EuroSimE 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems IEEE EPS IEEE

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Advanced programme

Special session Short Course: Ageing Phenomena in Polymers and Effects on Microelectronics Reliability 08:30 Sunday April 15 2018
Chaired by Dr. Ole Hölck, Dr. Hans Walter, Marius van Dijk
08:30 Part 1
10:30Coffee break

Special session Short Course: Ageing Phenomena in Polymers and Effects on Microelectronics Reliability 10:45 Sunday April 15 2018
Chaired by Dr. Ole Hölck, Dr. Hans Walter, Marius van Dijk
10:45 Part 2
Special session 90mn Short Course: New challenges on packaging roadmap 13:30 Sunday April 15 2018
Chaired by Prof. Christopher Bailey
13:00 90mn course
Special session Short Course: Electromigration and Thermomigration in Electronics Packaging Solder Joints and Copper Interconnects 13:30 Sunday April 15 2018
Chaired by Prof. Cemal Basaran
13:30 Part 1
15:30Coffee break

Special session 90mn Short Course: Material characterization and modeling for new packaging technologies for harsh environment 15:45 Sunday April 15 2018
Chaired by Dr. Przemyslaw Jakub Gromala
15:45 90mn course
Special session Short Course: Electromigration and Thermomigration in Electronics Packaging Solder Joints and Copper Interconnects 15:45 Sunday April 15 2018
Chaired by Prof. Cemal Basaran
15:45 Part 2
09:00Welcome by xxxx

Special session Industry keynotes 09:10 Monday April 16 2018
Chaired by
09:10 Automotive Electronics Reliability, Simulation and Validation Udo Jauernig, Bosch GmbH
09:40 Reliability in Complex Autonomous Systems Shalabh Tandon, Intel
10:10Coffee break

Session 1 Technical Keynotes
10:30 Monday April 16 2018
Chaired by
10:30 30mn Keynote presentation - Microfluidics for the Thermal Control of Photonics Integrated Circuits
Corresp. Jeff Punch - University of Limerick
11:00 30mn Keynote presentation - Prognostics and health management: current state-of-the-art for optimizing aircraft structural maintenance
Corresp. Christian Gogu - Université de Toulouse
11:30 30mn Keynote presentation - Physics-Based Accelerated Qualification for Rigid and Flexible Electronics
Corresp. Suresh Sitaraman -
12:00 30mn Keynote presentation - Perspectives of Water Effects in Polymers from Molecular Dynamics
Corresp. Nancy Iwamoto - Honeywell PMT/AM

12:30Lunch

Session 2 Solder Joint Reliability
14:00 Monday April 16 2018
Chaired by
14:00 30mn Keynote presentation - Candidate for Best Paper Award On the formation and propagation of laminate cracks and their influence on the fatigue lives of solder joints
Corresp. Andreas Lövberg - Swerea IVF AB
14:30 20mn A Mechanistic Model for the Life of Solder Joints under Realistic Long Term Service Conditions
Corresp. Peter Borgesen - Binghamton University
14:50 20mn Modeling the effects of imposed current on the creep of SAC305 solder material
Corresp. Peter Varga - Óbuda University
15:10 20mn Load Based Reliability Assessment of BGA Solder Joints under Thermomechanical Load
Corresp. Fabian Schempp - Robert Bosch GmbH
15:30 20mn Robustness of BGAs: parametric study of voids' distribution in SAC solder joints
Corresp. Samuel Pin - IRT Saint-Exupéry

Session 3 MEMS Structures and Microfluidics
14:00 Monday April 16 2018
Chaired by
14:00 20mn On the Applicability of Single-Layer Integrated Microchannel Cooling in 3D ICs
Corresp. Piotr Zajac - Lodz University of Technology
14:20 20mn Flow rate dependence of enzymatic reactions in flow-through microchambers
Corresp. Péter Pálovics - Budapest University of Technology and Economics, Department of Electron Devices
14:40 20mn Design and Test of a 3D Printed Acoustic Fresnel Lens
Corresp. Guilherme Brondani Torri - Imec
15:00 20mn Candidate for Best Paper Award Development and characterization of MEMS membranes based on thin-film PZT actuators for microfluidic applications
Corresp. Baptiste NEFF - CEA Leti

