Advance programme

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Day 1 - Monday 26 Apr 2010
08.00	Registration desk open
09.00	OPENING SESSION by the General Chair
09.10	INDUSTRIAL TRENDS KEYNOTE 1: tbd
09.40	INDUSTRIAL TRENDS KEYNOTE 2: tbd
10.10	INDUSTRIAL TRENDS KEYNOTE 3: tbd
10.40	Break
11:10	S. 1  New Developments in Modeling
12.40	Lunch
14:00	S. 2  Experimental Investigations	S. 3  Modelling of MEMS Devices I	S. 4  Thermal Modelling and Characterization
15.50	Coffee break
16:20	S. 5  Damage and Failure	S. 6  Innovative Methods for Microsystems Modelling I	S. 7  Electrothermal Modeling and Characterization
18.00	Transport by bus to Château Le Thil
19.00	Dinner in Château Le Thil
Day 2 - Tuesday 27 Apr 2010
09:00	S. 8  Flexible Electronics	S. 9  Innovative Methods for Microsystems Modelling II	S. 10  Thermal-Fluid Behavior Modeling and Characterization
10.10	Break
11:00	S. 11  Posters TM	S. 12  Posters MP+TF
12.20	Lunch
13:30	S. 13  Thermo-Mechanical Modeling I	S. 14  Modelling of MEMS devices II	S. 15  Molecular Modeling
15.20	Break
16:00	S. 16  Dynamic Problems	S. 17  Multi-Physics Modelling for Power Electronics Devices	S. 18  Modeling for Advanced Packaging
18.30	Reception at the venue
Day 3 - Wednesday 28 Apr 2010
09:00	S. 19  General lectures, mixed
10.30	Break
11:00	S. 20  Reliability Modeling	S. 21  Process Modelling	S. 22  Thermo-Mechanical Modeling II
12.20	Lunch
13:40	S. 23  Mixed Thermal / Multiphysics session
15.40	End of conference

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors  Time table for Speakers

List of Technical Sessions
S-1 New Developments in Modeling
S-2 Experimental Investigations
S-3 Modelling of MEMS Devices I
S-4 Thermal Modelling and Characterization
S-5 Damage and Failure
S-6 Innovative Methods for Microsystems Modelling I
S-7 Electrothermal Modeling and Characterization
S-8 Flexible Electronics
S-9 Innovative Methods for Microsystems Modelling II
S-10 Thermal-Fluid Behavior Modeling and Characterization
S-11 Posters TM
S-12 Posters MP+TF
S-13 Thermo-Mechanical Modeling I
S-14 Modelling of MEMS devices II
S-15 Molecular Modeling
S-16 Dynamic Problems
S-17 Multi-Physics Modelling for Power Electronics Devices
S-18 Modeling for Advanced Packaging
S-19 General lectures, mixed
S-20 Reliability Modeling
S-21 Process Modelling
S-22 Thermo-Mechanical Modeling II
S-23 Mixed Thermal / Multiphysics session

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors  Time table for Speakers

Session 1		11:10	Monday 26 Apr 2010
New Developments in Modeling Chairman: B. Michel, Fraunhofer IZM; L.J. Ernst, Delft University of Technology
11:10	30mn	Keynote presentation - Wafer Level Packaging (WLP): from Fan-in to Fan-out Corresponding Author: Xuejun Fan - Lamar University
11:40	30mn	Keynote presentation - Trends in Microsystems Integration and its Impact on Reliability Corresponding Author: Mervi Paulasto-Kröckel - Aalto University School of Science and Technology
12:10	30mn	Keynote presentation - Jets and Rotary Flows for Single-Phase Liquid Cooling: An Overview of Some Recent Experimental Findings Corresponding Author: Jeff Punch - CTVR, Stokes Institute

 

Session 2		14:00	Monday 26 Apr 2010
Experimental Investigations Chairman: tbd
14:00	30mn	Keynote presentation - Toward Comprehensive Reliability Testing – a Combined Loading Approach Corresponding Author: Toni Mattila - Helsinki University of Technology Toni. T. Mattila, M. Paulasto-Kröckel, Aalto University, School of Science and Technology
14:30	20mn	Theoretical Analyses on the Shear Test Corresponding Author: Rainer Dudek - Fraunhofer ENAS, MMC Rainer Dudek 1, Ralf Doering 1, Kerstin Kreyssig 2, Bernd Michel 1 1 Fraunhofer ENAS, Micro Materials Center Berlin and Chemnitz 2 CWM GmbH, Chemnitz
14:50	20mn	Measuring time-dependent mechanics in metallic MEMS Corresponding Author: Lambert Bergers - Eindhoven University of Technology Bergers, L.I.J.C., Delhey, N.K.R., Hoefnagels, J.P.M., Geers, M.G.D., Eindhoven University of Technology, Dep. of Mechanical Engineering
15:10	20mn	Interfacial Strength of Silicon-to-Molding Compound Changes with Thermal Residual Stress Corresponding Author: An Xiao - Delft University of Technology Gerd Schlottig 1, An Xiao 2, Heinz Pape 3, Bernhard Wunderle 4, Leo J. Ernst 2 1 Infineon Technologies AG, Munich; Fraunhofer IZM, Berlin, Germany; TU-Delft, Delft, The Netherlands 2 TU-Delft, Delft, The Netherlands 3 Infineon Technologies AG, Munich, Germany 4 Fraunhofer IZM, Berlin; TU Chemnitz, Chemnitz, Germany
15:30	20mn	Local stress analysis in devices by FIB Corresponding Author: Rene Kregting - TNO René Kregting 1, Sander Gielen 1, Willem van Driel 2, Paul Alkemade 3, Hozan Miro 3, Jan-Dirk Kamminga 4 1 TNO Science & Industry, Eindhoven, The Netherlands 2 NXP Semiconductors, Nijmegen, The Netherlands; Delft University of Technology, Delft, The Netherlands 3 Delft University of Technology, Delft, The Netherlands 4 M2i Materials innovation institute, Delft, The Netherlands

 

Session 3		14:00	Monday 26 Apr 2010
Modelling of MEMS Devices I Chairman: tbd
14:00	30mn	Keynote presentation - AN ON-CHIP EXPERIMENTAL ASSESSMENT OF CASIMIR FORCE EFFECT IN MICRO-ELECTROMECHANICAL SYSTEMS Corresponding Author: Attilio Frangi - Dept. of Structural Engineering, Politecnico di Milano
14:30	20mn	MEMS resonator temperature compensation Corresponding Author: Fabrice CASSET - CEA, LETI, MINATEC F. Casset 1, C. Durand 2, Y. Civet 3, E. Ollier 1, JF. Carpentier 2, P. Ancey 2, P. Robert 1 1 CEA, LETI, MINATEC, Grenoble, France 2 ST, Crolles, France 3 TIMA, Grenoble, France
14:50	20mn	Failure Modes of Wafer Level Thin Film MEMS Packages During Wafer Thinning Corresponding Author: J.J.M. Zaal - Delft University of Technology J.J.M. Zaal, W.D. van Driel, G.Q. Zhang, Delft University of Technology
15:10	20mn	Prediction of stiction in Microswitch Systems Corresponding Author: Ling Wu - University of Liege Ling WU, V. ROCHUS, L. NOELS, J.C. GOLINVAL, University of Liege, Liège, Belgium
15:30	20mn	FINITE ELEMENT MODELLING OF ADHESION PHENOMENA IN MEMS Corresponding Author: Raffaele Ardito - Dept. of Structural Engineering, Politecnico di Milano Raffaele Ardito, Alberto Corigliano, Attilio Frangi, Politecnico di Milano, Milan, Italy

 

Session 4		14:00	Monday 26 Apr 2010
Thermal Modelling and Characterization Chairman: tbd
14:00	30mn	Keynote presentation - Simulation-based analysis of the heat-affected zone during target preparation by pulsed-laser ablation through stacked silicon dies in 3D integrated System-in-Packages Corresponding Author: Stefan Martens - Infineon Technologies AG, Regensburg, Germany Stefan Martens 1, Markus Fink 1, Walter Mack 1, Friedemann Voelklein 2, Juergen Wilde 3 1 Infineon Technologies AG, Regensburg, Germany 2 RheinMain University of Applied Sciences, IMtech, Institute of Microtechnologies, Ruesselsheim, Germany 3 Laboratory for Assembly and Packaging, IMTEK, Department of Microsystems Engineering, University of Freiburg, Germany
14:30	20mn	Fabrication of Freestanding Thin Pt/W Thermocouple by Joule Heat Welding Corresponding Author: Hironori Tohmyoh - Tohoku University Hironori Tohmyoh, Hironao Takeda, Mohammed N. I. Khan, Masumi Saka, Tohoku University
14:50	20mn	Light Degradation Prediction of High Power Light Emitting Diode Lighting Modules Corresponding Author: Kuo-Ning Chiang - National Tsing Hua University, Department of Power Mechanical Engineering Yen-Fu Su, Shin-Yueh Yang, Wei-Hao Chi, Kuo-Ning Chiang, Dept. of Power Mechanical Engineering, National Tsing Hua University, HsinChu, Taiwan
15:10	20mn	Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation Corresponding Author: CORFA Anthony - CEA, LETI, MINATEC A. Corfa, A. Gasse, S. Bernabé, H. Ribot, CEA LETI MINATEC
15:30	20mn	Analytical modelling of transient processes in thermal microsensors Corresponding Author: Alexander Kozlov - Omsk State University

