EuroSimE 2005 was locally organised by Fraunhofer IZM (Rainer Dudek and team) with support of AMIC GmbH, in Radisson Hotel of Berlin, Germany
EuroSimE 2005 in Berlin, Germany
The 6th IEEE EuroSimE conference was held in Berlin, Germany, in April 2005 and was attended by 155 individuals. · courses were offered for professional training. 
Proceedings of EuroSimE 2005 – Berlin, Germany, April 2005
720 pages A4 IEEE Catalog Number: 05EX1050 ISBN: 0780390628 

CDROM version IEEE Catalog Number: 05EX1050C ISBN: 0780390636 crystal package The CD has a dedicated browser featuring a search capability on keywords: content, author, organisation, country. 
Chapter 1 : Industrial Trends
 Advanced Packaging as Key Enabler for System Solutions
Dr. Werner Klingenstein  Nanoreliability – Combined Simulation and Experiment
Prof. Dr. Bernd Michel  Trends in Power Semiconductor Packaging
Don Desbiens
Chapter 2 : New Developments in Design Modeling
 Sense and Nonsense of Heat Transfer Correlations Applied to Electronic Cooling
C. Lasance  Importance of Upstream Design in Product Development and Its Methodology
K. Ohtomi  Modeling of integrated inductors and transformers for RF applications
Jose M. LopezVillegas, J. Sieiro
Chapter 3 : Designing for Interface Reliability
 ThermoMechanical FiniteElement Modeling of a ChiponFoil Bonding Process
P. Suter, R. Bauknecht, T. Graf, H. Duran, I. Venter  Investigation of adhesion properties of CuEMC interface by Molecular Dynamic Simulation
C. KY Wong, H.B. Fan, M.MF Yuen  Thermal Cycling Simulation in Electronics Packages Using the Molecular Dynamic Method
H.B. Fan, E.K.L Chan, C.K.Y. Wong, M.M.F. Yuen  Cu bonding to Cu low K wafers: a systematic study of the mechanical bonding process
D. Degryse, B. Vandevelde, E. Beyne
Chapter 4 : Model Order Reduction Techniques
 Dynamic Macromodels for Sensor Devices
Christina Bohm, Torsten Hauck, Manfred Thanner, Gary O’Brien  Parametric Model Order Reduction for Scanning Electrochemical Microscopy: Fast Simulation of Cyclic Volt ammogram
L. Feng, D. Koziol, E.B. Rudnyi, J.G. Korvink  Comparison of Model Order Reduction Methodologies for Thermal Problems
M. Salleras, S. Marco, T. Bechtold, E. Rudnyi, J. Korvink, J. Santander, L. Fonseca  Compact modeling of RF passives by using model order reduction techniques
J. Sieiro, Jose M. LopezVillegas
Chapter 5 : Modeling and Characterization of Solder Joints
 Relevance of primary creep in thermomechanical cycling for lifetime prediction in Snbased solders
S. Déplanque, W. Nüchter, M. Spraul, B. Wunderle, R. Dudek, B. Michel  Creep of thermally aged SnAgCuSolder Joints
S. Wiese, M. Röllig, KJ. Wolter  Novell test concept for experimental lifetime prediction of miniaturized leadfree solder contacts
M. Roellig, R. Dudek, S. Wiese, B.Wunderle, KJ. Wolter, B. Michel  Deformation Characteristics and Microstructural Evolution of SnAgCu Solder Joints
T.O. Reinikainen, P. Marjamäki, J.K. Kivilahti, E. Monlevade
Chapter 6 : Modeling of Material Behavior
 Out of plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach
F. Cacchione, A. Corigliano, B. De Masi, M. Ferrera  Investigations of Strength Properties of UltraThin Silicon
S. Schönfelder, J. Bagdahn, M. Ebert, M. Petzold, K. Bock, C. Landesberger  Investigation of NonUniform Moisture Distribution on Determination of Hygroscopic Swelling Coefficient and Finite Element Modeling for a Flip Chip Package
Jiang Zhou, Ramesh Putta, Sachin P. Lahoti, Sharan C., Manish P. Sitlani  Measuring and Modeling the CureDependent Rubbery Moduli of Epoxy Molding Compound
D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, H.J.L. Bressers, J.H.J. Janssen
Chapter 7 : CFD and FE Thermal Modeling
 An Experimental Setup for Validating a CFD Model of a Doublesided PCB in a Sealed Enclosure at Various Power Configurations
J. Johansson, I. Belov, P. Leisner  Validation of FE Model for Transient Hot Wire Thermal Conductivity Measurements
J. Bilek, Dr J. Atkinson, Prof W. Wakeham  Improved Methods for Memory Module Characterization