Session 4 Thermal Behavioral Modeling
14:00 Monday April 16 2018
Chaired by
14:00 30mn Keynote presentation - Combined SPICE-FEM Analysis of Electrothermal Effects in InGaP/GaAs HBT Arrays for Handset Applications
Corresp. Vincenzo d'Alessandro - Department of Electrical Engineering and Information Technology, University Federico II, Naples, Italy
14:30 20mn Experimental and CFD Evaluation of Active Anti-Condensation Methods for Non-Hermetic Cabinets
Ilja Belov 1, Zahra Alavizadeh 1, Mats Lindgren 2, Jan Rydén 3, Peter Leisner 4
1 Jönköping University, School of Engineering, Jönköping, Sweden
2 Omnisys Instruments AB, Västra Frölunda, Sweden
3 Saab AB, Göteborg, Sweden
4 RISE Research Institutes of Sweden, Borås, Sweden

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14:50 20mn Application of FCM-ANFIS approach to model heat transfer and pressure drop of Titania-Water nanofluids in the turbulent flow regime
Corresp. Dr. Mehdi Mehrabi - University of Pretoria
15:10 20mn Flow induced hotspot migration studies with heat spreader integrated microchannels using reduced graphene oxide nanofluids
Corresp. Narendran G - NITK-surathkal
15:30 20mn Kapitza resistance across nanoscale crystalline and amorphous silicon carbide interface
Corresp. Junhui Li - State Key Laboratory of High Performance Complex Manufacturing,Central South University

15:50Coffee break

Session 5 Thermo-Mechanical Material Characterisation
16:20 Monday April 16 2018
Chaired by
16:20 30mn Keynote presentation - Mechanical reliability of microelectronics packaging: small scale adhesion measurements and in-situ imaging.
Corresp. Emanuele Cattarinuzzi - Politecnico di Milano
16:50 20mn Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Corresp. Riet Labie - Imec
17:10 20mn Thermo-mechanical Characterisation of Thin Sputtered Copper Films on Silicon: Elasto-Plastic, Fatigue and Subcritical Fracture-Mechanical Data
Corresp. Bernhard Wunderle - Chemnitz University of Technology
17:30 20mn Candidate for Best Paper Award Extraction of Isotropic Uniaxial Mechanical Properties using Nanoindentation: A Critical Evaluation of Data Analyses Methods based on Experiments and Finite Element Simulation
Corresp. Jan Albrecht - Fraunhofer Institute for Electronic Nano Systems ENAS

Session 6 Solid State Lighting
16:20 Monday April 16 2018
Chaired by
16:20 30mn Keynote presentation - Color maintenance prediction for LED-based products
Corresp. Willem van Driel - Philips Lighting
16:50 20mn Simulation based Optimal Design of High Power Ultraviolet Light-emitting Diode Module used for Photocatalysis
Corresp. Jiajie Fan - Hohai University
17:10 20mn Hardware Implementation of LED Forward Voltage Measurement for Junction Temperature Estimation
Corresp. Tetzlaff Thomas - South Westphalia University of Applied Sciences
17:30 20mn A Study of the Impacts of Current Ripple on Reliability of LEDs
Corresp. Bo Sun - State Key Laboratory of Solid-State Lighting

Session 7 Thermal Analysis
16:20 Monday April 16 2018
Chaired by
16:20 30mn Keynote presentation - CFD-Based Iterative Methodology for Modeling Natural Convection in Microelectronic Packages
Corresp. Papa Momar SOUARE - Université de Sherbrooke
16:50 20mn Modeling of Hyperbolic Heat Conduction in SOI Transistor by Equivalent RLC Network
Corresp. Amir Mirza Gheytaghi - TUDelft
17:10 20mn Investigation of inspired-DELPHI Compact Thermal Model for modeling planar transformer
Corresp. Eric Monier-Vinard - Thales Global Services
17:30 20mn Atomic level prediction of thermal conductivity of metallic materials in IC packaging
Corresp. Wenhui Zhu - Central South University

19:30Dinner downtown

Session 8 Flexible Electronics Reliability
08:30 Tuesday April 17 2018
Chaired by
08:30 20mn Lifetime Modelling and Geometry Optimization of Meander Tracks in Stretchable Electronics
Corresp. Arian Grams - Fraunhofer IZM
08:50 20mn The influence of thermal ageing on the flow-stress of copper traces on PCB’s
Corresp. Adam Yuile - Saarland University
09:10 20mn Design rules for TSV membranes
Corresp. Raffaele Alberto Coppeta - ams AG

