Go to Global conference schedule Technical program
| Day 1 - Monday 16 Apr 2012 | |||
| 09:00 | Opening by general Chair | ||
| 09:05 | Welcome by local organiser | ||
| 09:10 | General session: Industrial Trends | General Lecture 1: Dr. E. Fortunato - Thin Film Transistors | |
| 09:40 | General Lecture 2: Dr. K. van der Klauw - Quality of Light | ||
| 10:10 | General Lecture 3: | ||
| 10:40 | Break | ||
| 11:00 | S. 1 New developments in modeling | ||
| 12:40 | Lunch | ||
| 14:00 | S. 2 Adhesion experiments | S. 3 Molecular Dynamics | S. 4 Thermal Behavior Modeling and Characterization |
| 15:50 | Break | ||
| 16:20 | S. 5 Reliability modeling | S. 6 Process Modelling | S. 7 Electrothermal Modeling and Characterization |
| 17:50 | End of 1st day technical sessions | ||
| 18:00 | Departure by bus for dinner at Seteais Palace | ||
| Day 2 - Tuesday 17 Apr 2012 | |||
| 09:00 | S. 8 Health monitoring | S. 9 Process Modelling and MEMS Structures | S. 10 Solid State Lighting Thermal Analysis |
| 10:10 | Break | ||
| 11:00 | S. 11 Thermo-mechanical issues in microelectronics | S. 12 Multi-Physics and Thermal Issues in Microelectronics | |
| 12:20 | Lunch | ||
| 13:30 | S. 13 Experimental investigations | S. 14 MEMS Applications | S. 15 Interface simulations |
| 15:20 | Break | ||
| 16:00 | S. 16 Thermo-mechanical modeling | S. 17 Fracture Modelling and MEMS Analysis | S. 18 Solder measurements and modeling |
| 18:00 | Cocktail party at venue | ||
| Day 3 - Wednesday 18 Apr 2012 | |||
| 09:00 | S. 19 General lectures: Mixed (Title to be defined later) | ||
| 10:30 | Break | ||
| 11:00 | S. 20 Thermo-mechanics for new applications | S. 21 Solid State Lighting | |
| 12:20 | Lunch | ||
| 13:40 | S. 22 General lectures: Mixed (Title to be defined later) | ||
| 15:40 | End of conference | ||
Go to Global conference schedule Technical program
| Session 1 | 11:00 | Monday 16 Apr 2012 | |
| New developments in modeling Chairman: L.J. Ernst | |||
| 11:00 | 30mn | Keynote presentation - Thermo-Mechanical Reliability of Advanced Low-k/Copper Interconnects: Chip Package Interaction Corresponding Author: Xiao Hu Liu - IBM TJ Watson Research Center | |
| 11:30 | 30mn | Keynote presentation - Anisotropic Strain-Field-induced Change of the Electronic Conductivity of Graphene Sheets and Carbon Nanotubes Corresponding Author: Hideo Miura - Tohoku University | |
| 12:00 | 30mn | Keynote presentation - Thermal Challenges in Photonic Integrated Circuits Corresponding Author: Jeff Punch - Stokes Institute, University of Limerick | |
| Session 2 | 14:00 | Monday 16 Apr 2012 | |
| Adhesion experiments Chairman: | |||
| 14:00 | 30mn | Keynote presentation - Determination of Interface Fracture Parameters by Shear Testing Using Different Theoretical Approaches Corresponding Author: Rainer Dudek - Fraunhofer ENAS | |
| 14:30 | 20mn | Fracture Toughness Characterization and Modeling of Interfaces in Microelectronic Packages - A Status Review - Corresponding Author: Heinz Pape - Infineon Technologies AG | |
| 14:50 | 20mn | Rapid fracture-mechanical bi-material interface characterisation by using the advanced mixed-mode bending test Corresponding Author: Bernhard Wunderle - Chemnitz University of Technology | |
| 15:10 | 20mn | Interfacial fracture toughness measurements in Microelectronic Packages with different test setups on samples from production Corresponding Author: Ingrid Maus - Infineon Technologies AG | |
| 15:30 | 20mn | Establishing the Interfacial Fracture Properties of Cu-EMC Interfaces at Harsh Condition Corresponding Author: Mahdi Sadeghinia - Delft University of Technology | |
| Session 3 | 14:00 | Monday 16 Apr 2012 | |
| Molecular Dynamics Chairman: | |||
| 14:00 | 30mn | Keynote presentation - Transport of moisture at Epoxy-SiO2 interfaces investigated by Molecular Modeling Corresponding Author: Ole Hölck - Fraunhofer IZM | |
