Advanced programme March 1st 2015

Click to unfold/fold programme at a glance

09:00 Welcome by local organiser

Special session Special session: Industry keynotes 09:10 Monday April 20 2015
Chaired by Kouchi Zhang, TU Delft DIMES
09:10 Simulation driven design – from concept phase to robust design, Dr. Petra Schiebel, Robert Bosch GmbH
09:40 Molecular Modeling in Industry for Electronic Materials, Nancy Iwamoto, Honeywell
10:10 Predicting the Lifetime of Power Semiconductor Modules under Variable Thermal Stress - Boundary Conditions and Limitations, Prof. Dr. Uwe Scheuermann, Manager Product Reliability, SEMIKRON Elektronik
10:40 Break

Session 1 Technical Keynotes 11:00 Monday April 20 2015
Chaired by TBD
11:00 30mn Keynote presentation - Nonlinear mechanical springs for counteracting nonlinearities in gap-closing electrostatic actuators
Corresponding Author: David Elata - Technion - Israel Institute of Technology
Ben Rivlin, Shai Shmulevich, Aharon Joffe, David Elata, Technion – Israel Institute of Technology
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11:30 30mn Keynote presentation - Virtual Prototyping of Advanced Packaging Processes
Corresponding Author: Julien Sylvestre - University Sherbrooke

12:00 30mn Keynote presentation - B-spline X-ray Diffraction Imaging Techniques for Die Warpage and Stress Monitoring Inside Fully Encapsulated Packaged Chips
Corresponding Author: Patrick McNally - Dublin City University

12:30 Lunch

Session 2 Reliability investigations 14:00 Monday April 20 2015
Chaired by TBD
14:00 30mn Keynote presentation - Challenges in the Reliability of 3D Integration using TSVs
Corresponding Author: Martin Stiebing - Technische Universität Chemnitz

14:30 20mn Reliability Investigation and Design of High Power Inverter Modules based on Material Characterization Simulation and experimental Verification.
Corresponding Author: Enrico Merten - Berliner Nanotest u. Design GmbH

14:50 20mn Study on Thermomechanical Reliability of IGBT Power Module and Thermal Grease Pump-out Mechanism
Corresponding Author: Jue Li - Dept. of Electrical Engineering and Automation School of ELEC Aalto University

15:10 20mn The effect of variations in temperature cycling profile and mechanical properties of solder on thermo-mechanical reliability of a lead-free BGA package
Corresponding Author: Ilja Belov - School of Engineering Jönköping University

15:30 20mn Accelerated Life Test with Conversion of Thermal Shock Stress to Mechanical Stress
Corresponding Author: Hyoung-seuk Choi - Korea Institute of Ceramic Engineering and Technology Energy and Environment Division

Session 3 Multi-physics simulations (incl moisture, electrical, etc) 14:00 Monday April 20 2015
Chaired by TBD
14:00 30mn Keynote presentation - Multiphysics Study of Electromigration in Ceramic Capacitors
Corresponding Author: Abhijit Dasgupta - University of Maryland

14:30 20mn Measurement and simulation of electromagnetic drift for obsolescence management in electronics.
Corresponding Author: DUCHAMP GENEVIEVE - Univ Bordeaux - IMS laboratory

14:50 20mn A Compact Parametric Model of Magnetic Resonance Micro Sensor
Corresponding Author: Kudryavtsev Mikhail - University of Rostock
M. Kudryavtsev 1, Sh. Gorgi Zade 1, J. G. Korvink 2, T. Bechtol 1
1 University of Rostock, Germany
2 Institute for Microsystems Engineering, Freiburg University, Germany

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15:10 20mn New simulation method for Deep Trench Termination diode DT² using mixed-mode TCAD Sentaurus
Corresponding Author: FEDIA BACCAR - Houssam ARBESS - IMS LABORATORY

15:30 20mn Understanding Tip-Enhanced Raman Spectroscopy by Multiphysics Finite Element Simulations
Corresponding Author: Vladimir A. Kolchuzhin - TU Chemnitz

