EuroSimE 2009 was locally organised by TU Delft (Leo Ernst, Kaspar Jansen and team) in TUD Congress Centre, Delft, The Netherlands

EuroSimE 2009 in Delft, The Netherlands

The 10th EuroSimE was held in the Aula congress centre of the Technical University of Delft, in the Netherlands, April 2009. It was attended by 150 individuals.

5 training courses were offered on Sunday. The software exhibition brought together 7 exhibitors.

Proceedings of EuroSimE 2009
760 pages
IEEE Catalog Number CFP09566-PRT
ISBN 978-1-4244-4159-4
Library of Congress 200901561

CD-ROM version: IEEE Catalog number CFP09566-CDR
ISBN 978-1-4244-4161-7
Library of Congress 2009901561

This was the technical programme of EuroSimE 2009:

09.10 INDUSTRIAL TRENDS KEYNOTE 1: Trends in Analog and Power Packaging, Dan Kinzer, Senior VP at Fairchild Semiconductor Corp., USA

09.40 INDUSTRIAL TRENDS KEYNOTE 2: From convergence to diversification, Gerard F.M. Beenker VP, Scientific Director NXP Semiconductors / Corporate I&T, The Netherlands

10.10 INDUSTRIAL TRENDS KEYNOTE 3: The Automotive Si(mu)licon Drive, by Peter van Staa, Robert Bosch GmbH

Session 1 11:10 Monday 27 Apr 2009
New Developments in Modeling
Chaired by B. Michel, Fraunhofer IZM; L.J. Ernst, Delft University of Technology
11:10 30mn
Keynote presentation - Challenges in LED thermal characterisation
Clemens J.M. Lasance, Philips Research, the Netherlands
Andras Poppe, Mentor Graphics MicReD Division, Hungary
11:40 30mn
Keynote presentation - Application of stress sensing test chips to area array packaging
Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, M. Kaysar Rahim, Jordan C. Roberts, Safina Hussain, Auburn University, USA
12:10 30mn
Keynote presentation - Simulation approaches for magnetic resonance imaging sensors
Jan G. Korvink 1, Zhenyu Liu 2, Andreas Peter 2, Laura Del Tin 2, Feng Jia 2, Raghad Zohair 2, Ibrahim El-Kair 2
1 Dpt of Microsystems Engineering (IMTEK), University of Freiburg, Germany; Freiburg Institute of Advanced Studies (FRIAS), University of Freiburg, Germany
2 Dpt of Microsystems Engineering (IMTEK), University of Freiburg, Germany

Session 2 14:00 Monday 27 Apr 2009
Thermo-Mechanical Modeling
Chaired by P. Lall, Auburn University; Y. Liu, Faichild Semiconductors
14:00 30mn
Keynote presentation - Applications of FE multi-scale simulations in microelectronics
Richard van Silfhout, Thijs Viegers, Philips Applied Technologies, Eindhoven, The Netherlands
14:30 20mn
Accurate Thermal Cycle Lifetime Estimation for BGA Memory Components with Lead-free Solder Joints
Przemyslaw Gromala, Jan Reichelt, Sven Rzepka, Qimonda Dresden
14:50 20mn
Constitutive Behaviour of Copper Ribbons used in Solar Cell Assembly Processes
Steffen Wiese, Rico Meier, Frank Kraemer, Joerg Bagdahn, Fraunhofer Center for Silicon Photovoltaics, Halle (Saale)
15:10 20mn
On the epoxy moulding compound aging effect on package reliability
Sander Noijen 1, Roy Engelen 1, Joerg Martens 2, Alexandru Opran 1, Olaf van der Sluis 1
1 Philips Applied Technologies, Eindhoven, The Netherlands
2 NXP Semiconductors, Hamburg, Germany
15:30 20mn
Analysis of the three-dimensional delamination behavior of stretchable electronics applications
Olaf van der Sluis 1, Peter Timmermans 2, Edwin van der Zanden 3, Johan Hoefnagels 3
1 Philips Applied Technologies, Eindhoven, The Netherlands and Delft University of Technology, Delft, The Netherlands
2 Philips Applied Technologies, Eindhoven, The Netherlands
3 Eindhoven University of Technology, Eindhoven, The Netherlands

Session 3 14:00 Monday 27 Apr 2009
Process Modeling
Chaired by C. Bailey, The University of Greenwich; N. Iwamoto, Honeywell
14:00 30mn
Keynote presentation - Modeling, Simulation and Calibration of the Chip Encapsulation Molding Process
Mike Roellig 1, Sebastian Meyer 2, Michael Thiele 3, Sven Rzepka 3, Klaus-Juergen Wolter 2
1 Fraunhoferinstitut fuer Zerstoerungsfreie Pruefverfahren, Dresden
2 Technische Universitaet Dresden
3 Qimonda GmbH & Co. KG, Dresden
14:30 20mn
Modeling Cure Shrinkage and Viscoelasticity to Enhance the Numerical Methods for Predicting Delamination in Semiconductor Packages
M. Hossein Shirangi 1, Bernhard Wunderle 2, Olaf Wittler 2, Hans Walter 2, Bernd Michel 2
1 Robert Bosch GmbH, Automotive Electronics, Germany
2 Fraunhofer IZM, Micro Materials Center Berlin, Germany
14:50 20mn
Modeling and simulation of a nanowire based cantilever structure
Ritu Bajpai, Onur Tigli, Mona Zaghloul, The George Washington University, Washington DC, USA
15:10 20mn
Package delamination as indicator of ball bond lift: New diagnostic methodology
Manoubi Auguste BAHI 1, Pascal LECUYER 1, Annabelle GENTIL 1, Hélène FREMONT 2, Jean-Pierre LANDESMAN 3
1 ATMEL, Nantes, France
2 IMS Université Bordeaux 1, Talence, France
3 IMN Université de Nantes, Nantes, France