Session 9 MEMS Transducers
08:30 Tuesday April 17 2018
Chaired by
08:30 30mn Keynote presentation - Behaviour investigation and modeling of a mechanically coupled CMUT approach
Corresp. Marcel Krenkel - Fraunhofer IPMS
09:00 20mn Design, Modelling, and Characterization of Display Compatible pMUT Device
Corresp. Chih-Hsien Huang - https://www.imec-int.com/en/home
09:20 20mn Candidate for Best Paper Award A meta-stable self-aligning interdigitated electrode structure yielding a 100aF/nm capacitive transducer
Corresp. Luke Middelburg - TU DELFT EWI

Session 10 Thermal Modeling and Characterization
08:30 Tuesday April 17 2018
Chaired by
08:30 30mn Keynote presentation - LED 3D Thermal Model Calibration against Measurement
Corresp. Robin Bornoff - Mentor - A Siemens Business
09:00 20mn Measurement and Simulation of MEMS Dedicated to Investigation of Heat Transfer at Nanoscale
Corresp. Marcin Janicki - Lodz University of Technology
09:20 20mn 3D Hybrid Bonding assembly studied by Scanning Thermal Microscopy, resistive thermometry and Finite Element Modelling
Corresp. Axel PIC - STMicroelectronics & CETHIL Lyon