Session 4 Thermal Behavior Modeling and Characterization 14:00 Monday April 20 2015
Chaired by TBD
14:00 30mn Keynote presentation - Modeling and model-based control of temperature in an SThM probe
Corresponding Author: Michel LENCZNER - FEMTO-ST Institute Departement Time and Frequency

14:30 20mn CFD Simulations of Wave Soldering on Through-Hole Printed Circuit Assemblies
Corresponding Author: Dr. Adam Yuile - University of Saarland

14:50 20mn Simulation of a Flip Chip Bonding Technique Using Reactive Foils
Corresponding Author: F. Kraemer - Saarland University

15:10 20mn Thermo-Mechanical Simulation of a Graphene Heat Spreader
Corresponding Author: Michael Edwards - Chalmers University of Technology

15:30 20mn Thermal analysis of micro-hotplates for catalytic gas microsensors
Corresponding Author: Alexander Kozlov - Omsk State University

15:50 Break

Session 5 Interconnect investigations 16:20 Monday April 20 2015
Chaired by TBD
16:20 30mn Keynote presentation - Adequate Mechanical Copper Modelling for 2nd Level Interconnect Structures
Corresponding Author: S. Wiese - Saarland University

16:50 20mn Wire Bond Lifetime Modelling Using Numeric Simulation and a Crack Growth Approach
Corresponding Author: Arian Grams - Fraunhofer IZM

17:10 20mn Thermo-mechanical ball bonding simulation with elasto-plastic parameters obtained from nanoindentation and atomic force measurements
Corresponding Author: Alan Wright - Fraunhofer IISB

17:30 20mn Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres MPS
Corresponding Author: Fayҫal R. Hamou - SINTEF MiNaLab

Session 6 Molecular Dynamics and Process Modelling 16:20 Monday April 20 2015
Chaired by TBD
16:20 30mn Keynote presentation - Towards Nanoreliability of CNT based Sensor Applications: Investigations of CNT-Metal Interfaces Combining Molecular Dynamics Simulations Advanced In Situ Experiments and Analytics.
Corresponding Author: Steffen Hartmann - Technische Universität Chemnitz

16:50 20mn Computational Electrohydodynamics in the Fabrication of Hollow Polymer Microstructures
Corresponding Author: Chris Bailey - University of Greenwich

17:10 20mn Diffusion Simulation thru Polymers using Coarse-grained Models Derived from Molecular Models.
Corresponding Author: Nancy Iwamoto - Honeywell

17:30 20mn Submodeling FEM Analysis of 3D Printed Structures
Corresponding Author: Javad Zarbakhsh - Carinthia University of Applied Sciences

Session 7 Thermal Modelling and Analysis 16:20 Monday April 20 2015
Chaired by TBD
16:20 30mn Keynote presentation - Analytical experimental and numerical approach to thermal analysis and design of a travelling wave tube
Corresponding Author: Artur Wymyslowski - Wroclaw University of Technology
Waldemar Wiejak, PIT-RADWAR S.A., Wroclaw, Poland
Artur Wymysłowski, Wroclaw University of Technology, Wroclaw, Poland

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16:50 20mn Measurement of Non-uniform Junction Temperature Distribution of Large Light-Emitting Diode by Using a Modified Forward Voltage Method
Corresponding Author: Mian TAO - Hong Kong University of Science and Technology

17:10 20mn Model Verification of Novel Heat Exchanger Geometries Based on Additive Manufacturing
Corresponding Author: Klas Brinkfeldt - Swerea IVF

17:30 20mn Temperature profiles along bonding wires revealed by the bond calculator a new thermo-electrical simulation tool
Corresponding Author: Carl Christoph Jung - Robert Bosch Center for Power Electronics Reutlingen University

