Advance programme
Go to Global conference schedule Technical program
| Day 1 - Monday 26 Apr 2010 | |||
| 08.00 | Registration desk open | ||
| 09.00 | OPENING SESSION by the General Chair | ||
| 09.10 | INDUSTRIAL TRENDS KEYNOTE 1: Solid State Lighting, George Craford, Philips Lighting | ||
| 09.40 | INDUSTRIAL TRENDS KEYNOTE 2: The European’s R&D landscape for micro/nanoelectronics, Michel Brilloux, CEA-LETI, France | ||
| 10.10 | INDUSTRIAL TRENDS KEYNOTE 3: tbd | ||
| 10.40 | Break | ||
| 11:10 | S. 1 New Developments in Modeling | ||
| 12.40 | Lunch | ||
| 14:00 | S. 2 Experimental Investigations | S. 3 Modelling of MEMS Devices I | S. 4 Thermal Modelling and Characterization |
| 15.50 | Coffee break | ||
| 16:20 | S. 5 Damage and Failure | S. 6 Innovative Methods for Microsystems Modelling I | S. 7 Electrothermal Modeling and Characterization |
| 18.00 | Transport by bus to Château Le Thil | ||
| 19.00 | Dinner in Château Le Thil | ||
| Day 2 - Tuesday 27 Apr 2010 | |||
| 09:00 | S. 8 Flexible Electronics | S. 9 Innovative Methods for Microsystems Modelling II | S. 10 Thermal-Fluid Behavior Modeling and Characterization |
| 10.10 | Break | ||
| 11:00 | S. 11 Posters TM | S. 12 Posters MP+TF | |
| 12.20 | Lunch | ||
| 13:30 | S. 13 Thermo-Mechanical Modeling I | S. 14 Modelling of MEMS devices II | S. 15 Molecular Modeling |
| 15.20 | Break | ||
| 16:00 | S. 16 Dynamic Problems | S. 17 Multi-Physics Modelling for Power Electronics Devices | S. 18 Modeling for Advanced Packaging |
| 18.30 | Reception at the venue | ||
| Day 3 - Wednesday 28 Apr 2010 | |||
| 09:00 | S. 19 General lectures, mixed | ||
| 10.30 | Break | ||
| 11:00 | S. 20 Reliability Modeling | S. 21 Process Modelling | S. 22 Thermo-Mechanical Modeling II |
| 12.20 | Lunch | ||
| 13:40 | S. 23 Mixed Thermal / Multiphysics session | ||
| 15.40 | End of conference | ||
Go to Global conference schedule Technical program
| Session 1 | 11:10 | Monday 26 Apr 2010 | |
| New Developments in Modeling Chairman: B. Michel, Fraunhofer IZM; L.J. Ernst, Delft University of Technology | |||
| 11:10 | 30mn | Keynote presentation - Wafer Level Packaging (WLP): from Fan-in to Fan-out Corresponding Author: Xuejun Fan - Lamar University | |
| Session 2 | 14:00 | Monday 26 Apr 2010 | |
| Experimental Investigations Chairman: tbd | |||
| 14:00 | 30mn | Keynote presentation - Toward Comprehensive Reliability Testing – a Combined Loading Approach Corresponding Author: Toni Mattila - Helsinki University of Technology | |
| 14:30 | 20mn | Theoretical Analyses on the Shear Test Corresponding Author: Rainer Dudek - Fraunhofer ENAS, MMC Rainer Dudek 1, Ralf Doering 1, Kerstin Kreyssig 2, Bernd Michel 1 1 Fraunhofer ENAS, Micro Materials Center Berlin and Chemnitz 2 CWM GmbH, Chemnitz | |
| 14:50 | 20mn | Size-effects in time-dependent mechanics in metallic MEMS Corresponding Author: Lambert Bergers - Eindhoven University of Technology | |
| 15:10 | 20mn | Procedure to Determine Interfacial Toughness of EMC-Copper (Oxide) Interfaces Corresponding Author: An Xiao - Delft University of Technology | |
| 15:30 | 20mn | Local stress analysis in devices by FIB Corresponding Author: Rene Kregting - TNO | |
| Session 3 | 14:00 | Monday 26 Apr 2010 | |
| Modelling of MEMS Devices I Chairman: tbd | |||
| 14:00 | 30mn | Keynote presentation - AN ON-CHIP EXPERIMENTAL ASSESSMENT OF CASIMIR FORCE EFFECT IN MICRO-ELECTROMECHANICAL SYSTEMS Corresponding Author: Attilio Frangi - Dept. of Structural Engineering, Politecnico di Milano | |
| 14:30 | 20mn | MEMS resonator temperature compensation Corresponding Author: Fabrice CASSET - CEA, LETI, MINATEC F. Casset 1, C. Durand 2, Y. Civet 3, E. Ollier 1, JF. Carpentier 2, P. Ancey 2, P. Robert 1 1 CEA, LETI, MINATEC, Grenoble, France 2 ST, Crolles, France 3 TIMA, Grenoble, France | |