 

Session 5		16:20	Monday 26 Apr 2010
Damage and Failure Chairman:
16:20	30mn	Keynote presentation - Detailed Investigation on the Damage Accumulation of Lead-free Solder Joints under Accelerated Temperature Cycling Corresponding Author: S. W. Ricky Lee - HKUST Y. S. Chan, S. W. Ricky Lee, HKUST
16:50	20mn	Crack and Damage in low-k BEoL Stacks under Assembly and CPI Aspects Corresponding Author: Juergen Auersperg - Fraunhofer ENAS Juergen Auersperg 1, Dietmar Vogel 2, Matthias U. Lehr 3, Michael Grillberger 3, Bernd Michel 2 1 Fraunhofer ENAS Chemnitz and AMIC GmbH Berlin 2 Fraunhofer ENAS Chemnitz and Fraunhofer IZM Berlin 3 GLOBALFOUNDRIES Dresden Module One LLC & Co. KG
17:10	20mn	Moisture Diffusion Modeling and Application in a 3D RF Module Subject to Moisture Absorption and Desorption Loads Corresponding Author: Liping Zhu - TriQuint Semiconductor Inc Liping Zhu, Dean Monthei, Gene Lambird, Wally Holgado, TriQuint Semiconductor, USA
17:30	20mn	Numerical-experimental analysis of combined bulk and interface fracture in a leadless package Corresponding Author: Sander Noijen - Philips Applied Technologies Sander Noijen 1, Sven Walczyk 2, Roelf Groenhuis 2, Olaf van der Sluis 1 1 Philips Applied Technologies, Eindhoven, The Netherlands 2 NXP Semiconductors, Nijmegen, The Netherlands

 

Session 6		16:20	Monday 26 Apr 2010
Innovative Methods for Microsystems Modelling I Chairman:
16:20	30mn	Keynote presentation - A Comparison of Model Order Reduction Methods used in different FE Software Tools Corresponding Author: Mario Patrick Jungwirth - University of Applied Sciences Upper Austria, Campus Wels M. Jungwirth, D. Hofinger, H. Weinzierl, FH OÖ – Upper Austria University of Applied Sciences, Wels, Austria
16:50	20mn	A linear analysis to overcome the numerical Cherenkov instability Corresponding Author: Professor Franck Assous - Ariel Universisty Center & Bar Ilan University Franck Assous, Ariel University Center & Bar-Ilan University, Israel Jacques Segre, CEA-Saclay, DEN/DM2S/SFME, France
17:10	20mn	Thermomechanical simulation of BCB membrane thin-film package Corresponding Author: Seonho Seok - IEMN/IRCICA CNRS Seonho Seok 1, Nathalie Rolland 1, Paul-alain Rolland 1, Siebe Bouwstra 2 1 IEMN/IRCICA/CNRS 2 MEMS TC
17:30	20mn	The Mechanical Characterisation of Glass Frit Seals for Capped MEMS Devices Corresponding Author: Cillian Burke - Stokes Institute

 

Session 7		16:20	Monday 26 Apr 2010
Electrothermal Modeling and Characterization Chairman:
16:20	30mn	Keynote presentation - New Methodology on Electro-Thermal Characterization and Modeling of Large Power Drivers using Lateral PNP BJTs Corresponding Author: Joseph Rhayem - Program Manager : Electro-Thermal Characterisation A.Vrbicky 1, R. Blecic 2, P. Malena 3, S. Bychikhin 4, D. Pogany 4, A. Wieers 5, A. Baric 2, M. Tack 5 1 ONSEMI, Bratislava, Slovakia 2 University of Zagreb, Zagreb, Croatia 3 ONSEMI, Brno, Czech 4 Institute for Solid State Electronics, Vienna, Austria 5 ONSEMI, Oudenaarde, Belgium
16:50	20mn	System-level model of electrothermal microsystem and temperature control circuit Corresponding Author: Dennis Hohlfeld - Holst Centre / IMEC
17:10	20mn	Electromagnetic and Thermal investigations of RF Circuits and Devices Corresponding Author: Yves SCUDELLER - Université de Nantes
17:30	20mn	Switching speed evolution for MOS silicon devices electrically stressed under high temperatures Corresponding Author: Pr. Chafic SALAME - Lebanese University

 

Session 8		09:00	Tuesday 27 Apr 2010
Flexible Electronics Chairman:
09:00	30mn	Keynote presentation - Thermo-Mechanical Analysis of Flexible and Stretchable Systems Corresponding Author: Mario Gonzalez - IMEC Mario Gonzalez 1, Bart Vandevelde 1, Wim Christiaens 2, Yung-Yu Hsu 1, François Iker 1, Frederick Bossuyt 1, Jan Vanfleteren 1, Olaf van der Sluis 3, P.H.M. Timmermans 3 1 IMEC 2 Ghent University 3 Philips Applied Technologies
09:30	20mn	Flexible Circuits with Embedded Resistors Subjected to Extreme Thermal Loading Conditions Using the Shadow Moiré and FEM Measurements Techniques Corresponding Author: Luciano Arruda - Nokia Institute of Technology
09:50	20mn	Modeling the residual shrinkage during lithographic processing on flexible polymer substrates Corresponding Author: Marco Barink - TNO/Holst Centre M. Barink, D. van den Berg, I. Yakimets, E. Meinders, TNO/Holst Centre

 

Session 9		09:00	Tuesday 27 Apr 2010
Innovative Methods for Microsystems Modelling II Chairman:
09:00	30mn	Keynote presentation - Exemplified calculation of stress migration in a 90nm node via structure Corresponding Author: Kirsten Weide-Zaage - Leibniz Universität Hannover Kirsten Weide-Zaage, Information Technology Laboratory, Leibniz University Hannover
09:30	20mn	Improvement of micro-bridge capacitance-voltage curve linearity using shape optimization Corresponding Author: Lemaire Etienne - Aerospace and Mechanical Engineering Department, University of Liège
09:50	20mn	Multiple Environment Overstress Testing and Modelling of Solar Cells Corresponding Author: Erik Veninga - TNO Science and Industry E.P. Veninga, A.W.J. Gielen, TNO Science and Industry, Eindhoven, The Netherlands

 

Session 10		09:00	Tuesday 27 Apr 2010
Thermal-Fluid Behavior Modeling and Characterization Chairman:
09:00	30mn	Keynote presentation - Analysis of the performance reduction of axial fans in close proximity to EMC screens Corresponding Author: Raúl Antón - TECNUN-University of Navarra Raúl Antón, Asier Bengoechea, Yunesky Masip, Alejandro Rivas, Juan Carlos Ramos, Gorka S. Larraona, TECNUN-University of Navarra, Spain
09:30	20mn	CFD Assisted Design Evaluation and Experimental Verification of a Logic-Controlled Local PCB Heater for Humidity Management in Electronics Enclosure Corresponding Author: ILJA BELOV - School of Engineering, Jönköping University Ilja Belov 1, Mats Lindgren 2, Jan Ryden 3, Zahra Alavizadeh 1, Peter Leisner 2 1 School of Engineering, Jönköping University, Jönköping, Sweden 2 SP Technical Research Institute of Sweden, Borås, Sweden 3 Saab Microwave Systems, Göteborg, Sweden
09:50	20mn	Bond Wire Design for eXtreme Switch Devices Corresponding Author: Torsten Hauck - Freescale Semiconductor Germany Torsten Hauck, Anton Kolbeck, Freescale Semiconductor Germany

 