| 14:30 | 20mn | Study of CNT Growth Termination Mechanism: Effect of Catalyst Diffusion Corresponding Author: Zhaoli GAO - The Hong Kong University of Science and Technology | |
| 14:50 | 20mn | Sintering process of silver nanoparticles in ink-jet printed conductive microstrucutres - molecular dynamics approach Corresponding Author: Tomasz Fałat - Wrocław University of Technology | |
| 15:10 | 20mn | Wettability of organic ferroelectric material on metal substrate Corresponding Author: William Hua - Hong Kong University of Science & Technology | |
| 15:30 | 20mn | Molecular modeling of polymer–gas interactions in polyaniline based carbon dioxide sensor Corresponding Author: Xianping CHEN - Delft University of Technology | |
| Session 4 | 14:00 | Monday 16 Apr 2012 | |
| Thermal Behavior Modeling and Characterization Chairman: | |||
| 14:00 | 30mn | Keynote presentation - Thermal Modelling and Optimisation of Hot Solder Dip Process Corresponding Author: Stoyan Stoyanov - University of Greenwich | |
| 14:30 | 20mn | Thermal performances evaluation of new high temperature power packages using SiC devices Corresponding Author: Ludi ZHANG; Stéphane AZZOPARDI ; Alexandrine GUEDON-GRACIA; Eric WOIRGARD - IMS Laboratory | |
| 14:50 | 20mn | THERMAL MODELING OF ACTIVE EMBEDDED CHIP INTO HIGH DENSITY ELECTRONIC BOARD Corresponding Author: MONIER VINARD ERIC - Thales global services | |
| 15:10 | 20mn | Simulation of the frequency response of a thermal flow sensor in gaseous media Corresponding Author: Diego Fernando Reyes Romero - Laboratory for Sensors, IMTEK, University of Freiburg | |
| Session 5 | 16:20 | Monday 16 Apr 2012 | |
| Reliability modeling Chairman: | |||
| 16:20 | 30mn | Keynote presentation - Effects of TSV-Interposer Warpage on Thermal and Mechanical Reliability Corresponding Author: John H Lau - ITRI | |
| 16:50 | 20mn | Failure Modeling of BGA Package and LCD Module for Reliability Evaluation of Handheld Device Corresponding Author: Soonwan Chung - Samsung Electronics Co., Ltd. | |
| 17:10 | 20mn | Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation Corresponding Author: Dr. Reinhard Pufall - Infineon Technologies AG | |
| 17:30 | 20mn | Thermo-Mechanical Investigation of the Reliability of Embedded Components in PCBs during Processing and under Bending Loading Corresponding Author: Sander Noijen - Bilim Atli-Veltin - Philips Research | |
| Session 6 | 16:20 | Monday 16 Apr 2012 | |
| Process Modelling Chairman: | |||
| 16:20 | 30mn | Keynote presentation - Multiphysics Modelling of Electroactive Hydrogels Corresponding Author: Nicolas Cordero - Tyndall National Institute, University College Cork | |
| 16:50 | 20mn | Simulation of diffusion controlled intermetallic formation of Au/Al interface Corresponding Author: Rui Huang - Infineon Technologies AG | |
| 17:10 | 20mn | A Model of Electric Field Assisted Capillarity for the Fabrication of Hollow Polymer Microstructures Corresponding Author: Catherine E. H. Tonry - School of Computing and Mathematical Sciences, University of Greenwich | |
| 17:30 | 20mn | Influence of Liner Materials on the Mechanical Stress and Migration in a Copper Metallization Corresponding Author: Jörg Kludt - Leibniz Universität Hannover, Information Technology Laboratory | |
| Session 7 | 16:20 | Monday 16 Apr 2012 | |
| Electrothermal Modeling and Characterization Chairman: | |||
| 16:20 | 30mn | Keynote presentation - Transient Electrothermal Simulation of Interconnected Systems Corresponding Author: Torsten Hauck - Freescale Halbleiter GmbH | |
| 16:50 | 20mn | Effect of Source Metallization Ageing on Power MOSFET Behavior Corresponding Author: Toufik AZOUI - LAAS-CNRS | |
| 17:10 | 20mn | Electro-thermal Simulation of a Semiconductor Power Switch Considering Damage Effects Corresponding Author: Torsten Hauck - Freescale Halbleiter Deutschland GmbH | |
| 17:30 | 20mn | Thermal Management for stackable package with stacked ICs Corresponding Author: Lutz Meinshausen - Leibniz Universität Hannover, Information Technology Laboratory | |
