EuroSimE 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems IEEE EPS IEEE

Advanced programme on January 21

Presentations tagged "Candidate for best paper award": selected after abstract rankings and comments from Reviewers.

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Special session Short Course: Power Electronics Packaging (C-Liu part 1) 08:30 Sunday March 24 2019
Chaired by Prof. Sheng Liu
08:30 Part 1
Special session Short Course: Design for Reliability in MEMS (C-Corigliano Part 1) 08:30 Sunday March 24 2019
Chaired by Alberto Corigliano
08:30 Part 1
10:30Coffee break

Special session Short Course: Power Electronics Packaging (C-Liu part 2) 10:45 Sunday March 24 2019
Chaired by Prof. Sheng Liu
10:45 Part 2
Special session Short Course: Design for Reliability in MEMS (C-Corigliano part 2) 10:45 Sunday March 24 2019
Chaired by Alberto Corigliano
10:45 Part 2
Special session Short Course: System-Level Simulation of Microsystems-MOR (C-Bechtold Part 1) 14:00 Sunday March 24 2019
Chaired by Prof. Dr.-Ing. Tamara Bechtold
14:00 Part 1
Special session Short Course: Reliability of Semiconductor Devices (C-Pufall) 14:00 Sunday March 24 2019
Chaired by Reinhard Pufall
14:00 2 hour course
Special session Short Course: Molecular Modelling (C-Iwamoto Part 1) 14:00 Sunday March 24 2019
Chaired by Nancy Iwamoto
14:00 Part 1
16:00Coffee break

Special session Short Course: Applications of test chips (C-Suhling) 16:15 Sunday March 24 2019
Chaired by Jeff Suhling
16:15 2h course
Special session Short Course: System-Level Simulation of Microsystems-MOR (C-Bechtold Part 2) 16:15 Sunday March 24 2019
Chaired by Prof. Dr.-Ing. Tamara Bechtold
16:15 Part 2
Special session Short Course: Molecular Modelling (C-Iwamoto Part 2) 16:15 Sunday March 24 2019
Chaired by Nancy Iwamoto
16:15 Part 2
09:00Welcome by W. van Driel

Special session Industry keynotes 09:15 Monday March 25 2019
Chaired by
09:15 Pushing the limits of MEMS – Success factors design and simulation Udo-Martin Gómez, Robert Bosch GmbH
09:45 Package Developments at Qualcomm - Ahmer Sayed,Qualcomm
10:15 Package Development for Autonomous Driving - Darrel Frear, NXP
10:45Coffee break

Session 1 Technical Keynotes
11:15 Monday March 25 2019
Chaired by
11:15 40mn Keynote presentation - About the futures challenges related to Thermo-Mechanics, Multi-Physics, Thermal and Reliability
Corresp. C. Bailey, B. Vandevelde, W. van Driel, Peter Rodgers - Signify
11:55 30mn Keynote presentation - Past, present and future of EuroSimE
Corresp. Guoqi Zhang - TU Delft

12:45Lunch

Session 2 Solder joint reliability
14:00 Monday March 25 2019
Chaired by
14:00 30mn Keynote presentation - Numerical study on local effects of composition and geometry in self-healing solders
Corresp. Georg Siroky - Materials Center Forschungs GmbH
14:30 20mn Transgranular Crack Propagation in Thermal Cycling of SnAgCu Solder Joints
Corresp. Andreas Lövberg - RISE Research Institutes of Sweden
14:50 20mn Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
Corresp. Bart Vandevelde - imec
15:10 20mn Numerical Prediction of Failure in SnAgCu solder under shear and tensile-dominant cyclic loading
Corresp. Marta Kuczynska - Robert Bosch GmbH
15:30 20mn Effect of Stress State on Fatigue Characterization of SAC305 Solder Joints
Corresp. Abhishek Deshpande - University of Maryland

Session 3 MEMS structures - I
14:00 Monday March 25 2019
Chaired by
14:00 20mn Finite element method simulation of graphene phononic crystals with cross-shaped nanopores
Corresp. Seiya Kubo - Japan Advanced Institute of Science and Technology (JAIST)
14:20 20mn Enhanced Fluid Flow By Wavelike Excitation of a Micromechanical Bending Actuator
Corresp. Wolfgang Hölzl - Technical University of Munich, Institute for Physics of Electrotechnology
14:40 20mn Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane
Corresp. Wouter Westerveld - Imec
15:00 20mn Simulation and Design of an Optical Accelerometer
Corresp. Veronique Rochus - IMEC
15:20 20mn Modelling, Simulations and Performance Analysis of MEMS vibrating Gyroscope in Coventor MEMS+ Environment
Corresp. Jacek Nazdrowicz - Lodz University of Technology

