EuroSimE 2005 was locally organised by Fraunhofer IZM (Rainer Dudek and team) with support of AMIC GmbH, in Radisson Hotel of Berlin, Germany

EuroSimE 2005 in Berlin, Germany

The 6th IEEE EuroSimE conference was held in Berlin, Germany, in April
2005 and was attended by 155 individuals.

· courses were offered for professional training.
· Three days of technical sessions for oral and poster presentation (112
in total).
· A parallel exhibition from industrial contributors and simulation and
optimization software companies (8 organizations in total).

Proceedings of EuroSimE 2005 – Berlin, Germany, April 2005

720 pages A4
IEEE Catalog Number: 05EX1050

ISBN: 0-7803-9062-8
CD-ROM version
IEEE Catalog Number: 05EX1050C
ISBN: 0-7803-9063-6

crystal package
The CD has a dedicated browser featuring a search capability on keywords: content,
author, organisation, country.

Chapter 1 : Industrial Trends

  • Advanced Packaging as Key Enabler for System Solutions

    Dr. Werner Klingenstein

  • Nanoreliability – Combined Simulation and Experiment

    Prof. Dr. Bernd Michel

  • Trends in Power Semiconductor Packaging

    Don Desbiens

Chapter 2 : New Developments in Design Modeling

  • Sense and Nonsense of Heat Transfer Correlations Applied to Electronic Cooling

    C. Lasance

  • Importance of Upstream Design in Product Development and Its Methodology

    K. Ohtomi

  • Modeling of integrated inductors and transformers for RF applications

    Jose M. Lopez-Villegas, J. Sieiro

Chapter 3 : Designing for Interface Reliability

  • Thermo-Mechanical Finite-Element Modeling of a Chip-on-Foil Bonding Process

    P. Suter, R. Bauknecht, T. Graf, H. Duran, I. Venter

  • Investigation of adhesion properties of Cu-EMC interface by Molecular Dynamic Simulation

    C. KY Wong, H.B. Fan, M.MF Yuen

  • Thermal Cycling Simulation in Electronics Packages Using the Molecular Dynamic Method

    H.B. Fan, E.K.L Chan, C.K.Y. Wong, M.M.F. Yuen

  • Cu bonding to Cu low K wafers: a systematic study of the mechanical bonding process

    D. Degryse, B. Vandevelde, E. Beyne

Chapter 4 : Model Order Reduction Techniques

  • Dynamic Macromodels for Sensor Devices

    Christina Bohm, Torsten Hauck, Manfred Thanner, Gary O’Brien

  • Parametric Model Order Reduction for Scanning Electrochemical Microscopy: Fast Simulation of Cyclic Volt ammogram

    L. Feng, D. Koziol, E.B. Rudnyi, J.G. Korvink

  • Comparison of Model Order Reduction Methodologies for Thermal Problems

    M. Salleras, S. Marco, T. Bechtold, E. Rudnyi, J. Korvink, J. Santander, L. Fonseca

  • Compact modeling of RF passives by using model order reduction techniques

    J. Sieiro, Jose M. Lopez-Villegas

Chapter 5 : Modeling and Characterization of Solder Joints

  • Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders

    S. Déplanque, W. Nüchter, M. Spraul, B. Wunderle, R. Dudek, B. Michel

  • Creep of thermally aged SnAgCu-Solder Joints

    S. Wiese, M. Röllig, K-J. Wolter

  • Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts

    M. Roellig, R. Dudek, S. Wiese, B.Wunderle, K-J. Wolter, B. Michel

  • Deformation Characteristics and Microstructural Evolution of SnAgCu Solder Joints

    T.O. Reinikainen, P. Marjamäki, J.K. Kivilahti, E. Monlevade

Chapter 6 : Modeling of Material Behavior

  • Out of plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach

    F. Cacchione, A. Corigliano, B. De Masi, M. Ferrera

  • Investigations of Strength Properties of Ultra-Thin Silicon

    S. Schönfelder, J. Bagdahn, M. Ebert, M. Petzold, K. Bock, C. Landesberger

  • Investigation of Non-Uniform Moisture Distribution on Determination of Hygroscopic Swelling Coefficient and Finite Element Modeling for a Flip Chip Package