Session 11		11:00	Tuesday 27 Apr 2010
Posters TM Chairman:
		Principles for Simulation of Barrier Cracking due to high Stress Corresponding Author: Johar Ciptokusumo - Leibniz Universität Hannover, Laboratorium für Informationstechnologie, Germany Johar Ciptokusumo 1, Kirsten Weide-Zaage 1, Oliver Aubel 2 1 Leibniz Universitaet Hannover, Laboratorium fuer Informationstechnologie 2 GLOBALFOUNDRIES Incorporated
		Thermo-mechanical simulations in double-sided heat transfer power assemblies Corresponding Author: Eric WOIRGARD - Université Bordeaux 1 E. Woirgard 1, I. Favre 1, JY Deletage 1, S. Azzopardi 1, R. Leon 2, G. Convenant 2, Z. Khatir 3 1 Université de Bordeaux I,Talence, France 2 Valeo-CEE, Montigny-le-Bretonneux, France 3 Inrets, Versailles, France
		Aging Effects of Epoxy Moulding Compound on the Long-Term Stability of Plastic Package Corresponding Author: Eric Nguegang Ngnetiwe - Robert Bosch GmbH Eric Nguegang 1, Jochen Franz 1, André Kretschmann 1, Hermann Sandmaier 2 1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany 2 University of Stuttgart, Lehrstuhl Mikrosystemtechnik, Stuttgart, Germany
		Evaluating the effect of viscoelastic damping layers in the dynamic behavior of printed wiring boards Corresponding Author: Cleber Pagliosa - Nokia Institute of Technology Cleber Pagliosa, Joao Morais da Silva Neto, Nokia Institute of Technology
		Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board Corresponding Author: Wilson Carlos MAIA FILHO - Thales Corporate Services Wilson Carlos Maia Filho, Michel Brizoux, Arnaud Grivon, Thales Corporate Services, France
		Design of Al Pad Geometry for Reducing Current Crowding Effect in Flip-chip Solder Joint Using Finite-element Analysis Corresponding Author: Yuan-wei Chang - National Chiao Tung University Y. W. Chang, Chih Chen, Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan, ROC
		Efficiency and robustness of some behavior laws in the description of viscoplastic deformation and degradation of solder materials Corresponding Author: Sabeur MSOLLI - Université de Toulouse ; INP/ENIT ; LGP Sabeur MSOLLI, Adrien ZÈANH, Olivier DALVERNY, Moussa KARAMA, Université de Toulouse ; INP/ENIT ; LGP ; Tarbes, France
		Thermomechanical characterization of electronic components Corresponding Author: SANA BEN KHLIFA - . bLaboratoire d\'Electronique et des Technologies de l\'Information, CEA / LETI-MINATEC, and.Laboratoire de mécanique Biomécani Sana Ben KHLIFA 1, Napo BONFOH 1, Paul LIPINSKI 1, Manuel FENDLER 2, Stéphane BERNABE 2, Hervé RIBOT 2 1 Laboratoire de mécanique Biomécanique Polymère Structures (LaBPS), Ecole Nationale d’Ingénieurs de Metz (ENIM) ,Metz,France. 2 Laboratoire d'Electronique et des Technologies de l'Information, CEA / LETI-MINATEC, Grenoble,France.
		Thermo-mechanical simulations of LTCC packages for RF MEMS applications Corresponding Author: Lenkkeri, Jaakko Tapani - VTT Technical Research Centre of Finland J. Lenkkeri 1, E. Juntunen 1, M. Lahti 1, S. Bouwstra 2 1 VTT Technical Research Centre of Finland, Oulu, Finland 2 MEMS TC, Amsterdam, The Netherlands
		Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality Corresponding Author: Willem van Driel - NXP Semiconductors E. Spaan 1, E. Ooms 1, W.D. van Driel 2, C.A. Yuan 1, D.G. Yang 3, G.Q. Zhang 4 1 NXP Semiconductors, Nijmegen, The Netherlands 2 NXP Semiconductors, Nijmegen; Delft University of Technology, Delft, The Netherlands 3 NXP Semiconductors, Nijmegen, The Netherlands; Guilin University, Guilin, China 4 Delft University of Technology, Delft; Phillips Lighting, Eindhoven, The Netherlands
		GaAs-Based Laser Diode Bonding-Induced Stress Investigation By Means Of Simulation And Degree Of Polarization Of The Photoluminescence Measurements Corresponding Author: Julien Le Clec\'h - 3S Photonics Julien LeClecH 1, Daniel T. Cassidy 2, Michel Biet 1, François Laruelle 1, Mauro Bettiati 1, Jean-Pierre Landesman 3 1 3S Photonics 2 McMaster University 3 Université de Nantes
		Mechanical and Thermal Simulations of a Microactuator for the Stimulation of the Perilymph Corresponding Author: Tom Creutzburg - Leibniz Universität Hannover - Institute for Microtechnology H.H. Gatzen, Leibniz Universität Hannover - Institute for Microtechnology, Garbsen, Germany
		Thermomechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array) : Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability Corresponding Author: CHAILLOT Agnès - EADS Innovation Works CHAILLOT A. 1, MUNIER C. 1, MAIRE O. 1, VIGIER M. 2, CHASTANET C. 2 1 EADS Innovation Works 2 AIRBUS
		Influence of PCB design and materials on chip solder joint reliability Corresponding Author: Berthou Matthieu - MBDA France Berthou Matthieu 1, Hélène Frémont 2, Alexandrine Gracia 2, C.Jéphos-Davennel 3 1 MBDA France, IMS Bordeaux, DGA 2 IMS Bordeaux 3 DGA CELAR
		Loop Height - Its Significant Impact on IC Copper Wire Bonding Corresponding Author: Silnore Sabando - Fairchild Semiconductor
		Measurement of Viskoelastic Material Properties of Adhesives for SHM Sensors Under Harsh Environmental Conditions Corresponding Author: Boehme, Bjoern - Technische Universität Dresden, Electronics Packaging Laboratory Boehme, B. 1, Roellig, M. 2, Wolter, K.-J. 1 1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany 2 Fraunhofer-Institut for Non-destructive Testing, Dresden, Germany
		Warpage Simulation of IC Packages during Molding and Post-mold Processes Corresponding Author: Hwang, Sheng-Jye - Dept. of ME, National Cheng Kung University, Tainan, Taiwan
		Numerical Multi-objective Optimization Used to Elasto-plastic Material Extraction of Thin Layers Through Nanoindentaion Technique Corresponding Author: Lukasz Dowhan - Wroclaw University of technology Lukasz Dowhan 1, Artur Wymyslowski 1, Olaf Wittler 2, Raul Mroßko 2 1 Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Poland 2 Fraunhofer IZM, Micro Materials Center, Germany
		Moisture Sensitive Plastic Packages of IC Devices: Design for Reliability Corresponding Author: Xuejun Fan - Lamar University
		Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates Corresponding Author: Karsten Meier - Technische Universität Dresden Karsten Meier 1, Mike Roellig 2, Steffen Wiese 3, Klaus-Jürgen Wolter 1 1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany 2 Fraunhofer Institute for Non-Destructive Testing (IZFP-D), Dresden, Germany 3 Fraunhofer Center for Silicon-Photovoltaics (CSP), Halle, Germany
		Thermoelastic Analysis on the Interacting Piezoelectric Fibers: a Micromechanical Approach Corresponding Author: Roohollah Hashemi - Sharif University of Technology
		The study of carbon nanotube's length in reference to its thermal conductivity by molecular dynamics approach Corresponding Author: Bartosz Platek - Wroclaw University of Technology Bartosz Platek, Tomasz Falat, Jan Felba, Artur Borzdun, Wroclaw University of Technology, Faculty of Microsystems Electronics and Photonics, Laboratory for Interconnecting and Packaging Electronic Circuits
		Vibration Reliability of SMD Pb-free Solder Joints Corresponding Author: Mario Borras - Robert Bosch GmbH Mario Borras 1, Olivier Lanier 1, Roumen Ratchev 1, Michael Guyenot 1, Daniel Coutellier 2 1 Robert Bosch GmbH, Corporate Research CR/APJ3, D-71701 Schwieberdingen (Germany) 2 LAMIH, UMR CNRS 8530, Université de Valenciennes, F-59313 VAlenciennes Cedex 9 (France)
		Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages Corresponding Author: Daniel Vanderstraeten - ON Semiconductor Daniel Vanderstraeten 1, Andrej Ivankovic 1, Kris Vanstreels 2, Guy Brizar 1, Renaud Gillon 1, Eddy Blansaer 1, Bart Vandevelde 2 1 ON Semiconductor, Oudenaarde, Belgium 2 IMEC, Leuven, Belgium
		Vibration Durability of Pb-free HVQFN Assemblies Corresponding Author: Abhijit Dasgupta - Center for Advanced Life Cycle Engineering, Mechanical Engineering Dept, University of Maryland C. Choi 1, M. Al-Bassyiouni 2, A. Dasgupta 2, J. W. C. de Vries 3, W. Balemans 3, W. van Driel 4 1 CALCE Center, University of Maryalnd 2 CALCE Center, University of Maryland 3 Philips Applied Technologies 4 Philips Lighting
		Mechanism analyses on PBGA strip packaging warpage Corresponding Author: Yeong K. Kim - Korea Aerospace University In Soo Park 1, Jooho Choi 2, Jin Hyuk Gang 2 1 Doosan Corporation Electro-materials 2 Korea Aerospace University
		Numerical Simulations of Thermo-Mechanical Stresses during the Casting of Multi-Crystalline Silicon Ingots Corresponding Author: Marcus Oswald - Fraunhofer Center for Silicon Photovoltaics M. Turek, J. Bagdahn, Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany
		Interconnection Technologies for Photovoltaic Modules – Analysis of technological and mechanical Problems Corresponding Author: Steffen Wiese - Fraunhofer CSP Steffen Wiese 1, Frank Kraemer 1, Norbert Betzl 2, Dietmar Wald 2 1 Fraunhofer CSP, Halle, Germany 2 SOLARWATT AG, Dresden, Germany
		A Case Study of Networked Sensors by Simulations and Experiments Corresponding Author: Cheng Guo - Delft University of Technology Cheng Guo, Martin Jacobsson, R. Venkatesha Prasad, Delft University of Technology
		Interfacial delamination and thermal fatigue life estimation of multilayered metal MEMS Corresponding Author: Angelo R. Maligno - Loughborough University
		SINTERING, IN DIFFERENT TEMPERATURES, OF TRACES OF SILVER PRINTED IN FLEXIBLE SURFACES Corresponding Author: Rafael Drumond Mancosu, Dr. - INdT - Instituto Nokia de Tecnologia Mancosu, R. D., Quintero, J, A, Q., Azevedo, R. E. S., Nokia Institute of Technology - INdT, Manaus, Brazil

