Advance programme

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors  Time table for Speakers

Day 1 - Monday 26 Apr 2010
08.00Registration desk open
09.00OPENING SESSION by the General Chair
09.10INDUSTRIAL TRENDS KEYNOTE 1: tbd
09.40INDUSTRIAL TRENDS KEYNOTE 2: tbd
10.10INDUSTRIAL TRENDS KEYNOTE 3: tbd
10.40Break
11:10 S. 1  New Developments in Modeling
12.40Lunch
14:00 S. 2  Experimental Investigations S. 3  Modelling of MEMS Devices I S. 4  Thermal Modelling and Characterization
15.50Coffee break
16:20 S. 5  Damage and Failure S. 6  Innovative Methods for Microsystems Modelling I S. 7  Electrothermal Modeling and Characterization
18.00Transport by bus to Château Le Thil
19.00Dinner in Château Le Thil
Day 2 - Tuesday 27 Apr 2010
09:00 S. 8  Flexible Electronics S. 9  Innovative Methods for Microsystems Modelling II S. 10  Thermal-Fluid Behavior Modeling and Characterization
10.10Break
11:00 S. 11  Posters TM S. 12  Posters MP+TF
12.20Lunch
13:30 S. 13  Thermo-Mechanical Modeling I S. 14  Modelling of MEMS devices II S. 15  Molecular Modeling
15.20Break
16:00 S. 16  Dynamic Problems S. 17  Multi-Physics Modelling for Power Electronics Devices S. 18  Modeling for Advanced Packaging
18.30Reception at the venue
Day 3 - Wednesday 28 Apr 2010
09:00 S. 19  General lectures, mixed
10.30Break
11:00 S. 20  Reliability Modeling S. 21  Process Modelling S. 22  Thermo-Mechanical Modeling II
12.20Lunch
13:40 S. 23  Mixed Thermal / Multiphysics session
15.40End of conference

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors  Time table for Speakers

List of Technical Sessions
S-1 New Developments in Modeling
S-2 Experimental Investigations
S-3 Modelling of MEMS Devices I
S-4 Thermal Modelling and Characterization
S-5 Damage and Failure
S-6 Innovative Methods for Microsystems Modelling I
S-7 Electrothermal Modeling and Characterization
S-8 Flexible Electronics
S-9 Innovative Methods for Microsystems Modelling II
S-10 Thermal-Fluid Behavior Modeling and Characterization
S-11 Posters TM
S-12 Posters MP+TF
S-13 Thermo-Mechanical Modeling I
S-14 Modelling of MEMS devices II
S-15 Molecular Modeling
S-16 Dynamic Problems
S-17 Multi-Physics Modelling for Power Electronics Devices
S-18 Modeling for Advanced Packaging
S-19 General lectures, mixed
S-20 Reliability Modeling
S-21 Process Modelling
S-22 Thermo-Mechanical Modeling II
S-23 Mixed Thermal / Multiphysics session

Go to Global conference schedule  List of Technical Sessions  Technical program  List of sessions by Authors  Time table for Speakers

Session 111:10 Monday 26 Apr 2010
New Developments in Modeling
Chairman: B. Michel, Fraunhofer IZM; L.J. Ernst, Delft University of Technology
11:1030mnKeynote presentation - Wafer Level Packaging (WLP): from Fan-in to Fan-out
Corresponding Author: Xuejun Fan - Lamar University
11:4030mnKeynote presentation - Trends in Microsystems Integration and its Impact on Reliability
Corresponding Author: Mervi Paulasto-Kröckel - Aalto University School of Science and Technology
12:1030mnKeynote presentation - Jets and Rotary Flows for Single-Phase Liquid Cooling: An Overview of Some Recent Experimental Findings
Corresponding Author: Jeff Punch - CTVR, Stokes Institute

 

Session 214:00 Monday 26 Apr 2010
Experimental Investigations
Chairman: tbd
14:0030mnKeynote presentation - Toward Comprehensive Reliability Testing – a Combined Loading Approach
Corresponding Author: Toni Mattila - Helsinki University of Technology
Toni. T. Mattila, M. Paulasto-Kröckel, Aalto University, School of Science and Technology
14:3020mnTheoretical Analyses on the Shear Test
Corresponding Author: Rainer Dudek - Fraunhofer ENAS, MMC
Rainer Dudek 1, Ralf Doering 1, Kerstin Kreyssig 2, Bernd Michel 1
1 Fraunhofer ENAS, Micro Materials Center Berlin and Chemnitz
2 CWM GmbH, Chemnitz
14:5020mnMeasuring time-dependent mechanics in metallic MEMS
Corresponding Author: Lambert Bergers - Eindhoven University of Technology
Bergers, L.I.J.C., Delhey, N.K.R., Hoefnagels, J.P.M., Geers, M.G.D., Eindhoven University of Technology, Dep. of Mechanical Engineering
15:1020mnInterfacial Strength of Silicon-to-Molding Compound Changes with Thermal Residual Stress
Corresponding Author: An Xiao - Delft University of Technology
Gerd Schlottig 1, An Xiao 2, Heinz Pape 3, Bernhard Wunderle 4, Leo J. Ernst 2
1 Infineon Technologies AG, Munich; Fraunhofer IZM, Berlin, Germany; TU-Delft, Delft, The Netherlands
2 TU-Delft, Delft, The Netherlands
3 Infineon Technologies AG, Munich, Germany
4 Fraunhofer IZM, Berlin; TU Chemnitz, Chemnitz, Germany
15:3020mnLocal stress analysis in devices by FIB
Corresponding Author: Rene Kregting - TNO
René Kregting 1, Sander Gielen 1, Willem van Driel 2, Paul Alkemade 3, Hozan Miro 3, Jan-Dirk Kamminga 4
1 TNO Science & Industry, Eindhoven, The Netherlands
2 NXP Semiconductors, Nijmegen, The Netherlands; Delft University of Technology, Delft, The Netherlands
3 Delft University of Technology, Delft, The Netherlands
4 M2i Materials innovation institute, Delft, The Netherlands

 