17:50 End of 1st day technical sessions

19:00 Dinner downtown

Session 8 Modeling for advanced package development 09:00 Tuesday April 21 2015
Chaired by TBD
09:00 30mn Keynote presentation - Thermo-Mechanical Simulations of a SiC Power Module with Double Sided Cooling
Corresponding Author: Klas Brinkfeldt - Swerea IVF

09:30 20mn Reliability analysis of copper bump interconnection in double-sided power module
Corresponding Author: Kuo-Ning Chiang - National Tsing Hua University

09:50 20mn Thermo-Mechanical Reliability Studies with a Focus on Damage Accumulation of Fatigue induced by Accelerated Mechanical Tests
Corresponding Author: Jens Heilmann - Chemnitz University of Technology

Session 9 Multi-Physics Modelling of Interconnects 09:00 Tuesday April 21 2015
Chaired by TBD
09:00 30mn Keynote presentation - Life Time Characterization for a Highly Robust Metallization
Corresponding Author: Kirsten Weide-Zaage - RESRI Group at IMS-AS Leibniz Universität Hannover

09:30 20mn Electro-Thermo-Mechanical Analyses on Silver Sintered IGBT-Module Reliability in Power Cycling
Corresponding Author: Rainer Dudek - Fraunhofer ENAS Micro Materials Center
Rainer Dudek 1, Ralf Döring 1, Sven Rzepka 1, Christian Erhardt 2, Michael Günther 3, Moritz Haag 4
1 Fraunhofer ENAS, Micro Materials Center, Chemnitz
2 Fraunhofer IZM, Berlin
3 Robert Bosch GmbH, CRAPJ3, Stuttgart
4 Bertrandt Ingenieurbuero GmbH, Ingolstadt

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09:50 20mn Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testing
Corresponding Author: Dr. Martin Lederer - Vienna University of Technology

Session 10 Thermomechanical Behavior Modeling and Characterization 09:00 Tuesday April 21 2015
Chaired by TBD
Corresponding Author: Alexander W.J. Gielen - TNO Technical Sciences – Materials Solutions for Opto-electronic Devices

09:20 20mn Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies: A Combined Experimental and FEM Analysis
Corresponding Author: Bart Vandevelde - imec

09:40 20mn Vapor Pressure Prediction in Reflow for Stacked-Chip Packages by a Convection-Diffusion Model
Corresponding Author: Xuejun Fan - Lamar University

10:10 Break

Session 11 Thermo-Mechanical Issues in Microelectronics 10:40 Tuesday April 21 2015
Chaired by Bernhard Wunderle, TU Chemnitz; Kaspar Jansen, TU Delft
Multi-physics Modelling of Thin Films : Optimization for Finite Elements Simulations Tools
Corresponding Author: Toni Youssef - Labinal Power Systems - Safran Group

Reliability Study on SMD Components on an Organic Substrate with a Thick Copper Core for Power Electronics Applications
Corresponding Author: Karsten Meier - Technische Universität Dresden

An Overview of Scanning Acoustic Microscope a Reliable Method for Non-destructive Failure Analysis of Microelectronic Components
Corresponding Author: Maryam Yazdan Mehr - Materials innovation institute M2i Delft University of Technology

Investigation of relaxation behavior by piezoresistive stress sensor
Corresponding Author: Alicja Palczynska - Robert Bosch GmbH

Designing Efficient Computer Experiments - The Step Beyond Finite Element Modelling
Corresponding Author: Natalie Vollert - CTR Carinthian Tech Research AG

Application of Design of Computer Experiments DoCE method for the extraction of the elasto-plastic behavior law of ECD copper through nano-indentation tests
Corresponding Author: Stéphane MOREAU - CEA

Advances in Percolated Thermal Underfill PTU Simulations for 3D- Integration
Corresponding Author: Sridhar Ganesh Kumar - Technishe Universität Chemnitz

Chip Package Interaction: A Stress analysis on 3D IC’s packages
Corresponding Author: Melina Lofrano - imec vzw

Tensile strength of lead alloy on the base of creep and fatigue phenomena
Corresponding Author: Krystian Jankowski - Politechnika Wroclawska