| 14:50 | 20mn | Failure Modes of Wafer Level Thin Film MEMS Packages During Wafer Thinning Corresponding Author: J.J.M. Zaal - Delft University of Technology | |
| 15:10 | 20mn | Prediction of stiction in Microswitch Systems Corresponding Author: Ling Wu - University of Liege | |
| 15:30 | 20mn | FINITE ELEMENT MODELLING OF ADHESION PHENOMENA IN MEMS Corresponding Author: Raffaele Ardito - Dept. of Structural Engineering, Politecnico di Milano | |
| Session 4 | 14:00 | Monday 26 Apr 2010 | |
| Thermal Modelling and Characterization Chairman: tbd | |||
| 14:00 | 30mn | Keynote presentation - Simulation-based analysis of the heat-affected zone during target preparation by pulsed-laser ablation through stacked silicon dies in 3D integrated System-in-Packages Corresponding Author: Stefan Martens - Infineon Technologies AG, Regensburg, Germany | |
| 14:30 | 20mn | Fabrication of Freestanding Thin Pt/W Thermocouple by Joule Heat Welding Corresponding Author: Hironori Tohmyoh - Tohoku University | |
| 14:50 | 20mn | Light Degradation Prediction of High Power Light Emitting Diode Lighting Modules Corresponding Author: Kuo-Ning Chiang - National Tsing Hua University, Department of Power Mechanical Engineering | |
| 15:10 | 20mn | Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation Corresponding Author: CORFA Anthony - CEA, LETI, MINATEC | |
| 15:30 | 20mn | Analytical modelling of transient processes in thermal microsensors Corresponding Author: Alexander Kozlov - Omsk State University | |
| Session 5 | 16:20 | Monday 26 Apr 2010 | |
| Damage and Failure Chairman: | |||
| 16:20 | 30mn | Keynote presentation - Detailed Investigation on the Damage Accumulation of Lead-free Solder Joints under Accelerated Temperature Cycling Corresponding Author: S. W. Ricky Lee - HKUST | |
| 16:50 | 20mn | Crack and Damage in low-k BEoL Stacks under Assembly and CPI Aspects Corresponding Author: Juergen Auersperg - Fraunhofer ENAS | |
| 17:10 | 20mn | Numerical Analysis of Interfacial Delamination for a 3D RF Module subject to Moisture Absorption and Desorption Loads Corresponding Author: Liping Zhu - TriQuint Semiconductor Inc | |
| 17:30 | 20mn | Numerical-experimental analysis of combined bulk and interface fracture in a leadless package Corresponding Author: Sander Noijen - Philips Applied Technologies | |
| Session 6 | 16:20 | Monday 26 Apr 2010 | |
| Innovative Methods for Microsystems Modelling I Chairman: | |||
| 16:20 | 30mn | Keynote presentation - A Comparison of Model Order Reduction Methods used in different FE Software Tools Corresponding Author: Mario Patrick Jungwirth - University of Applied Sciences Upper Austria, Campus Wels | |
| 16:50 | 20mn | A linear analysis to overcome the numerical Cherenkov instability Corresponding Author: Professor Franck Assous - Ariel Universisty Center & Bar Ilan University | |
| 17:10 | 20mn | Thermomechanical simulation of BCB membrane thin-film package Corresponding Author: Seonho Seok - IEMN/IRCICA CNRS | |
| 17:30 | 20mn | The Mechanical Characterisation of Glass Frit Seals for Capped MEMS Devices Corresponding Author: Cillian Burke - Stokes Institute | |
| Session 7 | 16:20 | Monday 26 Apr 2010 | |
| Electrothermal Modeling and Characterization Chairman: | |||
| 16:20 | 30mn | Keynote presentation - New Methodology on Electro-Thermal Characterization and Modeling of Large Power Drivers using Lateral PNP BJTs Corresponding Author: Joseph Rhayem - Program Manager : Electro-Thermal Characterisation | |
| 16:50 | 20mn | System-level model of electrothermal microsystem and temperature control circuit Corresponding Author: Dennis Hohlfeld - Holst Centre / IMEC | |
