EuroSimE 2003 was locally organised by “Association EuroSimE” in Palais des Congrès of Aix-en-Provence, France

Proceedings of EuroSimE 2003 – Aix-en-Provence, France, March-April 2003

	Proceedings of EuroSimE 2003. 490 pages A4 ISBN 0-7803-7054-6 (C) IEEE CD version included at no extra charge.
	CD-ROM version of Proceedings of EuroSimE 2003 (CD). PDF files ISBN 0-7803-7056-2 (C) IEEE

1. Keynote: From Smart Card to Smart Object
   

   Henri Boccia, Gemplus, France

2. Keynote:Market Situation, Trends and Reliability Issues of Micro-Systems
   as Enabler for Automotive Applications

   Günter Lugert, Thomas Riepl, Siemens, Germany

3. Keynote: Needs for advanced packaging and new developments of IC process
   

   Didier Grenier, STMicroelectronics, France

4. Keynote:Carbon nanotube applications in microelectronics
   

   W. Hoenlein, F. Kreupl, G.S. Duesberg, A.P. Graham, M. Liebau,
   R. Seidel, E. Unger, Infineon, Germany

5. Keynote: Delamination of electronic package
   

   Matthew Yuen, Haibo Fan, Hong Kong Univ. of Science and Technology,
   Hong Kong

6. Keynote:Computer-aided engineering of electro-thermal MST devices:
   moving from device to system simulation

   Jan G. Korvink, Evgenii B. Rudnyi, University of Freiburg, Germany

7. Keynote: Prediction of Microelectronics Thermal Behavior in Electronic
   Equipment: Status, Challenges and Future Requirements

   Peter Rogers, Electronics Thermal Management, Ltd., Ireland

8. Keynote: Development of the Green Plastic Encapsulation for High Density
   Wire Bonded Packages

   T.Y. Lin , C.M.Fang, Y.F.Yao, K.H.Chua, Agere Systems Singapore
   Pte Ltd., Singapore

9. Thermal-mechanical properties of an electrically conductive adhesive
   

   M.H.H. Meuwissen, H.L.A.H. Steijvers, M. van den Nieuwenhof,
   TNO Institute of Industrial Technology, The Netherlands

10. Micromechanical modeling of stress evolution induced during cure in
    a particle filled electronic packaging polymer

    D.G. Yang , K.M.B. Jansen, L.G. Wang, L.J. Ernst, Delft University
    of Technology
    G.Q. Zhang, H.J.L. Bressers, Philips, The Netherlands

11. Reliability Investigations of Flip Chip Package with Porous Underfill
    

    K.-C. Liao, H. H. Tsai, Mechanical Engineering, Mingchi Institute
    of Technology, Taiwan

12. Parallel Session 4: Thermal Behavior Modeling
    

    Chair: P.Rodgers, Electronics Thermal Management, Ireland

13. Keynote: Thermal Behavior of Stacked System-in-Package
    

    Jani Valtanen, Pekka Heino, and Eero Ristolainen, Tampere University
    of Technology, Finland

14. Modeling the Assembly and Performance of Optoelectronic Packages
    

    D.Gwyer, C. Bailey, K. Pericleous, University of Greenwich,
    UK
    D. Philpott, P. Misselbrook, Celestica, UK

15. Thermal Management of Joule-heating Microreactor using Modelling Tools
    

    Nicolás Cordero, Jonathan West, Helen Berney, NMRC, University
    College, Ireland

16. Study of semiconductor surfaces in the radiant-heat transfer systems
    

    V.I.Rudakov, V.V. Ovcharov, V.P.Prigara, Institute of Microelectronics
    and Informatics, Russian Academy of Sciences, Russia

17. Keynote: Thermo Mechanical Solder Joint Fatigue Under Mobile Phone
    Usage Conditions

    Pirkka Myllykoski, Nokia, Finland

18. Microstructure evolution of tin-lead solder
    

    R.L.J.M. Ubachs, P.J.G. Schreurs, and M.G.D. Geers, Eindhoven
    University of Technology, The Netherlands

19. Quantitative microscopy of microstructural evolution in eutectic solders
    subjected to static thermal load

    M.A. Matin, W.P.Vellinga, M.G.D.Geers, Eindhoven University
    of Technology, The Netherlands