| Session 8 | 09:00 | Tuesday 17 Apr 2012 | |
| Health monitoring Chairman: | |||
| 09:00 | 30mn | Keynote presentation - INTERROGATION OF THERMO-MECHANICAL DAMAGE IN FIELD-DEPLOYED ELECTRONICS Corresponding Author: Pradeep Lall - Auburn University | |
| 09:30 | 20mn | Stress Chip Measurements of Internal Package Stresses for Process Characterization and Health Monitoring Corresponding Author: Sven Rzepka - Fraunhofer ENAS, Micro Materials Center | |
| 09:50 | 20mn | An approach to life consumption monitoring of solder joints under field temperature conditions Corresponding Author: ILJA BELOV - School of Engineering, Jönköping University | |
| Session 9 | 09:00 | Tuesday 17 Apr 2012 | |
| Process Modelling and MEMS Structures Chairman: | |||
| 09:00 | 30mn | Keynote presentation - Studies on the transitional behaviors of Au-to-Au micro-contact during the initialization stage of contact formation under low contact force Corresponding Author: Qiu Haodong - Nanyang Technological University | |
| 09:30 | 20mn | Reliability and Functionality Investigation of CFRP Embedded Ultrasonic Transducers supported by FEM and EFIT Simulations Corresponding Author: Mike Roellig - Fraunhofer Institute for Nondestructive Testing | |
| 09:50 | 20mn | Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards Corresponding Author: Hassene Fridhi - IMS-Bordeaux | |
| Session 10 | 09:00 | Tuesday 17 Apr 2012 | |
| Solid State Lighting Thermal Analysis Chairman: | |||
| 09:00 | 30mn | Keynote presentation - LED Driver Thermal Design Considerations for Solid-State Lighting Technologies Corresponding Author: Xavier Perpiñà Giribet - IMB-CNM (CSIC) | |
| 09:30 | 20mn | Thermal resistance investigations on new leadframe-based LED packages and boards Corresponding Author: PARDO Benjamin - CEA-Léti | |
| 09:50 | 20mn | Dynamic thermal simulation of high brightness LEDs with unsteady driver power output Corresponding Author: Huaiyu Ye - TUDelft | |
| Session 11 | 11:00 | Tuesday 17 Apr 2012 | |
| Thermo-mechanical issues in microelectronics Chairman: Kaspar Jansen, Heinz Pape | |||
| Evaluation of quasi-hermetic packaging solutions for active microwave devices and space applications Corresponding Author: Walim BEN NACEUR - LABORATOIRE IMS, CNRS, UNIVERSITE BORDEAUX 1, IPB | |||
| Effect of Isothermal Aging and Salt Spray Tests on Reliability and Mechanical Strength of Eutectic Sn-Bi Lead-Free Solder Joints Corresponding Author: Milad Mostofizadeh - Tampere University of Technology | |||
| An Extensive Investigation of the Four Point Bending Test for Interface Characterization Corresponding Author: Sander Noijen - Philips Research | |||
| Shear stress modelling of ACA joints in thermal tests Corresponding Author: Kirsi Saarinen - Tampere University of Technology | |||
| Evaluation of Very Low Bending Radius of Flexible Circuits beyond the Standard Rules Corresponding Author: Wilson Maia - Thales Global Services | |||
| Drop test finite element simulation of a Chip Scale Package reliability: focus on the component architecture and materials Corresponding Author: BELHENINI Soufyane - Ecole Polytechnique de l\'Université de Tours | |||
| In situ vibration measurements on power modules under operating conditions Corresponding Author: Bernhard CZERNY - University of Vienna, Faculty of Physics | |||
| Preliminaries studies the parameters for thermal and residual stress simulation of Nd:YAG laser shin sheet metal welding by seam mode Corresponding Author: Chansopheak SEANG - Institut National des Sciences Appliquées (INSA de Rennes) | |||
| Modelling of power devices under repetitive power pulsing supported by materials characterization through nanoindentation Corresponding Author: Pasquale Vena - Politecnico di Milano | |||
| A NOVEL WAFER -LEVEL TEST METHOD TO MEASURE THE BOND STRENGTH IN MICROELECTRONIC MATERIALS Corresponding Author: Sara Carniello - Austriamicrosystems AG | |||
