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EuroSimE 2017 scheduled in Dresden, Germany, on April 2nd 2017 (short courses) and April 3-4-5 (conf. and exhibition)

Local Organiser is Fraunhofer-Institut für Keramische Technologien und Systeme IKTS, team of Dr.-Ing. Mike Röllig

Call For Papers

EuroSimE 2016 was held in Montpellier, France, April 17-20, 2016

Local organiser was Laboratory of Informatics, Robotics and Microelectronics LIRMM

2016 final programme

2016 final programme

See 2015 papers accepted for publication in Microelectronics Reliability Journal (above tab "Journals")


30th of the series, it will be organised in Budapest, Hungary, in September by the team who had organised EuroSimE 2015, Prof. Dr. István Bársony and Dr. Krisztina Szakolczai, of Hungarian Academy of Sciences

Want to exhibit your softwares and products ? download the2016 Exhibitor Guide (2017 version to be released by summer)

2015 book on Molecular Modeling and Multiscaling Issues for Electronic Material Applications!

See preface Written by Artur Wymyslowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan, see Springer

Discover who published about what from 2006 to 2016 (1279 papers)


EuroSimE was created as the only international annual conference with a focus on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.


EuroSimE was initiated in 2000 by the COMPETE network, with sponsorship from the European Commission, to meet research and development needs in the fields of Microelectronics and Microsystems.


Since then, EuroSimE has gained worldwide appeal with participants from more than thirty countries, spanning all continents, and has become a fully technically sponsored IEEE CPMT event. The conference proceedings are part of the IEEE conference publication program and can be found in both the IEL and IEEE Xplore® systems.


Since 2005, ASTEFO - a Professional Congress Organiser and Producer - financially produces and logistically organises EuroSimE under the control of the EuroSimE Steering Committee.

EuroSimE attendance over time

Since 2000, EuroSimE brings together a strong community of engineers, scientists and researchers, with common focus on modeling and simulation of materials and components. The average attendance is 150 individuals from 25-30 countries.

EuroSimE 2015 papers published in Microelectronics Reliability Journal

  • High Strain-Rate Constitutive Behavior of SAC105 and SAC305 Leadfree Solder During Operation at High Temperature, Pradeep Lall
  • An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages, Emad Poshtan
  • Numerical Investigation and Experimental Validation of Residual Stresses Building up in Microelectronics Packaging, Ali Riza Rezaie Adli
  • Lumen Maintenance Predictions for LED Packages, Willem Dirk van Driel
  • Predicting Non-Fickian Moisture Diffusion in EMCs for Application in Micro-electronic Devices, Marco Barink
  • Thermo-Mechanical Effects in Majorana Type Quantum Devices, Alexander W.J. Gielen
  • Investigation of Relaxation Behavior by Piezoresistive Stress Sensor, Alicja Palczynska

EuroSimE 2014 papers published in Microelectronics Reliability Journal:

  • Assessment of Long Term Reliability of Photovoltaic Glass-Glass Modules vs. Glass-Back Sheet Modules Subjected to Temperature Cycles by FE-Analysis, Frank Kraemer
  • The Shear Strength of nano-Ag Sintered Joints and the use of Ag Interconnects in the Design and Manufacture of SiGe-based Thermo-Electric Modules, Michael John Edwards
  • Degradation of silicone in white LEDs during device operation: a finite element approach to product reliability prediction, Paola Altieri-Weimar
  • Thermo-mechanical Characterization of Passive Stress Sensors in Si Interposer, Benjamin Vianne
  • Computationally Efficient and Stable Order Reduction Methods for a Large-Scale Model of MEMS Piezoelectric Energy Harvester, Mikhail Kudryavtsev
  • Adhesion work analysis through molecular modeling and wetting angle measurement, Kamil N Allaf
  • Microstructure Simulation of Grain Growth in Cu Through Silicon Vias Using Phase-Field Modeling, Nabi Nabiollahi

EuroSimE 2013 papers published in Microelectronics Reliability Journal:

  • Multi-physics Simulations for Combined Temperature/Humidity Loading of Potted Electronic Assemblies, Abhijit Dasgupta
  • Geometry optimization of a Lorentz force, resonating MEMS magnetometer, Alberto Corigliano
  • Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling, Bart Vandevelde
  • Simulation and Measurement of the Flip Chip Solder Bumps with a Cu-plated plastic Core, Kirsten Weide-Zaage
  • Multi-physics Reliability Simulation for Solid State Lighting Drivers, Sima Tarashioon
  • On the Crack and Delamination Risk Optimization of a Si-Interposer for LED Packaging, Juergen Auersperg
  • Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading, Jue Li
  • Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys, Juergen Eckermann
  • Stress Impact of Moisture Diffusion measured with the Stress Chip, Florian Schindler-Saefkow

EuroSimE 2012 papers published in Microelectronics Reliability Journal:

  • A Domain Decomposition Method for the Simulation of Fracture in Polysilicon MEMS, Alberto Corigliano
  • Modelling Methodology for Thermal Analysis of Hot Solder Dip Process, Stoyan Stoyanov
  • Cu-wire bonding, Cu-Al intermetallics, thermal aging, thermo-mechanical properties, delamination and thermal conductivity, Kouters Hermanus Matheus Marcel
  • Design methodologies for reliability of SSL LED boards, Jiri Jakovenko
  • Thermal resistance investigations on new leadframe-based LED packages and boards, Adrien Gasse
  • Mechanical Problems of Novel Back Contact Solar Modules, Steffen Wiese
  • Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface: Interface Roughness, Nancy Iwamoto
  • Transport of Moisture at Epoxy-SiO2 Interfaces Investigated by Molecular Modeling, Ole Hölck