Session 4 Thermal Behavioral Modelling
14:00 Monday March 25 2019
Chaired by
14:00 30mn Keynote presentation - Analysis of Self Heating Effect in Vertical-channel Field Effect Transistor
Corresp. Hyungchell Shin - Seoul National University
14:30 20mn Numerical simulation of reflow soldering
Corresp. Michael Stadler - Infineon
14:50 20mn Simulation of self-heating of printed interconnects for thermal design
Corresp. Daniel Bülz - Fraunhofer Institute for Electronic Nano Systems
15:10 20mn Advanced Electro-Thermal Analysis of IGBT Modules in a Power Converter System
Corresp. Daohui Li - Dynex Semiconductor Ltd
15:30 20mn Modelling of thermal processes in thin-film BAW resonators
Corresp. Alexander Kozlov - Omsk State Technical Univesity

15:50Coffee break

Session 5 Prognostics and health monitoring
16:30 Monday March 25 2019
Chaired by
16:30 30mn Keynote presentation - Degradation Prediction of Electronic Packages using Artificial Intelligence
Corresp. Alexandru Prisacaru - Robert Bosch GmbH
17:00 20mn A Combined Methodology to Include System Effects in Board-Level Stress Simulations
Corresp. Rainer Dudek - Fraunhofer ENAS, Dept. Micro Materials Center
17:20 20mn A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints
Corresp. Ayda Halouani - University of Technology of Troyes
17:40 20mn Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions
Corresp. Laura Wambera - Technische Universität Dresden

Session 6 Multi-Physics process models
16:30 Monday March 25 2019
Chaired by
16:30 20mn Micro-Transfer-Printing and Potential Process Optimizations by FEA
Corresp. Kjell Buehler - Fraunhofer Institute for Microstructure of Materials and Systems (IMWS)
16:50 20mn Numerical modelling of magnetic nanoparticle dynamics in microfluidic devices
Corresp. Péter Pálovics - Budapest University of Technology and Economics, Department of Electron Devices
17:10 20mn Modeling temperature dependent chemical reaction of intermetallic compound growth
Corresp. Aleksandr Morozov - Technical University of Berlin
17:30 20mn Electrical characterization of MoS2 thin film transistor and the effect of strain on their performances
Corresp. Hongyu Tang - Delft Institute of Microsystems and Nanoelectronics, Delft University of Technology

Session 7 Package level thermo-mechanical assessment
16:30 Monday March 25 2019
Chaired by
16:30 30mn Keynote presentation - Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests
Corresp. Reinhard Pufall - Infineon Technologies AG
17:00 20mn Advanced Mixed-Mode Bending Test: Influence of the Surface Topography on the Fracture Behaviour of an EMC to Copper Lead Frame Bi-Material Interface
Corresp. Marcus Schulz - AMIC GmbH
17:20 20mn Package Level Warpage Simulation of a Fan Out System in Board Module
Corresp. Thomas Krivec - AT&S
17:40 20mn Numerical estimation of local load during manufacturing process in high temperature PCB resins based on viscoelastic material modelling
Corresp. Michael Schmidt - Robert Bosch GmbH

19:00Dinner downtown

Session 8 System level mechanical reliability
08:30 Tuesday March 26 2019
Chaired by
08:30 30mn Keynote presentation - Accelerated Pump Out Testing for Thermal Greases
Corresp. Bernhard Wunderle - TU Chemnitz
09:00 20mn Automated Method Using Finite Element Simulation to Identify Microvia Stacks at Risk of Separation in Complex PCB Designs
Corresp. Craig Hillman - DfR Solutions
09:20 20mn Experimental Evaluation of the Adequacy of Accelerated High Temperature Testing for ECUs Qualification in Electromobility
Corresp. Abdalla Youssef - BMW Group
09:40 20mn Vacuum Environment to Accelerate the Iso-thermal Aging of Automotive Electronic Assemblies for Qualification in Electromobility
Corresp. Abdalla Youssef - BMW Group
10:00 20mn Layout Optimization for CMOS Interconnects for Heating, Cooling and Improved Stress Distribution
Corresp. Verena Hein - X-FAB Semiconductor Foundries GmbH