Surrogate model based mechanical characterization of lead-free soldered joint material exhibiting ratcheting behavior: an advanced methodology
Corresponding Author: Benoît Dompierre - Cenaero ASBL

Die thickness impact on thermo-mechanical stress in 3D packages
Corresponding Author: Abdellah Salahouelhadj - imec

Efficient modeling of printed circuit boards structures for dynamic simulations
Corresponding Author: Elena Zukowski - Bosch Connected Devices and Solutions GmbH

Fracture Mechanical Modeling for the Stress Analysis of DBC ceramics
Corresponding Author: Patrick Gaiser - Robert Bosch GmbH

Material Characterization and Process Optimization of Dye-sensitized Solar Cell Sealant
Corresponding Author: Changwoon Han - Korea Electronics Technology Institute

Current Load Capacity of Electrical Conductor Tracks Evaluated by Simulation and Thermographic Imaging
Corresponding Author: Florian Wagner - South Westphalia University of Applied Sciences

Thermo-mechanical Analysis of GaAs Devices under Temperature-Humidity-Bias testing
Corresponding Author: Kokou Adokanou - Center For materials Forming CEMEF

Numerical investigation of ceramic package interposer interconnects using isotropic conductive adhesive
Corresponding Author: Fayҫal R. Hamou - SINTEF MiNaLab

A Finite Element Modelling and Fracture Mechanical Approach of Multilayer Ceramic Capacitors
Corresponding Author: Joseph Al Ahmar - Saarland University

Analyses on a directly attached airbag sensor packaging system
Corresponding Author: Yeong K. Kim - Inha University

Estimation of landmine characteristics in different sand types using Neural Networks
Corresponding Author: Hussein Fouad Mohamed Ali - Egypt-Japan University for Science and Technology E-JUST

Estimation of landmine characteristics in sandy desert based on mechanical and thermal effects using Neural Networks
Corresponding Author: Hussein Fouad Mohamed Ali - Egypt-Japan University for Science and Technology E-JUST

Constitutive modelling of copper films on silicon substrate
Corresponding Author: Dr. Martin Lederer - Vienna University of Technology

Session 12 Thermal and Multi-Physics Issues in Microelectronics 10:40 Tuesday April 21 2015
Chaired by Bernhard Wunderle, TU Chemnitz; Kaspar Jansen, TU Delft
GEANT4 Simulations in Terms of Radiation Hardness of Commercially Available SRAM
Corresponding Author: Aymen Moujbani - Leibniz Universität HannoverInstitute of Microelectronic Systems IMSRESRI Group

Multi-physics Analysis for Temperature Rise of Electric Connectors Using a Multi-scale Model
Corresponding Author: Liao Kuo-Chi - National Taiwan University

Comparison of Electrical Thermal and Optical characteristics of High-Power LEDs operating in various spectral ranges: from UV to red
Corresponding Author: Anton Chernyakov - SHM RE Center RAS

Electromigration Modelling of Void Nucleation in Open Cu-TSVs
Corresponding Author: Marco Rovitto - Institute for Microelectronics TU Wien
Marco Rovitto, Wolfhard H. Zisser, Hajdin Ceric, Tibor Grasser, Vienna University of Technology TU Wien, Vienna, Austria
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Design and Fabrication of a Hot-film Air Flow Sensor with Sapphire as Substrate
Corresponding Author: Chunlin Xu - Huazhong University of Science Technology

Fatigue Life of Solder Joint forWhite Chip LED by Finite Element Method
Corresponding Author: Tang Hongyu - State Key Laboratory of Solid State Lighting Changzhou Base

Statistical energy study for 28nm FDSOI devices
Corresponding Author: AZEMARD Nadine - LIRMM CNRS

Heterogenous electronic system for monitoring operational material properties
Corresponding Author: Kamil Allaf - Wroclaw University of Technology Faculty of Microsystem Electronics and Photonics