Session 4 14:00 Monday 27 Apr 2009
Thermal Behavior Modeling and Characterization
Chaired by P. Rodgers, The Petroleum Institute; X. Perpinya, Centro Nacional de Microelectrónica
14:00 30mn
Keynote presentation - Thermal Transient Behavior of Silicon-on-Glass BJTs
Salvatore Russo 1, Luigi La Spina 2, Vincenzo d'Alessandro 1, Niccolò Rinaldi 1, Massimiliano De Magistris 3, Lis K. Nanver 2
1 Department of Electronics and Telecommunications Engineering, University of Naples Federico II, Naples, Italy
2 Laboratory of Electronic Components, Technology & Materials (ECTM), Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology, Delft, The Netherlands
3 Department of Electrical Engineering, University of Naples Federico II, Naples, Italy
14:30 20mn
Efficient Solution of Inverse Thermal Problem via Parametric Model Order Reduction
Tamara Bechtold, MCRTN COMSON, University of Wuppertal, Gauss Str. 20, 42119 Wuppertal, Germany
Dennis Hohlfeld, )Holst Centre / IMEC, High Tech Campus 31, 5656 AE Eindhoven, The Netherlands
Evgenii B. Rudnyi, CADFEM GmbH, Marktplatz 2, 85567 Grafing b. München, Germany
14:50 20mn
CFD Analysis of Water Jet Impingement Cooling System for Effective Cooling of IGBTs used in Power Electronics
M. J. Rizvi 1, R. Skuriat 2, T. Tilford 1, C. Bailey 1, C. M. Johnson 2, H. Lu 1
1 School of Computing & Mathematical Sciences, The University of Greenwich, London, UK
2 Department of Electrical & Electronic Engineering, The University of Nottingham, Nottingham, UK
15:10 20mn
High-Temperature CNFET Characteristics
Samaneh Soleimani Amiri, Ali Afzali-Kusha, Behjat Forouzandeh, University of Tehran,Iran
15:30 20mn
Thermal Analysis Based on the Environmental Tests of STN Display
Jian-Ping Li 1, Ping Yang 1, Jian Zhong 1, Quayle Chen 2, Cherie Jing 2, Leon Xu 2, Antti Salo 2
1 School of Mechatronics Engineering, University of Electronic Science and Technology of China
2 Nokia Research Center Beijing

Session 5 16:20 Monday 27 Apr 2009
Optimisation (TM)
Chaired by J. Auersperg, Fraunhofer IZM; G. Zhiyin, Huazhong University of Science and Technology
16:20 30mn
Keynote presentation - Automated Optimization of Light Dose Distribution for Moving-Mask Lithography
Fred van Keulen 1, Yoshikazu Hirai 2, Osamu Tabata 2
1 Department for Precision and Microsystems Engineering, Delft University of Technology, The Netherlands
2 Department of Micro Engineering, Graduate School of Engineering, Kyoto University, Japan
16:50 20mn
Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Artur Wymyslowski 1, Olaf Wittler 2, Raul Mrossko 2, Rainer Dudek 2, Jürgen Auersperg 2, Lukasz Dowhan 1
1 Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Poland
2 Fraunhofer Institute for Reliability and Microintegration (IZM), Micro Materials Center, Germany
17:10 20mn
Prediction of the thermo-mechanical material behavior of PEN foil during photolithographic processing
M. Barink, M. Goorhuis, P. Giesen, F. Furthner, I. Yakimets, TNO/Holst Centre, Eindhoven, The Netherlands
17:30 20mn
Simulated annealing as a global optimization algorithm used in numerical prototyping of electronic packaging
Lukasz Dowhan, Artur Wymyslowski, Krzysztof Urbanski, Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Poland

Session 6 16:20 Monday 27 Apr 2009
Electro-Mechanical Devices (Part 1)
Chaired by D. Elata, Technion; A. Corigliano, Politecnico di Milano
16:20 30mn
Keynote presentation - Pull-in curves determined with monolithic FEM models
Stephan Hannot, Daniel Rixen, Delft University of Technology
16:50 20mn
Optimising Dynamic Behaviour of Electrostatically Actuated MEMS Contact Switch
Maryna Lishchynska 1, Marcin Cychowski 1, Niel Canty 2, Tom O'Mahony 2, Kieran Delaney 1
1 TEC Centre, Cork Institute of Technology, Cork, Ireland
2 Advanced Control Group, Cork Institute of Technology, Cork, Ireland
17:10 20mn
The dynamic model of electrostatic torsion mirror with pullin consideration for multiphysics behavior anticipation
Yuheon Yi, Hiroyuki Fujita, Hiroshi Toshiyoshi, University of Tokyo, Tokyo, Japan
17:30 20mn
3D multi-frequency MEMS electromechanical resonator design
F. Casset 1, C. Durand 2, S. Dedieu 3, JF. Carpentier 3, JP. Gonchond 3, P. Ancey 3, P. Robert 1
1 CEA, LETI, MINATEC
2 IEMN
3 ST