Session 314:00 Monday 26 Apr 2010
Modelling of MEMS Devices I
Chairman: tbd
14:0030mnKeynote presentation - AN ON-CHIP EXPERIMENTAL ASSESSMENT OF CASIMIR FORCE EFFECT IN MICRO-ELECTROMECHANICAL SYSTEMS
Corresponding Author: Attilio Frangi - Dept. of Structural Engineering, Politecnico di Milano
14:3020mnMEMS resonator temperature compensation
Corresponding Author: Fabrice CASSET - CEA, LETI, MINATEC
F. Casset 1, C. Durand 2, Y. Civet 3, E. Ollier 1, JF. Carpentier 2, P. Ancey 2, P. Robert 1
1 CEA, LETI, MINATEC, Grenoble, France
2 ST, Crolles, France
3 TIMA, Grenoble, France
14:5020mnFailure Modes of Wafer Level Thin Film MEMS Packages During Wafer Thinning
Corresponding Author: J.J.M. Zaal - Delft University of Technology
J.J.M. Zaal, W.D. van Driel, G.Q. Zhang, Delft University of Technology
15:1020mnPrediction of stiction in Microswitch Systems
Corresponding Author: Ling Wu - University of Liege
Ling WU, V. ROCHUS, L. NOELS, J.C. GOLINVAL, University of Liege, Liège, Belgium
15:3020mnFINITE ELEMENT MODELLING OF ADHESION PHENOMENA IN MEMS
Corresponding Author: Raffaele Ardito - Dept. of Structural Engineering, Politecnico di Milano
Raffaele Ardito, Alberto Corigliano, Attilio Frangi, Politecnico di Milano, Milan, Italy

 

Session 414:00 Monday 26 Apr 2010
Thermal Modelling and Characterization
Chairman: tbd
14:0030mnKeynote presentation - Simulation-based analysis of the heat-affected zone during target preparation by pulsed-laser ablation through stacked silicon dies in 3D integrated System-in-Packages
Corresponding Author: Stefan Martens - Infineon Technologies AG, Regensburg, Germany
Stefan Martens 1, Markus Fink 1, Walter Mack 1, Friedemann Voelklein 2, Juergen Wilde 3
1 Infineon Technologies AG, Regensburg, Germany
2 RheinMain University of Applied Sciences, IMtech, Institute of Microtechnologies, Ruesselsheim, Germany
3 Laboratory for Assembly and Packaging, IMTEK, Department of Microsystems Engineering, University of Freiburg, Germany
14:3020mnFabrication of Freestanding Thin Pt/W Thermocouple by Joule Heat Welding
Corresponding Author: Hironori Tohmyoh - Tohoku University
Hironori Tohmyoh, Hironao Takeda, Mohammed N. I. Khan, Masumi Saka, Tohoku University
14:5020mnLight Degradation Prediction of High Power Light Emitting Diode Lighting Modules
Corresponding Author: Kuo-Ning Chiang - National Tsing Hua University, Department of Power Mechanical Engineering
Yen-Fu Su, Shin-Yueh Yang, Wei-Hao Chi, Kuo-Ning Chiang, Dept. of Power Mechanical Engineering, National Tsing Hua University, HsinChu, Taiwan
15:1020mnAnalytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation
Corresponding Author: CORFA Anthony - CEA, LETI, MINATEC
A. Corfa, A. Gasse, S. Bernabé, H. Ribot, CEA LETI MINATEC
15:3020mnAnalytical modelling of transient processes in thermal microsensors
Corresponding Author: Alexander Kozlov - Omsk State University

 

Session 516:20 Monday 26 Apr 2010
Damage and Failure
Chairman:
16:2030mnKeynote presentation - Detailed Investigation on the Damage Accumulation of Lead-free Solder Joints under Accelerated Temperature Cycling
Corresponding Author: S. W. Ricky Lee - HKUST
Y. S. Chan, S. W. Ricky Lee, HKUST
16:5020mnCrack and Damage in low-k BEoL Stacks under Assembly and CPI Aspects
Corresponding Author: Juergen Auersperg - Fraunhofer ENAS
Juergen Auersperg 1, Dietmar Vogel 2, Matthias U. Lehr 3, Michael Grillberger 3, Bernd Michel 2
1 Fraunhofer ENAS Chemnitz and AMIC GmbH Berlin
2 Fraunhofer ENAS Chemnitz and Fraunhofer IZM Berlin
3 GLOBALFOUNDRIES Dresden Module One LLC & Co. KG
17:1020mnMoisture Diffusion Modeling and Application in a 3D RF Module Subject to Moisture Absorption and Desorption Loads
Corresponding Author: Liping Zhu - TriQuint Semiconductor Inc
Liping Zhu, Dean Monthei, Gene Lambird, Wally Holgado, TriQuint Semiconductor, USA
17:3020mnNumerical-experimental analysis of combined bulk and interface fracture in a leadless package
Corresponding Author: Sander Noijen - Philips Applied Technologies
Sander Noijen 1, Sven Walczyk 2, Roelf Groenhuis 2, Olaf van der Sluis 1
1 Philips Applied Technologies, Eindhoven, The Netherlands
2 NXP Semiconductors, Nijmegen, The Netherlands

 

Session 616:20 Monday 26 Apr 2010
Innovative Methods for Microsystems Modelling I
Chairman:
16:2030mnKeynote presentation - A Comparison of Model Order Reduction Methods used in different FE Software Tools
Corresponding Author: Mario Patrick Jungwirth - University of Applied Sciences Upper Austria, Campus Wels
M. Jungwirth, D. Hofinger, H. Weinzierl, FH OÖ – Upper Austria University of Applied Sciences, Wels, Austria
16:5020mnA linear analysis to overcome the numerical Cherenkov instability
Corresponding Author: Professor Franck Assous - Ariel Universisty Center & Bar Ilan University
Franck Assous, Ariel University Center & Bar-Ilan University, Israel
Jacques Segre, CEA-Saclay, DEN/DM2S/SFME, France
17:1020mnThermomechanical simulation of BCB membrane thin-film package
Corresponding Author: Seonho Seok - IEMN/IRCICA CNRS
Seonho Seok 1, Nathalie Rolland 1, Paul-alain Rolland 1, Siebe Bouwstra 2
1 IEMN/IRCICA/CNRS
2 MEMS TC
17:3020mnThe Mechanical Characterisation of Glass Frit Seals for Capped MEMS Devices
Corresponding Author: Cillian Burke - Stokes Institute

 

