – Philips Semiconductors
Full authors list: G.Q. (Kouchi) Zhang 1, Mart Graef 2, Fred van Roosmalen 2
1 Philips Semiconductors, Eindhoven; Delft University of Technology, Delft, The Netherlands
2 Philips Semiconductors, Eindhoven, The Netherlands
Chairman: L. Ernst, Delft University of Technology, The Netherlands
11:10 – 30mn Keynote: thermomechanical [ PID 300 ]
Computational Challenges for Reliability Assessment of Next Generation Micro and Nano Systems
Corresponding author: Abhijit Dasgupta – University of Maryland
Full authors list: Abhijit Dasgupta, University of Maryland, College Park, MD 20742, USA
11:40 – 30mn Keynote: MP1 multiphysics [ PID 303 ]
Future of MEMS: An industry point of view
Corresponding author: Benedetto Vigna – ST Microelectronics
Full authors list: Benedetto Vigna, STMicroelectronics / FTM ? MEMS Business Unit, Milano, Italy
12:10 – 30mn Keynote: TF1 thermal [ PID 306 ]
Challenges in using nano-textured surfaces to reduce pressure drop through microchannels
Corresponding author: Tara Dalton – Stokes Research Institute
Full authors list: Tara Dalton 1, Cormac Eason 1, Ryan Enright 1, Marc Hodes 2, Paul Kolodner 2, Tom Krupenkin 2
1 Stokes Research Institute, University of Limerick, Ireland
2 Bell Laboratories/Lucent Technologies Murray Hill, New Jersey, USA
Chairman: R. Dudek, Fraunhofer Institute IZM, Germany; C. Bailey, Greenwich University, Great Britain
14:00 – 30mn Keynote: thermomechanical [ PID 295 ]
The Role of Simulation in Failure Prediction and Design Optimization in Electronics Packaging
Corresponding author: Andrew A. O. TAY – National University of Singapore
Full authors list: Andrew A. O. Tay, National University of Singapore, Singapore, Singapore
14:30 – 20mn thermomechanical [ PID 263 ]
Efficient damage sensitivity analysis in advanced Cu low-k bond pad structures using Area Release Energy
Corresponding author: Olaf van der Sluis – Philips Applied Technologies
Full authors list: O. van der Sluis 1, R.A.B. Engelen 1, W.D. van Driel 2, M.A.J. van Gils 2, R.B.R. van Silfhout 1
1 Philips Applied Technologies
2 Philips Semiconductors
14:50 – 20mn thermomechanical [ PID 193 ]
Non-Empirical Modeling of Fatigue in Lead-Free Solder Joints: Experimental Characterization and Estimation of Fracture Parameters
Corresponding author: Dhruv Bhate – Purdue University
Full authors list: Dhruv Bhate, Dennis Chan, Ganesh Subbarayan, Purdue University, West Lafayette, IN, USA
15:10 – 20mn thermomechanical [ PID 188 ]
Measuring the strength of brittle microbeams without measuring forces or displacements.
Corresponding author: David Elata – Technion – Israel Institute of Technology
Full authors list: Arnon Hirshberg, David Elata, Technion – Israel Institute of Technology, Haifa, Israel
15:30 – 20mn thermomechanical [ PID 230 ]
Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi physics simulations
Corresponding author: Jeroen Bielen – Philips Semiconductors
Full authors list: Jeroen Bielen, Jan-Joris Gommans, Frank Theunis, Philips Semiconductors, Nijmegen, The Netherlands
Chairman: Dr. S. Marco, University of Barcelona, Spain
14:00 – 30mn Keynote: MP2 multiphysics [ PID 304 ]
Design for Micro and Nano Manufacture ? The PATENT-DfMM Network of Excellence : Modelling and Simulation Cluster
Corresponding author: Prof. Andrew Richardson – University of Lancaster
Full authors list: Andrew Richardson, Centre for Microsystems Engineering, Lancaster University, UK
Orla Slattery, Tyndall National Institute, Cork, Ireland
Marta Rencz, Budapest University of Technology and Economics, Hungary
14:30 – 20mn MP3 multiphysics [ PID 121 ]
MODELLING EFFECTS OF PACKAGING ON PULL-IN BEHAVIOUR OF DOUBLY ANCHORED BEAMS
Corresponding author: Maryna Lishchynska – Tyndall National Institute
Full authors list: Maryna Lishchynska 1, Conor O’Mahony 1, Orla Slattery 1, Olaf Wittler 2
1 Tyndall National institute
2 Fraunhofer Institut Zuverl?ssigkeit und Mikrointegration
14:50 – 20mn MP4 multiphysics [ PID 149 ]
On the Advantages of Using a Strong Coupling Variational Formulation to Model Electro-Mechanical Problem
Corresponding author: V?ronique Rochus – University of Li?ge
Full authors list: V?ronique Rochus 1, Daniel J. Rixen 2, Jean-Claude Golinval 1
1 University of Li?ge, Li?ge, Belgium
2 T.U. Delft, Delft, The Netherlands
15:10 – 20mn MP5 multiphysics [ PID 258 ]
Topology optimization of electromechanical microsystems against pull-in voltage
Corresponding author: Etienne Lemaire – University of Li?ge
Full authors list: Etienne Lemaire, Pierre Duysinx, V?ronique Rochus, Jean-Claude Golinval, University of Li?ge, Department of Mechanics and Aerospace
15:30 – 20mn MP6 multiphysics [ PID 192 ]
Using electromechanical buckling for measuring residual stress
Corresponding author: David Elata – Technion – Israel Institute of Technology
Full authors list: Samy Abu-Salih, David Elata, Technion – Israel Institute of Technology, Haifa, Israel
Chairman: Peter Rodgers, The petroleum Institue, UAE; Miquel Vellvehi, Centre Nacional de Microelectr?nica, Spain
14:00 – 30mn Keynote: thermal [ PID 240 ]
Difficulties on the estimation of the thermal structure function from noisy thermal impedance transients
Corresponding author: Marc Salleras – Universitat de Barcelona
Full authors list: Marc Salleras 1, Jordi Palac 2, Guillem Carles 1, Santiago Marco 1
1 University of Barcelona, Barcelona, Spain
2 University of Lleida, Lleida, Spain
14:30 – 20mn thermal [ PID 247 ]
Comparison Between Simulated and Experimental Thermal Resistances of Power Devices Using an Specific Test Chip
Corresponding author: Xavier JORDA – Centre Nacional de Microelectronica – CSIC
Full authors list: Xavier JORDA, Miquel VELLVEHI, Francesc MADRID, Jose Luis GALVEZ, Philippe GODIGNON, Jose MILLAN, Centre Nacional de Microelectr?nica – CSIC, Spain
14:50 – 20mn thermal [ PID 219 ]
EXPERIMENTAL INVESTIGATION ON THE LEAKAGE REVERSE CURRENT COMPONENT FLOWING AT THE SEMICONDUCTOR PN JUNCTION PERIPHERY
Corresponding author: Vasile Obreja – National R&D Institute for Microtechnology (IMT)
Full authors list: Vasile V.N. Obreja, Cecilia Codreanu, National R&D Institute for Microtechnology (IMT ), Bucharest, Romania
15:10 – 20mn P TF6 thermal [ PID 227 ]
Steady State and Transient Thermal Characterization for Flip Chip Interconnection on Flexible Substrate
Corresponding author: Liu Caroline Chen – IMEC
Full authors list: Liu Caroline Chen 1, Reijo Lehtiniemi 2, Bart Vandevelde 1, Ali Arslan 2