Session 7 16:20 Monday 27 Apr 2009
Innovative Methods for Microsystems Modelling
Chaired by M. Gonzalez, IMEC; M. Lindgren, SP Technical Research Institute of Sweden
16:20 30mn
Keynote presentation - On Electrochemical Cell Modelling as Basis for Predicting Corrosion Failures in Plastic Encapsulated Microelectronics
M. van Soestbergen 1, R.T.H. Rongen 2, A. Mavinkurve 2, G.Q. Zhang 3, L.J. Ernst 4
1 Materials Innovation Institute, Delft, the Netherlands
2 NXP Semiconductors, Nijmegen, the Netherlands
3 NXP Semiconductors, Eindhoven, the Netherlands
4 Delft University of Technology, Delft, the Netherlands
16:50 20mn
Uncertainty and Reliability Analysis of Chip Scale Package Subjected to Board-level Drop Test
Masafumi Sano, Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Kuo-Ning Chiang, Advanced Microsystem Packaging and Nano-Mechanics Research Lab Dept. of Power Mechanical Engineering, National Tsing Hua University, Taiwan
17:10 20mn
Analytical model of electrostatic membrane-based actuators
C. Maj 1, M. Olszacki 1, M. Al Bahri 1, P. Pons 1, A. Napieralski 2
1 LAAS-CNRS, Universite de Toulouse, Toulouse, France
2 Technical University of Lodz, Lodz, Poland
17:30 20mn
A Fusion Approach to IGBT Power Module Prognostics
Nishad Patil 1, Diganta Das 1, Chunyan Yin 2, Hua Lu 2, Chris Bailey 2, Michael Pecht 3
1 Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, USA
2 School of Computing and Mathematical Science, University of Greenwich, UK
3 CALCE, University of Maryland, USA; Dpt of Electronics Engineering, City University of Hong Kong

Session 8 09:00 Tuesday 28 Apr 2009
Dynamics
Chaired by T. Tee, Amkor; R. Dudek, Fraunhofer IZM
09:00 30mn
Keynote presentation - Copper Trace Fatigue Models for Mechanical Cycling, Vibration and Shock/Drop of High-Density PWAs
Daniel Farley 1, Yuxun Zhou 1, Farbod Askari 1, Moustafa Al-Bassyiouni 1, Abhijit Dasgupta 1, J. F. J. Caers 2, J. W. C. DeVries 2
1 University of Maryland
2 Philips
09:30 20mn
A Multiscale-Stochastic Finite Element Approach to Shock-Induced Polysilicon MEMS Failure
S. Mariani 1, A. Ghisi 1, R. Martini 1, A. Corigliano 1, B. Simoni 2
1 Politecnico di Milano, Dipartimento di Ingegneria Strutturale, Milano, Italy
2 MAHRS Unit, STMicroelectronics, Cornaredo, Italy
09:50 20mn
Design for Board Trace Reliability of WLCSP under Drop Test
Tong Yan Tee 1, Hun Shen Ng 1, Ahmer Syed 2, Rex Anderson 2, Choong Peng Khoo 1, Boyd Rogers 2
1 Amkor Technology, Singapore
2 Amkor Technology, USA

Session 9 11:00 Tuesday 28 Apr 2009
Thermo-Mechanical Issues in Microelectronics
Chaired by K. Jansen, Technical University of Delft; H. Pape, Infineon Technologies

Assembly induced failures in thin film MEMS packages
J.J.M. Zaal 1, W.D. van Driel 2, J.T.M. van Beek 3, G.Q. Zhang 2
1 Delft University of Technology
2 NXP Semiconductors, Delft University of Technology
3 NXP Semiconductors

Design for Reliability Methodology for Micro Laser Welding of Pigtail Fibres
Asif Malik 1, Stoyan Stoyanov 1, Chris Bailey 1, Paul Firth 2
1 University of Greenwich
2 Bookham Technology

Effects of Geometry and Material Properties for Stacked IC Package with Spacer Structure
Ming-Che Hsieh, Chih-Kung Yu, Wei Lee, Industrial Technology Research Institute, Hsinchu, Taiwan

Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests
Fubin Song 1, Tong Jiang 1, Jeffery C. C. Lo 1, S. W. Ricky Lee 1, Keith Newman 2
1 EPACK Lab, Center for Advanced Microsystems Packaging, Hong Kong University of Science & Technology
2 SUN Microsystems

Development of a submodel technique for the simulation of solder joint fatigue of electronic devices mounted within an assembled ECU.
Natalja Schafet 1, Christian Lemm 1, Ulrich Becker 1, Herbert Güttler 2, Philipp Schmid 2
1 Robert Bosch GmbH, Schwieberdingen, Germany
2 MicroConsult GmbH, Bernstadt, Germany

Probabilistic Effects in Thermal Cycling Failures of High-I/O BGA Assemblies
Shaughn London 1, Dominic Fricano 1, Abhijit Dasgupta 1, Tommi Reinikainen 2, Germano Freitas 3, Cleber Pagliosa 3
1 University of Maryland
2 Nokia
3 INdT

Drop Test Simulation Study of Flexible Devices
Quayle Chen 1, Leon Xu 1, Cherie Jing 1, Tom Xue 1, Bin Wang 1, Tiejun Zhao 1, Antti Salo 1, Kari Ojala 2
1 Nokia Research Center (Beijing), China
2 Nokia Devices, R&D (Helsinki), Finland