 

Session 12		11:00	Tuesday 27 Apr 2010
Posters MP+TF Chairman:
		Virtual prototyping of PoP interconnections regarding electrically activated mechanisms Corresponding Author: Kirsten WEIDE-ZAAGE - Leibniz University Hannover Lutz Meinshausen 1, Kirsten Weide-Zaage 1, Hélène Frémont 2, Wei Feng 2 1 Laboratorium für Informationstechnologie, University Hannover 2 Laboratoire IMS, CNRS UMR 5218, ENSEIRB, Université Bordeaux I
		Response of an Electrostatically Actuated Microbeam to Drop-Table Test Corresponding Author: Mohammad I Younis - State University of New York at Binghamton H. Ouakad, M. I. Younis, F. Alsaleem, T. Levo, J. Pitarresi,, SUNY Binghamton
		The Degradation of Solder Joints Under High Current Density and Low-Cycle Fatigue Corresponding Author: Davide Di Maio - National Physical Laboratory D. Di Maio 1, C. Murdoch 2, O. Thomas 1, C. Hunt 1 1 National Physical Laboratory, Teddington, UK 2 Imperial College, London UK
		Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test Corresponding Author: Lihua Liang - Zhejiang University of Technology Fei Liu 1, Qiang Wang 1, Lihua Liang 1, Yong Liu 2 1 Zhejiang University of Technology, Fairchild-ZJUT Microelectronic Packaging Joint Lab, Hangzhou, China 2 Fairchild Semiconductor, S. Portland, Maine, USA
		Reliability Study of Stretchable Interconnect by Simulations Corresponding Author: Quayle Chen - Nokia Research Center (Beijing), Advanced System Engineering
		Design of Jigs of Cellular Phones for Drop Test of OLED Modules Corresponding Author: Kwangju Lee - Korea University of Technology and Education
		MEMS Control by Periodic Networks of Resistances Corresponding Author: Ratier Nicolas - FEMTO-ST Hui HUI 1, Youssef YAKOUBI 2, Michel LENCZNER 1, Nicolas RATIER 1 1 FEMTO-ST, Département Temps-Fréquences Université de Franche-Comté, Besaçon, France 2 Laboratoire Jacques-Louis Lions, Université Pierre et Marie Curie, Paris, France
		FE Modelling of Capacitive Pressure Sensors Realized in LTCC Technology Corresponding Author: Cristina Marghescu - University “Politehnica” of Bucharest, Center for Technological Electronics and Interconnection Techniques
		SINTERING, IN DIFFERENT TEMPERATURES, OF TRACES OF SILVER PRINTED IN FLEXIBLE SURFACES Corresponding Author: Rafael Drumond Mancosu - Instituto Nokia de Tecnologia - INdT
		Comparison and characterization of a typical strain gage trace against another using the printed method Corresponding Author: JAIRO ALONSO QUINTERO QUINTERO - Nokia Institute of Technology - INdT Quintero, Jairo Alonso Quintero, Mancosu, Rafael Drumond, Nokia Institute of Technology - INdT, Manaus, Brazil
		Large Deformation of Beam Columns - a Closed Form Solution and Design Guide for Vertical Buckling Probe Needles Corresponding Author: Torsten Hauck - Freescale Semiconductor germany Torsten Hauck, Freescale Semiconductor Germany Wolfgang H. Müller, Technische Universität Berlin
		A NEW ITERATIVE ALGORITHM FOR THE SOLUTION FOR THE LOAD DEFLECTION SQUARE MEMBRANES Corresponding Author: Youssef Hicham - LAAS CNRS Youssef Hicham 1, André Ferrand 2, Patrick Pons 1, Robert Plana 1 1 LAAS CNRS 2 LAAS CNRS, ICA-MSEM
		Optical stability of silicone based butt-coupling optical interconnect Corresponding Author: Dengke Cai - Technische Universität Dortmund, Fakultät für Elektrotechnik und Informationstechnik
		Numerical modeling of temperature distribution in power transformers to determine the hot spot temperature and location Corresponding Author: aydin ghaffarnajad mehraban - power and water university of technology
		Numerical multiscale analysis of TG of crosslinked polymer Corresponding Author: Sebastian J. Tesarski - Wroclaw University of Technology Sebastian J. Tesarski 1, Ole Hölck 2, Artur Wymysłowski 1 1 Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland 2 Fraunhofer Institut Zuverlässigkeit und Mikrointegration, Volmerstr. 9B, 12489 Berlin, Germany
		THERMAL MODELLING OF THE EMERGING MULTI-CHIP PACKAGES Corresponding Author: Eric Monier-Vinard - Thales Corporate Services Eric Monier-Vinard, Valentin Bissuel, Paul Murphy, Olivier Daniel, Julien Dufrenne, THALES CST
		Electro-thermal investigation of silicon power inverters operating at low switching Frequencies Corresponding Author: Yves SCUDELLER - Université de Nantes

 

Session 13		13:30	Tuesday 27 Apr 2010
Thermo-Mechanical Modeling I Chairman:
13:30	30mn	Keynote presentation - Simulation of Drop Testing at Extremely High Accelerations Corresponding Author: Abhijit Dasgupta - Center for Advanced Life Cycle Engineering, Mechanical Engineering Dept., University of Maryland Stuart Douglas, M. Al-Bassyiouni, A. Dasgupta, CALCE Center, University of Maryland
14:00	20mn	Numerical investigations of the strain behavior in nanoscale patterned strained silicon structures Corresponding Author: Falk Naumann - Fraunhofer Institute for Mechanics of Materials O. Moutanabbir 1, M. Reiche 1, C. Schriever 2, J. Schilling 2, M. Petzold 3 1 Max Planck Institute of Microstructure Physics, Halle, Germany 2 ZIK "Sili-nano", Martin-Luther-University Halle, Germany 3 Fraunhofer Institute for Mechanics of Materials, Halle, Germany
14:20	20mn	MULTISCALE MODELING OF NONLINEAR BEHAVIOR OF NANO-REINFORCED STRUCTURAL ADHESIVE BONDS FOR AEROSPACE APPLICATIONS Corresponding Author: Shaker A. Meguid - University of Toronto, Canada
14:40	20mn	Virtual Thermo-Mechanical Prototyping for High-Temperature-Application Microelectronics Corresponding Author: Daoguo Yang - NXP Semiconductors
15:00	20mn	Multi-scale modeling of the Viscoplastic Response of As-fabricated Microscale Sn3.0Ag0.5Cu Solder Interconnects Corresponding Author: Gayatri Cuddalorepatta - University of Maryland Gayatri Cuddalorepatta, Abhijit Dasgupta, CALCE Electronic Products and Systems Center, University of Maryland, USA

 