    Jiang Zhou, Ramesh Putta, Sachin P. Lahoti, Sharan C., Manish P. Sitlani

  • Measuring and Modeling the Cure-Dependent Rubbery Moduli of Epoxy Molding Compound

    D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, H.J.L. Bressers, J.H.J. Janssen

Chapter 7 : CFD and FE Thermal Modeling

  • An Experimental Setup for Validating a CFD Model of a Double-sided PCB in a Sealed Enclosure at Various Power Configurations

    J. Johansson, I. Belov, P. Leisner

  • Validation of FE Model for Transient Hot Wire Thermal Conductivity Measurements

    J. Bilek, Dr J. Atkinson, Prof W. Wakeham

  • Improved Methods for Memory Module Characterization

    M. Carmona, G. Eggers, S. Leseduarte, A. Legen, A. Wolter, S. Neugebauer, J. Thomas

  • Modelling of Fluid Flow and Heat Transfer in a Copper Base Heat Sink Application

    Jafar Mahmoudi

Chapter 8 : Designing for reliability and optimization

  • Parameter Optimization for Wafer Probe using Simulation

    Y. Liu, D. Desbiens,S. Irving, T. Luk

  • Moisture effects on the reliability of Anisotropic Conductive Films

    C.Y. Yin, H. Lu, C. Bailey, Y.C. Chan

  • Warpage minimization of the HVQFN map mould

    J.G.J. Beijer, J.H.J.Janssen, H.J.L. Bressers, W.D. van Driel, K.M.B. Jansen, D.G. Yang, G.Q. Zhang

  • A Novel Response Surface Method for Simulation-Based Design Optimizations of Electronic Packages

    Zhen Xue Han, Leon Xu, Bo Ping Wang, Tommi Reinikainen

Chapter 9 : Delamination related Failures

  • Driving mechanisms of delamination related reliability problems in exposed pad packages

    W.D. van Driel, H.J.L. Bressers, M.A.J. van Gils, G.Q. Zhang, L.J. Ernst

  • Analysis of Cu/low-k Bondpad Delamination by using a Novel Failure Index

    M.A.J. van Gils, G.Q. Zhang, J.H.J. Janssen, O. van der Sluis, R.M.J. Voncken

  • Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications

    J. Auersperg, B. Seiler, E. Cadalen, R. Dudek, B. Michel

Chapter 10 : MultiPhysics problems in MEMS

  • The Computation of Electrostatic Forces in MEMS: Spatial Method vs. Material Method

    K. Zeng, J.G. Korvink

  • On the evaluation of damping forces in MEMS

    A. Frangi, A. Corigliano, G. Spinola

  • Multiphysics for Topology Optimization in MEMS

    J. Korvink, Z. Liu

Chapter 11 : Thermo-Mechanical Issues in Microelectronics and Microsystems Applications

  • Impact of the Die Attach Process on Power and Thermal Cycling for a Discrete Style Semiconductor Package

    Y. Liu, S. Irving, D. Desbiens, T. Luk, N.S. How, Y. Kwon, S.D. Lee

  • An Effective Method for Improving IC Package Die Failure Assembly Punching Process

    S. Irving, Y. Liu, E.I.V. Almagro, H.T. Granada Jr

  • Solder Joints Layout Design and Reliability Enhancement of Wafer Level Packaging

    C-M. Liu, C-C. Lee, K-N. Chiang

  • Weibull Statistics for Multiple Flaw Distributions and its Application in Silicon Fracture Prediction

    T. Hauck, C. Bohm, W.H. Müller

  • Design Rules to Avoid Tunnel Cracking in VLSI interconnects during Process Flow

    H. Brillet, S. Orain, V. Fiori, M. Dupeux, M. Braccini

  • Predicting the Mechanical Behavior of Self-Deformed Micromachined Cantilevers

    A. Pasupuleti, F. Sahin, A. Raisanen, J.L. Hebding, W.W. Walter, K.D. Hirschman

  • Reliability Analysis of Lead-Free BGA Assemblies Linking FE Simulations and Experimental Results