Session 9 Thermal Modelling and Characterization
08:30 Tuesday March 26 2019
Chaired by
08:30 30mn Keynote presentation - The effect of the thermal conductivity of room-temperature-vulcanizing silicone used for boiling heat transfer
Corresp. Noriyuki Unno - Sanyo-Onoda City University
09:00 20mn Measurement and Simulation of Test Structures Dedicated to the Investigation of Heat Diffusion at Nanoscale
Corresp. Marcin Janicki - Lodz University of Technology
09:20 20mn Thermal Analysis of Lithium-Ion Battery via Simulation
Corresp. ANKIT YADAV - Punjab Engineering College (Deemed to be University)

Session 10 Solid State Lighting
08:30 Tuesday March 26 2019
Chaired by
08:30 30mn Keynote presentation - Solder interconnect degradation under special situations
Corresp. Xiujuan Zhao - Signify (Philips lighting) Netherlands
09:00 20mn Lifetime Prediction of Ultraviolet light-emitting diodes with accelerated Wiener degradation process
Corresp. Jiajie Fan - Hohai University
09:20 20mn Criteria of Unreliable for High-Power InGaN Arrays
Corresp. Anton Chernyakov - SHM R&E Center, RAS
09:40 20mn Modelling Thermo-mechanical Stress in GaN-LEDs Soldered on Copper Substrate with simulations validated by Raman experiments
Corresp. Fosca Conti - University of Padova, Department of Chemical Sciences
10:00 20mn Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models
Corresp. Gordon Elger - Institute for Innovative Mobimity IIMo, Technische Universität Ingolstadt

10:20Coffee break

Session 11 Dialog session (posters)
10:20 Tuesday March 26 2019
Chaired by Sven Rzepka, Mike Röllig
A Comprehensive Study on Silicon Die Strength and its Impact on Reliability.
Corresp. jing-en luan - STmicroelectronics Pte Ltd
A New Transient Thermal-Electronic Model for LEDs
Corresp. Jiajie Fan - Hohai University
Ageing of Optical BPA-PC under Harsh environment Stresses
Corresp. Maryam Yazdan Mehr - TuDelft
Analytical modelling of MEMS Z-axis comb-drive accelerometer
Corresp. Cezary Maj - Lodz University of Technology, Department of Microelectronics and Computer Science
Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder.
Corresp. Ramiro Vargas - Obuda University
Comprehensive Analysis for Predicting Thermal Deformation of Semiconductor Package
Corresp. Kento Kariya - ROHM Co., Ltd
Comprehensive Analysis for Predicting Thermal Deformation of Semiconductor Packages
Corresp. Kento Kariya - ROHM Co., Ltd.
Coupled electro-mechanical simulation of capacitive MEMS accelerometer for determining optimal parameters of readout circuit
Corresp. Piotr Zajac - Department of Microelectronics and Computer Science, Lodz University of Technology
Design and Performance Analysis of Circular Pin Heat Sinks Using ESM (Energy Storage Materials)
Corresp. Muhammad Hashir - University of Engineering and technology Taxila
Design for Package Miniaturization for a MEMS Pressure Sensor
Corresp. Roseanne Duca - STMicroelectronics (Ltd)
Effect of Geometric Parameters of Circular Fresnel Lenses on Energy Transmission for Daylighting System
Corresp. DEORAJ PRAJAPATI - Punjab Engineering College ( Deemed to be University)
Electromigration Effects in Corroded BGAs
Corresp. Kirsten Weide-Zaage - Leibniz Universität Hannover IMS-RESRI
Experimental characterization and numerical end of life prediction of a single-MOSFET power module under active power cycling
Corresp. Youssef Maniar - Robert Bosch GmbH
Failure Analysis Based on Vibration Signals
Corresp. Azadeh Gholaminejad - Iran University of Science and Technology
Modeling of the curing process of epoxy based thermoset materials
Corresp. Tamás Baksa - Robert Bosch Kft.
Modelling and Simulation of Glass Frit Bonding of Silicon Wafers
Corresp. Seyed Amir Fouad Farshchi Yazdi - Politecnico di Milano
New Method to Determine the Local Joule Heat Distribution in Fast Switching Device
Corresp. Chistian Römelsberger - CADFEM GmbH
Numerical and experimental study of a novel body-mounted piezoelectric energy harvester based on synchronized multi-magnet excitation
Corresp. Rolanas Dauksevicius - Kaunas University of Technology
Numerical Simulation of Top Metal Thickness on IMD Stress due to Probing
Corresp. Raj Sekar Sethu - X-FAB Semiconductor Foundries AG
On the experimental & numerical investigation of current carrying & electro-migration capability of Wafer level chip scale package (WLCSP)
Corresp. Arun Sasi - Dialog Semiconductor GmbH
Optimization of Heat Transfer using Nano-cutting fluids
Corresp. Marriyam Shabbir - University of Engineering and Technology, Lahore Pakistan
Remaining Useful Life Prediction of Random Discharging Lithium-ion Batteries Using a Gamma Process Model
Corresp. Bo Sun - School of Reliability and Systems Engineering, Beihang University
Substrate Characterization by Dynamic Warpage and Modelling
Corresp. Jing-en Luan - STmicroelectronics Pte Ltd
Thermomechanical behavior of brazed power module: 2D brazed assembly modelling
Corresp. Mahdi MEJRI - CIRIMAT