Sensitivity Analysis of Technological Fabrication Tolerances on the Lifetime of Flip-Chip Solder Joints
Tilman Eckert, Kornelius Tetzner, Olaf Bochow-Ness, Wolfgang H. Müller, Herbert Reichl, Technische Universität Berlin, Berlin, Germany

In-Situ Observation of SAC305 Degradation during Isothermal Cycling of Joint-Scale Samples
Dominik Herkommer, Michael Reid, Jeff Punch, Stokes Institute, University of Limerick, Ireland

Comprehensive Material Characterization of Organic Packaging Materials
Bjoern Boehme 1, K.M.B. Jansen 2, Sven Rzepka 3, Klaus-Juergen Wolter 1
1 Technische Universität Dresden, Electronics Packaging Laboratory, Dresden, Germany
2 Delft University of Technology, Mechanics of Materials, Delft, The Netherlands
3 Qimonda Dresden, Dresden, Germany

Impact of the UBM geometry and solder bump shape on electromigration reliability in a package system
Yuanxiang Zhang 1, Lihua Liang 1, Xuefan Chen 1, Yong Liu 2, Timwah Luk 2, Scott Irving 2
1 Fairchild-ZJUT Joint Lab, Zhejiang University of Technology
2 Fairchild Semiconductor Corp.

The influence of process parameters and material properties on stress distribution in MEMS-ASIC integrated systems after molding- numerical and experimental approach.
Tomasz Falat 1, Kazimierz Friedel 1, Krzysztof Malecki 1, Dominika Uruska 1, Wilfred Gal 2
1 Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland
2 Fico B.V., Duiven, The Netherlands

Lifetime Modeling for Jedec Drop Tests
Frank Krarmer, Fraunhofer Center for Silicon Photovoltaics, Halle (Saale), Germany
Sven Rzepka, Qimonda Dresden GmbH & Co OHG, Dresden, Germany
Jens Lienig, Dresden University of Technology, Institute of Electromechanical and Electronic Design, Germany

Dynamic model for design optimization of a high bandwidth thermal linear motor
S.L. Paalvast 1, P.M. Sarro 2, R.H. Munnig Schmidt 1
1 Delft University of Technology, 3mE - PME - MSD
2 Delft University of Technology, DIMES - ECTM

Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens
R. Metasch 1, J.C. Boareto 1, M. Roellig 2, S. Wiese 3, K.-J. Wolter 1
1 Technische Universität Dresden, Electronics Packaging Laboratory
2 Fraunhofer Institut für Zerstörungsfreie Prüfverfahren
3 Fraunhofer-Center für Silizium-Photovoltaik

Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components.
T. Falat 1, K.M.B. Jansen 2, J. de Vreugd 2, S. Rzepka 3
1 Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics
2 Delft University of Technology, Faculty of Mechanical, Maritime and Materials Engineering
3 Qimonda Dresden GmbH & Co OHG, Dept. QD BET CMI

Virtual prototyping of a Wafer Level Chip Scale Package: Underfill role in die cracking
Samed Barnat 1, Stephane Bellenger 2, Helene Frémont 3, Alexandrine Gracia 3, Pascal Talbot 4
1  NXP Semiconductors, Caen; Université Bordeaux I, Laboratoire IMS, France
2  NXP Semiconductors, Caen, France
3 Université Bordeaux I, Laboratoire IMS, France
4 NXP Semiconductors, Caen, France

Influence of Thermal Ageing on Long Term Reliability of SnAgCu Solder Joints
B. Dompierre 1, V. Aubin 2, E. Charkaluk 2, W. C. Maia Filho 1, M. Brizoux 1
1 Engineering & Process Management, Thales Corporate Services SAS, 92366 Meudon, France
2 Laboratoire de Mécanique de Lille, UMR CNRS 8107, 59651 Villeneuve d’Ascq Cedex, France

Design Study of the Bump on Flexible Lead by FEA for Wafer Level Packaging
I. Eidner 1, B. Wunderle 2, K. L. Pan 3, M. J. Wolf 2, O. Ehrmann 1, H. Reichl 1
1 Technical University of Berlin, Germany
2 Fraunhofer Institute for Reliability and Microintegration, Germany
3 Guilin University of Electronic Technology, China

Investigation on the loading of thermomechanical actuators to improve efficient thermomechanical reduction bases for fast reanalysis
Alexander M. Steenhoek, Daniel J. Rixen, Delft University of Technology, The Netherlands

Influence of build-up construction and resin-content on mechanical behavior of printed circuit boards
W. C. Maia Filho, M. Brizoux, B. Dompierre, B. Guillaume, Thales Corporate Services - EPM, Meudon-la-Forêt, France

Characterisation and modelling of the nanoindentation experiment in Au layers
Olaf Wittler 1, Raúl Mroßko 2, Saskia Huber 1, Astrid Gollhardt 1, Bernd Michel 1
1 Micro Materials Center, Fraunhofer IZM, Berlin, Germany
2 AMIC GmbH, Berlin, Germany

Cure-induced warpage of micro electronics: comparison with experiments
J. de Vreugd 1, K.M.B. Jansen 1, L.J. Ernst 1, C. Bohm 2, T. Falat 3
1 TU-Delft
2 Infineon
3 TU Wroclaw

Board Level Reliability Improvement of Ultra Thin Leadless Package (UTLP) Concept
Cadmus Yuan 1, G.Q. (Kouchi) Zhang 2, Joey Salta 1, Rik Jos 1
1 NXP Semiconductors, The Netherlands
2 NXP Semiconductors; Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands

Moisture Effects on a SiP Carrier
Xiaosong Ma 1, K.M.B. Jansen 1, L.J. Ernst 1, W.D van Driel 2, O. van der Sluis 3, G.Q.Zhang 2
1 Delft University of Technology
2 Delft University of Technology and NXP the Netherlands
3 Delft University of Technology and Philips

Session 10 11:00 Tuesday 28 Apr 2009
Multi-Physics and Thermal Issues in Microelectronics
Chaired by K. Jansen, Technical University of Delft; H. Pape, Infineon Technologies

A Conformal Mapping based Approach for Fast Two-Dimensional FEM electrostatic analysis of MEMS devices without re-meshing
Prasad S Sumant, Andreas C Cangellaris, Narayana R Aluru, University of Illinois at Urbana-Champaign, Urbana, IL, USA

Numerical modeling of two proposed mechanically fabricated free-fins heatsinks
Jan Bijan Pourian, Mark Irwin, Erik Dahlquist, Department of energy technique Malardalen University Mdh, Outokumpu fabrication technology,Mdh

A Multiscale Model of Micro Cantilever Arrays
Lenczner Michel, Cogan Scott, Pillet Emannuel, Hui Hui, FEMTO-ST

Rigid-Flexible Printed Circuit Structure Optimization by Simulation
Hai-bo Sun 1, Ming-quan Shi 1, Ping Yang 1, Jian Zhong 1, Quayle Chen 2, Tom Xue 2, Tiejun Zhao 2, Leon Xu 2, Antti Salo 2
1 School of Mechatronics Engineering, University of Electronic Science and Technology of China
2 Nokia Research Center Beijing

FEA Based Design Optimization of Exciting Sensitivity for Micromachined Piezoelectric Transducer
Chengguang Cai 1, Yang Liu 2, Yanan Han 2, Quayle Chen 2, Antti Salo 2, Leon Xu 2
1 Beijing University of Posts and Telecommunications, Beijing, China
2 Nokia Research Center (Beijing), China

Simulating the real geometry of an electrostatic switch to study the effect of uncertainties on the pull-in voltage.
H.ACHKAR, LAAS-CNRS, University of Toulouse: INSA
P.PONS, LAAS-CNRS
M.SARTOR, University of Toulouse: INSA
R.PLANA, LAAS-CNRS, University of Toulouse: UPS

Dynamic Study and Structure Enhancement of Small Outline Dual-in-line Memory Module
C. J. Huang, C. Y. Chou, K. N. Chiang, Advanced Microsystem Packaging and Nano-Mechanics Research Lab Dept. of Power Mechanical Engineering, National Tsing Hua University, Taiwan

Design and Simulation Study for an Electro-Thermally Actuated Micromanipulator
Rodica Voicu, Catalin Tibeica, Raluca Muller, National Institute for Research and Development in Microtechnologies (IMT-Bucharest), Bucharest, Romania

High Vibration Sensors: Modelling, Design and Integration
Véronique Rochus 1, Stefanie Gutschmidt 1, Jean-Claude Golinval 1, Michel Saint-Mard 2, Bruno Heusdens 1, Fabrice Haudry 1, Jacques Destiné 1
1 University of Liège
2 TAIPRO Engineering SA

Challenges in MEMS parametric macromodeling based on mode superposition technique
Vladimir Kolchuzhin, Wolfram Dötzel, Jan Mehner, Chemnitz University of Technology, Chemnitz, Germany

Multi-disciplinary Approach to Design of a Power Electronics Module for Harsh Environments
Mats Lindgren 1, Ilja Belov 2, Alf Johansson 2, Torkel Danielsson 3, Niklas Gunnarsson 1, Peter Leisner 4
1 SP Technical Research Institute of Sweden
2 School of Engineering, Jönköping University
3 Proxy Electronics AB
4 SP Technical Research Institute of Sweden/School of Engineering, Jönköping University

Session 11 13:30 Tuesday 28 Apr 2009
Reliability and Materials
Chaired by B. Wunderle, Fraunhofer IZM; J. Wilde, IMTEK
13:30 30mn
Keynote presentation - Prognostics and Condition Monitoring of Electronics
Pradeep Lall 1, Prashant Gupta 1, Dhananjay Panchagade 1, Manish Kulkarni 1, Jeff Suhling 1, James Hofmeister 2
1 Auburn University
2 Ridgetop, Inc.
14:00 20mn
Wire bonding degradation induced by temperature gradients under active cyclic loading
R. Pufall, P. Alpern, W. Kanert, T. Smorodin, M. Stecher, Infineon Technologies AG
14:20 20mn
Thermo-Mechanical Reliability Assessment for 3D Through-Si Stacking
Rainer Dudek 1, Birgit Brämer 1, Roland Irsigler 2, Sven Rzepka 3, Bernd Michel 1
1 Fraunhofer ENAS, Micro Materials Center Berlin and Chemnitz, Germany
2 Qimonda AG
3 Qimonda Dresden GmbH & Co. OHG
14:40 20mn
Influence of moisture on the time and temperatue dependent properties of polymer systems
Walter, H. 1, Dermitzaki, E. 1, H.Shirangi 2, Wunderle,B. 1, Hartmann, S. 3, Michel, B. 1
1 Fraunhofer IZM, Micro Materials Center Berlin /Chemnitz, Germany
2  Robert Bosch GmbH, Reutlingen,Germany
3 Technische Universität Berlin (TUB), Berlin, Germany
15:00 20mn
Modeling the substrate effects on nanoindentation mechanical property measurement
Mario Gonzalez, Kris Vanstreels, Adam M. Urbanowicz, IMEC