LED’s Luminous Flux Lifetime Prediction Using a Hybrid Numerical Approach
Corresponding Author: Xuejun Fan - Lamar University

Special session Simulia Software Demo Training 10:41 Tuesday April 21 2015
Chaired by
10:40 Software demo training (about 1 hour)
12:10 Lunch

Session 13 Materials Modeling 13:30 Tuesday April 21 2015
Chaired by TBD
13:30 30mn Keynote presentation - Multiscale modeling of the Anisotropic Transient Creep Response of Heterogeneous SAC Single Crystals
Corresponding Author: Abhijit Dasgupta - University of Maryland

14:00 20mn Simulation of the Deformation Behaviour of Large Thin Silicon Wafers and Comparison with Experimental Findings
Corresponding Author: Johannes Schicker - CTR Carinthian Tech Research AG

14:20 20mn Numerical Analysis of Cure Induced Residual Stress in Die Packaging
Corresponding Author: Ali Riza Rezaie Adli - TU Delft

14:40 20mn Material Characterization and Nonlinear Viscoelastic Modelling of Epoxy Based Thermosets for Automotive Application
Corresponding Author: Gromala Przemyslaw - Robert Bosch BmbH

15:00 20mn Experimental thermal and mechanical characterisation of Percolating Thermal Underfills PTU for thermally enhanced Flip-Chip packages
Corresponding Author: Uwe Zschenderlein - Technische Universität Chemnitz

Session 14 MEMS - Switches, Accelerometers, Sensors 13:30 Tuesday April 21 2015
Chaired by TBD
13:30 30mn Keynote presentation - Latching MEMS switch matrices for telecommunication applications
Corresponding Author: Dries Dellaert - CMST Ghent University - IMEC
Dries Dellaert, Jan Doutreloigne, CMST, Ghent University - IMEC, Ghent, Belgium
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14:00 20mn Optimal design and nonlinearities in a z-axis resonant micro-accelerometer
Corresponding Author: Alberto Corigliano - Politecnico di Milano

14:20 20mn Modelling and characterization of circular electrostatic actuators
Corresponding Author: Raffaele ardito - Politecnico di Milano

14:40 20mn Different Simulation tools to accurately design Poly-SiGe Pressure Sensors
Corresponding Author: Rochus Veronique - Imec

15:00 20mn Packaging Effects of Three-axis SOI MEMS Accelerometer
Corresponding Author: Kuo-Ning Chiang - Dept. of Power Mechanical Engineering National Tsing Hua University

Session 15 Thermo-mechanical simulations 13:30 Tuesday April 21 2015
Chaired by TBD
13:30 30mn Keynote presentation - FEA Study of Damage and Cracking Risks in BEoL Structures under Copper Wirebonding Impact
Corresponding Author: Juergen Auersperg - Fraunhofer ENAS

14:00 20mn Laser cutting of semiconductor wafers: comparing a simplified numerical approach with experiments
Corresponding Author: Michiel van Soestbergen - NXP Semiconductors

14:20 20mn Efficient Simulation of Thermo-Mechanical Stress in the On-Chip Metallization of Power Semiconductors
Corresponding Author: Gimi Pham - Robert Bosch Center for Power Electronics Reutlingen University

14:40 20mn Prediction of package delamination based on µMMT and BST experiments
Corresponding Author: Hasan Sadat Nabi - infineon

15:00 20mn The Influence of PBGAs Post-Cure Warpage Simulation Viscoelastic Material Properties and Evaluation Methodology on Accuracy of Solder Joints Damage Prediction
Corresponding Author: Marta Kuczynska - Robert Bosch GmbH

15:20 Break

Session 16 Failure mode extraction 15:40 Tuesday April 21 2015
Chaired by TBD
15:40 30mn Keynote presentation - Thermal Deformation Analysis of Automotive Electronic Control Units Subjected to Passive and Active Thermal Cycles
Corresponding Author: Bulong Wu - University of Maryland College Park

