Advanced programme January 2015

Click to unfold/fold programme at a glance

09:00 Welcome by local organiser

Special session Special session: Industry keynotes 09:10 Monday April 20 2015
Chaired by Kouchi Zhang, TU Delft DIMES
09:10 Simulation driven design – from concept phase to robust design, Dr. Petra Schiebel, Robert Bosch GmbH
09:40 Molecular Modeling in Industry for Electronic Materials, Nancy Iwamoto, Honeywell
10:10 Predicting the Lifetime of Power Semiconductor Modules under Variable Thermal Stress - Boundary Conditions and Limitations, Prof. Dr. Uwe Scheuermann, Manager Product Reliability, SEMIKRON Elektronik
10:40 Break

Session 1 Technical Keynotes 11:00 Monday April 20 2015
Chaired by TBD
11:00
30mn Keynote presentation - Nonlinear mechanical springs for counteracting nonlinearities in electrostatic actuation
Corresponding Author: David Elata - Technion - Israel Institute of Technology
11:30
30mn Keynote presentation - Virtual Prototyping of Advanced Packaging Processes
Corresponding Author: Julien Sylvestre - University Sherbrooke
12:00
30mn Keynote presentation - B-spline X-ray Diffraction Imaging Techniques for Die Warpage and Stress Monitoring Inside Fully Encapsulated Packaged Chips
Corresponding Author: Patrick McNally - Dublin City University

12:30 Lunch

Session 2 Reliability investigations 14:00 Monday April 20 2015
Chaired by TBD
14:00
30mn Keynote presentation - Challenges in the Reliability of 3D Integration using TSVs
Corresponding Author: Martin Stiebing - Technische Universität Chemnitz
14:30
20mn Reliability Investigation and Design of High Power Inverter Modules based on Material Characterization Simulation and experimental Verification.
Corresponding Author: Enrico Merten - Berliner Nanotest u. Design GmbH
14:50
20mn Study on Thermomechanical Reliability of IGBT Power Module and Thermal Grease Pump-out Mechanism
Corresponding Author: Jue Li - Dept. of Electrical Engineering and Automation School of ELEC Aalto University
15:10
20mn The effect of variations in temperature cycling profile and mechanical properties of solder on thermo-mechanical reliability of a lead-free BGA package
Corresponding Author: Ilja Belov - School of Engineering Jönköping University
15:30
20mn Accelerated Life Test with Conversion of Thermal Shock Stress to Mechanical Stress
Corresponding Author: Hyoung-seuk Choi - Korea Institute of Ceramic Engineering and Technology Energy and Environment Division

Session 3 Multi-physics simulations (incl moisture, electrical, etc) 14:00 Monday April 20 2015
Chaired by TBD
14:00
30mn Keynote presentation - Multiphysics Study of Electromigration in Ceramic Capacitors
Corresponding Author: Abhijit Dasgupta - University of Maryland
14:30
20mn Measurement and simulation of electromagnetic drift for obsolescence management in electronics.
Corresponding Author: DUCHAMP GENEVIEVE - Univ Bordeaux - IMS laboratory
14:50
20mn A Compact Parametric Model of Magnetic Resonance Micro Sensor
Corresponding Author: Kudryavtsev Mikhail - University of Rostock
15:10
20mn New simulation method for Deep Trench Termination diode DT² using mixed-mode TCAD Sentaurus
Corresponding Author: FEDIA BACCAR - IMS LABORATORY
15:30
20mn Understanding Tip-Enhanced Raman Spectroscopy by Multiphysics Finite Element Simulations
Corresponding Author: Vladimir A. Kolchuzhin - TU Chemnitz

Session 4 Thermal Behavior Modeling and Characterization 14:00 Monday April 20 2015
Chaired by TBD
14:00
30mn Keynote presentation - Modeling and model-based control of temperature in an SThM probe
Corresponding Author: Michel LENCZNER - FEMTO-ST Institute Departement Time and Frequency
14:30
20mn CFD Simulations of Wave Soldering on Through-Hole Printed Circuit Assemblies
Corresponding Author: Dr. Adam Yuile - University of Saarland
14:50
20mn Simulation of a Flip Chip Bonding Technique Using Reactive Foils
Corresponding Author: F. Kraemer - Saarland University
15:10
20mn Thermo-Mechanical Simulation of a Graphene Heat Spreader
Corresponding Author: Michael Edwards - Chalmers University of Technology
15:30
20mn Thermal analysis of micro-hotplates for catalytic gas microsensors
Corresponding Author: Alexander Kozlov - Omsk State University

