EuroSimE 2014 will be held in the city of Ghent, Belgium, on April 7-8-9^th 2014 with imec as local organiser (B. Vandevelde).

 

 

EuroSimE 2013 was held in the city of Wroclaw, Poland, on April 15-17 2013.

Local organiser was Wroclaw University of Technology, prof. Artur Wymyslowski and team (Kamil Allaf, Krystian Jankowski, Dawid Krol, Alicja Palczynska and Ryszard Swierczynski).

Read the Call For Paper. Alternative ePub version 24kb (reflowable, suited to smartphones)

See 2013 technical programme (or download a PDF copy)

See 2013 training courses programme

Find out who published about what topics from 2006 to 2013 (933 papers) ...

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EuroSimE

EuroSimE was created as the only international annual conference with a focus on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

 

EuroSimE was initiated in 2000 by the COMPETE network, with sponsorship from the European Commission, to meet research and development needs in the fields of Microelectronics and Microsystems.

 

Since then, EuroSimE has gained worldwide appeal with participants from more than thirty countries, spanning all continents, and has become a fully technically sponsored IEEE CPMT event. The conference proceedings are part of the IEEE conference publication program and can be found in both the IEL and IEEE Xplore^® systems.

 

Since 2005, ASTEFO - a Professional Congress Organiser and Producer - financially produces and logistically organises EuroSimE under the control of the EuroSimE Steering Committee.

EuroSimE attendance over time

Since 2000, EuroSimE brings together a strong community of engineers, scientists and researchers, with common focus on modeling and simulation of materials and components. The average attendance is 150-160 individuals from 25-30 countries.

EuroSimE 2012 papers published in Microelectronics Reliability Journal:

• Nancy Iwamoto: Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface (Part III): Interface Roughness
• M.H.M. Kouters, G.H.M. Gubbels, C.A. Yuan: Characterization of Intermetallic Compounds in Cu-Al Ball Bonds: Mechanical Properties, Interface Delamination and Thermal Conductivity
• J. Jakovenko, J. Formánek, B. Pardo, X. Perpiñà, R.J. Werkhoven, J.M.G. Kunen, P. Bancken, P.J. Bolt: Thermo-Mechanical Evaluation and Life Time Simulation of a High Power LED Lamp Boards
• Federica Confalonieri, Giuseppe Cocchetti, Aldo Ghisi, Alberto Corigliano: A Domain Decomposition Method for the Simulation of Fracture in Polysilicon MEMS
• Steffen Wiese, Frank Kraemer, Erik Peter, Jonas Seib: Mechanical Problems of Novel Back Contact Solar Modules
• O. Hölck, J. Bauer, T. Braun, H. Walter, O. Wittler, B. Wunderle: Transport of Moisture at Epoxy-SiO2 Interfaces Investigated by Molecular Modeling
• B. Pardo, A. Gasse, A. Fargeix, J. Jakovenko, R.J. Werkhoven, X. Perpiñà, T. Van Weelden, P. Bancken: Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards
• Stoyan Stoyanov, Chris Bailey, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott, John Roulston: Thermal Modelling and Optimisation of Hot Solder Dip Process

EuroSimE 2010 papers published in Microelectronics Reliability Journal:

• O. Hölck, E. Dermitzaki, B. Wunderle, J. Bauer and B. Michel: "Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface using Molecular Modelling"
• Nancy Iwamoto: "Modeling Mechanical Properties of an Epoxy Using Particle Dynamics, as Parameterized through Molecular Modeling"
• Łukasz Dowhań, Artur Wymysłowski, Paweł Janus, Magdalena Ekwińska, Olaf Wittler: "Extraction of Elastic-Plastic Material Properties of Thin Films Through Nanoindentaion Technique with Support of Numerical Methods"
• L.I.J.C. Bergers, J.P.M. Hoefnagels, N.K.R. Delhey , M.G.D. Geers: "Measuring time-dependent deformations in metallic MEMS"
• Cédric LE COQ, Adellah TOUGUI, Marie-Pascale STEMPIN, Laurent BARREAU: "Optimization for Simulation of WL-CSP Subjected to Drop-Test with Plasticity Behavior"
• Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P.H.M. Timmermans: "Design and Implementation of Flexible and Stretchable Systems"
• T. T. Mattila and M. Paulasto-Kröckel: "Toward Comprehensive Reliability Testing of Electronics by a Combined Loading Approach"
• Rene Kregting, Sander Gielen, Willem van Driel, Paul Alkemade, Hozan Miro, Jan-Dirk Kamminga: "Local stress analysis on semiconductor devices by combined experimental-numerical procedure"

Background

One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development.

Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. The 14th in the series, EuroSimE 2013 aims to:

• promote further development and application of simulation methodologies and tools for the electronics industry,
• improve communication and exchange information between methodology & tool-developers and industry users,
• strengthen co-operation between industry, universities, and research institutes.

Scope

EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to:

• mechanical simulation (both static and dynamic),
• thermo-mechanical simulation,
• thermal simulation,
• material characterisation experiments and modelling,
• thin-film mechanics,
• failure criteria and damage-modelling (fatigue, creep, delamination, cracks, buckling, large deformation, moisture-induced failures, yield),
• fracture, continuum, and micro-mechanics in (micro)-electronics,
• interface strengths,
• experiments for model verification,
• simulation in reliability engineering,
• (micro)-electronic product and/or process optimisation,
• simulation-based optimisation,
• simulation for reliability improvement/failure prediction,
• virtual and accelerated reliability qualification,
• design rule development via simulation,
• virtual prototyping in product and/or process design,
• from micro to macro simulation,
• multi-physics simulation,
• advanced numerical and analytical simulation methodologies and tools.

Applications

The applications cover all fields of (micro)-electronics and microsystems, but not limited to:

• Wafer processing and chip design,
• PWB design and application,
• Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level packages, MCM, Opto-electronic packages, MEMS),
• Microsystems,
• Interconnections,
• Systems,
• Materials of (micro)-electronics,
• Processes in (micro)-electronics