    A. Guédon-Gracia, P. Roux, E. Woirgard, C. Zardini

  • Evaluation of spring constant in plates with straight suspensions

    M. Lishchynska, N. Cordero, O. Slattery, C. O’Mahony

  • Simulation assisted investigation and improvement of the performance of an electronics assembly subjected to temperature cycling

    M. Lindgren, M. Meuwissen, P. Leisner

  • A Stress-Life Methodology for Ball Grid Array Lead-Free and Tin-Lead Solder Interconnects under Impact Conditions

    G. Heaslip, J.M. Punch, B.A. Rodgers, C. Ryan, M. Reid

  • Finite Element Analysis on Transient Post-welding Shift of Opto-electronic Pigtail Package

    C.H. Yiu, Y.M. Cheung

  • The effect of cycling hardening in copper heat-sinks on die fracture probability

    J. Bielen, M. van Gils, F. Theunis

  • Design Study for Improved Solder Joint Reliability of VQFN Packages

    S. Stoeckl, H. Pape

  • New Experimental Approach For Failure Prediction In Electronics: Topography And Deformation Measurement Complemented With Acoustic Microscopy

    I. Richard, R. Fayolle, A. Smyth, J-C. Lecomte

Chapter 12 : Multi-Physics Modelling and Characterization

  • Simulating Lithium-Ion Batteries Operation with MODAL. Recent Development and Some Test Cases

    F. Ternay, D. Djian, S. Martinet

  • Oxide development on coated copper contacts

    M. Reid, J. Punch, T. Galkin, K. Väkeväinen, T. Stenberg, M. Vilén, M. Mihov

  • Design Study for a Thick-Film Piezoelectric Actuator in an LTCC structure

    M. Santo Zarnik, D. Belavic

  • Simulating piezoelectric transformers for lighting applications

    Micheal Morris, Orla Slattery, Gerald Duffy, Paddy Byrne, Andrew Connell

  • Simulation of mass flux divergence distribution for an evaluation of commercial test structures with tungsten plugs

    K. Weide-Zaage, V. Hein

  • Coupled Electro-Mechanics Simulation Methodology of the Dynamic Pull-in in Micro-Systems

    V. Rochus, D.J. Rixen, J-C. Golinval

  • FEM of anodic bonding test structures

    J.A. Plaza, E. Gonzalez, J. Esteve

Chapter 13 : Thermal Modeling and Characterization in Microelectronics

  • Compact Electro-thermal Model of Semiconductor Device with Nonlinear Convection Coefficient

    L. Feng, E.B. Rudnyi, J.G. Korvink, C. Bohm, T. Hauck

  • Sequential approach to numerical optimisation of the LTCC ceramic pressure sensor

    A. Wymyslowski, M. Santo-Zarnik, D. Belavic

  • A minimum specification of air-cooling and layout design by efficient optimization scheme for outline design stage

    Y. Iwata, S. Hayashi, R. Satoh, K. Fujimoto

  • Improved 3D-Nonlinear Compact Modeling for Power Components

    W. Habra, P. Tounsi, J-M. Dorkel

  • Thermal Analysis of Power MOSFETS Using Rebeca-3D Thermal Modeling Software (from Epsilon Ingénierie) versus Physical Measurements and Possible Extractions

    K. Pandya, S. Jaunay

  • Transient Hygrothermal Behaviour of Portable Electronics

    J. Punch, R. Grimes, G. Heaslip, T. Galkin, K. Väkeväinen, V. Kyyhkynen, E. Elonen, O. Rusanen

  • Some important considerations in heatsink design

    B. Karimpourian, J. Mahmoudi

Chapter 14 : Materials Modelling and Characterisation for Thermo-Mechanics

  • Mechanical Properties of Sintered Kovar Alloy for Structure Components of Optical Devices

    Liao K.C., Feng H.P., Cheng C.D., Tsai H.H., Shieh W.B.