Session 12 13:30 Tuesday 28 Apr 2009
Multi-Physics Models for Reliability
Chaired by D. Andersson, Swerea IVF; S. Wiese, Fraunhofer CSP
13:30 30mn
Keynote presentation - Moisture induced effects in PoP
A. Guédon-Gracia, W. FENG, J.-Y. Delétage, F. Verdier, H. Frémont, IMS, Université bordeaux 1, FRANCE
14:00 20mn
Thermo-mechanical modeling of stress-induced-voiding in BEOL Cu interconnects structures
Melina Lofrano 1, Christopher J. Wilson 2, Kristof Croes 1, Bart Vandevelde 1
1 IMEC, Leuven, Belgium
2 School of Electrical, Electronic, and Computer Engineering. Newcastle University, United-Kingdom
14:20 20mn
The electro-thermal-mechanical performance of an OLED: a multi-physics model study
Sander Gielen 1, Marco Barink 1, Jeroen van den Brand 2, Ton van Mol 2
1 TNO Science and Industry, Eindhoven, The Netherlands
2 Holst Centre, Eindhoven, The Netherlands
14:40 20mn
Electrically driven matter transport effects in PoP interconnections
W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, H. Frémont, IMS, Université bordeaux 1, FRANCE
15:00 20mn
Effect of Wire Bond and Die Layout on Electrical Performance of Power Packages
Yumin Liu 1, Mark Rembrandr T Carredo 1, Zhiping Hu 1, Yong Liu 2, Timwah Luk 2, Scott Irving 2
1 Fairchild Semiconductor, Suzhou
2 Fairchild Semiconductor Corp., S. Portland

Session 13 13:30 Tuesday 28 Apr 2009
Molecular Dynamics
Chaired by J. Qu, Georgia Tech; C. Yuan, NXP Semiconductors
13:30 30mn
Keynote presentation - A multiscale approach for investigation of interfacial delamination in electronic packages
Haibo Fan, Matthew M F Yuen, Department of Mechanical Engineering, Hong Kong University of Science and Technology
14:00 20mn
Molecular Dynamics Simulation and Mechanical Characterisation for the Establishment of Structure-Property Correlations for Epoxy Resins in Microelectronics Packaging Applications
B. Wunderle 1, E. Dermitzaki 1, O. Hölck 1, J. Bauer 1, H. Walter 1, Q. Shaik 2, K. Rätzke 2, F. Faupel 2, B. Michel 1
1 Fraunhofer IZM
2 Kiel University
14:20 20mn
Understanding Leakage Current Susceptibility in Dielectrics using Molecular Modeling
Nancy Iwamoto, Honeywell Specialty Materials
Ahila Krishnamoorthy, Honeywell Electronic Materials
14:40 20mn
Computational Study of Armchair Single Wall Carbon Nanotubes
Dumitru Pavel, Kouchi Zhang, Cadmus Yuan, Department of Precision and Microsystem Engineering, Delft University of Technology, Delft The Netherlands
15:00 20mn
Investigation on thermal and mechanical properties of Crosslinked Epoxy Resin by MD Simulation
Ningbo Liao 1, G.Q. Zhang 1, Dumitru Pavel 1, Olaf van der Sluis 2, K.M.B. Jansen 1, L.J. Ernst 1
1 Department of Precision and Microsystem Engineering, Delft University of Technology. 2600 GA, Delft. The Netherlands
2 Philips Applied Technologies, High Tech Campus 7, 5656 AE Eindhoven, The Netherlands

Session 14 16:00 Tuesday 28 Apr 2009
Solder Modeling
Chaired by A. Dasgupta, University of Maryland; F. Gao, Georgia Institute of Technology
16:00 30mn
Keynote presentation - Multi-scale analysis of solder interconnects in micro-electronics
M.G.D. Geers 1, M. Erinc 2, M.A. Matin 1
1 Eindhoven University of Technology, Eindhoven, The Netherlands
2 TNO, Eindhoven, The Netherlands
16:30 20mn
Modelling of Sn3.0Ag0.5Cu Thermo-Mechanical Behaviour by a Continuum Damage Approach
Marc GRIEU 1, Gregor MASSIOT 2, Olivier MAIRE 2, Catherine MUNIER 2, Yves BIENVENU 3, Jacques RENARD 3
1 EADS France Innovation Works / Ecole des Mines de Paris
2 EADS France Innovation Works
3 Ecole des Mines de Paris
16:50 20mn
Combining Experimental and Simulation Methods for the Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads
Karsten Meier 1, Mike Roellig 2, Steffen Wiese 3, K.-J. Wolter 1
1 Technische Universität Dresden, Electronics Packaging Laboratory, D-01062 Dresden, Germany
2 Fraunhofer Gesellschaft IZFP-D, Dresden, Germany
3 Fraunhofer Gesellschaft CSP, Halle, Germany
17:10 20mn
Influence of the Microstructure on the Stress State of Solder Joints during Thermal Cycling
Alexander Menk, Robert Bosch GmbH
Stephane Bordas, University of Glasgow, Department of Civil Engineering
17:30 20mn
Effect of Cyclic Fatigue Damage Accumulation on the Elastic-Plastic Properties of SAC305 Solders
Gayatri Cuddalorepatta, Abhijit Dasgupta, CALCE Electronic Products and Systems Center, Mechanical Engineering Department, University of Maryland, USA