12:15Lunch

Session 12 Thermal Analysis
13:30 Tuesday March 26 2019
Chaired by
13:30 20mn Measuring thermal resistance in solar cells using pulse width modulated heating power
Corresp. Andrey Gavrikov - Ulyanovsk Branch of Kotel’nikov Institute of Radio-Engineering and Electronics of Russian Academy of Sciences
13:50 20mn Thermal Analysis of Different Medium Voltage Switchgear System and Comparison Of Different Insulating Gases Inside A GIS.
Corresp. Anoop Raj Rao - Hochschule Furtwangen
14:10 20mn Experimental Investigation of Cooling System’s Flow Non-Uniformity over Photovoltaic Panel
Corresp. ANKIT YADAV - Punjab Engineering College (Deemed to be University)
14:30 20mn Migration of flow induced hotspot with heat spreader integrated microchannel subjected to asymmetric hot spots: A multiphysics approach
Corresp. Narendran G - NITK

Session 13 Electronics reliability under vibration loadings
13:30 Tuesday March 26 2019
Chaired by
13:30 30mn Keynote presentation - Effect of Nonlinear Interactions of Electronic Assemblies in Response to Multiaxial Vibration Excitation
Corresp. Xiao Lin - Center for Advanced Life Cycle Engineering (CALCE)
14:00 20mn SSD Mechanical Static and Dynamic Test Reliability Study Using Simulation
Corresp. Tae Min Kang - SK hynix, NAND Solution Development Division
14:20 20mn Effect of Material properties and Boundary condition on PCB frequencies in electronic control unit
Corresp. Mahdi Sadeghinia - Robert Bosch GmbH, Automotive Electronics
14:40 20mn Harmonic Vibration Durability Tests on Lead-Free Solder Alloys at Different Isothermal Conditions
Corresp. Karsten Meier - Technische Universität Dresden, Institute for Electronic Packaging Technology
15:00 20mn High Power Vibrational Analysis in Response to Experimental Qualification Results
Corresp. Daohui Li - Dynex Semiconductor Ltd

Session 14 Multiphysics / Scale analysis - including moisture, electromigration, etc.
13:30 Tuesday March 26 2019
Chaired by
13:30 20mn Resistor-Capacitor Approach for Modelling of Temperature and Humidity Response Inside Electronic Enclosures
Corresp. Zygimantas Staliulionis - FORCE Technology
13:50 20mn Simulations in Terms of Radiation Effects on different BEOL Material Systems
Corresp. Kirsten Weide-Zaage - Leibniz Universität Hannover IMS-RESRI
14:10 20mn Inverse Characterization and Damage Detection of Viscoelastic Adhesive Layers from Vibration Test Data Considering Temperature Effect
Corresp. Alaa Fezai - Robert Bosch GmbH, Automotive Electronics
14:30 20mn Computational Mechanics for Flexible and Wearable Electronics
Corresp. ZhuangJian Liu - INSTITUTE OF HIGH PERFORMANCE COMPUTING

15:20Coffee break

Session 15 MEMS structures - II
15:45 Tuesday March 26 2019
Chaired by
15:45 20mn Simulation Methodology for active semiconductor devices in MEMS
Corresp. Mike Schwarz - Robert Bosch GmbH
16:05 20mn Simulation-Based Design of an Electrostatically Driven Microactuator for Fluid Transport in Mobile Applications
Corresp. Martin Seidl - Chair for Physics of Electrotechnology, Technical University of Munich
16:25 20mn Automatic assembly of multiscale models and its application to a family of homogenized models of wave propagation through interfaces having a periodic structure
Corresp. Michel Lenczner - FEMTO-ST - UBFC
16:45 20mn Reconstructing mid-air acoustic holograms using PMUT arrays: a simulation study
Corresp. Hang Gao - imec
17:05 20mn Simulation of display compatible micromachined PMUTs for haptic feedback
Corresp. Alexandre Halbach - IMEC