Session 716:20 Monday 26 Apr 2010
Electrothermal Modeling and Characterization
Chairman:
16:2030mnKeynote presentation - New Methodology on Electro-Thermal Characterization and Modeling of Large Power Drivers using Lateral PNP BJTs
Corresponding Author: Joseph Rhayem - Program Manager : Electro-Thermal Characterisation
A.Vrbicky 1, R. Blecic 2, P. Malena 3, S. Bychikhin 4, D. Pogany 4, A. Wieers 5, A. Baric 2, M. Tack 5
1 ONSEMI, Bratislava, Slovakia
2 University of Zagreb, Zagreb, Croatia
3 ONSEMI, Brno, Czech
4 Institute for Solid State Electronics, Vienna, Austria
5 ONSEMI, Oudenaarde, Belgium
16:5020mnSystem-level model of electrothermal microsystem and temperature control circuit
Corresponding Author: Dennis Hohlfeld - Holst Centre / IMEC
17:1020mnElectromagnetic and Thermal investigations of RF Circuits and Devices
Corresponding Author: Yves SCUDELLER - Université de Nantes
17:3020mnSwitching speed evolution for MOS silicon devices electrically stressed under high temperatures
Corresponding Author: Pr. Chafic SALAME - Lebanese University

 

Session 809:00 Tuesday 27 Apr 2010
Flexible Electronics
Chairman:
09:0030mnKeynote presentation - Thermo-Mechanical Analysis of Flexible and Stretchable Systems
Corresponding Author: Mario Gonzalez - IMEC
Mario Gonzalez 1, Bart Vandevelde 1, Wim Christiaens 2, Yung-Yu Hsu 1, François Iker 1, Frederick Bossuyt 1, Jan Vanfleteren 1, Olaf van der Sluis 3, P.H.M. Timmermans 3
1 IMEC
2 Ghent University
3 Philips Applied Technologies
09:3020mnFlexible Circuits with Embedded Resistors Subjected to Extreme Thermal Loading Conditions Using the Shadow Moiré and FEM Measurements Techniques
Corresponding Author: Luciano Arruda - Nokia Institute of Technology
09:5020mnModeling the residual shrinkage during lithographic processing on flexible polymer substrates
Corresponding Author: Marco Barink - TNO/Holst Centre
M. Barink, D. van den Berg, I. Yakimets, E. Meinders, TNO/Holst Centre

 

Session 909:00 Tuesday 27 Apr 2010
Innovative Methods for Microsystems Modelling II
Chairman:
09:0030mnKeynote presentation - Exemplified calculation of stress migration in a 90nm node via structure
Corresponding Author: Kirsten Weide-Zaage - Leibniz Universität Hannover
Kirsten Weide-Zaage, Information Technology Laboratory, Leibniz University Hannover
09:3020mnImprovement of micro-bridge capacitance-voltage curve linearity using shape optimization
Corresponding Author: Lemaire Etienne - Aerospace and Mechanical Engineering Department, University of Liège
09:5020mnMultiple Environment Overstress Testing and Modelling of Solar Cells
Corresponding Author: Erik Veninga - TNO Science and Industry
E.P. Veninga, A.W.J. Gielen, TNO Science and Industry, Eindhoven, The Netherlands

 

Session 1009:00 Tuesday 27 Apr 2010
Thermal-Fluid Behavior Modeling and Characterization
Chairman:
09:0030mnKeynote presentation - Analysis of the performance reduction of axial fans in close proximity to EMC screens
Corresponding Author: Raúl Antón - TECNUN-University of Navarra
Raúl Antón, Asier Bengoechea, Yunesky Masip, Alejandro Rivas, Juan Carlos Ramos, Gorka S. Larraona, TECNUN-University of Navarra, Spain
09:3020mnCFD Assisted Design Evaluation and Experimental Verification of a Logic-Controlled Local PCB Heater for Humidity Management in Electronics Enclosure
Corresponding Author: ILJA BELOV - School of Engineering, Jönköping University
Ilja Belov 1, Mats Lindgren 2, Jan Ryden 3, Zahra Alavizadeh 1, Peter Leisner 2
1 School of Engineering, Jönköping University, Jönköping, Sweden
2 SP Technical Research Institute of Sweden, Borås, Sweden
3 Saab Microwave Systems, Göteborg, Sweden
09:5020mnBond Wire Design for eXtreme Switch Devices
Corresponding Author: Torsten Hauck - Freescale Semiconductor Germany
Torsten Hauck, Anton Kolbeck, Freescale Semiconductor Germany

 