09:40Coffee break

Special session Exhibitor and Sponsor special session 10:00 Tuesday April 17 2018
Chaired by
10:00 TBD
Session 11 Dialog session (posters)
Best and outstanding posters will be found from all poster contributions by the conference participants
10:00 Tuesday April 17 2018
Chaired by
Heat haze effects in thermal chamber tensile tests on Digital Image Correlation
Corresp. Adam Yuile - Saarland University
Inverse Dynamic Characterization of Viscoelastic Layers from Experimental and Operational Modal Analysis
Corresp. Alaa Fezai - Robert Bosch GmbH
Simulating Object Lists Using Neural Networks In Automotive Radar
Corresp. Alexander Suhre - Valeo Schalter und Sensoren GmbH
Internal Stress State of a TQFP subjected to Liquid Temperature Shock using Piezoresistive Silicon Stress Sensor
Corresp. Alexandru Prisacaru - Robert Bosch GmbH, Reliability Modeling and System Optimization (AE/EDT3)
Reliability assessment of SiC power module stack based on thermo-structural analysis
Corresp. Alexey Sokolov - Asea Brown Boveri Ltd., Corporate Research
Automation of Electro-thermal Simulations Based on Thermal Conductivity Optimization
Corresp. Anton Datsuk - IHP GmbH
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ON THE MECHANICAL RELIABILITY OF SOLDER JOINT OF SYSTEM IN PACKAGES (SiP) USING SIMULATION DRIVEN DESIGN APPROACH
Corresp. ARUN SASI - DIALOG SEMICONDUCTOR GmbH
Nano Thermal Management of IC Packaging with Computational Fluid Dynamics Tool
Corresp. Be-nazir Khan - IXYS IC Division
Thermal aging modeling of Molding Compound under High-Temperature Storage and Temperature Cycling Conditions
Corresp. bingbing Zhang - Infineon Technologies AG
Effect of Material properties and Boundary condition on PCB frequencies in electronic control unit
Corresp. Chalukya Nagappa Chincholi - Robert Bosch Engineering and Business Solutions Private Limited
Study on Layout Optimization of Multi-Chip LED Modules Based on Discrete Element Method
Corresp. Cheng Qian - School of Reliability and Systems Engineering, Beihang University
Explosion Mechanism Investigation of High Power IGBT Module
Corresp. Daohui LI - Dynex Semiconductor Ltd
Study of EM
Corresp. Daohui LI - Dynex Semiconductor
Thermodynamic analysis of SiO2 thickness’s effect on TSV
Corresp. Fu Guicui - School of Reliability and Systems Engineering
EXTENDING THE PERFORMANCE OF HIGH HEAT FLUX 2.5D AND 3D PACKAGING FROM COMPONENT-SYSTEM INTERACTION.
Corresp. Gamal Refai-Ahmed, Hoa Do, Brian Philofsky - Xilinx Inc.
Modelling and simulation of microelectronic packages containing complex chip structures
Corresp. Goran Pecanac - Robert Bosch GmbH
Simulation of the Thermomechanical Stress of a MEMS microphone
Corresp. Hanna Ebbinghaus - Munich University of Applied Sciences
Determination of Relevant Material Behaviour for Use in Stretchable Electronics
Corresp. Hans Walter - Fraunhofer IZM
Mechanistic Model for the Stress-Strain Response of Double-Layered PSA
Corresp. Hao Huang - CALCE, University of Maryland
Method to Predict Lifetime of IGBT under Power Cycling based-on Fast Electro-Thermo-Mechanical Model
Corresp. Jiang Maogong - School of Reliability and Systems Engineering, Beihang University
FEM Modelling of porosity in Ag sintering die attach for RF power applications
Corresp. Jianlin Huang and An Xiao - Ampleon
BGA Strip Warpage induced by assembly process and the Practical Prediction Methodology
Corresp. Jing-en Luan - STMicroelectronics Pte Ltd
Board level drop reliability study and orthotropic PCB material property test methodology
Corresp. Jue Li - Huawei Technologies Oy (Finland) Co. Ltd
Power Map Modeling in Packaged Integrated Circuits and Power Devices
Corresp. Kunal Jain - ESI Group
Failure Assessments of Polymeric Structure for Electronic Connectors
Corresp. Kuo-Chi Liao - National Taiwan University
Influence of Cooling Conditions on LED Compact Thermal Model Element Values
Corresp. Marcin Janicki - Lodz University of Technology
Simulation-Based Design of a Micro Fluidic Transportation System for Mobile Applications Based on Ultrasonic Actuation
Corresp. Martin Seidl - Chair for Physics of Electrotechnology, Technical University of Munich
The Application of Dynamic Compact Model with Multiple Inputs using Model Order Reduction
Corresp. Martina Aderonke Bella - University of Greenwich
Modelling the Influence of Molding Compound and Temperature Profile on Solder Joint Reliability in Single Die QFN Packages
Corresp. Maxim Serebreni - DfR Solutions
Nonlinear dynamic modeling of a piezoelectric vibration energy harvester including hysteretic effectsNonlinear dynamic modeling of a piezoelectric vibration energy harvester including hysteretic effects
Corresp. Pasquale Montegiglio - Department of Electrical and Information Engineering, Politecnico di Bari
Thick Metal Flat Passivation Elastic Modulus Investigation
Corresp. Raj Sekar Sethu - X-FAB Semiconductor Foundries AG
Wire Pull FEA Simulation Comparison
Corresp. Raj Sekar Sethu - X-FAB Semiconductor Foundries AG
On Relation between Parameters of Cohesive Zone Model
Corresp. Sergey ANANIEV - Infineon Technologies AG
Simulation-based specification of the power module lifetime to extend parameter regime beyond testing limitations
Corresp. Tatyana Kashko - Infineon Technologies AG
Lumen maintenance prediction for LEDs - new insights
Corresp. W.D. van Driel - Philips Lighting
Numerical studies of thermoelectric cooling for a GaAs laser diode
Corresp. Waleed Ahmed - University of Waterloo
Failure Criteria of IGBT Module Determined by Multi-physics Simulation
Corresp. Wang Ye - Beihang University, School of Reliability and Systems Engineering
Application of the homogenization approach by finite element simulation to calculate the wafer warpage
Corresp. WeiZhen YAO - Laboratory of Mechanics and Rheology, University of Tours
Research and Design of On-line Measurement System for Grinding Force and Temperature of Wafer Grinder
Corresp. Wenhui Zhu - School of Mechanical and Electronical Engineering,Central South University
Ab initio calculations of structural and dynamical properties of BiNCa3 compound.
Corresp. Yassine CHAOUCHE - University of Larbi Tébessi
Experimental investigation and numerical modelling of the High Cycle Fatigue behavior of a SnAgCu-solder alloy including temperature and mean stress effects
Corresp. Youssef Maniar - Robert Bosch GmbH, Corporate Sector Research and Advance Engineering

12:00Lunch

Session 12 MEMS Structures
13:15 Tuesday April 17 2018
Chaired by
13:15 20mn Self-assembly of High Performance On-Chip RF-MEMS Inductors Based on Internal-Stress Induced Post-Release Bending
Corresp. Murat Kaya Yapici - Sabanci University
13:35 20mn Simulation and characterization of a high-sensitive Micro-Opto-Mechanical Microphone
Corresp. Hang Gao - imec
13:55 20mn Low Cycle Fatigue of Aluminium Thin Films on Vibrating Silicon MEMS Cantilevers: Highly Accelerated Stress Test and Finite Element Modelling
Corresp. Reinhard Pufall - Infineon Technologies AG
14:15 20mn A Novel Graphene Based Waveguide Electro-optic Bragg Grating Modulator
Corresp. Xian-Ping Chen - Chongqing University