15:50 Break

Session 5 Interconnect investigations 16:20 Monday April 20 2015
Chaired by TBD
16:20
30mn Keynote presentation - Adequate Mechanical Copper Modelling for 2nd Level Interconnect Structures
Corresponding Author: S. Wiese - Saarland University
16:50
20mn Wire Bond Lifetime Modelling Using Numeric Simulation and a Crack Growth Approach
Corresponding Author: Arian Grams - Fraunhofer IZM
17:10
20mn Thermo-mechanical ball bonding simulation with elasto-plastic parameters obtained from nanoindentation and atomic force measurements
Corresponding Author: Alan Wright - Fraunhofer IISB
17:30
20mn Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres MPS
Corresponding Author: Fayҫal R. Hamou - SINTEF MiNaLab

Session 6 Molecular Dynamics and Process Modelling 16:20 Monday April 20 2015
Chaired by TBD
16:20
30mn Keynote presentation - Towards Nanoreliability of CNT based Sensor Applications: Investigations of CNT-Metal Interfaces Combining Molecular Dynamics Simulations Advanced In Situ Experiments and Analytics.
Corresponding Author: Steffen Hartmann - Technische Universität Chemnitz
16:50
20mn Computational Electrohydodynamics in the Fabrication of Hollow Polymer Microstructures
Corresponding Author: Chris Bailey - University of Greenwich
17:10
20mn Diffusion Simulation thru Polymers using Coarse-grained Models Derived from Molecular Models.
Corresponding Author: Nancy Iwamoto - Honeywell
17:30
20mn Submodeling FEM Analysis of 3D Printed Structures
Corresponding Author: Javad Zarbakhsh - Carinthia University of Applied Sciences

Session 7 Thermal Modelling and Analysis 16:20 Monday April 20 2015
Chaired by TBD
16:20
30mn Keynote presentation - Analytical experimental and numerical approach to thermal analysis and design of a travelling wave tube
Corresponding Author: Artur Wymyslowski - Wroclaw University of Technology
16:50
20mn Measurement of Non-uniform Junction Temperature Distribution of Large Light-Emitting Diode by Using a Modified Forward Voltage Method
Corresponding Author: Mian TAO - Hong Kong University of Science and Technology
17:10
20mn Model Verification of Novel Heat Exchanger Geometries Based on Additive Manufacturing
Corresponding Author: Klas Brinkfeldt - Swerea IVF
17:30
20mn Temperature profiles along bonding wires revealed by the bond calculator a new thermo-electrical simulation tool
Corresponding Author: Carl Christoph Jung - Robert Bosch Center for Power Electronics Reutlingen University

17:50 End of 1st day technical sessions

19:00 Dinner downtown

Session 8 Modeling for advanced package development 09:00 Tuesday April 21 2015
Chaired by TBD
09:00
30mn Keynote presentation - Thermo-Mechanical Simulations of a SiC Power Module with Double Sided Cooling
Corresponding Author: Klas Brinkfeldt - Swerea IVF
09:30
20mn Reliability analysis of copper bump interconnection in double-sided power module
Corresponding Author: Kuo-Ning Chiang - National Tsing Hua University
09:50
20mn Thermo-Mechanical Reliability Studies with a Focus on Damage Accumulation of Fatigue induced by Accelerated Mechanical Tests
Corresponding Author: Jens Heilmann - Chemnitz University of Technology

Session 9 Multi-Physics Modelling of Interconnects 09:00 Tuesday April 21 2015
Chaired by TBD
09:00
30mn Keynote presentation - Life Time Characterization for a Highly Robust Metallization
Corresponding Author: Kirsten Weide-Zaage - RESRI Group at IMS-AS Leibniz Universität Hannover
09:30
20mn Electro-Thermo-Mechanical Analyses on Silver Sintered IGBT-Module Reliability in Power Cycling
Corresponding Author: Rainer Dudek - Fraunhofer ENAS Micro Materials Center
09:50
20mn Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testing
Corresponding Author: Dr. Martin Lederer - Vienna University of Technology