20. FE Modeling of a shear test: Correlation with experiments
    

    M. Gonzalez, B. Vandevelde, R. Van Hoof and E. Beyne, IMEC,
    Belgium

21. Parallel Session 6: Thermal & Mechanical problems in Advanced Packaging
    

    Chair: H.Pape, Infineon Technologies, Germany

22. Keynote: Mechanical, Thermal and Electrical Issues in System-in-a-Package
    on Low-Cost Liquid Crystal Polymer Substrate

    Johan Liu, Liu Chen, Gang Zou, Chalmers University of Technology
    C/O IVF, Sweden
    Jorma Kivilahti, Helsinki University of Technology, Finland

23. Reliability Prediction of Exposed Pad Type Semiconductor Packages
    

    Torsten Hauck, Tina Bohm, Motorola GmbH, Germany

24. Reliability Analysis of a New Type of Optical Fiber Array Module for
    Transceivers

    Hsiao-Tung Ku and Kuo-Ning Chiang, National Tsing Hua University,
    Taiwan

25. Feasibility Study of a Thermal Packaging for Fiber Bragg Gratings by
    Invar Effect Substrate

    H.H., Tsai, K.C. Liao, Mingchi Institute of Technology, Taiwan

26. Keynote: Requirements in Advanced Packaging Curriculum
    

    Guna Selvaduray, Joseph F. Becker and H Anthony Chan, San Jose
    State Univ. ,USA

27. Nonlinear Reduced Modeling Of a Damped Dual-axis Accelerometer
    

    Eskild R. Westby, Norwegian University of Science and Technology,
    Norway

28. FEA Simulation of Package Stress in Transfer Molded MEMS Pressure Sensors
    

    Rudolf Krondorfer, Timothy C. Lommasson, SensoNor asa, Norway
    Yeong Kim, Samsung Techwin, Korea

29. Characterisation of P and N Type Silicon Piezoresistive Strain Gauges
    

    D. O’Mahoney, O. Slattery, E. Sheehan, Finbarr Waldron, National
    Microelectronics Research Centre, University College Cork, Ireland

30. Keynote: Component Modeling Methodology in Consumer Electronic Product
    Development

    Geneviève Martin,Wendy Luiten, Philips, The Netherlands

31. An approach to a numerical simulation of thermal contact problems in
    electronic packages

    K. Friedel; A. Wymyslowski, Wroclaw University of Technology,
    Poland

32. A model based optimization of a line shaped Laval nozzle for Micro
    Abrasive Air Jetting

    A. Holtsmark, M. Achtsnick, A. M. Hoogstrate, B. Karpuschewski,
    A. Beukers, Delft University of Technology, The Netherlands

33. Investigations of the thermal properties of AII-BVI mixed crystals
    with the piezoelectric phase spectra method

    M. Malinski, Technical University of Koszalin
    J. Zakrzewski, H. Meczynska, Nicolaus Copernicus University, Poland

34. Keynote: Design Analysis and Optimization of Wirebond Stacked Die BGA
    Packages for Improved Board Level Solder Joint Reliability

    Tong Yan Tee, Hun Shen Nga, Xavier Baratona, STMicroelectronics
    Singapore
    Zhaowei Zhong, Nanyang Technological University, Singapore

35. Optimization of the Reliability of a BGA Package by Finite-Element-Simulation
    

    Anton Legen, Manuel Carmona, Jens Pohl, Jochen Thomas, Infineon
    Technologies AG, Germany

36. Response Surface Methodology for Enhancing Theoretical Models: Application
    to Warpage Prediction of CSP BGAs

    Eric Egan, Gerard Kelly, Tom O’Donovan, Peter Kennedy, National
    University of Ireland
    Gerard Kelly, Cork Institute of Technology, Ireland

37. Solution and Test of a Numerical Model Describing Lithium Evolution
    in Secondary Batteries

    F. Ternay, A. Laurent, S. Martnet, CEA/GRENOBLE, DRT/DTEN/SCSE,
    France

38. Fatigue Damage Modeling in Solder Joints: a cohesive zone approach
    

    Adnan Abdul-Baqi, Piet J.G. Schreurs, Marc G.D. Geers, Eindhoven
    University of Technology, The Netherlands

