EuroSimE 2004 was locally organised by IMEC (Bart Vandevelde and team) in Novotel Tour Noire, Brussels, Belgium

Proceedings of EuroSimE 2004 – Brussels, Belgium, May 2004

625 pages A4 ISBN 0-7803-8420-2 IEEE Catalog number 04EX831 CD version already unavailable

• CHAPTER 1, Industrial Trends – Roadmap Challenges There is More than Moore – A.J.van Roosmalen

  Opportunities and Challenges for Telecommunications Technology – J.Rantala

  Trends in Automotive Packaging – H.Casier

  Trends & Challenges in Microsystems Packaging – M.K.Iyer

• CHAPTER 2, Technology DevelopmentsNano-electronics in Biological Applications – G.Borghs

  Reliability Challenges and Recent Advances for Cu Interconnects – Paul S.Ho,
  Ki-Don Lee, Sean Yoon, Guotao Wang

  From Macro-Cooling to Micro-Reliability – M.R.D.Davies

• CHAPTER 3, Virtual Thermal Mechanical PrototypingModeling of Cure-Induced Warpage of Plastic IC Packages – D.G.Yang, K.M.B.Jansen,
  L.J.Ernst, G.Q.Zhang, W.D.van Driel, H.J.L.Bressers

  Thermo-Mechanical Stress Modelling of MOS Device with Electro- thermal Considerations
  – P.Tounsi, J.P.Fradin, X.Chauffleur, Ph.Dupuy, J.M.Dorkel, A.Marty, A.Deram

  FEM-based Method to Determinate Mechanical Stress Evolution during Process
  Flow in Microelectronics – Application to Stress-Voiding – S.Orain, J.C Barbé,
  X.Federspiel, P.Legallo, H.Jaouen

  On Wire Failures in Micro-electronic Packages – W.D.van Driel, J.H.J.Jansen
  , G.Q.Zhang, M.A.J.van Gils, R.B.R.van Silfhout, L.J.Ernst

• CHAPTER 4, Thermal Mechanical Behavior on Wafer Level A Finite Element Study of Process Induced Stress in the Transistor Channel:
  Effects of Silicide Contact and Gate Stack – C.Torregiani, J.Liu, B.Vandevelde,
  D.Degryse, M.J.Van Dal, A.Benedetti, A.Lauwers, K.Maex

  Effect of Metal Layout Design on Passivation Crack Occurrence using both Experimental
  and Simulation Techniques – R.B.R van Silfhout, W.D.van Driel, Y.Li, M.A.J.van
  Gils, J.H.J.Janssen, G.Q.Zhang, G.Tao, J.Bisschop, L.J.Ernst

  Probability of Silicon Fracture in Molded Packages – C.Bohm, T.Hauck, W.H.Müller,
  A.Juritza

  Interfacial Sliding and Plasticity in Back-end Interconnect Structures of Microelectronic
  devices – I.Dutta, D.Pan, C.Park, J.Vella

   

• CHAPTER 5, Dynamic Compact Thermal and Electro-Thermal
  Models
•  

  Empirical Validation of Thermal Dynamics in a Silicon Microthruster: Influence
  of the Boundary Conditions – M.Salleras, I.García, J.Palacín, M.Puig, J.Samitier,
  S.Marco

  Compact Electro-thermal Models of Semiconductor Devices with Multiple Heat
  Sources – C.Bohm, T.Hauck, E.B.Rudnyi, J.G.Korvink

  Electro-Thermal Transistor Models in the SISSI Electro-Thermal IC Simulator
  – V.Székely, A.Poppe, G.Hajas

• CHAPTER 6, Experimental and Numerical InteractionComputational Model Validation with Experimental Data from Temperature Cycling
  Tests of PBGA Assemblies for the Analysis of Board Level Solder Joint Reliability
  – R.Lee, D.Lau

  PWB Warpage Analysis and Verification using an AP210 Standards-based Engineering
  Framework and Shadow Moiré – D.Zwemer, S.McCarron, A.Spradling,R.Peak, M.Bajaj,T.Thurman,
  M.Dickerson, L.Klein, G.Liutkis,K.Brady J.Messina

  Novel Numerical and Experimental Analysis of Dynamic Responses under Board
  Level Drop Test – Tong Yan Tee, Jing-en Luan, Eric Pek, Chwee Teck Lim, Zhaowei
  Zhong

  Finite Element Modelling of Crack Detection Tests – S Ridout, M Dusek, C Bailey,
  C Hunt