| Accelerated lifetime measurements of Cu-Al ball bonded interconnects Corresponding Author: Dr. Golta Khatibi - University of Vienna, Faculty of Physics | |||
| Cu/Epoxy Interface Enhancement and Characterization with Thiol Treatment Corresponding Author: Peng He - The Hong Kong University of Science and Technology | |||
| Board level reliability comparison of leadframe packages: QFN, TLA and HLA Corresponding Author: Yang Yongbo - United test and assembly center Ltd | |||
| Parameter optimization of torque wireless sensors based on surface acoustic waves (SAW) Corresponding Author: Jürgen Wilde, Thomas Fellner, Elena Zukowski - University of Freiburg-IMTEK, Department of Microsystems Engineering, Laboratory for Assembly and Packaging | |||
| Lifetime assessment of BGA solder joints with voids under thermomechanical load Corresponding Author: Robert Schwerz - TU-Dresden | |||
| Humidity Effects on the Fatigue of Fiber Reinforced Polymers in Micro/Nano Functional Systems Corresponding Author: Sven Rzepka - Micro Materials Center at Fraunhofer ENAS | |||
| A multivariate parameter analysis of copper pillars eases the design of denser interconnects. Corresponding Author: Gerd Schlottig - IBM Research GmbH | |||
| FEM Stress Analysis in BGA Components Subjected to Jedec Drop Test Applying High Strain Rate Lead-Free Solder Material Models Corresponding Author: Frank Kraemer - University of Saarland | |||
| Simulation and Qualification of an System-in-Package (SiP) based Solid State Lighting (SSL) module Corresponding Author: Dr. Daniel Farley - TU Delft | |||
| 3D deformation FEM simulations and measurement during VDMOS transistor operation Corresponding Author: MARCAULT Emmanuel - LAAS-CNRS | |||
| Investigation of Interface Delamination in a SO8 Package under Reflow Corresponding Author: Yong Liu - Fairchild Semiconductor Corp. | |||
| RELIABILITY MODELING OF ELECTRONIC SYSTEMS SUBJECTED TO HIGH STRAIN RATES Corresponding Author: Pradeep Lall - Auburn University | |||
| Nonlinear Analyses of Semi-Embedded Through-Silicon Via (TSV) Interposer with Stress Relief Gap Under Thermal and Shock Conditions Corresponding Author: John H Lau - ITRI | |||
| Finite Element Modeling of Solder Joint Fatigue under Four-Point Bending Test at Elevated Temperature Corresponding Author: Baris Sabuncuoglu - IMEC | |||
| Characterization of Adhesives and Interface Strength for Automotive Applications Corresponding Author: Berkan Oeztuerk - Robert Bosch GmbH, Automotive Electronics | |||
| Experimental system for analysing the combined loading and failure modes of solder joints in electronic packaging Corresponding Author: Krystian Jankowski - Wroclaw University of Technology | |||
| Trends and challenges in Lead Free Soldering Corresponding Author: Eduardo Dias Lopes - ISQ | |||
| Session 12 | 11:00 | Tuesday 17 Apr 2012 | |
| Multi-Physics and Thermal Issues in Microelectronics Chairman: Kaspar Jansen, Heinz Pape | |||
| Consideration of dielectric passivation for hermetic BCB cap package based on FEM simulation Corresponding Author: Seonho Seok - IEMN CNRS | |||
| Thermal Improvement of Die Attach with Iodine Treat-ment and Its Application in Solid State Lighting Corresponding Author: Kai Zhang - The Hong Kong University of Science and Technology | |||
| 3D Electrostatic Microgenerator Corresponding Author: Janicek Vladimir - FEE CTU in Prague, Department of Microelectronics | |||
| Establishment of the Mesoscale parameters for epoxy-copper Interfacial Separation Corresponding Author: Cell K Y Wong - Delft University of Technology | |||
| 2D finite elements electro-thermal modeling for IGBT: uni and multicellular approch Corresponding Author: EL BOUBKARI Kamal - Laboratoire IMS | |||
| Influence of conversion level on simulation results of crosslinked polymers Corresponding Author: Sebastian J. Tesarski - Wrocław University of Technology | |||