1 IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
2 Nokia Research Center, P.O. Box 407, FI-00045 Nokia Group, Finland
15:30 – 20mn thermal [ PID 226 ]
Electro-thermal simulation of DC/DC converter using a relaxation method
Corresponding author: Miquel Vellvehi – Centro Nacional de Microelectr?nica (IMB-CNM)
Full authors list: Miquel Vellvehi, Xavier Jord, Philippe Godignon, Jos? Mill, Centre Nacional de Microelectr?nica (CNM-CSIC), Bellaterra (Barcelona), Spain
Chairman: T. Reinikainen, Nokia, Finland; B. Schwarz, Siemens, Germany
16:30 – 30mn Keynote: TM7 thermomechanical [ PID 274 ]
Analytical and Numerical Analysis of Drop Impact Behavior for a Portable Electronic Device
Corresponding author: Jiang Zhou – Lamar University
Full authors list: Jiang Zhou, Kallolimath Sharan, Sachin Lahoti, Lamar University, Beaumont TX, USA
17:00 – 20mn thermomechanical [ PID 231 ]
Lead-Free Solder Cyclic Plasticity Characterization for Drop Test Simulations
Corresponding author: Etienne BONNAUD – Infineon Technologies Sweden AB
Full authors list: Etienne Bonnaud, Infineon Technologies, Stockholm, Sweden; Royal Institute of Technology, Stocholm, Sweden
Peter Gudmundson, Royal Institute of Technology, Stocholm, Sweden
17:20 – 20mn thermomechanical [ PID 202 ]
Drop Simulation and Stress Analysis of MEMS Devices
Corresponding author: Torsten Hauck – Freescale Halbleiter Deutschland GmbH
Full authors list: Torsten Hauck 1, Gary Li 1, Andrew McNeill 1, Heiko Knoll 2, Matthias Ebert 2, J?rg Bagdahn 2
1 Freescale Semiconductor
2 Fraunhofer Institute for Mechanics of Materials
17:40 – 20mn thermomechanical [ PID 128 ]
Impact Force Characteristics of Package-level Solder Joints Subjected to Ball Impact Test
Corresponding author: Chang-Lin Yeh – Advanced Semiconductor Engineering, Inc.
Full authors list: Chang-Lin Yeh, Yi-Shao Lai, Advanced Semiconductor Engineering, Inc., Nantze, Kaohsiung, Taiwan
Chairman: Prof. G. Wachutka, TU Munich, Germany; Dr. Mario Gonzalez, IMEC, Belgium
16:30 – 20mn MP8 multiphysics [ PID 166 ]
Multi-Physics Modeling and Finite Element Approximation of Charge Flow in Ionic Channels
Corresponding author: Riccardo Sacco – Politecnico di Milano, Dipartimento di Matematica F. Brioschi
Full authors list: Bice Chini, CNR Institute of Neuroscience Cellular and Molecular Pharmacology Section, Milan, Italy
Joseph W. Jerome, Department of Mathematics, Northwestern University, Evanston, USA
Riccardo Sacco, Politecnico di Milano, Dipartimento di Matematica, Milan, Italy
16:50 – 20mn MP10 multiphysics [ PID 158 ]
Modelling new design of fluidic microvalves
Corresponding author: Anna Pandolfi – Dipartimento di Ingegneria Strutturale, Politecnico di Milano
Full authors list: Anna Pandolfi, Dipartimento di Ingegneria Strutturale, Politecnico di Milano, Italy
Michael Ortiz, Graduate Aeronautical Laboratories, California Institute of Technology, Pasadena, CA, USA
17:10 – 20mn MP9 multiphysics [ PID 211 ]
ON THE APPPLICATION OF THE BGK MODEL TO THE SIMULATION OF FLUID STRUCTURE INTERACTION IN MEMS
Corresponding author: Frangi Attilio – Dept. Structural Engineering, Politecnico of Milan
Full authors list: Cercignani Carlo, Frangi Attilio, Frezzotti Aldo, Lorenzani Silvia, Politecnico di Milano, Italy
Chairman: D. Andersson, IVF, Sweden; Abhijit Dasgupta, University of Maryland, USA
16:30 – 30mn Keynote: thermomechanical [ PID 217 ]
Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging
Corresponding author: Dr. Rainer Dudek – FhG IZM
Full authors list: Rainer Dudek 1, Hans Walter 1, Ralf D?ring 1, Bernd Michel 1, Thorsten Meyer 2, Joerg Zapf 3, Harry Hedler 2
1 Fraunhofer IZM, Micro Materials Center Berlin and Chemnitz, Germany
2 Infineon Technologies AG, Germany
3 Siemens AG, Germany
17:00 – 20mn thermomechanical [ PID 126 ]
Simulation and Analysis for Typical Package Assembly Manufacture Process
Corresponding author: Yong Liu – Fairchild Semiconductor Corp.
Full authors list: Yong Liu 1, Qiuxiao Qian 2, Scott Irving 1, Don Desbiens 1, Timwah Luk 1
1 Fairchild Semiconductor Corp., South Portland, ME, USA
2 Fairchild Semiconductor, Suzhou, Jiangsu, China
17:20 – 20mn thermomechanical [ PID 145 ]
Virtual Design and Qualification of IC Backend Structures
Corresponding author: R.B.R. van Silfhout – Philips Applied Technologies
Full authors list: R.B.R. van Silfhout 1, O. van der Sluis 1, W.D. van Driel 2, J.H.J. Janssen 3, G.Q. Zhang 4
1 Philips Applied Technologies, Eindhoven, The Netherlands
2 Philips Semiconductors, Nijmegen, The Netherlands
3 Philips CFT, Eindhoven, The Netherlands
4 Philips Semiconductors, Eindhoven, The Netherlands
17:40 – 20mn thermomechanical [ PID 278 ]
Thermo-Mechanical Analysis of the Packaging Process for Micro-Electronic Displays
Corresponding author: Professor Chris Bailey – University of Greenwich
Full authors list: Y Lee 1, C Bailey 1, H Lu 1, S Riches 2, M Bartholomew 2, N Tebbit 2
1 University of Greenwich. London,. United Kingdom
2 MCE, Newmarket, United Kingdom
Chairman: J. Zhou, Lamar University, USA. A. Dasgupta, CALCE, USA
08:30 – 30mn Keynote: thermomechanical [ PID 181 ]
Simulation of impact rupture in polysilicon MEMS
Corresponding author: Alberto Corigliano – Politecnico di Milano, Department of Structural Engineering
Full authors list: Alberto Corigliano 1, Fabrizio Cacchione 1, Attilio Frangi 1, Sarah Zerbini 2
1 Politecnico di Milano
2 STMicroelectronics
09:00 – 20mn thermomechanical [ PID 223 ]
Numerical identification of geometric parameters from dynamic measurement of grinded membranes on wafer level
Corresponding author: Ebert, Matthias – Fraunhofer Institute for Mechanics of Materials Halle
Full authors list: Matthias Ebert 1, Ronny Gerbach 1, J?rg Bagdahn 1, Steffen Michael 2, Siegfried Hering 3
1 Fraunhofer Institute for Mechanics of Materials, Halle/ Saale, Germany
2 Melexis GmbH, Erfurt, Germany
3 X-FAB Semiconductor Foundries AG, Erfurt, Germany
09:20 – 20mn thermomechanical [ PID 168 ]
Assembly-Induced Stress and Its Effect on the Integrity of Assembly System in Drop Simulation
Corresponding author: Wei Ren – Senior Research Engineer
Full authors list: Wei Ren, Jianjun Wang, Nokia
Chairman: Pr. Andrew Tay, National University of Singapore; Pr. David Elata, Technion, Israel
08:30 – 30mn Keynote: MP11 multiphysics [ PID 228 ]
Truly Nonlinear Model-Order Reduction Techniques
Corresponding author: Slobodan Mijalkovic – Delft University of Technology
