Final program

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Day 1 - Monday 21 Apr 2008
08:00	Registration
09:00	Opening session
09:10	Industry Keynotes session 9:10 Thijs Viegers, Senior director - Chief Technology Officer, Philips Applied Technologies, Eindhoven, The Netherlands: Challenges for SiP Product Creation 9:40 Michel Despont, Manager of Nano- & Microfabrication in IBM Zurich Research Lab, Switzerland: More than Moore by (N)MEMS on CMOS 10:10 Georg Meyer-Berg, Infineon Technologies, Munich, Germany: Future Packaging Trends
10:40	Coffee break
11:10	S 1  New developments in modeling
12:40	Lunch
14:00	S 2  IC-package modeling	S 3  Multi-physics modeling for MEMS	S 4  Thermal Behavior Modeling and Characterization
15:50	Coffee break
16:30	S 5  Solder reliability	S 6  Fluid-mechanical interactions	S 7  Advances in thermo-mechanical modeling
18:00	End of first day technical sessions
19:30	Dinner downtown in Historisches Kaufhaus
Day 2 - Tuesday 22 Apr 2008
08:30	S 8  Molecular modeling in micro-electronics	S 9  Numerical modeling for magnetic MEMS	S 10  Thermo-mechanical qualification modeling
09:40	Coffee break
10:00	S 11  Poster session - Thermomechanical issues in microelectronics	S 12  Poster session - Thermal and multi-physics issues in microelectronics
11:20	S 13  Board and System Level Thermal Analysis	S 14  Polymer physics	S 15  Interface delamination modeling and characterisation
12:30	Lunch
14:00	S 16  Process modeling	S 17  Innovative methods for micro-systems modeling	S 18  Dynamics modeling and testing
15:30	Annual meeting of EuroSimE Organising Committee	Coffee break
16:00	Special Exhibitors session
17:30	Cocktail party
Day 3 - Wednesday 23 Apr 2008
08:30	S 19  New Developments - I
10:00	Coffee break
10:30	S 20  Experimental mechanics for micro-electronics	S 21  Ion transport and electro-migration
12:20	Lunch
14:00	S 22  New Developments - II
16:00	End of conference

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors

List of Technical Sessions
S-1 New developments in modeling
S-2 IC-package modeling
S-3 Multi-physics modeling for MEMS
S-4 Thermal Behavior Modeling and Characterization
S-5 Solder reliability
S-6 Fluid-mechanical interactions
S-7 Advances in thermo-mechanical modeling
S-8 Molecular modeling in micro-electronics
S-9 Numerical modeling for magnetic MEMS
S-10 Thermo-mechanical qualification modeling
S-11 Poster session - Thermomechanical issues in microelectronics
S-12 Poster session - Thermal and multi-physics issues in microelectronics
S-13 Board and System Level Thermal Analysis
S-14 Polymer physics
S-15 Interface delamination modeling and characterisation
S-16 Process modeling
S-17 Innovative methods for micro-systems modeling
S-18 Dynamics modeling and testing
S-19 New Developments - I
S-20 Experimental mechanics for micro-electronics
S-21 Ion transport and electro-migration
S-22 New Developments - II

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors

08:00

Registration

09:00

Opening session

09:10

Industry Keynotes session

10:40

Coffee break

Session 1		11:10	Monday 21 Apr 2008
New developments in modeling Chaired by L.J. Ernst, Delft University of Technology - W. van Driel, NXP Semiconductors
11:10	30mn abstract	Keynote presentation - Modeling and Characterization of Interfaces - from an Atomistic Description to a Continuum Approach Jianmin Qu, Remi Dingreville, Georgia Tech
11:40	30mn abstract	Keynote presentation - Energy Efficient Liquid Cooling Jeff Punch, CTVR, Stokes Institute, University of Limerick, Limerick, Ireland
12:10	30mn abstract	Keynote presentation - Multi-physics simulation and reliability analysis for RF-MEMS devices X. Rottenberg 1, P. Czarnecki 1, H. A. C. Tilmans 2, W. De Raedt 2, I. De Wolf 1 1 IMEC, KULeuven 2 IMEC

12:40

Lunch

Session 2		14:00	Monday 21 Apr 2008
IC-package modeling Chaired by R. Dudek, Fraunhofer Institute IZM - J. Wilde, IMTEK
14:00	30mn abstract	Keynote presentation - Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies Bart Vandevelde, Chukwudi Okoro, Mario Gonzalez, Bart Swinnen, Eric Beyne, IMEC, Leuven, Belgium
14:30	20mn abstract	Effect of Package Type in IC-Package Stress Interaction Design Rules W.D. van Driel 1, D.G. Yang 2, G.Q. Zhang 1 1 NXP Semiconductors, TU Delft 2 NXP Semiconductors
14:50	20mn abstract	Predictive Models for μBGA and QFN Reliability Estimation Juergen Wilde, Elena Zukowski, Department of Microsystems Engineering, University of Freiburg, Freiburg, Germany
15:10	20mn abstract	Chip-Package Interactions: Some Investigations On Copper/Low-k Interconnect Delaminations Vincent Fiori, Sébastien Gallois-Garreignot, Clément Tavernier, Hervé Jaouen, André Juge, STMicroelectronics
15:30	20mn abstract	A new on chip nanomechanical testing concept applied to ductile and brittle thin film materials Asmahan Safi, Samer Houri, Michaël Coulombier, Sébastien Gravier, Nicolas André, Thomas Pardoen, Jean-Pierre Raskin, Université catholique de Louvain