| 17:10 | 20mn | Electromagnetic and Thermal investigations of RF Circuits and Devices Corresponding Author: Yves SCUDELLER - Université de Nantes | |
| 17:30 | 20mn | Switching speed evolution for MOS silicon devices electrically stressed under high temperatures Corresponding Author: Pr. Chafic SALAME - Lebanese University | |
| Session 8 | 09:00 | Tuesday 27 Apr 2010 | |
| Flexible Electronics Chairman: | |||
| 09:00 | 30mn | Keynote presentation - Thermo-Mechanical Analysis of Flexible and Stretchable Systems Corresponding Author: Mario Gonzalez - IMEC | |
| 09:30 | 20mn | Flexible Circuits with Embedded Resistors Subjected to Extreme Thermal Loading Conditions Using the Shadow Moiré and FEM Measurements Techniques Corresponding Author: Luciano Arruda - Nokia Institute of Technology | |
| 09:50 | 20mn | Modeling the residual shrinkage during lithographic processing on flexible polymer substrates Corresponding Author: Marco Barink - TNO/Holst Centre | |
| Session 9 | 09:00 | Tuesday 27 Apr 2010 | |
| Innovative Methods for Microsystems Modelling II Chairman: | |||
| 09:00 | 30mn | Keynote presentation - Exemplified calculation of stress migration in a 90nm node via structure Corresponding Author: Kirsten Weide-Zaage - Leibniz Universität Hannover | |
| 09:30 | 20mn | Improvement of micro-bridge capacitance-voltage curve linearity using shape optimization Corresponding Author: Lemaire Etienne - Aerospace and Mechanical Engineering Department, University of Liège | |
| 09:50 | 20mn | Multiple Environment Overstress Testing and Modelling of Solar Cells Corresponding Author: Erik Veninga - TNO Science and Industry | |
| Session 10 | 09:00 | Tuesday 27 Apr 2010 | |
| Thermal-Fluid Behavior Modeling and Characterization Chairman: | |||
| 09:00 | 30mn | Keynote presentation - Analysis of the performance reduction of axial fans in close proximity to EMC screens Corresponding Author: Raúl Antón - TECNUN-University of Navarra | |
| 09:30 | 20mn | CFD Assisted Design Evaluation and Experimental Verification of a Logic-Controlled Local PCB Heater for Humidity Management in Electronics Enclosure Corresponding Author: ILJA BELOV - School of Engineering, Jönköping University | |
| 09:50 | 20mn | Bond Wire Design for eXtreme Switch Devices Corresponding Author: Torsten Hauck - Freescale Semiconductor Germany | |
| Session 11 | 11:00 | Tuesday 27 Apr 2010 | |
| Posters TM Chairman: | |||
| Principles for Simulation of Barrier Cracking due to high Stress Corresponding Author: Johar Ciptokusumo - Leibniz Universität Hannover, Laboratorium für Informationstechnologie, Germany | |||
| Thermo-mechanical simulations in double-sided heat transfer power assemblies Corresponding Author: Eric WOIRGARD - Université Bordeaux 1 | |||
| Aging Effects of Epoxy Moulding Compound on the Long-Term Stability of Plastic Package Corresponding Author: Eric Nguegang Ngnetiwe - Robert Bosch GmbH | |||
| Reliability Assessment of 3D Chip Stacking Package Using Metal Bonding and Through Silicon Via Technologies Corresponding Author: Kuo-Ning Chiang - National Tsing Hua University, Dep. of Power Mechanical Engineering | |||
| Evaluating the effect of viscoelastic damping layers in the dynamic behavior of printed wiring boards Corresponding Author: Cleber Pagliosa - Nokia Institute of Technology | |||
| Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board Corresponding Author: Wilson Carlos MAIA FILHO - Thales Corporate Services | |||
| Characterization of a Staggered Curved-Channel Micromixer Corresponding Author: Jyh Jian Chen - Department of Biomechatronics Engineering, National Pingtung University of Science and Technology | |||
