EuroSimE 2001 was locally organised by MTA in Maison de la Chimie, Paris, France

Proceedings of EuroSimE 2001 – Paris, France, April 2001

	Proceedings of EuroSimE 2001. 344 pages A4 ISBN 0-7803-9806-8 (C) Europia, IEEE-CPMT CD version included at no extra charge.
	CD-ROM version of Proceedings of EuroSimE 2001 (CD). For Windows 95-98-NT. PDF files, dedicated browser included (Win32 only) ISBN 0-7803-9807-6 (C) IEEE

1. COMPETE, the European Thematic Network on Microelectronics Packaging
   and Interconnection.

   O. de Saint Leger, COMPETE co-ordination at MTA, Paris, France

2. Mechanical Simulation in Microelectronics and Photonics Packaging
   

   E. Suhir, Bell Laboratories, Lucent Technologies, Inc. USA

3. Electronics Trends in Mobile Communications
   

   H. Huomo, Research & Technology Access of Nokia Mobile Phones,
   Finland

4. Silicon Technology in the 21st Century
   

   A.J. van Roosmalen, Philips Semiconductors, The Netherlands

5. Virtual Thermo-Mechanical Prototyping of Microelectronics – The challenges
   for mechanics professionals

   G.Q. Zhang, P. Maessen, J. Bisschop, J. Janssen, F. Kuper, Philips,
   The Netherlands, L.J. Ernst, Delft University of Technology, The Netherlands

6. Trends in the Application of Mechanics to (Micro-) Electronics
   

   Dick H. van Campen, Secretary-General of IUTAM, Eindhoven University
   of Technology, The Netherlands

7. Response Surface Modelling for Non-linear Packaging Stresses
   

   W. van Driel, G.Q. Zhang, J.W. Bergsma, G. Steenbergen, Philips,
   The Netherlands, L. J. Ernst, Delft Univ. of Techn., The Netherlands

8. Robust Multiple Criteria Optimization of Thermally Enhanced PQFP
   

   Chia-Lung Chang, Wei-Shin Lin, Nat.Yunlin Univ. of Sc. & Techn.
   Touliu, Yunlin, Taiwan

9. Simplified Mechanical Model for the Thermomechanical Warpage of Microelectronic
   Packages Using Response Surface Methodology

   Eric Egan, National Microelectronics Research Centre (NMRC),
   Nat. Univ. of Ireland, Gerard Kelly, Cork Institute of Technology, Ireland,
   Tom O’Donovan, Statistics Department, National University of Ireland,
   Cork, Ireland

10. Parameterised Modelling of thermo-mechanical reliability for a 5×4
    CSP

    B. Vandevelde, E. Beyne, IMEC, Leuven, Belgium, G.Q. Zhang,
    J. Caers, Philips CFT, The Netherlands

11. Thermo-mechanical Reliability of Multilayer Ceramic Capacitors: Measurement
    and Computation

    J.M.J. den Toonder, C.W. Rademaker, Philips, The Netherlands

12. Probabilistic Approach to Numerical Assessment of Electronic Component
    Reliability

    A. Wymyslowski, Wroclaw Univ. of Techn., Inst. of Microsyst.
    Techn., Wroclaw, Poland

13. Thermally Induced Delamination-Buckling in a Metal-Ceramic Microelectronic
    Product

    C.J. Liu, L. J. Ernst, G. Wisse, Delft Univ. of Techn., The
    Netherlands, G. Q. Zhang, M. Vervoort, Philips CFT, The Netherlands

14. Effect of Chip Anisotropy on Packaging Process Induced Stresses
    

    J. Janssen, W. van Driel, J. Bisschop, F. Kuper, R. Schravendeel,
    Y. Li, G.Q. Zhang, Philips, The Netherlands, D.G. Yang, L.J. Ernst, Delft
    Univ. of Techn., The Netherlands

15. Modelling of Heat Transfer for System In a Package (SIP)
    

    Jiemin Zhou, Central south Univ., Changsha, P.R. China, Xitao
    Wang, Liu Chen, Johan Liu, Chalmers Univ. of Techn. Gothenburg, Sweden

16. Actuation Unit Analysis of a Thermo-Pneaumatic Actuated Micropump
    

    M. Carmona, S. Marco, J. Samitier, Universitat de Barcelona,
    Spain,.M.C. Acero, J.A. Plaza, J. Esteve, Centro Nacional de Microelectrónica.
    (IMB-CSIC), Spain