Session 14		13:30	Tuesday 27 Apr 2010
Modelling of MEMS devices II Chairman:
13:30	30mn	Keynote presentation - FEM assisted Development of a SHM-Piezo-Package for Damage Evaluation in Airplane Components Corresponding Author: Mike Roellig - Fraunhofer Institute for Non-Destructive Testing Mike Roellig 1, Lars Schubert 1, Uwe Lieske 1, Bjoern Boehme 2, Bernd Frankenstein 1, Norbert Meyendorf 1 1 Fraunhofer Institute for Non-Destructive Testing 2 Dresden University of Technology
14:00	20mn	Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS Corresponding Author: Joseph Zekry - IMEC vzw Joseph Zekry 1, Bart Vandevelde 1, Siebe Bouwstra 2, Robert Puers 3, Chris Van Hoof 1, Harrie A.C. Tilmans 1 1 Imec, Leuven, Belgium 2 MEMS TC, Amsterdam, The Netherlands 3 K.U.Leuven, Belgium
14:20	20mn	Modeling the effects of printed circuit motion on the response of microstructures under mechanical shock Corresponding Author: Mohammad I Younis - State University of New York at Binghamton Abdallah H Ramini, Mohammad I Younis, Ronald Miles, SUNY Binghamton
14:40	20mn	GLOBAL MODELLING OF A CORIOLIS MICRO-GYROSCOPE FOR QUADRATURE ERROR COMPENSATION Corresponding Author: DESCHARLES Melanie - ONERA Descharles Mélanie 1, Guérard Jean 1, Kokabi Hamid 2 1 ONERA, Chatillon, France 2 UPMC L2E, Ivry-sur-Seine, France
15:00	20mn	Copper Pillar Bump Structure Optimization for Flip Chip Packaging with Cu/Low-K Interconnects Corresponding Author: zhang xueren - United Test & Assembly Center Ltd

 

Session 15		13:30	Tuesday 27 Apr 2010
Molecular Modeling Chairman:
13:30	30mn	Keynote presentation - Mechanical Properties of an Epoxy, Modeled Using Particle Dynamics as Parameterized through Molecular Modeling Corresponding Author: Nancy Iwamoto - Honeywell Specialty Materials
14:00	20mn	Design of reliable Cu-epoxy interface using Molecular Dynamic Simulation Corresponding Author: Cell K Y Wong - Delft University of Technology Cell K Y Wong 1, H B Fan 2 2, G Q Zhang 1, Matthew M F Yuen 2 1 Faculty 3mE, Department PME Delft University of Technology 2 Department of Mechanical Engineering, Hong Kong University of Science and Technology
14:20	20mn	Molecular Modeling of Microelectronic Packaging Materials – Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface Corresponding Author: Ole Hölck - Micro Material Center Berlin, Fraunhofer IZM O. Hölck 1, E. Dermitzaki 1, B. Wunderle 2, J. Bauer 3, B. Michel 1 1 Micro Materials Center Berlin - Fraunhofer IZM, Berlin, Germany 2 TU Chemnitz, Chemnitz, Germany 3 SIIT - Fraunhofer IZM, Berlin, Germany
14:40	20mn	On the Mechanical Properties of Cu3Sn Intermetallic Compound through Molecular Dynamics Simulation Corresponding Author: Ching-Feng Yu - Department of Power Mechanical Engineering, National Tsing Hua University Wen-Hwa Chen 1, Hsien-Chie Cheng 2, Ching-Feng Yu 1 1 Department of Power Mechanical Engineering, National Tsing Hua University 2 Department of Aerospace and Systems Engineering, Feng Chia University
15:00	20mn	Computational materials engineering: capabilities of atomic-scale prediction of mechanical, thermal, and electric properties of microelectronic materials Corresponding Author: Erich Wimmer - Materials Design, Inc. A. Mavromaras 1, D. Rigby 2, W. Wolf 3, M. Christensen 1, M. Halls 2, C. Freeman 2, P. Saxe 4, E. Wimmer 5 1 Materials Design SARL, Stockholm, Sweden 2 Materials Design, Inc., San Diego, USA 3 Materials Design SARL, Vienna, Austria 4 Materials Design, Inc. Angel Fire, USA 5 Materials Design, Inc., Santa Fe, USA

 

Session 16		16:00	Tuesday 27 Apr 2010
Dynamic Problems Chairman:
16:00	30mn	Keynote presentation - Anomaly Detection and Fault-Mode Isolation for Prognostics Health Monitoring of Electronics Subjected to Drop and Shock Corresponding Author: Pradeep Lall - Auburn University
16:30	20mn	BGA Lifetime Prediction in JEDEC Drop Tests Accounting for Copper Trace Routing Effects Corresponding Author: Frank Kraemer - Fraunhofer CSP Frank Kraemer 1, Steffen Wiese 1, Sven Rzepka 2, Jens Lienig 3 1 Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany 2 Fraunhofer ENAS, Micro Material Center Chemnitz & Berlin, Germany 3 Dresden University of Technology, Institute of Electromechanical and Electronic Design, Germany
16:50	20mn	Computer Simulation and Design of a Solder Joint Vibration Test Machine Corresponding Author: Elisha Kamara - University of Greenwich
17:10	20mn	Optimization for Simulation of WL-CSP Subjected to Drop-Test with Plasticity Behavior Corresponding Author: Cédric LE COQ - Laboratoire de Mécanique et Rhéologie (LMR) - STMicroelectronics C. Le Coq 1, A. Tougui 2, M.-P. Stempin 3, L. Barreau 3 1 LMR - STMicroelectronics, France 2 LMR, France 3 STMicroelectronics, France
17:30	20mn	High-Speed Mechanical Impact Reliability of Solder Interconnections in High-Power LEDs Corresponding Author: Jussi Hokka - Philips Lighting J. Hokka 1, J.F.J.M. Caers 2, X.J. Zhao 2, M. de Jong 3, W. Peels 3, B. Sykes 4, G.Q. Zhang 3, M. Paulasto-Kröckel 1 1 Aalto University School of Science and Technology, Espoo, Finland 2 Philips Applied Technologies, Eindhoven, The Netherlands 3 Philips Lighting, Eindhoven, The Netherlands 4 XYZTEC bv, Panningen, The Netherlands

 

Session 17		16:00	Tuesday 27 Apr 2010
Multi-Physics Modelling for Power Electronics Devices Chairman:
16:00	30mn	Keynote presentation - Electro-thermo-mechanical simulation of automotive MOSFET transistor Corresponding Author: Hervé FERAL - EPSILON Ingénierie Xavier CHAUFFLEUR, Jen-Pierre FRADIN, EPSILON Ingénierie, Labège, France
16:30	20mn	A connection of thermo-mechanical finite elements tools with electro-thermal finite elements simulation : towards an electro-thermo-mechanical finite elements modeling for power semiconductor devices Corresponding Author: BELMEHDI - IMS Laboratory Yassine BELMEHDI, Stéphane AZZOPARDI, Eric WOIRGARD, Jean-Yves DELETAGE, Isabelle FAVRE, IMS Laboratory, University of Bordeaux
16:50	20mn	Investigation into the Reliability of IGBT Inverters Operating in Combined Aeronautical Constraints Corresponding Author: Hassan ABBAD - power electronics reliability
17:10	20mn	Finite Element Analysis of a High Voltage Semiconductor Polymeric Package Design using a Taguchi Based Experimental Design Corresponding Author: Nadeesh Nobeen - Loughborough University

 

Session 18		16:00	Tuesday 27 Apr 2010
Modeling for Advanced Packaging Chairman:
16:00	30mn	Keynote presentation - Virtual Prototyping Advanced by Statistic and Stochastic Methodologies Corresponding Author: Sven Rzepka - Fraunhofer ENAS - Micro Materials Center Sven Rzepka 1, Axel Müller 2, Bernd Michel 1 1 Fraunhofer ENAS, Micro Materials Center Chemnitz/Berlin; Chemnitz, Germany 2 BorgWarner BERU Systems GmbH, Dept. Modeling and Analysis, Ludwigsburg, Germany
16:30	20mn	Evaluation of Probing Process Parameters and PAD Designs: Experiments and Modeling Correlations for Solving Mechanical Issues Corresponding Author: Romuald ROUCOU - STMicroelectronics / EMSE-CMP Romuald Roucou 1, Vincent Fiori 2, Florian Cacho 2, Karim Inal 3, Xavier Boddaert 3 1 STMicroelectronics, Crolles, France / Ecole Nationale Supérieure des Mines de Saint Etienne, CMP-GC, Gardanne, France 2 STMicroelectronics, Crolles, France 3 Ecole Nationale Supérieure des Mines de Saint Etienne, CMP-GC, Gardanne, France
16:50	20mn	Numerical Modelling Methodology for Design of Miniaturised Integrated Products – an Application to 3D CMM Micro-probe Development Corresponding Author: Pushparajah Rajaguru - Centre for Numerical Modelling and Process Analysis
17:10	20mn	The probability design for wire bonding process by finite element and Monte Carlo method Corresponding Author: Yong Liu - Fairchild Semiconductor Corp. Huixian Wu 1, Yangjian Xu 1, Lihua Liang 1, Yong Liu 2, Stephen Martin 2 1 Fairchild-ZJUT Microelectronic Packaging Joint Lab, Zhejiang University of Technology, Hangzhou, China 2 Fairchild Semiconductor, S. Portland, Maine, USA
17:30	20mn	Mechanical Behaviour and Fatigue of Copper Ribbons used as Solar Cell Interconnectors Corresponding Author: Steffen Wiese - Fraunhofer CSP Steffen Wiese, Rico Meier, Frank Kraemer, Fraunhofer CSP, Halle, Germany