Session 1111:00 Tuesday 27 Apr 2010
Posters TM
Chairman:
Principles for Simulation of Barrier Cracking due to high Stress
Corresponding Author: Johar Ciptokusumo - Leibniz Universität Hannover, Laboratorium für Informationstechnologie, Germany
Johar Ciptokusumo 1, Kirsten Weide-Zaage 1, Oliver Aubel 2
1 Leibniz Universitaet Hannover, Laboratorium fuer Informationstechnologie
2 GLOBALFOUNDRIES Incorporated
Thermo-mechanical simulations in double-sided heat transfer power assemblies
Corresponding Author: Eric WOIRGARD - Université Bordeaux 1
E. Woirgard 1, I. Favre 1, JY Deletage 1, S. Azzopardi 1, R. Leon 2, G. Convenant 2, Z. Khatir 3
1 Université de Bordeaux I,Talence, France
2 Valeo-CEE, Montigny-le-Bretonneux, France
3 Inrets, Versailles, France
Aging Effects of Epoxy Moulding Compound on the Long-Term Stability of Plastic Package
Corresponding Author: Eric Nguegang Ngnetiwe - Robert Bosch GmbH
Eric Nguegang 1, Jochen Franz 1, André Kretschmann 1, Hermann Sandmaier 2
1 Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
2 University of Stuttgart, Lehrstuhl Mikrosystemtechnik, Stuttgart, Germany
Evaluating the effect of viscoelastic damping layers in the dynamic behavior of printed wiring boards
Corresponding Author: Cleber Pagliosa - Nokia Institute of Technology
Cleber Pagliosa, Joao Morais da Silva Neto, Nokia Institute of Technology
Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board
Corresponding Author: Wilson Carlos MAIA FILHO - Thales Corporate Services
Wilson Carlos Maia Filho, Michel Brizoux, Arnaud Grivon, Thales Corporate Services, France
Design of Al Pad Geometry for Reducing Current Crowding Effect in Flip-chip Solder Joint Using Finite-element Analysis
Corresponding Author: Yuan-wei Chang - National Chiao Tung University
Y. W. Chang, Chih Chen, Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan, ROC
Efficiency and robustness of some behavior laws in the description of viscoplastic deformation and degradation of solder materials
Corresponding Author: Sabeur MSOLLI - Université de Toulouse ; INP/ENIT ; LGP
Sabeur MSOLLI, Adrien ZÈANH, Olivier DALVERNY, Moussa KARAMA, Université de Toulouse ; INP/ENIT ; LGP ; Tarbes, France
Thermomechanical characterization of electronic components
Corresponding Author: SANA BEN KHLIFA - . bLaboratoire d\'Electronique et des Technologies de l\'Information, CEA / LETI-MINATEC, and.Laboratoire de mécanique Biomécani
Sana Ben KHLIFA 1, Napo BONFOH 1, Paul LIPINSKI 1, Manuel FENDLER 2, Stéphane BERNABE 2, Hervé RIBOT 2
1 Laboratoire de mécanique Biomécanique Polymère Structures (LaBPS), Ecole Nationale d’Ingénieurs de Metz (ENIM) ,Metz,France.
2 Laboratoire d'Electronique et des Technologies de l'Information, CEA / LETI-MINATEC, Grenoble,France.
Thermo-mechanical simulations of LTCC packages for RF MEMS applications
Corresponding Author: Lenkkeri, Jaakko Tapani - VTT Technical Research Centre of Finland
J. Lenkkeri 1, E. Juntunen 1, M. Lahti 1, S. Bouwstra 2
1 VTT Technical Research Centre of Finland, Oulu, Finland
2 MEMS TC, Amsterdam, The Netherlands
Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality
Corresponding Author: Willem van Driel - NXP Semiconductors
E. Spaan 1, E. Ooms 1, W.D. van Driel 2, C.A. Yuan 1, D.G. Yang 3, G.Q. Zhang 4
1 NXP Semiconductors, Nijmegen, The Netherlands
2 NXP Semiconductors, Nijmegen; Delft University of Technology, Delft, The Netherlands
3 NXP Semiconductors, Nijmegen, The Netherlands; Guilin University, Guilin, China
4 Delft University of Technology, Delft; Phillips Lighting, Eindhoven, The Netherlands
GaAs-Based Laser Diode Bonding-Induced Stress Investigation By Means Of Simulation And Degree Of Polarization Of The Photoluminescence Measurements
Corresponding Author: Julien Le Clec\'h - 3S Photonics
Julien LeClecH 1, Daniel T. Cassidy 2, Michel Biet 1, François Laruelle 1, Mauro Bettiati 1, Jean-Pierre Landesman 3
1 3S Photonics
2 McMaster University
3 Université de Nantes
Mechanical and Thermal Simulations of a Microactuator for the Stimulation of the Perilymph
Corresponding Author: Tom Creutzburg - Leibniz Universität Hannover - Institute for Microtechnology
H.H. Gatzen, Leibniz Universität Hannover - Institute for Microtechnology, Garbsen, Germany
Thermomechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array) : Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability
Corresponding Author: CHAILLOT Agnès - EADS Innovation Works
CHAILLOT A. 1, MUNIER C. 1, MAIRE O. 1, VIGIER M. 2, CHASTANET C. 2
1 EADS Innovation Works
2 AIRBUS
Influence of PCB design and materials on chip solder joint reliability
Corresponding Author: Berthou Matthieu - MBDA France
Berthou Matthieu 1, Hélène Frémont 2, Alexandrine Gracia 2, C.Jéphos-Davennel 3
1 MBDA France, IMS Bordeaux, DGA
2 IMS Bordeaux
3 DGA CELAR
Loop Height - Its Significant Impact on IC Copper Wire Bonding
Corresponding Author: Silnore Sabando - Fairchild Semiconductor
Measurement of Viskoelastic Material Properties of Adhesives for SHM Sensors Under Harsh Environmental Conditions
Corresponding Author: Boehme, Bjoern - Technische Universität Dresden, Electronics Packaging Laboratory
Boehme, B. 1, Roellig, M. 2, Wolter, K.-J. 1
1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany
2 Fraunhofer-Institut for Non-destructive Testing, Dresden, Germany
Warpage Simulation of IC Packages during Molding and Post-mold Processes
Corresponding Author: Hwang, Sheng-Jye - Dept. of ME, National Cheng Kung University, Tainan, Taiwan
Numerical Multi-objective Optimization Used to Elasto-plastic Material Extraction of Thin Layers Through Nanoindentaion Technique
Corresponding Author: Lukasz Dowhan - Wroclaw University of technology
Lukasz Dowhan 1, Artur Wymyslowski 1, Olaf Wittler 2, Raul Mroßko 2
1 Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Poland
2 Fraunhofer IZM, Micro Materials Center, Germany
Moisture Sensitive Plastic Packages of IC Devices: Design for Reliability
Corresponding Author: Xuejun Fan - Lamar University
Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates
Corresponding Author: Karsten Meier - Technische Universität Dresden
Karsten Meier 1, Mike Roellig 2, Steffen Wiese 3, Klaus-Jürgen Wolter 1
1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany
2 Fraunhofer Institute for Non-Destructive Testing (IZFP-D), Dresden, Germany
3 Fraunhofer Center for Silicon-Photovoltaics (CSP), Halle, Germany
Thermoelastic Analysis on the Interacting Piezoelectric Fibers: a Micromechanical Approach
Corresponding Author: Roohollah Hashemi - Sharif University of Technology
The study of carbon nanotube's length in reference to its thermal conductivity by molecular dynamics approach
Corresponding Author: Bartosz Platek - Wroclaw University of Technology
Bartosz Platek, Tomasz Falat, Jan Felba, Artur Borzdun, Wroclaw University of Technology, Faculty of Microsystems Electronics and Photonics, Laboratory for Interconnecting and Packaging Electronic Circuits
Vibration Reliability of SMD Pb-free Solder Joints
Corresponding Author: Mario Borras - Robert Bosch GmbH
Mario Borras 1, Olivier Lanier 1, Roumen Ratchev 1, Michael Guyenot 1, Daniel Coutellier 2
1 Robert Bosch GmbH, Corporate Research CR/APJ3, D-71701 Schwieberdingen (Germany)
2 LAMIH, UMR CNRS 8530, Université de Valenciennes, F-59313 VAlenciennes Cedex 9 (France)
Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
Corresponding Author: Daniel Vanderstraeten - ON Semiconductor
Daniel Vanderstraeten 1, Andrej Ivankovic 1, Kris Vanstreels 2, Guy Brizar 1, Renaud Gillon 1, Eddy Blansaer 1, Bart Vandevelde 2
1 ON Semiconductor, Oudenaarde, Belgium
2 IMEC, Leuven, Belgium
Vibration Durability of Pb-free HVQFN Assemblies
Corresponding Author: Abhijit Dasgupta - Center for Advanced Life Cycle Engineering, Mechanical Engineering Dept, University of Maryland
C. Choi 1, M. Al-Bassyiouni 2, A. Dasgupta 2, J. W. C. de Vries 3, W. Balemans 3, W. van Driel 4
1 CALCE Center, University of Maryalnd
2 CALCE Center, University of Maryland
3 Philips Applied Technologies
4 Philips Lighting
Mechanism analyses on PBGA strip packaging warpage
Corresponding Author: Yeong K. Kim - Korea Aerospace University
In Soo Park 1, Jooho Choi 2, Jin Hyuk Gang 2
1 Doosan Corporation Electro-materials
2 Korea Aerospace University
Numerical Simulations of Thermo-Mechanical Stresses during the Casting of Multi-Crystalline Silicon Ingots
Corresponding Author: Marcus Oswald - Fraunhofer Center for Silicon Photovoltaics
M. Turek, J. Bagdahn, Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany
Interconnection Technologies for Photovoltaic Modules – Analysis of technological and mechanical Problems
Corresponding Author: Steffen Wiese - Fraunhofer CSP
Steffen Wiese 1, Frank Kraemer 1, Norbert Betzl 2, Dietmar Wald 2
1 Fraunhofer CSP, Halle, Germany
2 SOLARWATT AG, Dresden, Germany
A Case Study of Networked Sensors by Simulations and Experiments
Corresponding Author: Cheng Guo - Delft University of Technology
Cheng Guo, Martin Jacobsson, R. Venkatesha Prasad, Delft University of Technology
Interfacial delamination and thermal fatigue life estimation of multilayered metal MEMS
Corresponding Author: Angelo R. Maligno - Loughborough University
SINTERING, IN DIFFERENT TEMPERATURES, OF TRACES OF SILVER PRINTED IN FLEXIBLE SURFACES
Corresponding Author: Rafael Drumond Mancosu, Dr. - INdT - Instituto Nokia de Tecnologia
Mancosu, R. D., Quintero, J, A, Q., Azevedo, R. E. S., Nokia Institute of Technology - INdT, Manaus, Brazil