Session 3		14:00	Monday 21 Apr 2008
Multi-physics modeling for MEMS Chaired by M. Biesheuvel, Delft University - E. Dermitzaki, Fraunhofer IZM
14:00	30mn abstract	Keynote presentation - Fluidic-electrostatic-mechanical modeling of the dynamic response of RF-MEMS capacitive switches Jeroen Bielen 1, Jiri Stulemeijer 1, Deepak Ganjoo 2, Dale Ostergaard 2, Sander Noijen 3 1 NXP Semiconductors 2 Ansys Inc. 3 Philips, Applied Technologies
14:30	20mn abstract	A Perturbation Finite Element Method for Modeling Electrostatic MEMS without Remeshing Mohamed Boutaayamou 1, Ruth V. Sabariego 1, Patrick Dular 2 1 Department of Electrical Engineering and Computer Science, University of Liège, Belgium. 2 Department of Electrical Engineering and Computer Science, University of Liège, FNRS, Belgium.
14:50	20mn abstract	Electromechanical Resonator Detection Enhancement by the Use of a Movable Electrode Casset F. 1, Durand C. 2, Buchaillot L. 2, Ollier E. 1, Ancey P. 3, Aïd M. 1 1 CEA-LETI, MINATEC, Grenoble, France 2 IEMN/ISEN, Lille, France 3 STMicroelectronics, Crolles, France
15:10	20mn abstract	A New Methodology For RF MEMS Contact Simulation D. Peyrou, F. Coccetti, F. Pennec, H. Achkar, P. Pons, R. Plana, LAAS CNRS
15:30	20mn abstract	Modeling of Smart Compliant Electro-Active Polymer Actuator S. Soulimane, M. Al Ahmad, M. Matmat, H. Camon, LAAS-CNRS

Session 4		14:00	Monday 21 Apr 2008
Thermal Behavior Modeling and Characterization Chaired by P. Rodgers, The Petroleum Institute - J. Punch, University of Limerick
14:00	30mn abstract	Keynote presentation - Effectively Modeling the Thermal Behavior of Trench-Isolated Bipolar Transistors Ilaria Marano, Vincenzo d'Alessandro, Niccolò Rinaldi, Department of Electronics and Telecommunications Engineering, University of Naples "Federico II", via Claudio 21, 80125 Naples
14:30	20mn abstract	Effective thermal modeling of discretes under peak-pulsed power loading by sub-domain consideration. Sander Noijen, Erik Eggink, Philips Applied Technologies, Eindhoven, The Netherlands
14:50	20mn abstract	New method of dynamic Compact Thermal Model extraction W. Habra 1, P. Tounsi 2, F. Madrid 2, J-M. Dorkel 2 1 University of Aleppo, Faculty of Electronics Engineering. Aleppo, Syria 2 LAAS-CNRS, Université de Toulouse, Toulouse, France.
15:10	20mn abstract	Thermal Analysis Automation System for Semiconductor Package Yuanxiang Zhang 1, Lihua Liang 1, Yangjian Xia 1, Yong Liu 2, Scott Irving 2, Timwah Luk 2 1 Fairchild-ZJUT Joint Lab, Zhejiang University of Technology, Hangzhou China 2 Fairchild Semiconductor Corp., S. Portland, ME, USA
15:30	20mn abstract	Aluminum-Nitride Thin-Film Heatspreaders Integrated in Bipolar Transistors Luigi La Spina 1, Ilaria Marano 2, Vincenzo d'Alessandro 2, Hugo Schellevis 1, Lis K. Nanver 1 1 Delft University of Technology, Delft, The Netherlands 2 University of Naples Federico II, Naples, Italy

15:50

Coffee break

Session 5		16:30	Monday 21 Apr 2008
Solder reliability Chaired by P. Lall, Auburn University
16:30	30mn abstract	Keynote presentation - Simulation Based Analysis of Secondary Effects on Solder Fatigue Rainer Dudek, Ralf Doering, Christine Bombach, Bernd Michel, FhG-IZM, MMCB
17:00	20mn abstract	Creep Measurements on SnAgCu Solder Joints in Different Compositions and after Mechanical and Thermal Treatment Mike Roellig, Steffen Wiese, Karsten Meier, Klaus-Jürgen Wolter, Dresden University of Technology
17:20	20mn abstract	Effect of Primary Creep Behavior on Fatigue Damage Accumulation Rates in Accelerated Thermal Cycling of Sn3.0Ag0.5Cu Pb-Free Interconnects Gayatri Cuddalorepatta, Abhijit Dasgupta, CALCE Electronic Products and Systems Center, University of Maryland, USA
17:40	20mn abstract	Can temperature shock tests speed up development of reliable components for automotive applications Dr. Reinhard Pufall, Dr. Werner Kanert, Infineon Technologies AG Munich

Session 6		16:30	Monday 21 Apr 2008
Fluid-mechanical interactions Chaired by R. van Silfhout, Philips Applied Technologies
16:30	30mn abstract	Keynote presentation - A Wide Pressure Range Estimate of Gas Damping in Polysilicon Inertial MEMS Devices Attilio Frangi, Department of Structural Engineering, Politecnico di Milano, Milano, Italy Aldo Ghisi, Department of Structural EngineDepartment of Structural Engineering, Politecnico di Milano, Milano, Italy
17:00	20mn abstract	Online Fluid-Monitoring using an electromechanical Cantilever Mario Jungwirth, University of Applied Sciences Upper Austria, Campus Wels
17:20	20mn abstract	Sensitivity-Maximizing and Error-Reducing Design of a Flow and Thermal Property Sensor Cubukcu, Ali Sukru, Urban, Gerald A., IMTEK / University of Freiburg, Freiburg, Germany
17:40	20mn abstract	Cavitation instability in the plastic IC packaging material due to moisture-induced vapor pressure and thermal stress Li Zhigang, Niu Xiaoyan, Ma Yong, Shu Xuefeng, Yang Guitong, Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology, Taiyuan, PR China

