Six training courses will be held at the venue Hotel Miragem on Sunday April 15th.
| 08h30 | C1 Analog and power packaging Yong LIU, Fairchild Semiconductors Duration: 2h00 | C2 3D IC and MEMS Integration Packaging John LAU, ITRI Duration: 2h00 | C3 Coplanarity Measurement of Chip, Component and PCB during Assembly Process Prof Bongtae HAN, CALCE Duration: 2h00 |
| 10h30 | Break Duration: 15mn |
| 10h45 | C1 (continued) Duration: 2h00 | C2 (continued) Duration: 2h00 | C3 (continued) Duration: 2h00 |
| 12h45 | Lunch Duration: 1h00 |
| 13h45 | C4 System Reliability Willem VAN DRIEL, Philips Lighting Duration: 2h00 | C5 Reliability of of RoHS Compliant 2D and 3D IC Interconnects John LAU, ITRI Duration: 2h00 | C6 Packaging of High Brightness Light-Emitting Diodes for Solid-State Lighting Sheng LIU, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology Duration: 2h00 |
| 15h45 | Break Duration: 15mn |
| 16h00 | C4 (continued) Duration: 2h00 | C5 (continued) Duration: 2h00 | C6 (continued) Duration: 2h00 |
Instructor : Yong LIU, Fairchild Semiconductors
Course outline to come soon...
C2 3D IC and MEMS Integration Packaging
Instructor : John LAU, ITRI
Leaflet McGraw-Hill Advanced MEMS Packaging
C3 Coplanarity Measurement of Chip, Component and PCB during Assembly Process
Instructor : Prof Bongtae HAN, CALCE
Warpage/coplanarity of surface mount components and substrates is one of the most critical issues during the board-level assembly process and handling. In the past decades, numerous optical methods have been employed for warpage/coplanarity measurements. They include point measurement techniques such laser profilometer, optical scanning, white light interferometer; and whole-field measurement techniques such as classical interferometry (e.g., Twyman/Green interferometry, Fizeau interferometry, holographic interferometry, speckle interferometry), geometric moiré techniques (e.g., shadow moiré and projection moiré), Digital Image Correlation, etc.
This course reviews all existing warpage/coplanarity measurement techniques that have been implemented for packaging applications. Selected results from each technique are presented to illustrate advantages and limitations. Technical challenges associated with future package and substrate developments will be addressed and advanced methodology developments will be discussed.
Substrate engineers; Component engineers; Assembly engineers; Qualification engineers
He is currently a Professor of the Mechanical Engineering Department of the University of Maryland and is directing the LOMSS (Laboratory for Optomechanics and Micro/nano Semiconductor/Photonics Systems) of CALCE (Center for Advanced Life Cycle Engineering).
His technical contributions center around experimental analyses by optical techniques. He developed, extended and utilized special measurement means, including Moiré Interferometry, Micro-Moiré Interferometry, Far Infrared Fizeau Interferometry and Advanced Shadow Moiré, thereby providing instrumentation for, and analyses of, device behavior; instrumentation that he developed is widely used in industry today.
Dr. Han has co-authored a text book entitled "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials", Springer-Verlag, 1997. He edited two books and published 8 book chapters. He has published extensively in international journals and conferences (over 150 journal and conference papers), and has organized numerous international meetings and panels discussing electronics reliability. He holds 2 US patents and 4 invention disclosures.
Dr. Han received the IBM Excellence Award for Outstanding Technical Achievements in 1994. He was a recipient of the 2002 Brewer Award, presented at the Annual Conference of the SEM in Emerging Technologies. His publication awards include the Year 2004 Best Paper Award of the IEEE Transactions on Components and Packaging Technologies, and the Gold Award (best paper in the Analysis and Simulation session) at the 1st Samsung Technical Conference in 2004. He served as an Associate Technical Editor for Experimental Mechanics, from 1999 to 2001, and has been serving as an Associate Technical Editor for Journal of Electronic Packaging, Transaction of the ASME since 2003.
He was elected a Fellow of the SEM (Society for Experimental Mechanics) and the ASME (American Society for Mechanical Engineers) in 2006 and 2007, respectively.
Instructor : Willem VAN DRIEL, Philips Lighting
Willem has a >15 year track record in the reliability domain. Application areas range from healthcare, gas and oil explorations, semiconductors and in his current position in Philips Lighting he is responsible for Solid State Lighting reliability.
He holds an assistant professor position at the University of Delft, The Netherlands. His scientific interests are solid state lighting, microelectronics and microsystems technologies, virtual prototyping, virtual reliability qualification and designing for reliability of microelectronics and microsystems.
He is a member of the organizing committee of the IEEE conference EuroSimE and Guest Editor for the IEEE Transactions on Components and Packaging Technologies. He has authored and co-authored more than 150 scientific publications, including journal and conference papers, book or book chapters and invited keynote lectures. He holds 10 patents. [http://nl.linkedin.com/pub/willem-van-driel/3/ba9/7b5]
C5 Reliability of of RoHS Compliant 2D and 3D IC Interconnects
Instructor : John LAU, ITRI
Leaflet McGraw-Hill Reliability of of RoHS Compliant 2D and 3D IC Interconnects
C6 Packaging of High Brightness Light-Emitting Diodes for Solid-State Lighting
Instructor : Sheng LIU, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology
This short course will cover the essential knowledge for the LED packaging and its lighting applications. They cover many examples in road lighting, backlighting lighting, automotive headlamp, locomotive lighting, airport lighting, MR6, and light bulbs. Application specific LED packaging is introduced for those specific applications. Evolution of LED, its key elements of design for X are introduced. Optical, thermal, manufacturing processes, and reliability are discussed. New trends towards direct white light and wafer level packaging are also discussed. This course is useful to researchers, practicing engineers, and graduate students. The interactions between various chains of the LED industry will be discussed among HVPE GaN substrate growth, MOCVD epi growth, LED chip structures, packaging structures, and applications.
Tel: +86-27-87542604, Fax: +86-27-87544175, Email: victor_liu63@126.com
Updated 05 01 12