39. The reliability study of underfill Flip Chip in Micro-electronic Packaging
    

    Xiaosong Ma, J.J.Chen, D.G.Yang, Xi’an Univ. of Electronic Technology
    and Guilin Univ. of Electronic Technology

40. Parallel Session 10: Thermal Performance
    

    Chair: N.Cordero, Ireland

41. Keynote: Board Via Effect on Thermal Performance of a Leadless Package
    

    Heinz Pape, Kay Schille, Rudolf Kutscherauer, Infineon Technologies
    AG, Germany

42. Wafer Scale Power Transistor Package: Electro-Thermal Modeling and
    Validation

    A.W.J.P. den Boer, M.A.J. van Gils, G.M. Janssen, Philips, The
    Netherlands

43. Comparative Study of Power Module Technologies by means of Thermal
    Simulation Tools

    Peter Hansen, Flemming Nielsen, Hans S. Nielsen, John Jacobsen,
    Grundfos A/S, Denmark

44. An Investigation of Thermal Enhancement of MPM BGA Package
    

    Abe-JM Yang, Cary Yang, Carol Liang, Jeng Yung Lai, Yu-Po Wang,
    CS Hsiao, Siliconware Precision Industries Co., Ltd., Taiwan

45. Packaging simulation in gas flow sensors
    

    N.Sabaté, I.Gràcia, J.Berganzo, C.Can, Centre Nacional de Microelectrònica,
    CNM-CSIC, Spain

46. Keynote: Design Study for Stacked MEMS
    

    Jan Eite Bullema, Marcel Meuwissen, Erik Veninga, TNO, The Netherlands

47. Thermal FEM simulation of ultra-miniaturised wall shear sensors
    

    Delphine Meunier, Jumana Boussey, CNRS, Institut de Microélectronique,
    Electromagnétisme et Photonique, IMEP, France

48. Design, analysis and validation of vertical probing technology
    

    Chang-An Yuan, Hsing-Chih Liu, Ming-Hung Sun and Kou-Ning Chiang,
    National Tsing Hua University, Taiwan

49. Development of a Compact Thermal Model for a Micropyrotechnic Actuator
    

    M. Salleras, J. Palacín, M. Puig, J. Samitier, S. Marco, Universitat
    de Barcelona, Spain

50. Experimental Verification of the FE model of a Thick-film Ceramic Pressure
    Sensor

    Marina Santo Zarnik, Darko Belavic, HIPOT-R&D / Jozef Stefan
    Institute, Slovenia
    K.P. Friedel; A. Wymyslowski, Wroclaw University of Technology, Poland

51. Modeling of Pyroelectric Sensor Arrays
    

    Günter Milde, Jörg Drescher, Gerald Gerlach, Herbert Balke,
    Hans-Achim Bahr, TU Dresden, Germany

52. Keynote: Prediction of Crack Growth of IC Passivation Layer
    

    G.Q. Zhang, M.A.J. van Gils, R.B.R. Silfhout, W.D. van Driel,
    Philips, The Netherlands
    Y.T. He, L.J. Ernst, Delft University of Technology, the Netherlands

53. The Impact of Wafer-Level Stress on Package Warpage and Die Attach
    Stress

    Eric Egan, Anne-Marie Kelleher, Tom O’Donovan, Peter Kennedy,
    National University of Ireland
    Gerard Kelly, Cork Institute of Technology, Ireland

54. Prediction of interfacial delamination failures of a stacked IC structure
    using combined experimental and simulation methods

    Zhang G.Q, Van Driel W., Van Gils M., Van Silfhout R., Philips,
    The Netherlands
    Liu C.J., Ernst L.J., Delft University of Technology, The Netherlands

55. Mechanical FEM simulation of bonding process on Cu low-K wafers
    

    Dominiek Degryse, Bart Vandevelde and Eric Beyne, IMEC, Belgium

56. Effect of Delamination of IC/Compound Interface on Passivation Cracking
    

    R.B.R van Silfhout, J.D. Roustant, W.D. van Driel, Y. Li, G.Q.
    Zhang, M.A.J. van Gils, Philips, The Netherlands,
    D.G. Yang, Delft University of Technology