Session 13 Process Modelling
13:15 Tuesday April 17 2018
Chaired by
13:15 30mn Keynote presentation - 3D-Printing and wet metallization for uniaxial and multi-axial accelerometers
Corresp. Alberto Corigliano - Politecnico di Milano
13:45 20mn Optimized 2D positioning of windings in inductive components by genetic algorithm
Corresp. Andreas Rosskopf - Fraunhofer IISB
14:05 20mn Prediction of filling time in capillary-driven underfill process through 3D numerical analysis
Corresp. Wenhui Zhu - Central South University
14:25 20mn Simulation based Optimization of an Inkjet-Printed, Robust and Flexible Capacitive Touch Screen Panel
Corresp. Lisa-Marie Faller - Alpen Adria Universität
14:45 20mn Effect of Ultrasonic Agitation on the Properties of Copper Electrodeposition in Micro-Via
Corresp. Zhuwenhui - Central South University

Session 14 Reliability of Power Packages
13:15 Tuesday April 17 2018
Chaired by
13:15 30mn Keynote presentation - Multi-Scale Modelling of Internal Failure Mechanism of SiC Power MOSFETs
Corresp. Xianping Chen - Key Laboratory of Optoelectronic Technology & Systems, Education Ministry of China, Chongqing University
13:45 20mn Failure Analysis in Power Devices using Lock-in Infrared Thermography
Corresp. Miquel Vellvehi - Institut de Microelectronica de Barcelona (IMB-CNM,CSIC)
14:05 20mn Study of Cu Wire Crack under Thermal Cycling Test
Corresp. Haibo Fan - Nexperia Hong Kong
14:25 20mn A Thermo-Mechanical Fatigue Damage Modeling Methodology for Power Semiconductor Robustness Validation Studies
Corresp. Heinz E. Pettermann - Institute of Lightweight Design and Structural Biomechanics; TU Wien
14:45 20mn Determination of Die-Shift in a Multi-Project Fan-out Wafer Level Package after Processing by means of Numerical Simulations
Corresp. Marius van Dijk - Fraunhofer IZM

15:05Coffee break

Session 15 Electronics Reliability under Vibration Loadings
15:30 Tuesday April 17 2018
Chaired by
15:30 30mn Keynote presentation - Assessing the vibrational response and robustness of electronic systems by dissolving time and length scale
Corresp. Thomas Schriefer - University of Erlangen-Nuremberg
16:00 20mn Effect of Temperature on Vibration Fatigue of SAC105 Solder Material after Extended Room Temperature Aging
Corresp. David Leslie - CALCE, University of Maryland
16:20 20mn Vibration Test and Simulation of Printed Circuit Board
Faical Arabi, Alexandrine Gracia, Jean-Yves Delétage, Hélène Frémont, University of Bordeaux - IMS Laboratory
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16:40 20mn Resonance frequency dependency of Thermal Interface Materials under vibration
Corresp. Emad A. Poshtan - Bosch
17:00 20mn VIBRATION FATIGUE ANALYSIS OF LEAD-FREE CSP ASSEMBLIES ON PRINTED CIRCUIT BOARD
Corresp. Bart Vandevelde - imec

Session 16 Life Time Predictions
15:30 Tuesday April 17 2018
Chaired by
15:30 30mn Keynote presentation - Long-Term Thermal Fatigue Testing of Solder Joints and Related Fatigue Life Predictions
Corresp. Rainer Dudek - Fraunhofer ENAS, Dept. Micro Materials Center
16:00 20mn Lifetime Study of Cu Wire Bonds: Comparison between Thermal and Mechanical Cyclic Loading
Corresp. Ali Mazloum-Nejadari - Infineon AG
16:20 20mn Data Analytics Approach for Optimal Qualification Testing of Electronic Components
Corresp. Stoyan Stoyanov - University of Greenwich
16:40 20mn Thermal and Hydraulic Characterisation of Microfluidic Heat Exchangers for Photonics Integrated Circuits
Corresp. Niamh Richardson - University of Limerick
17:00 20mn Reliability analysis of encapsulated components in 3D-circuit board integration
Corresp. Schwerz Robert - Fraunhofer Institute for Ceramic Technologies and Systems IKTS