• CHAPTER 7, Modeling and Designing of Advanced PackagingDesign, Fabrication and Comparison of Lead-Free/Eutectic Solder Joint Reliability
  of FlipChip Package – Chih-Tang Peng, Kuo-Ning Chiang, Terry Ku, Kenny Chang

  Virtual Qualification of Moisture Induced Failures of Advanced Packages – M.A.J.van
  Gils, W.D.van Driel, G.Q.Zhang, H.J.L.Bressers,R.B.R.van Silfhout, X.J.Fan, J.H.J.Janssen

  Finite Element Analysis of an Improved Wafer Level Package using Silicone Under
  Bump (SUB) Layers – M.Gonzalez, M.Vanden Bulcke, B.Vandevelde, E.Beyne, Y.Lee,
  B.Harkness, H.Meynen

  Crack and Delamination Risk Evaluation of Thin Silicon Applications based on
  Fracture Mechanics Approaches – J.Auersperg, D.Vogel, B.Michel

   

• CHAPTER 8, Thermal Behavior Modeling and Characterization
  – Numerical Simulation and Experimental Verification of the Thermal Contact
•  

  Properties of the Polymers Bonds – T.Falat, A.Wymyslowski, K.Friedel, J.Felba

  Experiments on Behaviour of Power Silicon PN Junctions under Reverse Bias Voltage
  at High Temperature – V.V.N.Obreja, C.Codreanu, K.Nuttall, O.Buiu

  Parameter Calibration on Post-ion-implantation Dopant Diffusions – J.Fu , W.Crans,
  W.J.Eijsenga

• CHAPTER 9, Advanced Numerical Simulation MethodologiesAutomated FEM Mesh Optimization for Nonlinear Problems Based on Error Estimation
  – S.Rzepka

  Advanced Numerical Prototyping Methods in Modern Engineering Applications –
  W.D.van Driel, J.van de Peer, N.Tzannetakis, A.Wymyslowski, G.Q.Zhang

  Reliability-Based Design Optimization for Land Grid Array Solder Joints Under
  Thermo-Mechanical Load – Zhenxue Han, Bo Wang, Leon Xu, Tommi Reinikainen, Ren
  Wei

  Finite Element Analysis of Ultra Thin BGA Package: First and Second Level Reliability
  – P.Limaye, B.Vandevelde, H.deVries, D.Degryse, K.Slob, C.van Veen, R.Labie

  Application of Simulation-based Decision Making in Product Development of an
  RF Module – M.Lindgren, I.Belov, M.Törnvall, P.Leisner

   

• CHAPTER 10, Small Scale Thermal and Fluid Aspects
  in Microsystems
•  

  Data on the Velocity Slip and Temperature Jump Coefficients – F.Sharipov

  Shear Driven Micro-Flows of Gaseous Mixtures – D.Valougeorgis, S.Naris

  Effect of Slip on Transient Liquid Flow Development in Micro-Channels – M.N.Sabry,
  A.R.Abdel-Rahim, M.H.Mansour

  Model Order Reduction of 3D Electro-Thermal Model for a Novel Micromachined

  Hotplate Gas Sensor – T.Bechtold, J.Hildenbrand, J.G.Korvink, J.Wollenstein

  Non-contact Thermal Conductivity Measurements of P-doped and N-doped Gold

  Covered Natural and Isotopically-Pure Silicon and their Oxides – M.G.Burzo,
  P.L.Komarov, P.E.Raad

• CHAPTER 11, Modeling in Micro TechnologyDesign and analysis of novel glass WLCSP structure – Chang-Ann Yuan , Cheng
  Nan Han, Kou-Ning Chiang

  State of the Art in Prediction of Mechanical Behaviour of Microsystems – M.Lishchynska,
  N.Cordero, O.Slattery

  Behavioral VHDL-AMS Modeling of Nuclear Magnetic Resonance Sensor – S.Megherbi,
  J.-C.Ginefri, L.Darrasse, G.Raynaud, J.-F.Pône

  3D-FEM Modelling of an Electro-Optical Micro-Shutter – P.Roux, E.Woirgard,
  M.Pizzi

  Novel 2D Micronib Ionization Sources for Nano Electrospray-Mass Spectrometry
  (ESI-MS) – S.Le Gac, S.Arscott1, C.Rolando

• CHAPTER 12, Designing for ReliabilityA Study of Cyclic Bending Reliability of Bare-die-type Chip-scale Packages
  – Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Jenq-Dah Wu