Full authors list: Slobodan Mijalkovic, Delft University of Technology, Delft, The Netherlands
09:00 – 20mn MP12 multiphysics [ PID 207 ]
Parametric Finite Element Analysis for Reduced Order Modeling of MEMS
Corresponding author: Vladimir A. Kolchuzhin – Chemnitz University of Technology, Department Microsystems and Precision Engineering, Germany
Full authors list: Vladimir Kolchuzhin 1, Jan E. Mehner 2, Thomas Gessner 2, Wolfram Doetzel 1
1 Chemnitz University of Technology, Chemnitz, Germany
2 Fraunhofer Institute for Reliability and Microintegration, Chemnitz, Germany
09:20 – 20mn MP13 multiphysics [ PID 116 ]
EFFICIENT PRE-STRESSED HARMONIC ANALYSIS OF RF-MICRORESONATOR BY MEANS OF MODEL ORDER REDUCTION
Corresponding author: Laura Del Tin – ARCES University of Bologna (Italy)
Full authors list: L. Del Tin 1, R. Gaddi 1, A.Gnudi 1, E. Rudnyi 2, A. Greiner 2, J. G. Korvink 2
1 ARCES-DEIS, University of Bologna
2 IMTEK, Laboratory for simulation, University of Freiburg
Chairman: Marcel Meuwissen, TNO Science and Industry, Eindhoven, The Netherlands
10:00 – 20mn Poster: P1 thermomechanical [ PID 175 ]
An Efficient Method for Assessing Board Level Reliability for Micro-electronic Packages using Combined Experimental ? Numerical Techniques
Corresponding author: Marjolein Yvonne Jansen – Philips Applied Technologies
Full authors list: M.Y. Jansen 1, J.W.C. de Vries 1, W.D. van Driel 2
1 Philips Applied Technologies
2 Philips Semiconductors and Delft University of Technology
10:00 – 0mn Poster: P2 thermomechanical [ PID 205 ]
Thermal cycle reliability of the 3D chip stacked package using Pb-free solder bumps: Parameter study by FEM analysis
Corresponding author: Chikage NORITAKE – DENSO CORPORATION
Full authors list: Chikage Noritake 1, Paresh Limaye 2, Mario Gonzalez 2, Bart Vandevelde 2
1 DENSO CORPORATION, Japan & IMEC, Belgium
2 IMEC, Belgium
10:00 – 0mn Poster: P6 thermomechanical [ PID 167 ]
Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis
Corresponding author: Sylvain Deplanque – Robert BOSCH GmbH
Full authors list: Sylvain D?planque 1, Wolfgang N?chter 1, Bernhard Wunderle 2, Ralph Schacht 2, Bernd Michel 2
1 Robert Bosch GmbH, Stuttgart, Germany
2 Fraunhofer IZM, Berlin, Germany
10:00 – 0mn Poster: P4 thermomechanical [ PID 172 ]
Mechanical characterization analysis of a segmented silicon layer on ultra-thin polyimide substrates
Corresponding author: Wang Lingen – Delft University of Technology
Full authors list: L. Wang, K.M.B. Jansen, M. Bartek, A. Polyakov, L.J. Ernst, Delft University of Technology
10:00 – 0mn Poster: P11 thermomechanical [ PID 206 ]
Thermo-Mechanical Modeling of Plastic-Core Solder Balls in Ceramic Ball Grid Array Packages
Corresponding author: Jussi Anttonen – University of Oulu, Microelecronics and Materials Physics Laboratories
Full authors list: Jussi Anttonen 1, Tero Kangasvieri 1, Olli Nousiainen 2, Jussi Putaala 1, Jouko V?h?kangas 1
1 Microelectronics and Materials Physics Laboratories, University of Oulu Finland
2 Materials Engineering Laboratory, University of Oulu Finland
10:00 – 0mn Poster: P8 thermomechanical [ PID 236 ]
Sequentially-Coupled Finite Element Transient Analysis with Hygroscopic Swelling
Corresponding author: Jiang Zhou – Lamar University
Full authors list: Jiang Zhou, Lamar University, Beaumont TX, USA
10:00 – 0mn Poster: P16 thermomechanical [ PID 134 ]
Automated Modeling and Fatigue Analysis of Flexible Printed Circuits
Corresponding author: Alexander Ptchelintsev – NOKIA Research Center
Full authors list: Alexander Ptchelintsev, Nokia Research Center, Helsinki, Finland
10:00 – 0mn Poster: P13 thermomechanical [ PID 234 ]
Modelling of Air Damping in MEMS Inertial Sensors: Comparison Between Numerical and Experimental Results
Corresponding author: Elisabetta Leo – Politecnico di Milano – Mechanical Department
Full authors list: Braghin Francesco, Leo Elisabetta, Resta Ferruccio, Politecnico di Milano
10:00 – 0mn Poster: P14 thermomechanical [ PID 266 ]
Extraction of material parameters for creep experiments on real solder-joints by FE analysis
Corresponding author: Mike Roellig – Dresden University of Technology, Electronics Packaging Laboratory
Full authors list: Mike R?llig, Steffen Wiese, Klaus-J?rgen Wolter, Dresden University of Technology, IAVT
10:00 – 0mn Poster: P28 thermomechanical [ PID 156 ]
Design and Analysis of a novel fan-out WLCSP structure
Corresponding author: Cadmus Yuan – Advanced Chip Engineering Technology Inc.
Full authors list: Cadmus Yuan 1, G. Q. Zhang 1, Ching-Shun Huang 2, Chun-Hui Yu 2, Chin-Cheng Yang 2, Wen-Kung Yang 2, Ming-Chih Yew 3, C. Y. Chou 3, Kou-Ning Chiang 3
1 Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands
2 Advanced Chip Engineering Technology Inc., Taiwan
3 Department of Power Mechanical Engineering, National Tsing Hua University
10:00 – 0mn Poster: P17 thermomechanical [ PID 159 ]
Numerical approach to investigation of thermally conductive adhesives
Corresponding author: Artur Wymyslowski – Wroclaw University of Technology; Faculty of Microsystem Electreonics and Photonics
Full authors list: Tomasz Falat 1, Artur Wymyslowski 1, Jana Kolbe 2, Kaspar M.B. Jansen 3, Leo Ernst 3
1 Wroclaw University of Technology
2 IFAM – Fraunhofer Institut fuer Fertigungstechnik und Angewandte Material
3 Delft Univeristy of Technology
10:00 – 0mn Poster: P23 thermomechanical [ PID 235 ]
Modelling the stiffness and inertial characteristics of MEMS supporting beams: comparison between numerical and experimental results
Corresponding author: Elisabetta Leo – Politecnico di Milano – Mechanical Department
Full authors list: Francesco Bragin, Elisabetta Leo, Ferrucio Resta, Politecnico di Milano, Italy
10:00 – 20mn Poster: P26 thermomechanical [ PID 273 ]
Reliability Optimization of Stacked System-in-Package Using FEA
Corresponding author: Jani Valtanen – Tampere University of Technology
Full authors list: Jani Valtanen, Pekka Heino, Tampere University of Technology, Tampere, Finland
10:00 – 0mn Poster: P30 thermomechanical [ PID 170 ]
Impact of Pitch Reduction over Residual Strain of Flip Chip Solder Bump After Reflow
Corresponding author: DAVOINE C?cile – CEA Grenoble
Full authors list: C. Davoine 1, M. Fendler 2, R. Fortunier 1, C. Louis 1
1 CEA/LETI Grenoble, France
2 Centre de Micro?lectronique de Provence, France
10:00 – 0mn Poster: P29 thermomechanical [ PID 233 ]
Complete elastic characterization of a silica layer by Brillouin scattering.