Session 7		16:30	Monday 21 Apr 2008
Advances in thermo-mechanical modeling Chaired by A. Corigliano, Politecnico di Milano - A. Wymyslowski, Wroclaw University
16:30	30mn abstract	Keynote presentation - Mechanics of Moisture for Polymers: Fundamental Concepts and Model Study Xuejun Fan, Department of Mechanical Engineering, Lamar University, Beaumont, Texas, USA; Department of Engineering Mechanics, South China U
17:00	20mn abstract	Modeling and improvement of a metallization system subjected to fast temperature cycle stress Tobias Smorodin 1, Christina Bohm 1, Joao Gaspar 2, Marek Schmidt 2, Oliver Paul 2, Matthias Stecher 1 1 Infineon Technologies AG 2 IMTEK, University of Freiburg
17:20	20mn abstract	Prediction of Wafer Bow through Thermomechanical Simulation of Patterned Hard Coated Copper Films Javad Zarbakhsh 1, Thomas Detzel 2, Rui Huang 1, Markus Leicht 2, Peter Nelle 3, Stefan Woehlert 2 1 KAI – Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, Villach, Austria 2 Infineon Technologies Austria AG, Villach, Austria 3 Infineon Technologies AG, Munich, Germany
17:40	20mn abstract	Stochastic Finite Element Modeling of Thermoelastic Quality Factor of Micro-Beams S. Lepage 1, G. Weickum 2, K. Maute 2 1 University of Illinois, Urbana-Champaign, USA 2 University of Colorado, Boulder, USA

18:00

End of first day technical sessions

19:30

Dinner downtown in Historisches Kaufhaus

Session 8		08:30	Tuesday 22 Apr 2008
Molecular modeling in micro-electronics Chaired by Y. Liu, Fairchild Semiconductors - B. Schwarz, Siemens
08:30	30mn abstract	Keynote presentation - Performance Properties in Thick Film Silicate Dielectric Layers Using Molecular Modeling Nancy Iwamoto 1, Ahila Krishnamoorthy 2, Richard Spear 2, Emma Brouk 2, Amanuel Gebrebrhan 2, Mehari Stifanos 2, Ed Rutter 2, Deb Yellowaga 3 1 Honeywell/UOP 2 Honeywell Electronic Materials 3 Honeywell Electronic Chemicals
09:00	20mn abstract	The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film Cadmus Yuan 1, Amy E. Flower 2, Olaf van der Sluis 3, G.Q. (Kouchi) Zhang 1, Leo J. Ernst 3, Mohammed Cherkaoui 4, Willem D. van Driel 1 1 Delft University of Technology; NXP Semiconductors, The Netherlands 2 The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, USA; Delft University of Technology, T 3 Delft University of Technology, The Netherlands 4 The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, USA
09:20	20mn abstract	Structure Property Correlation of epoxy resins under the influence of moisture; and comparison of Diffusion coefficient with MD-simulations E. Dermitzaki, B. Wunderle, J. Bauer, H. Walter, B. Michel, Fraunhofer Institute-IZM

Session 9		08:30	Tuesday 22 Apr 2008
Numerical modeling for magnetic MEMS Chaired by J. Qu, Georgia Institute of Technology
08:30	30mn abstract	Keynote presentation - An Iterative Approach to Simulate Magnetic Micro Systems by Changing the Magnetic Properties B. Spasova, D. Dinulovic, Hans H. Gatzen, Institute for Microtechnology, Hannover, Germany
09:00	20mn abstract	An Approach for Simulating Magnetic Microactuators Dragan Dinulovic, Hans H. Gatzen, Institute for Microtechnology, Leibniz Universitaet Hannover
09:20	20mn abstract	2D Finite Element Modeling of Magnetic MEMS and Coupled Model with Fluid Mechanic Problem: Application to Biological Pumping Fluids Hakim Bensaidane, Advanced Technology Development Center CDTA, Algiers, Algeria

Session 10		08:30	Tuesday 22 Apr 2008
Thermo-mechanical qualification modeling Chaired by K. Newman, Sun Microsystems - B. Wunderle, Fraunhofer Institute IZM
08:30	30mn abstract	Keynote presentation - Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages Daoguo Yang 1, Jeroen Bielen 1, F. Theunis 1, W. D. van Driel 2, G.Q. Zhang 2 1 NXP Semiconductors 2 NXP Semiconductors, Delft University of Technology
09:00	20mn abstract	A Multilayer PCB Material Modeling Approach Based on Laminate Theory Sven Rzepka 1, Frank Krämer 1, Oliver Grassmé 1, Jens Lienig 2 1 Qimonda Dresden GmbH & Co. OHG, Dresden, Germany 2 Dresden University of Technology, Institute of Electromechanical and Electronic Design, Germany
09:20	20mn abstract	Warpage Simulation and DOE Analysis with Application in Package-on-Package Development Wei Sun, W.H. Zhu, C.K. Wang, Anthony Y.S. Sun, H.B. Tan, United Test & Assembly Center Ltd (UTAC), Singapore