17. A New Thermal Simulation Tool for Optimizing Laser Desoldering of Flip-Chip
    Components

    G. Hanreich, J. Nicolics, Vienna Univ. of Technology, Austria

18. Numerical Simulation of Embedded Passive Components in Multi-layer
    PCBs

    D. M. Stubbs, S. H. Pulko, A. J. Wilkinson, Univ. of Hull, United
    Kingdom

19. Thermal Investigation of a Jedec MO-166 Package by Finite Element Simulations
    

    Kirsten Weide, Univ. Hannover, Lab. für Inform. Techn

20. Neural Network Methodologies for Modeling, Simulation, and Optimization
    

    Q.J. Zhang, Carleton Univ., Ottawa, Ontario, Canada

21. Design for Flip Chip on Flex: A Combined Thermal & Mechanical Modeling
    & Analysis

    Xuejun Fan, Philips, USA

22. Lifetime Prediction of Extended Flip-Chip Packages under Thermal and
    Mechanical Loading

    B. Wunderle, W. Nüchter, Robert Bosch GmbH, Stuttgart, Germany,
    A. Schubert, B. Michel, Fraunhofer IZM, Berlin, Germany

23. High Temperature Thermo-Mechanical Analysis of Gas Sensors Substrates
    

    J.Puigcorbé, A.Vilà, J.R. Morante, Universitat de Barcelona,
    Spain

24. An Optimized Shear Test Sample for Assessing Solder Deformation Properties
    

    Tommi Reinikainen, Wei Ren, Nokia Mobile Phones, Irving, Texas

25. Structure Investigation of Quad Flat Non-lead Package to Improve Radio-Frequency
    Application

    Nansen Chen, Kevin Chiang, Charley Kuo, Kelly Liu, Terry Hsu,
    T. D. Her, SPIL, Taiwan

26. Experimental Verification of Analytical and FE-models Through Micro-Raman
    Spectroscopy

    Ingrid De Wolf, Imec, Leuven, Belgium

27. Characterisation of Lead-Free Solders in Flip Chip Joints
    

    S. Wiese, F. Feustel, E. Meusel, Techn. Univ. Dresden, Inst.
    für Halbleiter- und Mikrosystemtechnik, Germany

28. Time and Temperature Dependent Thermo-Mechanical Characterization and
    Modeling of a Packaging Molding Compound

    M. S. Kiasat, L. J. Ernst, Delft Univ. of Techn., The Netherlands,
    G. Q. Zhang, R. Bressers, Philips, The Netherlands

29. Process Induced Residual Stress Prediction for Microelectronic Packaging
    Materials During Cure

    H.A. de Boer, M.H.H. Meuwissen, M.C. van der Wekken, TNO, The
    Netherlands, P.J.G. Schreurs, M.G.D. Geers, Technical Univ. of Eindhoven,
    The Netherlands

30. Material Mechanics and Reliability Issues of Lead-Free Solder Interconnects
    

    A. Schubert, H. Walter, E. Jung, A. Gollhardt, Fraunhofer-IZM,
    Berlin, Germany

31. Numerical Optimisation of Gold Creep Model for Thermocompression Bonding
    

    J. Puigcorbe, S. Marco, S. Leseduarte, Universitat de Barcelona,
    Spain, O. Vendier, C. Drevon, Alcatel Space, Toulouse, France, D. Floriot,
    Thomson-CSF-LCR, Orsay, France, H. Blanck, United Monolithic Semiconductors
    GmBH, Ulm, Germany, P. Auxemery, United Monolithic Semiconductors SAS,
    Orsay, France

32. Nano-scratch Behaviour of Diamond-like Carbon Films
    

    Li-ye Huang, Ke-wei Xu , Jian Lu, Xian Jiaotong Univ. China,
    Bruno Guelorget, Univ. de Techn. de Troyes, France

33. Measurement of Thermal Deformation of Interconnection layers Using
    SIEM

    Sheng Chang, Fu-Pen Chiang, State Univ. of New York at Stony
    Brook, USA , Yifan Guo, Motorolla Semiconductor Products Sector, Tempe
    Arizona, USA

34. Analysis of Damage Mechanisms at Miniaturized Solder Joins, Essentials
    for Life Time Predictions

    H.J. Albrecht, B. Schwarz, Siemens AG, Berlin, Germany

35. Three- and Four-Point Bend Testing for Electronic Assemblies
    

    Santosh Shetty, Tommi Reinikainen, Nokia Mobile Phones, Irving,
    Texas

36. Local Stress Analysis on Polymer Stud Grid Array (PSGA) Packages by
    Raman Spectroscopy and FEM Simula

    Jian Chen, Bart Vandevelde, Ingrid De Wolf, Imec, Leuven, Belgium,
    Jef Van Puymbroeck, Marcel Heerman, Siemens, Oostkamp, Belgium

37. Reliability Prediction of Area Array Solder Joints
    

    Rainer Dudek, Ralf Döring, Bernd Michel, Fraunhofer IZM, Berlin,
    Germany

38. An Integrated Modelling Approach to Solder Joint Formation and Fatigue
    Life Analysis

    Pan Kai-lin, Zhou De-jian, Chen zi-chen, Huang Chun-yue, Qin
    Kuang-yu, ZheJiang Univ., HangZhou, PRC