| Design of Al Pad Geometry for Reducing Current Crowding Effect in Flip-chip Solder Joint Using Finite-element Analysis Corresponding Author: Yuan-wei Chang - National Chiao Tung University | |||
| Efficiency and robustness of some behavior laws in the description of viscoplastic deformation and degradation of solder materials Corresponding Author: Sabeur MSOLLI - Université de Toulouse ; INP/ENIT ; LGP | |||
| Thermomechanical characterization of electronic components Corresponding Author: SANA BEN KHLIFA - . bLaboratoire d\'Electronique et des Technologies de l\'Information, CEA / LETI-MINATEC, and.Laboratoire de mécanique Biomécani | |||
| Thermo-mechanical simulations of LTCC packages for RF MEMS applications Corresponding Author: Lenkkeri, Jaakko Tapani - VTT Technical Research Centre of Finland | |||
| GaAs-Based Laser Diode Bonding-Induced Stress Investigation By Means Of Simulation And Degree Of Polarization Of The Photoluminescence Measurements Corresponding Author: Julien Le Clec\'h - 3S Photonics | |||
| Mechanical and Thermal Simulations of a Microactuator for the Stimulation of the Perilymph Corresponding Author: Tom Creutzburg - Leibniz Universität Hannover - Institute for Microtechnology | |||
| A multi-sectional approach to a thermo-mechanically coupled micro cantilever: Theoretical and experimental investigations Corresponding Author: Dennis Roeser - University of Paderborn | |||
| Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality Corresponding Author: Willem van Driel - NXP Semiconductors | |||
| Thermomechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array) : Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability Corresponding Author: CHAILLOT Agnès - EADS Innovation Works | |||
| Influence of PCB design and materials on chip solder joint reliability Corresponding Author: Berthou Matthieu - MBDA France | |||
| Loop Height - Its Significant Impact on IC Copper Wire Bonding Corresponding Author: Silnore Sabando - Fairchild Semiconductor | |||
| Copper Pillar Bump Structure Optimization for Flip Chip Packaging with Cu/Low-K Interconnects Corresponding Author: zhang xueren - United Test & Assembly Center Ltd | |||
| Measurement of Viskoelastic Material Properties of Adhesives for SHM Sensors Under Harsh Environmental Conditions Corresponding Author: Boehme, Bjoern - Technische Universität Dresden, Electronics Packaging Laboratory | |||
| Warpage Simulation of IC Packages during Molding and Post-mold Processes Corresponding Author: Hwang, Sheng-Jye - Dept. of ME, National Cheng Kung University, Tainan, Taiwan | |||
| Numerical Multi-objective Optimization Used to Elasto-plastic Material Extraction of Thin Layers Through Nanoindentaion Technique Corresponding Author: Lukasz Dowhan - Wroclaw University of technology | |||
| Moisture Sensitive Plastic Packages of IC Devices: Design for Reliability Corresponding Author: Xuejun Fan - Lamar University | |||
| Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates Corresponding Author: Karsten Meier - Technische Universität Dresden | |||
| Thermoelastic Analysis on the Interacting Piezoelectric Fibers: a Micromechanical Approach Corresponding Author: Roohollah Hashemi - Sharif University of Technology | |||
| The study of carbon nanotube's length in reference to its thermal conductivity by molecular dynamics approach Corresponding Author: Bartosz Platek - Wroclaw University of Technology | |||
| Vibration Reliability of SMD Pb-free Solder Joints Corresponding Author: Mario Borras - Robert Bosch GmbH | |||
| Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages Corresponding Author: Daniel Vanderstraeten - ON Semiconductor | |||
| Vibration Durability of Pb-free HVQFN Assemblies Corresponding Author: Abhijit Dasgupta - Center for Advanced Life Cycle Engineering, Mechanical Engineering Dept, University of Maryland | |||