09:40

Coffee break

Session 11		10:00	Tuesday 22 Apr 2008
Poster session - Thermomechanical issues in microelectronics Chaired by K.Jansen (TU Delft), H.Pape (Infineon)
	abstract	Thermo-mechanical Simulations for 4-Layer Stacked IC Packages Ming-Che Hsieh, Chih-Kuang Yu, Industrial Technology Research Institute
	abstract	Study of JEDEC B-condition JESD22-B111 Standard for Drop Test Reliability of Chip Scale Packages Yassine Bentata, STMicroelectronics Tours & IMS Bordeaux Stéphane Forster, STMicroelectronics Tours Kim Yong Goh, STMicroelectronics Singapore Hélène Fremont, IMS Bordeaux
	abstract	Analytical Model for Thermally-induced Warpage of PoP W. Feng, H. Frémont, A. Guédon-Gracia, F. Verdier, B. Plano, Laboratoire IMS, CNRS UMR 5218, ENSEIRB, Université Bordeaux I
	abstract	Testing Solder Interconnect Reliability Under Drop Impact Loading Conditions J.J.M. Zaal, Delft University of Technology, Delft, The Netherlands H.P. Hochstenbach, NXP Semiconductors, Nijmegen, the Netherlands W.D. van Driel, NXP Semiconductors, Nijmegen, the Netherlands / Delft University of Technology, Delft, the Netherlands G.Q. Zhang, NXP Semiconductors, Eindhoven, the Netherlands/ Delft University of Technology, Delft, the Netherlands
	abstract	Durability Modelling of a BGA Component under Random Vibration Marc Grieu 1, Gregor Massiot 1, Olivier Maire 1, Agnès Chaillot 1, Catherine Munier 1, Yves Bienvenu 2, Jacques Renard 2 1 EADS France Innovation Works 2 Mines Paris, Centre des Matériaux
	abstract	Effects of detailed substrate modeling and solder layout design on the 1st and 2nd level solder joint reliability for the large die FCBGA Kalyan Biswas 1, Shiguo Liu 1, Xiaowu Zhang 2, TC Chai 2 1 IBIDEN Singapore Pte Ltd 2 Institute of Microelectronics (IME), Singapore
	abstract	Optimization of High Density Interconnections (HDI) Printed Circuit Boards robustness A. Chaillot 1, O. Maire 1, C. Munier 1, L. Tonnelier 2, C. Chastanet 2 1 EADS France Innovation Work 2 AIRBUS France
	abstract	Flexible Device and Component Reliability Study Using Simulations Quayle Chen, quayle.chen@nokia.com Leon Xu, leon.xu@nokia.com Cherie Jing, cherie.jing@nokia.com Tom Xue, tom.xue@nokia.com Antti Salo, antti.o.salo@nokia.com Kari Ojala, kari.ojala@nokia.com
	abstract	Aging Effects on IMC Formation and Joint Strength of Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP F. Sun 1, P Hochstenbach 2, W. D. Van Driel 2, G. Q. Zhang 3 1 Harbin University of Science and Technology, Harbin, China 2 NXP Semiconductors, Eindhoven, the Netherlands 3  NXP Semiconductors, Eindhoven, the Netherlands
	abstract	Investigation of BPSG Profile and FAB Size on Cu Stud Bumping Process by Modeling and Experiment Yumin Liu, Yong Liu, Scott Irving, Timwah Luk, Qi Wang, Fairchild Semiconductor
	abstract	Identification and Verification by Experiment and Simulation for the Possibility of Die Cracking Induced by UIL Test Zhongfa Yuan 1, Yong Liu 2, Scott Irving 2, Timwah Luk 2 1 Fairchild Semiconductor, Suzhou, China 2 Fairchild Semiconductor, South Portland, USA
	abstract	Influence of Heat Sink Mounting Procedure on Package Reliability Zhongfa Yuan 1, Yong Liu 2, Timwah Luk 2, Scott Irving 2 1 Fairchild Semiconductor, Suzhou, China 2 Fairchild Semiconductor, South Portland, USA
	abstract	Thermomechanical Modelling and Reliability Study of an IGBT Module for an Aeronautical Application Adrien Zeanh 1, Moussa Karama 1, Olivier Dalverny 1, Eric Woirgard 2, Stéphane Azzopardi 2, Arezki Bouzourene 3, Jacques Casutt 3, Michel Mermet-Guyennet 4 1 ENIT - LGP, Tarbes, France 2 ENSEIRB - IMS, Bordeaux, France 3 THALES AES, Chatou, France 4 Alstom - PEARL, Séméac, France
	abstract	Aging Induced Evolution of Lead Free Solder Material Behavior Hongtao Ma, Yifei Zhang, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall, Michael J. Bozack, Auburn University
	abstract	Prognostication of System-State in Lead-Free Electronics Equipment under Cyclic and Steady-State Thermo-Mechanical Loads Pradeep Lall, Madhura Hande, Chandan Bhat, Vikrant More, Rahul Vaidya, Jeff Suhling, Auburn University
	abstract	Effect of aging of packaging materials on die surface cracking of a SiP carrier Xiaosong Ma 1, K.M.B. Jansen 1, L.J. Ernst 1, W.D van Driel 2, O. van der Sluis 3, G.Q.Zhang 4, Charles Regard 5, Christian Gautier 6, Hélène Frémont 7 1 Delft University of Technology 2 NXP, the Netherlands 3 Delft University of Technology, Philips, the Netherlans 4 Delft University of Technology, NXP, the Netherlands 5 NXP Semiconductors, LaMIPS, Université de Caen,IMS Bordeaux Université de Bordeaux,France 6 NXP Semiconductors, LaMIPS, Université de Caen, France 7 IMS Bordeaux Université de Bordeaux, France
	abstract	Solder Fatigue of Wafer Level Package Assemblies. Comparison with Flip Chip BGA'S Charles Regard 1, Christian Gautier 1, Hélène Frémont 2, Alexandre Val 3, Frédéric Roullier 1, Patrice Schwindenhammer 1, Patrick Poirier 1 1 NXP Semiconductors, Caen, France 2 IMS, Bordeaux, France 3 Solectron, Canéjan, France
	abstract	Predicting Dielectric Constant Trends Using Molecular Modeling Nancy Iwamoto, Honeywell, Ramona, California, USA

