|08h30||C1 Chip-Package Interaction|
Bart Vandevelde, IMEC
|C2 Model Order Reduction|
Dr-Ing. Tamara Bechtold, IMTEK - University of Freiburg
|C3 Stress and strain measurement for micro- and nano-scale microelectronics and MEMS devices|
Dietmar Vogel and Sven Rzepka, Fraunhofer ENAS, Chemnitz
|13h45||C4 Sorry, this course was cancelled on March 14th.|
Ahmer Syed, Amkor Technology, Phoenix AZ
|C5 Fracture mechanics and its applications in microsystem packaging|
Jianmin Qu, Northwestern University, Robert R. McCormick School of Engineering and Applied Science
|C6 LEDs Standardize – LEDs Do Something Cool!|
András Poppe, BME, Hungary
Instructor : Bart Vandevelde, IMEC
Chip Package Interaction (CPI) gained a lot of importance in the last years. The reason is twofold. First, advanced node IC technologies requires dielectrics in the BEOL (back-end-of-line) with a decreasing k value. These so-called (ultra) low-k materials have a reduced stiffness and adhesion strength to the barrier materials, making the BEOL much more vulnerable to externally applied stress due to packaging.
Secondly, advanced packaging technologies such as 3D stacked IC’s use thinned dies (down to 25µm) which can cause much higher stresses at transistor level, resulting in mobility shifts.
The course will give an overview on potential CPI failures, methods to model and characterise CPI and design guidelines to minimise the risk for CPI failure.
This course is intended for IC package designers and scientists, BEOL designers and process engineers, package and BEOL material suppliers. The course will contain some basics in mechanical stress induced by packaging, but will also go in depth for specialists in the different domains.
Dr. Bart Vandevelde received his Masters degree in mechanical engineering from the Catholic University of Leuven (Belgium) in June 1994. In March 2002, he received a PhD degree at IMEC in the field of thermo-mechanical modelling for electronic packages. Currently, he is responsible for the packaging level reliability research at IMEC. He has many publications in the field of thermal and thermo-mechanical modelling and characterisation for advanced IC packaging technologies.
Instructor : Dr-Ing. Tamara Bechtold, IMTEK - University of Freiburg
The rapid development of microelectronic and micro-electromechanical systems (MEMS) imposes high demands on modeling and simulation of these devices. In order to accurately describe the system behavior, which often belongs to several physical domains, usually a transient analysis is required.
Spatial discretization (with e. g. finite elements) of microsystem components with high aspect ratios (e.g. thin layers) leads to large-scale non-linear ordinary differential equation systems. Transient integration of such systems imposes high demands on computing time and memory capacity. Despite the always increasing computer power, extensive simulation studies including the necessary device-circuitry cosimulations, are still only possible under appropriate model simplifications. Furthermore, system-level studies of microsystems covering sensing, actuatuating, signal processing and packaging aspects demand for low-order yet precise models, which can be automatically gained with help of mathematical model order reduction (MOR) methods.
This course will give an overwiew of exsiting mathematical model order reduction methods and will demonstrate the usability of reduced order models of several multiphysics MEMS devices, within a cosimulation of the device and its driving/control circuitry.
The course adresses the needs of engineers and researchers involved in numerical modeling of MEMS and microelectronics and their simulations both at device and system level.
Tamara Bechtold is currently an Interim Professor for microsystems simulation at the University of Freiburg.
She obtained her MSc in microelecronics and microsystems engineering from the University of Bremen, Germany, in 2000, and her PhD in microsystem simulation from the University of Freiburg, Germany, in 2005. Between 2006 and 2010.
Dr. Bechtold worked as an experienced researcher for Philips Research Laboratories and NXP Seminconductors in Eindhoven, The Netherlands. The objective of her research work was to enhance the standard IC design flow through model order reduction and optimization modules. From 2010 to 2011, Dr. Bechtold was with CADFEM GmbH in Stuttgart, Germany, supporting industry and academia in application of advancedmodeling and simulation tools for systemlevel simulation and electromagnetic device simulation.
Dr. Bechtold is author or co-author of over 40 technical publications in the area of microsystem simulation, the lead author of the textbook "Fast Simulations of of Electro-Thermal MEMS: Efficient Dynamic Compact Models", published by Springer and the main editor of the textbook "System-Level Modeling of MEMS”, by Wiley-VHC book series on Advanced Micro and Nanosystems.