| Mechanism analyses on PBGA strip packaging warpage Corresponding Author: Yeong K. Kim - Korea Aerospace University | |||
| Numerical Simulations of Thermo-Mechanical Stresses during the Casting of Multi-Crystalline Silicon Ingots Corresponding Author: Marcus Oswald - Fraunhofer Center for Silicon Photovoltaics | |||
| Interconnection Technologies for Photovoltaic Modules – Analysis of technological and mechanical Problems Corresponding Author: Steffen Wiese - Fraunhofer CSP | |||
| Thermo-mechanical reliability of the Bump on Flexible Lead for Wafer Level Packaging Corresponding Author: Ines Kolb - Fraunhofer IZM, TU-Berlin | |||
| A Case Study of Networked Sensors by Simulations and Experiments Corresponding Author: Cheng Guo - Delft University of Technology | |||
| Interfacial delamination and thermal fatigue life estimation of multilayered metal MEMS Corresponding Author: Angelo R. Maligno - Loughborough University | |||
| SINTERING, IN DIFFERENT TEMPERATURES, OF TRACES OF SILVER PRINTED IN FLEXIBLE SURFACES Corresponding Author: Rafael Drumond Mancosu, Dr. - INdT - Instituto Nokia de Tecnologia | |||
| Session 12 | 11:00 | Tuesday 27 Apr 2010 | |
| Posters MP+TF Chairman: | |||
| Virtual prototyping of PoP interconnections regarding electrically activated mechanisms Corresponding Author: Kirsten WEIDE-ZAAGE - Leibniz University Hannover | |||
| Response of an Electrostatically Actuated Microbeam to Drop-Table Test Corresponding Author: Mohammad I Younis - State University of New York at Binghamton | |||
| The Degradation of Solder Joints Under High Current Density and Low-Cycle Fatigue Corresponding Author: Davide Di Maio - National Physical Laboratory | |||
| Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test Corresponding Author: Lihua Liang - Zhejiang University of Technology | |||
| COUPLED FIELD NUMERICAL SIMULATION AND EXPERIMENTAL CHARACTERIZATION OF INKJET PRINTED STRAIN GAUGES Corresponding Author: Jairo Alonso Quintero Quintero - Instituto Nokia de Tecnologia - INdT | |||
| Reliability Study of Stretchable Interconnect by Simulations Corresponding Author: Quayle Chen - Nokia Research Center (Beijing), Advanced System Engineering | |||
| Design of Jigs of Cellular Phones for Drop Test of OLED Modules Corresponding Author: Kwangju Lee - Korea University of Technology and Education | |||
| MEMS Control by Periodic Networks of Resistances Corresponding Author: Ratier Nicolas - FEMTO-ST | |||
| FE Modelling of Capacitive Pressure Sensors Realized in LTCC Technology Corresponding Author: Cristina Marghescu - University “Politehnica” of Bucharest, Center for Technological Electronics and Interconnection Techniques | |||
| SINTERING, IN DIFFERENT TEMPERATURES, OF TRACES OF SILVER PRINTED IN FLEXIBLE SURFACES Corresponding Author: Rafael Drumond Mancosu - Instituto Nokia de Tecnologia - INdT | |||
| Comparison and characterization of a typical strain gage trace against another using the printed method Corresponding Author: JAIRO ALONSO QUINTERO QUINTERO - Nokia Institute of Technology - INdT | |||
| Large Deformation of Beam Columns - a Closed Form Solution and Design Guide for Vertical Buckling Probe Needles Corresponding Author: Torsten Hauck - Freescale Semiconductor germany | |||
| A NEW ITERATIVE ALGORITHM FOR THE SOLUTION FOR THE LOAD DEFLECTION SQUARE MEMBRANES Corresponding Author: Youssef Hicham - LAAS CNRS | |||
| Optical stability of silicone based butt-coupling optical interconnect Corresponding Author: Dengke Cai - Technische Universität Dortmund, Fakultät für Elektrotechnik und Informationstechnik | |||