57. Prediction of Thermo-Mechanical Integrity of Wafer Backend Processes
    

    G.Q. Zhang, J. den Toonder, J. Beijer, Philips, The Netherlands
    R.J.O.M. Hoofman, Philips Belgium
    V. Gonda, , L.J. Ernst, Delft University of Technology, The Netherlands

58. Keynote: New Failure Analysis Methods in Microelectronics
    

    Ingrid de Wolf, IMEC, Belgium

59. Keynote: Simulation of microstructure evolution in metallic alloys
    

    Markus Apel, B. Böttger, G.J. Schmitz, Univ. of Aachen, Germany

60. Keynote: Investigations on Low Cycle Fatigue of Electrodeposited Thin
    Copper and Nickel Films

    Rainer Dudek, Hans Walter, and Bernd Michel, Fraunhofer-IZM,
    Germany
    Jörg Zapf, Siemens AG, Germany

61. Keynote: Optimization and Finite Element Analysis for Reliable Electronic
    Packaging

    S. Stoyanov, C. Bailey, University of Greenwich, UK

62. Numerical Simulation and Optimization of Capacitive Transducers
    

    H. Landes, R. Lerch, M. Kaltenbacher, R. Peipp, University of
    Erlangen-Nuremberg
    F. Vogel, inuTech GmbH, Nuremberg, Germany

63. Comparison of Lifetime Predictions with 3D Finite Element Models of
    a High Density Flip Chip without Underfill on LTCC

    M. Spraul, W. Nüchter, A. Möller, Robert Bosch Gmbh, Germany
    A. Schubert, B. Michel, Fraunhofer IZM, Germany

64. The Reliability Analysis and Structure Design for High Density Flip
    Chip BGA Packaging

    Chih-Tang Peng, Chang-Ming Liu, Kuo-Ning Chiang, National Tsing
    Hua University, Taiwan

65. Influence of material combinations on delamination failures in a cavity
    down TBGA package

    W.D. van Driel, G.Q. Zhang, Philips, The Netherlands
    A.Y.L. Chang, Philips Semiconductors Kaohsiung, Taiwan
    G. Wisse, L.J. Ernst, Delft University of Technology, The Netherlands

66. Keynote: The state of the art of lead-free solders
    

    Sabine Knott and Adolf Mikula,,

67. Microstructure and Creep Behaviour of eutectic SnAg and SnAgCu Solders
    

    S. Wiese, K.J. Wolter, Technische Universität Dresden, Germany

68. Microstructural Change of Lead-Containing and Lead Free Solders: Experiments
    and Computer Simulations

    H.-J. Albrecht, D.S. Brodie, Siemens AG Berlin, Germany
    A.J. Gunn, Heriot-Watt University, UK
    W.H. Müller, Technische Universität Berlin, Germany

69. Tensile and Fatigue Isothermal Properties of Copper Joints with Sn63-Pb37,
    Sn62-Pb36-Ag2 and Sn42-Bi58 Alloys

    E. M. Grigoletto, A. Damasco, I. Ferreira, State University
    of Campinas, Brasil

70. Parametric study on Flip Chip package with lead-free solder joints
    by using the probabilistic design approach

    J.S. Liang, D.G. Yang, Q.Y. Li, Guilin University of Electronic
    Technology, China
    L.J. Ernst, Delft University of Technology, The Netherlands
    G. Q. Zhang, Philips, The Netherlands

71. Keynote: Material Response Prediction and Understanding Through the
    use of Molecular Modeling

    Nancy Iwamoto, Honeywell, USA

72. Keynote: Micro-Digital Image Speckle Correlation (u-DiSC) System and
    its Applications to Microelectronics Packages

    Xunqing Shi, Singapore Institute of Manufacturing Technology,
    Singapore

73. Keynote: Understanding Morphology Changes in Solders
    

    Wolfgang H. Mueller, Technische Universitat Berlin, Germany

74. Keynote: A Simulation-Based Multi-Objective Design Optimization of
    Electronic Packaging under Thermal Cycling and Bend Load

    Leon Xu, Wei Ren, and Tommi Reinikainen, Nokia Mobile Phones,
    USA