Corresponding author: Marco G. Beghi – Politecnico di MIlano
Full authors list: G. Signoriello 1, M.G. Beghi 1, A. Rusconi Clerici 2, G. Spinola 2
1 Politecnico di Milano, Italy
2 ST Microelectronics, Italy
10:00 – 0mn Poster: P37 thermomechanical [ PID 154 ]
Reliability Impact of Highly Temperature-Dependent Underfill Material to the Lead-Free Flip Chip Package
Corresponding author: Kuo-Ning Chiang – Department of Power Mechanical Engineering, National Tsing Hua University
Full authors list: C. C. Chiu 1, C. J. Wu 1, C. Y. Chou 1, C. T. Peng 1, K. N. Chiang 1, Terry Ku 2, Kenny Cheng 2
1 Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan
2 VIA Technologies, Inc.,Hsin-Tien, Taipei, Taiwan
10:00 – 0mn Poster: P35 thermomechanical [ PID 267 ]
Influence of the Thickness of Silicon Dies on Strength
Corresponding author: Stephan Sch?nfelder – Fraunhofer Institute for Mechanics of Materials Halle
Full authors list: Stephan Sch?nfelder, Matthias Ebert, J?rg Bagdahn, Fraunhofer Institute for Mechanics of Materials, Halle, Germany
10:00 – 0mn Poster: P40 thermomechanical [ PID 176 ]
Measurements of the solders surface tension values.
Corresponding author: Karel Du?ek – Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology
Full authors list: Jan Urb?nek, Karel Du?ek, Czech Technical University in Prague, Czech Republic
10:00 – 0mn Poster: P39 thermomechanical [ PID 244 ]
Thermomechanical stressing of solar cells
Corresponding author: Marek Novotn? – Department of Microelectronics, Brno University of Technology
Full authors list: Lubo? Jakubka, Pavel Cejtchaml, Ivan Szendiuch, Department of Microelectronics, Brno University of Technology
10:00 – 0mn Poster: thermomechanical [ PID 143 ]
Design for Reliability of Wafer Level Packages
Corresponding author: W.D. van Driel – Philips Semiconductors
Full authors list: W.D. van Driel 1, H.P. Hochstenbach 2, G.Q. Zhang 1
1 Philips Semiconductors, Delft University of Technology
2 Philips Semiconductors
10:00 – 0mn Poster: thermomechanical [ PID 203 ]
Effects of aeronautical conditions on passivation cracking of micro-structures of IC packages
Corresponding author: Yuting HE – University of Air Force Engineering, P.R.China
Full authors list: Y.T. He 1, H.P. Li 1, F. Li 1, L.Wang 2, G.Q. Zhang 3, L.J. Ernst 2
1 College of Aeronautics, University of Air Force Engineering, Xi?an, P.R.China
2 Delft University of Technology, Delft, The Netherlands
3 Philips Semiconductors, Eindhoven; Delft University of Technology, Delft, The Netherlands
10:00 – 0mn Poster: P41 thermomechanical [ PID 253 ]
Exact modelling of stress fields in multi-layer beams using readily available mathematics software
Corresponding author: Christopher Kinsella – University of Limerick
Full authors list: Christopher Kinsella, Thomas D. Moore, John L. Jarvis, University of Limerick, Limerick, Ireland
10:00 – 20mn Poster: P3 thermomechanical [ PID 212 ]
Moisture Effects on the Creep of Thermosetting IC Packaging Polymers
Corresponding author: Xiaosong Ma – Delft University of Technology
Full authors list: Xiaosong Ma, K.M.B. Jansen, L.J. Ernst, TU Delft, The Netherlands
Chairman: Marcel Meuwissen, TNO Science and Industry, Eindhoven, The Netherlands
10:00 – 0mn Poster: multiphysics [ PID 118 ]
Design of High Performance Surface Transverse Wave Resonators
Corresponding author: Shuming T. Wang – I-Shou University, Kaohsiung, Taiwan
Full authors list: Shuming T. Wang 1, Mei-Hui Chung 1, Chun-Hung Yu 2
1 I-Shou University, Taiwan
2 ftech Corporation, Taiwan
10:00 – 20mn Poster: P TF1 thermal [ PID 124 ]
SOI Die Heat Transfer Analysis from Device to Assembly Package
Corresponding author: Yong Liu – Fairchild Semiconductor Corp.
Full authors list: Scott Irving, Yong Liu, Duane Connerny, Timwah Luk, Fairchild Semiconductor Corp., South Portland, ME, USA
10:00 – 0mn Poster: P TF2 thermal [ PID 127 ]
Numerical Examination and Experimental Verification of Thermal Performance of Board-level QFP with Unattached Drop-in Heat Spreader
Corresponding author: Yi-Shao Lai – Advanced Semiconductor Engineering, Inc.