 

Session 1211:00 Tuesday 27 Apr 2010
Posters MP+TF
Chairman:
Virtual prototyping of PoP interconnections regarding electrically activated mechanisms
Corresponding Author: Kirsten WEIDE-ZAAGE - Leibniz University Hannover
Lutz Meinshausen 1, Kirsten Weide-Zaage 1, Hélène Frémont 2, Wei Feng 2
1 Laboratorium für Informationstechnologie, University Hannover
2 Laboratoire IMS, CNRS UMR 5218, ENSEIRB, Université Bordeaux I
Response of an Electrostatically Actuated Microbeam to Drop-Table Test
Corresponding Author: Mohammad I Younis - State University of New York at Binghamton
H. Ouakad, M. I. Younis, F. Alsaleem, T. Levo, J. Pitarresi,, SUNY Binghamton
The Degradation of Solder Joints Under High Current Density and Low-Cycle Fatigue
Corresponding Author: Davide Di Maio - National Physical Laboratory
D. Di Maio 1, C. Murdoch 2, O. Thomas 1, C. Hunt 1
1 National Physical Laboratory, Teddington, UK
2 Imperial College, London UK
Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test
Corresponding Author: Lihua Liang - Zhejiang University of Technology
Fei Liu 1, Qiang Wang 1, Lihua Liang 1, Yong Liu 2
1 Zhejiang University of Technology, Fairchild-ZJUT Microelectronic Packaging Joint Lab, Hangzhou, China
2 Fairchild Semiconductor, S. Portland, Maine, USA
Reliability Study of Stretchable Interconnect by Simulations
Corresponding Author: Quayle Chen - Nokia Research Center (Beijing), Advanced System Engineering
Design of Jigs of Cellular Phones for Drop Test of OLED Modules
Corresponding Author: Kwangju Lee - Korea University of Technology and Education
MEMS Control by Periodic Networks of Resistances
Corresponding Author: Ratier Nicolas - FEMTO-ST
Hui HUI 1, Youssef YAKOUBI 2, Michel LENCZNER 1, Nicolas RATIER 1
1 FEMTO-ST, Département Temps-Fréquences Université de Franche-Comté, Besaçon, France
2 Laboratoire Jacques-Louis Lions, Université Pierre et Marie Curie, Paris, France
FE Modelling of Capacitive Pressure Sensors Realized in LTCC Technology
Corresponding Author: Cristina Marghescu - University “Politehnica” of Bucharest, Center for Technological Electronics and Interconnection Techniques
SINTERING, IN DIFFERENT TEMPERATURES, OF TRACES OF SILVER PRINTED IN FLEXIBLE SURFACES
Corresponding Author: Rafael Drumond Mancosu - Instituto Nokia de Tecnologia - INdT
Comparison and characterization of a typical strain gage trace against another using the printed method
Corresponding Author: JAIRO ALONSO QUINTERO QUINTERO - Nokia Institute of Technology - INdT
Quintero, Jairo Alonso Quintero, Mancosu, Rafael Drumond, Nokia Institute of Technology - INdT, Manaus, Brazil
Large Deformation of Beam Columns - a Closed Form Solution and Design Guide for Vertical Buckling Probe Needles
Corresponding Author: Torsten Hauck - Freescale Semiconductor germany
Torsten Hauck, Freescale Semiconductor Germany
Wolfgang H. Müller, Technische Universität Berlin
A NEW ITERATIVE ALGORITHM FOR THE SOLUTION FOR THE LOAD DEFLECTION SQUARE MEMBRANES
Corresponding Author: Youssef Hicham - LAAS CNRS
Youssef Hicham 1, André Ferrand 2, Patrick Pons 1, Robert Plana 1
1 LAAS CNRS
2 LAAS CNRS, ICA-MSEM
Optical stability of silicone based butt-coupling optical interconnect
Corresponding Author: Dengke Cai - Technische Universität Dortmund, Fakultät für Elektrotechnik und Informationstechnik
Numerical modeling of temperature distribution in power transformers to determine the hot spot temperature and location
Corresponding Author: aydin ghaffarnajad mehraban - power and water university of technology
Numerical multiscale analysis of TG of crosslinked polymer
Corresponding Author: Sebastian J. Tesarski - Wroclaw University of Technology
Sebastian J. Tesarski 1, Ole Hölck 2, Artur Wymysłowski 1
1 Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland
2 Fraunhofer Institut Zuverlässigkeit und Mikrointegration, Volmerstr. 9B, 12489 Berlin, Germany
THERMAL MODELLING OF THE EMERGING MULTI-CHIP PACKAGES
Corresponding Author: Eric Monier-Vinard - Thales Corporate Services
Eric Monier-Vinard, Valentin Bissuel, Paul Murphy, Olivier Daniel, Julien Dufrenne, THALES CST
Electro-thermal investigation of silicon power inverters operating at low switching Frequencies
Corresponding Author: Yves SCUDELLER - Université de Nantes