 

Session 19		09:00	Wednesday 28 Apr 2010
General lectures, mixed Chairman:
09:00	30mn	Keynote presentation - Thermo-mechanical design of a generic 0-level MEMS Package using Chip Capping and Through Silicon Via’s Corresponding Author: Bart Vandevelde - IMEC
09:30	30mn	Keynote presentation - How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies Corresponding Author: Hélène Frémont - IMS Université de Bordeaux H. Frémont, IMS-Bordeaux, Université Bordeaux 1, UMR-5218, Talence, France
10:00	30mn	Keynote presentation - Thermal Performance Enhancement by Exploitation of Nano-Effects Corresponding Author: Bernhard Wunderle - Micro Materials Centre Berlin, Fraunhofer IZM

 

Session 20		11:00	Wednesday 28 Apr 2010
Reliability Modeling Chairman:
11:00	30mn	Keynote presentation - Thermo-mechanical challenges in the longevity of microelectronics Corresponding Author: Sanders Gielen - TNO A. W. J. Gielen, TNO Science and Industry
11:30	20mn	Limitations of Norris-Landzberg Equation and Application of Damage Accumulation Based Methodology for Estimating Acceleration Factors for Pb Free Solders Corresponding Author: Ahmer Syed - Amkor Technology Ahmer Syed, Amkor Technology
11:50	20mn	Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via Corresponding Author: Samed Barnat 1, 2,3 ; Helene Fremont 3 ; Alexandrine Gracia 3 ; Eric Cadalen 1 ; Catherine Bunel 1 ; François Neuilly 1 ; Jean-R - 1 IPDIA; 2 NXP Semiconductors France; 3 Université Bordeaux I, Laboratoire IMS Samed Barnat 1, Hélène Frémont 2, Alexandrine Gracia 2, Eric Cadalen 3, Catherine Bunel 3, François Neuilly 4, Jean-René Tenailleau 5 1  IPDIA ; NXP Semiconductors Caen ; IMS Bordeaux Université de Bordeaux, France 2 IMS Bordeaux Université de Bordeaux, France 3  IPDIA, France 4 IPDIA, IEMN Université de Lille 1 , France 5 IPDIA, France
12:10	20mn	Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures Corresponding Author: Hideo Miura - Tohoku University Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura, Tohoku University
12:30	20mn	Interface Characterization Combined with Cohesive Zone Modeling Corresponding Author: Xiaosong Ma / Kaspar Jansen - Delft University of Technology Xiaosong Ma 1, G.Q. Zhang 1, O. van der Sluis 2, K.M.B. Jansen 1, W.D van Driel 3, L.J. Ernst 1, Charles Regard 4, Christian Gautier 5, Hélène Frémont 6 1 Delft University of Technology, Delft, The Netherlands 2 Philips Applied Technologies, Eindhoven, The Netherlands 3 Delft University of Technology, Delft; NXP, Nijmegen, The Netherlands 4 NXP Semiconductors; LaMIPS, Université de Caen; IMS Université de Bordeaux, Talence, France 5 NXP Semiconductors; LaMIPS, Université de Caen, France 6 IMS Université de Bordeaux, Talence, France

 

Session 21		11:00	Wednesday 28 Apr 2010
Process Modelling Chairman:
11:00	30mn	Keynote presentation - Multiscale approach optimization on surface wettabilty change on rough surface Corresponding Author: Edward K. L. Chan - Hong Kong University of Science & Technology Edward K L CHAN, Haibo FAN, Matthew M F YUEN, Hong Kong University of Science & Technology, Hong Kong
11:30	20mn	Thermo-mechanical simulations of RF-MEMS 0-level package based on wafer bonding by soldering Corresponding Author: Siebe Bouwstra - MEMS Technical Consultancy Siebe Bouwstra, Remco Hageman, MEMS Technical Consultancy, Amsterdam, The Netherlands
11:50	20mn	Electromigration modeling with consideration of hillock formation Corresponding Author: Lihua Liang - Zhejiang University of Technology Yuan Xiang Zhang 1, Lihua Liang 1, Yong Liu 2 1 Zhejiang University of Technology, Fairchild-ZJUT Microelectronic Packaging Joint Lab, Hangzhou, China 2 Fairchild Semiconductor Corp. S. Portland, USA
12:10	20mn	Multiphysics Modeling and Design of Ultralarge Multiwafer MOVPE Reactor for Group III-Nitride Light Emitting Diodes Corresponding Author: Changsung Sean Kim - SAMSUNG Electro-Mechanics Co., Ltd. Changsung Sean Kim 1, Jongpa Hong 2, Jihye Shim 1, Yongsun Won 1, Yong-Il Kwon 1 1 Samsung Electro-Mechanics Co., Ltd. 2 Samsung LED Co., Ltd.
12:30	20mn	Magnetic Analysis and Simulation of a Self-Propelled Capsule Endoscope Corresponding Author: Sheng Liu - Institute of Microsystems Chengzhi Hu, Mingyuan Gao, Zhenzhi Chen, Honghai Zhang, Sheng Liu, School of Mechanical Science & Engineering, Huazhong University of Science & Technology

 

Session 22		11:00	Wednesday 28 Apr 2010
Thermo-Mechanical Modeling II Chairman:
11:00	30mn	Keynote presentation - Board level reliability of the advanced RF Power Packaging Corresponding Author: Cadmus Yuan - Dr.
11:30	20mn	The Effect of Thermal Aging on Molding Compound Properties Corresponding Author: J. de Vreugd - TU-Delft J. de Vreugd 1, K.M.B. Jansen 1, L.J. Ernst 1, C.Bohm 2 1 Technical University Delft 2 Infineon Technologies Munich
11:50	20mn	Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests. Corresponding Author: Dr. Reinhard Pufall - Infineon Technologies AG
12:10	20mn	Effects of the Geometrical Dimensions on Stress and Strain of Electrostatically Actuated MEMS Resonators at Pull-in and Stiction Positions Corresponding Author: Pustan Marius - Aerospace & Mechanical Engineering Department, University of Liege Marius Pustan 1, Veronique Rochus 2, Jean-Claude Golinval 2 1 University of Liege, Liege, Belgium / Technical University of Cluj-Napoca, Cluj-Napoca, Romania 2 University of Liege, Liege, Belgium
12:30	20mn	Multi-scale numerical-experimental method to determine the size dependent elastic properties of composite silicon copper nano cantilevers using an electrostatic pull in experiment Corresponding Author: R.H. Poelma - Delft University of Technology R.H. Poelma, H. Sadeghian, S.P.M. Noijen, J.J.M. Zaal, G.Q. Zhang, Delft University of Technology, Delft, The Netherlands

 

Session 23		13:40	Wednesday 28 Apr 2010
Mixed Thermal / Multiphysics session Chairman:
13:40	30mn	Keynote presentation - TWO-SCALE vs THREE-SCALE FE ANALYSES OF SHOCK-INDUCED FAILURE IN POLYSILICON MEMS Corresponding Author: Alberto Corigliano - Politecnico di Milano S. Mariani 1, A. Ghisi 1, R. Martini 1, A. Corigliano 1, B. Simoni 2 1 Politecnico di Milano, Dipartimento di Ingegneria Strutturale, Milan, Italy 2 STMicroelectronics, MH Division, Cornaredo, Italy
14:10	30mn	Keynote presentation - Simulation of Particle Levitation due to Dielectrophoresis Corresponding Author: Rochus Véronique - University of Liège Rochus Véronique 1, Hannot Stephan 2, Golinval Jean-Claude 1, Rixen Daniel 2 1 University of Liège 2 TU Delft

 

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors  Time table for Speakers