Full authors list: Yi-Shao Lai, Tong Hong Wang, Chang-Chi Lee, Hsuan-Yu Chen, Advanced Semiconductor Engineering, Inc., Nantze, Kaohsiung, Taiwan
10:00 – 20mn Poster: multiphysics [ PID 129 ]
Compact Modeling of Diode with VHDL-AMS Including Reverse Recovery
Corresponding author: Lyse-Aline COYITANGIYE and Richard GRISEL – LEMI (Laboratoire Electronique, Microtechnologie et Instrumentation)
Full authors list: Lyse-Aline COYITANGIYE, Richard GRISEL, LEMI-Universit? de Rouen- IUT, Mont Saint Aignan, France
10:00 – 0mn Poster: P TF3 thermal [ PID 130 ]
Thermal Management of Bright LEDs for Automotive Applications
Corresponding author: Yan Lai – Computational Modelling Group, Tyndall National Institute
Full authors list: Yan Lai, Nicolas Cordero, Tyndall National Institute, Cork, Ireland
10:00 – 0mn Poster: multiphysics [ PID 131 ]
Multi-Physics Simulation Strategies with Application to Fuel Cell Modeling
Corresponding author: Leon Xu – Nokia Research Center
Full authors list: Brian H. Dennis 1, Zhenxue Han 1, Weiya Jin 1, Bo Ping Wang 1, Teppo Aapro 2, Leon Xu 2, Alexander Ptchelintsev 2, Tommi Reinikainen 2
1 University of Texas at Arlington
2 Nokia Research Center
10:00 – 0mn Poster: multiphysics [ PID 135 ]
Multi-domain and mixed-signal simulation of System-on-Chip embedding MEMS
Corresponding author: Skandar BASROUR – TIMA
Full authors list: S. Basrour, K. Matou, Y. Ammar, M. Marzencki, A. Zenati, TIMA, Grenoble, France
10:00 – 0mn Poster: multiphysics [ PID 136 ]
Modeling of the fabrication and operation of 3-D self assembled SOI MEMS
Corresponding author: Carlos Gustavo Mendez – Open-Engineering sa
Full authors list: C. M?ndez 1, C. Louis 1, S. Paquay 1, P. De Vincenzo 1, I. Klapka 1, V. Rochus 2, F. Iker 3, N. Andr 3, J.-P. Raskin 3
1 Open Engineering, Li?ge, Belgium
2 Universit? de Li?ge, Li?ge, Belgium
3 Universit? catholique de Louvain, Louvain-la-Neuve, Belgium
10:00 – 0mn Poster: multiphysics [ PID 137 ]
FEA Calculations for Ultra Thin Piezoresistive Pressure Sensor on SOI for Heatspreader Integration
Corresponding author: Bogdan Bercu – Institute of Microelectronics, Electromagnetism and Photonics
Full authors list: Bogdan Bercu, Laurent Mont, Panagiota Morfouli, Institute of Microelectronics, Electromagnetism and Photonics, Grenoble, France
10:00 – 0mn Poster: multiphysics [ PID 139 ]
Finite Element Modeling of Electrostatic MEMS Including Fringing Field Effects Impacts on Forces
Corresponding author: M. Boutaayamou – University of Li?ge
Full authors list: M. Boutaayamou, K. H. Nair, R.V. Sabariego, P. Dular, Dept. of Electrical Engineering and Computer Science (ELAP), University of Li?ge, Li?ge, Belgium
10:00 – 0mn Poster: multiphysics [ PID 146 ]
Interfacial Adhesion Method for Semiconductor Applications Covering the Full Mode Mixity
Corresponding author: J. Thijsse – Philips Applied Technologies
Full authors list: J. Thijsse 1, W.D. van Driel 2, M.A.J. van Gils 2, O. van der Sluis 3
1 Eindhoven University of Technology, Eindhoven, the Netherlands
2 Philips Semiconductors, Nijmegen, the Netherlands
3 Philips Applied Technologies, Eindhoven, the Netherlands
10:00 – 0mn Poster: multiphysics [ PID 148 ]
Measurements and FE-Simulations of Moisture Distribution in FR4 Based Printed Circuit Boards
Corresponding author: H?l?ne Fr?mont – IXL, ENSEIRB UMR 5818
Full authors list: Fr?mont H?l?ne, IXL, Universit? Bordeaux 1 , Talence, France
Horaud Walter, Solectron, Design & Technology Center, Bordeaux, France
Weide-Zaage Kirsten, LFI, University of Hannover, Hannover, Germany
10:00 – 0mn Poster: multiphysics [ PID 165 ]
An Analysis of Beam Deflections in Poly-SiGe Cantilevers
Corresponding author: Mario Gonzalez – IMEC
Full authors list: Mario Gonzalez, Gregory Van Barel, Ann Witvrouw, Bart Vandevelde, IMEC, Leuven, Belgium
10:00 – 0mn Poster: multiphysics [ PID 182 ]
A Monte Carlo investigation of nanocrystal memory reliability
Corresponding author: Riccardo Gusmeroli – DEI – Politecnico di Milano and IU.NET
Full authors list: Riccardo Gusmeroli 1, Alessandro S. Spinelli 1, Christian Monzio Compagnoni 1, Daniele Ielmini 1, Andrea L. Lacaita 2
1 DEI Politecnico di Milano – IU.NET, Milano, Italy
2 DEI Politecnico di Milano – IU.NET, Milano, Italy and IFN-CNR, Milano, Italy
10:00 – 0mn Poster: multiphysics [ PID 183 ]
Performance improvement of ballistic double-gate devices and design trade-offs
Corresponding author: Riccardo Gusmeroli – DEI – Politecnico di Milano and IU.NET
Full authors list: Riccardo Gusmeroli, Alessandro S. Spinelli, DEI Politecnico di Milano – IU.NET, Milano, Italy
10:00 – 0mn Poster: multiphysics [ PID 185 ]
Impact of source-drain tunneling on double-gate performance
Corresponding author: Alessandro Spinelli – DEI – Politecnico di Milano and IU.NET
Full authors list: Alessandro S. Spinelli, Riccardo Gusmeroli, DEI Politecnico di Milano – IU.NET, Milano, Italy
10:00 – 0mn Poster: multiphysics [ PID 187 ]
Analytic model of the deflection of piezoelectric unimorph and bimorph structures with numerical verification
Corresponding author: David Elata – Technion – Israel Institute of Technology
Full authors list: David Elata, Eyal Elka, Haim Abramovich, Technion – Israel Institute of Technology, Haifa, Israel
10:00 – 0mn Poster: multiphysics [ PID 195 ]
Electro-migration Study in Solder Joint and Interconnects of IC packages
Corresponding author: Lihua Liang – Zhejiang University of Technology, College of Mechanical Engineering
Full authors list: L.H. Liang, Y.J. Xu, Y. Liu, Zhejiang University of Technology
10:00 – 0mn Poster: multiphysics [ PID 200 ]
1 Gb stacked solution of multilevel NOR flash memory packaged in a LFBGA 8 mm by 10 mm by 1.4 mm of thickness
Corresponding author: Paolo Pulici – Department of Electronics – Politecnico di Milano
Full authors list: Michele Dellutri 1, Paolo Pulici 2, Domenico Guarnaccia 1, Pierpaolo Stoppino 1, Gianpietro Vanalli 1, Tito Lessio 1, Francesco Vassallo 1, Rosario Di Stefano 1, Giuseppe Labriola 1, Alberto Tenerello 1, Filippo Lo Iacono 1, Giovanni Campardo 1
1 STMicroelectronics, Agrate Brianza (MI), Italy
2 Politecnico di Milano, Department of electronics, Milano, Italy
10:00 – 0mn Poster: P TF5 thermal [ PID 201 ]
Thermo-Electric Simulation of a 77GHz Radar Transmitter Chip for Automotive Applications
Corresponding author: Adam Augustin – Freescale Halbleiter Deutschland GmbH
Full authors list: Adam Augustin, Torsten Hauck, Akbar Ghazinour, Freescale Semiconductor, Germany
10:00 – 0mn Poster: multiphysics [ PID 209 ]
High Speed Pull Test Characterization for Pb-Free Ball Alloys into BGA Packages.
