EuroSimE 2001 was locally organised by MTA in Maison de la Chimie, Paris, France

Proceedings of EuroSimE 2001 – Paris, France, April 2001

Proceedings of EuroSimE 2001.
344 pages A4
ISBN 0-7803-9806-8 (C) Europia, IEEE-CPMT
CD version included at no extra charge.
CD-ROM version of Proceedings of EuroSimE 2001 (CD).
For Windows 95-98-NT. PDF files, dedicated browser included (Win32 only)
ISBN 0-7803-9807-6 (C) IEEE

  1. COMPETE, the European Thematic Network on Microelectronics Packaging
    and Interconnection.

    O. de Saint Leger, COMPETE co-ordination at MTA, Paris, France

  2. Mechanical Simulation in Microelectronics and Photonics Packaging

    E. Suhir, Bell Laboratories, Lucent Technologies, Inc. USA

  3. Electronics Trends in Mobile Communications

    H. Huomo, Research & Technology Access of Nokia Mobile Phones,

  4. Silicon Technology in the 21st Century

    A.J. van Roosmalen, Philips Semiconductors, The Netherlands

  5. Virtual Thermo-Mechanical Prototyping of Microelectronics – The challenges
    for mechanics professionals

    G.Q. Zhang, P. Maessen, J. Bisschop, J. Janssen, F. Kuper, Philips,
    The Netherlands, L.J. Ernst, Delft University of Technology, The Netherlands

  6. Trends in the Application of Mechanics to (Micro-) Electronics

    Dick H. van Campen, Secretary-General of IUTAM, Eindhoven University
    of Technology, The Netherlands

  7. Response Surface Modelling for Non-linear Packaging Stresses

    W. van Driel, G.Q. Zhang, J.W. Bergsma, G. Steenbergen, Philips,
    The Netherlands, L. J. Ernst, Delft Univ. of Techn., The Netherlands

  8. Robust Multiple Criteria Optimization of Thermally Enhanced PQFP

    Chia-Lung Chang, Wei-Shin Lin, Nat.Yunlin Univ. of Sc. & Techn.
    Touliu, Yunlin, Taiwan

  9. Simplified Mechanical Model for the Thermomechanical Warpage of Microelectronic
    Packages Using Response Surface Methodology

    Eric Egan, National Microelectronics Research Centre (NMRC),
    Nat. Univ. of Ireland, Gerard Kelly, Cork Institute of Technology, Ireland,
    Tom O’Donovan, Statistics Department, National University of Ireland,
    Cork, Ireland

  10. Parameterised Modelling of thermo-mechanical reliability for a 5×4

    B. Vandevelde, E. Beyne, IMEC, Leuven, Belgium, G.Q. Zhang,
    J. Caers, Philips CFT, The Netherlands

  11. Thermo-mechanical Reliability of Multilayer Ceramic Capacitors: Measurement
    and Computation

    J.M.J. den Toonder, C.W. Rademaker, Philips, The Netherlands

  12. Probabilistic Approach to Numerical Assessment of Electronic Component

    A. Wymyslowski, Wroclaw Univ. of Techn., Inst. of Microsyst.
    Techn., Wroclaw, Poland

  13. Thermally Induced Delamination-Buckling in a Metal-Ceramic Microelectronic

    C.J. Liu, L. J. Ernst, G. Wisse, Delft Univ. of Techn., The
    Netherlands, G. Q. Zhang, M. Vervoort, Philips CFT, The Netherlands

  14. Effect of Chip Anisotropy on Packaging Process Induced Stresses

    J. Janssen, W. van Driel, J. Bisschop, F. Kuper, R. Schravendeel,
    Y. Li, G.Q. Zhang, Philips, The Netherlands, D.G. Yang, L.J. Ernst, Delft
    Univ. of Techn., The Netherlands

  15. Modelling of Heat Transfer for System In a Package (SIP)

    Jiemin Zhou, Central south Univ., Changsha, P.R. China, Xitao
    Wang, Liu Chen, Johan Liu, Chalmers Univ. of Techn. Gothenburg, Sweden

  16. Actuation Unit Analysis of a Thermo-Pneaumatic Actuated Micropump

    M. Carmona, S. Marco, J. Samitier, Universitat de Barcelona,
    Spain,.M.C. Acero, J.A. Plaza, J. Esteve, Centro Nacional de Microelectrónica.
    (IMB-CSIC), Spain