 

Session 1313:30 Tuesday 27 Apr 2010
Thermo-Mechanical Modeling I
Chairman:
13:3030mnKeynote presentation - Simulation of Drop Testing at Extremely High Accelerations
Corresponding Author: Abhijit Dasgupta - Center for Advanced Life Cycle Engineering, Mechanical Engineering Dept., University of Maryland
Stuart Douglas, M. Al-Bassyiouni, A. Dasgupta, CALCE Center, University of Maryland
14:0020mnNumerical investigations of the strain behavior in nanoscale patterned strained silicon structures
Corresponding Author: Falk Naumann - Fraunhofer Institute for Mechanics of Materials
O. Moutanabbir 1, M. Reiche 1, C. Schriever 2, J. Schilling 2, M. Petzold 3
1 Max Planck Institute of Microstructure Physics, Halle, Germany
2 ZIK "Sili-nano", Martin-Luther-University Halle, Germany
3 Fraunhofer Institute for Mechanics of Materials, Halle, Germany
14:2020mnMULTISCALE MODELING OF NONLINEAR BEHAVIOR OF NANO-REINFORCED STRUCTURAL ADHESIVE BONDS FOR AEROSPACE APPLICATIONS
Corresponding Author: Shaker A. Meguid - University of Toronto, Canada
14:4020mnVirtual Thermo-Mechanical Prototyping for High-Temperature-Application Microelectronics
Corresponding Author: Daoguo Yang - NXP Semiconductors
15:0020mnMulti-scale modeling of the Viscoplastic Response of As-fabricated Microscale Sn3.0Ag0.5Cu Solder Interconnects
Corresponding Author: Gayatri Cuddalorepatta - University of Maryland
Gayatri Cuddalorepatta, Abhijit Dasgupta, CALCE Electronic Products and Systems Center, University of Maryland, USA

 

Session 1413:30 Tuesday 27 Apr 2010
Modelling of MEMS devices II
Chairman:
13:3030mnKeynote presentation - FEM assisted Development of a SHM-Piezo-Package for Damage Evaluation in Airplane Components
Corresponding Author: Mike Roellig - Fraunhofer Institute for Non-Destructive Testing
Mike Roellig 1, Lars Schubert 1, Uwe Lieske 1, Bjoern Boehme 2, Bernd Frankenstein 1, Norbert Meyendorf 1
1 Fraunhofer Institute for Non-Destructive Testing
2 Dresden University of Technology
14:0020mnThermomechanical design and modeling of porous alumina-based thin film packages for MEMS
Corresponding Author: Joseph Zekry - IMEC vzw
Joseph Zekry 1, Bart Vandevelde 1, Siebe Bouwstra 2, Robert Puers 3, Chris Van Hoof 1, Harrie A.C. Tilmans 1
1 Imec, Leuven, Belgium
2 MEMS TC, Amsterdam, The Netherlands
3 K.U.Leuven, Belgium
14:2020mnModeling the effects of printed circuit motion on the response of microstructures under mechanical shock
Corresponding Author: Mohammad I Younis - State University of New York at Binghamton
Abdallah H Ramini, Mohammad I Younis, Ronald Miles, SUNY Binghamton
14:4020mnGLOBAL MODELLING OF A CORIOLIS MICRO-GYROSCOPE FOR QUADRATURE ERROR COMPENSATION
Corresponding Author: DESCHARLES Melanie - ONERA
Descharles Mélanie 1, Guérard Jean 1, Kokabi Hamid 2
1 ONERA, Chatillon, France
2 UPMC L2E, Ivry-sur-Seine, France
15:0020mnCopper Pillar Bump Structure Optimization for Flip Chip Packaging with Cu/Low-K Interconnects
Corresponding Author: zhang xueren - United Test & Assembly Center Ltd

 

Session 1513:30 Tuesday 27 Apr 2010
Molecular Modeling
Chairman:
13:3030mnKeynote presentation - Mechanical Properties of an Epoxy, Modeled Using Particle Dynamics as Parameterized through Molecular Modeling
Corresponding Author: Nancy Iwamoto - Honeywell Specialty Materials
14:0020mnDesign of reliable Cu-epoxy interface using Molecular Dynamic Simulation
Corresponding Author: Cell K Y Wong - Delft University of Technology
Cell K Y Wong 1, H B Fan 2 2, G Q Zhang 1, Matthew M F Yuen 2
1 Faculty 3mE, Department PME Delft University of Technology
2 Department of Mechanical Engineering, Hong Kong University of Science and Technology
14:2020mnMolecular Modeling of Microelectronic Packaging Materials – Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface
Corresponding Author: Ole Hölck - Micro Material Center Berlin, Fraunhofer IZM
O. Hölck 1, E. Dermitzaki 1, B. Wunderle 2, J. Bauer 3, B. Michel 1
1 Micro Materials Center Berlin - Fraunhofer IZM, Berlin, Germany
2 TU Chemnitz, Chemnitz, Germany
3 SIIT - Fraunhofer IZM, Berlin, Germany
14:4020mnOn the Mechanical Properties of Cu3Sn Intermetallic Compound through Molecular Dynamics Simulation
Corresponding Author: Ching-Feng Yu - Department of Power Mechanical Engineering, National Tsing Hua University
Wen-Hwa Chen 1, Hsien-Chie Cheng 2, Ching-Feng Yu 1
1 Department of Power Mechanical Engineering, National Tsing Hua University
2 Department of Aerospace and Systems Engineering, Feng Chia University
15:0020mnComputational materials engineering: capabilities of atomic-scale prediction of mechanical, thermal, and electric properties of microelectronic materials
Corresponding Author: Erich Wimmer - Materials Design, Inc.
A. Mavromaras 1, D. Rigby 2, W. Wolf 3, M. Christensen 1, M. Halls 2, C. Freeman 2, P. Saxe 4, E. Wimmer 5
1 Materials Design SARL, Stockholm, Sweden
2 Materials Design, Inc., San Diego, USA
3 Materials Design SARL, Vienna, Austria
4 Materials Design, Inc. Angel Fire, USA
5 Materials Design, Inc., Santa Fe, USA

 