Session 15 16:00 Tuesday 28 Apr 2009
Innovative Methods for Multi-Physics Modeling
Chaired by A. Frangi, Politecnico di Milano
16:00 30mn
Keynote presentation - On the numerical evaluation of capacitance and electrostatic forces in MEMS
Raffaele Ardito, Leonardo Baldasarre, Alberto Corigliano, Department of Structural Engineering, Politecnico di Milano
16:30 20mn
Parameter Identification of Piezoelectric AlGaN/GaN Beam Resonators by Dynamic Measurements
Steffen Michael 1, Klemens Brueckner 2, Florentina Niebelschuetz 2, Katja Tonisch 2, Christoph Schaeffel 1
1 Institute for Microelectronic and Mechatronic Systems, Ilmenau
2 Institute of Micro- and Nanotechnologies, Ilmenau University of Technology
16:50 20mn
Experimentally Validated and Automatically Generated Multi-Energy Domain Coupled Model of a RF MEMS Switch
Martin Niessner 1, Gabriele Schrag 2, Jacopo Iannacci 3, Gerhard Wachutka 2
1 Institute for Physics of Electrotechnology, Munich University of Technology, Munich, Germany, Munich, Germany
2 Institute for Physics of Electrotechnology, Munich University of Technology, Munich, Germany
3 Fondazione Bruno Kessler (FBK), MemSRaD Research Unit, Povo di Trento, Italy
17:10 20mn
Simulation of large-scale periodic circuits by a homogenization method
Nicolas Ratier, Michel Lenczner, FEMTO-ST/CNRS, Besançon, France

Session 16 16:00 Tuesday 28 Apr 2009
Modeling for Advanced Packaging
Chaired by D. Yang, NXP Semiconductors; O. van der Sluis, Philips
16:00 30mn
Keynote presentation - Several Modeling Issues in LED, 3D-SiP, and Nano Interconnects
Sheng Liu 1, Kai Wang 2, Zhiyin Gan 3, Xiaobing Luo 4, Xiaohui Song 5, Zhaohui Chen 5, Zongyuan Liu 6, Han Yan 7, Wei Wei 8, Pei Wang 6
1 Huazhong University of Science and Technology; Wuhan National Laboratory for Optoelectronics; School of Optoelectronics Science and Engineering, Huazhong University of Science & Technology, Wuhan, China
2 Division of MOEMS, Wuhan National Laboratory for Optoelectronics; School of Optoelectronics Science and Engineering, University of Science & Technology, Wuhan, China
3 Huazhong University of Science and Technology; Wuhan National Laboratory for Optoelectronics; Wuhan, China
4 Division of MOEMS, Wuhan National Laboratory for Optoelectronics; School of Energy and Power Engineering, Huazhong University of Science & Technology, Wuhan, China
5 Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China; Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China
6 School of Mechanical Science and Engineering, Huazhong University of Science & Technology; Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China
7 Division of MOEMS, Wuhan National Laboratory for Optoelectronics; Department of Electronic Science & Technology, Huazhong University of Science & Technology, Wuhan, China
8 Division of MOEMS, Wuhan National Laboratory for Optoelectronics; School of Optoelectronics Science and Engineering, Huazhong University of Science & Technology, Wuhan, China
16:30 20mn
Experimental and numerical analyses of flexible PCBs under various loading conditions
Luciano Arruda 1, Renato Bonadiman 2, Costa Josineto 3, Germano Freitas 2
1 Instituto Nokia de Tecnologia; Universidade Estadual do Amazonas, Manaus, Brazil
2 Instituto Nokia de Tecnologia, Manaus, Brazil
3 Instituto Nokia de Tecnologia; Universidade Federal do Amazonas, Manaus, Brazil
16:50 20mn
Modeling of Process and Reliability of Press-Fit Interconnections
Thomas Fellner, Elena Zukowski, Jürgen Wilde, University of Freiburg - IMTEK, Germany
17:10 20mn
Reliability Modeling on a MOSFET Power Package Based on Embedded Die Technology
Daoguo Yang 1, Martien Kengen 2, W.G.M. Peels 2, David Heyes 3, W. D. van Driel 1
1 Operations BE Innovation, NXP Semiconductors, Nijmegen, the Netherlands
2 IS&O CSC-Innovation, NXP Semiconductors, Nijmegen, the Netherlands
3 BL Power Management, NXP Semiconductors
17:30 20mn
Fatigue life prediction models developed for Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)
A. Chaillot 1, M. Grieu 1, C. Munier 1, I. Lombaert-Valot 1, S. Bousquet 2, C. Chastanet 2, J-P. Canaud 3, R. Dumonteil 4, S. Villard 4, P. Raynal 5, D. Maron 5
1 EADS IW
2 Airbus France
3 EADS SN
4 TECH-CI
5 ACTIA