EuroSimE 2011 papers published in Microelectronics Reliability Journal:

  • Studies on the Reliability of Power Packages Based on Strength and Fracture Criteria, Rainer Dudek
  • Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests, Reinhard Pufall
  • Development of a Standard for Transient Measurement of Junction-To-Case Thermal Resistance, Heinz Pape
  • Effects of single vacancy defect position on the stability of carbon nanotubes, René Poelma
  • Comparative Characterization of Chip to Epoxy Interfaces by Molecular Modeling and Contact, Angle Determination, Ole Hölck
  • Developing the stress-strain curve to failure using mesoscale models parameterized from molecular models, Nancy Iwamoto
  • A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging, Esther Weltevreden

EuroSimE 2010 papers published in Microelectronics Reliability Journal:

  • MO. Hölck, E. Dermitzaki, B. Wunderle, J. Bauer and B. Michel: "Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface using Molecular Modelling"
  • Nancy Iwamoto: "Modeling Mechanical Properties of an Epoxy Using Particle Dynamics, as Parameterized through Molecular Modeling"
  • Łukasz Dowhań, Artur Wymysłowski, Paweł Janus, Magdalena Ekwińska, Olaf Wittler: "Extraction of Elastic-Plastic Material Properties of Thin Films Through Nanoindentaion Technique with Support of Numerical Methods"
  • ML.I.J.C. Bergers, J.P.M. Hoefnagels, N.K.R. Delhey , M.G.D. Geers: "Measuring time-dependent deformations in metallic MEMS"
  • Cédric LE COQ, Adellah TOUGUI, Marie-Pascale STEMPIN, Laurent BARREAU: "Optimization for Simulation of WL-CSP Subjected to Drop-Test with Plasticity Behavior"
  • Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P.H.M. Timmermans: "Design and Implementation of Flexible and Stretchable Systems"
  • T. T. Mattila and M. Paulasto-Kröckel: "Toward Comprehensive Reliability Testing of Electronics by a Combined Loading Approach"
  • Rene Kregting, Sander Gielen, Willem van Driel, Paul Alkemade, Hozan Miro, Jan-Dirk Kamminga: "Local stress analysis on semiconductor devices by combined experimental-numerical procedure"

EuroSimE 2009 papers published in Microelectronics Reliability Journal:

  • A multiscale approach for investigation of interfacial delamination in electronic packages, Hai Bo Fan
  • Molecular Dynamics Approach to Structure-Property Correlation in Epoxy Resins for Thermo-Mechanical Lifetime Modeling, B. Wunderle
  • Cure induced warpage of micro electronics: comparison with experiments, J. de Vreugd
  • On the epoxy moulding compound aging effect on package reliability, Sander Noijen
  • Reliability Modeling on a MOSFET Power Package Based on Embedded Die Technology, Daoguo Yang
  • Advanced Analysis on Board Trace Reliability of WLCSP under Drop Impact, Ahmer Syed
  • Copper Trace Fatigue Models for Mechanical Cycling, Vibration and Shock/Drop of High-Density PWAs, D. Farley

EuroSimE 2008 papers published in Microelectronics Reliability Journal:

  • Prognostication of System-State in Lead-Free Electronics Equipment under Cyclic and Steady-State Thermo-Mechanical Loads, Pradeep Lall
  • Simulation Based Analysis of Secondary Effects on Solder Fatigue, Rainer Dudek
  • Solder Interconnect Reliability Under Drop Impact Loading Conditions Using High-Speed Cold Bump Pull, J.J.M. Zaal
  • Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics, Olaf van der Sluis
  • Experimental Investigations and Model Study of Moisture Behaviors in Polymers, Xuejun Fan
  • Modeling and characterization of molding compound properties during cure, Kaspar Jansen
  • Performance Properties in Thick Film Silicate Dielectric Layers Using Molecular Modeling, Nancy Iwamoto


One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development.

Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. All EuroSimE's aim to:

  • promote further development and application of simulation methodologies and tools for the electronics industry,
  • improve communication and exchange information between methodology & tool-developers and industry users,
  • strengthen co-operation between industry, universities, and research institutes.


EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to:

  • Multi-physics simulation (e.g. thermal, mechanical, thermo-mechanical, coupled thermo-fluidic, coupled electro-mechanics, fluid structure interactions, opto-mechanics)
  • Failure analysis and failure mode extraction
  • Material characterisation, experiments and modelling
  • Validation of simulations by experiments
  • Failure criteria and damage modelling for reliability prediction
  • Integrated process modelling
  • Advanced numerical and analytical simulation methodologies and tools
  • Behavioural modelling
  • Simulation-based optimisation, virtual prototyping in product and/or process design
  • Compact modelling and model order reduction
  • Multiscale modeling and simulation


The applications cover all fields of (micro)-electronics and microsystems, but not limited to:

  • Components and packaging
    • Flip-chip, BGA, CSP, Wafer-Level packages, MCM, Cu/low-k packages
    • 3-D packaging
    • Opto-electronic packages
    • High temperature and high power packaging
    • Packaging for harsh environments
  • Microsystems
    • Piezoelectric components
    • MEMS sensors and actuators
    • Opto-mechanical devices
    • Nano-electronic mechanical devices
    • Bio-MEMS/NEMS
    • Microfluidics
  • LED lighting
  • Smart systems of 2nd and 3rd generation
Sponsors Robert Bosch Dantec Electronics Dynardo EPoSS NXP Philips Lighting Siemens    LinkedIn®