Session 12		10:00	Tuesday 22 Apr 2008
Poster session - Thermal and multi-physics issues in microelectronics Chaired by K.Jansen (TU Delft), H.Pape (Infineon)
	abstract	Investigation of Stress-buffer-enhanced Package Subjected to Board-level Drop Test Chan-Yen Chou 1, Tuan-Yu Hung 1, Ming-Chih Yew 1, Wen-Kun Yang 2, Dyi-Chung Hu 2, Mon-Chin Tsai 2, Ching-Shun Huang 2, Kuo-Ning Chiang 1 1 Advanced Microsystem Packaging and Nano-Mechanics Research Lab. PME, National Tsing Hua University 2 Advanced Chip Engineering Technology Inc.
	abstract	Characterization of Dynamic Behavior of Pb-Free Material 95.7Sn3.8Ag0.5Cu and Its Determination of Dynamic Constitutive Model Parameters Liang Lihua 1, Chen Xuefan 1, Wang Qiang 1, Liu Fei 1, Yong Liu 2, Scott Irving 2, Timwah Luk 2 1 Zhejiang University of Technology 2 Fairchild Semiconductor Corp
	abstract	Investigation of the stress-strain curves of lead-free solder alloy Niu Xiaoyan, Ma Yong, Li Zhigang, Shu Xuefeng, Yang Guitong, Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology, Taiyuan, PR China
	abstract	Use The Reverse Engineering Technique To Link COMSOL and ANSYS Softwares H.Achkar 1, F.Pennec 1, D.Peyrou 1, M.Sartor 2, R.Plana 1, P.Pons 1 1 LAAS-CNRS 2 INSA-Toulouse
	abstract	The Thermal-Structural Analysis of Plastic Substrate Based Display Using Experiments and FEM Simulations Chang-chun Gu 1, Ming-quan Shi 1, PingYang 1, Leon Xu 2, Quayle Chen 2, Antti Salo 2 1 School of Mechatronics Engineering, University of Electronic Science and Technology of China, 2 Nokia Research Center, Beijing
	abstract	Analysis of the Thermal Behavior of Trench-Isolated Bipolar Transistors Fabricated on SOI Substrates Ilaria Marano, Vincenzo d'Alessandro, Niccolò Rinaldi, Department of Electronics and Telecommunications Engineering, University of Naples "Federico II", via Claudio 21, 80125 Naples
	abstract	Cold Test and Cyclic Damp Heat Test of Plastic Substrate Based Displays Jian-Ping Li 1, Ping Yang 1, Jian Zhong 1, Jun Zhou 1, Leon Xu 2, Quayle Chen 2, Antti Salo 2, Kari Ojala 3 1 School of Mechatronics Engineering, University of Electronic Science and Technology of China 2 Nokia Research Center, Beijing 3 Nokia Devices, R&D, Finland
	abstract	The Steady State Damp Heat Test and Dry Heat Test of Plastic Substrate Based Displays Jian Zhong 1, Ping Yang 1, Jian-ping Li 1, Jun Zhou 1, Quayle Chen 2, Leon Xu 2, Antti Salo 2 1 School of Mechatronics Engineering, University of Electronic Science and 2 Nokia Research Center, Beijing
	abstract	Efficient Electrothermal Simulation of Power Electronics for Hybrid Electric Vehicle Anis Dehbi 1, Wolfgang Wondrak 1, Evgenii B. Rudnyi 2, Udo Killat 2, Peter van Duijsen 3 1 Daimler AG, GR & AE Cabin and Powertrain E/E 2 CADFEM GmbH 3 Simulation Research

Session 13		11:20	Tuesday 22 Apr 2008
Board and System Level Thermal Analysis Chaired by N. Cordero, Tyndall Institute
11:20	30mn abstract	Keynote presentation - An Experimental and Numerical Investigation of Tube Bank Heat Exchanger Thermofluids Peter Rodgers 1, Afshin Goharzadeh 1, Osama Abd Elhamid Ali 2, Valerie Eveloy 1 1 The Petroleum Institute, Abu Dhabi, United Arab Emirates 2 National Drilling Company, Abu Dhabi, United Arab Emirates
11:50	20mn abstract	Application of CFD Modeling for Energy Efficient Humidity Management of an Electronics Enclosure in Storage under Severe Climatic Conditions Ilja Belov 1, Jan Rydén 2, Joakim Lindeblom 3, Yafan Zhang 1, Torgny Hansson 2, Fredrik Bergner 4, Peter Leisner 5 1 School of Engineering, Jönköping University, Sweden 2 Saab Microwave Systems, Göteborg, Sweden 3 SP Technical Research Institute of Sweden, Boras, Sweden 4 Flomerics Nordic AB, Nacka, Sweden 5 School of Engineering, Jönköping University; SP Technical Research Institute of Sweden, Boras; Sweden
12:10	20mn abstract	Simulation of Fluid Dynamics in Active Liquid Heat Sink for CPU Cooling System Song-Hao Wang, Steven Melendez, Ronny Blanco, Milton Gomez, Micro and Precision Manufacturing Center, Kun-Shan University of Technology, Taiwan

Session 14		11:20	Tuesday 22 Apr 2008
Polymer physics Chaired by W.H. Zhu, UTAC - M. Guyenot, Robert Bosch GmbH
11:20	30mn abstract	Keynote presentation - Numerical Simulation of Encapsulant Curing within a Variable Frequency Microwave Processing System T. Tilford 1, K.I. Sinclair 2, G. Goussetis 2, C. Bailey 1, M.P.Y. Desmulliez 2, A.K. Parrott 1, A.J. Sangster 2 1 University Of Greenwich, London, United Kingdom 2 Heriot Watt University, Edinburgh, United Kingdom
11:50	20mn abstract	Characterization of Dual-Stage Moisture Diffusion, Residual Moisture Content and Hygroscopic Swelling of Epoxy Molding Compounds Hossein Shirangi 1, Juergen Auersperg 2, Metin Koyuncu 1, Hans Walter 2, Wolfgang H. Müller 3, Bernd Michel 2 1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany 2 Fraunhofer IZM, Berlin, Germany 3 Technical University of Berlin, Institut Für Mechanik, Berlin, Germany
12:10	20mn abstract	A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds M.K.Saraswat 1, K.M.B.Jansen 1, M.D. Patel 2, L.J Ernst 1, C. Bohm 3 1 Delft University of Technology, The Netherlands 2 Lamar University, Beaumont, Texas USA 3 Infineon Technologies, Munich, Germany