  • Fracture and Delamination of Thin Multilayers on Ultra-thin Silicon

    G. Kravchenko, J. Bagdahn

  • Models correlation and comparison for solder joint reliability

    Yangjian Xu, Lihua Liang, Yong Liu

  • Comparison of Lifetime Predictions with 3-D Finite Element Model of Power Electronics Devices

    S. Moreau, R. Leroy, T. Lequeu, R. Jérisian

  • A reliability evaluation of lead-free ball grid array (BGA) solder joints through mechanical fatigue testing

    C. Ryan, J. Punch, B. Rodgers

  • FE analysis and experimental testing of a 4-pin ceramic test vehicle with tin-lead and tin-silver-copper solder joints

    M. Spraul, W. Nüchter, B. Wunderle, B. Michel

  • Measurement of acceleration factor for lead-free solder (SnAg3.8Cu0.7) in thermal cycling test of BGA components and calibration of lead-free solder joint model for life prediction by finite element analyses

    K. Andersson, A. Perttula, O. Salmela, J. Särkkä, M. Tammenmaa

  • Complete Model for Interfacial stresses of a Two Layered Structure

    D. Sujan, M. V. V. Murthy, K. N. Seetharamu, A. Y. Hassan

  • Viscoelastic characterization of fast curing moulding compounds

    B.V. Milosheva, K.M.B. Jansen, J.H.J. Janssen, H.J.L. Bressers, L.J. Ernst

  • Experimental Investigation of the Adhesion Dilation with Negative Thermal Expansion LiAlSi2O6 Fillers

    H-H. Tsai, C.D. Cheng, W.B. Shieh, K.T. Lee, H.P. Feng

  • Characterization of Non-Conductive Adhesives

    D. Farley, A. Dasgupta, J.F.J. Caers, W.E. Hua

  • Modelling and Experiments on an Isothermal Fatigue Test for Solder Joints

    S. Ridout, M. Dusek, C. Bailey, C. Hunt

  • Modelling Methodology for Linear Elastic Compound Modelling Versus Visco-Elastic Compound Modelling

    R.B.R van Silfhout, J.G.J Beijer, G.Q. Zhang, W.D. van Driel

  • Experimental Determination and Finite Element Validation of the Anand Viscoplasticity Model for SnAgCu

    B. Rodgers, B. Flood, J. Punch, F. Waldron

  • Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

    M.A. Matin, E.W.C. Coenen, W.P. Vellinga, M.G.D. Geers

Chapter 15 : Prediction of Dynamic Behavior

  • Transient analysis of impact fracturing of solder joints

    C.L. Yeh, Y.S. Lai

  • Hybrid Experimental and Computational Approach for Rate Dependent Mechanical Properties Using Indentation Techniques

    J. Varghese, D. Herkommer, G. Radig, A. Dasgupta

Chapter 16 : New techniques in component design and modelling

  • Computer Assisted Design Study of a Low-Cost Pressure Sensor

    M.H.H. Meuwissen, E.P. Veninga, M.W.W.J. TIjdink, M.G.H. Meijeirink

  • Advanced Structural Similarity rules for the BGA package family

    W.D. van Driel, A. Mavinkurve, M.A.J. van Gils, G.Q. Zhang, L.J. Ernst

  • Probabilistic Design approach for Package Design and Solder Joint Reliability optimization for a Lead Free BGA Package

    P. Limaye, B. Vandevelde, J. Van de Peer, S. Donders, R. Darveaux

Chapter 17 : Designing for Packaging Reliability

  • Thermal-mechanical coupling analysis for coupled power and thermal cycling fatigue reliability of chip-scale packages

    Y.S. Lai, T.H. Wang, C.C. Lee

  • Correct Modelling of Geometry and of Materials Properties in the Thermo-Mechanical Finite-Elements-Simulation of Chip Scale Packages

    E. Zukowski, E. Deier, J. Wilde

  • Thermal Performance and Solder Joint Reliability for Board Level Assembly of Modified Leadframe Package