Session 10 Thermomechanical Behavior Modeling and Characterization 09:00 Tuesday April 21 2015
Chaired by TBD
09:00
20mn THERMO-MECHANICAL EFFECTS IN MAJORANA TYPE QUANTUM DEVICES
Corresponding Author: Alexander W.J. Gielen - TNO Technical Sciences – Materials Solutions for Opto-electronic Devices
09:20
20mn Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies: A Combined Experimental and FEM Analysis
Corresponding Author: Bart Vandevelde - imec

10:10 Break

Session 11 Thermo-Mechanical Issues in Microelectronics 10:40 Tuesday April 21 2015
Chaired by Bernhard Wunderle, TU Chemnitz; Kaspar Jansen, TU Delft

Multi-physics Modelling of Thin Films : Optimization for Finite Elements Simulations Tools
Corresponding Author: Toni Youssef - Labinal Power Systems - Safran Group

Reliability Study on SMD Components on an Organic Substrate with a Thick Copper Core for Power Electronics Applications
Corresponding Author: Karsten Meier - Technische Universität Dresden

An Overview of Scanning Acoustic Microscope a Reliable Method for Non-destructive Failure Analysis of Microelectronic Components
Corresponding Author: Maryam Yazdan Mehr - Materials innovation institute M2i Delft University of Technology

Investigation of relaxation behavior by piezoresistive stress sensor
Corresponding Author: Alicja Palczynska - Robert Bosch GmbH

Designing Efficient Computer Experiments - The Step Beyond Finite Element Modelling
Corresponding Author: Natalie Vollert - CTR Carinthian Tech Research AG

Application of Design of Computer Experiments DoCE method for the extraction of the elasto-plastic behavior law of ECD copper through nano-indentation tests
Corresponding Author: Stéphane MOREAU - CEA

Advances in Percolated Thermal Underfill PTU Simulations for 3D- Integration
Corresponding Author: Sridhar Ganesh Kumar - Technishe Universität Chemnitz

Chip Package Interaction: A Stress analysis on 3D IC’s packages
Corresponding Author: Melina Lofrano - imec vzw

Tensile strength of lead alloy on the base of creep and fatigue phenomena
Corresponding Author: Krystian Jankowski - Politechnika Wroclawska

Surrogate model based mechanical characterization of lead-free soldered joint material exhibiting ratcheting behavior: an advanced methodology
Corresponding Author: Benoît Dompierre - Cenaero ASBL

Die thickness impact on thermo-mechanical stress in 3D packages
Corresponding Author: Abdellah Salahouelhadj - imec

Efficient modeling of printed circuit boards structures for dynamic simulations
Corresponding Author: Elena Zukowski - Bosch Connected Devices and Solutions GmbH

Fracture Mechanical Modeling for the Stress Analysis of DBC ceramics
Corresponding Author: Patrick Gaiser - Robert Bosch GmbH

Material Characterization and Process Optimization of Dye-sensitized Solar Cell Sealant
Corresponding Author: Changwoon Han - Korea Electronics Technology Institute

Current Load Capacity of Electrical Conductor Tracks Evaluated by Simulation and Thermographic Imaging
Corresponding Author: Florian Wagner - South Westphalia University of Applied Sciences

Thermo-mechanical Analysis of GaAs Devices under Temperature-Humidity-Bias testing
Corresponding Author: Kokou Adokanou - Center For materials Forming CEMEF

Numerical investigation of ceramic package interposer interconnects using isotropic conductive adhesive
Corresponding Author: Fayҫal R. Hamou - SINTEF MiNaLab

A Finite Element Modelling and Fracture Mechanical Approach of Multilayer Ceramic Capacitors
Corresponding Author: Joseph Al Ahmar - Saarland University

Analyses on a directly attached airbag sensor packaging system
Corresponding Author: Yeong K. Kim - Inha University

Estimation of landmine characteristics in different sand types using Neural Networks
Corresponding Author: Hussein Fouad Mohamed Ali - Egypt-Japan University for Science and Technology E-JUST