M. Carmona, G. Eggers, S. Leseduarte, A. Legen, A. Wolter, S. Neugebauer, J. Thomas  Modelling of Fluid Flow and Heat Transfer in a Copper Base Heat Sink Application
Jafar Mahmoudi
Chapter 8 : Designing for reliability and optimization
 Parameter Optimization for Wafer Probe using Simulation
Y. Liu, D. Desbiens,S. Irving, T. Luk  Moisture effects on the reliability of Anisotropic Conductive Films
C.Y. Yin, H. Lu, C. Bailey, Y.C. Chan  Warpage minimization of the HVQFN map mould
J.G.J. Beijer, J.H.J.Janssen, H.J.L. Bressers, W.D. van Driel, K.M.B. Jansen, D.G. Yang, G.Q. Zhang  A Novel Response Surface Method for SimulationBased Design Optimizations of Electronic Packages
Zhen Xue Han, Leon Xu, Bo Ping Wang, Tommi Reinikainen
Chapter 9 : Delamination related Failures
 Driving mechanisms of delamination related reliability problems in exposed pad packages
W.D. van Driel, H.J.L. Bressers, M.A.J. van Gils, G.Q. Zhang, L.J. Ernst  Analysis of Cu/lowk Bondpad Delamination by using a Novel Failure Index
M.A.J. van Gils, G.Q. Zhang, J.H.J. Janssen, O. van der Sluis, R.M.J. Voncken  Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
J. Auersperg, B. Seiler, E. Cadalen, R. Dudek, B. Michel
Chapter 10 : MultiPhysics problems in MEMS
 The Computation of Electrostatic Forces in MEMS: Spatial Method vs. Material Method
K. Zeng, J.G. Korvink  On the evaluation of damping forces in MEMS
A. Frangi, A. Corigliano, G. Spinola  Multiphysics for Topology Optimization in MEMS
J. Korvink, Z. Liu
Chapter 11 : ThermoMechanical Issues in Microelectronics and Microsystems Applications
 Impact of the Die Attach Process on Power and Thermal Cycling for a Discrete Style Semiconductor Package
Y. Liu, S. Irving, D. Desbiens, T. Luk, N.S. How, Y. Kwon, S.D. Lee  An Effective Method for Improving IC Package Die Failure Assembly Punching Process
S. Irving, Y. Liu, E.I.V. Almagro, H.T. Granada Jr  Solder Joints Layout Design and Reliability Enhancement of Wafer Level Packaging
CM. Liu, CC. Lee, KN. Chiang  Weibull Statistics for Multiple Flaw Distributions and its Application in Silicon Fracture Prediction
T. Hauck, C. Bohm, W.H. Müller  Design Rules to Avoid Tunnel Cracking in VLSI interconnects during Process Flow
H. Brillet, S. Orain, V. Fiori, M. Dupeux, M. Braccini  Predicting the Mechanical Behavior of SelfDeformed Micromachined Cantilevers
A. Pasupuleti, F. Sahin, A. Raisanen, J.L. Hebding, W.W. Walter, K.D. Hirschman  Reliability Analysis of LeadFree BGA Assemblies Linking FE Simulations and Experimental Results
A. GuédonGracia, P. Roux, E. Woirgard, C. Zardini  Evaluation of spring constant in plates with straight suspensions
M. Lishchynska, N. Cordero, O. Slattery, C. O’Mahony  Simulation assisted investigation and improvement of the performance of an electronics assembly subjected to temperature cycling
M. Lindgren, M. Meuwissen, P. Leisner  A StressLife Methodology for Ball Grid Array LeadFree and TinLead Solder Interconnects under Impact Conditions
G. Heaslip, J.M. Punch, B.A. Rodgers, C. Ryan, M. Reid  Finite Element Analysis on Transient Postwelding Shift of Optoelectronic Pigtail Package
C.H. Yiu, Y.M. Cheung  The effect of cycling hardening in copper heatsinks on die fracture probability
J. Bielen, M. van Gils, F. Theunis  Design Study for Improved Solder Joint Reliability of VQFN Packages
S. Stoeckl, H. Pape  New Experimental Approach For Failure Prediction In Electronics: Topography And Deformation Measurement Complemented With Acoustic Microscopy
I. Richard, R. Fayolle, A. Smyth, JC. Lecomte
Chapter 12 : MultiPhysics Modelling and Characterization
 Simulating LithiumIon Batteries Operation with MODAL. Recent Development and Some Test Cases
F. Ternay, D. Djian, S. Martinet  Oxide development on coated copper contacts
M. Reid, J. Punch, T. Galkin, K. Väkeväinen, T. Stenberg, M. Vilén, M. Mihov  Design Study for a ThickFilm Piezoelectric Actuator in an LTCC structure
M. Santo Zarnik, D. Belavic  Simulating piezoelectric transformers for lighting applications