  Three-Dimensional Stress Analysis of Ink Marking Process – Chang-Lin Yeh1,
  Yi-Hsien Lin, Yi-Shao Lai, Hsiao-Chuang Chang, Jenq-Dah Wu

  Microprocessor Packaging Strategy: Reliability of various Flip Chip BGA

  Packages on different Printed Circuit Boards – A.Guilhaume, C.Munier, C.Allégret,
  M.Michaud

  Mechanism-Based Delamination Prediction During Reflow with Moisture

  Preconditioning – X.J.Fan, L.J.Ernst, G.Q.Zhang, W.van Driel

  Microstructural Stability and Failure Modes in Eutectic Sn-Ag-Cu Solder – M.A.Matin,
  W.P.Vellinga, and M.G.D.Geers

  Analysis of Thermal-Moisture Induced Failure of Pb-free Soldered IC Packages
  in

  SMT Reflow Soldering Process – Ning Sun, Dachuan Lin, Daoguo Yang,

• CHAPTER 13, Material Characterization and ModelingRupture Test on Polysilicon Films Through Electrostatic Actuation – F.Cacchione,
  B.De Masi, A.Corigliano, M.Ferrera

  Evaluation of the Primary and Secondary Creep of SnPb Solder Joint Using a
  Modified Grooved-lap Test Specimen – S.Déplanque, W.Nüchter, B.Wunderle, H.Walter,
  B.Michel

  Numerical Simulation and Experimental Verification of the Piezoresistivity
  Phenomenon for the Printed Thick-Film Piezoresitors – A.Wymyslowski, M.Santo –
  Zarnik, K.Friedel, D.Belavi?c

  Void Formation in a Copper-Via-Structure Depending on the Stress Free Temperature
  and Metallization Geometry – K.Weide, D.Dalleau, Y.Danto, H.Fremont

  Mechanical Characterisation of SiLK by Nanoindentation and Substrate Curvature
  Techniques – V.Gonda, K.M.B.Jansen, L.J.Ernst, Jaap den Toonder, G.Q.Zhang

  Cantilever Microbeams: Modelling of the Dynamical Behaviour and Material Characterization
  – R.Yahiaoui, A.Bosseboeuf

  A Novel Tool for Cure Dependent Viscoelastic Characterization of Packaging
  Polymers – C.van ’t Hof, L.J.Ernst, K.M.B.Jansen, D.G.Yang, H.J.L.Bressers, G.Q.Zhang

• CHAPTER 14, Modeling of MEMS and Optical DevicesHardware Description Language Modeling of an Electrostatically Actuated bi-axial
  Micromirror – F.Parrain, S.Megherbi, G.Raynaud, H.Mathias, J.Gilles, A.Bosseboeuf,
  G.Schröpfer, P. Cusin, N.Faure

  Polymer Waveguide and VCSEL Array Multi-Physics Modelling for OECB Based Optical
  Backplanes – D.Gwyer, P.Missebrook, C.Bailey, P.P.Conway, K.Williams

  Determination of Residual Stress in Glass Frit Bonded MEMS by Finite Element
  Analysis  – M.Ebert, J.Bagdahn

• CHAPTER 15, Simulation-Based Thermal Design StrategiesA Computer-Architecture Approach to Thermal Management in Computer Systems:
  Opportunities and Challenges – K.Skadron, M.R.Stan, W.Huang, Zhijian Lu, K.Sankaranarayanan,
  J.Lach

  Tri-dimensional reduced-order Thermal Model of Stacked Electronic Structures
  – V.Feuillet, V.Gatto, Y.Scudeller, Y.Jarny

  Thermal Modeling for Power MOSFETs in DC-DC Applications – Y.Bulut, K.Pandya

• CHAPTER 16, Solder Reliability BehaviorReliability of SnPb and Pb-Free Flip-Chips under Different Test Conditions
  – M.Spraul, W.Nüchter, A.Möller, B.Wunderle, B.Michel

  Microstructural and Mechanical Characterization of 95.5Sn-4Ag-0.5Cu Solder
  Balls by Nano-Indentation – M.Erinç, P.Schreurs, G.Q.Zhang, W.D.van Driel, M.Geers

  Modeling Stress Strain Curves For Lead Free 95.5Sn-3.8Ag-0.7Cu Solder – J.H.L.Pang,
  B.S.Xiong and T.H.Low