Session 1616:00 Tuesday 27 Apr 2010
Dynamic Problems
Chairman:
16:0030mnKeynote presentation - Anomaly Detection and Fault-Mode Isolation for Prognostics Health Monitoring of Electronics Subjected to Drop and Shock
Corresponding Author: Pradeep Lall - Auburn University
16:3020mnBGA Lifetime Prediction in JEDEC Drop Tests Accounting for Copper Trace Routing Effects
Corresponding Author: Frank Kraemer - Fraunhofer CSP
Frank Kraemer 1, Steffen Wiese 1, Sven Rzepka 2, Jens Lienig 3
1 Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany
2 Fraunhofer ENAS, Micro Material Center Chemnitz & Berlin, Germany
3 Dresden University of Technology, Institute of Electromechanical and Electronic Design, Germany
16:5020mnComputer Simulation and Design of a Solder Joint Vibration Test Machine
Corresponding Author: Elisha Kamara - University of Greenwich
17:1020mnOptimization for Simulation of WL-CSP Subjected to Drop-Test with Plasticity Behavior
Corresponding Author: Cédric LE COQ - Laboratoire de Mécanique et Rhéologie (LMR) - STMicroelectronics
C. Le Coq 1, A. Tougui 2, M.-P. Stempin 3, L. Barreau 3
1 LMR - STMicroelectronics, France
2 LMR, France
3 STMicroelectronics, France
17:3020mnHigh-Speed Mechanical Impact Reliability of Solder Interconnections in High-Power LEDs
Corresponding Author: Jussi Hokka - Philips Lighting
J. Hokka 1, J.F.J.M. Caers 2, X.J. Zhao 2, M. de Jong 3, W. Peels 3, B. Sykes 4, G.Q. Zhang 3, M. Paulasto-Kröckel 1
1 Aalto University School of Science and Technology, Espoo, Finland
2 Philips Applied Technologies, Eindhoven, The Netherlands
3 Philips Lighting, Eindhoven, The Netherlands
4 XYZTEC bv, Panningen, The Netherlands

 

Session 1716:00 Tuesday 27 Apr 2010
Multi-Physics Modelling for Power Electronics Devices
Chairman:
16:0030mnKeynote presentation - Electro-thermo-mechanical simulation of automotive MOSFET transistor
Corresponding Author: Hervé FERAL - EPSILON Ingénierie
Xavier CHAUFFLEUR, Jen-Pierre FRADIN, EPSILON Ingénierie, Labège, France
16:3020mnA connection of thermo-mechanical finite elements tools with electro-thermal finite elements simulation : towards an electro-thermo-mechanical finite elements modeling for power semiconductor devices
Corresponding Author: BELMEHDI - IMS Laboratory
Yassine BELMEHDI, Stéphane AZZOPARDI, Eric WOIRGARD, Jean-Yves DELETAGE, Isabelle FAVRE, IMS Laboratory, University of Bordeaux
16:5020mnInvestigation into the Reliability of IGBT Inverters Operating in Combined Aeronautical Constraints
Corresponding Author: Hassan ABBAD - power electronics reliability
17:1020mnFinite Element Analysis of a High Voltage Semiconductor Polymeric Package Design using a Taguchi Based Experimental Design
Corresponding Author: Nadeesh Nobeen - Loughborough University

 

Session 1816:00 Tuesday 27 Apr 2010
Modeling for Advanced Packaging
Chairman:
16:0030mnKeynote presentation - Virtual Prototyping Advanced by Statistic and Stochastic Methodologies
Corresponding Author: Sven Rzepka - Fraunhofer ENAS - Micro Materials Center
Sven Rzepka 1, Axel Müller 2, Bernd Michel 1
1 Fraunhofer ENAS, Micro Materials Center Chemnitz/Berlin; Chemnitz, Germany
2 BorgWarner BERU Systems GmbH, Dept. Modeling and Analysis, Ludwigsburg, Germany
16:3020mnEvaluation of Probing Process Parameters and PAD Designs: Experiments and Modeling Correlations for Solving Mechanical Issues
Corresponding Author: Romuald ROUCOU - STMicroelectronics / EMSE-CMP
Romuald Roucou 1, Vincent Fiori 2, Florian Cacho 2, Karim Inal 3, Xavier Boddaert 3
1 STMicroelectronics, Crolles, France / Ecole Nationale Supérieure des Mines de Saint Etienne, CMP-GC, Gardanne, France
2 STMicroelectronics, Crolles, France
3 Ecole Nationale Supérieure des Mines de Saint Etienne, CMP-GC, Gardanne, France
16:5020mnNumerical Modelling Methodology for Design of Miniaturised Integrated Products – an Application to 3D CMM Micro-probe Development
Corresponding Author: Pushparajah Rajaguru - Centre for Numerical Modelling and Process Analysis
17:1020mnThe probability design for wire bonding process by finite element and Monte Carlo method
Corresponding Author: Yong Liu - Fairchild Semiconductor Corp.
Huixian Wu 1, Yangjian Xu 1, Lihua Liang 1, Yong Liu 2, Stephen Martin 2
1 Fairchild-ZJUT Microelectronic Packaging Joint Lab, Zhejiang University of Technology, Hangzhou, China
2 Fairchild Semiconductor, S. Portland, Maine, USA
17:3020mnMechanical Behaviour and Fatigue of Copper Ribbons used as Solar Cell Interconnectors
Corresponding Author: Steffen Wiese - Fraunhofer CSP
Steffen Wiese, Rico Meier, Frank Kraemer, Fraunhofer CSP, Halle, Germany

 

Session 1909:00 Wednesday 28 Apr 2010
General lectures, mixed
Chairman:
09:0030mnKeynote presentation - Thermo-mechanical design of a generic 0-level MEMS Package using Chip Capping and Through Silicon Via’s
Corresponding Author: Bart Vandevelde - IMEC
09:3030mnKeynote presentation - How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies
Corresponding Author: Hélène Frémont - IMS Université de Bordeaux
H. Frémont, IMS-Bordeaux, Université Bordeaux 1, UMR-5218, Talence, France
10:0030mnKeynote presentation - Thermal Performance Enhancement by Exploitation of Nano-Effects
Corresponding Author: Bernhard Wunderle - Micro Materials Centre Berlin, Fraunhofer IZM

 