Micheal Morris, Orla Slattery, Gerald Duffy, Paddy Byrne, Andrew Connell  Simulation of mass flux divergence distribution for an evaluation of commercial test structures with tungsten plugs
K. WeideZaage, V. Hein  Coupled ElectroMechanics Simulation Methodology of the Dynamic Pullin in MicroSystems
V. Rochus, D.J. Rixen, JC. Golinval  FEM of anodic bonding test structures
J.A. Plaza, E. Gonzalez, J. Esteve
Chapter 13 : Thermal Modeling and Characterization in Microelectronics
 Compact Electrothermal Model of Semiconductor Device with Nonlinear Convection Coefficient
L. Feng, E.B. Rudnyi, J.G. Korvink, C. Bohm, T. Hauck  Sequential approach to numerical optimisation of the LTCC ceramic pressure sensor
A. Wymyslowski, M. SantoZarnik, D. Belavic  A minimum specification of aircooling and layout design by efficient optimization scheme for outline design stage
Y. Iwata, S. Hayashi, R. Satoh, K. Fujimoto  Improved 3DNonlinear Compact Modeling for Power Components
W. Habra, P. Tounsi, JM. Dorkel  Thermal Analysis of Power MOSFETS Using Rebeca3D Thermal Modeling Software (from Epsilon Ingénierie) versus Physical Measurements and Possible Extractions
K. Pandya, S. Jaunay  Transient Hygrothermal Behaviour of Portable Electronics
J. Punch, R. Grimes, G. Heaslip, T. Galkin, K. Väkeväinen, V. Kyyhkynen, E. Elonen, O. Rusanen  Some important considerations in heatsink design
B. Karimpourian, J. Mahmoudi
Chapter 14 : Materials Modelling and Characterisation for ThermoMechanics
 Mechanical Properties of Sintered Kovar Alloy for Structure Components of Optical Devices
Liao K.C., Feng H.P., Cheng C.D., Tsai H.H., Shieh W.B.  Fracture and Delamination of Thin Multilayers on Ultrathin Silicon
G. Kravchenko, J. Bagdahn  Models correlation and comparison for solder joint reliability
Yangjian Xu, Lihua Liang, Yong Liu  Comparison of Lifetime Predictions with 3D Finite Element Model of Power Electronics Devices
S. Moreau, R. Leroy, T. Lequeu, R. Jérisian  A reliability evaluation of leadfree ball grid array (BGA) solder joints through mechanical fatigue testing
C. Ryan, J. Punch, B. Rodgers  FE analysis and experimental testing of a 4pin ceramic test vehicle with tinlead and tinsilvercopper solder joints
M. Spraul, W. Nüchter, B. Wunderle, B. Michel  Measurement of acceleration factor for leadfree solder (SnAg3.8Cu0.7) in thermal cycling test of BGA components and calibration of leadfree solder joint model for life prediction by finite element analyses
K. Andersson, A. Perttula, O. Salmela, J. Särkkä, M. Tammenmaa  Complete Model for Interfacial stresses of a Two Layered Structure
D. Sujan, M. V. V. Murthy, K. N. Seetharamu, A. Y. Hassan  Viscoelastic characterization of fast curing moulding compounds
B.V. Milosheva, K.M.B. Jansen, J.H.J. Janssen, H.J.L. Bressers, L.J. Ernst  Experimental Investigation of the Adhesion Dilation with Negative Thermal Expansion LiAlSi2O6 Fillers
HH. Tsai, C.D. Cheng, W.B. Shieh, K.T. Lee, H.P. Feng  Characterization of NonConductive Adhesives
D. Farley, A. Dasgupta, J.F.J. Caers, W.E. Hua  Modelling and Experiments on an Isothermal Fatigue Test for Solder Joints
S. Ridout, M. Dusek, C. Bailey, C. Hunt  Modelling Methodology for Linear Elastic Compound Modelling Versus ViscoElastic Compound Modelling
R.B.R van Silfhout, J.G.J Beijer, G.Q. Zhang, W.D. van Driel  Experimental Determination and Finite Element Validation of the Anand Viscoplasticity Model for SnAgCu
B. Rodgers, B. Flood, J. Punch, F. Waldron  Correlation between thermal fatigue and thermal anisotropy in a Snrich solder alloy
M.A. Matin, E.W.C. Coenen, W.P. Vellinga, M.G.D. Geers
Chapter 15 : Prediction of Dynamic Behavior
 Transient analysis of impact fracturing of solder joints
C.L. Yeh, Y.S. Lai  Hybrid Experimental and Computational Approach for Rate Dependent Mechanical Properties Using Indentation Techniques
J. Varghese, D. Herkommer, G. Radig, A. Dasgupta
Chapter 16 : New techniques in component design and modelling
 Computer Assisted Design Study of a LowCost Pressure Sensor