Session 16 EU projects (provisional)
15:45 Tuesday March 26 2019
Chaired by
15:45 30mn Keynote presentation - Delphi4LED EU project
Corresp. Geneviève Martin - Signify
16:15 30mn Keynote presentation - TRACE EU project
Corresp. Rainer Dudek -
16:45 30mn Keynote presentation - EuroPAT-MASIP
Corresp. Sven Rzepka -
17:15 30mn Keynote presentation - IoSense EU project
Corresp. Willem van Driel -

Session 17 High power applications
15:45 Tuesday March 26 2019
Chaired by
15:45 30mn Keynote presentation - Vacancy Transport, Mechanical Stress, and Self-Diffusion under Electromigration
Corresp. Xuejun Fan - Lamar University
16:15 20mn Simulative Comparison of Polymer and Cement Encapsulations on SiC-MOSFET Power Modules under Thermomechanical Load
Corresp. Felix Wagner - Robert Bosch GmbH
16:35 20mn Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications
Corresp. Uwe Zschenderlein - Chemnitz University of Technology
16:55 20mn Methodology for Correlation of Porosity and Mechanical Properties of Silver Sintered Joints in Electronics
Corresp. René Metasch - Fraunhofer IKTS
17:15 20mn Material Model and Simulation of Multilayer-AgSn-Foils for Transient-Liquid-Phase Bonding of Sensor Elements
Corresp. Markus Feisst - Universtity of Freiburg - IMTEK

Special session Exhibitor and Sponsor special session 18:00 Tuesday March 26 2019
Chaired by
18:00 Bosch / CADFEM / Dynardo / FRT-CWM / Huawei / Signify / Siemens
19:15Dinner cocktail at venue

Session 18 Multiphysics keynotes
08:30 Wednesday March 27 2019
Chaired by
08:30 30mn Keynote presentation - AIR-COUPLED ARRAY OF PMUTS AT 100 KHZ WITH PZT ACTIVE LAYER: MULTIPHYSICS MODEL AND EXPERIMENTS
Corresp. Alberto Corigliano - Politecnico di Milano
09:00 30mn Keynote presentation - TBD - Modeling Based Development of Semiconductor Chain Equipment ?
Sheng Liu, Institute of Technological Sciences, Wuhan University, China
09:30 30mn Keynote presentation - Reliabilty of electronic materials when subjected to aging conditions
Corresp. Jeff Suhling - Auburn University

Special session Awards ceremony 10:00 Wednesday March 27 2019
Chaired by Sven Rzepka
10:00 Best and outstanding papers and posters
10:15Coffee break

Session 19 IC level thermo-mechanical analysis
10:30 Wednesday March 27 2019
Chaired by
10:30 30mn Keynote presentation - BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses
Corresp. Juergen Auersperg - Fraunhofer ENAS
11:00 20mn Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation
Corresp. Abdellah Salahouelhadj - imec
11:20 20mn Determination of BEOL Aluminum-Copper Constitutive Equation using FEA Simulation and Response Surface Methodology
Corresp. Raj Sekar Sethu - X-FAB Semiconductor Foundries AG
11:40 20mn Effect of Material Nonlinearity on Thermal Deformation Behaviour of Semiconductor Packaging Structure
Corresp. Kento Kariya - Fundamental Research and Development Division, ROHM Co., Ltd., Japan
12:00 20mn A characterization method for stochastically distributed voids in sintered nano-silver joints and its application
Corresp. Cheng Qian - Beihang University

Session 20 Advanced experimental analysis techniques
10:30 Wednesday March 27 2019
Chaired by
10:30 30mn Keynote presentation - Study of V-groove on Leadframe/Epoxy Mold Compound Delamination Improvement
Corresp. HaiBo Fan - Nexperia Hong Kong
11:00 20mn Direct Measurements of Underfill Local Strain Using Confocal Microscopy and Digital Image Correlation
Corresp. Ying Yang - University of Sherbrooke
11:20 20mn Plastic deformation and failure modes of moulding compounds during indentation loading and their importance for the quantitative characterisation of adhesion
Corresp. Nadine Pflügler - Infineon Technologies AG
11:40 20mn Measurements and Simulations of the Creep Strain in Flip Chip Dies
Corresp. Florian Schindler-Saefkow - Fraunhofer ENAS, Micro Materials Center
12:00 20mn Warpage Investigation of PCB Embedding Technology – Determination of Relevant Modelling Parameters by Means of FEM and Experiments
Corresp. Florian Rost - Fraunhofer IZM

12:30Lunch

Special session Visit of Robert Bosch plant of Salzgitter 13:30 Wednesday March 27 2019
Chaired by
13:30 Departure by bus from venue
16:30 Return to venue

Compiled on Tue, 22 Jan 2019 09:34:41 +0100 after template Full program 2019 HTML page