Corresponding author: Aldo Losavio – STMicroelectronics
Full authors list: Anna Tiziana Valota 1, Aldo Losavio 1, Loic Renard 1, Antonello Vicenzo 2
1 STMicroelectronics
2 Politecnico di Milano
10:00 – 20mn Poster: multiphysics [ PID 210 ]
MVT corrections for the evaluation of damping in MEMS
Corresponding author: FRANGI ATTILIO – DEPT. STRUCTURAL ENGINEERING, POLITECNICO DI MILANO
Full authors list: Cercignani Carlo 1, Frangi Attilio 1, Lorenzani Silvia 1, Vigna Benedetto 2
1 Politecnico di Milano, Italy
2 STMicroelectronics, Italy
10:00 – 0mn Poster: multiphysics [ PID 216 ]
Multiphysics softwares benchmark on ANSYS/COMSOL applied for RF MEMS switches packaging simulations
Corresponding author: PEYROU David – LAAS-CNRS
Full authors list: D. Peyrou 1, P. Pons 1, M. Saadaoui 1, D. Leray 2, A. Ferrand 2, K. Yacine 1, H. Granier 1, A.Nicolas 3, J.W. Tao 4, R. Plana 1
1 LAAS-CNRS, Toulouse, France
2 INSA LGMT-COSAM, Toulouse, France
3 MEMSCAP, Crolles, France
4 ENSEEIHT-LEN7, Toulouse, France
10:00 – 0mn Poster: P TF7 thermal [ PID 229 ]
Hybrid Constant Temperature Regulator
Corresponding author: Reznicek Zdenek, PE – HIT Ltd., Slovak Technical University, Brno University of Technology
Full authors list: Reznicek Zdenek 1, Tvarozek Vladimir 2, Szendiuch Ivan 3, Reznicek Michal 3
1 HIT Ltd., Nedachlebice, Czech Republic
2 Slovak University of Technology, Bratislava, Slovakia
3 Brno University of Technology, Brno, Czech Republic
10:00 – 0mn Poster: multiphysics [ PID 232 ]
Electromechanical model of a multi-layer piezoelectric cantilever
Corresponding author: Jordi Brufau-Penella – Universitat de Barcelona
Full authors list: Jordi Brufau-Penella, Manel Puig-Vidal, Universitat de Barcelona, Spain
10:00 – 0mn Poster: multiphysics [ PID 252 ]
Modeling and Simulation of Ferrite and Varistor EMI Suppressors
Corresponding author: Mirjana Damnjanovic – Faculty of Technical Sciences, University of Novi Sad
Full authors list: Mirjana Damnjanovic, Goran Stojanovic, Ljiljana Zivanov, Faculty of Technical Sciences, University of Novi Sad, Serbia and Montenegro
10:00 – 0mn Poster: multiphysics [ PID 261 ]
FEM modelling of piezo-actuated microswitches
Corresponding author: CHAPUIS Fran?ois – FEMTO-ST/STmicroelectronics/CEA-LETI
Full authors list: F.Chapuis 1, F.Bastien 2, J.F.Manceau 2, F.Casset 3, P.L.Charvet 4
1 Institut FEMTO-ST, dept LPMO, Besan?on, France; STmicroelectronics, Crolles, France
2 Institut FEMTO-ST, dept LPMO, Besan?on, France
3 CEA-LETI, Grenoble, France; STmicroelectronics, Crolles, France
4 CEA-LETI, Grenoble, France
10:00 – 0mn Poster: multiphysics [ PID 269 ]
Effect of interfacial adhesion of copper/epoxy under different moisture level
Corresponding author: Edward K L Chan – Mechanical Engineering Department, The Hong Kong University of Science and Technology
Full authors list: Edward K L Chan, Haibo Fan, Matthew M F Yuen, The Hong Kong University of Science and Technology
10:00 – 0mn Poster: multiphysics [ PID 271 ]
FEM based design and simulation of bulk micromachined MEMS accelerometers with low cross-axis sensitivity
Corresponding author: RAVINDRA MUKHIYA – ADVANCED TECHNOLOGY CENTRE, INDIAN INSTITUTE OF TECHNOLOGY, KHARAGPUR, INDIA
Full authors list: R. Mukhiya 1, A. Adami 2, A. Bagolini 2, M. Zen 2, S. Kal 1
1 Advanced Technology Centre / E & ECE Dept., IIT, Kharagpur, India
2 Microsystems Division, ITC-irst, Trento, Italy
10:00 – 0mn Poster: multiphysics [ PID 272 ]
Geometric Parameters Identification for Bulk-Micromachined Accelerometer from Modal Frequencies Measurements
Corresponding author: Steffen Michael – Melexis GmbH
Full authors list: Steffen Michael, Melexis GmbH, Haarbergstra?e 67, D-99097 Erfurt, Germany
Michael Katzschmann, IMMS gGmbH , Ehrenbergstr. 27, D-98693 Ilmenau, Germany
Siegfried Hering, X-FAB Semiconductor Foundries AG, Haarbergstra?e 67, D-99097 Erfurt, Germany
10:00 – 0mn Poster: multiphysics [ PID 119 ]
Shear Horizontal Surface Acoustic Wave Sensors Based on Polyaniline for Ammonia Gas Sensing
Corresponding author: Chi-Yen Shen – Department of Electrical Engineering, I- Shou University
Full authors list: Chi-Yen Shen, Cheng-Liang Hsu, De-Lu Wang, I- Shou University, Kaohsiung County, Taiwan
10:00 – 0mn Poster: multiphysics [ PID 279 ]
Analysing the Performance of Flexible Substrates for Lead-Free Applications
Corresponding author: Professor Chris Bailey – University of Greenwich
Full authors list: C. Y. Yin 1, H. Lu 1, C. Bailey 1, Y. C. Chan 2
1 University of Greenwich, London, United Kingdom
2 City University of Hong Kong, Hong Kong, China
10:00 – 20mn Poster: TM17 multiphysics [ PID 150 ]
Numerical simulation of SU-8 Optical Accelerometers
Corresponding author: Andreu Llobera – Instituto de Microelectr?nica de Barcelona
Full authors list: A. Llobera 1, V.J. Cadarso 1, V. Seidemann 2, S.B?ttgenbach 2, J.A.Plaza 1
1 Instituto de Microelectr?nica de Barcelona, Barcelona, Spain
2 Institut f?r Mikrotechnik,Braunschweig, Germany
Chairman: S. Wiese, Dresden University of Technology, Germany; F. Gao, Osaka University, Japan
11:00 – 30mn Keynote: thermomechanical [ PID 256 ]
Fatigue and thermal fatigue damage analysis of thin metal films
Corresponding author: Guang-Ping Zhang – Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences
Full authors list: G. P. Zhang 1, C. A. Volkert 2, R. Schwaiger 2, R. M?nig 3, O. Kraft 2
1 Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, P. R. China
2 Institut f?r Materialforschung II, Forschungszentrum Karlsruhe, Germany
3 Department of Materials Science and Engineering, Massachusetts Institute of Technology, USA
11:30 – 20mn thermomechanical [ PID 184 ]
FATIGUE LIFE OF SOLDER BUMPS IN A SYSTEM IN PACKAGE: RELATING POWER CYCLING TO THERMAL CYCLING
Corresponding author: Johan G. J. Beijer – Philips Applied Technologies
Full authors list: J.G.J. Beijer 1, M.Y. Jansen 1, G.M. Janssen 1, J.A. Bielen 2, E.P.A. Tijssen 2
1 Philips Applied Technologies
2 Philips Semiconductors
11:50 – 20mn thermomechanical [ PID 171 ]
Power Amplifier (PA) Transistors Fatigue Life Prediction under Thermo-Mechanical Cyclic Loading
Corresponding author: Jianjun Wang – Nokia
Full authors list: Jianjun Wang, Weiqun Peng, Wei Ren, Nokia, Irving, USA
12:10 – 20mn thermomechanical [ PID 282 ]
The Successive-Initiation Modeling Strategy for Modeling Damage Progression: Application to Voided Solder Interconnects
Corresponding author: A. Dasgupta – CALCE Electronic Products & Systems Center
Full authors list: Leila J. Ladani, Abhijit Dasgupta, CALCE Center, Mechanical Engg. Dept., University of Maryland, USA
Chairman: W. van Driel, Philips Semiconductors, The Netherlands; J. Auersperg, Fraunhofer Institute IZM, Germany
11:00 – 30mn Keynote: thermomechanical [ PID 264 ]
Combined Fracture, Delamination Risk and Fatigue Evaluation of Advanced Microelectronics Applications Towards RSM/DOE Concepts
Corresponding author: J?rgen Auersperg – Fraunhofer IZM, Berlin
Full authors list: J?rgen Auersperg 1, Rainer Dudek 2, Bernd Michel 2
1 Fraunhofer IZM, Berlin and AMIC Angewandte Micro-Messtechnik GmbH, Berlin
2 Fraunhofer IZM, Berlin
11:30 – 20mn thermomechanical [ PID 218 ]
Virtual Prototyping Based Design Optimization of the Substrate, Leadframe and Flip Chip Package Families with Low-k Technology
Corresponding author: Anne Marie Grech – STMicroelectronics
Full authors list: W.D. van Driel 1, A-M. Grech 2, T. Hauck 3, I. Schmadlak 3, X. Zhang 2, S. Orain 4