  Effect of Different Temperature Cycle Profiles on the Crack Propagation and
  Microstructural Evolution of Real Lead Free Joints of Different Electronic Components
  – C.Andersson, D.Andersson, P-E Tegehall , Johan Liu

  A Review of Creep Fatigue Failure Models in Solder Material – Simplified Use
  of a Continuous Damage Mechanical Approach – G.Massiot, C.Munier

• CHAPTER 17, CFD and FE Modeling of Thermal PerformanceThermal and Flow Analysis of SiC-Based Gas Sensors for Automotive Applications
  – I.Below, P.Leisner, H.Wingbran, A.L.Spetz, H.Sundgren, B.Thuner, H.Svenningstorp,
  P. Leisner

  Low Reynolds Number Turbulence Models for Accurate Thermal Simulations of Electronic
  Components – K Dhinsa, C Bailey, K Pericleous

  Thermal Testing of a 3-Die Stacked Chip Scale Package Including Evaluation
  of Simplified and Complex Package Geometry Finite Element Models – B.A.Zahn

  Thermal Analysis of QFN Packages Using Finite Element Method – C.L.Chang, Y.Y.Hsieh

  Experimental Study on Visualization of a Longitudinal Heat Sink with Top-mounted
  Fan by Particle Tracking – J.H.Jang

   

• CHAPTER 18, Micro- to Macro-Scale Thermal Design
  Challenges in Microelectronics
•  

  Modeling Heat Transfer and Liquid Flow in Micro-Channels – M.N.Sabry, B.O.Djebedjian,
  S.H.Saleh, M.M.Mahgoub

  Cooling Problems and Thermal Issues in High Power Electronics: a Multi-Faceted
  Design Approach – M.Behnia, L.Maguire ,G.Morrison

  Design Challenges for High-Performance Heat Sinks used in Microelectronic Equipment:
  Evolution and Future Requirements – P.Rodgers, V.Eveloy

• CHAPTER 19, Solder FatigueA Mechanics-Based Strain Gage Methodology for Direct Solder Joint Reliability
  Assessment – L.L.Mercado, S.Girouard, G.Hsieh

  Microstructural Behaviour of Solder Alloys – R.L.J.M.Ubachs, P.J.G.Schreurs,
  M.G.D.Geers

  Flip Chip Solder Joint Fatigue Analysis Using 2D and 3D FE Models – A.Yeo,
  C.Lee, J.H.L.Pang

  Thermal Fatigue Modelling for SnAgCu and SnPb Solder Joints – R.Dudek, H.Walter,
  R.Doering, B.Michel

  Thermal Cycling Reliability of SnAgCu and SnPb Solder Joints: A Comparison
  for Several IC-Packages – B.Vand?
  Gevelde, M.Gonzalez, P.Limaye, P.Ratchev, E.Beyne

   

• CHAPTER 20, Characterization and Modeling of Polymer
  behavior
•  

  Molecular Modeling Studies of IC Barrier Concerns – N.Iwamoto

  Molecular Simulation of Cu-SAM Adhesion Force – H.Fan, C.K.Wong, M.M.F.Yuen

  Cure, Temperature and Time dependent Constitutive Modeling of Moulding Compounds
  – K.M.B.Jansen, L.Wang, D.G.Yang, C.van `t Hof, L.J.Ernst, H.J.L.Bressers, G.Q.Zhang

  Simulation of No-Flow Underfill Process for Flip-Chip Assembly – A.Kolbeck,
  T.Hauck, J.Jendrny, O.Hahn, Rolf Mahnken

  Mechanical Properties of Molding Compounds (MCs) under Different Moisture Conditions
  and in a Wide Temperature Range – W.H.Zhu, S.L.Gan, C.L.Toh

   

• CHAPTER 21, New Developments in Microelectronics
  Reliability
•  

  Challenges of Thermomechanical Design and Modeling of Ultra Fine-Pitch Wafer
  Level Packages – A.A.O.Tay

  Topography and Deformation Measurement under Thermomechanical Stress – R.Fayolle,
  J.Lecomte

  Reliability of Interfaces for Lead-Free Solder Bumps – R.L.H.Shih, D.Y.K.Lau,
  R.W.M.Kwok, M.Li, M.K.W.Sun

  From Chemical Building Blocks of Polymers to Microelectronics Reliability –
  H.J.L.Bressers, W.D.van Driel, K.M.B.Jansen, L.J.Ernst and G.Q.Zhang