39. Packaging Induced Die Stresses Considering Time-dependence of a Moulding
    Compound

    J. Janssen, W. van Driel, J. Bisschop, F. Kuper, R. Schravendeel,
    Y. LI, R. Bressers, G.Q. Zhang, Philips, The Netherlands, M.S. Kiasat,
    L.J. Ernst, Delft Univ. of Techn., The Netherlands

40. Coupling of Mechanical and Electrical Behaviours Around a Notch Tip
    in Piezoelectric Medium

    Y.L. Li, Y. Sato, K. Watanabe, Univ. of Tokyo, Japan

41. Modelling and Simulation of an Electrostatically Actuated Surface-Micromachined
    Tunable Fabry-Perot Microinterferometer for the Medium IR Spectral Range

    C. Calaza, M. Moreno, S. Marco, Universitat de Barcelona, Spain,
    L. Fonseca, C. Cané, I. Gràcia, Centro Nacional de Microelectrónica (IMB-CSIC),
    Barcelona, Spain

42. Force Constants for liquid solder bumps with unequal padsizes
    

    Co Van Veen, Philips CFT, The Netherlands, Bart Vandevelde,
    Eric Beyne, Imec, Belgium

43. Numerical Simulation of Delamination in IC Packages Using a New Variable-order
    Singular Boundary-element

    A. A. O. Tay, K. H. Lee and K. M. Lim, Centre for IC Failure
    Analysis and Reliability, Nat. Univ. of Singapore

44. Numerical Method of Reliability Assessment of the Flip-Chip Packaging
    

    J. Dziduszko, A. Wymyslowski, K. Friedel, Wroclaw Univ. of Techn.
    Poland

45. Thermal Management in a New Utra-thin Chip Stack Technology
    

    S. Pinel, J. Tasselli, J.P. Bailbe, A. Marty, LAAS-CNRS, Toulouse,
    France, O. Vendier, M. Huan, ALCATEL SPACE, Toulouse, France, S. Marco,
    J.R. Morante, Univ. of Barcelona, Spain, E. Beyne, R. Van Hoof, IMEC,
    Leuven, Belgium

46. State-Of-The-Art of Thermo-Mechanical Modelling of IC Back-End Processes
    

    R.B.R. van Silfhout, A. de Boer, H.J.M. Geijselaers, Technical
    University of Twente, The Netherlands Y. Li , J. Bisschop, F. Kuper, R.
    Schravendeel, J.H.J. Janssen, W. van Driel, G.Q. Zhang , M. Jansen Philips,
    The Netherlands

47. Performance of a Thermo-Pneumatic Actuated Micropump: Influence of
    the Fluidic Components

    M. Carmona, S. Marco, J. Samitier, Univ. de Barcelona, SIC,
    Spain

48. SPICE Based Simulations of Electrothermal Processes
    

    Piotr Dziurdzia, Univ. of Mining and Metallurgy, Inst. of Electr.,
    Kraków, Poland

49. A Robust Implementation of Stress Governing Equations for Next Generation
    Process Simulators

    Slobodan Mijalkovic, Wim Crans, Delft Univ. of Techn. ITS/DIMES

50. Effect of Carrier and Retain Ring Mechanism of Chemical-Mechanical
    Polishing of the Axial Deformation on Wafer Surface

    Zone-Ching Lin, Nat. Taiwan Univ. of Sc. & Techn.,Taipei, Taiwan

51. Micro to Macro Thermo-Mechanical Simulation of Wafer-Level Packaging
    

    C.A.Yuan, K.N. Chiang, National Tsing Hua University, Taiwan

52. Numerical Simulation of Reactive Interdiffusion in Thin Layers
    

    X. Federspiel, M. Ignat, LTPCM/INPG, France

53. Computer Simulation of Grain Growth in a Bidimensional Polycrystalline
    Films

    Jianmin Zhang, Kewei Xu, Vincent Ji, Xian Jiaotong Univ. China/ENSAM,
    Paris, France

54. Finite Element Modelling of Solder Joint Reliability of Plastic Ball
    Grid Assembly Under Thermal Cyclic Loading

    X. J. Zhao, Philips CFP, Singapore, G. Q. Zhang, J. Caers, Philips
    CFP, The Netherlands, L.J. Ernst, Delft Univ.of Techn., The Nethelands

55. A user-friendly thermo-mechanical stress test chip concept; does this
    exist ?

    Daniel Vanderstraeten, Gust Schols, Alcatel Microelectronics,
    Belgium, Oliver Kierse, James Molyneaux, Analog Devices Bv, Ireland, Orla
    Slattery, Kieran Delaney, National Microelectronics Research Centre, Ireland,
    Jozef Vanneuville, Klaas Decat, IMEC-KHBO, Belgium, Chan Geok Chai Moses,
    CS2, Belgium