Her research interests cover applications of advanced mathematical methods of model order reduction and topology optimization to engineering problems and a multi physic modelling on the system- and device-level.
Instructor : Dietmar Vogel and Sven Rzepka, Fraunhofer ENAS, Chemnitz
Past years complexity of advanced electronics and MEMS systems has increased significantly. This process is accompanied by the introduction and application of new materials as well as new manufacturing technologies. In order to provide sufficient reliability of new products, continuum mechanics simulations with subsequent failure behavior prediction are used extensively. In doing so, considerable input data to feed simulations has to be generated. Residual stress due to manufacturing often is critical data in terms of its retrieval. Namely, built-in stresses in thin multilayer and patterned structures are not properly accessible by established methods. On the other hand, their correct knowledge is essential for trustworthy simulation results. In order to overcome this situation, existing stress measurement methods have been improved and new stress measurement methods have been developed and introduced within the past years. Though, sufficient spatial resolution of the method, high stress sensitivity and applicability to a diversity of materials often is a crucial point for new methods. Promising approaches for local stress measurement are methods basing on x-ray and electron diffraction, on stress relief by ion/laser milling, as well as micro/nanoRaman spectroscopy. In the opposite, the application of special stress test chips allows stress evaluation on MEMS and microprocessors due to packaging processes. The tutorial comprises an overview on the mentioned spatially high resolution methods as well as on test chip application. Their capabilities are benchmarked against each other and compared with classical procedures like for example bow measurements. Application examples are depicted in order to give an idea on practical utilization of the methods, on time and effort to be realized.
Digital image correlation (DIC) is a powerful tool for experimental deformation and motion analysis of objects under mechanical and thermal load. Applied to micrographs captured, e.g., from micro systems loaded inside SEM, FIB or AFM, deformation behavior on micro or nano scale can be studied. Extracted deformation fields can be used for comparison with FEA data or utilized to determine material properties required for simulation. In addition to stress measurement methods, the tutorial will give an overview of this technique and about applications in various field of reliability analysis.
The course is designed for scientists and engineers who are involved in reliability and quality management, as well as in product and technology development of electronics and microsystem components/devices. It is valuable to engineers faced with stress problems and looking for alternative, particularly non-standard approaches for stress evaluation.
Dietmar Vogel is currently group manager on the Micro Materials Center at the Fraunhofer ENAS in Chemnitz, Germany. He heads the group "Characterization of Micro and Nano Systems". His main research field is experimental micro and nano mechanics with emphasis to measurement techniques. Dietmar Vogel's expertise comprises fields like thermo-mechanical reliability for electronics, electronics and MEMS packaging, surface analytics, defectoscopy, material constitutive behavior and determination of material properties. Past years Dietmar Vogel conducted and supervised research activities with focus on advanced stress measurement techniques with high spatial resolution applied to electronics components and devices. Dietmar Vogel studied physics and received his PhD degree in plasma physics from the St. Petersburg State University in 1980. He started his career as scientist and manager in the Institute of Mechanics of the former East German Academy of Sciences. In between 1993 and 2007 he has been working with the Fraunhofer Institute for Reliability and Microintegration Berlin (IZM), where he headed research groups. In 2008 he changed to the newly founded Fraunhofer Institute for Electronic Nano Systems. Dietmar Vogel published over 150 papers in the field of mechanical reliability of electronics packaging. He has given many keynote and invited lectures on international conferences. He was member of program committees and chairing conferences. In 2005 he received the Joseph-von-Fraunhofer Award in recognition of his achievement in the field of nanoscopic measurement techniques.
Sven Rzepka is head of the department Micro Materials Center (MMC) at Fraunhofer ENAS in Chemnitz Germany. He joined Fraunhofer in 2009 after working as Principal simulation at Qimonda, Backend development, and at Infineon, BEoL reliability department. In 2002, he graduated from Dresden University of Technology with PhD and habilitation degrees. Since then, he has been teaching bachelor and master courses on microelectronics reliability and numerical simulation at the universities of Dresden and Chemnitz. In total, Dr. Rzepka has been working in microelectronics BEoL and packaging technology for 25 years with 20 years experience microelectronics reliability and simulation. He is member of IEEE, EPoSS, and Euceman. He has published his work in more than 100 papers in international journals and at conferences around the world.