    Chien-Chen Lee, Chang-Chun Lee, K-N. Chiang

  • Life Prediction Models for Lead-free BGA Packages and Modules under Board Level Drop Test and Thermal Cycling Test

    T.Y. Tee, J-E. Luan, H.S. Ng, K.Y. Goh, X. Baraton, R. Bronner, M. Sorrieul, T. Reinikainen, E. Hussa, A. Kujala

  • Development of Predictive Modeling Scheme for Flip-chip on Fine Pitch Flex Substrate

    Changsoo Jang, Seongyoung Han, Yeongkook Kim, Hangyu Kim, Samson Yoon, Seungmin Cho, Changwoon Han, Bongtae Han

Chapter 18 : Small Scale Thermofluids

  • Numerical simulation and optimisation of the vacuum microsensor

    A. Wymyslowski, K.J. Urbanski, T.M. Berlicki

  • Peaks in Temperature Distribution over the Area of Operating Power Semiconductor Junctions Related to the Surface Leakage Current

    V.V.N. Obreja, C. Codreanu, K.I. Nuttall, I. Codreanu

  • Analytical solutions for two-dimensional heat spread in ASICs using conformal mapping techniques

    A. Augustin, A. Kostka, B. Maj

  • Application of GAs to Optimization of Heat Transfer in Micro-Channels

    I. Codreanu, V.V.N. Obreja, C. Codreanu

  • Rigorous thermal treatment of heat generation and heat transfer in GaAs-based HBT device modeling

    F.A. Mohammadi, K. Meres, M.C.E. Yagoub

Chapter 19 : New Developments in Modeling and Experiments – part I

  • A Comparative Study of Solder Fatigue Evaluated by Microscopic In-situ Analysis, On-line Resistance Measurement and FE Calculations

    R. Dudek, W. Faust, J. Vogel, B. Michel

  • Contrasting CFD for Electronic Systems Modeling with that for Aerospace

    P. Tucker, Y. Liu

  • Modeling and Design of Shape Memory Alloy Actuators

    M. Langelaar, G.H. Yoon, S. Gurav, Y.Y. Kim, F. van Keulen

Chapter 20 : Multiscale Modeling and Experiments

  • A constitutive single crystal model for the silicon mechanical behavior: application to the stress induced by silicided lines in MOS technologies

    F. Cacho, S. Orain, G. Cailletaud, H. Jaouen

  • Impression Creep Testing and Microstructurally Adaptive Creep Modeling of Lead Free Solder Interconnects

    I. Dutta, D. Pan, S. Jadhav

  • A Multi Scale Finite Element Method to Evaluate Bond Pad Architectures

    V. Fiori, S. Orain

  • Reliability of SnAgCu Solder Balls in Packaging

    M. Erinç, P.J.G. Schreurs, G.Q. Zhang, M.G.D. Geers

Chapter 21 : Component Level Thermal Analysis

  • Thermal Placement Optimization of MCMs Using a Force-Directed based Approach

    H-C. Cheng, Y-C. Huang

  • Thermal analysis of fully integrated RF single-package module for GSM Quad-band Jandsets

    K-C. Park, S. Hwang, J. Koo

  • Analytical and finite element models of the thermal behaviour for leadfree soldering processes in electronic assembly

    N. Van Steenberge, B. Vandevelde, I. Schildermans, G. Willems

  • Room Temperature Soldering of Microelectronic Components for Enhanced Thermal Performance.

    J. S. Subramanian, P. Rodgers, J. Newson, T. Rude, Z. He, E. Besnoin, T.P. Weihs, V. Eveloy, M.G. Pecht

Chapter 22 : New Developments in Modeling and Experiments – part II

  • Point-of-Source Thermal Management

    J. Punch

  • Extending the Limits of Air-Cooling in Microelectronic Equipment

    P. Rodgers, V. Eveloy, M.G. Pecht

  • Characterization of Thin Film and Intermetallic Compound in Solder Joints

    Iting Tsai, Li Jung Tai, S. F. Yen, T. H. Chuang, Robert Lo, Terry Ku, Enboa Wu