  17. A New Thermal Simulation Tool for Optimizing Laser Desoldering of Flip-Chip

    G. Hanreich, J. Nicolics, Vienna Univ. of Technology, Austria

  18. Numerical Simulation of Embedded Passive Components in Multi-layer

    D. M. Stubbs, S. H. Pulko, A. J. Wilkinson, Univ. of Hull, United

  19. Thermal Investigation of a Jedec MO-166 Package by Finite Element Simulations

    Kirsten Weide, Univ. Hannover, Lab. für Inform. Techn

  20. Neural Network Methodologies for Modeling, Simulation, and Optimization

    Q.J. Zhang, Carleton Univ., Ottawa, Ontario, Canada

  21. Design for Flip Chip on Flex: A Combined Thermal & Mechanical Modeling
    & Analysis

    Xuejun Fan, Philips, USA

  22. Lifetime Prediction of Extended Flip-Chip Packages under Thermal and
    Mechanical Loading

    B. Wunderle, W. Nüchter, Robert Bosch GmbH, Stuttgart, Germany,
    A. Schubert, B. Michel, Fraunhofer IZM, Berlin, Germany

  23. High Temperature Thermo-Mechanical Analysis of Gas Sensors Substrates

    J.Puigcorbé, A.Vilà, J.R. Morante, Universitat de Barcelona,

  24. An Optimized Shear Test Sample for Assessing Solder Deformation Properties

    Tommi Reinikainen, Wei Ren, Nokia Mobile Phones, Irving, Texas

  25. Structure Investigation of Quad Flat Non-lead Package to Improve Radio-Frequency

    Nansen Chen, Kevin Chiang, Charley Kuo, Kelly Liu, Terry Hsu,
    T. D. Her, SPIL, Taiwan

  26. Experimental Verification of Analytical and FE-models Through Micro-Raman

    Ingrid De Wolf, Imec, Leuven, Belgium

  27. Characterisation of Lead-Free Solders in Flip Chip Joints

    S. Wiese, F. Feustel, E. Meusel, Techn. Univ. Dresden, Inst.
    für Halbleiter- und Mikrosystemtechnik, Germany

  28. Time and Temperature Dependent Thermo-Mechanical Characterization and
    Modeling of a Packaging Molding Compound

    M. S. Kiasat, L. J. Ernst, Delft Univ. of Techn., The Netherlands,
    G. Q. Zhang, R. Bressers, Philips, The Netherlands

  29. Process Induced Residual Stress Prediction for Microelectronic Packaging
    Materials During Cure

    H.A. de Boer, M.H.H. Meuwissen, M.C. van der Wekken, TNO, The
    Netherlands, P.J.G. Schreurs, M.G.D. Geers, Technical Univ. of Eindhoven,
    The Netherlands

  30. Material Mechanics and Reliability Issues of Lead-Free Solder Interconnects

    A. Schubert, H. Walter, E. Jung, A. Gollhardt, Fraunhofer-IZM,
    Berlin, Germany

  31. Numerical Optimisation of Gold Creep Model for Thermocompression Bonding

    J. Puigcorbe, S. Marco, S. Leseduarte, Universitat de Barcelona,
    Spain, O. Vendier, C. Drevon, Alcatel Space, Toulouse, France, D. Floriot,
    Thomson-CSF-LCR, Orsay, France, H. Blanck, United Monolithic Semiconductors
    GmBH, Ulm, Germany, P. Auxemery, United Monolithic Semiconductors SAS,
    Orsay, France

  32. Nano-scratch Behaviour of Diamond-like Carbon Films

    Li-ye Huang, Ke-wei Xu , Jian Lu, Xian Jiaotong Univ. China,
    Bruno Guelorget, Univ. de Techn. de Troyes, France

  33. Measurement of Thermal Deformation of Interconnection layers Using

    Sheng Chang, Fu-Pen Chiang, State Univ. of New York at Stony
    Brook, USA , Yifan Guo, Motorolla Semiconductor Products Sector, Tempe
    Arizona, USA

  34. Analysis of Damage Mechanisms at Miniaturized Solder Joins, Essentials
    for Life Time Predictions

    H.J. Albrecht, B. Schwarz, Siemens AG, Berlin, Germany

  35. Three- and Four-Point Bend Testing for Electronic Assemblies

    Santosh Shetty, Tommi Reinikainen, Nokia Mobile Phones, Irving,

  36. Local Stress Analysis on Polymer Stud Grid Array (PSGA) Packages by
    Raman Spectroscopy and FEM Simula

    Jian Chen, Bart Vandevelde, Ingrid De Wolf, Imec, Leuven, Belgium,
    Jef Van Puymbroeck, Marcel Heerman, Siemens, Oostkamp, Belgium

  37. Reliability Prediction of Area Array Solder Joints

    Rainer Dudek, Ralf Döring, Bernd Michel, Fraunhofer IZM, Berlin,

  38. An Integrated Modelling Approach to Solder Joint Formation and Fatigue
    Life Analysis

    Pan Kai-lin, Zhou De-jian, Chen zi-chen, Huang Chun-yue, Qin
    Kuang-yu, ZheJiang Univ., HangZhou, PRC