Estimation of landmine characteristics in sandy desert based on mechanical and thermal effects using Neural Networks
Corresponding Author: Hussein Fouad Mohamed Ali - Egypt-Japan University for Science and Technology E-JUST

Constitutive modelling of copper films on silicon substrate
Corresponding Author: Dr. Martin Lederer - Vienna University of Technology

Session 12 Thermal and Multi-Physics Issues in Microelectronics 10:40 Tuesday April 21 2015
Chaired by Bernhard Wunderle, TU Chemnitz; Kaspar Jansen, TU Delft

Finite element modeling of ZnO nanowire with different configurations of electrodes connected to external capacitive circuit for pressure sensing applications
Corresponding Author: Rolanas Dauksevicius - Kaunas University of Technology

GEANT4 Simulations in Terms of Radiation Hardness of Commercially Available SRAM
Corresponding Author: Aymen Moujbani - Leibniz Universität HannoverInstitute of Microelectronic Systems IMSRESRI Group

Comparison of Electrical Thermal and Optical characteristics of High-Power LEDs operating in various spectral ranges: from UV to red
Corresponding Author: Anton Chernyakov - SHM RE Center RAS

Vapor Pressure Prediction in Reflow for Stacked-Chip Packages by a Convection-Diffusion Model
Corresponding Author: Xuejun Fan - Lamar University

A Degradation Model of Aluminum Electrolytic Capacitors for LED Power Supplies
Corresponding Author: Bo Sun - Beijing Research Center Delft University of Technology

Electromigration Modelling of Void Nucleation in Open Cu-TSVs
Corresponding Author: Marco Rovitto - Institute for Microelectronics TU Wien

Fatigue Life of Solder Joint forWhite Chip LED by Finite Element Method
Corresponding Author: Tang Hongyu - State Key Laboratory of Solid State Lighting Changzhou Base

Multi-physics Analysis for Temperature Rise of Electric Connectors Using a Multi-scale Model
Corresponding Author: Liao Kuo-Chi - National Taiwan University

Design and Fabrication of a Hot-film Air Flow Sensor with Sapphire as Substrate
Corresponding Author: Chunlin Xu - Huazhong University of Science Technology

Statistical energy study for 28nm FDSOI devices
Corresponding Author: AZEMARD Nadine - LIRMM CNRS

Heterogenous electronic system for monitoring operational material properties
Corresponding Author: Kamil Allaf - Wroclaw University of Technology Faculty of Microsystem Electronics and Photonics

Environmental Protection by Optimum Utilization of Car Air Conditioners
Corresponding Author: Sanchita Abrol - HMR Institute of Technology and Management

Special session Simulia Software Demo Training 10:41 Tuesday April 21 2015
Chaired by
10:40 Software demo training (about 1 hour)
12:10 Lunch

Session 13 Materials Modeling 13:30 Tuesday April 21 2015
Chaired by TBD
13:30
30mn Keynote presentation - Multiscale modeling of the Anisotropic Transient Creep Response of Heterogeneous SAC Single Crystals
Corresponding Author: Abhijit Dasgupta - University of Maryland
14:00
20mn Simulation of the Deformation Behaviour of Large Thin Silicon Wafers and Comparison with Experimental Findings
Corresponding Author: Johannes Schicker - CTR Carinthian Tech Research AG
14:20
20mn Numerical Analysis of Cure Induced Residual Stress in Die Packaging
Corresponding Author: Ali Riza Rezaie Adli - TU Delft
14:40
20mn Material Characterization and Nonlinear Viscoelastic Modelling of Epoxy Based Thermosets for Automotive Application
Corresponding Author: Gromala Przemyslaw - Robert Bosch BmbH
15:00
20mn Experimental thermal and mechanical characterisation of Percolating Thermal Underfills PTU for thermally enhanced Flip-Chip packages
Corresponding Author: Uwe Zschenderlein - Technische Universität Chemnitz