Instructor : Ahmer Syed, Amkor Technology, Phoenix AZ
Instructor : Jianmin Qu, Northwestern University, Robert R. McCormick School of Engineering and Applied Science
Fracture and fatigue have been the most prevalent thermomechanical failure modes in microelectronic packages. As portable electronics become more ubiquitous, the demand for smaller size with more functions and higher performance will continue to rise. Such high density integration of heterogeneous components will further exacerbate the vulnerability of electronic devices against thermomechanical failure. Therefore, it is critically important that fracture and fatigue be used as design parameters for reliable microsystems. This requires not only the experimental tools to characterize the material’s ability to resist fracture and fatigue, but also the predictive modeling tools for design and reliability analysis.
In this course, existing fracture mechanics modeling/characterization methodologies commonly used in microelectronic packaging will be reviewed. Discussions will also include recent development in multi-scale, multi-physics modeling and characterization tools for engineering smart and multi-functional interfaces for nano and microelectronics.
Engineers, scientists and managers involved in the design, process and manufacturing of microsystem packaging, as well as electronic material suppliers involved in materials manufacturing and research and development.
Jianmin Qu, Walter P. Murphy Professor in the McCormick School of Engineering and Applied Science at Northwestern University, received his Ph.D. in Theoretical and Applied Mechanics from Northwestern University. Before joining the faculty at his alma mater in 2009, Professor Qu was on the faculty of the School of Mechanical Engineering at the Georgia Institute of Technology from 1989 to 2009.
Professor Qu’s research focuses on several areas of theoretical and applied mechanics including micromechanics of composites, interfacial fracture and adhesion, fatigue and creep damage in solder alloys, thermomechanical reliability of microelectronic packaging, defects and transport in ionic solids with applications to solid oxide fuel cells and batteries, and ultrasonic nondestructive evaluation of advanced engineering materials. He has authored/co-authored two books, 10 book chapters and over 150 referred journal papers in these areas.
Professor Qu currently serves as an Associate Editor for the Journal of Electronic Packaging. He has taught short courses in the general area of microelectronic packaging reliability in various professional conferences in Asia, Europe, South America and the US.
Jianmin Qu, Ph.D.
Walter P. Murphy Professor
Chair, Department of Civil and Environmental Engineering
Professor, Department of Mechanical Engineering
Evanston, IL 60208-3109
Phone: 847-467-4528, FAX: 847-491-4011
Instructor : András Poppe, BME, Hungary
LED performance is strongly influenced by the junction temperature. That is, LEDs' dissipation, the package thermal resistance (or impedance) and thermal environment (including ambient temperature and actual cooling conditions) are key parameters from the point of view of LED operation both at end-users in the field and during laboratory and production testing. To predict LED operation in a final application requires proper characterization of the LEDs themselves and to be able to simulate the final SSL product.
Though there have been great efforts in standardization of SSL products, until recently thermal aspects remained step children – except prescribing elevated aging temperatures during LM80 lifetime tests. The importance of the thermal issues and the need for new, LED specific thermal testing standards has been acknowledged by some vendors who were the first to investing into the new thermal testing technologies and started pursuing thermal standardization activities.
The JEDEC JC15 committee was among the first to act in 2009 by setting up a LED thermal testing task group, followed by the Division 2 of CIE where different technical committees have been set up to complete LED testing standards with thermal aspects. This short course aims at introducing characterization techniques which provide real thermal metrics of LED devices together with their hot lumens and temperature dependence of their luminous flux and other light output properties. The tutorial aims at providing the latest news about the activities in these committees.
The JEDEC JESD51-5x series of standards about LED thermal testing, launched in April 2012 will be shown in detail. Latest results regarding test based modeling of LEDs will also be presented, including LED package thermal modeling for CFD tools (with some LED street lighting application examples) as well as simplified LED multi-domain models allowing hot lumens calculation as a post-processing step in a CFD tool. Underlying models and application examples will be shown.
LED products still seem to be in the early, exponential growth phase of product life cycle: the LED product of today may become completely obsolete tomorrow – with no product replacement compatibility. The aim of the Zhaga consortium is to bridge this gap; resulting in new testing challenges, including thermal. The final part of the course aims at providing some outlook, also from this perspective.