| Numerical modeling of temperature distribution in power transformers to determine the hot spot temperature and location Corresponding Author: aydin ghaffarnajad mehraban - power and water university of technology | |||
| THERMAL MODELLING OF THE EMERGING MULTI-CHIP PACKAGES Corresponding Author: Eric Monier-Vinard - Thales Corporate Services | |||
| Numerical multiscale analysis of TG of crosslinked polymer Corresponding Author: Sebastian J. Tesarski - Wroclaw University of Technology | |||
| Electro-thermal investigation of silicon power inverters operating at low switching Frequencies Corresponding Author: Yves SCUDELLER - Université de Nantes | |||
| Session 13 | 13:30 | Tuesday 27 Apr 2010 | |
| Thermo-Mechanical Modeling I Chairman: | |||
| 13:30 | 30mn | Keynote presentation - Simulation of Drop Testing at Extremely High Accelerations Corresponding Author: Abhijit Dasgupta - Center for Advanced Life Cycle Engineering, Mechanical Engineering Dept., University of Maryland | |
| 14:00 | 20mn | Numerical investigations of the strain behavior in nanoscale patterned strained silicon structures Corresponding Author: Falk Naumann - Fraunhofer Institute for Mechanics of Materials | |
| 14:20 | 20mn | MULTISCALE MODELING OF NONLINEAR BEHAVIOR OF NANO-REINFORCED STRUCTURAL ADHESIVE BONDS FOR AEROSPACE APPLICATIONS Corresponding Author: Shaker A. Meguid - University of Toronto, Canada | |
| 14:40 | 20mn | Virtual Thermo-Mechanical Prototyping for High-Temperature-Application Microelectronics Corresponding Author: Daoguo Yang - NXP Semiconductors | |
| 15:00 | 20mn | Multi-scale modeling of the Viscoplastic Response of As-fabricated Microscale Sn3.0Ag0.5Cu Solder Interconnects Corresponding Author: Gayatri Cuddalorepatta - University of Maryland | |
| Session 14 | 13:30 | Tuesday 27 Apr 2010 | |
| Modelling of MEMS devices II Chairman: | |||
| 13:30 | 30mn | Keynote presentation - FEM assisted Development of a SHM-Piezo-Package for Damage Evaluation in Airplane Components Corresponding Author: Mike Roellig - Fraunhofer Institute for Non-Destructive Testing | |
| 14:00 | 20mn | Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS Corresponding Author: Joseph Zekry - IMEC vzw | |
| 14:20 | 20mn | Modeling the effects of printed circuit motion on the response of microstructures under mechanical shock Corresponding Author: Mohammad I Younis - State University of New York at Binghamton | |
| 14:40 | 20mn | GLOBAL MODELLING OF A CORIOLIS MICRO-GYROSCOPE FOR QUADRATURE ERROR COMPENSATION Corresponding Author: DESCHARLES Melanie - ONERA | |
| Session 15 | 13:30 | Tuesday 27 Apr 2010 | |
| Molecular Modeling Chairman: | |||
| 13:30 | 30mn | Keynote presentation - Mechanical Properties of an Epoxy, Modeled Using Particle Dynamics as Parameterized through Molecular Modeling Corresponding Author: Nancy Iwamoto - Honeywell Specialty Materials | |
| 14:00 | 20mn | Design of reliable Cu-epoxy interface using Molecular Dynamic Simulation Corresponding Author: Cell K Y Wong - Delft University of Technology | |
| 14:20 | 20mn | Molecular Modeling of Microelectronic Packaging Materials – Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface Corresponding Author: Ole Hölck - Micro Material Center Berlin, Fraunhofer IZM | |
| 14:40 | 20mn | On the Mechanical Properties of Cu3Sn Intermetallic Compound through Molecular Dynamics Simulation Corresponding Author: Ching-Feng Yu - Department of Power Mechanical Engineering, National Tsing Hua University | |
| 15:00 | 20mn | Computational materials engineering: capabilities of atomic-scale prediction of mechanical, thermal, and electric properties of microelectronic materials Corresponding Author: Erich Wimmer - Materials Design, Inc. | |
| Session 16 | 16:00 | Tuesday 27 Apr 2010 | |
| Dynamic Problems Chairman: | |||