Session 14 MEMS - Switches, Accelerometers, Sensors 13:30 Tuesday April 21 2015
Chaired by TBD
13:30
30mn Keynote presentation - Latching MEMS switch matrices for telecommunication applications
Corresponding Author: Dries Dellaert - CMST Ghent University - IMEC
14:00
20mn Optimal design and nonlinearities in a z-axis resonant micro-accelerometer
Corresponding Author: Alberto Corigliano - Politecnico di Milano
14:20
20mn Modelling and characterization of circular electrostatic actuators
Corresponding Author: Raffaele ardito - Politecnico di Milano
14:40
20mn Different Simulation tools to accurately design Poly-SiGe Pressure Sensors
Corresponding Author: Rochus Veronique - Imec
15:00
20mn Packaging Effects of Three-axis SOI MEMS Accelerometer
Corresponding Author: Kuo-Ning Chiang - Dept. of Power Mechanical Engineering National Tsing Hua University

Session 15 Thermo-mechanical simulations 13:30 Tuesday April 21 2015
Chaired by TBD
13:30
30mn Keynote presentation - FEA Study of Damage and Cracking Risks in BEoL Structures under Copper Wirebonding Impact
Corresponding Author: Juergen Auersperg - Fraunhofer ENAS
14:00
20mn Laser cutting of semiconductor wafers: comparing a simplified numerical approach with experiments
Corresponding Author: Michiel van Soestbergen - NXP Semiconductors
14:20
20mn Efficient Simulation of Thermo-Mechanical Stress in the On-Chip Metallization of Power Semiconductors
Corresponding Author: Gimi Pham - Robert Bosch Center for Power Electronics Reutlingen University
14:40
20mn Prediction of package delamination based on µMMT and BST experiments
Corresponding Author: Hasan Sadat Nabi - infineon
15:00
20mn The Influence of PBGAs Post-Cure Warpage Simulation Viscoelastic Material Properties and Evaluation Methodology on Accuracy of Solder Joints Damage Prediction
Corresponding Author: Marta Kuczynska - Robert Bosch GmbH

15:20 Break

Session 16 Failure mode extraction 15:40 Tuesday April 21 2015
Chaired by TBD
15:40
30mn Keynote presentation - Thermal Deformation Analysis of Automotive Electronic Control Units Subjected to Passive and Active Thermal Cycles
Corresponding Author: Bulong Wu - University of Maryland College Park
16:10
20mn Fracture Risk Assessment of Laser Marked Die by Means of Simulation and Test
Corresponding Author: Ilko Schmadlak - Freescale Halbleiter Deutschland GmbH
16:30
20mn Accelerated determination of temperature-dependent interfacial fracture toughness in microelectronic packages under cyclic loading
Corresponding Author: Emad Poshtan - Robert Bosch GmbH
16:50
20mn Simulation Driven Design of Novel Integrated Circuits -Part 1: Selection of the materials based on the Virtual DoE
Corresponding Author: ARUN SASI - Robert Bosch Engineering and Business Solutions Limited RBEI

Session 17 Solid State Lighting 15:40 Tuesday April 21 2015
Chaired by TBD
15:40
30mn Keynote presentation - Modeling of LED solder joint cracking during temperature cycling with Finite Element FE
Corresponding Author: Wenbo Yuan - Osram Opto Semiconductors GmbH
16:10
20mn Accelerated Reliability Test method for Optics in LED Luminaire Applications
Corresponding Author: Maryam Yazdan Mehr - Materials innovation istitute
16:30
20mn Lumen Maintenance Predictions for LED Packages using LM80 data
Corresponding Author: W.D. van Driel - Philips Lighting
W.D. van Driel, M. Schuld, B. Jacobs, F. Commissaris, J. van der Eyden, Philips Lighting, The Netherlands
16:50
20mn Evaluation of silicone degradation for LED packages using finite element analysis
Corresponding Author: Sung-Uk Zhang - Samsung Electronics Co.Ltd.
17:10
20mn LED’s Luminous Flux Lifetime Prediction Using a Hybrid Numerical Approach
Corresponding Author: Xuejun Fan - Lamar University