  39. Packaging Induced Die Stresses Considering Time-dependence of a Moulding

    J. Janssen, W. van Driel, J. Bisschop, F. Kuper, R. Schravendeel,
    Y. LI, R. Bressers, G.Q. Zhang, Philips, The Netherlands, M.S. Kiasat,
    L.J. Ernst, Delft Univ. of Techn., The Netherlands

  40. Coupling of Mechanical and Electrical Behaviours Around a Notch Tip
    in Piezoelectric Medium

    Y.L. Li, Y. Sato, K. Watanabe, Univ. of Tokyo, Japan

  41. Modelling and Simulation of an Electrostatically Actuated Surface-Micromachined
    Tunable Fabry-Perot Microinterferometer for the Medium IR Spectral Range

    C. Calaza, M. Moreno, S. Marco, Universitat de Barcelona, Spain,
    L. Fonseca, C. Cané, I. Gràcia, Centro Nacional de Microelectrónica (IMB-CSIC),
    Barcelona, Spain

  42. Force Constants for liquid solder bumps with unequal padsizes

    Co Van Veen, Philips CFT, The Netherlands, Bart Vandevelde,
    Eric Beyne, Imec, Belgium

  43. Numerical Simulation of Delamination in IC Packages Using a New Variable-order
    Singular Boundary-element

    A. A. O. Tay, K. H. Lee and K. M. Lim, Centre for IC Failure
    Analysis and Reliability, Nat. Univ. of Singapore

  44. Numerical Method of Reliability Assessment of the Flip-Chip Packaging

    J. Dziduszko, A. Wymyslowski, K. Friedel, Wroclaw Univ. of Techn.

  45. Thermal Management in a New Utra-thin Chip Stack Technology

    S. Pinel, J. Tasselli, J.P. Bailbe, A. Marty, LAAS-CNRS, Toulouse,
    France, O. Vendier, M. Huan, ALCATEL SPACE, Toulouse, France, S. Marco,
    J.R. Morante, Univ. of Barcelona, Spain, E. Beyne, R. Van Hoof, IMEC,
    Leuven, Belgium

  46. State-Of-The-Art of Thermo-Mechanical Modelling of IC Back-End Processes

    R.B.R. van Silfhout, A. de Boer, H.J.M. Geijselaers, Technical
    University of Twente, The Netherlands Y. Li , J. Bisschop, F. Kuper, R.
    Schravendeel, J.H.J. Janssen, W. van Driel, G.Q. Zhang , M. Jansen Philips,
    The Netherlands

  47. Performance of a Thermo-Pneumatic Actuated Micropump: Influence of
    the Fluidic Components

    M. Carmona, S. Marco, J. Samitier, Univ. de Barcelona, SIC,

  48. SPICE Based Simulations of Electrothermal Processes

    Piotr Dziurdzia, Univ. of Mining and Metallurgy, Inst. of Electr.,
    Kraków, Poland

  49. A Robust Implementation of Stress Governing Equations for Next Generation
    Process Simulators

    Slobodan Mijalkovic, Wim Crans, Delft Univ. of Techn. ITS/DIMES

  50. Effect of Carrier and Retain Ring Mechanism of Chemical-Mechanical
    Polishing of the Axial Deformation on Wafer Surface

    Zone-Ching Lin, Nat. Taiwan Univ. of Sc. & Techn.,Taipei, Taiwan

  51. Micro to Macro Thermo-Mechanical Simulation of Wafer-Level Packaging

    C.A.Yuan, K.N. Chiang, National Tsing Hua University, Taiwan

  52. Numerical Simulation of Reactive Interdiffusion in Thin Layers

    X. Federspiel, M. Ignat, LTPCM/INPG, France

  53. Computer Simulation of Grain Growth in a Bidimensional Polycrystalline

    Jianmin Zhang, Kewei Xu, Vincent Ji, Xian Jiaotong Univ. China/ENSAM,
    Paris, France

  54. Finite Element Modelling of Solder Joint Reliability of Plastic Ball
    Grid Assembly Under Thermal Cyclic Loading

    X. J. Zhao, Philips CFP, Singapore, G. Q. Zhang, J. Caers, Philips
    CFP, The Netherlands, L.J. Ernst, Delft Univ.of Techn., The Nethelands

  55. A user-friendly thermo-mechanical stress test chip concept; does this
    exist ?

    Daniel Vanderstraeten, Gust Schols, Alcatel Microelectronics,
    Belgium, Oliver Kierse, James Molyneaux, Analog Devices Bv, Ireland, Orla
    Slattery, Kieran Delaney, National Microelectronics Research Centre, Ireland,
    Jozef Vanneuville, Klaas Decat, IMEC-KHBO, Belgium, Chan Geok Chai Moses,
    CS2, Belgium