Authors: find your session number:

• AZZOPARDI :  17  Al-Bassyiouni :  11 13  Alavizadeh :  10  Alkemade :  2  Alsaleem :  12  Ancey :  3  Antón :  10  Ardito :  3  Assous :  6  Aubel :  11  Auersperg :  5  Azzopardi :  11  
• BELMEHDI :  17  BERNABE :  11  BONFOH :  11  Bagdahn :  11  Balemans :  11  Baric :  7  Barink :  8  Barnat :  20  Barreau :  16  Bauer :  15  Belov :  10  Bengoechea :  10  Berg :  8  Bernabé :  4  Bettiati :  11  Betzl :  11  Biet :  11  Bissuel :  12  Blansaer :  11  Blecic :  7  Boddaert :  18  Boehme :  14  Borras :  11  Borzdun :  11  Bossuyt :  8  Bouwstra :  6 11 14 21  Brizar :  11  Brizoux :  11  Bunel :  20  Bychikhin :  7  
• CHAN :  21  CHAUFFLEUR :  17  Cacho :  18  Cadalen :  20  Caers :  16  Carpentier :  3  Casset :  3  Cassidy :  11  Chan :  5  Chang :  11  Chen :  11 15 21  Cheng :  15  Chi :  4  Chiang :  4  Choi :  11  Christensen :  15  Christiaens :  8  Ciptokusumo :  11  Civet :  3  Convenant :  11  Coq :  16  Corfa :  4  
• 0 :  2 11  
• Corigliano :  3 23  Coutellier :  11  Cuddalorepatta :  13  
• DALVERNY :  11  DELETAGE :  17  Daniel :  12 23  Dasgupta :  11 13  Deletage :  11  Dermitzaki :  15  Doering :  2  Douglas :  13  Dowhan :  11  Driel :  2 3 11 20  Drumond :  12  Dudek :  2  Dufrenne :  12  Durand :  3  
• Ernst :  2 20 22  
• FAN :  21  FAVRE :  17  FENDLER :  11  FRADIN :  17  Falat :  11  Favre :  11  Felba :  11  Feng :  12  Ferrand :  12  Filho :  11  Fink :  4  Fiori :  18  Frangi :  3  Frankenstein :  14  Franz :  11  Freeman :  15  Frémont :  11 12 19 20  
• GOLINVAL :  3  Gang :  11  Gao :  21  Gasse :  4  Gatzen :  11  Gautier :  20  Ghisi :  23  Gielen :  2 9 20  Gillon :  11  Golinval :  22  Gonzalez :  8  Gracia :  11 20  Grillberger :  5  Grivon :  11  Groenhuis :  5  Guo :  11  Guyenot :  11  
• HUI :  12  Hageman :  21  Halls :  15  Hamid :  14  Hauck :  10 12  Hicham :  12  Hofinger :  6  Hokka :  16  Holgado :  5  Hong :  21  Hoof :  14  Hsu :  8  Hu :  21  Hunt :  12  Hölck :  12 15  
• Iker :  8  Inal :  18  Ivankovic :  11  
• Jacobsson :  11  Jansen :  20 22  Jean :  14  Jean-Claude :  23  Jong :  16  Jungwirth :  6  Juntunen :  11  
• KARAMA :  11  KHLIFA :  11  Kamminga :  2  Khan :  4  Khatir :  11  Kim :  21  Kishi :  20  Kolbeck :  10  Kraemer :  11 16 18  Kregting :  2  Kretschmann :  11  Kreyssig :  2  Kwon :  21  
• LENCZNER :  12  LIPINSKI :  11  Lahti :  11  Lambird :  5  Landesman :  11  Lanier :  11  Larraona :  10  Laruelle :  11  LeClecH :  11  Lee :  5  Lehr :  5  Leisner :  10  Lenkkeri :  11  Leon :  11  Levo :  12  Liang :  12 18 21  Lienig :  16  Lieske :  14  Lindgren :  10  Liu :  12 18 21  
• MSOLLI :  11  Ma :  20  Mack :  4  Maio :  12  Malena :  7  Mariani :  23  Martens :  4  Martin :  18  Martini :  23  Masip :  10  Matthieu :  11  Mattila :  2  Mavromaras :  15  Meier :  11 18  Meinders :  8  Meinshausen :  12  Meyendorf :  14  Michel :  2 5 15 18  Miles :  14  Miro :  2  Miura :  20  Monier-Vinard :  12  Monthei :  5  Moutanabbir :  13  Mroßko :  11  Murdoch :  12  Murphy :  12  Mélanie :  14  Müller :  12 18  
• NOELS :  3  Nakahira :  20  Neto :  11  Neuilly :  20  Nguegang :  11  Noijen :  5 22  
• Ollier :  3  Ooms :  11  Ouakad :  12  
• Pagliosa :  11  Pape :  2  Park :  11  Paulasto-Kröckel :  2 16  Peels :  16  Petzold :  13  Pitarresi, :  12  Plana :  12  Platek :  11  Poelma :  22  Pogany :  7  Pons :  12  Prasad :  11  Puers :  14  Pustan :  22  
• Quintero :  12  
• RATIER :  12  RIBOT :  11  ROCHUS :  3  Ramini :  14  Ramos :  10  Ratchev :  11  Regard :  20  Reiche :  13  Ribot :  4  Rigby :  15  Rivas :  10  Robert :  3  Rochus :  22  Roellig :  11 14  Rolland :  6  Roucou :  18  Ryden :  10  Rzepka :  16 18  
• Sadeghian :  22  Saka :  4  Sandmaier :  11  Sato :  20  Saxe :  15  Schilling :  13  Schlottig :  2  Schriever :  13  Schubert :  14  Segre :  6  Seok :  6  Shim :  21  Simoni :  23  Sluis :  5 8 20  Spaan :  11  Stempin :  16  Stephan :  23  Su :  4  Suzuki :  20  Syed :  20  Sykes :  16  
• Tack :  7  Takeda :  4  Tenailleau :  20  Tesarski :  12  Thomas :  12  Tilmans :  14  Timmermans :  8  Tohmyoh :  4  Tougui :  16  Turek :  11  
• Vanderstraeten :  11  Vandevelde :  8 11 14  Vanfleteren :  8  Vanstreels :  11  Veninga :  9  Voelklein :  4  Vogel :  5  Vreugd :  22  Vries :  11  Véronique :  23  
• WOIRGARD :  17  WU :  3  Walczyk :  5  Wald :  11  Wang :  12  Weide-Zaage :  9 11 12  Weinzierl :  6  Wieers :  7  Wiese :  11 16 18  Wilde :  4  Wimmer :  15  Wittler :  11  Woirgard :  11  Wolf :  15  Wolter :  11  Won :  21  Wong :  15  Wu :  18  Wunderle :  2 15  Wymysłowski :  12  Wymyslowski :  11  
• Xiao :  2  Xu :  18  
• YAKOUBI :  12  YUEN :  21  Yakimets :  8  Yang :  4 11  Younis :  12 14  Yu :  15  Yuan :  11  Yuen :  15  
• Zaal :  3 22  Zekry :  14  Zhang :  3 11 15 16 20 21 22  Zhao :  16  Zhu :  5  ZÈANH :  11  
• 2 :  15  

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors  Time table for Speakers