M.H.H. Meuwissen, E.P. Veninga, M.W.W.J. TIjdink, M.G.H. Meijeirink  Advanced Structural Similarity rules for the BGA package family
W.D. van Driel, A. Mavinkurve, M.A.J. van Gils, G.Q. Zhang, L.J. Ernst  Probabilistic Design approach for Package Design and Solder Joint Reliability optimization for a Lead Free BGA Package
P. Limaye, B. Vandevelde, J. Van de Peer, S. Donders, R. Darveaux
Chapter 17 : Designing for Packaging Reliability
 Thermalmechanical coupling analysis for coupled power and thermal cycling fatigue reliability of chipscale packages
Y.S. Lai, T.H. Wang, C.C. Lee  Correct Modelling of Geometry and of Materials Properties in the ThermoMechanical FiniteElementsSimulation of Chip Scale Packages
E. Zukowski, E. Deier, J. Wilde  Thermal Performance and Solder Joint Reliability for Board Level Assembly of Modified Leadframe Package
ChienChen Lee, ChangChun Lee, KN. Chiang  Life Prediction Models for Leadfree BGA Packages and Modules under Board Level Drop Test and Thermal Cycling Test
T.Y. Tee, JE. Luan, H.S. Ng, K.Y. Goh, X. Baraton, R. Bronner, M. Sorrieul, T. Reinikainen, E. Hussa, A. Kujala  Development of Predictive Modeling Scheme for Flipchip on Fine Pitch Flex Substrate
Changsoo Jang, Seongyoung Han, Yeongkook Kim, Hangyu Kim, Samson Yoon, Seungmin Cho, Changwoon Han, Bongtae Han
Chapter 18 : Small Scale Thermofluids
 Numerical simulation and optimisation of the vacuum microsensor
A. Wymyslowski, K.J. Urbanski, T.M. Berlicki  Peaks in Temperature Distribution over the Area of Operating Power Semiconductor Junctions Related to the Surface Leakage Current
V.V.N. Obreja, C. Codreanu, K.I. Nuttall, I. Codreanu  Analytical solutions for twodimensional heat spread in ASICs using conformal mapping techniques
A. Augustin, A. Kostka, B. Maj  Application of GAs to Optimization of Heat Transfer in MicroChannels
I. Codreanu, V.V.N. Obreja, C. Codreanu  Rigorous thermal treatment of heat generation and heat transfer in GaAsbased HBT device modeling
F.A. Mohammadi, K. Meres, M.C.E. Yagoub
Chapter 19 : New Developments in Modeling and Experiments – part I
 A Comparative Study of Solder Fatigue Evaluated by Microscopic Insitu Analysis, Online Resistance Measurement and FE Calculations
R. Dudek, W. Faust, J. Vogel, B. Michel  Contrasting CFD for Electronic Systems Modeling with that for Aerospace
P. Tucker, Y. Liu  Modeling and Design of Shape Memory Alloy Actuators
M. Langelaar, G.H. Yoon, S. Gurav, Y.Y. Kim, F. van Keulen
Chapter 20 : Multiscale Modeling and Experiments
 A constitutive single crystal model for the silicon mechanical behavior: application to the stress induced by silicided lines in MOS technologies
F. Cacho, S. Orain, G. Cailletaud, H. Jaouen  Impression Creep Testing and Microstructurally Adaptive Creep Modeling of Lead Free Solder Interconnects
I. Dutta, D. Pan, S. Jadhav  A Multi Scale Finite Element Method to Evaluate Bond Pad Architectures
V. Fiori, S. Orain  Reliability of SnAgCu Solder Balls in Packaging
M. Erinç, P.J.G. Schreurs, G.Q. Zhang, M.G.D. Geers
Chapter 21 : Component Level Thermal Analysis
 Thermal Placement Optimization of MCMs Using a ForceDirected based Approach
HC. Cheng, YC. Huang  Thermal analysis of fully integrated RF singlepackage module for GSM Quadband Jandsets
KC. Park, S. Hwang, J. Koo  Analytical and finite element models of the thermal behaviour for leadfree soldering processes in electronic assembly
N. Van Steenberge, B. Vandevelde, I. Schildermans, G. Willems  Room Temperature Soldering of Microelectronic Components for Enhanced Thermal Performance.
J. S. Subramanian, P. Rodgers, J. Newson, T. Rude, Z. He, E. Besnoin, T.P. Weihs, V. Eveloy, M.G. Pecht
Chapter 22 : New Developments in Modeling and Experiments – part II
 PointofSource Thermal Management
J. Punch  Extending the Limits of AirCooling in Microelectronic Equipment
P. Rodgers, V. Eveloy, M.G. Pecht  Characterization of Thin Film and Intermetallic Compound in Solder Joints
Iting Tsai, Li Jung Tai, S. F. Yen, T. H. Chuang, Robert Lo, Terry Ku, Enboa Wu