Session 15		11:20	Tuesday 22 Apr 2008
Interface delamination modeling and characterisation Chaired by X. Fan, Lamar University - S. Rzepka, Qimonda
11:20	30mn abstract	Keynote presentation - Failure modelling of flexible electronics Olaf van der Sluis 1, Roy Engelen 2, Peter Timmermans 2, Kouchi Zhang 3 1 Philips Applied Technologies, Eindhoven, The Netherlands and Delft University of Technology, Delft, The Netherlands 2 Philips Applied Technologies, Eindhoven, The Netherlands 3 NXP Semiconductors, Eindhoven, The Netherlands and Delft University of Technology, Delft, The Netherlands
11:50	20mn abstract	Sapphire-removed induced the deformation of high power InGaN light emitting diodes C. N. Han 1, T .L. Chou 1, C. F. Huang 2, K.N. Chiang 1 1 Advanced Microsystem Packaging and Nano-Mechanics Research Lab., Department of Power Mechanical Engineering, National Tsing Hua 2 Epistar corporation.
12:10	20mn abstract	Advanced Miniature Mixed Mode Bending Setup for In-situ Interface Delamination Characterization M. Kolluri 1, M.H.L. Thissen 2, J.P.M. Hoefnagels 2, J.A.W. van Dommelen 2, M.G.D. Geers 2 1 The Netherlands Institute for Metals Research 2 Eindhoven University of Technology, Department of Mechanical Engineering,

12:30

Lunch

Session 16		14:00	Tuesday 22 Apr 2008
Process modeling Chaired by A. Dasgupta, CALCE Electronic Products & Systems Consortium - C. Yuan, Delft University / NXP Semiconductors
14:00	30mn abstract	Keynote presentation - Optimisation of Wirebond Interconnects by Automated Parameter Variation Stefan Martens 1, Jürgen Wilde 2, Elena Zukowski 2, Friedemann Völklein 3, Markus Ledermann 4 1 Infineon Technologies AG, Regensburg, Germany 2 University of Freiburg, IMTEK, Institute of Microsystem Technology, Assembly and Packaging, Germany 3 University of Applied Sciences Wiesbaden, IMtech, Institute of Microtechnologies, Germany 4 Robert Bosch GmbH, Stuttgart, Germany
14:30	20mn abstract	Wire Bonding Capillary Profile and Bonding Process Parameter Optimization Simulation Qiuxiao Qian, Yong Liu, Timwah Luk, Scott Irving, Fairchild Semiconductor, South Portland, USA
14:50	20mn abstract	Modelling the Nano-Imprint Forming Process for the Production of Miniaturised 3D Structures Stoyan Stoyanov 1, Farid Amalou 2, Keith Sinclair 2, Chris Bailey 1, Marc P.Y. Desmulliez 2 1 University of Greenwich, London, UK 2 Heriot-Watt University, Edinburgh, UK
15:10	20mn abstract	Intrinsic Dissipation in Microelectromechanical Systems Ardito Raffaele, Comi Claudia, Corigliano Alberto, Frangi Attilio, Department of Structural Engineering, Technical University (Politecnico) of Milan
15:30	20mn abstract	Assessment of the Feasibility of ‘Multiple Chips-to-Wafer’ Thermo-Compression Bonding using FEM Chukwudi Okoro 1, Anne Jourdain 2, Bart Vandevelde 2, Bart Swinnen 2, Dirk Vandepitte 3 1 IMEC / Katholieke Universiteit Leuven, Belgium 2 IMEC, Belgium 3 Katholieke Universiteit Leuven, Belgium

Session 17		14:00	Tuesday 22 Apr 2008
Innovative methods for micro-systems modeling Chaired by X. Rottenberg, IMEC
14:00	30mn abstract	Keynote presentation - A Derivatives-based Method for Parameterization of MEMS Reduced Order Models Vladimir Kolchuzhin, Wolfram Doetzel, Jan Mehner, Chemnitz University of Technology, Germany
14:30	20mn abstract	A multi-domain piezoresistive pressure sensor design tool based on analytical models M. Olszacki 1, C. Maj 1, M. Al Bahri 2, D. Peyrou 2, F. Kerrour 2, P. Pons 2, A. Napieralski 3 1 LAAS-CNRS, Toulouse, France; Department of Microelectronics and Computer Science, Lodz, Poland 2 LAAS-CNRS, Toulouse, France 3 Department of Microelectronics and Computer Science, Lodz, Poland
14:50	20mn abstract	Determining Pull-In Curves with Electromechanical FEM Models S.D.A. Hannot, D.J. Rixen, Delft University of Technology, Delft, The Netherlands
15:10	20mn abstract	Parametric Design of an Electrostatic Rotary Microactuator Using Finite Element Analysis and Metamodeling Jessica Bronson, Irene Fassi, ITIA-CNR
15:30	20mn abstract	Circular MEM Resonator: Modeling Second Order Effects on Resonance Frequency Yasseen S. Nada 1, Steve Stoffels 2, Harrie A. C. Tilmans 2, Emad Hegazi 3, Hani F. Ragai 3, Amr M. Shaarawi 1 1 American University in Cairo 2 Interuniversity Micro Electronics Center 3 Ain Shams University

Session 18		14:00	Tuesday 22 Apr 2008
Dynamics modeling and testing Chaired by B. Vandevelde, IMEC - M. Gonzalez, IMEC
14:00	30mn abstract	Keynote presentation - Recent Advances in Drop-Impact Reliability E.H. Wong, Singapore Institute of Manufacturing Technology (SIMTech) S.K.W. Seah, Institute of Microelectronics (IME) W.D. van Driel, NXP Semiconductors J.F.J.M. Caers, Philips Applied Technologies N. Owens, Freescale Semiconductor, Inc. Y.-S. Lai, Central Labs, ASE, Inc.
14:30	20mn abstract	FEM Simulation Study on the Free Drop of Electronic Modules Based on Calibrated and Validated Models Przemyslaw Gromala, Axel Müller, Sven Rzepka, Qimonda Dresden GmbH & Co. OHG, Dresden, Germany
14:50	20mn abstract	Correlating Drop Impact Simulations with Drop Impact Testing using High-Speed Camera Measurements J.J.M. Zaal, Delft University of Technology, Delft, The Netherlands W.D. van Driel, NXP Semiconductors, Nijmegen, The Netherlands / Delft University of Technology, Delft, The Netherlands F.J.H.G. Kessels, NXP Semiconductors, Nijmegen, The Netherlands G.Q. Zhang, NXP Semiconductors, Eindhoven, The Netherlands / Delft University of Technology, Delft, The Netherlands
15:10	20mn abstract	Numerical-experimental comparison of low-g and high-g tests on a polysilicon MEMS accelerometer Aldo Ghisi 1, Stanislaw Kalicinski 2, Stefano Mariani 1, Ingrid de Wolf 2, Alberto Corigliano 1 1 Dipartimento di Ingegneria Strutturale, Politecnico di Milano, Milano, Italy 2 IMEC, Leuven, Belgium
15:30	20mn abstract	Effect of Thermomechanical Stress on Resonant Frequency Shift of a Silicon MEMS resonator Mario Gonzalez, Anne Jourdain, Bart Vandevelde, Harrie A. C. Tilmans, IMEC, Leuven, Belgium