1 Philips Semiconductors
2 STMicroelectronics
3 Freescale
4 Crolles Alliance
11:50 – 20mn thermomechanical [ PID 152 ]
Sensitivity Design of Chip-in-Substrate-Package Using DOE with Factorial Analysis Technology
Corresponding author: Kuo-Ning Chiang – National Tsing Hua University
Full authors list: Ming-Chih Yew 1, Chang-Ann Yuan 1, Yu-Hua Chen 2, Wen-Kung Yang 3, Kuo-Ning Chiang 1
1 National Tsing Hua University, HsinChu, Taiwan
2 Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
3 Advanced Chip Engineering Technology Inc.,Hsinchu, Taiwan
12:10 – 20mn thermomechanical [ PID 204 ]
Probabilistic Analysis of the Influences of Design Parameter on the Reliability of Chip Scale Packages
Corresponding author: J?rgen Wilde, Elena Zukowski – University of Freiburg – IMTEK
Full authors list: J?rgen Wilde, Elena Zukowski, University of Freiburg, Germany
Chairman: N. Iwamoto, Honeywell, USA; K-N. Chiang, National Tsing Hua University, Taiwan
14:00 – 30mn Keynote: thermomechanical [ PID 301 ]
Effect of chemistry on viscoelastic properties of moulding compounds
Corresponding author: Kaspar M.B. Jansen – Delft University of Technology
Full authors list: K.M.B. Jansen 1, L.J. Ernst 1, H.J.L. Bressers 2
1 TU Delft, The Netherlands
2 Philips Semiconductors Nijmegen, The Netherlands
14:30 – 20mn thermomechanical [ PID 221 ]
Thermo-mechanical characterisation of a nano-sized particle filled underfill
Corresponding author: Marcel Meuwissen – TNO Science and Industry
Full authors list: Marcel Meuwissen, Adri van der Waal, Irene Hovens, Corn? Rentrop, TNO Science and Industry, Eindhoven, The Netherlands
14:50 – 20mn P22 thermomechanical [ PID 155 ]
Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP
Corresponding author: Cadmus Yuan – Advanced Chip Engineering Technology Inc.
Full authors list: Cadmus Yuan 1, G. Q. Zhang 2, Ching-Shun Huang 3, Chun-Hui Yu 4, Chin-Cheng Yang 5, Wen-Kung Yang 6, Ming-Chih Yew 7, Cheng Nan Han 7, Kou-Ning Chiang 8
1 PostDoc, Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands
2 Professor, Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands
3 Engineer, Advanced Chip Engineering Technology Inc., Taiwan
4 Manager, Advanced Chip Engineering Technology Inc., Taiwan
5 Vice Managing Director, Advanced Chip Engineering Technology Inc., Taiwan
6 Managing Director, Advanced Chip Engineering Technology Inc., Taiwan
7 Research Assistant, Department of Power Mechanical Engineering, National Tsing Hua University
8 Professor, Department of Power Mechanical Engineering, National
15:10 – 20mn P34 thermomechanical [ PID 241 ]
Measuring in-thickness mechanical properties of sub micron polymer dielectric films.
Corresponding author: Michiel van Soestbergen – Mechanics of Materials, PME, TU Delft
Full authors list: M. van Soestbergen 1, L. J. Ernst 1, K. M. B. Jansen 1, W. D. van Driel 2, M. Bartek 1, A. Polyakov 1
1 TU Delft, Delft, The Netherlands
2 Philips Semiconductors, Nijmegen, The Netherlands
Chairman: G-P. Zhang, Chinese Academy of Sciences, China; W. Dreyer, Weierstrass Institute for Applied Analysis and Stochastics, Germany
14:00 – 30mn Keynote: INV06 thermomechanical [ PID 297 ]
The correlation between the intermetallic compounds growth pattern and the addition in the solder matrix
Corresponding author: Feng Gao – Osaka University
Full authors list: Feng Gao, Tadashi Takemoto, Joining and Welding Research Institute,Osaka University,Osaka,Japan
14:30 – 20mn thermomechanical [ PID 215 ]
Updated Solder Joint Life Prediction Model Parameters after Eliminating Modeling Assumption and Sensitivity to Constitutive Equations
Corresponding author: Ahmer Syed – Amkor Technology, Inc.
Full authors list: Ahmer Syed, Amkor Technology, Inc.
14:50 – 20mn thermomechanical [ PID 225 ]
Compositional Effects on the Creep Properties of SnAgCu Solder
Corresponding author: Steffen Wiese – TU Dresden, Fak. ETIT, IAVT
Full authors list: Steffen Wiese 1, Frank Kr?mer 1, Michael Krause 2, Sandy Bennemann 2, Maik M?ller 1, Mike R?llig 1, Matthias Petzold 2, Klaus-J?rgen Wolter 1
1 TU Dresden, IAVT
2 Fraunhofer IWMH
15:10 – 20mn thermomechanical [ PID 213 ]
Solder Joint Loading Conditions Under Torsion Test
Corresponding author: MAIA FILHO, Wilson Carlos – Thales Research & Technology France
Full authors list: Wilson Carlos MAIA FILHO 1, Michel BRIZOUX 2, H?l?ne FREMONT 3, Yves DANTO 3
1 THALES Research & Technology France / IXL, ENSEIRB, Universit? de Bordeaux, France
2 THALES Research & Technology, France
3 IXL, ENSEIRB, Universit? de Bordeaux, France
15:30 – 20mn thermomechanical [ PID 160 ]
Reliability analysis of a new soldering process for automotive power modules application
Corresponding author: RIZZI Mathieu – Laboratoire IXL CNRS UMR 5818, ENSEIRB, Universit? Bordeaux 1
Full authors list: Mathieu Rizzi, Eric Woirgard, St?phane Azzopardi, IXL Laboratory ENSEIRB, Universit? de Bordeaux, France
Chairman:
20:00 – 20mn AMICOM thermomechanical [ PID 290 ]
EM Modeling of RF MEMS
Corresponding author: Larissa Vietzorreck – Technische Universit?t M?nchen, Lehrstuhl f?r Hochfrequenztechnik
Full authors list: Larissa Vietzorreck, TU Muenchen, Germany
20:20 – 20mn AMICOM thermomechanical [ PID 291 ]
Acoustics of Piezoelectric devices
Corresponding author: Paul Kirby – Cranfield University
Full authors list: Paul Kirby, Meiling Zhu, Cranfield University, United Kingdom
20:40 – 20mn AMICOM thermomechanical [ PID 292 ]
Modeling the electromechanical response of RF-MEMS switches
Corresponding author: David Elata – Technion – Israel Institute of Technology
Full authors list: David Elata, Technion – Israel Institute of Technology, Haifa, Israel
Chairman: Y. Liu, Fairchild Semiconductors, USA; W. N?chter, Robert Bosch, Germany
08:30 – 30mn Keynote: TF7 thermal [ PID 307 ]
Thermal Performance and Reliability of Thermal Interface Materials: A Review
Corresponding author: Peter Rodgers – The Petroleum Institute
Full authors list: P. Rodgers 1, V. Eveloy 1, E. Rahim 2, D. Morgan 2
1 The Petroleum Institute, United Arab Emirates
2 University of Maryland, College Park, USA
09:00 – 30mn Keynote: MP14 multiphysics [ PID 196 ]
Numerical Simulation of Capillary and Fluid Dynamic Forces on Tiny Chips During Fluidic Self-Assembly
Corresponding author: Andrew Tay – National University of Singapore
Full authors list: Andrew A. O. Tay 1, Hua Li 2, Xiangyang Gao 1, Jeremy Chen 1, V. Kripesh 3
1 National University of Singapore, Singapore, Singapore
2 Institute of High Performance Computing, Singapore, Singapore
3 Institute of Microelectronics, Singapore, Singapore
09:30 – 30mn Keynote: thermomechanical [ PID 299 ]
A Novel MEMS-based Nanoscale Material Testing System
Corresponding author: Horacio D. Espinosa – Northwestern University
Full authors list: Horacio D. Espinosa 1, Yong Zhu 1, Alberto Corigliano 2
1 Northwestern University
2 Politecnico di Milano
Chairman: A. Tay, National University of Singapore, Singapore; H. Pape, Infineon Technologies, Germany
10:30 – 30mn Keynote: thermomechanical [ PID 298 ]
Adhesion and Fracture of Polymer-Metal Interfaces
Corresponding author: Jianmin Qu – Georgia Tech
Full authors list: Jianmin Qu, Georgia Institute of Technology
11:00 – 20mn thermomechanical [ PID 125 ]
Reliability Study of Interconnects Structure in IC Packages
Corresponding author: Yong Liu – Fairchild Semiconductor Corp.