| Stress analysis of LED bulb under thermal and humid environment Corresponding Author: Lily Liang - Guilin University of electronic technology | |||
| Effect of Temperature and Moisture on LED Lamp Reliability Corresponding Author: Dongjing Liu - Guilin University of Electronic Technology | |||
| Multi-physics Simulation and Reliability Analysis for LED Lamp under Step Stress Accelerated Degradation Test Corresponding Author: Hongyu Tang - Guilin University of Electronic Technology | |||
| Life-Prediction of LED Bulb Based on Step-Stress Accelerated Degradation Test Corresponding Author: Wanchun Tian - Guilin University of Electronic Technology | |||
| The Method of Lines for the Analysis of Mechanical Structures Corresponding Author: Larissa Vietzorreck - TU Munich | |||
| Thermosonic Flip-chip Assembly on Flex Substrates Corresponding Author: Guangbin Dou - Imperial College London | |||
| Reliability Assessment of LED Luminaire Based on Step-stress Accelerated Degradation Test Corresponding Author: Rongbin Ren - Guilin University of Electronic Technology | |||
| Mechanical and tribological characterizations for reliability design of micromembranes Corresponding Author: Pustan Marius - Technical University of Cluj-Napoca | |||
| Thermal and moisture degradation in SSL system Corresponding Author: S. koh - Delft University of Technology | |||
| Simulation Based Thermal Optimization and Compact Modelling of CSP IC Device in Handheld and MCM IC Device in Wireless Router System Environment Corresponding Author: Ore Siew Hoon - United Test and Assembly Center Ltd | |||
| Investigation of Chip Temperature Related to Various Copper Thickness on Glass-Fabric-Based Substrate Corresponding Author: Chen-Chia Chen - National Chip Implementation Center | |||
| Viscoplastic behavior of diamond die attach subjected to high temperature conditions Corresponding Author: Ahlem BAAZAOUI - Laboratoire Génie de Production à l\'Ecole Nationale d\'Ingénieurs de Tarbes | |||
| Modelling of temperature distribution in thermal microsensors on sandwich thermally isolated structures Corresponding Author: Alexander Kozlov - Omsk State University | |||
| MEMS Accelerometers and their Bio-Applications Corresponding Author: Willem D. van Driel - Delft University of Technology | |||
| A Costeffictive Active Cooling Method: Thermal Performance and Cost Analysis of Power Electronic Devices Using Micro Pump Corresponding Author: Sheng Liu - Huazhong University of Science and Technology | |||
| Enhancement of Photovoltaics Electrical Performance through Thermal Management Corresponding Author: Peter Rodgers, Valerie Eveloy, Shrinivas Bojanampati - The Petroleum Institute Peter Rodgers, Valérie Eveloy, Shrinivas Bojanampati, The Petroleum Institute, Abu Dhabi, United Arab Emirates | |||
| Experimental Characteristics of Moisture Absorption and Desorption in Conductive Adhesives and Epoxy Mold Compounds Corresponding Author: Xuejun Fan - Lamar University | |||
| Experimental system for analysis of heat dissipation due to energy efficiency in electronic packaging Corresponding Author: Ryszard Świerczyński - Wroclaw University of Technology | |||
| Session 13 | 13:30 | Tuesday 17 Apr 2012 | |
| Experimental investigations Chairman: | |||
| 13:30 | 30mn | Keynote presentation - Wafer Level Integration and Reliability Consideration of Solid State Lighting (SSL) System Corresponding Author: Xuejun Fan - Lamar University | |
| 14:00 | 20mn | Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics Corresponding Author: Katrin Unterhofer - Infineon Technologies AG | |
| 14:20 | 20mn | In-Situ characterization of moisture induced swelling behaviour of microelectronic relevant polymers Corresponding Author: Dr. Hans Walter - Fraunhofer IZM | |
| 14:40 | 20mn | Transient thermal analysis as failure analytical tool in electronic packaging Corresponding Author: Daniel May - Technical University Chemnitz | |