15:30

Annual meeting of EuroSimE Organising Committee

15:30

Coffee break

16:00

Special Exhibitors session

17:30

Cocktail party

Session 19		08:30	Wednesday 23 Apr 2008
New Developments - I Chaired by J. Korvink, IMTEK - C. Bailey, University of Greenwich
08:30	30mn abstract	Keynote presentation - Finite difference scheme for the accurate modelling of boundary layers in microchannels Nicolás Cordero 1, Grigory Shishkin 2, Lida Shishkina 3, Orla Slattery 1, Martin Stynes 2 1 Tyndall National Institute, Cork, Ireland 2 Dept. of Mathematics, University College Cork, Ireland 3 Inst. of Mathematics and Mechanics, Russian Academy of Science, Ekaterinburg, Russia
09:00	30mn abstract	Keynote presentation - Current Hardware Trends in Mobile Phones Eduardo Asuncao, Angelo Costa, Iramylson Freitas, Tommi Reinikainen, Instituto Nokia de Tecnologia
09:30	30mn abstract	Keynote presentation - Feature Extraction and Health Monitoring using Image Correlation for Survivability of Leadfree Packaging under Shock and Vibration Pradeep Lall, Deepti Iyengar, Sandeep Shantaram, Prashant Gupta, Dhananjay Panchagade, Jeff Suhling, Auburn University

10:00

Coffee break

Session 20		10:30	Wednesday 23 Apr 2008
Experimental mechanics for micro-electronics Chaired by J. Auersperg, Fraunhofer IZM - E.H. Wong, Singapore Institute of Manufacturing Technology
10:30	30mn abstract	Keynote presentation - Characterization and modeling of molding compound properties during cure K.M.B. Jansen 1, C. Qian 1, L.J. Ernst 1, C. Bohm 2, A. Kessler 2, H. Preu 2, M. Stecher 2 1 TU Delft 2 Infineon Technologies
11:00	20mn abstract	Comparison of Bulk Modulus Determined by Transient Bulk Creep Experiment and Direct Optical Measurement of Poisson's Ratio Richard Löw, Robert Bosch GmbH, Corporate Sector Research and Advance Engineering, Advance Production Technology, Plastics Engineering, Germa Jürgen Wilde, University of Freiburg, Institute of Microsystem Technology, Laboratory for Assembly and Packaging, Germany
11:20	20mn abstract	Lifetime Prediction of BGA Assemblies with Experimental Torsion Test and Finite Element Analysis Wilson Carlos Maia Filho 1, Michel Brizoux 1, Hélène Frémont 2, Yves Danto 2 1 Thales Services SAS, Meudon-la-Forêt, France 2 IMS, ENSEIRB, UMR 5218, Université Bordeaux 1, Talence, France
11:40	20mn abstract	Lead-free Solder Material Characterization For Thermo-Mechanical Modeling Edith S.W. Poh, W.H. Zhu, X.R. Zhang, C.K. Wang, Anthony Y.S. Sun, H.B. Tan, United Test and Assembly Center Ltd (UTAC), Singapore
12:00	20mn abstract	A Comprehensive Shear-testing Facility for Joint-scale Solder Samples Dominik Herkommer, Michael Reid, Jeff Punch, CTVR, Stokes Research Institute, University of Limerick, Limerick, Ireland

Session 21		10:30	Wednesday 23 Apr 2008
Ion transport and electro-migration Chaired by N. Iwamoto, Honeywell
10:30	30mn abstract	Keynote presentation - Ionic polarisation layers in polymer electrolytes P.M. Biesheuvel 1, M. van Soestbergen 1, A. Mavinkurve 2, L.J. Ernst 3, G.Q. Zhang 3 1 Netherlands Institute for Metals Research; Delft University of Technology; Delft, the Netherlands 2 NXP Semiconductors, Nijmegen, the Netherlands 3 Delft University of Technology, the Netherlands
11:00	20mn abstract	Electromigration Induced Failure Mechanism: Multiphysics Model and Correlation with Experiments F. Cacho, V. Fiori, L. Doyen, C. Chappaz, C. Tavernier, H. Jaouen, STMicroelectronics
11:20	20mn abstract	Modelling the electromechanical coupling of RF switch using Extended Finite Element V. Rochus 1, L. Van Miegroet 1, P. Duysinx 1, J.C. Golinval 1, D. Rixen 2 1 University of Liège, Liège, Belgium 2 TU Delft, Delft, The Netherlands
11:40	20mn abstract	Simulation of Migration effects in PoP Kirsten Weide-Zaage 1, Helene Fremont 2, Linyan Wang 1 1 Laboratorium für Informationstechnologie, University of Hannover 2 IMS, Université Bordeaux 1 ENSEIRB-UMR 5218 ,
12:00	20mn abstract	Thermo-Electro-Mechanical V-Shaped Actuator Design and Simulations M. Matmat, M. Al Ahmad, C. Escriba, S. Soulimane, A. Marty, J.Y Fourniols, LAAS CNRS, France