Session 2011:00 Wednesday 28 Apr 2010
Reliability Modeling
Chairman:
11:0030mnKeynote presentation - Thermo-mechanical challenges in the longevity of microelectronics
Corresponding Author: Sanders Gielen - TNO
A. W. J. Gielen, TNO Science and Industry
11:3020mnLimitations of Norris-Landzberg Equation and Application of Damage Accumulation Based Methodology for Estimating Acceleration Factors for Pb Free Solders
Corresponding Author: Ahmer Syed - Amkor Technology
Ahmer Syed, Amkor Technology
11:5020mnDesign for reliability: Thermo-mechanical analyses of stress in Through Silicon Via
Corresponding Author: Samed Barnat 1, 2,3 ; Helene Fremont 3 ; Alexandrine Gracia 3 ; Eric Cadalen 1 ; Catherine Bunel 1 ; François Neuilly 1 ; Jean-R - 1 IPDIA; 2 NXP Semiconductors France; 3 Université Bordeaux I, Laboratoire IMS
Samed Barnat 1, Hélène Frémont 2, Alexandrine Gracia 2, Eric Cadalen 3, Catherine Bunel 3, François Neuilly 4, Jean-René Tenailleau 5
1  IPDIA ; NXP Semiconductors Caen ; IMS Bordeaux Université de Bordeaux, France
2 IMS Bordeaux Université de Bordeaux, France
3  IPDIA, France
4 IPDIA, IEMN Université de Lille 1 , France
5 IPDIA, France
12:1020mnEffect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures
Corresponding Author: Hideo Miura - Tohoku University
Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura, Tohoku University
12:3020mnInterface Characterization Combined with Cohesive Zone Modeling
Corresponding Author: Xiaosong Ma / Kaspar Jansen - Delft University of Technology
Xiaosong Ma 1, G.Q. Zhang 1, O. van der Sluis 2, K.M.B. Jansen 1, W.D van Driel 3, L.J. Ernst 1, Charles Regard 4, Christian Gautier 5, Hélène Frémont 6
1 Delft University of Technology, Delft, The Netherlands
2 Philips Applied Technologies, Eindhoven, The Netherlands
3 Delft University of Technology, Delft; NXP, Nijmegen, The Netherlands
4 NXP Semiconductors; LaMIPS, Université de Caen; IMS Université de Bordeaux, Talence, France
5 NXP Semiconductors; LaMIPS, Université de Caen, France
6 IMS Université de Bordeaux, Talence, France

 

Session 2111:00 Wednesday 28 Apr 2010
Process Modelling
Chairman:
11:0030mnKeynote presentation - Multiscale approach optimization on surface wettabilty change on rough surface
Corresponding Author: Edward K. L. Chan - Hong Kong University of Science & Technology
Edward K L CHAN, Haibo FAN, Matthew M F YUEN, Hong Kong University of Science & Technology, Hong Kong
11:3020mnThermo-mechanical simulations of RF-MEMS 0-level package based on wafer bonding by soldering
Corresponding Author: Siebe Bouwstra - MEMS Technical Consultancy
Siebe Bouwstra, Remco Hageman, MEMS Technical Consultancy, Amsterdam, The Netherlands
11:5020mnElectromigration modeling with consideration of hillock formation
Corresponding Author: Lihua Liang - Zhejiang University of Technology
Yuan Xiang Zhang 1, Lihua Liang 1, Yong Liu 2
1 Zhejiang University of Technology, Fairchild-ZJUT Microelectronic Packaging Joint Lab, Hangzhou, China
2 Fairchild Semiconductor Corp. S. Portland, USA
12:1020mnMultiphysics Modeling and Design of Ultralarge Multiwafer MOVPE Reactor for Group III-Nitride Light Emitting Diodes
Corresponding Author: Changsung Sean Kim - SAMSUNG Electro-Mechanics Co., Ltd.
Changsung Sean Kim 1, Jongpa Hong 2, Jihye Shim 1, Yongsun Won 1, Yong-Il Kwon 1
1 Samsung Electro-Mechanics Co., Ltd.
2 Samsung LED Co., Ltd.
12:3020mnMagnetic Analysis and Simulation of a Self-Propelled Capsule Endoscope
Corresponding Author: Sheng Liu - Institute of Microsystems
Chengzhi Hu, Mingyuan Gao, Zhenzhi Chen, Honghai Zhang, Sheng Liu, School of Mechanical Science & Engineering, Huazhong University of Science & Technology

 

Session 2211:00 Wednesday 28 Apr 2010
Thermo-Mechanical Modeling II
Chairman:
11:0030mnKeynote presentation - Board level reliability of the advanced RF Power Packaging
Corresponding Author: Cadmus Yuan - Dr.
11:3020mnThe Effect of Thermal Aging on Molding Compound Properties
Corresponding Author: J. de Vreugd - TU-Delft
J. de Vreugd 1, K.M.B. Jansen 1, L.J. Ernst 1, C.Bohm 2
1 Technical University Delft
2 Infineon Technologies Munich
11:5020mnDegradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests.
Corresponding Author: Dr. Reinhard Pufall - Infineon Technologies AG
12:1020mnEffects of the Geometrical Dimensions on Stress and Strain of Electrostatically Actuated MEMS Resonators at Pull-in and Stiction Positions
Corresponding Author: Pustan Marius - Aerospace & Mechanical Engineering Department, University of Liege
Marius Pustan 1, Veronique Rochus 2, Jean-Claude Golinval 2
1 University of Liege, Liege, Belgium / Technical University of Cluj-Napoca, Cluj-Napoca, Romania
2 University of Liege, Liege, Belgium
12:3020mnMulti-scale numerical-experimental method to determine the size dependent elastic properties of composite silicon copper nano cantilevers using an electrostatic pull in experiment
Corresponding Author: R.H. Poelma - Delft University of Technology
R.H. Poelma, H. Sadeghian, S.P.M. Noijen, J.J.M. Zaal, G.Q. Zhang, Delft University of Technology, Delft, The Netherlands

 

Session 2313:40 Wednesday 28 Apr 2010
Mixed Thermal / Multiphysics session
Chairman:
13:4030mnKeynote presentation - TWO-SCALE vs THREE-SCALE FE ANALYSES OF SHOCK-INDUCED FAILURE IN POLYSILICON MEMS
Corresponding Author: Alberto Corigliano - Politecnico di Milano
S. Mariani 1, A. Ghisi 1, R. Martini 1, A. Corigliano 1, B. Simoni 2
1 Politecnico di Milano, Dipartimento di Ingegneria Strutturale, Milan, Italy
2 STMicroelectronics, MH Division, Cornaredo, Italy
14:1030mnKeynote presentation - Simulation of Particle Levitation due to Dielectrophoresis
Corresponding Author: Rochus Véronique - University of Liège
Rochus Véronique 1, Hannot Stephan 2, Golinval Jean-Claude 1, Rixen Daniel 2
1 University of Liège
2 TU Delft

 

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Compiled on Fri, 05 Mar 2010 10:59:15 +0100

End of programme