| 15:00 | 20mn | Combined creep and fatigue measurement method for lead-free solder alloys Corresponding Author: René Metasch - Fraunhofer Institute for Non-Destructive Testing | |
| Session 14 | 13:30 | Tuesday 17 Apr 2012 | |
| MEMS Applications Chairman: | |||
| 13:30 | 30mn | Keynote presentation - Consistent Analytical Model for Single and Dual Thickness Capacitive Micromachined Ultrasound Transducers (cMUT) Corresponding Author: Xavier Rottenberg - IMEC | |
| 14:00 | 20mn | Optimized Design and Placement of Piezoelectric Transducers for Micromechanical Structures Subjected to Membrane Stresses Corresponding Author: Guilherme Brondani Torri - IMEC | |
| 14:20 | 20mn | Study of an active thermal recovery mechanism for an electrostatically actuated RF-MEMS switch Corresponding Author: Thomas Künzig - Munich University of Technology | |
| 14:40 | 20mn | EXPERIMENTAL AND NUMERICAL ASSESSMENT OF ADHESION IN REAL-LIFE MEMS Corresponding Author: Raffaele Ardito - Politecnico di Milano | |
| 15:00 | 20mn | A Parametric Multilevel MEMS Simulation Methodology using Finite Element Method and Mesh Morphing Corresponding Author: Vladimir A. Kolchuzhin - Chemnitz University of Technology, Department of Microsystems and Precision Engineering | |
| Session 15 | 13:30 | Tuesday 17 Apr 2012 | |
| Interface simulations Chairman: | |||
| 13:30 | 30mn | Keynote presentation - Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface (Part III): Interface Roughness Corresponding Author: Nancy Iwamoto - Honeywell Specialty Materials | |
| 14:00 | 20mn | Nonlinear Copper Behavior of TSV and the Cracking Risks during BEoL-Built-up for 3D-IC-Integration Corresponding Author: Juergen Auersperg - Fraunhofer ENAS | |
| 14:20 | 20mn | Cohesive zone model for delamination analysis of an embedded die system in package Corresponding Author: Yong Liu - Fairchild Semiconductor Corp. | |
| 14:40 | 20mn | Investigation on the Effect of Surface Roughness on the Fracture Strength of SCS Corresponding Author: Kuo-Ning Chiang - Dept. of Power Mechanical Engineering National Tsing Hua University | |
| 15:00 | 20mn | A simplified and meaningful crack propagation model in silicon for microelectronic power devices Corresponding Author: Calvez Damien - STMicroelectronics | |
| Session 16 | 16:00 | Tuesday 17 Apr 2012 | |
| Thermo-mechanical modeling Chairman: | |||
| 16:00 | 20mn | Keynote presentation - Weibull Stress Analysis for Failure of Semiconductor Package Corresponding Author: Hideo Aoki, Kanako Sawada - Toshiba | |
| 16:20 | 20mn | Multiscale modeling of residual stresses in isotropic conductive adhesives with nano particles Corresponding Author: Muge Erinc - TNO Science and Industry | |
| 16:40 | 20mn | Testing and Multiscale Modeling of Drop and Impact Loading of Complex MEMS Microphone Assemblies Corresponding Author: Jingshi Meng - University of Maryland | |
| 17:00 | 20mn | Simulations of High Temperature Pressure Sensor Packaging and Interconnections Corresponding Author: Klas Brinkfeldt - Swerea IVF | |
| 17:20 | 20mn | Assessment of thermo-mechanical stresses in Low Temperature Joining Technology Corresponding Author: Thomas Herboth - Robert Bosch GmbH | |
| Session 17 | 16:00 | Tuesday 17 Apr 2012 | |
| Fracture Modelling and MEMS Analysis Chairman: | |||
| 16:00 | 30mn | Keynote presentation - A domain decomposition method for the simulation of fracture in polysilicon MEMS Corresponding Author: Alberto Corigliano - Politecnico di Milano | |
| 16:30 | 20mn | PZT piezoelectric coefficient extraction by PZT-actuated micro-beam characterization and modeling Corresponding Author: Fabrice Casset - CEA-LETI, MINATEC Campus | |
| 16:50 | 20mn | Simulation of thermo-elastic losses in a meta-material bulk bar resonator Corresponding Author: Roelof Jansen - IMEC | |
| 17:10 | 20mn | Using an Electro-Thermo-Fluidic Model for the Design of a 3-Axis Thermal Accelerometer Corresponding Author: Luis Alexandre Machado da Rocha - University of Minho | |
| Session 18 | 16:00 | Tuesday 17 Apr 2012 | |