Session 17 09:00 Wednesday 29 Apr 2009
New Developments I
Chaired by N. Iwamoto, Honeywell; M. Geers, Technical University of Eindhoven
09:00 30mn
Keynote presentation - Ten Years of Thermal Analysis at EuroSimE - What's Next?
Peter Rodgers, Valerie Eveloy, The Petroleum Institute, Abu Dhabi, United Arab Emirates
09:30 30mn
Keynote presentation - Prognostics and Health Monitoring For Improved Qualification
Michael Pecht, Prognostics and Health Management Center City University of Hong Kong; Center for Advanced Life Cycle Engineering (CALCE) University of Maryland, USA
10:00 30mn
Keynote presentation - On the Analysis of Spontaneous Adhesion in MEMS
Raffaele Ardito, Alberto Corigliano, Attilio Frangi, Department of Structural Engineering, Politecnico di Milano, Italy

Session 18 11:00 Wednesday 29 Apr 2009
Electro-Mechanical Devices (Part 2)
Chaired by M. Jungwirth, Upper Austria University of Applied Sciences
11:00 30mn
Keynote presentation - Experimental characterization and numerical simulation of a dielectric tuning technique dedicated to miniature monolithic NMR coils.
Jean-Clément GUISIANO 1, Simon LAMBERT 2, Souhil MEGHERBI 3, Luc DARRASSE 2, Jean-Christophe GINEFRI 2
1 IEF/U2R2M
2 U2R2M
3 IEF
11:30 20mn
Thermal and Mechanical Design Optimisation of a Micro Machined Mid-Infrared Emitter for Optical Gas Sensing Systems
Falk Naumann 1, Matthias Ebert 1, Jürgen Hildenbrand 2, Emmanuel Moretton 2, Carolin Peter 2, Jürgen Wöllenstein 2
1 Fraunhofer Institute for Mechanics of Materials, Halle, Germany
2 Fraunhofer Institute for Physical Measurement Techniques, Freiburg, Germany
11:50 20mn
Static and dynamic experimental investigations of a micro-electromechanical cantilever in air and vacuum
Stefanie Gutschmidt 1, Veronique Rochus 2, Jean-Claude Golinval 2
1 University of Canterbury, Dept. of Mechanical Engineering, Christchurch, NZ
2 University of Liège, Dept. of Aerospace and Materials, Liège, Belgium
12:10 20mn
Frequency response of a 2D flow and thermal property sensor
Ali Sükrü Çubukçu, Gerald A. Urban, IMTEK, University of Freiburg, Freiburg, Germany
12:30 20mn
Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints
Shih-Wei Liang, Chih Chen, National Chiao Tung University

Session 19 11:00 Wednesday 29 Apr 2009
IC - Package Interactions
Chaired by H. Fan, Hong Kong University of Technology; S. Rzepka, Qimonda
11:00 30mn
Keynote presentation - 3D Circuit Model for 3D IC Reliability Study
Cher Ming Tan, Feifei He, Nanyang Technological University
11:30 20mn
Crack and Damage Evaluation in low-k BEoL Stacks under Chip Package Interaction Aspects
Juergen Auersperg 1, Dietmar Vogel 2, Matthias U. Lehr 3, Michael Grillberger 3
1 Fraunhofer ENAS Chemnitz and AMIC GmbH Berlin, Germany
2 Fraunhofer ENAS Chemnitz, Germany
3 AMD Fab36 LLC & Co. KG, Dresden, Germany
11:50 20mn
Virtual Prototyping for PPM-level Failures in Microelectronic Package
W.D. van Driel 1, R.A.B. Engelen 2, A. Mavinkurve 1, H. Cobussen 1, M. van Dort 1, M. van Eckendonk 1, L. Endrinal 1
1 NXP Semiconductors
2 Philips Apptech
12:10 20mn
Package induced low-k delaminations: Numerical developments and Experimental Investigations to address FEBE compatibility fracture phenomena.
Sébastien Gallois-Garreignot 1, Vincent Fiori 1, Daniel Nélias 2
1 STMicroelectronics
2 LaMCoS, INSA
12:30 20mn
Induced Delamination of Silicon-Molding Compound Interfaces
Gerd Schlottig, Infineon Technologies AG, Regensburg, Germany
Heinz Pape, Infineon Technologies AG, Munich, Germany
Bernhard Wunderle, Fraunhofer IZM, Berlin, Germany
Leo J. Ernst, TU-Delft, Delft, The Netherlands

Session 20 13:40 Wednesday 29 Apr 2009
New Developments II
Chaired by W. Van Driel, NXP Semiconductors; X. Fan, Lamar University
13:40 30mn
Keynote presentation - Thermal simulation of defect localisation using Lock-In Thermography in complex and fully packaged devices
Christian Schmidt 1, Falk Naumann 1, Frank Altmann 1, Stefan Martens 2
1 Fraunhofer Institute for Mechanics of Materials Halle, Germany
2 Infineon Technologies AG, Regensburg, Germany
14:10 30mn
Keynote presentation - Cohesive Zone Simulation on Dynamic Fracture at the Interfaces of a Single Solder Joint
Feng Gao 1, Jianping Jing 2, Frank Z. Liang 3, Richard L. Williams 3, Jianmin Qu 1
1 Georgia Institute of Technology, USA
2 Shanghai JiaoTong University, China
3 Intel Corporation
14:40 30mn
Keynote presentation - Co-Design and Multi-Physics Analysis for Power Electronic Modules
C. Bailey, H. Lu, T. Tilford, C. Yin, J. Rizvi, University of Greenwich
15:10 30mn
Keynote presentation - System-Level Modeling and Simulation of a Frequency-Tunable Electrostatic Energy Harvester
Dennis Hohlfeld, Svetla Matova, Rob van Schaijk, Holst Centre / IMEC, Eindhoven, The Netherlands