Speakers: find your schedule

• : Monday 26 Apr 2010 session 1 at 11:10 (#1)
• : Monday 26 Apr 2010 session 1 at 11:40 (#2)
• : Monday 26 Apr 2010 session 1 at 12:10 (#3)
• : Monday 26 Apr 2010 session 3 at 14:00 (#1)
• : Monday 26 Apr 2010 session 4 at 15:30 (#5)
• : Monday 26 Apr 2010 session 6 at 17:30 (#4)
• : Monday 26 Apr 2010 session 7 at 16:50 (#2)
• : Monday 26 Apr 2010 session 7 at 17:10 (#3)
• : Monday 26 Apr 2010 session 7 at 17:30 (#4)
• : Tuesday 27 Apr 2010 session 8 at 09:30 (#2)
• : Tuesday 27 Apr 2010 session 9 at 09:30 (#2)
• : Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• : Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• : Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• : Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• : Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• : Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• : Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• : Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• : Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• : Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• : Tuesday 27 Apr 2010 session 12 at 11:20 (poster)
• : Tuesday 27 Apr 2010 session 12 at 11:40 (poster)
• : Tuesday 27 Apr 2010 session 13 at 14:20 (#3)
• : Tuesday 27 Apr 2010 session 13 at 14:40 (#4)
• : Tuesday 27 Apr 2010 session 14 at 15:00 (#5)
• : Tuesday 27 Apr 2010 session 15 at 13:30 (#1)
• : Tuesday 27 Apr 2010 session 16 at 16:00 (#1)
• : Tuesday 27 Apr 2010 session 16 at 16:50 (#3)
• : Tuesday 27 Apr 2010 session 17 at 16:50 (#3)
• : Tuesday 27 Apr 2010 session 17 at 17:10 (#4)
• : Tuesday 27 Apr 2010 session 18 at 16:50 (#3)
• : Wednesday 28 Apr 2010 session 19 at 09:00 (#1)
• : Wednesday 28 Apr 2010 session 19 at 10:00 (#3)
• : Wednesday 28 Apr 2010 session 22 at 11:00 (#1)
• : Wednesday 28 Apr 2010 session 22 at 11:50 (#3)
• A. Corfa: Monday 26 Apr 2010 session 4 at 15:10 (#4)
• A. Mavromaras: Tuesday 27 Apr 2010 session 15 at 15:00 (#5)
• A. W. J. Gielen: Wednesday 28 Apr 2010 session 20 at 11:00 (#1)
• A.Vrbicky: Monday 26 Apr 2010 session 7 at 16:20 (#1)
• Abdallah H Ramini: Tuesday 27 Apr 2010 session 14 at 14:20 (#3)
• Ahmer Syed: Wednesday 28 Apr 2010 session 20 at 11:30 (#2)
• Bartosz Platek: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Bergers, L.I.J.C.: Monday 26 Apr 2010 session 2 at 14:50 (#3)
• Berthou Matthieu: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Boehme, B.: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• C. Choi: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• C. Le Coq: Tuesday 27 Apr 2010 session 16 at 17:10 (#4)
• Cell K Y Wong: Tuesday 27 Apr 2010 session 15 at 14:00 (#2)
• CHAILLOT A.: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Changsung Sean Kim: Wednesday 28 Apr 2010 session 21 at 12:10 (#4)
• Cheng Guo: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Chengzhi Hu: Wednesday 28 Apr 2010 session 21 at 12:30 (#5)
• Cleber Pagliosa: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• D. Di Maio: Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• Daniel Vanderstraeten: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Descharles Mélanie: Tuesday 27 Apr 2010 session 14 at 14:40 (#4)
• E. Spaan: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• E. Woirgard: Tuesday 27 Apr 2010 session 11 at 11:00 (poster)
• E.P. Veninga: Tuesday 27 Apr 2010 session 9 at 09:50 (#3)
• Edward K L CHAN: Wednesday 28 Apr 2010 session 21 at 11:00 (#1)
• Eric Monier-Vinard: Tuesday 27 Apr 2010 session 12 at 11:40 (poster)
• Eric Nguegang: Tuesday 27 Apr 2010 session 11 at 11:00 (poster)
• F. Casset: Monday 26 Apr 2010 session 3 at 14:30 (#2)
• Fei Liu: Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• Franck Assous: Monday 26 Apr 2010 session 6 at 16:50 (#2)
• Frank Kraemer: Tuesday 27 Apr 2010 session 16 at 16:30 (#2)
• Gayatri Cuddalorepatta: Tuesday 27 Apr 2010 session 13 at 15:00 (#5)
• Gerd Schlottig: Monday 26 Apr 2010 session 2 at 15:10 (#4)
• H. Frémont: Wednesday 28 Apr 2010 session 19 at 09:30 (#2)
• H. Ouakad: Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• H.H. Gatzen: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Hironori Tohmyoh: Monday 26 Apr 2010 session 4 at 14:30 (#2)
• Hui HUI: Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• Huixian Wu: Tuesday 27 Apr 2010 session 18 at 17:10 (#4)
• Ilja Belov: Tuesday 27 Apr 2010 session 10 at 09:30 (#2)
• In Soo Park: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• J. de Vreugd: Wednesday 28 Apr 2010 session 22 at 11:30 (#2)
• J. Hokka: Tuesday 27 Apr 2010 session 16 at 17:30 (#5)
• J. Lenkkeri: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• J.J.M. Zaal: Monday 26 Apr 2010 session 3 at 14:50 (#3)
• Johar Ciptokusumo: Tuesday 27 Apr 2010 session 11 at 11:00 (poster)
• Joseph Zekry: Tuesday 27 Apr 2010 session 14 at 14:00 (#2)
• Juergen Auersperg: Monday 26 Apr 2010 session 5 at 16:50 (#2)
• Julien LeClecH: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Karsten Meier: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Kirsten Weide-Zaage: Tuesday 27 Apr 2010 session 9 at 09:00 (#1)
• Kohta Nakahira: Wednesday 28 Apr 2010 session 20 at 12:10 (#4)
• Ling WU: Monday 26 Apr 2010 session 3 at 15:10 (#4)
• Liping Zhu: Monday 26 Apr 2010 session 5 at 17:10 (#3)
• Lukasz Dowhan: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Lutz Meinshausen: Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• M. Barink: Tuesday 27 Apr 2010 session 8 at 09:50 (#3)
• M. Jungwirth: Monday 26 Apr 2010 session 6 at 16:20 (#1)
• M. Turek: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Mancosu, R. D.: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Mario Borras: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Mario Gonzalez: Tuesday 27 Apr 2010 session 8 at 09:00 (#1)
• Marius Pustan: Wednesday 28 Apr 2010 session 22 at 12:10 (#4)
• Mike Roellig: Tuesday 27 Apr 2010 session 14 at 13:30 (#1)
• O. Hölck: Tuesday 27 Apr 2010 session 15 at 14:20 (#3)
• O. Moutanabbir: Tuesday 27 Apr 2010 session 13 at 14:00 (#2)
• Quintero, Jairo Alonso Quintero: Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• R.H. Poelma: Wednesday 28 Apr 2010 session 22 at 12:30 (#5)
• Raffaele Ardito: Monday 26 Apr 2010 session 3 at 15:30 (#5)
• Rainer Dudek: Monday 26 Apr 2010 session 2 at 14:30 (#2)
• Raúl Antón: Tuesday 27 Apr 2010 session 10 at 09:00 (#1)
• René Kregting: Monday 26 Apr 2010 session 2 at 15:30 (#5)
• Rochus Véronique: Wednesday 28 Apr 2010 session 23 at 14:10 (#2)
• Romuald Roucou: Tuesday 27 Apr 2010 session 18 at 16:30 (#2)
• S. Mariani: Wednesday 28 Apr 2010 session 23 at 13:40 (#1)
• Sabeur MSOLLI: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Samed Barnat: Wednesday 28 Apr 2010 session 20 at 11:50 (#3)
• Sana Ben KHLIFA: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Sander Noijen: Monday 26 Apr 2010 session 5 at 17:30 (#4)
• Sebastian J. Tesarski: Tuesday 27 Apr 2010 session 12 at 11:40 (poster)
• Seonho Seok: Monday 26 Apr 2010 session 6 at 17:10 (#3)
• Siebe Bouwstra: Wednesday 28 Apr 2010 session 21 at 11:30 (#2)
• Stefan Martens: Monday 26 Apr 2010 session 4 at 14:00 (#1)
• Steffen Wiese: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Steffen Wiese: Tuesday 27 Apr 2010 session 18 at 17:30 (#5)
• Stuart Douglas: Tuesday 27 Apr 2010 session 13 at 13:30 (#1)
• Sven Rzepka: Tuesday 27 Apr 2010 session 18 at 16:00 (#1)
• Toni. T. Mattila: Monday 26 Apr 2010 session 2 at 14:00 (#1)
• Torsten Hauck: Tuesday 27 Apr 2010 session 10 at 09:50 (#3)
• Torsten Hauck: Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• Wen-Hwa Chen: Tuesday 27 Apr 2010 session 15 at 14:40 (#4)
• Wilson Carlos Maia Filho: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Xavier CHAUFFLEUR: Tuesday 27 Apr 2010 session 17 at 16:00 (#1)
• Xiaosong Ma: Wednesday 28 Apr 2010 session 20 at 12:30 (#5)
• Y. S. Chan: Monday 26 Apr 2010 session 5 at 16:20 (#1)
• Y. W. Chang: Tuesday 27 Apr 2010 session 11 at 11:20 (poster)
• Yassine BELMEHDI: Tuesday 27 Apr 2010 session 17 at 16:30 (#2)
• Yen-Fu Su: Monday 26 Apr 2010 session 4 at 14:50 (#3)
• Youssef Hicham: Tuesday 27 Apr 2010 session 12 at 11:00 (poster)
• Yuan Xiang Zhang: Wednesday 28 Apr 2010 session 21 at 11:50 (#3)

Compiled on Fri, 05 Mar 2010 10:59:15 +0100

End of programme