16:10 20mn Fracture Risk Assessment of Laser Marked Die by Means of Simulation and Test
Corresponding Author: Ilko Schmadlak - Freescale Halbleiter Deutschland GmbH

16:30 20mn Accelerated determination of temperature-dependent interfacial fracture toughness in microelectronic packages under cyclic loading
Corresponding Author: Emad Poshtan - Robert Bosch GmbH

16:50 20mn Simulation Driven Design of Novel Integrated Circuits -Part 1: Selection of the materials based on the Virtual DoE
Corresponding Author: ARUN SASI - Robert Bosch Engineering and Business Solutions Limited RBEI

Session 17 Solid State Lighting 15:40 Tuesday April 21 2015
Chaired by TBD
15:40 30mn Keynote presentation - Modeling of LED solder joint cracking during temperature cycling with Finite Element FE
Corresponding Author: Wenbo Yuan - Osram Opto Semiconductors GmbH

16:10 20mn Accelerated Reliability Test method for Optics in LED Luminaire Applications
Corresponding Author: Maryam Yazdan Mehr - Materials innovation istitute

16:30 20mn Lumen Maintenance Predictions for LED Packages using LM80 data
Corresponding Author: W.D. van Driel - Philips Lighting
W.D. van Driel, M. Schuld, B. Jacobs, F. Commissaris, J. van der Eyden, Philips Lighting, The Netherlands
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16:50 20mn A Degradation Model of Aluminum Electrolytic Capacitors for LED Power Supplies
Corresponding Author: Bo Sun - Beijing Research Center Delft University of Technology

Session 18 Experimental investigations 15:40 Tuesday April 21 2015
Chaired by TBD
15:40 30mn Keynote presentation - Advanced Mixed-Mode Bending: Fracture Tests on Package Level Samples and Bi-Material Beams
Corresponding Author: Marcus Schulz - AMIC GmbH Technische Universität Chemnitz

16:10 20mn Thermal and mechanical behavior of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
Corresponding Author: Jan Albrecht - Fraunhofer Institute for Electronic Nano Systems ENAS MMC

16:30 20mn Fracture Mechanics of Thin Film Systems on the Sub-Micron Scale
Corresponding Author: Darjan Kozic - Materials Center Leoben

16:50 20mn Experimental investigation on the influence of microstructure on visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations
Corresponding Author: René Metasch - Fraunhofer Institute for Ceramic Technologies and Systems - Branch Materials Diagnostics

17:10 20mn Investigation of sensitive parameters in the structural simulation tool chain for fiber reinforced plastics in Automotive Electronic Control Units
Corresponding Author: Rongsi Wang - Bosch Automotive Products Suzhou Co. Ltd - Automotive Electronics
Rongsi Wang 1, Dorothea Papathanassiou 1, Matthias Werner 2, Jing Jin 3
1 Bosch Automotive Products Suzhou Co., Ltd, Suzhou, China
2 Robert Bosch GmbH, Reutlingen, Germany
3 BASF China Co., Ltd., Shanghai, China

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Special session Exhibitor and Sponsor special session 17:30 Tuesday April 21 2015
Chaired by Artur Wymyslowski, Willem van Driel
17:30 TBD
18:40 Cocktail party at venue

20:00 EuroSimE Organisers and Technical Committees meeting

Session 19 New Developments in Thermal Management, Failure and Reliability Modelling 08:30 Wednesday April 22 2015
Chaired by TBD
08:30 30mn Keynote presentation - Applications of Computational Mechanics in Stretchable Electronics
Corresponding Author: ZHAUNGJIAN LIU - Institute of High Performance Computing

09:00 30mn Keynote presentation - Design and Implementation of Spectral Power Distribution for White Light LED Packaging
Corresponding Author: Ricky Lee - Hong Kong University of Science and Technology

09:30 30mn Keynote presentation - Light Emitting Diodes and Solid State Luminaires
Corresponding Author: Pradeep Lall - Auburn University