| 16:00 | 30mn | Keynote presentation - Anomaly Detection and Fault-Mode Isolation for Prognostics Health Monitoring of Electronics Subjected to Drop and Shock Corresponding Author: Pradeep Lall - Auburn University | |
| 16:30 | 20mn | BGA Lifetime Prediction in JEDEC Drop Tests Accounting for Copper Trace Routing Effects Corresponding Author: Frank Kraemer - Fraunhofer CSP | |
| 16:50 | 20mn | Computer Simulation and Design of a Solder Joint Vibration Test Machine Corresponding Author: Elisha Kamara - University of Greenwich | |
| 17:10 | 20mn | Optimization for Simulation of WL-CSP Subjected to Drop-Test with Plasticity Behavior Corresponding Author: Cédric LE COQ - Laboratoire de Mécanique et Rhéologie (LMR) - STMicroelectronics | |
| 17:30 | 20mn | High-Speed Mechanical Impact Reliability of Solder Interconnections in High-Power LEDs Corresponding Author: Jussi Hokka - Philips Lighting | |
| Session 17 | 16:00 | Tuesday 27 Apr 2010 | |
| Multi-Physics Modelling for Power Electronics Devices Chairman: | |||
| 16:00 | 30mn | Keynote presentation - Electro-thermo-mechanical simulation of automotive MOSFET transitor Corresponding Author: Hervé FERAL - EPSILON Ingénierie | |
| 16:30 | 20mn | A connection of thermo-mechanical finite elements tools with electro-thermal finite elements simulation : towards an electro-thermo-mechanical finite elements modeling for power semiconductor devices Corresponding Author: BELMEHDI - IMS Laboratory | |
| 16:50 | 20mn | Investigation into the Reliability of IGBT Inverters Operating in Combined Aeronautical Constraints Corresponding Author: Hassan ABBAD - power electronics reliability | |
| 17:10 | 20mn | Simulation approach on Hot-Carrier-Induced Threshold-Voltage Shift and High Drain Leakage Current in P-Type Lateral DMOS Transistors Corresponding Author: Dr. Aresu Stefano - Infineon Technologies AG | |
| 17:30 | 20mn | Finite Element Analysis of a High Voltage Semiconductor Polymeric Package Design using a Taguchi Based Experimental Design Corresponding Author: Nadeesh Nobeen - Loughborough University | |
| Session 18 | 16:00 | Tuesday 27 Apr 2010 | |
| Modeling for Advanced Packaging Chairman: | |||
| 16:00 | 30mn | Keynote presentation - Virtual Prototyping Advanced by Statistic and Stochastic Methodologies Corresponding Author: Sven Rzepka - Fraunhofer ENAS - Micro Materials Center | |
| 16:30 | 20mn | Evaluation of Probing Process Parameters and PAD Designs: Experiments and Modeling Correlations for Solving Mechanical Issues Corresponding Author: Romuald ROUCOU - STMicroelectronics / EMSE-CMP | |
| 16:50 | 20mn | Numerical Modelling Methodology for Design of Miniaturised Integrated Products – an Application to 3D CMM Micro-probe Development Corresponding Author: Pushparajah Rajaguru - Centre for Numerical Modelling and Process Analysis | |
| 17:10 | 20mn | The probability design for wire bonding process by finite element and Monte Carlo method Corresponding Author: Yong Liu - Fairchild Semiconductor Corp. | |
| 17:30 | 20mn | Mechanical Behaviour and Fatigue of Copper Ribbons used as Solar Cell Interconnectors Corresponding Author: Steffen Wiese - Fraunhofer CSP | |
| Session 19 | 09:00 | Wednesday 28 Apr 2010 | |
| General lectures, mixed Chairman: | |||
| 09:00 | 30mn | Keynote presentation - Thermo-mechanical design of a generic 0-level MEMS Package using Chip Capping and Through Silicon Via’s Corresponding Author: Bart Vandevelde - IMEC | |
| 09:30 | 30mn | Keynote presentation - How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies Corresponding Author: Hélène Frémont - IMS Université de Bordeaux | |
| Session 20 | 11:00 | Wednesday 28 Apr 2010 | |
| Reliability Modeling Chairman: | |||
| 11:00 | 30mn | Keynote presentation - Thermo-mechanical challenges in the longevity of microelectronics Corresponding Author: Sanders Gielen - TNO | |