12:20

Lunch

Session 22		14:00	Wednesday 23 Apr 2008
New Developments - II Chaired by G.Q. Zhang, NXP Semiconductors
14:00	30mn abstract	Keynote presentation - Board-Level Solder Joint Reliability of High Performance Computers under Mechanical Loading Keith Newman, Sun Microsystems
14:30	30mn abstract	Keynote presentation - Design of Carbon Nanotubes based Microwave Applications Employing Mechanical Resonance Analysis Mahmoud Al Ahmad 1, W. I. Milne 2, Robert Plana 1 1 LAAS CNRS 2 University of Cambridge
15:00	30mn abstract	Keynote presentation - Investigation of Thermal Performance of Various Power Device Packages Xuejun Fan 1, K. Aung 2, X. Li 2 1 Department of Mechanical Engineering, Lamar University, Beaumont, Texas; Department of Engineering Mechanics, South China Univer 2 Department of Mechanical Engineering, Lamar University, Beaumont, Texas

16:00

End of conference

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors

Authors: find your session number:

• Achkar :  3  Ahmad :  3 21 22  Alberto :  16  Ali :  13  Amalou :  16  André :  2  Asuncao :  19  Attilio :  16  Auersperg :  14  Aung :  22  Azzopardi :  11  
• Bahri :  17  Bailey :  14 16  Bauer :  8  Belov :  13  Bensaidane :  9  Bentata :  11  Bergner :  13  Beyne :  2  Bhat :  11  Bielen :  3 10  Bienvenu :  11  Biesheuvel :  21  Biswas :  11  Blanco :  13  Bohm :  7 14 20  Bombach :  5  Boutaayamou :  3  Bouzourene :  11  Bozack :  11  Brizoux :  20  Bronson :  17  Brouk :  8  
• Cacho :  21  Caers :  18  Cai :  11  Camon :  3  Casutt :  11  Chai :  11  Chaillot :  11  Chappaz :  21  Chastanet :  11  Chen :  11 12  Cherkaoui :  8  Chiang :  12 15  Chou :  12 15  Claudia :  16  Coccetti :  3  Cordero :  19  Corigliano :  18  Costa :  19  Coulombier :  2  Cuddalorepatta :  5  Czarnecki :  1  
• Dalverny :  11  Danto :  20  Dasgupta :  5  Dehbi :  12  Dermitzaki :  8  Desmulliez :  14 16  Detzel :  7  Dingreville :  1  Dinulovic :  9  Doering :  5  Doetzel :  17  Dommelen :  15  Dorkel :  4  Doyen :  21  Driel :  2 8 10 11 18  Dudek :  5  Duijsen :  12  Dular :  3  Duysinx :  21  
• Eggink :  4  Engelen :  15  Ernst :  8 11 14 20 21  Escriba :  21  Eveloy :  13  
• Fan :  7 22  Fassi :  17  Fei :  12  Feng :  11  Filho :  20  Fiori :  2 21  Flower :  8  Forster :  11  Fourniols :  21  Frangi :  6  Freitas :  19  Fremont :  11 21  Frémont :  11 20  
• Gallois-Garreignot :  2  Ganjoo :  3  Gaspar :  7  Gatzen :  9  Gautier :  11  Gebrebrhan :  8  Geers :  15  Ghisi :  6 18  Goh :  11  Goharzadeh :  13  Golinval :  21  Gomez :  13  Gonzalez :  2 18  Goussetis :  14  Grassmé :  10  Gravier :  2  Grieu :  11  Gromala :  18  Gu :  12  Guitong :  6 12  Gupta :  19  Guédon-Gracia :  11  
• Habra :  4  Han :  15  Hande :  11  Hannot :  17  Hansson :  13  Hegazi :  17  Herkommer :  20  Hochstenbach :  11  Hoefnagels :  15  Houri :  2  Hsieh :  11  Hu :  12  Huang :  7 12 15  Hung :  12  
• Irving :  4 11 12 16  Iwamoto :  8 11  Iyengar :  19  
• Jansen :  11 14 20  Jaouen :  2 21  Jing :  11  
• 0 :  3 6  
• Jourdain :  16 18  Juge :  2  Jungwirth :  6  
• Kalicinski :  18  Kanert :  5  Karama :  11  Kerrour :  17  Kessels :  18  Kessler :  20  Killat :  12  Kolchuzhin :  17  Kolluri :  15  Koyuncu :  14  Krishnamoorthy :  8  Krämer :  10  
• Lai :  18  Lall :  11 19  Ledermann :  16  Leicht :  7  Leisner :  13  Lepage :  7  Li :  12 22  Liang :  4  Lienig :  10  Lihua :  12  Lindeblom :  13  Liu :  4 11 12 16  Luk :  4 11 12 16  Löw :  20  
• Ma :  11  Madrid :  4  Maire :  11  Maj :  17  Marano :  4 12  Mariani :  18  Martens :  16  Marty :  21  Massiot :  11  Matmat :  3 21  Maute :  7  Mavinkurve :  21  Mehner :  17  Meier :  5  Melendez :  13  Mermet-Guyennet :  11  Michel :  5 8 14  Miegroet :  21  Milne :  22  More :  11  Munier :  11  Müller :  14 18  
• Nada :  17  Nanver :  4  Napieralski :  17  Nelle :  7  Newman :  22  Noijen :  3 4  
• Ojala :  11 12  Okoro :  2 16  Olszacki :  17  Ostergaard :  3  Owens :  18  
• Panchagade :  19  Pardoen :  2  Parrott :  14  Patel :  14  Paul :  7  Pennec :  3  Peyrou :  3 17  Plana :  3 22  Plano :  11  Poh :  20  Poirier :  11  Pons :  3 17  Preu :  20  Pufall :  5  Punch :  1 20  
• Qian :  16 20  Qiang :  12  Qu :  1<