Session 17 Interfacial Properties
15:30 Tuesday April 17 2018
Chaired by
15:30 30mn Keynote presentation - Modeling reaction front propagation of intermetallic compounds by using an isogeometric analysis
Corresp. Wolfgang H. Müller - Technische Universität Berlin
16:00 20mn Candidate for Best Paper Award Interfacial Properties of Cu/SiO2 using a Multiscale Modelling Approach in Electronic Packages
Corresp. Zhen Cui - Technology university of Delft
16:20 20mn Characterization of EMC/LF Interfacial Fracture Toughness using the Advanced Mixed-Mode Bending Method
Corresp. Marcus Schulz - AMIC Angewandte Micro-Messtechnik GmbH
16:40 20mn Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Corresp. Reinhard Pufall - Infineon Technologies AG
17:00 20mn Four-Point-Bending Experiments on Multilayer Ceramic Capacitors: Microstructural Details on Crack Initiation and Propagation
Corresp. Steffen Wiese - Saarland University

Special session Panel: Should we rethink the reliability standards for these heterogeneous integrated SIP packages? 17:30 Tuesday April 17 2018
Chaired by Gaman Refai-Ahmed
17:30 Panel
19:30Dinner cocktail at venue

Session 18 Technical Keynotes
08:30 Wednesday April 18 2018
Chaired by
08:30 30mn Keynote presentation - On the TSV Delamination Risk Dependence on TSV Distance and Silicon Crystal Orientation
Corresp. Juergen Auersperg - Micro Materials Center at Fraunhofer ENAS
09:00 20mn Predicting Life-Span of Electronics without Curve Fitting Phenomenological Models and/or Life Cycle testing
Corresp. Cemal Basaran - University at Buffalo

09:40Coffee break

Session 19 IC level thermo-mechanical analysis
10:00 Wednesday April 18 2018
Chaired by
10:00 30mn Keynote presentation - Lift off reliability model for Aluminum and Copper wire bonds
Corresp. M. Guyenot - Robert Bosch GmbH CR/APJ3
10:30 20mn Minimizing electro-mechanical shifts in IC applications
Corresp. Jeroen Zaal - NXP Semiconductors
10:50 20mn Advanced risk analysis of interface delamination in semiconductor packages: a novel experimental approach to calibrating cohesive zone elements for Finite Element Modelling
Corresp. Georg M. Reuther - Infineon Technologies AG
11:10 20mn Coupled Thermo-Mechanical Analysis of Mass Reduced Silicon Micromirrors
Corresp. Harris Hall - Air Force Research Laboratory
11:30 20mn Peridynamic modelling of crack initiation and propagation in thermo-mechanically loaded electronic devices
Corresp. Gábor Ladányi - University of Dunaújváros

Session 20 Multi-Physics/Scale Analysis - Including Moisture, Electromigration, etc.
10:00 Wednesday April 18 2018
Chaired by
10:00 30mn Keynote presentation - A Review of Modeling Moisture Diffusion in Electronic Packages
Corresp. Xuejun Fan - Lamar University
10:30 20mn Candidate for Best Paper Award Parametric Model Order Reduction and System-level Simulation of a Thermoelectric Generator for Electrically Active Implants
Corresp. Chengdong Yuan - Jade University of Applied Science in Wilhelmshaven
10:50 20mn Thick AlCu-Metal Reliability Characterization
Corresp. Kirsten Weide-Zaage - Leibniz Universität Hannover IMS-RESRI
11:10 20mn Investigation of Trapping Behaviour in GaN HEMTs through physical TCAD Simulation of Capacitance Voltage characteristics
Corresp. Kalparupa Mukherjee - IMS Lab, University of Bordeaux
11:30 20mn A Multiscale Model of a Two-Dimensional Micro-Mirror Array
Corresp. TRINH Nguyen Nhat Binh - FEMTO-ST Institute, Department Time and Frequency

11:50Lunch, Awards

Special session Visit of Airbus plant 12:30 Wednesday April 18 2018
Chaired by
12:30 Departure group 1 by bus from venue
13:00 Departure group 2 by bus from venue
13:30 Group 1 begins visit
14:00 Group 2 begins visit
15:00 Group 1 finishes visit; bus stops at Blagnac airport and comes back to venue
15:30 Group 2 finishes visit; bus stops at Blagnac airport and comes back to venue

Compiled on Wed, 21 Feb 2018 11:50:43 +0100 after template