| 11:30 | 20mn | Estimation of Acceleration Factors for SAC305 Solder in Thermo-mechanical Reliability Corresponding Author: Ahmer Syed - Amkor Technology | |
| 11:50 | 20mn | Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via Corresponding Author: Samed Barnat 1, 2,3 ; Helene Fremont 3 ; Alexandrine Gracia 3 ; Eric Cadalen 1 ; Catherine Bunel 1 ; François Neuilly 1 ; Jean-R - 1 IPDIA; 2 NXP Semiconductors France; 3 Université Bordeaux I, Laboratoire IMS | |
| 12:10 | 20mn | Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures Corresponding Author: Hideo Miura - Tohoku University | |
| 12:30 | 20mn | Interface Characterization Combined with Cohesive Zone Modeling Corresponding Author: Xiaosong Ma - Delft University of Technology | |
| Session 21 | 11:00 | Wednesday 28 Apr 2010 | |
| Process Modelling Chairman: | |||
| 11:00 | 30mn | Keynote presentation - Multiscale approach optimization on surface wettabilty change on rough surface Corresponding Author: Edward K. L. Chan - Hong Kong University of Science & Technology | |
| 11:30 | 20mn | Thermo-mechanical simulations of RF-MEMS 0-level package based on wafer bonding by soldering Corresponding Author: Siebe Bouwstra - MEMS Technical Consultancy | |
| 11:50 | 20mn | Electromigration modeling with consideration of hillock formation Corresponding Author: Lihua Liang - Zhejiang University of Technology | |
| 12:10 | 20mn | Multiphysics Modeling and Design of Ultralarge Multiwafer MOVPE Reactor for Group III-Nitride Light Emitting Diodes Corresponding Author: Changsung Sean Kim - SAMSUNG Electro-Mechanics Co., Ltd. | |
| 12:30 | 20mn | Magnetic Analysis and Simulation of a Self-Propelled Capsule Endoscope Corresponding Author: Sheng Liu - Institute of Microsystems Chengzhi Hu, Mingyuan Gao, Zhenzhi Chen, Honghai Zhang, Sheng Liu, School of Mechanical Science & Engineering, Huazhong University of Science & Technology | |
| Session 22 | 11:00 | Wednesday 28 Apr 2010 | |
| Thermo-Mechanical Modeling II Chairman: | |||
| 11:00 | 30mn | Keynote presentation - Board level reliability of the advanced RF Power Packaging Corresponding Author: Cadmus Yuan - Dr. | |
| 11:30 | 20mn | The Effect of Thermal Aging on Molding Compound Properties Corresponding Author: J. de Vreugd - TU-Delft | |
| 11:50 | 20mn | Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests. Corresponding Author: Dr. Reinhard Pufall - Infineon Technologies AG | |
| 12:10 | 20mn | Effects of the Geometrical Dimensions on Stress and Strain of Electrostatically Actuated MEMS Resonators at Pull-in and Stiction Positions Corresponding Author: Pustan Marius - Aerospace & Mechanical Engineering Department, University of Liege | |
| 12:30 | 20mn | Multi-scale numerical-experimental method to determine the size dependent elastic properties of composite silicon copper nano cantilevers using an electrostatic pull in experiment Corresponding Author: R.H. Poelma - Delft University of Technology | |
| Session 23 | 13:40 | Wednesday 28 Apr 2010 | |
| Mixed Thermal / Multiphysics session Chairman: | |||
| 13:40 | 30mn | Keynote presentation - TWO-SCALE vs THREE-SCALE FE ANALYSES OF SHOCK-INDUCED FAILURE IN POLYSILICON MEMS Corresponding Author: Alberto Corigliano - Politecnico di Milano | |
| 14:10 | 30mn | Keynote presentation - Simulation of Particle Levitation due to Dielectrophoresis Corresponding Author: Rochus Véronique - University of Liège | |
| 14:40 | 30mn | Keynote presentation - Thermal Performance Enhancement by Exploitation of Nano-Effects Corresponding Author: Bernhard Wunderle - Micro Materials Centre Berlin, Fraunhofer IZM | |
Compiled on Mon, 08 Feb 2010 15:45:56 +0100
End of programme