Session 18 Experimental investigations 15:40 Tuesday April 21 2015
Chaired by TBD
15:40
30mn Keynote presentation - Advanced Mixed-Mode Bending: Fracture Tests on Package Level Samples and Bi-Material Beams
Corresponding Author: Marcus Schulz - AMIC GmbH Technische Universität Chemnitz
16:10
20mn Thermal and mechanical behavior of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
Corresponding Author: Jan Albrecht - Fraunhofer Institute for Electronic Nano Systems ENAS MMC
16:30
20mn Fracture Mechanics of Thin Film Systems on the Sub-Micron Scale
Corresponding Author: Darjan Kozic - Materials Center Leoben
16:50
20mn Experimental investigation on the influence of microstructure on visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations
Corresponding Author: René Metasch - Fraunhofer Institute for Ceramic Technologies and Systems - Branch Materials Diagnostics
17:10
20mn Investigation of sensitive parameters in the structural simulation tool chain for fiber reinforced plastics in Automotive Electronic Control Units
Corresponding Author: Rongsi Wang - Bosch Automotive Products Suzhou Co. Ltd - Automotive Electronics

Special session Exhibitor and Sponsor special session 17:30 Tuesday April 21 2015
Chaired by Artur Wymyslowski, Willem van Driel
17:30 TBD
18:40 Cocktail party at venue

20:00 EuroSimE Organisers and Technical Committees meeting

Session 19 New Developments in Thermal Management, Failure and Reliability Modelling 08:30 Wednesday April 22 2015
Chaired by TBD
08:30
30mn Keynote presentation - Applications of Computational Mechanics in Stretchable Electronics
Corresponding Author: ZHAUNGJIAN LIU - Institute of High Performance Computing
09:00
30mn Keynote presentation - Design and Implementation of Spectral Power Distribution for White Light LED Packaging
Corresponding Author: Ricky Lee - Hong Kong University of Science and Technology
09:30
30mn Keynote presentation - Light Emitting Diodes and Solid State Luminaires
Corresponding Author: Pradeep Lall - Auburn University
10:00
30mn Keynote presentation - Thermal design or design for reliability?
Corresponding Author: Prof Marta Rencz - Budapest University of Technology and Economics
Prof Marta Rencz, Department of Electron Devices, Budapest University of Technology and Economics, Hungary

10:30 Break

Session 20 Solders 11:00 Wednesday April 22 2015
Chaired by TBD
11:00
30mn Keynote presentation - High-Strain Rate High Temperature Behavior of Leadfree Solders
Corresponding Author: Pradeep Lall - Auburn University
11:30
20mn Characterization and Simulation of LTCCAdhesive and Alloy42Adhesive Interface Strength for Automotive Applications
Corresponding Author: Berkan Öztürk - Robert Bosch GmbH
11:50
20mn Influence of Intermetallic Compound Growth in Lead-free Solder Joints on Thermo-mechanical Failure
Corresponding Author: Ayat CHHAIBI - IMS Bordeaux
12:10
20mn A viscoplastic-fatigue-creep-damage model for tin-based solder alloy
Corresponding Author: Benjamin Métais - Robert Bosch GmbH
12:30
20mn Validation of inelastic temperature time-dependent material model for electro-deposited Cu using optimization software
Corresponding Author: Sergey Ananiev - Infineon Technologies AG

Session 21 Multi-Scale/Physics Modelling of MEMS Devices 11:00 Wednesday April 22 2015
Chaired by TBD
11:00
30mn Keynote presentation - A multi-scale model of Micro-Mirror Array
Corresponding Author: Michel LENCZNER - FEMTO-ST Institute Departement Time and Frequency
11:30
20mn Design and Simulation of a Micro Tactile Display Device for Elasticity Range of Human Soft Tissues
Corresponding Author: Nader A. Mansour - Egypt-Japan University of Science and Technology
11:50
20mn Predicting non-fickian moisture diffusion in EMCs for application in micro-electronic devices
Corresponding Author: M. Barink - TNO
12:10
20mn A SIMPLE CONSTITUTIVE MODEL FOR DIELECTRIC CHARGING BASED ON FRENKEL-POOLE MECHANISM
Corresponding Author: Tal Rubin - Technion – Israel Institute of Technology
12:30
20mn Design of thin-film AlN actuators for 4 inches transparent plates for haptic applications
Corresponding Author: Fabrice CASSET - CEA LETI MINATEC Campus

12:50 Lunch

Special session Electronics reliability challenges for Automated Driving 13:30 Wednesday April 22 2015
Chaired by Geron Maier, EPOSS
13:30 TBD
15:30 End of conference

compiled on Tue, 27 Jan 2015 12:33:00 +0100 after template 2015_conference_program.htm