| Solder measurements and modeling Chairman: | |||
| 16:00 | 30mn | Keynote presentation - Characterisation of Lead-free Solders at High Strain Rates Considering Microstructural Conditions Corresponding Author: Karsten Meier - TU Dresden, Electronics Packaging Laboratory | |
| 16:30 | 20mn | A Comparison of the Creep Behaviour of Joint-Scale SAC105 and SAC305 Solder Samples under Shear Conditions. Corresponding Author: Cillian Burke - CTVR Stokes Institute | |
| 16:50 | 20mn | Characterization of intermetallic compounds in Cu-Al ball bonds: thermo- mechanical properties, delamination and corrosion sensitivity Corresponding Author: Marcel Kouters - TNO Technical Sciences | |
| 17:10 | 20mn | Simulation-based predicition of reliability and robustness of interconnect systems for semiconductor applications Corresponding Author: Markus Ackermann - X-FAB Semiconductor Foundries AG | |
| 17:30 | 20mn | Influence of voids on thermo-mechanical performance of lead free LGA solder joints in SSL systems Corresponding Author: Guo Qi Zhang - M2i | |
| Session 19 | 09:00 | Wednesday 18 Apr 2012 | |
| General lectures: Mixed (Title to be defined later) Chairman: | |||
| 09:00 | 30mn | Keynote presentation - Prospects for Waste Heat Recovery in Microelectronic Systems Corresponding Author: Peter Rodgers, Valérie Eveloy - The Petroleum Institute, Abu Dhabi | |
| 09:30 | 30mn | Keynote presentation - LED-related, tittle will follow Corresponding Author: Pr BongTae Han - Universirty of Maryland | |
| 10:00 | 30mn | Keynote presentation - Comparison of Ni- and SiGe-based MEMS Magnetometers Corresponding Author: Veronique Rochus - IMEC | |
| Session 20 | 11:00 | Wednesday 18 Apr 2012 | |
| Thermo-mechanics for new applications Chairman: | |||
| 11:00 | 30mn | Keynote presentation - Mechanical Problems of novel Back Contact Solar Modules Corresponding Author: Steffen Wiese - Saarland University | |
| 11:30 | 20mn | GaN Growth on Patterned Silicon Substrates. A thermo mechanical study on wafer bow reduction Corresponding Author: Mario Gonzalez - IMEC | |
| 11:50 | 20mn | A “critical parameter sheet” like approach to optimize complex LED lighting systems Corresponding Author: Sander Gielen - TNO Eindhoven | |
| 12:10 | 20mn | Thermo-mechanical Characterization and Modeling of TSV Annealing Corresponding Author: Peter Saettler - Technical University Dresden | |
| 12:30 | 20mn | Thermo-mechanical reliability of embedded capacitors Corresponding Author: Antoine RENAULT - EADS Innovation Works | |
| Session 21 | 11:00 | Wednesday 18 Apr 2012 | |
| Solid State Lighting Chairman: | |||
| 11:00 | 30mn | Keynote presentation - Thermo-mechanical evaluation and life time simulation of a high power LED lamp boards Corresponding Author: Jiri Jakovenko - Czech Technical University in Prague, Faculty of Electrical Engineering | |
| 11:30 | 20mn | A Comparison Study of the Prognostics Approaches to Light Emitting Diodes Based on Accelerated Ageing Corresponding Author: Chris Bailey - University of Greenwich | |
| 11:50 | 20mn | Modelling lead free solder reliability in SSL applications towards virtual design Corresponding Author: Rene Kregting - TNO | |
| 12:10 | 20mn | Polymer-based 2D/3D wafer level heterogeneous integration for SSL module Corresponding Author: Cadmus Yuan - Netherlands Organisation for Applied Scientific Research (TNO) | |
| 12:30 | 20mn | Accelerated Testing Method of LED Luminaries Corresponding Author: Miao Cai - Guilin University of Electronic Technology, Guilin, China | |
| Session 22 | 13:40 | Wednesday 18 Apr 2012 | |
| General lectures: Mixed (Title to be defined later) Chairman: | |||
| 13:40 | 30mn | Keynote presentation - Reliability Modeling for Electronic Packages Corresponding Author: Yi-Shao Lai - ASE | |
| 14:10 | 30mn | Keynote presentation - Numerical modelling of anchor losses in MEMS resonators Corresponding Author: Frangi Attilio - Politecnico di Milano | |
End of programme