Full authors list: Yong Liu 1, Yumin Liu 2, Scott Irving 1, Timwah Luk 1, Don Desbiens 1, Zhen Zhang 3, Zhigang Suo 3
1 Fairchild Semiconductor Corp. South Portland, ME, USA
2 Fairchild Semiconductor, Suzhou, Jiangsu, China
3 Harvard University, Cambridge, MA, USA
11:20 – 20mn thermomechanical [ PID 194 ]
Adhesion of Arbitrary-Shaped MEMS Microstructures
Corresponding author: Dhruv Bhate – Purdue University
Full authors list: Dhruv Bhate, Purdue University, West Lafayette, IN, USA
Martin Dunn, University of Colorado, Boulder, CO, USA
11:40 – 20mn thermomechanical [ PID 141 ]
Reliability issues in Cu/low-k structures regarding the initiation of stress-voiding or crack failure
Corresponding author: St?phane ORAIN – PHILIPS Semiconductors
Full authors list: S. Orain 1, A. Fuchsmann 2, V. Fiori 2, X. Federspiel 1
1 Philips Semiconductors, Crolles, France
2 STMicroelectronics, Crolles, France
12:00 – 20mn thermomechanical [ PID 270 ]
Evolution of intermetallic phases in solder bonds
Corresponding author: Priv. Doz. Dr. Wolfgang Dreyer – Weierstrass Institute for Applied Analysis and Stochastics
Full authors list: Wolfgang Dreyer, Weierstrass Institute for Applied Analysis and Stochastics Berlin
Chairman: Dr. Moshfegh Ramin, IVF, Sweden; Marcel Meuwissen, TNO, The Netherlands
10:30 – 30mn Keynote: MP15 multiphysics [ PID 305 ]
Reliability in MEMS
Corresponding author: Ingrid de Wolf – IMEC
Full authors list: Ingrid De Wolf, IMECvzw, Leuven, Belgium
11:00 – 20mn MP16 multiphysics [ PID 259 ]
Characterization of Free-standing Thin Film Material Properties for RF-MEMS
Corresponding author: Vincent Burg – Philips Research Laboratories Eindhoven / Eindhoven University of Technology
Full authors list: Vincent Burg 1, Jaap den Toonder 1, Auke van Dijken 2, Johan Hoefnagels 3, Marc Geers 3
1 Philips Research Laboratories Eindhoven, The Netherlands / Eindhoven University of Technology, The Netherlands
2 Philips Research Laboratories Eindhoven, The Netherlands
3 Eindhoven University of Technology, The Netherlands
11:20 – 20mn MP17 multiphysics [ PID 242 ]
APPLICATION OF AN INNOVATIVE TESTING METHOD FOR THE FATIGUE CHARACTERISATION OF 15 um THICK EPITAXIAL POLYSILICON
Corresponding author: Eleonora Ferraris – ITIA-CNR
Full authors list: Eleonora Ferraris 1, Irene Fassi 1, Marco Del Sarto 2
1 ITIA-CNR, Milano, Italia
2 STMicroelectronics, Cornaredo (MI), Italia
11:40 – 20mn MP18 multiphysics [ PID 246 ]
Prediction of Material Properties of Epoxy Using Molecular Dynamic Simulation
Corresponding author: Haibo Fan – Department of Mechanical Engineering,Hong Kong University of Science and Technology
Full authors list: Haibo Fan, Cell K.Y. Wong, Matthew M.F. Yuen, Department of Mechanical Engineering,Hong Kong University of Science and Technology,Clear Water Bay, Kowloon, Hong Kong
12:00 – 20mn MP19 multiphysics [ PID 174 ]
Microstructural Considerations for Ultrafine Lead Free Solder Joints
Corresponding author: Zhiheng Huang – Loughborough University
Full authors list: Zhiheng Huang, Paul P. Conway, Rachel C. Thomson, Loughborough University, Loughborough, United-Kingdom
Chairman: J. Qu, Georgia Tech, USA, B. Vandevelde, IMEC, Belgium
14:00 – 30mn Keynote: INV-01 thermomechanical [ PID 293 ]
Molecular Modeling of Analyte Adsorption on MEMS GC Stationary Phases
Corresponding author: Nancy Iwamoto – Honeywell
Full authors list: Nancy Iwamoto, Ulrich Bonne, Honeywell Laboratories (Specialty Materials and Automation and Control Solutions), USA
14:30 – 30mn Keynote: MP20 multiphysics [ PID 281 ]
Multi-Energy Domain Modeling of Microdevices:Virtual Prototyping by Predictive Simulation
Corresponding author: Gerhard Wachutka – Institute for Physics of Electrotechnology
Full authors list: Gerhard Wachutka, Institute for Physics of Electrotechnology, Munich University of Technology, Germany
15:00 – 30mn Keynote: thermal [ PID 199 ]
From power smd to e-pad packages : a thermal bargain ?
Corresponding author: Claudio Maria Villa – ST Microelectronics
Full authors list: Claudio M. Villa, Arianna Morelli, Donata Gualandris, ST Microelectronics
15:30 – 30mn Keynote: TM39 thermomechanical [ PID 296 ]
Facing the challenge of designing for Cu/Low-K reliability
Corresponding author: Willem van Driel – Philips Semiconductors
Full authors list: W.D. van Driel, Delft University of Technology & Philips Semiconductors, The Netherlands