10:00 30mn Keynote presentation - Mission profile driven lifetime estimation of power modules
Corresponding Author: Prof Marta Rencz - Budapest University of Technology and Economics
Prof Marta Rencz, Department of Electron Devices, Budapest University of Technology and Economics, Hungary

10:30 Break

Session 20 Solders 11:00 Wednesday April 22 2015
Chaired by TBD
11:00 30mn Keynote presentation - High-Strain Rate High Temperature Behavior of Leadfree Solders
Corresponding Author: Pradeep Lall - Auburn University

11:30 20mn Characterization and Simulation of LTCCAdhesive and Alloy42Adhesive Interface Strength for Automotive Applications
Corresponding Author: Berkan Öztürk - Robert Bosch GmbH

11:50 20mn Influence of Intermetallic Compound Growth in Lead-free Solder Joints on Thermo-mechanical Failure
Corresponding Author: Ayat CHHAIBI - IMS Bordeaux

12:10 20mn A viscoplastic-fatigue-creep-damage model for tin-based solder alloy
Corresponding Author: Benjamin Métais - Robert Bosch GmbH

12:30 20mn Validation of inelastic temperature time-dependent material model for electro-deposited Cu using optimization software
Corresponding Author: Sergey Ananiev - Infineon Technologies AG

Session 21 Multi-Scale/Physics Modelling of MEMS Devices 11:00 Wednesday April 22 2015
Chaired by TBD
11:00 30mn Keynote presentation - A multi-scale model of Micro-Mirror Array
Corresponding Author: Michel LENCZNER - FEMTO-ST Institute Departement Time and Frequency

11:30 20mn Design of thin-film AlN actuators for 4 inches transparent plates for haptic applications
Corresponding Author: Fabrice CASSET - CEA LETI MINATEC Campus

11:50 20mn Predicting non-fickian moisture diffusion in EMCs for application in micro-electronic devices
Corresponding Author: M. Barink - TNO

Corresponding Author: Tal Rubin - Technion – Israel Institute of Technology
Tal Rubin 1, George Papaioannou 2, David Elata 1
1 Technion – Israel Institute of Technology, Haifa, Israel
2 University of Athens, Athens, Greece

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12:30 20mn Finite element modeling of ZnO nanowire with different configurations of electrodes connected to external capacitive circuit for pressure sensing applications
Corresponding Author: Rolanas Dauksevicius - Kaunas University of Technology

12:50 Lunch

Special session Electronics reliability challenges for Automated Driving 13:30 Wednesday April 22 2015
Chaired by Sven Rzepka, Fraunhofer ENAS, Dag Andersson, Swerea IVF, Bart Vandevelde, IMEC
13:30 European Roadmap 2015 'Smart Systems for Automated Driving',

Gereon Meyer, VDI/VDE-IT, EPoSS office

14:00 Horizon 2020 - European Work Programs 2015 & 2016/17:
  • Opportunities for New Exciting Research Work
  • Expectation concerning the Impact on Industrial Economy and Leadership.

Henri Rajbenbach, Unit A4 'Components' of DG ConNECT, European Commission

14:30 Panel statements and discussion

Expert engineers will outline and illustrate their priorities in coming research activities.
Highlight results from current projects will help explaining the next challenges that need to be tackled when developing the electronics and smart systems that will eventually bring visions like automated driving to life. When creating all the nifty new functional features, these systems must also meet strict requirements with respect to safety, robustness, and reliability as well as those on yield, affordability, and fast industrial product development with immediate market entrance. Otherwise, the intended economic and technological effects for strengthening the European leadership and wealth will not be achieved.

In particular, three fields of application oriented methodology research will be addressed:

  • New test strategies and methods for module level reliability and safety assessments
  • New strategies and approaches to the implementation of virtual techniques in the industrial design process
  • New measures and policies for self-diagnosis and predictive maintenance of electronics and smart systems

15:30 End
15:30 End of conference

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